CN108883866A - Film roll package body and its manufacturing method - Google Patents

Abstract

In the case where making sealing film (1) circulate in the form of film roll (10), it is substantially reduced the amount of moisture invaded into the resin composition layer of sealing film (1).A kind of film roll package body (20), it is the package body (20) that the sealing film (1) for the resin composition layer containing hygroscopic fillers for having supporting mass and being set on supporting mass is wound in film roll (10) obtained by core (2), wherein, to be the film roll (10) formed the film roll package body (20) with packaging material (12) sealed package of the state moisture resistance covered by hygroscopic film (11).

Description

Film roll package body and its manufacturing method

Technical field

The present invention relates to the film roll package bodies and its manufacturing method of sealing film.

Background technique

Organic EL (electroluminescent, Electroluminescence) element is luminescent material shining using organic substance Element can obtain shining for high brightness at low voltage, therefore be attracted attention in recent years.However, organic EL element is in the presence of as follows Problem：Very weak to the tolerance of moisture, luminescent material (luminescent layer) is denaturalized because of moisture, brightness is caused to decline, can not shine, The interface of electrode and luminescent layer is removed because of the influence of moisture or metal aoxidizes and resistance is got higher.Therefore, in order to will be in element Moisture barrier in portion and extraneous gas, such as carry out following item：The sealant of resin combination is formed by cover shape Carry out sealing organic el element at the whole face in the luminescent layer on substrate.

As disclosed in such resin combination, such as patent document 1 containing polyisobutylene resin, have can be with ring The polyisoprene resin of the functional group of oxygroup reaction and/or the resin of polyisobutylene resin, tackifying resin and epoxy resin Composition.In addition, disclosing the resin combination containing styreneisobutylene modified resin and tackifying resin in patent document 2. In addition, hygroscopic fillers are mixed in resin combination sometimes in order to improve the moisture-proof of sealant.

From the point of view of the viewpoints such as productivity, using such resin combination organic EL element sealing sometimes through propping up It holds and is formed with the sealing film of resin composition layer on body to carry out.In addition, sealing film as industrialized production In the case of, the area of place of retention can be reduced, and advantageous to operability when transporting etc., so mostly in resin combination The surface overlapping protection film of layer and the production of web-like form, the circulation that sealing film is wound in core.

For such film roll, circulate in transport and preservation etc. the stage, in order to protect it from the moisture in atmosphere It influences, is generally packaged in the packaging materials of moisture resistancees such as the high aluminium bag of moisture resistance and circulates.

Existing technical literature

Patent document

Patent document 1：International Publication No. 2011/62167

Patent document 2：International Publication No. 2013/108731.

Summary of the invention

The technical problems to be solved by the invention

But according to the present invention known to people, especially for the sealing with the resin composition layer containing hygroscopic fillers with thin Film, only by being rolled up with moisture resistance packaging material packing film, to intrusion of the moisture into the resin composition layer of sealing film Inhibition may not be abundant.In addition, the hygroscopicity of the resin composition layer containing hygroscopic fillers is high, thus sometimes from thin film fabrication to The moisture invaded in resin combination during packaging becomes project.For example, to the very weak organic EL element of the tolerance of moisture Sealing in, find the tendency that the component life of organic EL element declines because invading the moisture in resin combination.The class It inscribes particularly significant in the case where resin composition layer uses the resin combination of pressure-sensitive adhesive.In addition, in order to improve packaging The moisture resistance of body, it is also contemplated that it is packaged in moisture resistance packaging material in desiccant such as film roll circumferential arrangement silica-gel desiccants, Deliver circulation.However, in this case, the countermeasure as the moisture in the resin composition layer of reply intrusion sealing film not yet Must be abundant, and the desiccant in circulation is pressed against film roll surface, thus it some times happens that the feelings such as film roll surface indentation Condition destroys commodity value due to trace that desiccant leaves.

Invention that the present invention has been made in view of the above-described circumstances, the project to be solved (technical problem) is, provides In the case where so that sealing film is circulated in the form of film roll, it can be substantially reduced into the resin composition layer of sealing film The package body and its manufacturing method of the film roll of the amount of moisture of intrusion.

Technical scheme applied to solve the technical problem

After the present inventor studies in order to solve above-mentioned problem and conscientiously, as a result, it has been found that, by by the film roll of sealing film It is accommodated in the packaging material of moisture resistance with the state covered by hygroscopic film, the above subject can be solved.Based on the opinion The present invention it is as follows.

[1] a kind of film roll package body, it is that will have supporting mass and be set on the supporting mass to contain hygroscopic fillers The sealing film of resin composition layer be wound in the package body of film roll obtained by core, wherein the film coil packing Body is the film roll to be formed with the packaging material sealed package of the state moisture resistance covered by hygroscopic film；

[2] the film roll package body according to above-mentioned [1], wherein sealing film, which also has, to be set to containing hygroscopic fillers Resin composition layer with the protective film of the opposite side in bearing side；

[3] the film roll package body according to above-mentioned [1], wherein film roll is also to be wound with buffering in the outside of film roll The film roll with padded coaming of material；

[4] the film roll package body according to any one of above-mentioned [1]~[3], wherein film roll is in sealing film Outside is wound with the dust-proof film roll with dust-proof film with film, alternatively, being the buffering in the film roll with padded coaming The outside of material is also wound with the dust-proof film roll with padded coaming and dust-proof film with film；

[5] the film roll package body according to any one of above-mentioned [1]~[4], wherein core be it is hollow, in core Portion is configured with desiccant；

[6] the film roll package body according to any one of above-mentioned [1]~[5], wherein hygroscopic film is according to 25 DEG C, hygroscopic capacity obtained from the weight change of 1 week front and back is placed in the environment of relative humidity 60%RH is 1g/m²Above film；

[7] the film roll package body according to any one of above-mentioned [1]~[6], wherein hygroscopic film is that have to gather to benzene Naphthalate layer/moisture absorption layer/polyethylene terephthalate layer laminated construction film；

[8] the film roll package body according to any one of above-mentioned [1]~[7], wherein sealing film is filled out containing hygroscopicity The resin composition layer of material is the resin composition layer comprising olefine kind resin, tackifier and hygroscopic fillers；

[9] the film roll package body according to any one of above-mentioned [1]~[8], wherein the supporting mass of sealing film is anti- Moist film；

[10] the film roll package body according to any one of above-mentioned [1]~[9], wherein sealing film is used for organic EL The sealing of element；

[11] a kind of manufacturing method of film roll package body, wherein have：

First step will be with supporting mass and the resin combination containing hygroscopic fillers being set on the supporting mass in the process The sealing film of nitride layer is wound in core and film roll is made；

In the process, which is covered with hygroscopic film for the second step；And

In the process, the film covered with the hygroscopic film is rolled into the packaging material of moisture resistance for the third step, and will Packaging material sealing；

[12] method according to above-mentioned [11], wherein first step is Jin Erjuan after winding sealing film in core Around padded coaming, alternatively, sequentially winding padded coaming and dust-proof film, the process that film roll is made in turn；

[13] method according to above-mentioned [11] or [12], wherein sealing film is used for the sealing of organic EL element.

The effect of invention

If using the present invention, can be substantially reduced in the process of circulation of sealing film to the resin group containing hygroscopic fillers Close the amount of moisture invaded in nitride layer.

The simple declaration of attached drawing

Fig. 1 is the schematic cross sectional views using the film roll package body of an embodiment of the invention；

Fig. 2 is the schematic cross sectional views of the film roll package body of reference example 1；

Fig. 3 is the schematic cross sectional views of the film roll package body of comparative example 1.

Specific embodiment

Hereinafter, the present invention is described in detail.

Fig. 1 is the figure for schematically showing the section of the film roll package body using an embodiment of the invention.

Film roll package body of the invention is characterized mainly in that sealing film 1 is wound in core 2 as shown in described Fig. 1 Obtained by film roll 10 be incorporated in the packaging material 12 of moisture resistance with the state covered by hygroscopic film 11.

