CN109148680B - Auxiliary repair process method and auxiliary repair clamp for warpage of epoxy resin packaged ceramic substrate - Google Patents
Auxiliary repair process method and auxiliary repair clamp for warpage of epoxy resin packaged ceramic substrate Download PDFInfo
- Publication number
- CN109148680B CN109148680B CN201811119764.7A CN201811119764A CN109148680B CN 109148680 B CN109148680 B CN 109148680B CN 201811119764 A CN201811119764 A CN 201811119764A CN 109148680 B CN109148680 B CN 109148680B
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- China
- Prior art keywords
- auxiliary repair
- warpage
- hollow
- supporting plate
- ceramic substrate
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- 230000008439 repair process Effects 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000919 ceramic Substances 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 238000012937 correction Methods 0.000 claims abstract description 11
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 7
- 239000010951 brass Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000000053 physical method Methods 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Laminated Bodies (AREA)
Abstract
An auxiliary repair process method and an auxiliary repair clamp for warpage of an epoxy resin packaging ceramic substrate relate to the technical field of Chip Scale Packaging (CSP) processes. The technical defect that the warping effect is not obvious by a simple physical method is overcome, and the hollow packaging body is placed in an auxiliary repair clamp for high-temperature curing; the auxiliary repair fixture consists of a supporting plate and an upper cover plate arranged on the upper layer of the supporting plate, wherein the upper cover plate is a brass plate, a positioning groove matched with the hollow packaging body is arranged on the supporting plate, and the hollow packaging body is arranged in the positioning groove to cover the upper cover plate for high-temperature curing under the correction state of warpage. The use of copper materials with low heat transfer coefficients can reduce the heat dissipation rate of the process.
Description
Technical Field
The present invention relates to the field of Chip Scale Packaging (CSP) technology.
Background
The Chip Scale Packaging (CSP) process is a common packaging process of a surface acoustic wave filter (SAW) in the market at present, wherein one packaging mode is to flip-chip bond a piezoelectric chip with independent electrical property after ball placement and cutting on a gold-plated ceramic substrate through a hot-pressing ultrasonic process to complete circuit connection. Then, a hollow package of the surface acoustic wave filter is obtained by a lamination process, a high-temperature baking process, or the like using an epoxy resin film over the chip.
Because of the obvious difference between the thermal expansion coefficients of the epoxy resin film and the ceramic substrate (the thermal expansion coefficient of the epoxy resin film is about 7 times that of the ceramic substrate) and a series of complex physicochemical changes such as high-temperature baking, the hollow package can form remarkable warpage (Warpage) after thermal expansion and cold contraction. For a common 50mm×50mm ceramic substrate, the warpage of the whole hollow package body can reach 1.3-1.4 mm, which may seriously affect the welding reliability between the piezoelectric chip and the ceramic substrate. The effect is not obvious in the traditional process method for reducing the warpage by a simple physical method.
Disclosure of Invention
The invention aims to solve the technical defect that the effect of reducing the warpage by a simple physical method is not obvious in the prior art, and provides an auxiliary repair process method and an auxiliary repair clamp for the warpage of an epoxy resin packaging ceramic substrate.
In order to solve the technical problems, the invention adopts the following technical scheme:
The technological process of repairing warp of ceramic substrate with epoxy resin includes the steps of embedding ball, cutting piezoelectric chip with independent electric performance, hot pressing ultrasonic welding to gold plated ceramic substrate to complete circuit connection, forming hollow interval under the support of the embedded ball, adhering epoxy resin film onto the piezoelectric chip, laminating, and forming hollow package between the piezoelectric chip and the ceramic substrate; the method is characterized in that: placing the hollow packaging body in an auxiliary repair clamp for high-temperature curing; the auxiliary repair fixture consists of a supporting plate and an upper cover plate arranged on the upper layer of the supporting plate, wherein the upper cover plate is a brass plate, a positioning groove matched with the hollow packaging body is arranged on the supporting plate, and the hollow packaging body is arranged in the positioning groove to cover the upper cover plate for high-temperature curing under the correction state of warpage.
According to the size of the hollow packaging body and the size of the auxiliary repair clamp, one or more packaging bodies are simultaneously cured at high temperature in a correction state of warpage on each supporting plate.
And more than two layers of auxiliary repair clamps can be adopted for high-temperature curing in a correction state of simultaneously performing warpage.
