CN108945812B - Transfer and storage equipment for electronic device - Google Patents

Transfer and storage equipment for electronic device Download PDF

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Publication number
CN108945812B
CN108945812B CN201810940397.0A CN201810940397A CN108945812B CN 108945812 B CN108945812 B CN 108945812B CN 201810940397 A CN201810940397 A CN 201810940397A CN 108945812 B CN108945812 B CN 108945812B
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CN
China
Prior art keywords
buffer
electronic device
carrying
buffer layer
layer
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Active
Application number
CN201810940397.0A
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Chinese (zh)
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CN108945812A (en
Inventor
高长华
叶坤
商秋锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Hirose Opto Co Ltd
Original Assignee
Suzhou Hirose Opto Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201810940397.0A priority Critical patent/CN108945812B/en
Publication of CN108945812A publication Critical patent/CN108945812A/en
Application granted granted Critical
Publication of CN108945812B publication Critical patent/CN108945812B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of electronic device production, and particularly discloses transfer and storage equipment for electronic devices. The electronic device transfer and storage equipment comprises a working support, a buffer mechanism and a carrying mechanism, wherein the buffer mechanism is arranged on the working support and comprises a plurality of buffer layers arranged along the vertical direction, and the buffer layers are used for storing the electronic devices; the carrying mechanism can be horizontally and slidably arranged on the working support and is used for carrying the electronic device into and out of the buffer layer; the buffer mechanism and/or the carrying mechanism can move to a preset position along the vertical direction, and the buffer mechanism and/or the carrying mechanism are used for enabling the electronic device to be placed in a buffer layer at the preset position. The buffer mechanism and/or the carrying mechanism can move along the vertical direction, so that the electronic device can be placed in a preset buffer layer, the number of the carrying mechanisms is greatly reduced, the mechanism of transferring and storing equipment of the electronic device is simplified, and the production cost is reduced.

