CN108989511B - 一种具有电子元件的基座及音圈马达 - Google Patents
一种具有电子元件的基座及音圈马达 Download PDFInfo
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- CN108989511B CN108989511B CN201811114105.4A CN201811114105A CN108989511B CN 108989511 B CN108989511 B CN 108989511B CN 201811114105 A CN201811114105 A CN 201811114105A CN 108989511 B CN108989511 B CN 108989511B
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- metal circuit
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- electronic
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- 239000002184 metal Substances 0.000 claims abstract description 94
- 229910052751 metal Inorganic materials 0.000 claims abstract description 94
- 239000004033 plastic Substances 0.000 claims abstract description 44
- 229920003023 plastic Polymers 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 15
- 230000003647 oxidation Effects 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 230000002787 reinforcement Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 19
- 238000005520 cutting process Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000011265 semifinished product Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000003064 anti-oxidating effect Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 238000010924 continuous production Methods 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
- H02K41/0356—Lorentz force motors, e.g. voice coil motors moving along a straight path
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
- G01R33/072—Constructional adaptation of the sensor to specific applications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0225—Rotatable telephones, i.e. the body parts pivoting to an open position around an axis perpendicular to the plane they define in closed position
- H04M1/0227—Rotatable in one plane, i.e. using a one degree of freedom hinge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Windings For Motors And Generators (AREA)
- Reciprocating, Oscillating Or Vibrating Motors (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (8)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811114105.4A CN108989511B (zh) | 2018-09-25 | 2018-09-25 | 一种具有电子元件的基座及音圈马达 |
US17/276,726 US12013448B2 (en) | 2018-09-25 | 2019-06-12 | Base with electronic component and voice coil motor |
JP2021507054A JP7111886B2 (ja) | 2018-09-25 | 2019-06-12 | 電気素子を有するベース及びボイスコイルモータ |
PCT/CN2019/090830 WO2020062929A1 (zh) | 2018-09-25 | 2019-06-12 | 具有电子元件的基座及音圈马达 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811114105.4A CN108989511B (zh) | 2018-09-25 | 2018-09-25 | 一种具有电子元件的基座及音圈马达 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108989511A CN108989511A (zh) | 2018-12-11 |
CN108989511B true CN108989511B (zh) | 2023-05-12 |
Family
ID=64543795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811114105.4A Active CN108989511B (zh) | 2018-09-25 | 2018-09-25 | 一种具有电子元件的基座及音圈马达 |
Country Status (4)
Country | Link |
---|---|
US (1) | US12013448B2 (zh) |
JP (1) | JP7111886B2 (zh) |
CN (1) | CN108989511B (zh) |
WO (1) | WO2020062929A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108989511B (zh) * | 2018-09-25 | 2023-05-12 | 苏州昀冢电子科技股份有限公司 | 一种具有电子元件的基座及音圈马达 |
CN111193856B (zh) * | 2020-04-13 | 2020-07-24 | 苏州昀冢电子科技股份有限公司 | 摄像头模组马达载座及其检测设备和方法、马达 |
CN112702841B (zh) * | 2020-12-16 | 2022-01-14 | 苏州昀冢电子科技股份有限公司 | 一种焊接有电子元件的基座及其音圈马达 |
CN112702842B (zh) * | 2020-12-16 | 2022-04-29 | 苏州昀冢电子科技股份有限公司 | 一种具有金属电路的基座及音圈马达和制造方法 |
CN112738995B (zh) * | 2020-12-23 | 2022-04-29 | 苏州昀冢电子科技股份有限公司 | 一种具有金属电路的基座及其生产工艺和音圈马达 |
CN112994400B (zh) * | 2021-02-05 | 2022-04-05 | 苏州昀冢电子科技股份有限公司 | 一种集成有线圈的基座、音圈马达及其制造方法 |
CN113270978B (zh) * | 2021-06-08 | 2022-02-15 | 苏州昀冢电子科技股份有限公司 | 基座组件及其制造方法 |
CN114643680A (zh) * | 2022-03-22 | 2022-06-21 | 河南皓泽电子股份有限公司 | 镜头驱动装置及其框架和框架的制造方法 |
