CN108878395A - 电子封装件及其制法 - Google Patents

电子封装件及其制法 Download PDF

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Publication number
CN108878395A
CN108878395A CN201710382542.3A CN201710382542A CN108878395A CN 108878395 A CN108878395 A CN 108878395A CN 201710382542 A CN201710382542 A CN 201710382542A CN 108878395 A CN108878395 A CN 108878395A
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China
Prior art keywords
bearing structure
packing piece
electronic
piece according
preparation
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CN201710382542.3A
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English (en)
Inventor
陈睿丰
张正楷
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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Publication of CN108878395A publication Critical patent/CN108878395A/zh
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Abstract

一种电子封装件及其制法，通过于一承载结构堆叠组合上堆叠天线基板，因而无需于该承载结构堆叠组合中增加布设面积，即可依需求规划天线长度，由此达到天线运行的需求。

Description

电子封装件及其制法
技术领域
本发明有关一种电子封装件，尤指一种具天线结构的电子封装件。
背景技术
随着电子产业的蓬勃发展，电子产品也逐渐迈向多功能、高性能的趋势。目前无线通讯技术已广泛应用于各式各样的消费性电子产品以利接收或发送各种无线信号。为了满足消费性电子产品的外观设计需求，无线通讯模块的制造与设计朝轻、薄、短、小的需求作开发，其中，平面天线(Patch Antenna)因具有体积小、重量轻与制造容易等特性而广泛利用于手机(cell phone)、个人数字助理(Personal Digital Assistant，简称PDA)等电子产品的无线通讯模块中。
图1为悉知无线通讯模块的立体示意图。如图1所示，该无线通讯模块1包括：一基板10、设于该基板10上的多个电子元件11、一天线结构12以及封装材13。该基板10为电路板并呈矩形体。该电子元件11设于该基板10上且电性连接该基板10。该天线结构12为平面型且具有一天线本体120与一导线121，该天线本体120通过该导线121电性连接该电子元件11。该封装材13覆盖该电子元件11与该部分导线121。
但是，悉知无线通讯模块1中，该天线结构12为平面型，故基于该天线结构12与该电子元件11之间的电磁辐射特性及该天线结构12的体积限制，而于制程中，该天线本体120难以与该电子元件11整合制作，亦即该封装材13仅覆盖该电子元件11，并未覆盖该天线本体120，致使封装制程的模具需对应该些电子元件11的布设区域，而非对应该基板10的尺寸，因而不利于封装制程。
再者，因该天线结构12为平面型，故当需增加该天线结构12的长度时，需于该基板10的表面上增加布设区域(未形成封装材13的区域)以形成该天线本体120，但该基板10的长宽尺寸均为固定，因而难以增加布设区域的面积，致使无法增加该天线结构12的长度，因而无法达到天线运行的需求。
