CN108922847A - 一种用于晶圆生产加工的表面研磨装置 - Google Patents
一种用于晶圆生产加工的表面研磨装置 Download PDFInfo
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- CN108922847A CN108922847A CN201811060245.8A CN201811060245A CN108922847A CN 108922847 A CN108922847 A CN 108922847A CN 201811060245 A CN201811060245 A CN 201811060245A CN 108922847 A CN108922847 A CN 108922847A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000012545 processing Methods 0.000 title claims abstract description 35
- 238000005498 polishing Methods 0.000 claims abstract description 49
- 229910001651 emery Inorganic materials 0.000 claims abstract description 38
- 238000009434 installation Methods 0.000 claims description 29
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 7
- 239000007787 solid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011049 pearl Substances 0.000 description 2
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- 230000001360 synchronised effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (8)
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CN201811060245.8A CN108922847B (zh) | 2018-09-12 | 2018-09-12 | 一种用于晶圆生产加工的表面研磨装置 |
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CN201811060245.8A CN108922847B (zh) | 2018-09-12 | 2018-09-12 | 一种用于晶圆生产加工的表面研磨装置 |
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CN108922847A true CN108922847A (zh) | 2018-11-30 |
CN108922847B CN108922847B (zh) | 2024-06-28 |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109676515A (zh) * | 2018-12-26 | 2019-04-26 | 江苏纳沛斯半导体有限公司 | 一种带清洗功能的半导体晶圆研磨装置 |
CN110394718A (zh) * | 2019-08-15 | 2019-11-01 | 永康市凌城达机械设备制造有限公司 | 一种高效率的杯体砂带抛光装置 |
CN110456261A (zh) * | 2019-07-05 | 2019-11-15 | 扬州市高升机械有限公司 | 一种适用于多品类电动工具开关防尘的测试装置 |
CN111673590A (zh) * | 2020-06-03 | 2020-09-18 | 大连富地重工机械制造有限公司 | 一种带磨削细长物料打磨装置 |
CN112589669A (zh) * | 2020-12-09 | 2021-04-02 | 苏州斯尔特微电子有限公司 | 晶圆研磨用供料机构 |
CN112676954A (zh) * | 2020-12-09 | 2021-04-20 | 苏州斯尔特微电子有限公司 | 大尺寸晶圆研磨装置 |
CN112720731A (zh) * | 2020-12-28 | 2021-04-30 | 广州依青电子商务有限公司 | 一种多功能数控木工机床 |
CN112809507A (zh) * | 2021-01-04 | 2021-05-18 | 杭州月重智能技术有限公司 | 一种智能制造的晶棒固定和打磨装置 |
CN112838045A (zh) * | 2020-12-31 | 2021-05-25 | 六安优云通信技术有限公司 | 一种芯片制备用硅晶片加工装置及加工工艺 |
CN113290406A (zh) * | 2021-06-25 | 2021-08-24 | 新昌县善力机械科技有限公司 | 一种机械传动轴加工用铣削设备及加工工艺 |
CN114952571A (zh) * | 2022-04-14 | 2022-08-30 | 深圳模微半导体有限公司 | 基于物联网的安全芯片制造管理*** |
CN115351664A (zh) * | 2022-09-02 | 2022-11-18 | 江西安芯美科技有限公司 | 一种半导体晶圆固晶装置 |
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KR200414442Y1 (ko) * | 2006-02-07 | 2006-04-20 | 박명환 | 원통형 연마석 성형용 가공장치 |
CN201856158U (zh) * | 2010-07-20 | 2011-06-08 | 中芯国际集成电路制造(上海)有限公司 | 晶圆研磨定位环以及化学机械研磨设备 |
CN102528643A (zh) * | 2010-12-30 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨设备及其研磨单元 |
CN108453602A (zh) * | 2018-05-18 | 2018-08-28 | 江苏聚泰科技有限公司 | 一种液晶显示模组表面打磨装置 |
CN108515449A (zh) * | 2018-04-11 | 2018-09-11 | 王丽 | 一种用于光纤加工的光纤研磨机 |
CN209000866U (zh) * | 2018-09-12 | 2019-06-18 | 江苏英锐半导体有限公司 | 一种用于晶圆生产加工的表面研磨装置 |
-
2018
- 2018-09-12 CN CN201811060245.8A patent/CN108922847B/zh active Active