Here, the resin combination containing hygroscopic fillers that sealing film has supporting mass and is set on supporting mass Layer.For sealing film, come from the viewpoint for inhibiting foreign matter attachment and moisture to invade the resin composition layer to sealing It sees, it is generally desirable to, the side opposite with bearing side of the resin composition layer containing hygroscopic fillers is covered by protective film.Figure Sealing film 1 shown in 1 be have successively lamination supporting mass, the resin composition layer containing hygroscopic fillers, protective film and At structure sealing film.

Film roll package body 20 shown in FIG. 1 is one of the preferred configuration of film roll package body of the invention, film roll 10 It is also to be wound with padded coaming 3 in the outside of sealing film 1, is also wound in the outside of padded coaming 3 dust-proof with film 4 With padded coaming and the dust-proof film roll with film.

In the present invention, the basic structure of film roll 10 is that sealing film 1 is wound in core 2, be can be in core 2 On be only wound with sealing film 1 film roll, the outside of sealing film 1 be only also wound with padded coaming 3 band buffering The film roll of material or the dust-proof film with dust-proof film with film 4 is only also wound in the outside of sealing film 1 Volume.

If it is film roll package body of the invention, then passes through the effect of hygroscopic film 11, can sufficiently inhibit circulating The amount of moisture invaded in process etc. into the resin composition layer containing hygroscopic fillers of sealing film 1.Therefore, by will be thin Film roll is taken out from package body, carries out the sealing such as organic EL element with the sealing film 1 of uncoiling, can make organic EL element Component life sufficiently improve.

Further, since film roll 10 has padded coaming 3, it can prevent or alleviate in the process of circulation of film roll package body Sealing film 1 is caused to impact, so the reliability of sealing film 1 can be maintained with higher level.

In addition, Fig. 1 describes the whole face and the closely sealed state of hygroscopic film 11 of the film roll 10 comprising core 2, but can be Gap is formed between film roll 10 and hygroscopic film 11.That is, surrounding 10 entirety of film roll with hygroscopic film 11, make film roll Do not expose 10 outer surface.

< film roll >

Film roll 10 includes core 2 and the sealing film 1 for being wound in the core 2.

[core]

Core 2 becomes the core of winding sealing film 1, has the function of to prevent wound sealing film 1 from generating fold etc..

It as the material of core 2, is not particularly limited, paper, timber, metal, resin, fiber-reinforced resin etc. can be enumerated.This A little materials can be used one kind or two or more.Wherein, from the point of view of the viewpoints such as light weight, deformation resistance, price, preferably resin, fiber Reinforced resin.As resin, polyethylene, polypropylene, vinyl chloride, ABS resin, epoxy resin, polyester resin, butadiene can be enumerated Rubber, polyimide resin, polyamide, polyamide-imide resin, acrylic resin, vinyl chloride, gathers partially polystyrene Vinyl chloride, polyurethane resin etc..As the specific example for the resin for constituting fiber-reinforced resin, these exemplary trees can also be enumerated Rouge.As the fiber of fiber-reinforced resin, it is fine that glass fibre, carbon fiber, metallic fiber, polyimide fiber, aramid fiber can be enumerated Dimension etc..In addition, by paper, in the case that i.e. paper tube is used for core, it is preferably less using fluffing the reason of being likely to become foreign matter Dust-proof processing paper tube.

It as the shape of core 2, is not particularly limited, usually column, tubular, it is preferably cylindric, cylindric.In addition, The size (outer diameter) of core 2 is not particularly limited, in for example, cylindric, columned situation, from easy to operate in subsequent handling From the viewpoint of property, outer diameter (diameter) is preferably 30~300mm, more preferably 50~250mm.

In addition, from the viewpoint of inhibiting water translocation to hygroscopic film, the water content of core 2 be preferably 3 weight % with Under, more preferably 1 weight % or less.In addition, water content mentioned here is small by measuring the thermostat layer 24 that core is put into 60 DEG C Value measured by the method for the weight change of the core of Shi Qianhou.

Core 2 be tubular in the case where, can the inside of core 2 configure such as silica gel, Alusil (such as allophane), Natural zeolite, synthetic zeolite (such as molecular sieve), quick lime (calcium oxide), bentonite (such as montmorillonite), calcium chloride, chlorination The desiccant such as magnesium, magnesia.By configuring desiccant in the inside of core 2 in advance, desiccant is not direct to be connect with sealing film Touching, so that trace will not be generated on sealing film, it is advantageous to.

[sealing film]

Sealing film is the film for the resin composition layer containing hygroscopic fillers for having supporting mass and being set on supporting mass. As sealing film, preferably it is provided in the side opposite with bearing side of the resin composition layer containing hygroscopic fillers Protective film.

(supporting mass)

In order to improve the moisture resistance of sealing film, or in the case that supporting mass to be used as to a part of sealing structure, as Supporting mass, preferably using the supporting mass with barrier layer.As the supporting mass with barrier layer, it can be mentioned, for example on surface The evaporation film for forming the inorganic matters such as silica (silica), silicon nitride, SiCN, amorphous silicon is thin as the plastics of barrier layer Film；The plastic film etc. as barrier layer such as metal foil of stainless steel foil, aluminium foil is bonded on surface.It is excellent as plastic film Such as polyolefin (such as polyethylene, polypropylene, polyvinyl chloride), polyester, (such as polyethylene terephthalate is (following for choosing Sometimes referred to as " PET "), poly- 2,6- (ethylene naphthalate) (below sometimes referred to as " PEN ") etc.), polycarbonate, polyimides Plastic films are waited, particularly preferably PET film.Barrier layer and plastic film can have 2 layers or more of multilayered structure respectively.As city The example for the plastic film with barrier layer sold can enumerate TECHBARRIER HX, serial (the Mitsubishi's resin strain formula of AX, LX, L Commercial firm's system), (these are to form silica (silica) on surface to steam by X-BARRIER (Mitsubishi Plastics Inc's system) etc. The PET film of plated film).In addition, can also enumerate Nippon Light Metal Co., Ltd.'s system " AL1N30 with PET ", " ALPET (these are to be bonded with aluminium foil on surface by 1N30 ", FUKUDA METAL's Co. Ltd. system " AL3025 with PET ", " ALPET 3025 " etc. PET film).

Polarizing film can be used in supporting mass.In addition, supporting mass can be made of multiple layers with different function, such as and use band The plastic film and polarizing film of barrier layer.For example, can be used the plastic film with barrier layer and polarizing film optics adhesive sheet (OCA) etc. material obtained by bonding agents fitting is as supporting mass.In the case where the supporting mass, sealing film becomes band barrier layer The plastic film structure opposite with the resin composition layer side containing hygroscopic fillers.

In addition, sealing film is so that the resin composition layer containing hygroscopic fillers is transferred to sealed object from supporting mass In the case where the film that the mode of (such as the substrate for being formed with luminescent layer) uses, it is not absolutely required to damp proof for supporting mass Property.As the supporting mass for not having moisture resistance, it can be mentioned, for example as the supporting mass in the above-mentioned supporting mass with barrier layer Example cited by plastic film monomer etc..Supporting mass without moisture resistance is mostly in sealing film for element etc. Sealing after be stripped.In this case, preferably to the face of supporting mass to connect with the resin composition layer containing hygroscopic fillers Implement demoulding processing in advance.As the release agent for demoulding processing, specific enumerable fluorine class release agent, organic silicon demoulding Agent, alkyd resin class release agent etc..Release agent can be used in mixed way different types of release agent.

The thickness of supporting mass is not particularly limited, from the point of view of the viewpoints such as the operability of sealing film, preferably 10~150 μ M, more preferably 20~100 μm." thickness of supporting mass " mentioned here refers in the case where supporting mass has barrier layer The thickness of the supporting mass entirety of barrier layer.

[protective film]

Protective film be before the formation that sealing film is actually used in sealing structure until, to prevent containing hygroscopicity Surface attachment rubbish of the resin composition layer of filler etc. or the film for forming damage can be used above-mentioned as protective film Exemplary plastic film in supporting mass.Preferably PET film, PEN film or COP (cyclic olefin polymer) film, more preferably PET Film.Protective film can implement matte management, Corona discharge Treatment and demoulding processing in advance.As for demoulding processing Release agent, specific enumerable fluorine class release agent, organic silicon release agent, alkyd resin class release agent etc..Protective film can be 2 Layer or more multilayered structure.The thickness of protective film is also not particularly limited, preferably 1~40 μm, more preferably 10~30 μm.

