CN108879058A - A kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter and preparation method thereof - Google Patents
A kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter and preparation method thereof Download PDFInfo
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- CN108879058A CN108879058A CN201810666837.8A CN201810666837A CN108879058A CN 108879058 A CN108879058 A CN 108879058A CN 201810666837 A CN201810666837 A CN 201810666837A CN 108879058 A CN108879058 A CN 108879058A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention, which discloses a kind of broadband one and divides in 16, buries resistance multi-layer board power splitter, including：First copper-clad plate, one side are equipped with microwave top layer ground layer；Second copper-clad plate sets gradually microwave bottom layer ground layer, built-in type resistive layer and broadband one close to the direction of a lateral edge towards first copper-clad plate of first copper-clad plate and divides 16 power divider circuit layers；And the layer of prepreg between first copper-clad plate and second copper-clad plate.Power control signal cabling and microwave signal cabling can be carried out three-dimensional storied placement in the system integration by power splitter provided by the invention, structure is simple and saves wiring space, improve wiring integrated level, and interlayer interconnection is carried out by vertical interconnection via hole, so that power control signal and microwave signal is can be carried out effective vertical interconnection transmission, realizes that function divides the small light and High Density Integration of feeding network and power control signal.
Description
Technical field
The present invention relates to power splitters.Divide in 16 more particularly, to a kind of broadband one bury resistance multi-layer board power splitter and its
Production method.
Background technique
In radio frequency microwave system, in order to which power to be divided into two-way or multichannel according to a certain percentage, need using power point
Orchestration, such as to phased-array radar, transmitter power is assigned to each transmitting unit；Multichannel relayed communications is confidential to incite somebody to action this
Oscillation source power in ground is assigned in transmitting-receiving mixting circuit.So the application of power splitter is quite extensive, and its performance will affect
The communication quality of whole system.
In existing radio frequency microwave system frequently with power splitter mainly have chamber power divider, microstrip line power splitter with it is band-like
Line power splitter.Strip line power splitter advantage be it is small in size, it is at low cost, be convenient for the system integration, flexible design.Now with channel radio
The high speed development of letter, to the bandwidth of device and system, higher requirements are also raised, and broadband power divider is more able to satisfy system bandwidth
Requirement.Traditional power splitter, it is big that there are volumes, and weight is big, and defect at high cost and narrow frequency bandwidth limits it in width
With the application in microwave system.
Summary of the invention
It is big that there are volumes in order to solve traditional power splitter, and weight is big, defect at high cost and narrow frequency bandwidth, this hair
It is bright a kind of broadband one be provided divide in 16 bury resistance multi-layer board power splitter, including：
First copper-clad plate, one side are equipped with microwave top layer ground layer；
Second copper-clad plate, the direction close to a lateral edge towards first copper-clad plate of first copper-clad plate are successively set
It sets microwave bottom layer ground layer, built-in type resistive layer and broadband one and divides 16 power divider circuit layers；And
Layer of prepreg between first copper-clad plate and second copper-clad plate.
Preferably, the microwave top layer ground layer is equipped with first medium layer far from the side of first copper-clad plate.
Preferably, second dielectric layer is provided between the microwave bottom layer ground layer and built-in type resistive layer.
Preferably, 16 power divider circuit layers and the microwave bottom are divided in the microwave top layer ground layer, the broadband one
Layer ground plane is electrically connected by via hole.
The embodiment of the present invention also provides a kind of broadband one and divides in 16 the production method for burying resistance multi-layer board power splitter, including：
Microwave top layer ground layer is formed in the side of the first copper-clad plate；
Second copper-clad plate close to first copper-clad plate a lateral edge towards the direction of first copper-clad plate successively shape
Divide 16 power divider circuit layers at microwave bottom layer ground layer, built-in type resistive layer and broadband one；
Layer of prepreg is formed between the first copper-clad plate and second copper-clad plate, and carries out high-temperature lamination process together.
Preferably, the method also includes：
First medium layer is formed far from the side of first copper-clad plate in the microwave top layer ground layer.
Preferably, the method also includes：Second is formed between the microwave bottom layer ground layer and built-in type resistive layer
Dielectric layer.
Preferably, the method also includes：
Divide 16 power divider circuit layers and the microwave bottom layer ground in the microwave top layer ground layer, the broadband one
The via hole for being electrically connected to each other is formed on layer.
Beneficial effects of the present invention are as follows：
Power splitter provided by the invention and preparation method thereof can be by power control signal cabling and micro- in the system integration
Wave signal lead carries out three-dimensional storied placement, and structure is simple and saves wiring space, improves wiring integrated level, and by vertical
It interconnects via hole and carries out interlayer interconnection, so that power control signal and microwave signal is can be carried out effective vertical interconnection transmission, realize function
Divide the small light and High Density Integration of feeding network and power control signal.The multi-layer board strip line of resistance is buried in using simultaneously,
Structure is simple, is greatly saved the space in power splitter height, while eliminating the subsequent electric resistance welding of conventional microstrip power splitter
Connect technical process；Low in cost, easy to maintain, high reliablity, while function admirable, bandwidth, applicable situation are wide in range.