Description

Transfer and storage equipment for electronic device
Technical Field
The invention relates to the technical field of electronic device production, in particular to transfer and storage equipment for electronic devices.
Background
In the production line of electronic devices such as display panels or circuit boards, the electronic devices often need to be transferred and stored. In the prior art, the transfer and storage of the electronic device are often carried out on line, the electronic device cannot be directly transited with the previous working procedure and the next working procedure, the on-line butt joint is realized, the automation degree of the off-line transfer and storage is low, and the production efficiency is low.
Disclosure of Invention
The invention aims to provide an electronic device transfer and storage device, which is used for improving production efficiency.
To achieve the purpose, the invention adopts the following technical scheme:
an electronic device transfer and storage apparatus comprising a work support, further comprising:
the buffer mechanism is arranged on the working support and comprises a plurality of buffer layers arranged along the vertical direction, and the buffer layers are used for storing electronic devices; and
The carrying mechanism is horizontally and slidably arranged on the working support and is used for carrying the electronic device into and out of the buffer layer;
the buffer mechanism and/or the carrying mechanism can move to a preset position along the vertical direction, and the buffer mechanism and/or the carrying mechanism are/is used for enabling the electronic device to be placed in the buffer layer at the preset position.
Preferably, the working support is provided with a vertical driving mechanism, and the vertical driving mechanism is connected with the buffer mechanism and is used for driving the buffer mechanism to move along the vertical direction.
Preferably, the buffer mechanism further comprises a connection plate, the connection plate is connected with the vertical driving mechanism, and a plurality of buffer layers are arranged on the connection plate.
Preferably, the connection board comprises a first connection board and a second connection board which are arranged at intervals, the cache layer comprises a first cache layer and a second cache layer, the first cache layer is connected with the first connection board, and the second cache layer is connected with the second connection board; and a gap is reserved between the first buffer layer and the second buffer layer, and the carrying mechanism can be positioned in the gap between the first buffer layer and the second buffer layer.
Preferably, the first cache layer and the second cache layer each comprise a plurality of first supporting pieces which are parallel and are arranged at intervals;
the carrying mechanism comprises a plurality of second supports which are parallel and are arranged at intervals, wherein the second supports are used for bearing the electronic devices and can be positioned between two adjacent first supports.
Preferably, an inductor is arranged on the connecting plate and used for detecting whether the upper end of the buffer mechanism is horizontal.
Preferably, a first buffer area is arranged at one end of the buffer layer, and the first buffer area is used for bearing the flexible component of the electronic device.
Preferably, the handling mechanism comprises a second buffer zone for carrying the flexible components of the electronic device.
Preferably, the work support is further provided with an adsorption and transport mechanism capable of moving in a vertical direction, the transport mechanism can be located right below the adsorption and transport mechanism, and the adsorption and transport mechanism is used for adsorbing and transporting the electronic device.
Preferably, the working support is further provided with a transfer mechanism capable of moving in the horizontal direction, and the transfer mechanism can be located right below the adsorption conveying mechanism and is used for conveying the electronic devices.
The invention has the beneficial effects that: the electronic device is placed on the carrying mechanism, and the electronic device can be placed in a preset cache layer through the motion of the cache mechanism and/or the carrying mechanism along the vertical direction. . The plurality of cache layers are arranged, so that the transfer and storage equipment of the electronic device can store a plurality of electronic devices, and the applicability of the electronic device is improved. The transfer and storage equipment of the electronic device has high automation degree, can realize on-line butt joint with the previous working procedure and the subsequent working procedure, and improves the production efficiency.
Drawings
FIG. 1 is a perspective view of a transfer and storage device of an embodiment of the present invention;
FIG. 2 is a front view of a transfer and storage device of an embodiment of the present invention;
FIG. 3 is a schematic diagram of a buffer mechanism and a handling mechanism according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a buffering mechanism according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a carrying mechanism according to an embodiment of the present invention.
In the figure:
1. a working bracket;
2. a buffer mechanism; 21. a first connection plate; 22. a second connecting plate; 23. a first cache layer; 24. a second cache layer; 241. a first support; 25. an inductor; 26. a first buffer; 261. a first buffer plate; 262. a first connecting bar;
3. a carrying mechanism; 31. a second support; 32. a second buffer; 321. a second buffer plate; 322. a second connecting bar; 33. a bottom plate; 34. an adsorption assembly;
4. a vertical driving mechanism; 41. a servo motor; 42. a screw;
5. an adsorption conveying mechanism; 6. a transfer mechanism; 7. a horizontal slide rail; 100. an electronic device.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.
The present embodiment provides an electronic device transferring and storing apparatus for transferring and storing, for example, a liquid crystal panel, but is not limited thereto, and may be used for transferring and storing other electronic devices such as a circuit board, etc., to simplify the structure thereof and reduce the production cost thereof.
As shown in fig. 1 and 2, the electronic device transferring and storing apparatus provided in this embodiment includes a work support 1, a buffer mechanism 2, and a carrying mechanism 3. The buffer mechanism 2 is arranged on the working support 1, and the buffer mechanism 2 comprises a plurality of buffer layers arranged along the vertical direction, wherein the buffer layers are used for storing the electronic device 100; the carrying mechanism 3 is horizontally slidably arranged on the working bracket 1 and is used for carrying the electronic device 100 into and out of the buffer layer; the buffer mechanism 2 and/or the handling mechanism 3 can be moved in the vertical direction to a preset position for placing the electronic device 100 in the buffer layer of the preset position.