因此，如何克服上述悉知技术的种种问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述悉知技术的种种缺陷，本发明揭露一种电子封装件及其制法，无需于该承载结构堆叠组合中增加布设面积，即可依需求规划天线长度，由此达到天线运行的需求
本发明的电子封装件，包括：承载结构堆叠组合，其包含通过多个支撑件相互堆叠的第一承载结构与第二承载结构，并于该第一承载结构与第二承载结构之间结合有电子元件；以及天线基板，其设于该第二承载结构上。
本发明复揭露一种电子封装件的制法，包括：提供一承载结构堆叠组合，其包含通过多个支撑件相互堆叠的第一承载结构与第二承载结构，并于该第一承载结构与第二承载结构之间结合有电子元件；以及设置天线基板于该第二承载结构上。
前述的制法中，该承载结构堆叠组合的制程包括：设置该支撑件与该电子元件于该第一承载结构上；形成包覆层于该第一承载结构上以包覆该电子元件与支撑件；以及形成该第二承载结构于该包覆层上，使该支撑件电性连接该第一承载结构与第二承载结构。
前述的制法中，该承载结构堆叠组合的制程包括：设置该电子元件于该第二承载结构上；以及将该第一承载结构通过该支撑件堆叠于该第二承载结构上。
前述的电子封装件及其制法中，该支撑件电性连接该第一承载结构与第二承载结构。
前述的电子封装件及其制法中，该电子元件电性连接该第二承载结构。
前述的电子封装件及其制法中，该电子元件为主动元件。
前述的电子封装件及其制法中，该天线基板形成有至少一天线布设层。
前述的电子封装件及其制法中，该天线基板以导电元件设于该第二承载结构上。
前述的电子封装件及其制法中，该天线基板以结合层设于该第二承载结构上。
前述的电子封装件及其制法中，复包括形成包覆层于该第一承载结构与第二承载结构之间以包覆该电子元件与支撑件。
前述的电子封装件及其制法中，复包括设置电子装置于该第一承载结构上。
由上可知，本发明的电子封装件及其制法中，通过先制作完该承载结构堆叠组合，再将该天线基板堆叠于该承载结构堆叠组合的第二承载结构上，以于制程中，包覆层无需配合该天线基板，使封装制程的模具能对应该第一承载结构或第二承载结构的尺寸，而有利于封装制程。
再者，利用该天线基板的设计，以依需求于该天线基板上规划天线布设区域，因而无需于该第一承载结构或第二承载结构的表面上增加布设区域，故相比于悉知技术，本发明能于预定的第一承载结构或第二承载结构尺寸下于该天线基板上规划该天线布设层的长度，因而得以达到天线运行的需求，且能使该电子封装件符合微小化的需求。
附图说明
图1为悉知无线通讯模块的立体示意图；以及
图2A至图2F为本发明的电子封装件的制法的第一实施例的剖面示意图；以及
图3A至图3F为本发明的电子封装件的制法的第二实施例的剖面示意图；其中，图3C’为对应图3C的另一实施例的剖面示意图。
符号说明
1 无线通讯模块
10 基板
11,21,31 电子元件
12 天线结构
120 天线本体
121 导线
13 封装材
2,3 电子封装件
2a,3a 承载结构堆叠组合
2b 连接器
2c,3c 封装结构
20,30 第一承载结构
20a,30a 第一侧
20b,30b 第二侧
200 第一绝缘层
201 第一线路层
21a 作用面
21b 非作用面
210,310 电极垫
211,212 保护膜
22,32 导电凸块
23,33 支撑件
24 固晶层
25,35 包覆层
26,36 第二承载结构
260,260’ 第二绝缘层
261,261’ 第二线路层
27a,27b 导电元件
270 块底下金属层
28 天线基板
280 天线布设层
29,39 绝缘保护层
330 核心块
331 导电材
34 底胶
37 结合层
9 承载板
90 离型层
91 黏着层
S 切割路径。
具体实施方式
以下通过特定的具体实施例说明本发明的实施方案，熟悉此技艺的人士可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技艺的人士的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“第一”、“第二”及“一”等用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2F为本发明的电子封装件2的制法的第一实施例的剖面示意图。