Detailed description of the invention
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing.
Fig. 1 show the broadband one in the embodiment of the present invention divide in 16 bury resistance multi-layer board power splitter schematic diagram of laminated structure.
Divide in 16 Fig. 2 shows the broadband one in the embodiment of the present invention and buries resistance multi-layer board structure schematic diagram.
Fig. 3 shows the part in Fig. 2 using two-stage Wilkinson form circuit and built-in type resistance schematic diagram.
Specific embodiment
In order to illustrate more clearly of the present invention, the present invention is done further below with reference to preferred embodiments and drawings
It is bright.Similar component is indicated in attached drawing with identical appended drawing reference.It will be appreciated by those skilled in the art that institute is specific below
The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
The embodiment of the present invention, which provides a kind of broadband one, divides in 16 and buries resistance multi-layer board power splitter, as shown in Figure 1-3, include：
First copper-clad plate, one side are equipped with microwave top layer ground layer 1；Second copper-clad plate, close to a lateral edge of first copper-clad plate
Microwave bottom layer ground layer 3, built-in type resistive layer 7 and broadband one, which are set gradually, towards the direction of first copper-clad plate divides 16 function
Divide device circuit layer 2；And the layer of prepreg 6 between first copper-clad plate and second copper-clad plate.One point of 16 function
Divide device that there are 16 output ports (output port 1,2 to 16 in Fig. 2).
Power splitter provided by the invention, basic unit uses binodal Wilkinson power divider form spread bandwidth, using more
Layer microwave board manufacturing process is developed by photoetching, drilling, and the processes such as plating bond, lamination finally by prepreg, will be single
Face/double-side copper-applying high frequency laminated plate material, which presses, to be formed the strip line broadband one of built-in type resistance and divides 16 multi-layer board power splitters.It is interior
Buried broadband one divides 16 strip line multi-layer board power splitters that can believe power control signal cabling and microwave in the system integration
Number cabling carries out three-dimensional storied placement, and structure is simple and saves wiring space, improves wiring integrated level, and pass through vertical interconnection
Via hole carries out interlayer interconnection, so that power control signal and microwave signal is can be carried out effective vertical interconnection transmission, realizes function point feedback
The small light and High Density Integration of electric network and power control signal.The multi-layer board strip line of resistance, structure are buried in using simultaneously
Simply, it is greatly saved the space in power splitter height, while eliminating the subsequent resistance welder of conventional microstrip power splitter
Skill process；Low in cost, easy to maintain, high reliablity, while function admirable, bandwidth, applicable situation are wide in range.
Preferably, the microwave top layer ground layer is equipped with first medium layer far from the side of first copper-clad plate.
Preferably, second dielectric layer is provided between the microwave bottom layer ground layer and built-in type resistive layer.
Preferably, 16 power divider circuit layers and the microwave bottom are divided in the microwave top layer ground layer, the broadband one
Layer ground plane is electrically connected by via hole.
Wherein microwave top layer ground layer 1 forms single-side coated copper plate with first medium layer 4；16 power divider circuits are divided in broadband one
Layer 2, built-in type resistive layer 7, second dielectric layer 5 and microwave bottom layer ground layer 3 form double face copper.Single side, double face copper,
Application substrate technique is fabricated to respective metal figure, the transmission for frequency microwave signal；Built-in type active component, equally passes through
The substrate process such as photoetching, development make corresponding resistance pattern, for realizing the isolation between two way microwave signals.Later two
Kind copper-clad plate ultimately forms this multi-layer board broadband power divider by the high-temperature lamination process of substrate together with layer of prepreg 6.
Broadband one, which is divided in 16, buries resistance multi-layer board power splitter when emitting working condition, and microwave signal divides 16 from broadband one
Stripline transmission line input in power divider circuit layer 2, the second layer one divide in 16 power divider circuit layers 2 containing embedded resistors
Power-devided circuit at 16 tunnels and transmits 1 tunnel microwave signal constant amplitude with phase partitioning, is transferred out respectively by strip line output port,
It is used for junior's microwave circuit.
Broadband one, which is divided in 16, buries resistance multi-layer board power splitter when receiving working condition, and microwave signal divides 16 from broadband one
Stripline transmission line input in power divider circuit layer 2, the second layer one divide in 16 power divider circuit layers (2) and contain embedded resistors
Power-devided circuit by 16 tunnel microwave signal constant amplitudes with being harmonious as 1 tunnel and transmitting, transmitted out finally by strip line output port
It goes, and exports to higher level's microwave circuit.
The embodiment of the present invention also provides a kind of broadband one and divides in 16 the production method for burying resistance multi-layer board power splitter, including：
S1 forms microwave top layer ground layer in the side of the first copper-clad plate；
S2 second copper-clad plate close to first copper-clad plate a lateral edge towards the direction of first copper-clad plate successively
It forms microwave bottom layer ground layer, built-in type resistive layer and broadband one and divides 16 power divider circuit layers；
S3 forms layer of prepreg between the first copper-clad plate and second copper-clad plate, and carries out high-temperature lamination process together.