The electronic device 100 in the present embodiment is placed on the carrying mechanism 3, and the electronic device 100 can be placed in a predetermined buffer layer by the movement of the buffer mechanism 2 and/or the carrying mechanism 3 in the vertical direction. Providing a plurality of cache layers may enable the electronic device relay and storage device to store a plurality of electronic devices 100, improving its applicability. The electronic device transfer and storage equipment provided in the embodiment has high automation degree, can realize online butt joint with the previous process and the subsequent process, and improves the production efficiency.
In this embodiment, the buffer mechanism 2 can move up and down along a vertical direction, specifically, the working support 1 is provided with a vertical driving mechanism 4, the vertical driving mechanism 4 is connected with the buffer mechanism 2 and is used for driving the buffer mechanism 2 to move along the vertical direction, the vertical driving mechanism 4 can include a servo motor 41, a screw rod 42 connected with an output end of the servo motor 41 and a nut cooperatively connected with the screw rod 42, the buffer mechanism 2 is connected with the nut, the screw rod 42 is vertically arranged on the working support 1, the servo motor 41 works to drive the screw rod 42 to rotate, and the nut can move up and down along an axis direction of the screw rod 42, so as to drive the buffer mechanism 2 to move. The screw 42 and the servo motor 41 may be located at one side of the buffer mechanism 2 without affecting the storing function of the buffer mechanism 2. The vertical driving mechanism 4 may have other structures, which will not be described herein.
As shown in fig. 3 and fig. 4, the buffer mechanism 2 may further include a connection board, where the connection board is connected with a nut of the vertical driving mechanism 4, and a plurality of buffer layers are disposed on the connection board, and the connection board moves up and down to drive the plurality of buffer layers to move up and down at the same time.
Specifically, the connecting plates comprise a first connecting plate 21 and a second connecting plate 22 which are arranged at intervals, the first connecting plate 21 and the second connecting plate 22 are connected with vertical driving mechanisms 4, and the two groups of vertical driving mechanisms 4 are started simultaneously to enable the first connecting plate 21 and the second connecting plate 22 to move up and down synchronously.
Each cache layer comprises a first cache layer 23 and a second cache layer 24, wherein the first cache layer 23 is connected with the first connecting plate 21, and the second cache layer 24 is connected with the second connecting plate 22; there is a gap between the first buffer layer 23 and the second buffer layer 24, and the handling mechanism 3 can be located in the gap between the first buffer layer 23 and the second buffer layer 24. The first buffer layer 23 and the second buffer layer 24 of the same buffer layer are located on the same horizontal plane, so that the electronic device 100 can be stably carried. In order to ensure that the first buffer layer 23 and the second buffer layer 24 are located on the same horizontal plane, an inductor 25 is arranged on the connecting plate, and the inductor 25 is used for detecting whether the upper end of the buffer mechanism 2 is horizontal. Specifically, the first connecting plate 21 and the second connecting plate 22 are provided with an inductor 25, and the inductor 25 is used for detecting whether the heights of the first connecting plate 21 and the second connecting plate 22 are consistent, so that the first connecting plate 21 and the second connecting plate 22 can move up and down synchronously, the upper end level of the buffer mechanism 2 is ensured, and the first buffer layer 23 and the second buffer layer 24 of each buffer layer are positioned on the same horizontal plane. Specifically, the sensor 25 may be a correlation sensor 25.
The carrying mechanism 3 can be located in a gap between the first buffer layer 23 and the second buffer layer 24 when moving horizontally, so that the electronic device 100 can be carried directly above a preset buffer layer, and then the electronic device 100 located on the carrying mechanism 3 can be received by moving the buffer mechanism 2 upwards.
In this embodiment, each of the first buffer layer 23 and the second buffer layer 24 includes a plurality of first supporting members 241 disposed in parallel and at intervals, and the first supporting members 241 are capable of carrying the electronic device 100. The handling mechanism 3 includes a plurality of parallel and spaced second supports 31, and the second supports 31 are also used for carrying the electronic device 100, and when the handling mechanism 3 is stopped at the preset position, the second supports 31 can be located between two adjacent first supports 241. The first support 241 and the second support 31 can not only enable most positions of the electronic device 100, especially edge positions of the electronic device 100 to be received, avoid deformation or tilting of the electronic device 100, but also enable mutual transfer of the electronic device 100 between the handling mechanism 3 and the buffer mechanism 2.
One end of each buffer layer is provided with a first buffer area 26, and the first buffer area 26 is used for bearing flexible components of the electronic device 100. The electronic device 100 in this embodiment may be a display panel, one end of the display panel is provided with a flexible component, the first buffer area 26 may be disposed at any end of the buffer layer, and when the display panel is placed, the flexible component on the display panel may be received by the first buffer area 26. Specifically, the first buffer area 26 is disposed at one end of the buffer layer perpendicular to the length direction of the first supporting member 241, the first buffer area 26 includes a plurality of first buffer plates 261 disposed at intervals, and first connection bars 262 are disposed on the connection plates, and the first buffer plates 261 are fixed by the first connection bars 262.
As shown in fig. 5, a horizontal driving mechanism is disposed on the working support 1, and the horizontal driving mechanism is used for driving the carrying mechanism 3 to horizontally move relative to the working support 1, where the horizontal driving mechanism may include a driving member and a horizontal sliding rail 7, and the driving member may be a linear motor or an air cylinder.
The carrying mechanism 3 may further include a bottom plate 33 and an adsorption assembly 34, where the bottom plate 33 is connected to the output end of the driving member, and the adsorption assembly 34 is disposed on the bottom plate 33 and is used for adsorbing the electronic device 100 placed on the bottom plate 33, so as to prevent the electronic device 100 from being displaced during the carrying process. The plurality of second supporting members 31 are divided into two groups, and the two groups of second supporting members 31 are respectively connected to opposite ends of the bottom plate 33, and the bottom plate 33 and the upper surfaces of the plurality of second supporting members 31 are positioned on the same horizontal plane, so that the electronic device 100 can be stably carried.