如图2A所示，于一承载板9上设有第一承载结构20，该第一承载结构20具有相对的第一侧20a与第二侧20b，且该第一承载结构20以其第二侧20b结合至该承载板9上。接着，于该第一侧20a上形成多个电性连接该第一承载结构20的支撑件23，且设置至少一电子元件21于该第一承载结构20的第一侧20a上。
于本实施例中，该第一承载结构20为无核心层(coreless)的线路构造，其包括至少一第一绝缘层200与设于该第一绝缘层200上的一第一线路层201，如线路重布层(redistribution layer，简称RDL)。例如，形成该第一线路层201的材料为铜，且形成该第一绝缘层200的材料为如聚对二唑苯(Polybenzoxazole，简称PBO)、聚酰亚胺(Polyimide，简称PI)、预浸材(Prepreg，简称PP)等的介电材。
此外，该承载板9例如为半导体材料(如硅或玻璃)的圆形板体，其上以涂布方式依序形成有一离型层90与一黏着层91，以供该第一承载结构20设于该黏着层91上。
又，该支撑件23例如为柱状体、线状体或球状体，其设于该第一线路层201上并电性连接该第一线路层201，且形成该支撑件23的材料为如铜、金的金属材或焊锡材。应可理解地，该支撑件23的种类繁多，例如也可为被动元件，并不限于上述。
另外，该电子元件21为主动元件、被动元件或其二者组合，且该主动元件例如为半导体芯片，而该被动元件例如为电阻、电容及电感。于本实施例中，该电子元件21为半导体芯片，其具有相对的作用面21a与非作用面21b，该电子元件21以其非作用面21b通过一固晶层24黏固于该第一承载结构20的第一侧20a上，且该作用面21a具有多个电极垫210，并于该电极垫210上形成有导电凸块22与两层覆盖该些电极垫210与导电凸块22的保护膜211,212，其中，该保护膜211,212例如为聚对二唑苯(PBO)，且该导电凸块22为如导电线路、焊球的圆球状、或如铜柱、焊锡凸块等金属材的柱状、或焊线机制作的钉状(stud)，但不限于此。
如图2B所示，形成一包覆层25于该第一承载结构20的第一侧20a上，以令该包覆层25包覆该电子元件21与该些支撑件23，再通过整平制程，令上层的保护膜212、该支撑件23的端面与该导电凸块22的端面外露于该包覆层25，使该包覆层25的上表面齐平上层的保护膜212、该支撑件23的端面与该导电凸块22的端面。
于本实施例中，该包覆层25为绝缘材，如聚酰亚胺(polyimide，简称PI)、干膜(dryfilm)、环氧树脂(epoxy)或封装材(moldingcompound)，其可用压合(lamination)或模压(molding)的方式形成于该第一承载结构20的第一侧20a上。
此外，该整平制程通过研磨方式，移除该支撑件23、保护膜212、导电凸块22与包覆层25的部分材料，而使该包覆层25的上表面齐平保护膜212、该支撑件23的端面与该导电凸块22的端面。
如图2C所示，形成一第二承载结构26于该包覆层25上，使该第二承载结构26堆叠于该第一承载结构20上以形成一承载结构堆叠组合2a，且令该第二承载结构26电性连接该些支撑件23与该导电凸块22。
于本实施例中，该第二承载结构26为无核心层的线路构造，其包括多个第二绝缘层260,260’、及设于该第二绝缘层260,260’上的多个如RDL的第二线路层261,261’，且最外层的第二绝缘层260’可作为防焊层，以令最外层的第二线路层261’外露于该防焊层。或者，该第二承载结构26也可仅包括单一第二绝缘层260及单一第二线路层261。
此外，形成该第二线路层261,261’的材料为铜，且形成该第二绝缘层260,260’的材料为如聚对二唑苯(PBO)、聚酰亚胺(PI)、预浸材(PP)的介电材。
