CN114373701B - Jig for improving warpage, bump bridging and Die crack of Flip chip substrate - Google Patents
Jig for improving warpage, bump bridging and Die crack of Flip chip substrate Download PDFInfo
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- CN114373701B CN114373701B CN202210005270.6A CN202210005270A CN114373701B CN 114373701 B CN114373701 B CN 114373701B CN 202210005270 A CN202210005270 A CN 202210005270A CN 114373701 B CN114373701 B CN 114373701B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67092—Apparatus for mechanical treatment
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a jig for improving warpage, bump bridging and Die crack of a Flip chip substrate, which comprises: the clamp plate comprises a clamp plate, wherein a plurality of hollow welding areas are formed in the clamp plate, a plurality of plate frames of the clamp plate are formed at parts outside the welding areas, the plate frames are fixed on one sides of a substrate and a flip chip to be welded through fixing components, and the substrate is covered by the plate frames. The part of the substrate except the single flip chip to be welded is fixed through the pressing plate, so that the pressed area of the substrate is increased, and the problems of poor welding caused by warping of the substrate, bridging among bumps and chip cracking after reflow soldering can be reduced.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a jig for improving warpage, bump bridging and Die crack of a Flip chip substrate.
Background
In the prior art, when a substrate and a Flip chip are soldered, due to different CTE (coefficient of thermal expansion), the substrate is warped after reflow soldering, so that gaps are formed between the FC and the substrate, bumps are bridged, and Die crack occurs, thereby causing poor soldering and failure of the product. Therefore, there is a need to provide a jig for improving warpage, bump bridging and Die crack of Flip chip substrate, so as to at least partially solve the problems in the prior art.
Disclosure of Invention
In this summary, concepts in a simplified form are introduced that are further described in the detailed description. This summary of the invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In order to at least partially solve the above problems, the present invention provides a jig for improving warpage, bump bridging and Die crack of a Flip chip substrate, comprising: the clamp plate comprises a clamp plate, wherein a plurality of hollow welding areas are formed in the clamp plate, a plurality of plate frames of the clamp plate are formed at parts outside the welding areas, the plate frames are fixed on one sides of a substrate and a flip chip to be welded through fixing components, and the substrate is covered by the plate frames.
Preferably, the plate frame comprises a fixed outer frame, and a plurality of supporting inner frames which are crosswise arranged in the transverse direction and the longitudinal direction are arranged on the inner side of the fixed outer frame.
Preferably, the fixing assembly comprises a fixing plate, the fixing plate is arranged on one side, away from the pressing plate, of the base plate, a base plate is arranged between the fixing outer frame and the fixing plate, the base plate and the fixing outer frame are fixed together through a first locking piece.
Preferably, the thickness of the pad plate is the same as the thickness of the substrate.
Preferably, one side of the inner supporting frame, which is far away from the base plate, is supported by a reinforcing assembly, and the reinforcing assembly is used for preventing the inner supporting frame from deforming.
Preferably, the fixed subassembly includes the reinforcing plate, the reinforcing plate is fixed through the second retaining member the clamp plate is kept away from one side of base plate, be equipped with on the reinforcing plate with the reinforcing frame that fixed frame corresponds, a plurality of with the reinforcing inside casing that supports the inside casing and a plurality of with the through-hole that welding area corresponds, the reinforcing inside casing is close to one side that supports the inside casing is equipped with the reinforced subassembly.
Preferably, the reinforcing component comprises a reinforcing lath, the reinforcing lath corresponds to the reinforcing inner frame, two ends of the reinforcing lath, which are close to one side of the reinforcing inner frame, are provided with insertion rods, the reinforcing inner frame is provided with sleeves into which the insertion rods can be inserted, and a first spring is connected between the end of each insertion rod and each sleeve.
Preferably, the reinforcing plate strip with still be equipped with elastic mechanism between the reinforcing inside casing, elastic mechanism includes the first link block, the fixed setting of first link block is in on the reinforcing plate strip, be equipped with telescopic head rod in the first link block, the head rod is kept away from the fixed dead lever that is equipped with in one end of first link block, the both ends of dead lever pass through the connecting plate with reinforcing inside casing fixed connection, the dead lever is kept away from one side of head rod is equipped with the second connecting rod, the second connecting rod is kept away from the one end telescopic setting of dead lever is in the second link block, articulated in the first link block have two first articulated poles, the other end and the slip setting of first articulated pole are in slider on the dead lever is articulated, articulated in the second link block have two second articulated poles, the other end of second articulated pole with the slider is articulated, the slider with be connected with the second spring between the connecting plate, the second spring housing is established in the outside of dead lever, first articulated pole with the articulated one end of slider is equipped with the butt pole of L type, the butt setting is in one side of first articulated pole is kept away from one side of dead lever.