Patent Citations (6)
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KR200414442Y1 (ko) * | 2006-02-07 | 2006-04-20 | 박명환 | 원통형 연마석 성형용 가공장치 |
CN201856158U (zh) * | 2010-07-20 | 2011-06-08 | 中芯国际集成电路制造(上海)有限公司 | 晶圆研磨定位环以及化学机械研磨设备 |
CN102528643A (zh) * | 2010-12-30 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨设备及其研磨单元 |
CN108515449A (zh) * | 2018-04-11 | 2018-09-11 | 王丽 | 一种用于光纤加工的光纤研磨机 |
CN108453602A (zh) * | 2018-05-18 | 2018-08-28 | 江苏聚泰科技有限公司 | 一种液晶显示模组表面打磨装置 |
CN209000866U (zh) * | 2018-09-12 | 2019-06-18 | 江苏英锐半导体有限公司 | 一种用于晶圆生产加工的表面研磨装置 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109676515B (zh) * | 2018-12-26 | 2020-09-11 | 江苏纳沛斯半导体有限公司 | 一种带清洗功能的半导体晶圆研磨装置 |
CN109676515A (zh) * | 2018-12-26 | 2019-04-26 | 江苏纳沛斯半导体有限公司 | 一种带清洗功能的半导体晶圆研磨装置 |
CN110456261A (zh) * | 2019-07-05 | 2019-11-15 | 扬州市高升机械有限公司 | 一种适用于多品类电动工具开关防尘的测试装置 |
CN110394718A (zh) * | 2019-08-15 | 2019-11-01 | 永康市凌城达机械设备制造有限公司 | 一种高效率的杯体砂带抛光装置 |
CN110394718B (zh) * | 2019-08-15 | 2024-06-04 | 南京源之耀智能科技有限公司 | 一种高效率的杯体砂带抛光装置 |
CN111673590A (zh) * | 2020-06-03 | 2020-09-18 | 大连富地重工机械制造有限公司 | 一种带磨削细长物料打磨装置 |
CN112589669A (zh) * | 2020-12-09 | 2021-04-02 | 苏州斯尔特微电子有限公司 | 晶圆研磨用供料机构 |
CN112676954A (zh) * | 2020-12-09 | 2021-04-20 | 苏州斯尔特微电子有限公司 | 大尺寸晶圆研磨装置 |
CN112720731B (zh) * | 2020-12-28 | 2022-08-16 | 江门市吉思美家具有限公司 | 一种多功能数控木工机床 |
CN112720731A (zh) * | 2020-12-28 | 2021-04-30 | 广州依青电子商务有限公司 | 一种多功能数控木工机床 |
CN112838045A (zh) * | 2020-12-31 | 2021-05-25 | 六安优云通信技术有限公司 | 一种芯片制备用硅晶片加工装置及加工工艺 |
CN112809507A (zh) * | 2021-01-04 | 2021-05-18 | 杭州月重智能技术有限公司 | 一种智能制造的晶棒固定和打磨装置 |
CN113290406A (zh) * | 2021-06-25 | 2021-08-24 | 新昌县善力机械科技有限公司 | 一种机械传动轴加工用铣削设备及加工工艺 |
CN114952571A (zh) * | 2022-04-14 | 2022-08-30 | 深圳模微半导体有限公司 | 基于物联网的安全芯片制造管理*** |
CN114952571B (zh) * | 2022-04-14 | 2023-11-10 | 深圳模微半导体有限公司 | 基于物联网的安全芯片制造管理*** |
CN115351664A (zh) * | 2022-09-02 | 2022-11-18 | 江西安芯美科技有限公司 | 一种半导体晶圆固晶装置 |
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Effective date of registration: 20240331 Address after: 230000 No.3 Feixi Road, Shushan District, Hefei City, Anhui Province Applicant after: Zhao Mengya Country or region after: China Address before: 224002 No. 3 Standard Plant, No. 1, Middle New York Road, Comprehensive Bonded Zone, Yancheng Economic and Technological Development Zone, Jiangsu Province Applicant before: JIANGSU YINGRUI SEMICONDUCTOR Co.,Ltd. Country or region before: China |
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Effective date of registration: 20240531 Address after: 321000 China (Zhejiang) Pilot Free Trade Zone, Jinhua City, Zhejiang Province, China (Zhejiang) 6th Floor, Building 10, Gaochuangyuan, No. 300 Yangcun Road, Choujiang Street, Yiwu City, Jinhua City (self declaration) Applicant after: Zhejiang Yaochuang Technology Co.,Ltd. Country or region after: China Address before: 230000 No.3 Feixi Road, Shushan District, Hefei City, Anhui Province Applicant before: Zhao Mengya Country or region before: China |
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