CN109092842B - Scrapped photovoltaic module disassembling method - Google Patents
Scrapped photovoltaic module disassembling method Download PDFInfo
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- CN109092842B CN109092842B CN201810632754.7A CN201810632754A CN109092842B CN 109092842 B CN109092842 B CN 109092842B CN 201810632754 A CN201810632754 A CN 201810632754A CN 109092842 B CN109092842 B CN 109092842B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/20—Waste processing or separation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention relates to the technical field of environmental protection recovery, in particular to a scrapped photovoltaic module disassembling method, which comprises the following steps: 1) disassembling the aluminum frame; 2) disassembling the junction box; 3) removing the fluorine film; 4) removing the back plate; 5) separating the EVA adhesive layer from the back plate, and separating the silicon chip layer, the welding strip and the glass; 6) the materials are separated separately. The method has a simple structure, the scrapped photovoltaic module is disassembled in an environment-friendly and economic manner by adopting the method, and the damage rate of the aluminum frame and the glass is less than 4%; the recovery rate of non-ferrous metals is more than 95%, the recovery rate of noble metals is more than 90%, the recovery rate of silicon materials is more than 90%, the breakage rate of an aluminum frame for the thin-film solar cell is less than 3%, and the recovery rate of rare noble metals is more than 97%.
Description
Technical Field
The invention relates to the technical field of environmental protection recovery, in particular to a method for disassembling a scrapped photovoltaic module.
Background
China is a big country for producing and applying photovoltaic modules, only 2017 years of China produce more than 60GW photovoltaic modules, and according to the conversion of 7.6 ten thousand tons/GW, only 2017 years of photovoltaic modules have the total mass of more than 456 ten thousand tons after being scrapped.
Most of materials of the photovoltaic module are recyclable materials, recycling of the photovoltaic module is achieved, resources can be saved, exploitation of primary resources is reduced, energy consumption of resource extraction is reduced, and accordingly influence and damage to the ecological environment are reduced.
The photovoltaic module comprises 70% of glass (weight ratio, the same below), 18% of aluminum frame, 4% of silicon material, 0.15% of noble metal, 0.85% of junction box, 1% of back plate and 6% of EVA.
When the waste photovoltaic module is recycled, the module needs to be disassembled, and the aluminum frame, the glass and the junction box are partially removed to obtain the silicon wafer. Effective methods for recovering intact silicon wafers include "mineral acid dissolution" and "heat treatment". Among them, the latter is classified into a "fixed vessel heat treatment method" and a "fluidized bed reactor heat treatment method".
1) Inorganic acid dissolution method
The EVA is dissolved away by using mixed acid of nitric acid and nitrogen peroxide under a certain temperature condition for a period of time, and is classified with glass. The process remains intact but requires further processing of the silicon wafer.
2) Fixed container heat treatment process
And (3) putting the photovoltaic module into an incinerator, and setting the reaction temperature to 600 ℃ for incineration. After incineration, the battery, glass and frame were separated manually. The recovered materials enter corresponding recovery procedures, and the plastic materials are completely incinerated.
3) Fluidized bed reactor heat treatment process
And (4) carrying out heat treatment on the waste photovoltaic module by using a fluidized bed reactor. The fine sand is put into a fluidized bed reactor, and under the action of air with certain temperature and flow rate, the fine sand is in a scalding flowing state and has the physical properties of liquid. When the assembly is placed in a fluidized bed, the EVA and the back sheet material are gasified in the reactor, and waste gas enters a secondary combustion chamber from the reactor to be used as a heat source of the reactor. For the battery piece with the thickness of more than 400 microns, the intact silicon piece can be recycled. Because the manufacturing technology is continuously developed, the cell slice is gradually thinned, and the heat treatment method cannot obtain a perfect silicon slice, the method can only be applied to the recovery of silicon materials.
In addition to the above 3 methods, "organic acid dissolution method" and "physical separation method";
4) organic acid dissolving method
And swelling EVA by using an organic solvent to achieve the purpose of separating the cell piece, the EVA, the glass and the back plate. The method needs long time, and about 7 days is a reaction period. In addition, the EVA swells, which causes the cell pieces to be broken and has a problem of organic waste liquid treatment, is still under a laboratory research stage.
5) Physical separation method
The method comprises the steps of dismantling an aluminum frame and a junction box of the assembly, crushing the frameless assembly, separating a tin-coated welding strip from glass particles, grinding the rest part, and obtaining metal, silicon powder, back plate particles and EVA particles by using an electrostatic separation method. The method finally obtains a mixture of different materials, cannot realize the full separation of single components, and is still in a laboratory research stage.