Sealing film includes：Resin composition layer containing hygroscopic fillers is formed by the resin combination of pressure-sensitive adhesive The film of form, the resin composition layer containing hygroscopic fillers by non-sensitive cementability resin combination (such as thermosetting property Resin combination etc.) both the film of form that is formed.

The sealing film for the form that resin composition layer containing hygroscopic fillers is formed by pressure-sensitive adhesive resin combination In the case where, especially the circulations stage is easy to produce attachment of moisture in transport and preservation etc., so effect of the invention can be more Significantly played.

As containing hygroscopic fillers pressure-sensitive adhesive resin combination (below also referred to as " pressure-sensitive adhesive resin combination Object "), it can be mentioned, for example by (A) polyolefin resin, (B) tackifying resin and the resin of (C) hygroscopic fillers as an essential component Composition.

As (A) polyolefin resin (below also referred to as " (A) ingredient "), as long as having the bone from olefinic monomer Frame resin, is not particularly limited.For example, as polyolefin resin, can enumerate polythylene resin, polypropylene-based resin, Polybutene resinoid, polyisobutene resinoid.

From making polyolefin resin that there are the reasons such as preferred characteristic to consider, polyolefin resin can be random copolymerization Object or block copolymer.In addition, as copolymer, can enumerate the copolymer of (i) alkene of more than two kinds, (ii) alkene with it is non-total The copolymer of monomer (not including non-conjugated diene) other than the copolymer of yoke diene or the alkene such as (iii) alkene and styrene. Here, alkene can be used one kind or two or more in the copolymer of the copolymer of (ii) and (iii).As specific example, can enumerate Ethylene-non-conjugated diene copolymer, Ethylene/Butylene-non-conjugated diene copolymer, ethylene-propylene copolymer, ethylene-propylene-are non- Conjugated diene copolymer, ene-propylene-butene copolymer, propene-1-butene copolymer, propene-1-butene-non-conjugated diene copolymerization Object, isobutylene-butene copolymer, isobutene-butylene-non-conjugated diene copolymer, styreneisobutylene copolymer, styrene- Isobutylene-styrene copolymer etc..

From the viewpoint of assigning the good physical property such as cementability, the damp and hot tolerance of bonding, polyolefin resin is preferably Polyolefin resin with anhydride group (such as succinic acid anhydride group, maleic acid anhydride group, glutaric acid anhydride group etc.) and/or epoxy group (that is, introducing the polyolefin resin for having anhydride group and/or epoxy group in the molecule).

Olefine kind resin with anhydride group for example can be by making polyolefins with the unsaturated compound with anhydride group Resin carries out graft modification under the conditions of radical reaction and obtains.In addition it is also possible to by the unsaturated chemical combination with anhydride group Object carries out free-radical polymerized together with the composition monomer of polyolefin resin.Similarly, with the polyolefin resin of epoxy group Such as it can be by being grafted polyolefin resin under the conditions of radical reaction with the unsaturated compound with epoxy group Modification obtains.In addition it is also possible to by the unsaturated compound with epoxy group together with the composition monomer of polyolefin resin It carries out free-radical polymerized.

(A) ingredient can be used a kind or two or more be applied in combination.Preferably and with anhydride group polyolefins tree Rouge and polyolefin resin with epoxy group.(A) concentration of the anhydride group in ingredient and/or epoxy group be preferably 0.05~ 10mmol/g, more preferably 0.1~5mmol/g.The concentration of anhydride group is by according to JIS K 2501:2003 record is defined as neutralizing The value of the acid value of the mg number of the required potassium hydroxide of acid present in resin 1g and obtain, epoxy group concentration by be based on JIS K 7236:1995 obtained epoxide equivalents are found out.

(A) number-average molecular weight of ingredient is not particularly limited, from pressure-sensitive adhesive resin when bringing production sealing film The good coating of the varnish of composition and with from the viewpoint of the good compatibility of the other compositions in resin combination, Preferably 500000 hereinafter, more preferably 300000 hereinafter, further more preferably 150000 or less.On the other hand, pressure-sensitive from preventing Recess (film recess) of the varnish of adhesive resin composition in coating makes to be formed by pressure-sensitive viscous containing hygroscopic fillers The resistance to penetrability of connecing property resin composition layer plays, from the viewpoint of improving mechanical strength, preferably 10000 or more, more preferably 30000 or more, further more preferably 50000 or more.In addition, number-average molecular weight passes through gel permeation chromatography (GPC) method (polyphenyl second Alkene conversion) measurement.Shimadzu Scisakusho Ltd LC-9A/RID- specifically can be used by the number-average molecular weight that GPC method measures 6A is used Showa Denko K. K Shodex K-800P/K-804L as column, is made using toluene etc. as measurement device It for mobile phase, is measured under 40 DEG C of column temperature, is calculated using the calibration curve of standard polystyren.

As the specific example of pressure-sensitive adhesive resin combination, usable such as International Publication No. 2013/108731, The currently known compositions such as the composition recorded in International Publication No. 2011/062167.As non-sensitive adhesive resin Composition can be used currently known such as the compositions of thermosetting resin recorded in International Publication No. 2010/084938 Composition.

In addition, resin composition layer can be the resin of documented substance etc. in International Publication No. 2011/016408 Composition layer is set as 2 layers or more of multilayered structure.

The content of (A) ingredient in pressure-sensitive adhesive resin combination is not particularly limited, from bringing the clear of resin combination The good coating and compatibility of paint are formed by resin composition layer and can ensure that good damp and hot tolerance and operability From the viewpoint of (inhibiting sticky), add up to 100 weight % relative to the nonvolatile component in pressure-sensitive adhesive resin combination, compared with It is 80 weight % well hereinafter, more preferably 75 weight % are hereinafter, further more preferably 70 weight % or less.On the other hand, from making resistance to moisture-inhibiting Property improve, improve the transparency also from the viewpoint of, it is total relative to the nonvolatile component in pressure-sensitive adhesive resin combination 100 weight %, preferably 5 weight % or more, more preferably 10 weight % or more.

(B) tackifying resin (below also referred to as " (B) ingredient ") is also referred to as tackifier (tackifier), is that incorporation is plastic Property macromolecule assigns the resin of its adhesiveness.As (B) ingredient, it is not particularly limited, it is preferable to use terpene resin, modified terpene tree Rouge (hydrogenated terpene resin, terpene phenolic copolymer resins, aromatic-modified terpene resin etc.), coumarone resin, indene resin, Petropols (aliphatic category Petropols, hydrogenation alicyclic petroleum resin, aromatic species Petropols, aliphatic aromatic Copolymer Petropols, Alicyclic ring same clan Petropols, bicyclopentadiene class Petropols and its hydride etc.).From the viscous of pressure-sensitive adhesive resin combination From the point of view of the viewpoints such as connecing property, resistance to penetrability, compatibility, more preferably terpene resin, aromatic-modified terpene resin, terpene phenolic copolymerization are set Rouge, hydrogenation alicyclic petroleum resin, aromatic species Petropols, aliphatic aromatic Copolymer Petropols, alicyclic ring same clan petroleum tree Rouge, further more preferably alicyclic ring same clan Petropols, further more preferably alicyclic saturated hydrocarbon resin, particularly preferably contains hexamethylene Alkane ring filling hydrocarbon resin, dicyclopentadiene-modified hydrocarbon resin.