The handling mechanism 3 may further comprise a second buffer area 32 for carrying the flexible components of the electronic device 100, the second buffer area 32 being arranged corresponding to the first buffer area 26, and being located at the same end of the handling mechanism 3 and the buffer mechanism 2, respectively. The second buffer area 32 includes a second connecting bar 322 connected to the bottom plate 33, and a second buffer plate 321 connected to the second connecting bar 322 and disposed at intervals, and the second buffer plate 321 can be located between the two first buffer plates 261, so that the electronic device 100 can be smoothly transferred between the carrying mechanism 3 and the buffer mechanism 2.
In other embodiments, the handling mechanism 3 may further not include the second supporting member 31, but only include the bottom plate 33, where the bottom plate 33 carries the electronic device 100, and one end of the bottom plate 33 perpendicular to the length direction of the first supporting member 241 is provided with a pushing component capable of being lifted with respect to the bottom plate 33, and the pushing component is capable of pushing the electronic device 100 on the bottom plate 33 of the handling mechanism 3 into the buffer layer and pushing the electronic device 100 in the buffer layer onto the bottom plate 33 of the handling mechanism 3, respectively. The transport mechanism 3 having such a structure may not enter between the first buffer layer and the second buffer layer, but may be provided on one side of the buffer layer.
In this embodiment, the procedure of transferring and storing in the buffer mechanism 2 in the electronic device 100 is as follows:
1. the electronic device 100 is placed on the carrying mechanism 3, the carrying mechanism 3 moves to the side close to the buffer mechanism 2 until the electronic device moves between the first buffer layer 23 and the second buffer layer 24 and the first supporting pieces 241 and the second supporting pieces 31 can be staggered in sequence, and at the moment, the buffer mechanism 2 is at the lowest position (or at a certain position in the middle);
2. the vertical driving mechanism 4 drives the buffer mechanism 2 to move upwards to receive the electronic device 100 positioned on the carrying mechanism 3; the buffer mechanism 2 continues to move upward until a preset position (the preset position refers to that the layer of buffer layer does not bear the electronic device 100, and the second support 31 of the handling mechanism 3 can be located above the layer of buffer layer);
3. the carrying mechanism 3 moves to a side away from the buffer mechanism 2, and steps 1 and 2 are repeated.
The electronic device 100 is carried out from the buffer mechanism 2 and transferred to the next process as follows:
1. the vertical driving mechanism 4 drives the buffer mechanism 2 to move up and down so that the carrying mechanism 3 can be positioned at the lower side of the buffer layer carrying the electronic device 100;
2. the carrying mechanism 3 moves to one side close to the buffer mechanism 2 until the carrying mechanism moves between the first buffer layer 23 and the second buffer layer 24, and the first supporting pieces 241 and the second supporting pieces 31 can be sequentially staggered;
3. the buffer mechanism 2 moves downwards, the carrying mechanism 3 receives the electronic device 100, the carrying mechanism 3 moves to the side far away from the buffer mechanism 2, and the electronic device 100 on the carrying mechanism 3 is taken away in the next process;
4. the buffer mechanism 2 continues to move downwards until a preset position (the preset position refers to that the layer of buffer layer carries the electronic device 100, and the second supporting member 31 of the carrying mechanism 3 can be located below the layer of buffer layer);
5. repeating the steps 2-4.
The work support 1 is further provided with an adsorption and transport mechanism 5 capable of moving in the vertical direction, the transport mechanism 3 can be located right below the adsorption and transport mechanism 5, and the adsorption and transport mechanism 5 is used for adsorbing and transporting the electronic device 100. The suction and transport mechanism 5 may include a plurality of suction nozzles that suction the electronic component 100 on the transport mechanism 3 or the electronic component 100 of the previous process by vacuum suction or place the electronic component 100 suctioned on the suction and transport mechanism 5 on the transport mechanism 3, and a vacuum pump that communicates with the suction nozzles.
The adsorption mechanism can realize up-and-down motion through a linear motor or a driving cylinder fixed on the working support 1. In this embodiment, the adsorption mechanism may also perform horizontal movement in a direction perpendicular to the horizontal slide rail 7, so as to realize the transportation of the electronic device 100 in other directions.
The work support 1 is further provided with a transfer mechanism 6 capable of moving along the horizontal direction, specifically, the transfer mechanism 6 is slidably connected to the horizontal sliding rail 7, the transfer mechanism 6 can be located under the adsorption carrying mechanism 5 and used for conveying the electronic device 100, the transfer mechanism 6 can comprise a carrying platform used for carrying the electronic device 100 and a plurality of suction nozzles arranged on the carrying platform, and the suction nozzles are used for adsorbing the electronic device 100 and prevent the electronic device 100 from being displaced in the conveying process.
In the present embodiment, the electronic device transferring and storing apparatus transfers and stores the electronic device 100 to the caching mechanism 2 as follows:
1. the transfer mechanism 6 conveys the electronic device 100 of the previous process to the lower part of the adsorption mechanism, and the adsorption mechanism moves downwards and adsorbs the electronic device 100 placed on the transfer mechanism 6;
2. the carrying mechanism 3 moves to below the adsorbing mechanism, and the adsorbing mechanism places the electronic device 100 on the carrying mechanism 3;
3. the carrying mechanism 3 moves toward the buffer mechanism 2 to place the electronic device 100 on a buffer layer preset by the buffer mechanism 2.
The embodiment also provides a production line, which comprises the electronic device transferring and storing device, and the production line in the embodiment can realize automatic transferring and storing of the electronic device 100, and can be used for producing a liquid crystal display screen or other electronic products.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.