An auxiliary repair fixture for auxiliary repair of warpage of an epoxy resin packaged ceramic substrate is characterized in that: the auxiliary repair fixture comprises a supporting plate and an upper cover plate, wherein the upper cover plate is arranged on the upper layer of the supporting plate, the upper cover plate is a brass plate, a positioning groove which is anastomotic with the hollow packaging body is arranged on the supporting plate, and a clamping pin is arranged between the supporting plate and the upper cover plate.
The support plate may be a laminated structure of two or more layers.
The beneficial effects of the invention are as follows: the upper cover plate of the auxiliary repair fixture adopts the brass plate with higher density, and performs physical correction on the packaging body on one side; on the other hand, the warping mainly occurs in the cooling stage in the baking and curing process, and the heat dissipation rate in the process can be reduced by using the copper material with low heat transfer coefficient. The invention is mainly considered in two aspects of physical correction and reducing the heat dissipation rate in the cooling stage in the baking and curing process so as to reduce the stress in the package body and further increase the reliability of the product, and the invention does not conflict with the current process flow; the reliability of the product is further improved on the basis of the existing process conditions, and the failure risk of the product is reduced.
Drawings
FIG. 1 is a schematic cross-sectional view of a hollow package of the present invention;
FIG. 2 is a schematic cross-sectional view of an auxiliary repair fixture according to the present invention;
FIG. 3 is a graph showing the effect of improving warpage of a hollow package according to the present invention;
fig. 4 is a schematic structural view of the auxiliary repair fixture of the present invention using a laminated structure with more than two layers.
Detailed Description
The invention will be further described with reference to the accompanying drawings and preferred embodiments of the invention.
Referring to fig. 1 to 2, the epoxy resin encapsulated ceramic substrate warpage auxiliary repair process method of the present invention comprises the steps of firstly, flip-chip bonding a ball-mounted and cut piezoelectric chip 11 with independent electrical properties onto a gold-plated ceramic substrate 12 by a thermo-compression ultrasonic process to complete circuit connection, and forming a hollow gap 15 under the support of the ball-mounted chip 13; then, an epoxy resin film 14 is attached above the piezoelectric chip 11, and after lamination by a lamination process, a hollow package 1 is formed between the piezoelectric chip 11 and the ceramic substrate 12; finally, the hollow encapsulation body 1 is placed in an auxiliary repair fixture 2 for high-temperature curing.
The auxiliary repair fixture 2 comprises a supporting plate 21 and an upper cover plate 22; the upper cover plate 22 is arranged on the upper layer of the supporting plate 21, the upper cover plate 22 is a brass plate, a positioning groove 211 which is matched with the hollow packaging body 1 is arranged on the supporting plate 21, and a bayonet lock 23 is arranged between the supporting plate 21 and the upper cover plate 22. The hollow package 1 is placed in the positioning groove 211 to cover the upper cover plate 22 for high temperature curing in a corrected state of warpage.
The upper cover plate 22 is matched with the supporting plate 21 by using a copper-clad plate with higher density to press the hollow packaging body 1, and the hollow packaging body 1 is subjected to physical correction; because the warpage of the hollow package body 1 mainly occurs in the cooling stage in the baking and curing process, the brass plate with low heat transfer coefficient is used as the upper cover plate, so that the heat dissipation rate in the process can be reduced, the internal stress of the hollow package body 1 is slowly released, and the internal stress of a finished product is reduced, as shown in fig. 3, before the left hollow package body 1 is improved, the right hollow package body 1 is improved in fig. 3, so that the warpage of the hollow package body 1 can be reduced by 28-45%, the reliability of the product is finally improved, the qualification rate of the finished product is also improved, and the production cost is reduced.
Referring to fig. 4, in order to improve the processing efficiency of the present invention, the auxiliary repair jig 2 may correct warpage of one or more hollow packages 1 at the same time according to the size of the hollow packages 1 and the size of the auxiliary repair jig 2 without damaging the product. In addition, the auxiliary repair fixture 2 may also have a multi-layer structure, that is, the support plate 21 may have a laminated structure with more than two layers, and the auxiliary repair fixture with more than two layers is used for high-temperature curing in a correction state of warpage, and the warpage of the hollow package 1 is corrected between the upper cover plate 22 and the support plate 21 by using the nuts/bayonet locks 23, so as to improve the flatness of the product in batches through a thermal principle.