As the commercially available product that can be used as (B) ingredient, terpene resin can enumerate YS Resin PX, YS Resin PXN (is Pacify former chemical industry (Yasuhara Chemical) Co. Ltd. system) etc., aromatic-modified terpene resin can enumerate YS Resin TO, TR Serial (being An Yuan Chemical Co., Ltd system) etc., hydrogenated terpene resin can enumerate Clearon P, Clearon M, Clearon K series (being An Yuan Chemical Co., Ltd system) etc., terpene phenolic copolymer resins can enumerate YS Polyster 2000, Polyster U, Polyster T, Polyster S, Mighty Ace G (being An Yuan Chemical Co., Ltd system) etc. hydrogenate alicyclic petroleum Resin can enumerate 5300 series of Escorez, 5600 serial (being Exxon Mobil Corporation's system), Arkon P100, Arkon P125, Arkon P140 (being waste river Chemical Co., Ltd. system) etc., aromatic species Petropols can enumerate ENDEX 155 (Eastman corporation) etc., aliphatic aromatic Copolymer Petropols can enumerate Quintone D100 (the auspicious father-in-law (Zeon) of Japan Co. Ltd. system) etc., alicyclic ring same clan Petropols can enumerate Quintone 1325, Quintone 1345 (is the auspicious father-in-law of Japan Co. Ltd. system) etc., the saturation hydrocarbon resin containing cyclohexane ring can enumerate TFS 13-030 (waste river Chemical Co., Ltd. system) etc..

From the viewpoint of from resin combination sheet material, sheet material softens and has required heat resistance in lamination procedure, (B) The softening point of ingredient is preferably 50~200 DEG C, and more preferably 90~180 DEG C, further more preferably 100~150 DEG C.In addition, softening The measurement of point is to be measured according to JIS K2207 by ring and ball method.

(B) ingredient can be used a kind or two or more be applied in combination.(B) ingredient in pressure-sensitive adhesive resin combination Content is not particularly limited, from the viewpoint of the good resistance to penetrability for maintaining resin combination, relative to pressure-sensitive adhesive tree Nonvolatile component in oil/fat composition adds up to 100 weight %, preferably 80 weight % hereinafter, more preferably 60 weight % hereinafter, further More preferably 50 weight % or less.On the other hand, from the viewpoint of with enough cementabilities, relative to pressure-sensitive adhesive resin Nonvolatile component in composition adds up to 100 weight %, preferably 5 weight % or more, more preferably 10 weight % or more, further more It is 15 weight % or more well.

(C) hygroscopic fillers (below also referred to as " (C) ingredient ") as long as there is the filler for the ability for absorbing moisture, It is not particularly limited, preferably hygroscopicity metal oxide.Hygroscopicity metal oxide refers to the ability for absorbing moisture, with suction Wet moisture occurs to chemically react and formed the metal oxide of hydroxide.Specially it is selected from calcium oxide, magnesia, oxidation 1 kind of strontium, aluminium oxide, barium monoxide etc. or mixture of more than two kinds or soluble solids.As mixture of more than two kinds or solid solution The example of object, specific enumerable dolime (mixture containing calcium oxide and magnesia), calcined hydrotalcite (containing calcium oxide and The soluble solids of aluminium oxide) etc..Wherein, from the point of view of in terms of hygroscopicity is high and in terms of cost, the stability of raw material, preferably oxygen Change calcium, magnesia, calcined hydrotalcite, more preferably calcined hydrotalcite.Calcined hydrotalcite is preferably to natural hydrotalcite (Mg₆Al₂ (OH)₁₆CO₃4H₂O it) carries out the OH amount reduction calcined make in chemical structure with synthetic hydrotalcite (houghite compound) or disappears Hydrotalcite obtained by mistake.In addition, from the viewpoint of improving from the transparency for the solidified body for making resin combination, particularly preferably BET Specific surface area 65m²The calcined hydrotalcite of/g or more.BET specific surface area 65m²The BET specific surface area of the calcined hydrotalcite of/g or more Preferably 80m²/ g or more, more preferably 100m²/ g or more.In addition, BET specific surface area is preferably 200m²/ g is hereinafter, more preferably 150m²/ g or less.As the commercially available product of hygroscopicity metal oxide, calcium oxide (three powder Co. Ltd. systems processed altogether can be enumerated " Moiss Top#10 " etc.), magnesia (Kyowa Chemical Industry Co., Ltd's system " KYOWAMAG MF-150 ", " KYOWAMAG MF-30 ", Tateho chemical industry Co. Ltd. system " PUREMAG FNMG " etc.), light calcined magnesia (Tateho chemical industry strain " TATEHOMAG#500 " of formula commercial firm, " TATEHOMAG#1000 ", " TATEHOMAG#5000 " etc.), dolime it is (lucky Damp lime Co. Ltd. system " KT " etc.), calcined hydrotalcite (Kyowa Chemical Industry Co., Ltd's system " DHT-4A ", " DHT-4A-2 ", " DHT-4C " etc.) etc..The substance that is surface-treated with surface treating agent can be used in hygroscopicity metal oxide, as being used for The surface treating agent of surface treatment, it can be mentioned, for example higher fatty acids (preferably stearic acid, montanic acid, myristic acid, palmitinic acids The higher fatty acids of equal 18 or more carbon numbers), alkyl silicon alkanes, silane coupling agent etc., wherein it is preferred that higher fatty acids, alkyl silane Class (surface treating agent can be used one kind or two or more).The treating capacity of surface treating agent is preferable relative to hygroscopicity metal oxide It is 1~10 weight %.The content of (C) ingredient in pressure-sensitive adhesive resin combination is not particularly limited, relative to resin combination In nonvolatile component add up to 100 weight %, preferably 50 weight % hereinafter, more preferably 40 weight % hereinafter, further more preferably 30 Weight % or less.In addition, adding up to 100 weight %, preferably 1 weight % or more relative to the nonvolatile component in resin combination, more It is 5 weight % or more well, further more preferably 10 weight % or more.

From the perspective of flexibility and the formability raising for making resin combination, pressure-sensitive adhesive resin combination can be made Contain plasticizer.As the specific example of plasticizer, paraffin class processing oil, naphthenic processing oil, atoleine, poly- second can be enumerated The mineral oil such as alkene wax, polypropylene wax, vaseline, castor oil, cottonseed oil, rapeseed oil, soybean oil, palm oil, coconut oil, olive oil Equal vegetable oil, the liquid polyalphaolefins such as liquid polybutene, hydrogenation of liquid polybutene, liquid polybutadiene, hydrogenation of liquid polybutadiene Class etc..Wherein, preferably liquid polyalphaolefin class, particularly preferably liquid polybutadiene.In addition, as liquid polyalphaolefin class, from From the viewpoint of cementability, the preferably low substance of molecular weight, in terms of weight average molecular weight preferably 500~5000, more preferably In the range of 1000~3000.Plasticizer can be used alone a kind, also can be used in combination two or more.In addition, " liquid " is here Refer to the state of the plasticizer under room temperature (25 DEG C).In the case that pressure-sensitive adhesive resin combination contains plasticizer, to organic From the viewpoint of EL element does not cause adverse effect, add up to 100 weight % relative to the nonvolatile component in resin combination, It is used in the range of 50 weight % or less.

From the viewpoint of sticky stability of inhibition and other various physical property from resin combination etc., it can make pressure-sensitive Adhesive resin composition further contains the epoxy resin in addition to the polyolefin resin with epoxy group.In addition, conduct Polyolefin resin mainly using have anhydride group polyolefin resin in the case where, epoxy resin have by with have Cross-linked structure is formed between the polyolefin resin of anhydride group and improves the effect of moisture resistance.As such epoxy resin, nothing It is particularly limited to, as long as the epoxy group in terms of averagely in every 1 molecule with 2 or more.For example, bisphenol-A type ring can be enumerated Oxygen resin, biphenyl type epoxy resin, biphenyl aralkyl-type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, Bisphenol F Type epoxy resin, phosphorous epoxy resin, bisphenol-s epoxy resin, aromatic glycidyl amine type epoxy resin are (for example, four shrink Glyceryl diaminodiphenyl-methane, triglycidyl group para-aminophenol, diglycidyl toluidines, diglycidyl Aniline etc.), cycloaliphatic epoxy resin, aliphatic chain epoxy resin, phenol novolacs (phenol novolac) type ring oxygen Resin, cresol novolak type epoxy resin, phenol novolak type epoxy resin, bisphenol A novolac type epoxy resin, the skeleton containing polyalkylene glycol epoxy Resin, the epoxy resin with butadiene structure, the diglycidyl ether compound of bis-phenol, the diglycidyl ether of naphthalene glycol The alkyl of compound, the diglycidyl ether compound of the glycidyl etherified object of phenols and alcohols and these epoxy resin Replace body, halide and hydride etc..The epoxide equivalent of epoxy resin is preferably in the range of 100~1500g/eq, more preferably It is in the range of 150~1000g/eq, further more preferably in the range of 200~800g/eq.In addition, " epoxide equivalent " The grams (g/eq) for referring to the resin of the epoxy group comprising 1 gram equivalent is measured according to the method for 7236 defined of JIS K.Epoxy Resin can be used a kind or two or more be applied in combination.