Preferably, a first movable cavity is arranged in the first connecting block, a first hinged shaft is arranged on the side wall of the first movable cavity, the first hinged shaft is rotatably connected with one end of the first hinged rod, one side, far away from the first hinged rod, of the first hinged shaft is rotatably connected with a first gear, a first coil spring is connected between the first gear and the side wall of the first movable cavity, and teeth matched with the first gear are arranged on two sides of the first connecting rod;
a second movable cavity is arranged in the second connecting block, a second hinged shaft is arranged on the side wall of the second movable cavity, the second hinged shaft is rotatably connected with one end of the second hinged rod, one side, far away from the second hinged rod, of the second hinged shaft is rotatably connected with a second gear, a second coil spring (953) is connected between the second gear and the side wall of the second movable cavity, and teeth matched with the second gear are arranged on two sides of the second connecting rod;
one side of the second connecting block, which is far away from the second movable cavity, is provided with a round hole, a cylinder is arranged in the round hole in a sliding manner, one end of the cylinder is fixedly connected with the reinforcing inner frame, the other end of the cylinder is fixedly provided with a third spring, and one end, which is far away from the cylinder, of the third spring is connected with a step surface formed by the round hole and the second movable cavity.
Preferably, the bonding device further comprises a detection device for detecting the bonding degree of the pressing plate and the substrate, and the detection method comprises the following steps:
step 4, taking the reference pretightening force for connecting the pressing plate and the substrate as an acting force applied on the pressing plate, and predicting the deformation generated on the joint surface of the pressing plate and the substrate;
step 5, judging whether the deformation generated on the binding surface of the pressing plate and the substrate under the action of the reference pre-tightening force meets the requirement or not;
and 6, if the judgment result in the step 3 and the judgment result in the step 5 both meet the requirement, the joint degree of the pressing plate and the substrate is considered to meet the requirement, and if any judgment result in the step 3 and the step 5 does not meet the requirement, the joint degree of the pressing plate and the substrate is considered not to meet the requirement.
Compared with the prior art, the invention at least comprises the following beneficial effects:
the jig for improving the warpage, bump bridging and Die crack of the Flip chip substrate is used for fixing the part of the substrate except a single Flip chip to be welded through the pressing plate, so that the pressed area of the substrate is increased, and the problems of poor welding caused by the warpage of the substrate, bridging among a plurality of salient points and chip cracking after reflow soldering can be reduced.
Other advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of a pressing plate structure of a fixture for improving warpage, bump bridging and Die crack of a Flip chip substrate according to the present invention;
FIG. 2 is a schematic structural diagram of a pressing plate in the fixture for improving warpage, bump bridging and Die crack of a Flip chip substrate according to the present invention;
FIG. 3 is a schematic structural diagram of an assembly cross section of a jig for improving warpage, bump bridging and Die crack of a Flip chip substrate according to the present invention;
FIG. 4 is a schematic structural diagram of a stiffener in the fixture for improving warpage, bump bridging and Die crack of a Flip chip substrate according to the present invention;
FIG. 5 is a schematic structural diagram of a stiffener disposed on a stiffener in the fixture for improving warpage, bump bridging and Die crack of a Flip chip substrate according to the present invention;
FIG. 6 is a schematic diagram of a partial cross-sectional structure in FIG. 5 of the fixture for improving warpage, bump bridging and Die crack of a Flip chip substrate according to the present invention;
FIG. 7 is a schematic partial cross-sectional view of a reinforcing element when a butting rod of a fixture for improving warpage, bump bridging and Die crack of a Flip chip substrate abuts against a reinforcing lath according to the present invention;
fig. 8 is a schematic structural view of the first hinge shaft and the second hinge shaft in the jig for improving warpage, bump bridging and Die crack of the Flip chip substrate according to the present invention.