According to the technical method and experience of the existing scrapped photovoltaic module at home and abroad, the method comprises the following steps:
dissolving inorganic acid and organic acid: the frame is removed and the silicon wafer is recycled only aiming at the removal and separation of the EVA. And a large amount of chemical reagents are needed, and the remaining waste liquid also belongs to dangerous waste. The method is neither economical nor environmentally friendly.
A heat treatment method: the disposal process generates a large amount of organic waste gas, and the method is neither economical nor environment-friendly.
Physical separation method: not perfect enough to separate the individual components.
Therefore, an environment-friendly and economic method for disassembling the scrapped photovoltaic module is sought, the recovery rate can be improved, the breakage rate is reduced in the disassembling process, and the national expected index is met, so that the method is very necessary.
Disclosure of Invention
In order to overcome the defects of the technical problems, the invention provides a scrapped photovoltaic module disassembling method which can completely solve the technical problems.
The technical scheme for solving the technical problems is as follows:
the scrapped photovoltaic module disassembling method comprises the following steps:
1) disassemble aluminium frame
An automatic frame dismantling machine is adopted, and the aluminum frame is completely dismantled by increasing the outward expansion force of the aluminum frame of the scrapped photovoltaic module;
2) disassembling junction box
A blade is adopted, and the junction box is manually disassembled;
3) defluorination film
The fluorine film is positioned on the outermost layer of the structure of the scrapped photovoltaic module backboard, and the fluorine film is removed by controlling the pressure and the angle of the fluid sprayed out by the spray gun; the fluid, sand or the mixture of the fluid and the sand is sprayed out of the spray gun in the step 3), the fluid, the sand or the mixture of the fluid and the sand is in a mist or flow shape when flowing out of the spray gun opening, and the spraying pressure is 100kg/cm and 200kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 0.1-1.5 m, and the straight line included angle between the spray gun and the target is 30-45 degrees.
4) Go back board
The back plate material passes through the EVA glue layer andthe silicon wafers are tightly combined, the back plate is separated from the silicon wafers by controlling the pressure and the angle of the fluid sprayed out by the spray gun, and at the moment, the back plate is bonded with the EVA adhesive layer; before removing the back plate in the step 4), longitudinally cutting one side of the back plate close to the to-be-sprayed fluid by using a blade, so that the cutting depth at least extends to the silicon chip layer, even the glass layer. The fluid, sand or the mixture of the fluid and the sand is sprayed out of the spray gun in the step 4), the fluid, the sand or the mixture of the fluid and the sand is in a mist shape or a flow shape when flowing out of the spray gun opening, and the spraying pressure is 300-400kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 0.02-0.3 m, and the linear included angle between the spray gun and the target is 20-25 degrees.
5) Separating EVA adhesive layer and back plate, separating silicon chip layer, welding strip and glass
For welding the area between silicon chip and the EVA glue film, separate EVA glue film, backplate, silicon chip layer, weld area and glass respectively through the pressure and the angle of control spray gun efflux matter, the silicon chip smash to peel off, the silicon chip is peeled off and is 50-150 mesh granules, the area of welding be strip more than 5cm, the EVA glue film between silicon chip and glass be 45-55 mesh powder, backplate more than 90% is 2cm with the EVA glue film2The sizes are combined together; the fluid, sand or the mixture of the fluid and the sand is sprayed out of the spray gun in the step 5), the fluid, the sand or the mixture of the fluid and the sand is in a mist shape or a flow shape when flowing out of the spray gun opening, and the spraying pressure is 400kg/cm and 500kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 5-5.5 m, and the straight line included angle between the spray gun and the target is 10-15 degrees.
6) Separate separation of materials
And (3) enabling the mixed material obtained in the step 5) to flow into a collecting box, arranging a filter screen in the collecting box, separating large-particle materials by controlling the meshes of the filter screen, and gradually separating the rest materials by controlling the centrifugal speed of the centrifugal separator.
Further, the spray gun is any one of a single jet spray head, a fan-shaped spray head or a rotary spray head.