又，形成多个如焊球的导电元件27a于最外层的第二线路层261’上。例如，可形成一凸块底下金属层(Under Bump Metallurgy，简称UBM)270于最外层的第二线路层261’上，以利于结合该导电元件27a。
如图2D所示，接置一天线基板28于该些导电元件27a上。
于本实施例中，该天线基板28为封装基板型式，其可利用RDL制程形成有至少一天线布设层280。
如图2E所示，移除该承载板9及其上的离型层90与黏着层91。之后，先翻转整体结构，再形成多个如焊球的导电元件27b于该第一承载结构20的第二侧20b上，以接置电子装置，例如至少一连接器2b或如***级封装(System in package，简称SiP)的封装结构2c。
于本实施例中，可形成一如防焊层的绝缘保护层29于该第一承载结构20的第二侧20b上，且于该绝缘保护层29中形成多个开孔，以令该第一线路层201外露于该些开孔，从而供结合该些导电元件27b。
如图2F所示，沿如图2E所示的切割路径S进行切单制程，以完成该电子封装件2的制法。
本实施例的制法中，先制作完该承载结构堆叠组合2a，再将该天线基板28堆叠于该承载结构堆叠组合2a的第二承载结构26上，以于制程中，该包覆层25无需配合该天线基板28，使封装制程的模具能对应该第一承载结构20的尺寸，因而有利于封装制程。
此外，利用该天线基板28的设计，以依需求于该天线基板28上规划天线布设区域，因而无需于该第一或第二承载结构20,26的表面上增加布设区域，故相比于悉知技术，本发明的制法能于预定的第一或第二承载结构20,26尺寸下于该天线基板28上规画该天线布设层280的长度，因而得以达到天线运行的需求，且能使该电子封装件2符合微小化的需求。
图3A至图3F为本发明的电子封装件3的第二实施例的制法的剖视示意图。本实施例与第一实施例的差异在于制程的不同，其组成构件大致相同，故以下仅说明相异处，而不再赘述相同处。
如图3A所示，提供一设有多个支撑件33的第一承载结构30、及一设有电子元件31的第二承载结构36。
所述的第一承载结构30具有相对的第一侧30a及第二侧30b，且该第一侧30a及第二侧30b上形成有例如防焊层的绝缘保护层39。于本实施例中，该第一承载结构30为封装基板，其包含具有核心层的线路构造或无核心层的线路构造，该线路构造包含介电层及形成于该介电层上形成线路层，如扇出(fan out)型RDL。具体地，形成该介电层的材料例如为预浸材(PP)、聚酰亚胺(PI)、环氧树脂或玻纤(glassfiber)，且形成该线路层的材料为金属，如铜。应可理解地，该第一承载结构30亦可为其它承载芯片的载体，如有机板材、晶圆(wafer)、或其它具有金属布线(routing)的载板，并不限于上述，且该第一承载结构30因属于板材而可免用如图2A所示的承载件9。
此外，该第二承载结构36为封装基板，其包含具有核心层的线路构造或无核心层的线路构造，该线路构造包含介电层及形成于该介电层上形成线路层，如扇出型RDL。具体地，形成该介电层的材料例如为预浸材(PP)、聚酰亚胺(PI)、环氧树脂或玻纤(glassfiber)，且形成该线路层的材料为金属，如铜。应可理解地，该第二承载结构36亦可为其它承载芯片的载体，如有机板材、晶圆(wafer)、或其它具有金属布线(routing)的载板，并不限于上述。
所述的电子元件31以其电极垫310通过多个导电凸块32以覆晶方式电性连接该第二承载结构36。
所述的支撑件33形成于该第一承载结构30的第一侧30a上。于本实施例中，该支撑件33为多种材料形式，其具有核心块330与包覆该核心块330的导电材331，其中，该核心块330为如塑料球的绝缘材或如铜球的金属材，且该导电材331为焊锡材，如镍锡、锡铅或锡银，但不限于此。应可理解地，该支撑件33亦可为被动元件或如图2A所示的单一材料形式。
如图3B所示，对应结合该些支撑件33于该第二承载结构36上，并回焊该导电材331，使该第一承载结构30堆叠于该第二承载结构36上以形成一承载结构堆叠组合3a，且该电子元件31位于该第一承载结构30与该第二承载结构36之间。
于本实施例中，该第一承载结构30通过该些支撑件33电性连接该第二承载结构36。
