CN109031881A - Exposure mask mold and its method for preparing three-dimensional structure - Google Patents
Exposure mask mold and its method for preparing three-dimensional structure Download PDFInfo
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- CN109031881A CN109031881A CN201810839796.8A CN201810839796A CN109031881A CN 109031881 A CN109031881 A CN 109031881A CN 201810839796 A CN201810839796 A CN 201810839796A CN 109031881 A CN109031881 A CN 109031881A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Abstract
The present invention relates to a kind of exposure mask mold and its methods for preparing three-dimensional structure.Exposure mask mold of the invention is mainly made of substrate (1), mould structure layer (2), mask layer (3), the substrate (1) has translucency, the mask layer (3) has light-proofness, and the whole patterns or partial pattern and the whole patterns or partial pattern of the mould structure layer (2) of the mask layer (3) are same or similar.Using the method for exposure mask mold preparation three-dimensional structure the following steps are included: first is that filling the mixing material of photo-curing material or photo-curing material and other materials in the mould structure layer (2) of exposure mask mold, second is that exposure, solidify the mixing material of the photo-curing material or photo-curing material and other materials, third is that being detached from the mixing material of the cured photo-curing material or photo-curing material and other materials from exposure mask mold.The present invention, which realizes, solidifies the selectivity of moulding material, effectively expands application range.
Description
Technical field
The present invention relates to a kind of exposure mask mold and its methods for preparing three-dimensional structure.
Background technique
Mold is widely used in processing and manufacturing field, not only has application in the processing and manufacturing of general characteristics size parts,
And also there is application greatly in the processing of the part of nanoscale to Centimeter Level characteristic size.Fine shape transferred thereon and nanometer embossing
It is exactly two kind typical technologies of the mould structure in the part processing of nanoscale to Centimeter Level characteristic size.In fine shape transferred thereon
In technology, mold is first manufactured, material to be formed is then filled into mold, after material solidification to be formed, is demoulded, is realized fine
Shape transfer；First manufacture mold in nanometer embossing, then treat moulding material and suppressed, material solidification to be formed at
It after type, is demoulded, carries out fine shape transferred thereon.Mold in two kinds of technologies is all mainly by substrate layer and mould structure layer structure
At structure is relatively easy, but two kinds of technologies finally are all easy to exist to stay film, and application is restricted.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of exposure mask (being in industry also known as " mask ") mold and its preparation
The method of three-dimensional structure will not generate when carrying out shape transfer or three-dimensional structure duplication using the exposure mask mold and stay film.
To realize above-mentioned target, exposure mask mold of the invention is mainly by substrate (1), mould structure layer (2), mask layer (3)
Constitute, the substrate (1) have translucency, the mask layer (3) have light-proofness, whole patterns of the mask layer (3) or
Partial pattern and the whole patterns or partial pattern of the mould structure layer (2) are same or similar.
The optional technical solution of the present invention are as follows: the material of the substrate (1) and the material phase of the mould structure layer (2)
Together.
The optional technical solution of the present invention are as follows: the mould structure (2) and the mask layer (3) are same structure.
The optional technical solution of the present invention are as follows: the material of the substrate (1) is glass or high molecular material, the mask layer
(3) material is the combination of metal or metallic compound or ceramic material or high molecular material or above-mentioned material.
The optional technical solution of the present invention are as follows: the thickness of the mask layer (3) is less than 1 centimetre, the figure of the mask layer (3)
The minimum feature size of case is less than 1 centimetre, and the thickness of the mould structure layer (2) is less than 5 centimetres, the mould structure layer (2)
Pattern minimum feature size less than 1 centimetre.
It uses the technical solution of above-mentioned exposure mask mold preparation three-dimensional structure: including following step during preparing three-dimensional structure
It is rapid: step 1, filling photo-curing material or photo-curing material and other materials in the mould structure layer (2) of the exposure mask mold
The mixing material of material, Step 2: to the photo-curing material or photo-curing material and other materials being had been filled in step 1
Mixing material is exposed, and solidifies the mixing material of the photo-curing material or photo-curing material and other materials, step 3,
Make the mixing material of photo-curing material or photo-curing material and other materials cured described in step 2 from exposure mask mold
Middle disengaging；In the step 2, the direction of the exposure light is to be directed toward the exposure mask from the substrate (1) of the exposure mask mold
The mould structure layer (2) of mold.