Detailed Description
The present invention is further described in detail below with reference to the drawings and examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1 to fig. 8, the present invention provides a jig for improving warpage, bump bridging and Die crack of a Flip chip substrate, comprising: the clamp plate comprises a clamp plate 1, wherein a plurality of hollow welding areas 2 are formed on the clamp plate 1, a plurality of parts outside the welding areas 2 form a plate frame 3 of the clamp plate 1, the plate frame 3 is fixed on one side, to be welded, of a substrate 4 and a flip chip 5 through a fixing assembly, and the substrate 4 is covered by the plate frame 3.
The working principle of the technical scheme is as follows: the flip chip 5 is welded with the substrate 4 by arranging solder balls, namely bump bumps, on one side of the flip chip 5, and the solder balls are used for welding the flip chip 5 on the substrate 4 through a reflow soldering process, so that the whole substrate 4 is adopted for simultaneously welding a plurality of flip chips 5, the processing difficulty is reduced as much as possible, but the phenomenon that the welding surfaces of the substrate 4 and the flip chips 5 are warped due to different thermal expansion rates of the substrate 4 and the flip chips 5 can occur, and the phenomenon of bridging is easy to occur due to the small distance between the bumps, so that the packaging quality of the whole flip chip 5 is influenced; in the prior art, mostly be at the fixed round clamp plate 1 in the periphery of base plate 4, then with flip chip 5 welding on base plate 4, but a plurality of flip chip 5 weld simultaneously, the region that base plate 4 is not covered by clamp plate 1 still has very big probability to produce the warpage, and do not keep apart a plurality of welding position on base plate 4, bump bridging takes place easily, consequently, set up clamp plate 1 into network structure, fix clamp plate 1 on base plate 4, the position that the fretwork set up is the welding region 2 of chip, make part base plate 4 except that welding region 2 all pushed down by clamp plate 1, thereby increase the region that base plate 4 is consolidated, also be plate frame 3 covers the region of base plate 4, and keep apart a plurality of welding position on base plate 4, avoid bridging between the bump.
The beneficial effects of the above technical scheme are that: the part of the substrate 4 except the single flip chip to be welded is fixed by the pressing plate 1, so that the area of the substrate 4 to be pressed is increased, and the problems of poor welding caused by warping of the substrate 4, bridging among salient points and chip cracking after reflow soldering can be reduced.
In one embodiment, the panel frame 3 includes a fixed outer frame 310, and a plurality of supporting inner frames 320 arranged to cross each other in the transverse and longitudinal directions are provided at the inner side of the fixed outer frame 310.
The working principle and the beneficial effects of the technical scheme are as follows: the welding areas 2 are formed between the fixed outer frame 310 and the plurality of supporting inner frames 320 which are transversely and longitudinally crossed, and the plurality of supporting inner frames 320 which are transversely and longitudinally crossed press and fix the substrate 4 at the periphery of each welding area 2, so that the substrate 4 is prevented from warping in the welding process to cause poor welding, and meanwhile, bridging among the salient points is effectively prevented in the reflow welding process.
In one embodiment, the fixing assembly comprises a fixing plate 6, the fixing plate 6 is arranged on one side of the base plate 4 far away from the pressure plate 1, a backing plate 7 is arranged between the fixing outer frame 310 and the fixing plate 6, the backing plate 7 and the fixing outer frame 310 are fixed together through a first locking member;
the thickness of the backing plate 7 is the same as the thickness of the base plate 4.
The working principle and the beneficial effects of the technical scheme are as follows: the backing plate 7 can be arranged independently, or can be formed on the fixing plate 6 or the pressing plate 1, mainly in order to prevent the pressing plate 1 from generating unnecessary deformation when the pressing plate 1 and the fixing plate 6 press the base plate 4 therebetween through the first locking piece, thereby enabling the connection to be firmer; the arranged fixing plate 6 can support the bottom of the substrate 4, so that the substrate 4 is pressed and fixed under the locking action of the fixing plate 6 and the pressing plate 1, and the pressing effect of the pressing plate 1 on the substrate 4 is better; the first locking piece can be a bolt or other fixing pieces capable of achieving the locking effect, so that the fixing assembly can be taken down from the base plate 4 after the chip is welded, the fixing assembly can be repeatedly used, and resources are saved.