The content in the case where epoxy resin is used to be not particularly limited in pressure-sensitive adhesive resin combination, such as relative to Nonvolatile component in resin combination adds up to 100 weight %, and preferably 20 weight % are hereinafter, more preferably 15 weight % are hereinafter, into one More preferably 10 weight % are walked hereinafter, further more preferably 8 weight % are hereinafter, particularly preferably 6 weight % or less.On the other hand, from can From the viewpoint of ensuring good operability (adhesion inhibits), add up to 100 weights relative to the nonvolatile component in resin combination %, preferably 0.1 weight % or more, more preferably 0.5 weight % or more are measured, further more preferably 2 weight % or more.

For pressure-sensitive adhesive resin combination, such as containing the polyolefin resin with epoxy group and except this it It, can be further containing solidification from the viewpoint of improving the curing performance of resin combination in the case where outer epoxy resin Agent.As curing agent, be not particularly limited, can enumerate amine curing agent, guanidine curing agent, imidazole curing agent, Phosphonium class curing agent, Phenols curing agent etc..In addition, using the polyolefin resin with anhydride group as polyolefin resin, and then using with ring In the case where the polyolefin resin of oxygroup or above-mentioned epoxy resin, the curing agent in addition to phenols curing agent plays solidification and promotees Into the effect of agent.

Curing agent can be used a kind or two or more be applied in combination.It as amine curing agent, is not particularly limited, four can be enumerated The quaternary ammonium salts such as methyl bromide ammonium, tetrabutylammonium bromide；DBU (1,8- diazabicyclo [5.4.0] hendecene -7), DBN (1,5- bis- Azabicyclo [4.3.0] nonene -5), DBU- phenates, DBU- caprylate, DBU- tosilate, DBU- formates, DBU- benzene The diazabicyclos compounds such as phenol novolac resin salt；Benzyl dimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6- tri- The tertiary amines such as (bis aminomethyl) phenol and their salt, aromatic dimethyl urea, aliphatic dimethyl urea, aromatic dimethyl urea etc. two Methyl urea compounds etc..These curing agent can be used a kind or two or more be applied in combination.As guanidine curing agent, without especially limit Fixed, it can be mentioned, for example dicyandiamide, 1- methylguanidine, 1- ethyl guanidine, 1- cyclohexyl guanidine, 1- guanidines, 1- (o-tolyl) guanidines, diformazan Base guanidine, diphenylguanidine, trimethyl guanidine, tetramethylguanidine, pentamethyl guanidine, tri- azabicyclo of 1,5,7- [4.4.0] decene -5,7- first Three azabicyclo of base -1,5,7- [4.4.0] decene -5,1- methyl biguanides, 1- ethyl biguanides, 1- normal-butyl biguanides, 1- positive 18 Alkyl biguanides, 1,1- dimethylbiguanide, 1,1- diethyl biguanides, 1- cyclohexyl biguanides, 1- allyl biguanides, 1- phenyl biguanide, 1- (o-tolyl) biguanides etc..These curing agent can be used a kind or two or more be applied in combination.As imidazole curing agent, nothing It is particularly limited to, 1H- imidazoles, 2-methylimidazole, 2- phenyl -4-methylimidazole, 1- cyano ethyl -2- ethyl -4- methyl can be enumerated Bis- (methylol) imidazoles of imidazoles, 2- phenyl -4,5-, 1 benzyl 2 methyl imidazole, 1- benzyl -2- phenylimidazole, 2- ethyl -4- Methylimidazole, 2- phenylimidazole, 2- dodecyl imidazole, 2- heptadecyl imidazole, DMIZ 1,2 dimethylimidazole etc..These curing agent It can be used a kind or two or more be applied in combination.Zuo Wei Phosphonium class curing agent, is not particularly limited, it can be mentioned, for example triphenylphosphine, Phosphonium Borate compound, tetraphenylphosphoniphenolate tetraphenyl borate salts, Zheng Ding Ji Phosphonium tetraphenyl borate salts, 4-butyl-phosphonium caprate, (4- methyl Phenyl) triphenyl phosphonium rhodanate, tetraphenylphosphoniphenolate rhodanate, Ding base triphenyl phosphonium rhodanate etc..These curing agent can make With a kind or two or more is applied in combination.The type of phenols curing agent is not particularly limited, can enumerate MEH-7700, MEH-7810, MEH-7851 (bright and chemical conversion Co. Ltd. system), NHN, CBN, GPH (Nippon Kayaku K. K's system), SN170, SN180, SN190, SN475, SN485, SN495, SN375, SN395 (Toto Kasei KK's system), TD2090 (Dainippon Ink Chemicals's system) Deng.The specific example of phenols curing agent as the skeleton containing triazine can enumerate LA3018 (Dainippon Ink Chemicals's system) etc..As containing The specific example of the phenol novolacs curing agent of triazine skeleton, can enumerate LA7052, LA7054, LA1356 (Dainippon Ink Chemicals System) etc..These curing agent can be used a kind or two or more be applied in combination.Curing agent in pressure-sensitive adhesive resin combination Content is not particularly limited, and from the viewpoint of preventing resistance to penetrability from declining, is closed relative to the nonvolatile component in resin combination 100 weight %, preferably 5 weight % are counted hereinafter, more preferably 1 weight % or less.On the other hand, from the viewpoint of inhibiting sticky, relatively Nonvolatile component in resin combination adds up to 100 weight %, preferably 0.01 weight % or more, more preferably 0.05 weight % with On.

It can be arbitrarily containing the various additives in addition to above-mentioned ingredient in pressure-sensitive adhesive resin combination.As this The additive of sample, it can be mentioned, for example silica, barium sulfate, talcum, clay, mica powder, aluminium hydroxide, magnesium hydroxide, carbonic acid Calcium, magnesium carbonate, boron nitride, aluminium borate, barium titanate, strontium titanates, calcium titanate, magnesium titanate, bismuth titanates, titanium oxide, barium zirconate, zirconic acid The inorganic filling materials such as calcium；The organic fillers such as rubber particles, organosilicon powder, nylon powder, fluororesin powder；Orben, The thickeners such as Bentone；Organic silicon, fluorine class, the defoaming agent of high score subclass or flat agent；Triazole compounds, thiazolium compounds, Adaptations imparting agent such as triaizine compounds, porphyrin compound etc..

The preparation method of pressure-sensitive adhesive resin combination is not particularly limited, and can enumerate and gradation composition is added as needed Solubilizer etc., with the mixed method etc. of mixing roller or rotary blender etc..

The resin composition layer containing hygroscopic fillers of sealing film is formed by the resin combination of non-sensitive cementability Form film in the case where, as non-sensitive adhesive resin composition, mixed using in epoxy resin and its curing agent Enter to have thermosetting property or the Photocurable resin composition etc. of hygroscopic fillers.