The optional technical solution of present invention preparation three-dimensional structure are as follows: also include following step before implementing the step 2
It is rapid: by prefabricated structural member close to the mask die, the prefabricated structural member and the photo-curing material having been filled with or
Photo-curing material is contacted with the mixing material of other materials；After completing the step 2, the prefabricated structural member is the same as described
The mixing material of cured photo-curing material or photo-curing material and other materials links together；Complete the step 3
The prefabricated structural member is still the same as the mixing material of the cured photo-curing material or photo-curing material and other materials afterwards
Material links together.
The optional technical solution of present invention preparation three-dimensional structure are as follows: the mixing material includes conducting function material or packet
Containing polymer material perishable after solidification.
The beneficial effects of the present invention are as follows: being equipped with mask layer in exposure mask mold, realize not solid to the selectivity of moulding material
Change (do not stay at film and do not solidify), final realize does not stay film, effectively expands application range；Mould structure is simple, can make repeatedly
It is at low cost when with, use；For the exposure mask grinding tool, mould manufacturing method simple possible provided by the invention；It is repeatedly special with this
Benefit preparation three-dimensional structure, can prepare complicated three-dimensional structure.
Detailed description of the invention
Fig. 1 is the exposure mask mold structure diagram that embodiment one provides；
Fig. 2 is the exposure mask mold structure diagram that embodiment two provides；
Fig. 3 is the exposure mask mold structure diagram that embodiment three provides；
Fig. 4 is the exposure mask mold structure diagram that example IV provides；
Fig. 5 is the exposure mask mold structure diagram that embodiment five provides；
Fig. 6 is the exposure mask mold structure diagram that embodiment six provides；
Fig. 7 is the schematic diagram for the method that the exposure mask mold that embodiment seven provides prepares three-dimensional structure
Fig. 8 is the schematic diagram for the method that the mask die that embodiment eight provides prepares three-dimensional structure
Fig. 9 is the schematic diagram that exposure mask mold is used for multiple times and prepares the method for complex three-dimensional structure that embodiment nine provides
Appended drawing reference: 1- substrate；2- mould structure layer；3- mask layer；Three-dimensional structure (the photo-curing material after solidification of 4- preparation
Or the mixing material of photo-curing material and other materials)；The uncured photo-curing material of 5- or photo-curing material and other materials
Mixing material；6- exposure light；7- prefabricated structural member.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Word " step 1 " used in this patent, " step 2 ",
" step 3 " refers to opposite precedence between each step, should not be construed as only existing three steps when the preparation of three-dimensional structure part
Suddenly, similar " ' step 1 ' is first step of three-dimensional structure part preparation, ' step 2 ' followed by ' step 1 ' " should not also be done
Or the like understanding；Word " filling " is interpreted as entering a certain substance in certain region.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work, belongs to the present invention
The range of protection.
Embodiment one
Shown in Figure 1, the present embodiment provides a kind of exposure mask mould structure, Fig. 1 is its structural schematic diagram, exposure mask mold mainly by
Substrate (1), mould structure layer (2), mask layer (3) are constituted, and substrate (1) has translucency, and mask layer (3) has light-proofness.Mould
Lamps structure layer (2) is located at centre, and substrate (1) and mask layer (3) are located at the two sides of mould structure layer (2), mask layer (3)
Whole patterns or partial pattern and the whole patterns or partial pattern of mould structure layer (2) are same or similar.
In the optinal plan of the present embodiment, substrate (1) material is glass or light transmission high molecular material, the material of mask layer (3)
Material is the combination of metal or metallic compound or ceramic material or high molecular material or above-mentioned material.Mask layer (3) with a thickness of
0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc., the minimum feature size of the pattern of mask layer (3) is 0.1 nanometer, 1 micron, 1
Millimeter or 1 centimetre etc., small 10 microns, 1 millimeter, 1 centimetre or 5 centimetres of the thickness of mould structure layer (2) etc., mould structure layer
(2) minimum feature size of pattern is 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc..
Embodiment two
Shown in Figure 2, the present embodiment provides a kind of exposure mask mould structure, Fig. 2 is its structural schematic diagram, exposure mask mold mainly by
Substrate (1), mould structure layer (2), mask layer (3) are constituted, and substrate (1) has translucency, and mask layer (3) has light-proofness.It covers
Film layer (3) is located at centre, and substrate (1) and mould structure layer (2) are located at the two sides of mask layer (3), the whole of mask layer (3)
Pattern or partial pattern and the whole patterns or partial pattern of mould structure layer (2) are same or similar.