In one embodiment, the side of the support innerframe 320 remote from the base plate 4 is supported by a reinforcement assembly 8, and the reinforcement assembly 8 is configured to prevent deformation of the support innerframe 320.
The working principle and the beneficial effects of the technical scheme are as follows: because the interval between adjacent welding areas 2 is relatively small, the width of the supporting inner frame 320 is relatively small, and the supporting strength of the supporting inner frame is limited, so that the reinforcing component 8 is arranged on the surface of the supporting inner frame 320, which is not in contact with the substrate 4, and is used for supporting the strength of the supporting inner frame 320, so that the supporting inner frame 320 is in closer contact with the substrate 4, the reinforcing component 8 can be independently arranged and fixed with the substrate 4 in the same fixing way as the pressure plate 1, or can be directly arranged on the surface of the supporting inner frame 320, which is not in contact with the substrate 4, for example, reinforcing ribs can be arranged along the length direction of the supporting inner frame 320, so that the supporting inner frame 320 can have better strength, and the effects of preventing the substrate 4 from warping and promoting bump bridging can be generated.
In one embodiment, the fixing assembly includes a reinforcing plate 10, the reinforcing plate 10 is fixed on one side of the pressing plate 1 away from the base plate 4 through a second locking member, the reinforcing plate 10 is provided with a reinforcing outer frame corresponding to the fixing outer frame 310, a plurality of reinforcing inner frames corresponding to the supporting inner frames 320, and a plurality of through holes corresponding to the welding areas 2, and one side of the reinforcing inner frames close to the supporting inner frames 320 is provided with the reinforcing assembly 8.
The working principle and the beneficial effects of the technical scheme are as follows: the reinforcing plate 10 is the same as the pressing plate 1 in shape and size, the reinforcing plate 10 is used for balancing acting force of the plurality of supporting inner frames 320 on the pressing plate 1 on the base plate 4, the number of the welding areas 2 is large, the pressing plate 1 is only fixed with the base plate 4 through the periphery of the pressing plate 1 and can not be effectively pressed and fixed at the middle part of the base plate 4, therefore, the reinforcing plate 10 and the reinforcing assembly 8 can be adopted for effectively pressing the supporting inner frames 320 of the pressing plate 1 on the base plate 4 with large area, the plurality of supporting inner frames 320 can be effectively pressed and fixed on the base plate 4, the reinforcing plate 10 is fixed with the base plate 4 through the second locking piece and can be separately installed with the pressing plate 1 and also can be installed together, and the reinforcing plate 10 can be selectively used as required.
In one embodiment, the reinforcing assembly 8 includes a reinforcing lath 810, the reinforcing lath 810 corresponds to the reinforcing inner frame, two ends of the reinforcing lath 810 near one side of the reinforcing inner frame are provided with insertion rods 820, the reinforcing inner frame is provided with sleeves 830 capable of inserting the insertion rods 820, and a first spring 840 is connected between the ends of the insertion rods 820 and the sleeves 830.
The working principle and the beneficial effects of the technical scheme are as follows: the reinforcing assembly 8 can press the supporting inner frame 320 in a manner that the reinforcing laths 810 are elastically connected with the reinforcing inner frame, before the reinforcing plate 10 is installed, the first springs 840 are in a natural extension state, when the reinforcing plate 10 is installed on one side of the pressing plate 1, the reinforcing plate 10 is locked along with the second locking member, so that the distance between the reinforcing plate 10 and the pressing plate 1 is reduced, the inserting rods 820 are retracted into the sleeves 830, the first springs 840 are compressed, under the acting force of the first springs 840, the reinforcing laths 810 generate a large elastic acting force on the supporting inner frame 320 through the inserting rods 820, and the supporting inner frame 320 generates a pressing and fixing effect on the substrate 4 between the adjacent welding areas 2; meanwhile, if the surface of the pressing plate 1, which is far away from the substrate 4, is uneven, there is no need to worry that the supporting inner frame 320 does not contact the reinforcing laths 810 and cannot generate an over-pressing effect, because the reinforcing laths 810 have a certain amount of movement, each supporting inner frame 320 can effectively contact the reinforcing laths 810 under the elastic action, and a certain pressing and fixing effect is generated, so that the pressing and fixing acting force of the supporting inner frame 320 on the substrate 4 is increased, the substrate 4 is further prevented from warping, and the substrate 4 is in closer contact with the supporting inner frame 320.