Claims (6)

1. An electronic device transfer and storage apparatus comprising a work support (1), characterized in that it further comprises:
the buffer mechanism (2) is arranged on the working support (1), and the buffer mechanism (2) comprises a plurality of buffer layers arranged along the vertical direction, wherein the buffer layers are used for storing electronic devices (100); and
A carrying mechanism (3) which is horizontally slidably provided on the work rack (1) and is used for carrying in and carrying out the electronic device (100) from the buffer layer;
the buffer mechanism (2) and/or the carrying mechanism (3) can move to a preset position along the vertical direction, and the buffer mechanism is used for placing the electronic device (100) in the buffer layer at the preset position;
the working support (1) is provided with a vertical driving mechanism (4), and the vertical driving mechanism (4) is connected with the buffer mechanism (2) and is used for driving the buffer mechanism (2) to move along the vertical direction;
the buffer mechanism (2) further comprises a connecting plate, the connecting plate is connected with the vertical driving mechanism (4), and a plurality of buffer layers are arranged on the connecting plate;
the connecting plates comprise a first connecting plate (21) and a second connecting plate (22) which are arranged at intervals, the cache layer comprises a first cache layer (23) and a second cache layer (24), the first cache layer (23) is connected with the first connecting plate (21), and the second cache layer (24) is connected with the second connecting plate (22); a gap is formed between the first buffer layer (23) and the second buffer layer (24), and the carrying mechanism (3) can be positioned in the gap between the first buffer layer (23) and the second buffer layer (24);
still be provided with on the work support (1) and follow absorption transport mechanism (5) of vertical direction motion, transport mechanism (3) can be located absorption transport mechanism (5) under, absorption transport mechanism (5) are used for absorption and transport electron device (100).
2. The electronic device transfer and storage apparatus of claim 1 wherein said first buffer layer (23) and said second buffer layer (24) each comprise a plurality of first holders (241) arranged in parallel and spaced apart relation;
the carrying mechanism (3) comprises a plurality of second supports (31) which are parallel and are arranged at intervals, wherein the second supports (31) are used for bearing the electronic devices (100) and can be positioned between two adjacent first supports (241).
3. The electronic device transfer and storage apparatus according to claim 1, wherein an inductor (25) is provided on the connection board, the inductor (25) being configured to detect whether the upper end of the buffer mechanism (2) is level.
4. The electronic device relay and storage arrangement according to claim 1, characterized in that one end of the buffer layer is provided with a first buffer zone (26), the first buffer zone (26) being adapted to carry flexible components of the electronic device (100).
5. The electronic device transfer and storage apparatus of claim 4, wherein the handling mechanism (3) comprises a second buffer (32) for carrying flexible components of the electronic device (100).
6. The electronic device transfer and storage apparatus according to claim 1, wherein the work rack (1) is further provided with a transfer mechanism (6) capable of moving in a horizontal direction, the transfer mechanism (6) being capable of being located directly under the suction handling mechanism (5) and being used for conveying the electronic device (100).
CN201810940397.0A 2018-08-17 2018-08-17 Transfer and storage equipment for electronic device Active CN108945812B (en)