In the optinal plan of the present embodiment, substrate (1) material is glass or light transmission high molecular material, the material of mask layer (3)
Material is the combination of metal or metallic compound or ceramic material or high molecular material or above-mentioned material.Mask layer (3) with a thickness of
0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc., the minimum feature size of the pattern of mask layer (3) is 0.1 nanometer, 1 micron, 1
Millimeter or 1 centimetre etc., small 10 microns, 1 millimeter, 1 centimetre or 5 centimetres of the thickness of mould structure layer (2) etc., mould structure layer
(2) minimum feature size of pattern is 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc..
Embodiment three
Shown in Figure 3, the present embodiment provides a kind of exposure mask mould structure, Fig. 3 is its structural schematic diagram, exposure mask mold mainly by
Substrate (1), mould structure layer (2), mask layer (3) are constituted, and substrate (1) has translucency, and mask layer (3) has light-proofness.Mould
Lamps structure layer (2) and mask layer (3) are same structure.
In the optinal plan of the present embodiment, substrate (1) material is glass or light transmission high molecular material, the material of mask layer (3)
Material is the combination of metal or metallic compound or ceramic material or high molecular material or above-mentioned material.Mask layer (3)/mould structure
Layer (2) with a thickness of 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc., mask layer (3)/mould structure layer (2) pattern is most
Small characteristic size is 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc..
Example IV
Shown in Figure 4, the present embodiment provides a kind of exposure mask mould structure, Fig. 4 is its structural schematic diagram, exposure mask mold mainly by
Substrate (1), mould structure layer (2), mask layer (3) are constituted, and substrate (1) has translucency, and mask layer (3) has light-proofness.Mould
Lamps structure layer (2) is located at centre, and substrate (1) and mask layer (3) are located at the two sides of mould structure layer (2), mould structure layer
(2) identical with substrate (1) material, the whole patterns or partial pattern of mask layer (3) and whole patterns of mould structure layer (2) or
Partial pattern is same or similar.
In the optinal plan of the present embodiment, substrate (1) material is glass or light transmission high molecular material, the material of mask layer (3)
Material is the combination of metal or metallic compound or ceramic material or high molecular material or above-mentioned material.Mask layer (3) with a thickness of
0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc., the minimum feature size of the pattern of mask layer (3) is 0.1 nanometer, 1 micron, 1
Millimeter or 1 centimetre etc., small 10 microns, 1 millimeter, 1 centimetre or 5 centimetres of the thickness of mould structure layer (2) etc., mould structure layer
(2) minimum feature size of pattern is 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc..
Embodiment five
Shown in Figure 5, the present embodiment provides a kind of exposure mask mould structure, Fig. 5 is its structural schematic diagram, exposure mask mold mainly by
Substrate (1), mould structure layer (2), mask layer (3) are constituted, and substrate (1) has translucency, and mask layer (3) has light-proofness.Lining
Bottom (1) is located at centre, and mould structure layer (2) and mask layer (3) are located at the two sides of substrate (1), whole figures of mask layer (3)
Case or partial pattern and the whole patterns or partial pattern of mould structure layer (2) are same or similar.
In the optinal plan of the present embodiment, substrate (1) material is glass or light transmission high molecular material, the material of mask layer (3)
Material is the combination of metal or metallic compound or ceramic material or high molecular material or above-mentioned material.Mask layer (3) with a thickness of
0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc., the minimum feature size of the pattern of mask layer (3) is 0.1 nanometer, 1 micron, 1
Millimeter or 1 centimetre etc., small 10 microns, 1 millimeter, 1 centimetre or 5 centimetres of the thickness of mould structure layer (2) etc., mould structure layer
(2) minimum feature size of pattern is 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc..
Embodiment six
Shown in Figure 6, the present embodiment provides a kind of exposure mask mould structure, Fig. 6 is its structural schematic diagram, exposure mask mold mainly by
Substrate (1), mould structure layer (2), mask layer (3) are constituted, and substrate (1) has translucency, and mask layer (3) has light-proofness.Lining
Bottom (1) is located at centre, and mould structure layer (2) and mask layer (3) are located at the two sides of substrate (1), mould structure layer (2) and lining
Bottom (1) material is identical, the whole patterns or partial pattern of mask layer (3) and whole patterns or part figure of mould structure layer (2)
Case is same or similar.
In the optinal plan of the present embodiment, substrate (1) material is glass or light transmission high molecular material, the material of mask layer (3)
Material is metal or metallic compound or ceramic material or high molecular material.Mask layer (3) with a thickness of 0.1 nanometer, 1 micron, 1 milli
Rice or 1 centimetre etc., the minimum feature size of the pattern of mask layer (3) is 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc.,
Small 10 microns, 1 millimeter, 1 centimetre or 5 centimetres of the thickness of mould structure layer (2) etc., the minimum of the pattern of mould structure layer (2)
Characteristic size is 0.1 nanometer, 1 micron, 1 millimeter or 1 centimetre etc..
