CN104113992A - Double-sided flexible circuit board possessing shielding structure and method for manufacturing same - Google Patents
Double-sided flexible circuit board possessing shielding structure and method for manufacturing same Download PDFInfo
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- CN104113992A CN104113992A CN201310130581.6A CN201310130581A CN104113992A CN 104113992 A CN104113992 A CN 104113992A CN 201310130581 A CN201310130581 A CN 201310130581A CN 104113992 A CN104113992 A CN 104113992A
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- layer
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- flex circuit
- conductive adhesive
- sided flex
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A method for manufacturing a double-sided flexible circuit board possessing an electromagnetic shielding structure comprises the steps of providing a double-sided flexible circuit board substrate, wherein the double-sided flexible circuit board substrate comprises a basement layer, a line layer, an adhesive layer and an insulating covering layer which are laminated orderly, and an opening of penetrating the insulating covering layer and the adhesive layer is arranged at one side of the insulating covering layer of the double-sided flexible circuit board substrate to expose the line layer; providing a conductive fabric structural layer, wherein the conductive fabric structural layer comprises a conductive adhering layer, a metal film layer and an insulating layer which are laminated orderly, and is laminated on the double-sided flexible circuit board substrate, so that the conductive adhering layer is adhered on the insulating covering layer, and the opening is filled by the material of the conductive adhering layer; making a hole on the insulating layer of the conductive fabric structural layer to expose the metal film layer and form the double-sided flexible circuit board possessing the electromagnetic shielding structure. The present invention also provides a double-sided flexible circuit board possessing the electromagnetic shielding structure.
Description
Technical field
The present invention relates to a kind of double-sided flex circuit board manufacturing method, relate in particular to a kind of double-sided flex circuit plate with shielding construction and preparation method thereof.
Background technology
Along with developing rapidly of electronic technology, present electronic equipment has been widely used in human lives's every field.The extensive use of electronic equipment and development, relatively derivative problem is the electromagnetic interference that produces of these electronic equipments and suppresses the discussion from the non-interference problem producing itself.
Double-sided flex circuit panel products, for ensureing that signal is not subject to external interference, can increase design of Electromagnetic Shielding conventionally, and along with improving constantly of customer requirement, this type of design of Electromagnetic Shielding is also more and more.Conventional a kind of design that increases double-sided flex circuit plate effectiveness is that the insulating barrier that utilizes the conducting particles of shielding construction to penetrate conductive cloth structure is electrically connected with metal film layer at present, thereby static residual in the conductive adhesive of conductive cloth structure layer or conductive adhesive layer is effectively exported to the metal shell of shielding construction and eliminates.But the conducting particles in the conducting resinl in this technical scheme need have the function that can sting saturating insulating barrier, this kind of conducting resinl material only provided by several suppliers at present, and expensive, makes the conducting particles of conducting resinl sting the operating condition harshness of insulating barrier.
Summary of the invention
The invention provides lower double-sided flex circuit plate with shielding construction of a kind of cost and preparation method thereof.
A kind of manufacture method of the double-sided flex circuit plate with electromagnetic armouring structure, comprise step: provide double-sided flex circuit base board, described double-sided flex circuit base board comprises the basalis, line layer, glue-line and the insulating cover that are cascading, insulating cover one side of described double-sided flex circuit base board has the opening that runs through described insulating cover and glue-line, exposes described line layer; Conductive cloth structure layer is provided, described conductive cloth structure layer comprises the conductive adhesive, metal film layer and the insulating barrier that are cascading, and described conductive cloth structure layer is pressed on to described double-sided flex circuit base board, make described conductive adhesive be adhered to described insulating cover and make the material of conductive adhesive fill described opening; On the insulating barrier of described conductive cloth structure layer, produce perforate, to expose described metal film layer, form the double-sided flex circuit plate with electromagnetic armouring structure.
A kind of double-sided flex circuit plate, it comprises: double-sided flex circuit base board and conductive cloth structure layer, described double-sided flex circuit base board comprises the basalis, line layer, glue-line, the insulating cover that are cascading, described double-sided flex circuit base board has the opening that runs through described insulating cover and glue-line, so that described line layer is exposed to described opening; Described conductive cloth structure layer comprises the conductive adhesive, metal film layer and the insulating barrier that are cascading, the material that described conductive adhesive is adhered to described insulating cover and described conductive adhesive is full of described opening, described insulating barrier offers perforate, so that described metal film layer is exposed to described perforate.
With respect to prior art, the present embodiment adopts on the insulating barrier of laser pit technology on conductive cloth structure layer and makes perforate, in the time that metal shell is set, only need coated with conductive glue in surface of insulating layer and be filled in described perforate, make the conducting resinl of described conductive cloth structure layer by being filled in described perforate directly with metal shell electric connection, and do not need the insulating barrier piercing through in conductive cloth structure layer by conducting particles to realize the electric connection between conductive cloth structure layer and metal shell, thereby avoid being subject in process of production the restriction of several suppliers' certain material, also reduced cost of manufacture simultaneously.The double-sided flex circuit plate of the present embodiment can be used for making rigid-flexible combined circuit plate.