In one embodiment, an elastic mechanism 9 is further disposed between the reinforcing lath 810 and the reinforcing inner frame, the elastic mechanism 9 includes a first connecting block 910, the first connecting block 910 is fixedly disposed on the reinforcing lath 810, a telescopic first connecting rod 920 is disposed in the first connecting block 910, a fixing rod 930 is fixedly disposed at one end of the first connecting rod 920 away from the first connecting block 910, two ends of the fixing rod 930 are fixedly connected with the reinforcing inner frame through a connecting plate, a second connecting rod 940 is disposed at one side of the fixing rod 930 away from the first connecting rod 920, one end of the second connecting rod 940 away from the fixing rod 930 is telescopically disposed in a second connecting block 950, two first hinged rods 960 are hinged in the first connecting block 910, the other end of the first hinged rod 960 is hinged to a sliding block 970 which is slidably disposed on the fixing rod 930, two second hinged rods 980 are hinged in the second connecting block 950, the other end of the second hinged rod 980 is hinged to the sliding block 970, a second spring 91970 is connected between the sliding block 970 and the connecting plate 970, the second spring 91990 is sleeved on the outer side of the fixing rod 930, and one end of the sliding block 9100 away from the sliding block 960 is disposed in an abutting joint mode.
The working principle and the beneficial effects of the technical scheme are as follows: the elastic mechanism 9 is used for increasing the elastic force between the reinforcing laths 810 and the supporting inner frame 320, and simultaneously, the abutting rod 9100 can prevent the reinforcing component 8 from being damaged due to the excessive elastic force or the supporting inner frame 320 and the substrate 4 from being damaged due to the larger force, in the installation process of the reinforcing plate 10, as the distance between the reinforcing plate 10 and the pressure plate 1 is gradually reduced, the distance between the reinforcing laths 810 and the reinforcing inner frame is gradually reduced, the first connecting block 910 is driven to move towards one side of the fixing rod 930, the first connecting block 910 drives the two first hinge rods 960 hinged with the first connecting block 910 to rotate, so that the sliding block 970 slides towards the two ends of the fixing rod 930 and compresses the second spring, meanwhile, the second connecting block 950 moves towards one side of the fixing rod 930, the second hinge rod 980 moves together with the first hinge rods 960 and compresses the second spring 990, so that the second spring 990 generates an elastic force, the elastic force is transmitted to the reinforcing lath 810, so that the elastic action of the reinforcing laths 810 on the supporting inner frame 320 is enhanced, when the distance between the second hinge rods 960 and the first connecting rod 960 continues to be reduced, when the distance between the reinforcing plate 10 and the reinforcing plate 10 continues to be reduced, the reinforcing component is prevented from being damaged, and the reinforcing plate 810 is prevented from further reduced, and the reinforcing component 810 is prevented from being damaged due to further caused by the increased by the elastic force generated by the elastic mechanism 9110, and the elastic force generated by the reinforcing component 10, and the elastic mechanism 9110, and the reinforcing component 10, and the reinforcing plate 10, and the reinforcing component after the reinforcing component 10, and the reinforcing plate 10.
In one embodiment, a first movable cavity is formed in the first connection block 910, a first hinge shaft 911 is arranged on a side wall of the first movable cavity, the first hinge shaft 911 is rotatably connected to one end of the first hinge rod 960, a first gear 912 is rotatably connected to one side of the first hinge shaft 911, which is far away from the first hinge rod 960, a first coil spring is connected between the first gear 912 and the side wall of the first movable cavity, and teeth matched with the first gear 912 are arranged on two sides of the first connection rod 920;
a second movable cavity is arranged in the second connecting block 950, a second hinge shaft 951 is arranged on the side wall of the second movable cavity, the second hinge shaft 951 is rotatably connected with one end of the second hinge rod 980, a second gear 952 is rotatably connected to one side, far away from the second hinge rod 980, of the second hinge shaft 951, a second coil spring 953 is connected between the second gear 952 and the side wall of the second movable cavity, and teeth matched with the second gear 952 are arranged on two sides of the second connecting rod 940;
one side of the second connecting block 950, which is far away from the second movable cavity, is provided with a round hole, a cylinder is arranged in the round hole in a sliding manner, one end of the cylinder is fixedly connected with the reinforcing inner frame, the other end of the cylinder is fixedly provided with a third spring, and one end, which is far away from the cylinder, of the third spring is connected with a step surface formed by the round hole and the second movable cavity.