Sealing film in the present invention is for example dissolved with the varnish of resin combination by preparing, and varnish is coated on branch It holds on body and dries and formed.In addition, the resin composition layer containing hygroscopic fillers formed in this way is preferably formed with containing acid The anhydride group of the polyolefin resin of anhydride group with epoxy resin or the epoxy reaction containing the polyolefin resin of epoxy group and give birth to At ester bond.By forming such cross-linked structure, the moisture-proof of sealing film can be improved.The drying of organic solvent can pass through heat Wind waved etc. carries out.As organic solvent, the ketone such as acetone, methyl ethyl ketone (below also referred to as " MEK ") and cyclohexanone can be enumerated Class；The acetate esters such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol methyl ether acetate, carbitol acetate；It is molten The carbitols class such as fine agent, butyl carbitol；Toluene, dimethylbenzene isofamily hydro carbons；Dimethylformamide, dimethyl acetamide, N- first Base pyrrolidones etc.；The aromatic species mixed solvent such as solvent naphtha.As aromatic species mixed solvent, " Swasol " (ball can be enumerated Kind petroleum Co. Ltd. system, trade name), " Ipzole " (Idemitsu Kosen Co., Ltd.'s system, trade name).Organic solvent can be used 1 Two or more is applied in combination in kind.Drying condition is not particularly limited, preferably 1~60 minute dry at 50~100 DEG C.Pass through Reach 50 DEG C or more, is easy to make quantity of solvent decline remaining in resin composition layer.

The thickness of the resin composition layer containing hygroscopic fillers in sealing film is preferably 3~200 μm, more preferably 5 ~100 μm, further more preferably 5~50 μm.In addition, the final sealing structure as target is in the tree containing hygroscopic fillers In the case that oil/fat composition layer superimposed layer has the structure of sealing substrate, the part that moisture may penetrate into is only resin composition layer Side, therefore the thickness by reducing resin composition layer, the area that side is contacted with extraneous gas reduce.Therefore, from barrier From the perspective of moisture, it is generally desirable to reduce the thickness of resin composition layer.But the if thickness mistake of resin composition layer It is small, then element may be damaged when gluing, sealing substrate, there is also inclining for operability decline when gluing, sealing substrate To.In addition, making the thickness of resin composition layer in above-mentioned preferred scope for resin composition layer is being transferred to sealing In terms of object (for example, the substrate for foring the elements such as organic EL element) keeps the uniformity of the thickness of resin composition layer afterwards Effectively.

Winding of the sealing film in core is not particularly limited, and well known method can be used.Specifically, can enumerate with Core is the method that basic point batches sealing film.

[padded coaming]

It as the padded coaming 3 in the present invention, is not particularly limited, can enumerate with glassine paper (cellophane), polyethylene, poly- third Alkene, soft PVC, polyester (for example, PET or PEN, be copolymerized they and 1,4-CHDM etc. obtained by copolymerization it is poly- Ester etc.), polystyrene, the resins film as main component such as polyurethane, foaming agent as main component and is mixed using the resin Foamed thin sheet obtained by making it foam, using the resin as main component and mixes inorganic and/or organic pigment and passes through stretching Processing forms the films class such as porous membrane of hole, synthesizes stationery, Non-woven fabrics, good quality paper, art paper, coating paper, ox-hide The stationeries and the laminated body of these materials etc. such as paper, polyethylene layer combined paper, the water soluble paper, impregnated paper, blistering paper.In addition, can also arrange It lifts and these film classes is stacked on material obtained by the plastic basis material of aftermentioned hygroscopic film.

Wherein, especially good from resiliency, and from the perspective of light weight, moisture-proof, price etc. are good, it is preferably poly- Ethylene foamed thin sheet, polyurethane foam film etc..

As the thickness of padded coaming entirety, preferably 0.5~10mm, more preferably 1~7mm.It, may when less than 0.5mm It can not obtain enough buffering effects to organic EL element sealing film 1.In addition, if then may more than 10mm Generate winding offset or impression.

In the present invention, commercially available product is can be used in padded coaming.As preferred specific example, it can be mentioned, for example wine well chemistry works Highly foaming polyethylene sheet material " Mina Foam " (thickness of industry Co. Ltd. system：2mm), the poly- second of the high-foaming of JSP Corp Alkene sheet material " MIRAMAT " (thickness：2mm), the polyalkene foaming sheet material " FOLEC " of Co., Ltd. Inoac Corporation (thickness：1.8mm), the bubble padded coaming (Air Cap) " PUTIPUTI Roll D35 " of Kawakami Industrial Co. Ltd. is (thick Degree：5mm).

[dust-proof to use film]

Film 4 is used as dust-proof, is not particularly limited, is uncharged or low electric charge film.For example, can be used with poly- inclined The resins such as vinyl chloride, polyethylene, polypropylene, polyvinyl chloride, polymethylpentene film as main component, or with the resin For main component and mix film etc. obtained by electroconductive stuffing forming.It as electroconductive stuffing, is not particularly limited, applicable public affairs The antistatic agents such as the surfactant known；Generate zinc sulphide, copper sulfide, cadmium sulfide, nickel sulfide, palladium sulfide sulfides conductive Electroconductive stuffing obtained by property；Barium sulfate；The metal oxides such as tin oxide/zinc oxide, indium oxide, titanium oxide；Conductive carbon is filled out Material；Silicon organic compound；Surface metal plating layer filler etc..

Wherein, from the transparency, light weight, price etc. it is good from the perspective of, preferably Vingon film, polypropylene Film, polyethylene film, polyvinyl chloride film etc..

As the dust-proof thickness with film, preferably 5~75 μm, more preferably 8~50 μm, particularly preferably 10~50 μm.No When to 5 μm, in operation it is possible that fold, if it exceeds 75 μm, then floating for film may occur.

It is dust-proof that commercially available product can be used with film in the present invention.For example, the poly- inclined chloroethene of Asahi Kasei Corporation can be enumerated Alkene film " Saran Wrap " (thickness：11 μm), polypropylene film " FOA20 " (thickness of Futamura Chemical Co., Ltd.： 20 μm), polypropylene film " TORAYFAN " (thickness of Dongli Ltd.：20 μm), prince's F-TEX Co. Ltd. system it is poly- Polypropylene film " ALPHAN " (thickness：20 μm) etc..

< hygroscopic film >

In the present invention, as hygroscopic film 11, as long as before according to placing 1 week in the environment of 25 DEG C, relative humidity 60%RH The hygroscopic capacity that weight change afterwards obtains is 1g/m²Above film can be used and be not particularly limited.The hygroscopic capacity of film is more It is well 3g/m²More than, particularly preferably 5g/m²More than.If hygroscopic capacity is lower than 1g/m², then may be unable to fully inhibit moisture to Intrusion in the resin composition layer containing hygroscopic fillers of sealing film 1.In addition, hygroscopic capacity is preferably 15g/m²Hereinafter, More preferably 10g/m²Below.If hygroscopic capacity is more than 15g/m², then the deformation of hygroscopic film increases, and exists and causes not to operation Just tendency.

The form of hygroscopic film 11 is not particularly limited, and it can be mentioned, for example (i) to be formed in at least one side of plastic basis material The film of type etc. that the film of the type of moisture absorption layer, (ii) clamp on the two sides of moisture absorption layer with plastic basis material.

It is by organic polymer melting extrusion and as needed in length direction and/or width direction as plastic basis material Film obtained by upper implementation stretching, cooling, heat fixation etc. can enumerate polyethylene, polypropylene, gather to benzene as organic polymer Naphthalate, nylon 6, nylon 4, nylon66 fiber, nylon 12, polyvinyl chloride, gathers partially poly- 2,6- (ethylene naphthalate) Vinyl chloride, polyvinyl alcohol, Wholly aromatic polyamide, polyamidoimide, polyimides, polyetherimide, polysulfones, polyphenylene sulfide, Polyphenylene oxide etc..In addition, these organic polymers can be copolymerization or blend the organic polymer of other a small amount of organic polymers.

In addition, well known additive can be added in these organic polymers, such as antistatic agent, plastification material, lubrication material Material, colorant etc..

The thickness of plastic basis material is preferably in the range of 5~100 μm, more preferably in the range of 10~50 μm.

For plastic basis material, before layered absorbent layer, implementable Corona discharge Treatment, glow discharge process or other tables Face roughening treatment, also implementable anchoring coating process, printing, decoration.

The group comprising hygroscopic agent and matrix resin at least with vapor (moisture) absorbability can be used in moisture absorption layer Close object.