Brief description of the drawings
Fig. 1 is the generalized section of the double-sided flex circuit base board that provides of the embodiment of the present invention.
Fig. 2 is the generalized section that conductive cloth structure layer is pressed on to the double-sided flex circuit base board shown in Fig. 1.
Fig. 3 be in Fig. 2 in conductive cloth structure layer insulating barrier part produce the generalized section of perforate.
Fig. 4 is the generalized section that conductive adhesive layer is coated on to insulating barrier in Fig. 3.
Fig. 5 is the generalized section that the metal shell of Fig. 4 is pressed on to the conductive adhesive layer in Fig. 4.
Main element symbol description
| Double-sided flex circuit plate | 100 |
| Circuit board substrate | 110 |
| Basalis | 111 |
| Line layer | 112 |
| Glue-line | 113 |
| Insulating cover | 114 |
| Opening | 116 |
| Conductive cloth structure layer | 120 |
| Conductive adhesive | 121 |
| Colloid layer | 1211、1311 |
| Metal film layer | 122 |
| Insulating barrier | 123 |
| Perforate | 124 |
| Conductive adhesive layer | 131 |
| Metal shell | 132 |
| Conducting particles | 150、151 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 to Fig. 5, the embodiment of the present invention provides a kind of manufacture method of the double-sided flex circuit plate with shielding construction, comprises the following steps:
The first step, refers to Fig. 1, and double-sided flex circuit base board 110 is provided, and described double-sided flex circuit base board 110 surfaces have opening 116.
Described double-sided flex circuit base board 110 comprises the basalis 111, line layer 112, glue-line 113 and the insulating cover 114 that are cascading, described line layer 112 is formed at described basalis 111 surfaces, described glue-line 113 is coated on described line layer 112, described insulating cover 114 is pressed on described glue-line 113, and described glue-line 113 is for described line layer 112 and the described insulating cover 114 of boning.Described insulating cover 114 can be polyimide film layer.One side surface of the insulating cover 114 of described double-sided flex circuit base board 110 has opening 116, and described opening 116 runs through described insulating cover 114 and glue-line 113, and does not run through described line layer 112, to expose described line layer 112.Described line layer 112 can adopt the technique of selective etch copper foil layer to complete.
Described line layer 112 comprises earthing circuit layer, and in the present embodiment, described opening 116 exposed portions serve are earthing circuit layer.
Second step, refers to Fig. 2, and conductive cloth structure layer 120 is provided, and described conductive cloth structure layer 120 is pressed on to described double-sided flex circuit base board 110.
Described conductive cloth structure layer 120 comprises the conductive adhesive 121, metal film layer 122 and the insulating barrier 123 that stack gradually, described metal film layer 122 described conductive adhesive 121 and shown between insulating barrier 123.In the present embodiment, described conductive adhesive 121 comprises colloid layer 1211 and is scattered in the multiple conducting particless 150 in described colloid layer 1211, and described conductive adhesive 121 is pressed on the insulating cover 114 of described double-sided flex circuit base board 110, the described conductive adhesive 121 of part is filled in described opening 116.The relative both sides of in described conducting particles 150 one or multiple conducting particless 150 of once contacting contact with described metal film layer 122 and described line layer 112 respectively, thereby metal film layer 122 and described line layer 112 are conducted.In the present embodiment, the material of described insulating barrier can be polyester fiber.Described conducting particles 150 can be nickel particles, the plastic particles of plating nickel on surface or the plastic particles of surface gold-plating of gold particle, nickel particles, surface gold-plating.
The 3rd step, refers to Fig. 3, adopts the method for laser pit to produce perforate 124 on the surface of described conductive cloth structure layer 120.
In the present embodiment, on insulating barrier 123 in described conductive cloth structure layer 120, make described perforate 124, described perforate 124 runs through described insulating barrier 123 to expose described metal film layer 122, described metal film layer 122 plays shielding action, forms the double-sided flex circuit plate 100 with electromagnetic armouring structure.
In the use procedure of double-sided flex circuit plate 100 with shielding construction, for making ground connection convenient, also comprise the steps:
The 4th step, refers to Fig. 4, conductive adhesive layer 131 is coated on to the perforate 124 of insulating barrier 123 described in described insulating barrier 123 surfaces filling, and described conductive adhesive layer 131 comprises colloid layer 1311 and is scattered in the multiple conducting particless 151 in described colloid layer 1311.
Multiple conducting particless 151 in described colloid layer 1311 can be nickel particles, the plastic particles of plating nickel on surface or the plastic particles of surface gold-plating of gold particle, nickel particles, surface gold-plating.