The working principle and the beneficial effects of the technical scheme are as follows: when the reinforcing plate 10 is installed, under the movement of the first connecting block 910 and the second connecting block 950, the first connecting rod 920 and the second connecting rod 940 linearly move relative to the first movable cavity and the second movable cavity, and simultaneously drive the first gear 912 and the second gear 952 to rotate relative to the first hinge shaft 911 and the second hinge shaft 951, after the first gear 912 and the second gear 952 rotate, the first coil spring and the second coil spring 953 generate elastic acting force, so as to further increase the acting force between the reinforcing lath 810 and the supporting inner frame 320, the second connecting block 950 ensures that the reinforcing lath 810 can linearly move through a cylinder in which the second connecting block 950 is slidably connected, further ensure that the reinforcing lath 810 cannot tilt, under the elastic action of the third spring in cooperation with the first spring 840, the second spring 990 and the two coil springs, so that the reinforcing lath 810 generates elastic pre-tightening force to the supporting inner frame 320 and simultaneously balance the stress of each supporting plate frame 3, thereby facilitating the substrate 4 to be pressed and fixed by the supporting plate frames 3.
In one embodiment, the method further comprises a detection device for detecting the fitting degree of the pressing plate 1 and the substrate 4, and the detection method comprises the following steps:
D i ＝(D w *Δd*sinθ)/[D x *sinα+Δd*sin(α+θ)]
wherein D is i Is the distance of the ith measurement point from the reference plane, D w And D x Respectively an equivalent object distance and an equivalent image distance on an optical axis of the imaging lens, delta d is the moving distance of a laser spot image point on an imaging plane, theta is an included angle between the imaging plane and the optical axis of the imaging lens, alpha is an included angle between an axial line of a laser beam and the optical axis of the imaging lens, and sin is a sine value of a trigonometric function;
wherein τ is the flatness, and n is the number of the measurement points;
step 4, taking the reference pretightening force for connecting the pressing plate 1 and the substrate 4 as an acting force applied on the pressing plate 1, and predicting a deformation epsilon generated on a joint surface of the pressing plate 1 and the substrate 4:
where ε is the predicted deformation, p 1 And p 2 Poisson's ratios, E, of the platen 1 and the substrate 4, respectively 1 And E 2 The elastic modulus of the materials of the pressing plate 1 and the substrate 4 are respectively, F is a reference acting force applied on the pressing plate 1, pi is a mathematical constant, l is the maximum effective length of the contact between the pressing plate 1 and the substrate 4, and ln is a logarithm taking e as a base;
and 5, judging whether the deformation generated on the binding surface of the pressing plate 1 and the substrate 4 under the action of the reference pretightening force meets the requirement: the epsilon is less than 0.005mm, meets the requirement, and the epsilon is more than or equal to 0.005mm, does not meet the requirement;
and 6, if the judgment result in the step 3 and the judgment result in the step 5 both meet the requirements, the bonding degree of the pressing plate 1 and the substrate 4 is considered to meet the requirements, and if any judgment result in the step 3 and the step 5 does not meet the requirements, the bonding degree of the pressing plate 1 and the substrate 4 is considered to not meet the requirements.