Embodiment seven
Shown in Figure 7, the present embodiment provides a kind of method of exposure mask mold preparation three-dimensional structure, Fig. 7 is its schematic diagram, Fig. 7
(a) be the three dimensional structure diagram to be prepared, preparation process comprising the following specific steps
Firstly, preparing corresponding exposure mask mould structure, exposure mask mould structure is as shown in Figure 7 (b)；Then, it is filled out in exposure mask mold
The mixing material for filling photo-curing material or photo-curing material and other materials is as shown in Fig. 7 (c), the height of filling according to mold with
Size relationship between the three-dimensional structure to be prepared determines, can be higher or lower than or flush in exposure mask mold, in Fig. 7 (c), filling
Height be slightly above mask die；Then, to the mixed of the photo-curing material or photo-curing material and other materials having been filled with
Condensation material is exposed, and solidifies the mixing material of the photo-curing material or photo-curing material and other materials, the exposure
The direction of light is the mould structure layer (2) that the exposure mask mold is directed toward from the substrate (1) of the exposure mask mold, and exposure process is such as
Shown in Fig. 7 (d), the direction of exposure light can also be tilted perpendicular to exposure mask mold, in Fig. 7 (d), exposure light
Direction perpendicular to exposure mask mold, shown in situation such as Fig. 7 (e) after exposure curing, the packing material above mask pattern does not have
Solidification；Finally, the structure after solidification is detached from mold, as shown in Fig. 7 (f).
In the optinal plan of the present embodiment, the mixing material can for the material comprising conducting function material or comprising
The material of perishable polymer material after solidification.
Embodiment eight
Shown in Figure 8, the present embodiment provides a kind of method of exposure mask mold preparation three-dimensional structure, Fig. 8 is its schematic diagram, Fig. 8
(a) be the three dimensional structure diagram to be prepared, preparation process comprising the following specific steps
Firstly, preparing corresponding exposure mask mould structure, exposure mask mould structure is as shown in Figure 8 (b)；Then, it is filled out in exposure mask mold
The mixing material of photo-curing material or photo-curing material and other materials is filled, as shown in Fig. 8 (c)；Then, by prefabricated structural member
Close to the mask die, the prefabricated structural member and the photo-curing material having been filled with or photo-curing material and other materials
The mixing material of material contacts, as shown in Fig. 8 (d)；To the photo-curing material or photo-curing material and other materials having been filled with
Mixing material be exposed, make the mixing material of the photo-curing material or photo-curing material and other materials solidify, it is described
The direction of exposure light is the mould structure layer (2) that the exposure mask mold is directed toward from the substrate (1) of the exposure mask mold, exposed
Shown in journey such as Fig. 8 (e), the direction of exposure light can also be tilted perpendicular to exposure mask mold, in Fig. 8 (e), exposure
The direction of light is perpendicular to exposure mask mold, shown in situation such as Fig. 8 (f) after exposure curing, the packing material above mask pattern
Do not solidify；Finally, the structure after solidification is detached from mold, as shown in Fig. 8 (g).
In the optinal plan of the present embodiment, the mixing material can for the material comprising conducting function material or comprising
The material of perishable polymer material after solidification.
In the present embodiment, the mixing that photo-curing material or photo-curing material and other materials are filled in exposure mask mold
The step of material, optional technical solution have: by the mixed of the photo-curing material or photo-curing material and other materials
Condensation material directly drips on the exposure mask mold.
In the present embodiment, the mixing that photo-curing material or photo-curing material and other materials are filled in exposure mask mold
The step of material, optional technical solution have: by the mixing material of the photo-curing material or photo-curing material and other materials
Material is laid down into prefabricated component, and the exposure mask mold is then made the photo-curing material or photo-curing material close to the prefabricated component
Enter in exposure mask mold with the mixing material of other materials.
In the present embodiment, the mixing that photo-curing material or photo-curing material and other materials are filled in exposure mask mold
The step of material, optional technical solution have: by the mixing material of the photo-curing material or photo-curing material and other materials
Material is laid down into substrate, and the exposure mask mold is then made the photo-curing material or photo-curing material and its close to the substrate
The mixing material of his material enters in exposure mask mold.
In the present embodiment, optional technical solution are as follows: pressure can be applied to prefabricated component according to demand, make prefabricated component and exposure mask
Distance between mold is maintained in the size range of needs.