The 5th step, refers to Fig. 5, and a metal shell 132 is provided, and described metal shell 132 is formed to described conductive adhesive layer 131.
Described metal shell 132 is adhered to described insulating barrier 123 surfaces by described conductive adhesive layer 131, the relative both sides of in described conducting particles 151 one or multiple conducting particless 151 of contacting successively contact with described metal shell 132 with described metal film layer 122 respectively, thereby described metal film layer 122 is conducted with described metal shell 132.The material of described metal shell 132 can be selected from any in gold, silver, copper, aluminium, nickel, or is selected from the alloy of any two or more metals in gold, silver, copper, nickel.
Described metal shell 132 conducts with described line layer 112 by the conducting particles 150 of the conducting particles 151 in conductive adhesive layer 131, metal film layer 122 and conductive adhesive 121, thereby residual electric charge in described line layer 112 can be exported to outermost metal shell 132, described in when use, metal shell 132 is generally ground connection so that electric charge is derived, thereby eliminates static.In the present invention, can carry out ground connection at any place of metal shell 132, to increase effectiveness.
In the present embodiment, described conductive cloth structure layer 120 is only arranged at a wherein side of double-sided flex circuit base board 110.
Refer to Fig. 5, the double-sided flex circuit plate 100 of the present embodiment comprises double-sided flex circuit base board 110, is arranged at the conductive cloth structure layer 120 on described double-sided flex circuit base board 110 surfaces.Described double-sided flex circuit base board 110 comprises the basalis 111, line layer 112, glue-line 113 and the insulating cover 114 that are cascading, described line layer 112 is formed at described basalis 111 surfaces, described insulating cover 114 is bonded in described line layer 112 by described glue-line 113, described double-sided flex circuit base board 110 has the opening 116 that runs through described insulating cover 114 and glue-line 113, and the earthing circuit layer of described line layer 112 is exposed to described opening 116.Described opening 116 runs through described insulating cover 114 and glue-line 113.Described conductive cloth structure layer 120 comprises the conductive adhesive 121, metal film layer 122 and the insulating barrier 123 that stack gradually, described conductive adhesive 121 is mutually bonding with described insulating cover 114, and the material of described conductive adhesive 121 is full of described opening 116.Described conductive adhesive 121 comprises colloid layer 1211 and is scattered in the multiple conducting particless 150 in described colloid layer 1211, the relative both sides of in described conducting particles 150 one or multiple conducting particless 150 of once contacting contact with the earthing circuit layer of described metal film layer 122 and described line layer 112 respectively, thereby described metal film layer 122 and the earthing circuit layer of described line layer 112 are conducted.Described insulating barrier 123 offers perforate 124, to expose described metal film layer 122.Described conductive adhesive layer 131 comprises colloid layer 1311 and is scattered in the multiple conducting particless 151 in described colloid layer 1311, and described conductive adhesive layer 131 is adhered to described insulating barrier 123 surfaces, and the material of described conductive adhesive layer 131 is full of described perforate 124.Described metal shell 132 is formed at described conductive adhesive layer 131, described metal shell 132 is adhered to described insulating barrier 123 surfaces by described conductive adhesive layer 131, the relative both sides of in described conducting particles 151 one or multiple conducting particless 151 of contacting successively contact with described metal shell 132 with described metal film layer 122 respectively, thereby described metal film layer 122 is conducted with described metal shell 132.
The present invention adopts laser pit technology to make perforate 124 on the insulating barrier 123 of conductive cloth structure layer 120, applying colloid layer 1311 is directly electrically connected described conductive cloth structure layer 120 again with described metal shell 132, and do not need the insulating barrier 123 piercing through in conductive cloth structure layer 120 by conducting particles 151 to realize the electric connection between conductive cloth structure layer 120 and metal shell 132, thereby avoid being subject in process of production the restriction of certain certain material, also reduced cost of manufacture simultaneously.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (9)
1. a manufacture method with the double-sided flex circuit plate of electromagnetic armouring structure, comprises step:
Double-sided flex circuit base board is provided, described double-sided flex circuit base board comprises the basalis, line layer, glue-line and the insulating cover that are cascading, insulating cover one side of described double-sided flex circuit base board has the opening that runs through described insulating cover and glue-line, exposes described line layer;
Conductive cloth structure layer is provided, described conductive cloth structure layer comprises the conductive adhesive, metal film layer and the insulating barrier that are cascading, and described conductive cloth structure layer is pressed on to described double-sided flex circuit base board, make described conductive adhesive be adhered to described insulating cover and make the material of conductive adhesive fill described opening; And
On the insulating barrier of described conductive cloth structure layer, produce perforate, to expose described metal film layer, form the double-sided flex circuit plate with electromagnetic armouring structure.