The working principle and the beneficial effects of the technical scheme are as follows: any object can generate certain deformation after being stressed, the deformation degree is in great relation with the material selection of the object, the detection device detects the bonding degree of the pressing plate 1 and the substrate 4 under the condition of being determined based on the materials of the pressing plate 1 and the substrate 4 and the condition that the flatness of one surface of the substrate 4 to be bonded with the pressing plate 1 meets the requirement, and the pressing plate 1 is fixed on the substrate 4 through a fixing component, so the contact surface of the pressing plate 1 and the substrate 4 can be acted by force; in the method, the flatness calculated value of the pressing plate 1 is closer to 1, which indicates that the flatness is better, and the calculated value of the predicted deformation is smaller, which indicates that the bonding degree of the pressing plate 1 and the substrate 4 is higher, so that a range meeting the use requirement can be set as required to judge whether the bonding degree meets the requirement, and the bonding degree prediction of the pressing plate 1 and the substrate 4 is more accurate through the comprehensive detection of the two modes of flatness and the predicted deformation, which is more favorable for preventing the substrate 4 from deforming during welding, causing chip damage and preventing bridging among salient points, and plays a promoting role in improving the warpage of the Flip chip substrate, bump bridging and Die crack.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
While embodiments of the invention have been disclosed above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (4)
1. The utility model provides an improve flip chip base plate warpage, bump bridging and chip damage or cracked tool which characterized in that includes: the welding structure comprises a pressing plate (1), wherein a plurality of hollow welding areas (2) are formed on the pressing plate (1), a plate frame (3) of the pressing plate (1) is formed at the part outside the plurality of welding areas (2), the plate frame (3) is fixed on one side, to be welded, of a substrate (4) and a flip chip (5) through a fixing assembly, and the substrate (4) is covered by the plate frame (3);
the plate frame (3) comprises a fixed outer frame (310), and the inner side of the fixed outer frame (310) is provided with a plurality of supporting inner frames (320) which are transversely and longitudinally crossed;
the fixing assembly comprises a fixing plate (6), the fixing plate (6) is arranged on one side, away from the pressing plate (1), of the base plate (4), a backing plate (7) is arranged between the fixing outer frame (310) and the fixing plate (6), the backing plate (7) and the fixing outer frame (310) are fixed together through a first locking piece; the thickness of the backing plate (7) is the same as that of the base plate (4); the side, far away from the base plate (4), of the supporting inner frame (320) is supported by a reinforcing assembly (8), and the reinforcing assembly (8) is used for preventing the supporting inner frame (320) from deforming;
the fixing assembly comprises a reinforcing plate (10), the reinforcing plate (10) is fixed on one side, away from the base plate (4), of the pressing plate (1) through a second locking piece, a reinforcing outer frame corresponding to the fixing outer frame (310), a plurality of reinforcing inner frames corresponding to the supporting inner frames (320) and a plurality of through holes corresponding to the welding areas (2) are arranged on the reinforcing plate (10), and the reinforcing assembly (8) is arranged on one side, close to the supporting inner frames (320), of the reinforcing inner frames;
the reinforcing assembly (8) comprises reinforcing battens (810), the reinforcing battens (810) correspond to the reinforcing inner frame, inserting rods (820) are arranged at two ends, close to one side of the reinforcing inner frame, of the reinforcing battens (810), sleeves (830) capable of enabling the inserting rods (820) to be inserted are arranged on the reinforcing inner frame, and first springs (840) are connected between the end portions of the inserting rods (820) and the sleeves (830).
2. The jig for improving warpage, bump bridging and chip damage or breakage of a flip chip substrate as claimed in claim 1, wherein an elastic mechanism (9) is further disposed between the reinforcing lath (810) and the reinforcing inner frame, the elastic mechanism (9) comprises a first connecting block (910), the first connecting block (910) is fixedly disposed on the reinforcing lath (810), a first telescopic connecting rod (920) is disposed in the first connecting block (910), a fixing rod (930) is fixedly disposed at one end of the first connecting rod (920) away from the first connecting block (910), two ends of the fixing rod (930) are fixedly connected to the reinforcing lath through a connecting plate, a second connecting rod (960) is disposed at one side of the fixing rod (930) away from the first connecting rod (920), one end of the second connecting rod (940) away from the fixing rod (930) is telescopically disposed in a second connecting block (950), two first hinged rods (960) are hinged in the first connecting block (910), the other end of the first hinged rod (960) is hinged to the fixing rod (930), a slider (950) slidably disposed on the fixing rod (930), two sliders (980) are hinged to the other end of the first connecting rod (970), and two sliders (970) and a spring (990) and a second connecting plate (970) is hinged to the inner frame (990), the second spring (990) is sleeved on the outer side of the fixing rod (930), an L-shaped abutting rod (9100) is arranged at one end, hinged to the sliding block (970), of the first hinged rod (960), and the abutting rod (9100) is arranged on one side, away from the fixing rod (930), of the first hinged rod (960).