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Application Number Priority Date Filing Date Title
CN201810940397.0A CN108945812B (en) 2018-08-17 2018-08-17 Transfer and storage equipment for electronic device

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Application Number Priority Date Filing Date Title
CN201810940397.0A CN108945812B (en) 2018-08-17 2018-08-17 Transfer and storage equipment for electronic device

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CN108945812A CN108945812A (en) 2018-12-07
CN108945812B true CN108945812B (en) 2024-04-16

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112672548A (en) * 2020-12-25 2021-04-16 深圳市智晟威自动化科技有限公司 Large-scale cooling buffer memory machine

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CN108217191A (en) * 2017-12-25 2018-06-29 通彩智能科技集团有限公司 A kind of liquid crystal display panel is carried and buffer memory device
CN208761286U (en) * 2018-08-17 2019-04-19 苏州精濑光电有限公司 A kind of electronic device transfer and storage facilities

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Publication number Priority date Publication date Assignee Title
JP2008230846A (en) * 2007-03-23 2008-10-02 Fuji Mach Co Ltd Article supply device
EP1980508A1 (en) * 2007-04-11 2008-10-15 Mats Boman Aktiebolag Vertical buffer store for a conveyor
EP3243769A1 (en) * 2016-05-14 2017-11-15 Jörg Föller Method and storage device for storing piece goods with bridgeable shelf rows
CN206345303U (en) * 2016-12-14 2017-07-21 大族激光科技产业集团股份有限公司 Automatic stereowarehouse
CN108217191A (en) * 2017-12-25 2018-06-29 通彩智能科技集团有限公司 A kind of liquid crystal display panel is carried and buffer memory device
CN208761286U (en) * 2018-08-17 2019-04-19 苏州精濑光电有限公司 A kind of electronic device transfer and storage facilities

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