The method has a simple structure, the scrapped photovoltaic module is disassembled in an environment-friendly and economic manner by adopting the method, and the damage rate of the aluminum frame and the glass is less than 4%; the recovery rate of non-ferrous metals is more than 95%, the recovery rate of noble metals is more than 90%, the recovery rate of silicon materials is more than 90%, the breakage rate of an aluminum frame for the thin-film solar cell is less than 3%, and the recovery rate of rare noble metals is more than 97%.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic structural diagram of a scrapped photovoltaic module;
Detailed Description
Example 1:
the scrapped photovoltaic module disassembling method comprises the following steps:
1) disassemble aluminium frame
An automatic frame dismantling machine is adopted, and the aluminum frame is completely dismantled by increasing the outward expansion force of the aluminum frame of the scrapped photovoltaic module;
2) disassembling junction box
A blade is adopted, and the junction box is manually disassembled;
3) defluorination film
The fluorine film is positioned on the outermost layer of the structure of the scrapped photovoltaic module backboard, and the fluorine film is removed by controlling the pressure and the angle of the fluid sprayed out by the spray gun; the fluid sprayed from the spray gun is atomized when flowing out of the spray gun mouth, and the spraying pressure is 100kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 0.1 meter, and the straight line included angle between the spray gun and the target is 30 degrees.
4) Go back board
The back plate material is tightly combined with the silicon chip through the EVA adhesive layer, the back plate is separated from the silicon chip by controlling the pressure and the angle of the fluid sprayed out by the spray gun, and at the moment, the back plate is bonded with the EVA adhesive layer; before removing the back plate, a blade is used for longitudinally scratching one side of the back plate close to the to-be-sprayed fluid, so that the scratching depth extends to the silicon wafer layer.
The fluid sprayed from the spray gun is in the form of mist when flowing out of the spray gun mouth, and the spraying pressure is 300kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 0.02 m, and the straight line included angle between the spray gun and the target is 20 degrees.
5) Separating EVA adhesive layer and back plate, separating silicon chip layer, welding strip and glass
For welding the area between silicon chip and the EVA glue film, separate EVA glue film, backplate, silicon chip layer, weld area and glass respectively through the pressure and the angle of control spray gun efflux matter, the silicon chip smash to peel off, the silicon chip is peeled off and is 50-150 mesh granules, the area of welding be strip more than 5cm, the EVA glue film between silicon chip and glass be 45-55 mesh powder, backplate more than 90% is 2cm with the EVA glue film2The sizes are combined together; the fluid is sprayed out of the spray gun, the fluid is in a flow shape when flowing out of the spray gun mouth, and the spraying pressure is 400kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 5 m, and the straight line included angle between the spray gun and the target is 10.
6) Separate separation of materials
And (3) enabling the mixed material obtained in the step 5) to flow into a collecting box, arranging a filter screen in the collecting box, separating large-particle materials by controlling the meshes of the filter screen, and gradually separating the rest materials by controlling the centrifugal speed of the centrifugal separator.
The spray gun is a single jet flow nozzle.
The breakage rate of the aluminum frame and the glass is 3.3%; the recovery rate of nonferrous metal is 97%, the recovery rate of noble metal is 91.3%, the recovery rate of silicon material is 95%, the breakage rate of aluminum frame for thin-film solar cell is 2.3%, and the recovery rate of rare noble metal is 97.8%.
Example 2:
the scrapped photovoltaic module disassembling method comprises the following steps:
1) disassemble aluminium frame
An automatic frame dismantling machine is adopted, and the aluminum frame is completely dismantled by increasing the outward expansion force of the aluminum frame of the scrapped photovoltaic module;
2) disassembling junction box
A blade is adopted, and the junction box is manually disassembled;
3) defluorination film
The fluorine film is positioned on the outermost layer of the structure of the scrapped photovoltaic module backboard, and the fluorine film is removed by controlling the pressure and the angle of the fluid sprayed out by the spray gun; the sand sprayed out of the spray gun is in a flowing state when flowing out of the spray gun mouthThe pressure of the discharge was 200kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 1.5 m, and the straight line included angle between the spray gun and the target is 45 degrees.
4) Go back board
The back plate material is tightly combined with the silicon chip through the EVA adhesive layer, the back plate is separated from the silicon chip by controlling the pressure and the angle of the fluid sprayed out by the spray gun, and at the moment, the back plate is bonded with the EVA adhesive layer; before removing the back plate, a blade is used for longitudinally cutting one side of the back plate close to the to-be-sprayed electrolyte, so that the cutting depth extends to the glass layer.
The mixture of fluid and sand sprayed by the spray gun is atomized when flowing out of the spray gun mouth, and the spraying pressure is 400kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 0.3 m, and the straight line included angle between the spray gun and the target is 25 degrees.