3. The jig for improving the warpage, bump bridging and chip damage or breakage of the flip chip substrate of claim 2, wherein a first movable cavity is formed in the first connecting block (910), a first hinge shaft (911) is formed on a side wall of the first movable cavity, the first hinge shaft (911) is rotatably connected to one end of the first hinge rod (960), a first gear (912) is rotatably connected to a side of the first hinge shaft (911) away from the first hinge rod (960), a first coil spring (913) is connected between the first gear (912) and the side wall of the first movable cavity, and teeth matched with the first gear (912) are formed on two sides of the first connecting rod (920);
a second movable cavity is arranged in the second connecting block (950), a second hinge shaft (951) is arranged on the side wall of the second movable cavity, the second hinge shaft (951) is rotatably connected with one end of a second hinge rod (980), one side, far away from the second hinge rod (980), of the second hinge shaft (951) is rotatably connected with a second gear (952), a second coil spring (953) is connected between the second gear (952) and the side wall of the second movable cavity, and teeth matched with the second gear (952) are arranged on two sides of the second connecting rod (940);
one side of the second connecting block (950), which is far away from the second movable cavity, is provided with a round hole, a cylinder is arranged in the round hole in a sliding manner, one end of the cylinder is fixedly connected with the reinforcing inner frame, the other end of the cylinder is fixedly provided with a third spring, and one end, which is far away from the cylinder, of the third spring is connected with a step surface formed by the round hole and the second movable cavity.
4. The jig for improving the warpage, the bump bridging and the chip damage or the crack of the flip chip substrate as claimed in claim 1, further comprising a detection device for detecting the attaching degree of the pressing plate (1) and the substrate (4), wherein the detection method comprises the following steps:
step 1, arranging a plurality of measuring points on one surface of a pressing plate (1) close to a substrate (4), wherein the measuring points are uniformly distributed on a plate frame (3), and detecting the distance from each measuring point to a reference plane;
step 2, calculating the flatness of one surface of the pressing plate (1) close to the substrate (4) according to the distance between each measuring point and the reference plane;
step 3, judging whether the flatness meets the requirement or not;
step 4, taking the reference pretightening force for connecting the pressing plate (1) and the substrate (4) as an acting force applied on the pressing plate (1), and predicting the deformation generated on the joint surface of the pressing plate (1) and the substrate (4);
step 5, judging whether the deformation generated on the binding surface of the pressing plate (1) and the substrate (4) under the action of the reference pretightening force meets the requirement or not;
and 6, if the judgment result in the step 3 and the judgment result in the step 5 both meet the requirements, the bonding degree of the pressing plate (1) and the substrate (4) is considered to meet the requirements, and if any judgment result in the step 3 and the step 5 does not meet the requirements, the bonding degree of the pressing plate (1) and the substrate (4) is considered to not meet the requirements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210005270.6A CN114373701B (en) | 2022-01-05 | 2022-01-05 | Jig for improving warpage, bump bridging and Die crack of Flip chip substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210005270.6A CN114373701B (en) | 2022-01-05 | 2022-01-05 | Jig for improving warpage, bump bridging and Die crack of Flip chip substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114373701A CN114373701A (en) | 2022-04-19 |
| CN114373701B true CN114373701B (en) | 2023-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210005270.6A Active CN114373701B (en) | 2022-01-05 | 2022-01-05 | Jig for improving warpage, bump bridging and Die crack of Flip chip substrate |
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| Country | Link |
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| CN (1) | CN114373701B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9385091B2 (en) * | 2013-03-08 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reinforcement structure and method for controlling warpage of chip mounted on substrate |
| CN204209315U (en) * | 2014-08-13 | 2015-03-18 | 南通富士通微电子股份有限公司 | Semiconductor flip Reflow Soldering fixture |
| CN109148680B (en) * | 2018-09-26 | 2024-05-21 | 深圳市麦捷微电子科技股份有限公司 | Auxiliary repair process method and auxiliary repair clamp for warpage of epoxy resin packaged ceramic substrate |
| CN212704899U (en) * | 2020-08-06 | 2021-03-16 | 苏州市赛立鸿智能制造有限公司 | Semiconductor flip-chip reflow soldering clamp |
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2022
- 2022-01-05 CN CN202210005270.6A patent/CN114373701B/en active Active
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| Publication number | Publication date |
|---|---|
| CN114373701A (en) | 2022-04-19 |
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