As hygroscopic agent, the hygroscopic agent of inorganic and organic, and then the hygroscopic agent as inorganic can be used, can be used As being hydrated chemically the hygroscopic agent of moisture absorption, as molecular sieving effect physical moisture absorption hygroscopic agent.It is inhaled as organic The organic-based material with hydrophilic group, the especially organic-based material with carboxyl or hydroxyl can be used in humectant.

Specifically, it can be mentioned, for example aluminium oxide, potassium oxide, sodium oxide molybdena, barium monoxide, calcium oxide (quick lime), five oxidations Two phosphorus, zinc chloride, sodium hydroxide, calcium hydroxide, magnesium sulfate, calcium sulfate, lithium sulfate, sodium sulphate, cobaltous sulfate, gallium sulfate, sulfuric acid Titanium, nickel sulfate, potassium hydroxide, calcium chloride, magnesium chloride, strontium chloride, yttrium chloride, copper chloride, calcium bromide, bromination cerium, selenium bromide, bromine Change vanadium, magnesium bromide, barium titanate, cesium fluoride, fluorination tantalum, fluorination niobium, barium iodide, magnesium iodide, burnt alum (exsiccated alum), silica gel, Zeolite (molecular sieve), active carbon, clay mineral, allophane, starch based material, cellulose material, polyacrylate material Material, polyacrylic materials, polyvinyl alcohol material, polyacrylamide material, polyoxyethylene material etc., these hygroscopic agents It can be used a kind or be mixed with two or more.

As matrix resin, it is not particularly limited, it can the suitably selection use from currently known resin material.For example, can It enumerates polyethylene, polypropylene, polyvinyl chloride, Vingon, polytrifluorochloroethylene, polystyrene, polyethylene, polyamide, gather Acrylonitrile, ethylene vinyl acetate, ethylene-vinyl alcohol copolymer, polymethyl methacrylate, ethylene-methyl-prop Olefin(e) acid copolymer, ethylene-acrylic acid copolymer, ionomer (salt of ethylene-acrylic acid copolymer), ethylene-methyl methacrylate first Ester copolymer, polyethylene terephthalate, cyclic olefin polymer, cyclic olefin copolymer, Petropols, polytetrafluoroethyl-ne Fluoride resins copolymer such as alkene, polyvinyl fluoride, Kynoar, ethylene-tetrafluoroethylene copolymer etc..These matrix resins can make With a kind or it is mixed with two or more.

The thickness of moisture absorption layer is not particularly limited, preferably 5 μm or more, 100 μm hereinafter, more preferably 10 μm or more, 50 μm with Under.By making its 5 μm or more, it can be ensured that enough hygroscopicity, by making its 100 μm or less, it can be ensured that enough formings Property.

The whole thickness of hygroscopic film 11 is not particularly limited, preferably 20~150 μm, more preferably 50~100 μm.It is lower than At 20 μm, target capabilities can not be played sometimes, and in the case where being greater than 150 μm, operability is deteriorated sometimes.

In addition, hygroscopic film 11 can be 1 contained by hygroscopic film in the range of not damaging basic performance In above layer add Nucleating Agent, Petropols, antistatic agent, ultraviolet absorbing agent, lubricant, antioxidant, light stabilizer, Film obtained by the additives such as antiblocking agent, surfactant, dyestuff, pigment, fire retardant, deodorant, plasticizer.By the inclusion of Such layer can assign anti-static function, deodorization functions or anti-ultraviolet function etc. to hygroscopic film and package body, can make to wrap The keeping quality of dress body further increases.

In the present invention, as hygroscopic film 11, commercially available product can be used.As preferred specific example, it can be mentioned, for example " moisture absorption sheet material DRY KEEP film SPES48-231J " (thickness of Sasaki Chemical Co., Ltd.：60 μm, hygroscopic capacity： 6g/m²), " MOIST CATCH ZPA50 " (thickness of Kyodo Printing Co., Ltd.：50 μm, hygroscopic capacity：7g/m²), Japan's aluminium Co., Ltd. " Toyal Dry " (thickness：60 μm, hygroscopic capacity：6g/m²) etc..

The packaging material > of < moisture resistance

It include thin by the gas barrier property for having the function of preventing gas (vapor) from penetrating in the present invention, in the packaging material of moisture resistance Bag body or cabinet made of film.

Gas-barrier films are preferably that moisture vapor permeable rate (moisture-vapor transmission) is 5g/m²/ day film below, more preferably moisture-inhibiting Gas rate is 1g/m²/ day film below, particularly preferably moisture vapor permeable rate is 0.5g/m²/ day film below, preferably moisture vapor permeable rate For 0.1g/m²/ day film below.

Gas-barrier films include substrate and gas barrier layer.Gas barrier layer is generally disposed on substrate.In addition, gas barrier layer is configured in The two sides of substrate.In addition, " gas " is primarily referred to as vapor in this specification.In addition, " moisture vapor permeable rate " be 40 DEG C of temperature, According to JIS Z 0208-1976 under conditions of relative humidity (RH) 90%：The value of agar diffusion method measurement.

Substrate has the function of keeping gas barrier layer.Substrate of the present invention is not particularly limited, preferably have it is flexible and The bent film substrate of permeability.

As the specific example of film substrate, it can enumerate and be with the one kind or two or more resin in following resins group The resin film of main component, the resin group are：As the homopolymer of ethylene, propylene, butylene etc. or the polyolefin of copolymer (PO) polyester resins such as the amorphous polyolefin resins such as resin, cyclic polyolefin (APO), PET, PEN, nylon-6, Nylon-12, The polyethylene such as polyamide-based (PA) resin such as copolymer nylon, polyvinyl alcohol (PVA) resin, ethylene-vinyl alcohol copolymer (EVOH) Alcohol resinoid, polyetherimide (PEI) resin, polysulfones (PS) resin, polyether sulfone (PES) resin, gathers polyimides (PI) resin Ether ether ketone (PEEK) resin, polycarbonate (PC) resin, poly- vinyl butyrate (PVB) resin, polyarylate (PAR) resin, ethylene- TFE copolymer (ETFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (FEP), gathers at chlorotrifluoroethylene (PFA) The fluorine trees such as vinylidene (PVDF), polyvinyl fluoride (PVF), perfluoroethylene-perfluoropropene-perfluorovinylether copolymer (EPA) Rouge etc..

It can be non-stretched film using the substrate of above-mentioned resin film, be also possible to oriented film.

The thickness of substrate is preferably 10~100 μm, and more preferably 15~75 μm.In addition, can implement at corona discharge to substrate Reason.

Gas barrier layer has the function that gas-barrier films are assigned with gas barrier properties.As long as the moisture permeable of resulting gas-barrier films Rate is 5g/m²/ day is hereinafter, gas barrier layer can be arbitrary layer.

As the specific example of gas barrier layer, aluminium foil, aluminium-vapour deposition layer, inorganic layer etc. can be enumerated.As in inorganic layer Inorganic matter can enumerate curing zinc, aluminium oxide, indium oxide, tin oxide, gallium oxide, tin indium oxide (ITO), aluminium-doped zinc oxide (AZO), zinc-tin composite oxides (ZTO), aluminium nitride, silicon carbide, silica, silicon nitride, silicon oxynitride etc..Inorganic layer can lead to Cross the formation such as vapour deposition method, sputtering method, ion plating method.

Gas barrier layer can be single layer, be also possible to 2 layers with layer obtained by superimposed layer.In the case where 2 layers of lamination or more, each layer It can be the layer formed by identical component, be also possible to the layer formed by heterogeneity.

The thickness of gas barrier layer is preferably 1nm~20 μm, more preferably 100nm~15 μm.In addition, being 2 layers of lamination in gas barrier layer In the case of obtained by above, the thickness of gas barrier layer mentioned here refers to 2 layers of overall thickness.

The package body > of < film roll

It as the method for packing film volume, is not particularly limited, well known method can be used.For example, film roll hygroscopicity is thin After film covering, the film covered by hygroscopic film is rolled into moisture resistance packaging material, which is sealed. For the sealing of packaging material, a part (opening portion) heating to packaging material can be enumerated, cooling after pressure is applied, into The method of row sealing (using the packing method of heat-sealing).