5) Separating EVA adhesive layer and back plate, separating silicon chip layer, welding strip and glass
For welding the area between silicon chip and the EVA glue film, separate EVA glue film, backplate, silicon chip layer, weld area and glass respectively through the pressure and the angle of control spray gun efflux matter, the silicon chip smash to peel off, the silicon chip is peeled off and is 50-150 mesh granules, the area of welding be strip more than 5cm, the EVA glue film between silicon chip and glass be 45-55 mesh powder, backplate more than 90% is 2cm with the EVA glue film2The sizes are combined together; the sand sprayed out of the spray gun is in a flowing state when flowing out of the spray gun opening, and the spraying pressure is 500kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 5.5 m, and the straight line included angle between the spray gun and the target is 15 degrees.
6) Separate separation of materials
And (3) enabling the mixed material obtained in the step 5) to flow into a collecting box, arranging a filter screen in the collecting box, separating large-particle materials by controlling the meshes of the filter screen, and gradually separating the rest materials by controlling the centrifugal speed of the centrifugal separator.
The spray gun is a fan-shaped spray head.
The breakage rate of the aluminum frame and the glass is 3.2%; the recovery rate of non-ferrous metals is 96.1%, the recovery rate of noble metals is 93.4%, the recovery rate of silicon materials is 93.8%, the breakage rate of an aluminum frame for a thin-film solar cell is 2.01%, and the recovery rate of rare noble metals is 98.1%.
Example 3:
the scrapped photovoltaic module disassembling method comprises the following steps:
1) disassemble aluminium frame
An automatic frame dismantling machine is adopted, and the aluminum frame is completely dismantled by increasing the outward expansion force of the aluminum frame of the scrapped photovoltaic module;
2) disassembling junction box
A blade is adopted, and the junction box is manually disassembled;
3) defluorination film
The fluorine film is positioned on the outermost layer of the structure of the scrapped photovoltaic module backboard, and the fluorine film is removed by controlling the pressure and the angle of the fluid sprayed out by the spray gun; the sand sprayed by the spray gun is in the form of fog when flowing out of the spray gun mouth, and the spraying pressure is 150kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 1 meter, and the straight line included angle between the spray gun and the target is 35 degrees.
4) Go back board
The back plate material is tightly combined with the silicon chip through the EVA adhesive layer, the back plate is separated from the silicon chip by controlling the pressure and the angle of the fluid sprayed out by the spray gun, and at the moment, the back plate is bonded with the EVA adhesive layer; before removing the back plate, a blade is used for longitudinally cutting one side of the back plate close to the to-be-sprayed electrolyte, so that the cutting depth extends to the glass layer.
The mixture of fluid and sand sprayed by the spray gun is in a mist shape when flowing out of the spray gun opening, and the spraying pressure is 350kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 0.15 m, and the straight line included angle between the spray gun and the target is 22 degrees.
5) Separating EVA adhesive layer and back plate, separating silicon chip layer, welding strip and glass
For welding the area between silicon chip and the EVA glue film, separate EVA glue film, backplate, silicon chip layer, weld area and glass respectively through the pressure and the angle of control spray gun efflux matter, the silicon chip smash to peel off, the silicon chip is peeled off and is 50-150 mesh granules, the area of welding be strip more than 5cm, the EVA glue film between silicon chip and glass be 45-55 mesh powder, backplate more than 90% is 2cm with the EVA glue film2The sizes are combined together; the fluid sprayed from the spray gun is atomized when flowing out of the spray gun mouth, and the spraying pressure is 450kg/cm2(ii) a The distance between the nozzle of the spray gun and the target is 5.2 m, and the straight line included angle between the spray gun and the target is 12 degrees.
6) Separate separation of materials
And (3) enabling the mixed material obtained in the step 5) to flow into a collecting box, arranging a filter screen in the collecting box, separating large-particle materials by controlling the meshes of the filter screen, and gradually separating the rest materials by controlling the centrifugal speed of the centrifugal separator.
The spray gun is a rotary spray head.
The breakage rate of the aluminum frame and the glass is 3.6 percent; the recovery rate of nonferrous metal is 99%, the recovery rate of noble metal is 94.8%, the recovery rate of silicon material is 92.5%, the breakage rate of aluminum frame for thin-film solar cell is 2.2%, and the recovery rate of noble metal is 97.9%.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications and equivalent variations of the above embodiment according to the present invention are within the scope of the present invention.