Embodiment nine
Shown in Figure 9, the present embodiment provides a kind of method of exposure mask mold preparation three-dimensional structure, Fig. 9 is its schematic diagram, Fig. 9
It (a) is the three dimensional structure diagram to be prepared, preparation process is comprising the following specific steps firstly, referring to embodiment 8, pre-
First layer three-dimensional structure is prepared in substrate processed, as shown in Figure 9 (b)；Then, according to second layer three-dimensional structure, preparation is corresponding
Exposure mask mould structure, exposure mask mould structure, as shown in Figure 9 (c)；Then, photo-curing material is filled in exposure mask mold or light is solid
Change the mixing material of material and other materials, and by the structural member prepared (as shown in Figure 9) close to the mask die,
Make the mixing material of the structural member prepared and the photo-curing material having been filled with or photo-curing material and other materials
Contact, as shown in Fig. 9 (d)；To the mixing material of the photo-curing material or photo-curing material and other materials that have been filled with into
Row exposure, solidifies the mixing material of the photo-curing material or photo-curing material and other materials, the side of the exposure light
The substrate (1) of exposure mask mold described in Xiang Weicong is directed toward the mould structure layer (2) of the exposure mask mold, exposure process such as Fig. 9 (e) institute
Show, the direction of exposure light can also be tilted perpendicular to exposure mask mold, and in Fig. 9 (e), the direction of exposure light is hung down
Directly shown in such as Fig. 9 (f) of the situation after exposure mask mold, exposure curing, the packing material above mask pattern does not solidify；Most
Afterwards, the structure after solidification is detached from mold, as shown in Fig. 9 (g).
Claims (8)
1. a kind of exposure mask mold, it is characterised in that: exposure mask mold is mainly by substrate (1), mould structure layer (2), mask layer (3) structure
At the substrate (1) has translucency, and the mask layer (3) has light-proofness, whole patterns of the mask layer (3) or portion
Sub-pattern and the whole patterns or partial pattern of the mould structure layer (2) are same or similar.
2. exposure mask mold according to claim 1, it is characterised in that: the material and the mould structure of the substrate (1)
The material of layer (2) is identical.
3. exposure mask mold according to claim 1, it is characterised in that: the mould structure (2) and the mask layer (3) are
Same structure.
4. exposure mask mold according to claim 1, it is characterised in that: the material of the substrate (1) is glass or macromolecule
Material, the material of the mask layer (3) are metal or metallic compound or ceramic material or high molecular material or above-mentioned material
Combination.
5. exposure mask mold according to claim 1, it is characterised in that: the thickness of the mask layer (3) is less than 1 centimetre, institute
The minimum feature size of the pattern of mask layer (3) is stated less than 1 centimetre, the thickness of the mould structure layer (2) is less than 5 centimetres, institute
The minimum feature size of the pattern of mould structure layer (2) is stated less than 1 centimetre.
6. a kind of method using exposure mask mold preparation three-dimensional structure described in claim 1, it is characterised in that: three-dimensional in preparation
Step 1 is comprised the steps of: in configuration process, and photo-curing material is filled in the mould structure layer (2) of the exposure mask mold
Or the mixing material of photo-curing material and other materials, Step 2: to the photo-curing material or light that are had been filled in step 1
The mixing material of curing materials and other materials is exposed, and makes the photo-curing material or photo-curing material and other materials
Mixing material solidification, step 3 make photo-curing material or photo-curing material and other materials cured described in step 2
Mixing material be detached from from exposure mask mold；In the step 2, the direction of the exposure light is from the exposure mask mold
Substrate (1) be directed toward the mould structure layer (2) of the exposure mask mold.
7. the method for preparation three-dimensional structure according to claim 6, it is characterised in that: before implementing the step 2, also
It comprises the steps of: prefabricated structural member close to the mask die, make the prefabricated structural member and described has been filled with
Photo-curing material or photo-curing material are contacted with the mixing material of other materials；It is described prefabricated after completing the step 2
Structural member links together with the mixing material of the cured photo-curing material or photo-curing material and other materials；Complete
At prefabricated structural member described after the step 3 still with the cured photo-curing material or photo-curing material and other
The mixing material of material links together.
8. the method for preparation three-dimensional structure according to claim 6, it is characterised in that: the mixing material includes conductive function
Energy material includes polymer material perishable after solidifying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810839796.8A CN109031881A (en) | 2018-07-27 | 2018-07-27 | Exposure mask mold and its method for preparing three-dimensional structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810839796.8A CN109031881A (en) | 2018-07-27 | 2018-07-27 | Exposure mask mold and its method for preparing three-dimensional structure |
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| CN109031881A true CN109031881A (en) | 2018-12-18 |
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