Preferably before with packaging material packing film volume, to being de-gassed in packaging material, or inert gas is used It is replaced.By be de-gassed or using inert gas displacement, can be to the inside of package body obtained by sealing and packing material Environment (dew point etc.) is adjusted.

Embodiment

Hereinafter, showing embodiment, the present invention will be described in more detail.

(embodiment 1)

In the demoulding PET film ASST2.25 (thickness for having carried out demoulding processing with organic silicon release agent：100 μm, rattan lumber's industry Co. Ltd. system) on, it is equably coated with the varnish obtained with following conditions with die coater, is heated 60 minutes at 130 DEG C, To form 30 μm of thickness of resin composition layer.Organic silicon release agent is shared on the resin composition layer upper layer to be taken off The demoulding PET film 025E-0010BD (thickness of mould processing：25 μm, Tengsen Industrial Co., Ltd's system) it is sealed to make organic EL The organic EL sealing film of 10m is batched for 3 inches of diameter (7.62cm) of plastics core with film.Then, it winds high-incidence Steep polyethylene sheets (wine well chemical industry Co. Ltd. system, " Mina Foam " (thickness：2mm)), and then Vingon is wound Film (Asahi Kasei Corporation, " Saran Wrap " (thickness：11 μm)) after, moisture absorption sheet material will be used around resulting film roll DRY KEEP film SPES48-231J (laminated construction：Polyethylene/moisture absorption layer/polyethylene, thickness：60 μm, hygroscopic capacity：6g/m², Sasaki Chemical Co., Ltd.'s system) covering.Put it into the packaging material shape by being bonded with aluminium foil on polyethylene substrate At aluminium bag MBY-92100 (moisture vapor permeable rate：0.5g/m²/ day, ADY Co. Ltd. system) after, the entrance of bag is sealed by sealing It closes, obtains package body (bundling body).

[production of sealing film varnish]

In the saturation hydrocarbon resin (Arkon P125,60%Swasol solution, waste river Chemical Co., Ltd. system) containing cyclohexane ring, Disperse maleic anhydride modified liquid polyisobutene (HV-300M, Toho Chemical Industry Co., Ltd.'s system), polybutene with three-roll mill (HV-1900, JX Kuang stone Energy KK system) and calcined hydrotalcite (KW2200, Kyowa Chemical Industry Co., Ltd System), obtain mixture.Into resulting mixture, ethylene-methyl methacrylate glycidyl ester copolymer is mixed (BONDFAST BF-7M, Sumitomo Chemical Co's system), anionically polymerized curing agent (2,4,6- tri- (bis aminomethyl) benzene Phenol) and toluene, resulting mixture is uniformly dispersed with high speed rotation mixing machine, obtains the varnish of resin combination.

(reference example 1)

Sealing film is made similarly to Example 1, and for 3 inches of diameter (7.62cm) of plastics core, it is organic to batch 10m EL sealing film.Then, it is fixed inside core 2 silica gel MP20G (Chemical Co., Ltd of Toyota system), winding high-foaming is poly- Ethylene sheet material (wine well chemical industry Co. Ltd. system, " Mina Foam " (thickness：2mm)), and then Vingon film is wound (Asahi Kasei Corporation, " Saran Wrap " (thickness：11 μm)) after, put it into aluminium bag MBY-92100 (ADY Co., Ltd. System), the entrance of bag is closed by sealing, is obtained package body (bundling body).Fig. 2 is the schematic of resulting film roll package body Cross-sectional view.

(comparative example 1)

Organic EL sealing film is made similarly to Example 1, for 3 inches of diameter (7.62cm) of plastics core, is batched The organic EL sealing film of 10m.Then, highly foaming polyethylene sheet material (wine well chemical industry Co. Ltd. system " Mina is wound Foam " (thickness：2mm)), and then Vingon film (Asahi Kasei Corporation, " Saran Wrap " (thickness are wound：11μ M) after), resulting film is rolled into aluminium bag MBY-92100 (moisture vapor permeable rate：0.5g/m²/ day, ADY Co. Ltd. system), pass through The entrance of bag is closed in heat-sealing, is obtained package body (bundling body).Fig. 3 is the schematic cross sectional views of resulting film roll package body.

(evaluation of water content)

From the sample of sample and preservation 1 month that the package body of embodiment 1, reference example 1 and comparative example 1 is saved to 1 week respectively, take It is (horizontal to cut out sample from organic EL sealing film for organic EL sealing film out：About 100mm is indulged：About 100mm, weight：100 ~300mg), protective film is removed, with karr Fischer (Karl Fischer) moisture content determining device (three of coulometric titration Water chestnut chemistry Analytech Co. Ltd. system " determination of trace water device CA-200 ") determine the aqueous of its resin composition layer Amount.The device is by being arranged the glass container of heatable sample and the reaction for the moisture for having titration to gasify when heating sample being added The titration outfit of liquid is constituted.The moisture of gasification is by being passed through flow：250 ± 25ml/ minutes nitrogen and it is mobile from glass container To the reaction solution side of titration outfit.In measurement, to being replaced as under nitrogen atmosphere in the glass container of (steam vapour amount < 0.1ppm) Sample is put into, the amount of the moisture to gasify under conditions of 130 DEG C is titrated, calculates the water content of resin composition layer.As a result it is shown in Following table 1.

[table 1]

。

The explanation of symbol

1 organic EL sealing film

2 core

3 padded coamings

4 dust-proof use film

5 desiccant

10 film rolls

11 hygroscopic films

The packaging material of 12 moisture resistancees.

The application is based on the Japan Patent Patent 2016-060126 to file an application in Japan, its content all to be received Enter in this specification.

Claims (13)

1. a kind of film roll package body is the resin containing hygroscopic fillers that will have supporting mass He be set on the supporting mass The sealing film of composition layer is wound in the package body of film roll obtained by core, wherein

The film roll package body is the film roll to be sealed with the packaging material of the state moisture resistance covered by hygroscopic film It packs.

2. film roll package body according to claim 1, wherein sealing film, which also has, to be set to containing hygroscopic fillers Resin composition layer with the protective film of the opposite side in bearing side.

3. film roll package body according to claim 1, wherein film roll is also to be wound with buffering in the outside of film roll The film roll with padded coaming of material.

4. film roll package body described in any one of claim 1 to 3, wherein film roll is in sealing film Outside is wound with the dust-proof film roll with dust-proof film with film, or the fender in the film roll with padded coaming The outside of material is also wound with the dust-proof film roll with padded coaming and dust-proof film with film.

5. film roll package body according to any one of claims 1 to 4, wherein core be it is hollow, in the inside of core Configured with desiccant.

6. film roll package body according to any one of claims 1 to 5, wherein hygroscopic film be according to 25 DEG C, It is 1g/m that hygroscopic capacity obtained from the weight change of 1 week front and back is placed in the environment of relative humidity 60%RH²Above film.

7. film roll package body described according to claim 1~any one of 6, wherein hygroscopic film is that have to gather to benzene Naphthalate layer/moisture absorption layer/polyethylene terephthalate layer laminated construction film.

8. film roll package body according to any one of claims 1 to 7, wherein sealing film is filled out containing hygroscopicity The resin composition layer of material is the resin composition layer comprising olefine kind resin, tackifier and hygroscopic fillers.

9. film roll package body described according to claim 1~any one of 8, wherein the supporting mass of sealing film is anti- Moist film.

10. film roll package body described according to claim 1~any one of 9, wherein sealing film is for organic EL member The sealing of part.

11. a kind of manufacturing method of film roll package body, wherein have：

First step will be with supporting mass and the resin combination containing hygroscopic fillers being set on the supporting mass in the process The sealing film of nitride layer is wound in core and film roll is made；

In the process, which is covered with hygroscopic film for the second step；And

In the process, the film covered with the hygroscopic film is rolled into the packaging material of moisture resistance for the third step, and will Packaging material sealing.

12. according to the method for claim 11, wherein first step is after winding sealing film in core, in turn Padded coaming is wound, or sequentially winds padded coaming and dust-proof film, the process that film roll is made in turn.

13. method according to claim 11 or 12, wherein sealing film is used for the sealing of organic EL element.