Preferably, the method also includes：
S4 forms first medium layer far from the side of first copper-clad plate in the microwave top layer ground layer.
S5 forms second dielectric layer between the microwave bottom layer ground layer and built-in type resistive layer.
Preferably, the method also includes：
S6 divides 16 power divider circuit layers and the microwave bottom to connect in the microwave top layer ground layer, the broadband one
The via hole for being electrically connected to each other is formed on stratum.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention may be used also on the basis of the above description for those of ordinary skill in the art
To make other variations or changes in different ways, all embodiments can not be exhaustive here, it is all to belong to this hair
The obvious changes or variations that bright technical solution is extended out are still in the scope of protection of the present invention.
Claims (8)
1. a kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter, which is characterized in that including：
First copper-clad plate, one side are equipped with microwave top layer ground layer；
Second copper-clad plate is set gradually micro- close to the direction of a lateral edge towards first copper-clad plate of first copper-clad plate
16 power divider circuit layers are divided in wave base layer ground plane, built-in type resistive layer and broadband one；And
Layer of prepreg between first copper-clad plate and second copper-clad plate.
2. power splitter according to claim 1, which is characterized in that the microwave top layer ground layer is far from first copper-clad plate
Side be equipped with first medium layer.
3. power splitter according to claim 1 or claim 2, which is characterized in that the microwave bottom layer ground layer and built-in type resistive layer
Between be provided with second dielectric layer.
4. power splitter according to claim 1, which is characterized in that the microwave top layer ground layer, the broadband one divide 16
Power divider circuit layer and the microwave bottom layer ground layer are electrically connected by via hole.
5. the production method for burying resistance multi-layer board power splitter is divided in 16 in a kind of broadband one, which is characterized in that including：
Microwave top layer ground layer is formed in the side of the first copper-clad plate；
It sequentially forms in second copper-clad plate close to the direction of a lateral edge towards first copper-clad plate of first copper-clad plate micro-
16 power divider circuit layers are divided in wave base layer ground plane, built-in type resistive layer and broadband one；
Layer of prepreg is formed between the first copper-clad plate and second copper-clad plate, and carries out high-temperature lamination process together.
6. production method according to claim 5, which is characterized in that the method also includes：
First medium layer is formed far from the side of first copper-clad plate in the microwave top layer ground layer.
7. according to the production method of claim 5 or 6, which is characterized in that the method also includes：It is connect in the microwave bottom
Second dielectric layer is formed between stratum and built-in type resistive layer.
8. production method according to claim 5, which is characterized in that the method also includes：
Divide on 16 power divider circuit layers and the microwave bottom layer ground layer in the microwave top layer ground layer, the broadband one
Form the via hole for being electrically connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810666837.8A CN108879058A (en) | 2018-06-26 | 2018-06-26 | A kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810666837.8A CN108879058A (en) | 2018-06-26 | 2018-06-26 | A kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108879058A true CN108879058A (en) | 2018-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810666837.8A Pending CN108879058A (en) | 2018-06-26 | 2018-06-26 | A kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter and preparation method thereof |
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| CN (1) | CN108879058A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112018481A (en) * | 2020-08-07 | 2020-12-01 | 中国电子科技集团公司第三十八研究所 | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line |
| CN113163575A (en) * | 2021-05-10 | 2021-07-23 | 西安频谱电子信息科技有限责任公司 | Multilayer board microwave power circuit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705962A (en) * | 1996-12-31 | 1998-01-06 | Hughes Electronics | Microwave power dividers and combiners having an adjustable terminating resistor |
| CN201303043Y (en) * | 2008-11-25 | 2009-09-02 | 南京理工大学 | Microstrip dual-band power distributor with loading branch |
-
2018
- 2018-06-26 CN CN201810666837.8A patent/CN108879058A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705962A (en) * | 1996-12-31 | 1998-01-06 | Hughes Electronics | Microwave power dividers and combiners having an adjustable terminating resistor |
| CN201303043Y (en) * | 2008-11-25 | 2009-09-02 | 南京理工大学 | Microstrip dual-band power distributor with loading branch |
Non-Patent Citations (1)
| Title |
|---|
| 卢绍英等: ""基于平面埋阻技术的S波段功分器设计"", 《电脑知识与技术》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112018481A (en) * | 2020-08-07 | 2020-12-01 | 中国电子科技集团公司第三十八研究所 | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line |
| CN112018481B (en) * | 2020-08-07 | 2021-07-23 | 中国电子科技集团公司第三十八研究所 | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line |
| CN113163575A (en) * | 2021-05-10 | 2021-07-23 | 西安频谱电子信息科技有限责任公司 | Multilayer board microwave power circuit |
| CN113163575B (en) * | 2021-05-10 | 2023-09-26 | 西安频谱电子信息科技有限责任公司 | Multilayer board microwave power circuit |
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Application publication date: 20181123 |
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