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US5071223A (en) * | 1989-06-16 | 1991-12-10 | Hitachi, Ltd. | Circuit structure formed by insert molding of electric and/or optical transmission medium |
JP2001358517A (ja) * | 2000-06-15 | 2001-12-26 | Murata Mfg Co Ltd | アンテナ装置およびそれを用いた無線機 |
EP1170110A1 (de) * | 2000-07-07 | 2002-01-09 | Pollmann Austria OHG | Verfahren zum Herstellen einer kunststoffumspritzten Leiterstruktur einer elektrischen Schaltungseinheit sowie eine elektrische Schaltungseinheit mit einer kunststoffumspritzten Leiterstruktur |
CN1822747A (zh) * | 2005-02-16 | 2006-08-23 | 阿尔卑斯电气株式会社 | 立体电路模块及其制造方法 |
CN202634232U (zh) * | 2012-04-12 | 2012-12-26 | 佛山华永科技有限公司 | 便于加工的音圈马达 |
CN103124470A (zh) * | 2011-11-18 | 2013-05-29 | 胡泉凌 | 塑料金属化立体线路制造方法 |
CN103474859A (zh) * | 2013-09-02 | 2013-12-25 | 信源电子制品(昆山)有限公司 | 端子制作方法及端子与电子元器件芯体的制作方法 |
CN104716458A (zh) * | 2013-12-11 | 2015-06-17 | 台湾东电化股份有限公司 | 3d立体电路导脚结合簧片的结构 |
CN105607384A (zh) * | 2016-03-24 | 2016-05-25 | 上海安费诺永亿通讯电子有限公司 | 一种摄像头模组结构 |
CN205304938U (zh) * | 2015-12-11 | 2016-06-08 | 宁波舜宇光电信息有限公司 | 具有导电性能的马达底座及摄像模组 |
CN106444218A (zh) * | 2015-08-07 | 2017-02-22 | 台湾东电化股份有限公司 | 镜头驱动装置 |
CN106954356A (zh) * | 2017-04-13 | 2017-07-14 | 上海与德科技有限公司 | 一种壳体的制作方法、壳体与终端设备 |
CN206805096U (zh) * | 2017-06-30 | 2017-12-26 | 信利光电股份有限公司 | 一种自动对焦马达及摄像模组 |
CN107529700A (zh) * | 2017-09-04 | 2018-01-02 | 信利光电股份有限公司 | 一种音圈马达及摄像模组 |
CN207150719U (zh) * | 2017-09-27 | 2018-03-27 | 信利光电股份有限公司 | 一种下盖、音圈马达及摄像模组 |
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CN108989511B (zh) | 2018-09-25 | 2023-05-12 | 苏州昀冢电子科技股份有限公司 | 一种具有电子元件的基座及音圈马达 |
-
2018
- 2018-09-25 CN CN201811114105.4A patent/CN108989511B/zh active Active
-
2019
- 2019-06-12 WO PCT/CN2019/090830 patent/WO2020062929A1/zh active Application Filing
- 2019-06-12 JP JP2021507054A patent/JP7111886B2/ja active Active
- 2019-06-12 US US17/276,726 patent/US12013448B2/en active Active
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US5071223A (en) * | 1989-06-16 | 1991-12-10 | Hitachi, Ltd. | Circuit structure formed by insert molding of electric and/or optical transmission medium |
JP2001358517A (ja) * | 2000-06-15 | 2001-12-26 | Murata Mfg Co Ltd | アンテナ装置およびそれを用いた無線機 |
EP1170110A1 (de) * | 2000-07-07 | 2002-01-09 | Pollmann Austria OHG | Verfahren zum Herstellen einer kunststoffumspritzten Leiterstruktur einer elektrischen Schaltungseinheit sowie eine elektrische Schaltungseinheit mit einer kunststoffumspritzten Leiterstruktur |
CN1822747A (zh) * | 2005-02-16 | 2006-08-23 | 阿尔卑斯电气株式会社 | 立体电路模块及其制造方法 |
CN103124470A (zh) * | 2011-11-18 | 2013-05-29 | 胡泉凌 | 塑料金属化立体线路制造方法 |
CN202634232U (zh) * | 2012-04-12 | 2012-12-26 | 佛山华永科技有限公司 | 便于加工的音圈马达 |
CN103474859A (zh) * | 2013-09-02 | 2013-12-25 | 信源电子制品(昆山)有限公司 | 端子制作方法及端子与电子元器件芯体的制作方法 |
CN104716458A (zh) * | 2013-12-11 | 2015-06-17 | 台湾东电化股份有限公司 | 3d立体电路导脚结合簧片的结构 |
CN106444218A (zh) * | 2015-08-07 | 2017-02-22 | 台湾东电化股份有限公司 | 镜头驱动装置 |
CN205304938U (zh) * | 2015-12-11 | 2016-06-08 | 宁波舜宇光电信息有限公司 | 具有导电性能的马达底座及摄像模组 |
CN105607384A (zh) * | 2016-03-24 | 2016-05-25 | 上海安费诺永亿通讯电子有限公司 | 一种摄像头模组结构 |
CN106954356A (zh) * | 2017-04-13 | 2017-07-14 | 上海与德科技有限公司 | 一种壳体的制作方法、壳体与终端设备 |
CN206805096U (zh) * | 2017-06-30 | 2017-12-26 | 信利光电股份有限公司 | 一种自动对焦马达及摄像模组 |
CN107529700A (zh) * | 2017-09-04 | 2018-01-02 | 信利光电股份有限公司 | 一种音圈马达及摄像模组 |
CN207150719U (zh) * | 2017-09-27 | 2018-03-27 | 信利光电股份有限公司 | 一种下盖、音圈马达及摄像模组 |
Also Published As
Publication number | Publication date |
---|---|
CN108989511A (zh) | 2018-12-11 |
US12013448B2 (en) | 2024-06-18 |
WO2020062929A1 (zh) | 2020-04-02 |
JP7111886B2 (ja) | 2022-08-02 |
US20220034980A1 (en) | 2022-02-03 |
JP2021533574A (ja) | 2021-12-02 |
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