Claims (5)
1. The scrapped photovoltaic module disassembling method is characterized by comprising the following steps:
1) disassemble aluminium frame
An automatic frame dismantling machine is adopted, and the aluminum frame is completely dismantled by increasing the outward expansion force of the aluminum frame of the scrapped photovoltaic module;
2) disassembling junction box
A blade is adopted, and the junction box is manually disassembled;
3) defluorination film
The fluorine film is positioned on the outermost layer of the structure of the scrapped photovoltaic module backboard, and the fluorine film is removed by controlling the pressure and the angle of the fluid sprayed out by the spray gun;
4) go back board
The back plate material is tightly combined with the silicon chip through the EVA adhesive layer, the back plate is separated from the silicon chip by controlling the pressure and the angle of the fluid sprayed out by the spray gun, and at the moment, the back plate is bonded with the EVA adhesive layer;
5) separating EVA adhesive layer and back plate, separating silicon chip layer, welding strip and glass
A welding strip is arranged between the silicon wafer and the EVA adhesive layer, the back plate, the silicon wafer layer, the welding strip and the glass are respectively separated by controlling the pressure and the angle of the fluid discharged by the spray gun, the silicon wafer is crushed and peeled, the silicon wafer is peeled into particles of 50-150 meshes, the welding strip is in a strip shape of more than 5cm, the EVA adhesive layer between the silicon wafer and the glass is powder of 45-55 meshes, and more than 90% of the back plate and the EVA adhesive layer are combined together in a size of more than 2 cm;
6) separate separation of materials
The mixed material obtained in the step 5) flows into a collecting box, a filter screen is arranged in the collecting box, large-particle materials are firstly separated by controlling the meshes of the filter screen, and then the rest materials are respectively and gradually separated by controlling the centrifugal speed of a centrifugal separator;
before removing the back plate in the step 4), longitudinally cutting one side of the back plate close to the to-be-sprayed fluid by using a blade, so that the cutting depth at least extends to the silicon chip layer, even the glass layer.
2. The disassembly method of the scrapped photovoltaic module as claimed in claim 1, wherein the fluid, sand or the mixture of the fluid and sand is sprayed from the spray gun in the step 3), the fluid, sand or the mixture of the fluid and sand is in a mist or stream shape when flowing out of the spray gun mouth, and the spraying pressure is 100 and 200 kg/cm; the distance between the nozzle of the spray gun and the target is 0.1-1.5 m, and the straight line included angle between the spray gun and the target is 30-45 degrees.
3. The disassembly method of the scrapped photovoltaic module as claimed in claim 1, wherein the fluid, sand or the mixture of the fluid and sand is sprayed from the spray gun in the step 4), the fluid, sand or the mixture of the fluid and sand is in a mist or stream shape when flowing out of the spray gun mouth, and the spraying pressure is 300-; the distance between the nozzle of the spray gun and the target is 0.02-0.3 m, and the linear included angle between the spray gun and the target is 20-25 degrees.
4. The disassembly method of the scrapped photovoltaic module as claimed in claim 1, wherein the fluid, sand or the mixture of the fluid and sand is sprayed from the spray gun in the step 5), the fluid, sand or the mixture of the fluid and sand is in a mist or stream shape when flowing out of the spray gun mouth, and the spraying pressure is 400-500 kg/cm; the distance between the nozzle of the spray gun and the target is 5-5.5 m, and the straight line included angle between the spray gun and the target is 10-15 degrees.
5. The disassembly method of the scrapped photovoltaic module of claim 1, wherein the spray gun is any one of a single jet spray head, a fan-shaped spray head or a rotary spray head.
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| CN105895731A (en) * | 2014-09-29 | 2016-08-24 | 汉能新材料科技有限公司 | Recovery method of flexible solar assembly |
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| CN101088169A (en) * | 2004-12-22 | 2007-12-12 | 昭和砚壳石油株式会社 | CIS based thin film solar cell module, method for producing the same, and method for separating solar cell module |
| CN101474774A (en) * | 2009-01-19 | 2009-07-08 | 郜勇军 | Method for processing surface and edge of broken film coating epitaxial silicon chip |
| CN105895731A (en) * | 2014-09-29 | 2016-08-24 | 汉能新材料科技有限公司 | Recovery method of flexible solar assembly |
| CN105618461A (en) * | 2015-12-31 | 2016-06-01 | 东莞珂洛赫慕电子材料科技有限公司 | Method for recycling crystalline silicon solar cell module |
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