Claims (1)
1. The technological process of repairing warp of ceramic substrate with epoxy resin includes the steps of embedding ball, cutting piezoelectric chip with independent electric performance, hot pressing ultrasonic welding to gold plated ceramic substrate to complete circuit connection, forming hollow interval under the support of the embedded ball, adhering epoxy resin film onto the piezoelectric chip, laminating, and forming hollow package between the piezoelectric chip and the ceramic substrate; the method is characterized in that: placing the hollow packaging body in an auxiliary repair clamp for high-temperature curing; the auxiliary repair fixture consists of a supporting plate and an upper cover plate arranged on the upper layer of the supporting plate, wherein the upper cover plate is a brass plate, a positioning groove matched with the hollow packaging body is arranged on the supporting plate, and the hollow packaging body is placed in the positioning groove to cover the upper cover plate for high-temperature curing under the correction state of warpage; according to the size of the hollow packaging body and the size of the auxiliary repair clamp, one or more packaging bodies are simultaneously cured at high temperature in a correction state of warpage on each supporting plate; and adopting more than two layers of auxiliary repair clamps to simultaneously carry out high-temperature curing under the correction state of warpage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811119764.7A CN109148680B (en) | 2018-09-26 | 2018-09-26 | Auxiliary repair process method and auxiliary repair clamp for warpage of epoxy resin packaged ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811119764.7A CN109148680B (en) | 2018-09-26 | 2018-09-26 | Auxiliary repair process method and auxiliary repair clamp for warpage of epoxy resin packaged ceramic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109148680A CN109148680A (en) | 2019-01-04 |
| CN109148680B true CN109148680B (en) | 2024-05-21 |
Family
ID=64812281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811119764.7A Active CN109148680B (en) | 2018-09-26 | 2018-09-26 | Auxiliary repair process method and auxiliary repair clamp for warpage of epoxy resin packaged ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109148680B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114373701B (en) * | 2022-01-05 | 2023-03-28 | 广东气派科技有限公司 | Jig for improving warpage, bump bridging and Die crack of Flip chip substrate |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06163742A (en) * | 1992-11-18 | 1994-06-10 | Fujitsu Ltd | Semiconductor device |
| JPH1154532A (en) * | 1997-07-31 | 1999-02-26 | Toshiba Corp | Package for semiconductor device |
| US6949404B1 (en) * | 2002-11-25 | 2005-09-27 | Altera Corporation | Flip chip package with warpage control |
| CN101389160A (en) * | 2008-08-29 | 2009-03-18 | 瑞声声学科技(常州)有限公司 | Piezo-electric acoustic generator manufacturing method |
| CN201426216Y (en) * | 2009-05-06 | 2010-03-17 | 深圳市深南电路有限公司 | PCB stacking structure |
| WO2014156837A1 (en) * | 2013-03-28 | 2014-10-02 | 日東電工株式会社 | Hollow sealing resin sheet and production method for hollow package |
| CN205452240U (en) * | 2015-11-30 | 2016-08-10 | 中国电子科技集团公司第三十八研究所 | Solve fan -out type wafer -level package warping device |
| CN106549648A (en) * | 2016-12-06 | 2017-03-29 | 深圳市麦高锐科技有限公司 | A kind of SAW resonator and processing technology of wafer-level package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030080642A (en) * | 2002-04-10 | 2003-10-17 | 삼성전기주식회사 | A Method for Fabricating Ceramic Chip Packages |
-
2018
- 2018-09-26 CN CN201811119764.7A patent/CN109148680B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06163742A (en) * | 1992-11-18 | 1994-06-10 | Fujitsu Ltd | Semiconductor device |
| JPH1154532A (en) * | 1997-07-31 | 1999-02-26 | Toshiba Corp | Package for semiconductor device |
| US6949404B1 (en) * | 2002-11-25 | 2005-09-27 | Altera Corporation | Flip chip package with warpage control |
| CN101389160A (en) * | 2008-08-29 | 2009-03-18 | 瑞声声学科技(常州)有限公司 | Piezo-electric acoustic generator manufacturing method |
| CN201426216Y (en) * | 2009-05-06 | 2010-03-17 | 深圳市深南电路有限公司 | PCB stacking structure |
| WO2014156837A1 (en) * | 2013-03-28 | 2014-10-02 | 日東電工株式会社 | Hollow sealing resin sheet and production method for hollow package |
| CN205452240U (en) * | 2015-11-30 | 2016-08-10 | 中国电子科技集团公司第三十八研究所 | Solve fan -out type wafer -level package warping device |
| CN106549648A (en) * | 2016-12-06 | 2017-03-29 | 深圳市麦高锐科技有限公司 | A kind of SAW resonator and processing technology of wafer-level package |
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| Publication number | Publication date |
|---|---|
| CN109148680A (en) | 2019-01-04 |
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