CN108962804A - 一种不间断式进片回片装置及控制方法 - Google Patents
一种不间断式进片回片装置及控制方法 Download PDFInfo
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- CN108962804A CN108962804A CN201710356787.9A CN201710356787A CN108962804A CN 108962804 A CN108962804 A CN 108962804A CN 201710356787 A CN201710356787 A CN 201710356787A CN 108962804 A CN108962804 A CN 108962804A
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- Prior art keywords
- load port
- foup
- buffer area
- section
- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710356787.9A CN108962804B (zh) | 2017-05-19 | 2017-05-19 | 一种不间断式进片回片装置及控制方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710356787.9A CN108962804B (zh) | 2017-05-19 | 2017-05-19 | 一种不间断式进片回片装置及控制方法 |
Publications (2)
Publication Number | Publication Date |
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CN108962804A true CN108962804A (zh) | 2018-12-07 |
CN108962804B CN108962804B (zh) | 2021-08-10 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710356787.9A Active CN108962804B (zh) | 2017-05-19 | 2017-05-19 | 一种不间断式进片回片装置及控制方法 |
Country Status (1)
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CN (1) | CN108962804B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114420616A (zh) * | 2022-03-28 | 2022-04-29 | 西安奕斯伟材料科技有限公司 | 槽式清洗装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1536639A (zh) * | 2003-04-03 | 2004-10-13 | 力晶半导体股份有限公司 | 避免出气污染之前开式晶圆盒以及避免出气污染的方法 |
CN101203952A (zh) * | 2005-05-16 | 2008-06-18 | 埃赛斯特科技有限公司 | 输送机和半导体加工设备装载端口间的接口 |
JP2010098121A (ja) * | 2008-10-16 | 2010-04-30 | Tokyo Electron Ltd | 処理装置及び処理方法 |
CN101872529A (zh) * | 2009-04-24 | 2010-10-27 | 上海华虹Nec电子有限公司 | 用于晶圆加工设备的晶圆突片告警*** |
CN103010705A (zh) * | 2011-09-26 | 2013-04-03 | 大日本网屏制造株式会社 | 基板处理*** |
CN106463441A (zh) * | 2014-06-19 | 2017-02-22 | 村田机械株式会社 | 载具的临时保管装置和临时保管方法 |
-
2017
- 2017-05-19 CN CN201710356787.9A patent/CN108962804B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1536639A (zh) * | 2003-04-03 | 2004-10-13 | 力晶半导体股份有限公司 | 避免出气污染之前开式晶圆盒以及避免出气污染的方法 |
CN101203952A (zh) * | 2005-05-16 | 2008-06-18 | 埃赛斯特科技有限公司 | 输送机和半导体加工设备装载端口间的接口 |
JP2010098121A (ja) * | 2008-10-16 | 2010-04-30 | Tokyo Electron Ltd | 処理装置及び処理方法 |
CN101872529A (zh) * | 2009-04-24 | 2010-10-27 | 上海华虹Nec电子有限公司 | 用于晶圆加工设备的晶圆突片告警*** |
CN103010705A (zh) * | 2011-09-26 | 2013-04-03 | 大日本网屏制造株式会社 | 基板处理*** |
CN106463441A (zh) * | 2014-06-19 | 2017-02-22 | 村田机械株式会社 | 载具的临时保管装置和临时保管方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114420616A (zh) * | 2022-03-28 | 2022-04-29 | 西安奕斯伟材料科技有限公司 | 槽式清洗装置 |
Also Published As
Publication number | Publication date |
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CN108962804B (zh) | 2021-08-10 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211116 Address after: 201306 rooms 201 and 202, building 1, No. 501, Xuri Road, Lingang xinpian District, Pudong New Area, Shanghai Patentee after: Shanghai Xinyuan Micro Enterprise Development Co., Ltd Address before: 110168 No. 16, Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee before: Shenyang Xinyuan microelectronic equipment Co., Ltd |