2. the manufacture method of double-sided flex circuit plate as claimed in claim 1, it is characterized in that, also comprise described in a conductive adhesive layer and a metal shell are formed at successively and having on the insulating barrier of double-sided flex circuit plate of electromagnetic armouring structure, make the material of described conductive adhesive layer fill described perforate, and make the bonding described metal shell of described conductive adhesive layer and insulating barrier.
3. the manufacture method of double-sided flex circuit plate as claimed in claim 1, is characterized in that, described line layer is formed at described basalis surface, described glue-line bond described line layer and described insulating cover.
4. the manufacture method of double-sided flex circuit plate as claimed in claim 1, is characterized in that, the line layer that is exposed to described opening is earthing circuit layer.
5. a double-sided flex circuit plate, it comprises:
Double-sided flex circuit base board, described double-sided flex circuit base board comprises the basalis, line layer, glue-line, the insulating cover that are cascading, described double-sided flex circuit base board has the opening that runs through described insulating cover and glue-line, so that described line layer is exposed to described opening; And
Conductive cloth structure layer, described conductive cloth structure layer comprises the conductive adhesive, metal film layer and the insulating barrier that are cascading, the material that described conductive adhesive is adhered to described insulating cover and described conductive adhesive is full of described opening, described insulating barrier offers perforate, so that described metal film layer is exposed to described perforate.
6. double-sided flex circuit plate as claimed in claim 5, it is characterized in that, described conducting resinl adhesive layer comprises colloid layer and is scattered in the conducting particles in described colloid layer, the relative both sides of in described conducting particles one or multiple conducting particless of contacting successively contact with described metal film layer and line layer respectively, thereby described metal film layer and described line layer are conducted.
7. double-sided flex circuit plate as claimed in claim 5, it is characterized in that, described double-sided flex circuit plate also comprises a conductive adhesive layer and metal shell, described conductive adhesive layer is adhered to the described surface of insulating layer of described conductive cloth structure layer, the material of described conductive adhesive layer is full of described perforate, described metal shell is formed at described conductive adhesive layer, and described metal shell is adhered to described surface of insulating layer by described conductive adhesive layer.
8. double-sided flex circuit plate as claimed in claim 7, it is characterized in that, described conductive adhesive layer comprises colloid layer and is scattered in the multiple conducting particless in described colloid layer, the relative both sides of in described conducting particles one or multiple conducting particless of contacting successively contact with described metal shell with described metal film layer respectively, thereby described metal film layer and described metal shell are conducted.
9. double-sided flex circuit plate as claimed in claim 7, is characterized in that, the line layer that is exposed to described opening is earthing circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310130581.6A CN104113992A (en) | 2013-04-16 | 2013-04-16 | Double-sided flexible circuit board possessing shielding structure and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310130581.6A CN104113992A (en) | 2013-04-16 | 2013-04-16 | Double-sided flexible circuit board possessing shielding structure and method for manufacturing same |
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| Publication Number | Publication Date |
|---|---|
| CN104113992A true CN104113992A (en) | 2014-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310130581.6A Pending CN104113992A (en) | 2013-04-16 | 2013-04-16 | Double-sided flexible circuit board possessing shielding structure and method for manufacturing same |
Country Status (1)
| Country | Link |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407631A (en) * | 2015-12-29 | 2016-03-16 | 广东欧珀移动通信有限公司 | Flexible circuit board laminated structure and mobile terminal |
| CN110087389A (en) * | 2019-04-29 | 2019-08-02 | 维沃移动通信有限公司 | The preparation method of circuit board, electronic equipment and circuit board |
| CN110493949A (en) * | 2019-08-08 | 2019-11-22 | 上海创功通讯技术有限公司 | Flexible circuit board and preparation method thereof, electronic equipment |
| CN111526706A (en) * | 2020-04-20 | 2020-08-11 | 京东方科技集团股份有限公司 | Conductive cloth, electronic component and display device |
-
2013
- 2013-04-16 CN CN201310130581.6A patent/CN104113992A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407631A (en) * | 2015-12-29 | 2016-03-16 | 广东欧珀移动通信有限公司 | Flexible circuit board laminated structure and mobile terminal |
| CN110087389A (en) * | 2019-04-29 | 2019-08-02 | 维沃移动通信有限公司 | The preparation method of circuit board, electronic equipment and circuit board |
| CN110493949A (en) * | 2019-08-08 | 2019-11-22 | 上海创功通讯技术有限公司 | Flexible circuit board and preparation method thereof, electronic equipment |
| CN111526706A (en) * | 2020-04-20 | 2020-08-11 | 京东方科技集团股份有限公司 | Conductive cloth, electronic component and display device |
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Effective date of registration: 20170302 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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Application publication date: 20141022 |
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| WD01 | Invention patent application deemed withdrawn after publication |