如图3C所示，形成一包覆层35于该第一承载结构30与该第二承载结构36之间，以包覆该些支撑件33、导电凸块32与该电子元件31。
于本实施例中，如图3C’所示，亦可先形成底胶34于该第二承载结构36与该电子元件31之间以包覆该些导电凸块32，再形成该包覆层35，以包覆该些支撑件33、底胶34与该电子元件31。
如图3D所示，于该第二承载结构36上通过一结合层37黏固结合一天线基板28。
如图3E所示，形成多个如焊球的导电元件27b于该第一承载结构30的第二侧30b上，以接置电子装置，例如至少一连接器2b或如***级封装(SiP)的封装结构3c。
如图3F所示，沿如图3E所示的切割路径S进行切单制程，以完成该电子封装件3的制法。
本实施例的制法中，先制作完该承载结构堆叠组合3a，再将该天线基板28堆叠于该承载结构堆叠组合3a的第二承载结构36上，以于制程中，该包覆层35无需配合该天线基板28，使封装制程的模具能对应该第一或第二承载结构30,36的尺寸，因而有利于封装制程。
此外，利用该天线基板28的设计，以依需求于该天线基板28上规划天线布设区域，因而无需于该第一或第二承载结构30,36的表面上增加布设区域，故相比于悉知技术，本发明的制法能于预定的第一或第二承载结构30,36尺寸下于该天线基板28上规画该天线布设层280的长度，因而得以达到天线运行的需求，且能使该电子封装件3符合微小化的需求。
本发明还提供一种电子封装件2,3，其包括：一承载结构堆叠组合2a,3a以及一天线基板28。
所述的承载结构堆叠组合2a,3a包含通过多个支撑件23,33相互堆叠的第一承载结构20,30与第二承载结构26,36，并于该第一承载结构20,30与第二承载结构26,36之间设有至少一电子元件21,31。
所述的天线基板28叠设于该第二承载结构26,36上。
于一实施例中，该支撑件23,33电性连接该第一承载结构20,30与第二承载结构26,36。
于一实施例中，该电子元件21,31电性连接该第二承载结构26,36。
于一实施例中，该电子元件21,31为主动元件。
于一实施例中，该天线基板28形成有至少一天线布设层280。
于一实施例中，该天线基板28以多个导电元件27a设于该第二承载结构26上。
于一实施例中，该天线基板28以结合层37设于该第二承载结构36上。
于一实施例中，所述的电子封装件2,3复包括一包覆层25,35，形成于该第一承载结构20,30与第二承载结构26,36之间以包覆该电子元件21,31与支撑件23,33。
于一实施例中，所述的电子封装件2,3复包括设于该第一承载结构20,30上的电子装置。
综上所述，本发明的电子封装件及其制法中，主要通过将天线基板设于整合有电子元件的承载结构堆叠组合上的设计，以于制程中，包覆层无需配合天线基板，使封装制程的模具能对应该承载结构堆叠组合的第一或第二承载结构的尺寸，因而有利于封装制程。
此外，利用该天线基板的设计，而无需于该第一或第二承载结构的表面上增加布设区域，故本发明能于预定的第一或第二承载结构尺寸下于该天线基板上规画该天线布设层的长度，因而得以达到天线运行的需求，且能使该电子封装件符合微小化的需求。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (20)

1.一种电子封装件，其特征为，该电子封装件包括：
承载结构堆叠组合，其包含通过多个支撑件相互堆叠的第一承载结构与第二承载结构，并于该第一承载结构与第二承载结构之间结合有电子元件；以及
天线基板，其设于该第二承载结构上。
2.根据权利要求1所述的电子封装件，其特征为，该支撑件电性连接该第一承载结构与第二承载结构。
3.根据权利要求1所述的电子封装件，其特征为，该电子元件电性连接该第二承载结构。
4.根据权利要求1所述的电子封装件，其特征为，该电子元件为主动元件。
5.根据权利要求1所述的电子封装件，其特征为，该天线基板形成有至少一天线布设层。
6.根据权利要求1所述的电子封装件，其特征为，该天线基板以导电元件设于该第二承载结构上。
7.根据权利要求1所述的电子封装件，其特征为，该天线基板以结合层设于该第二承载结构上。
8.根据权利要求1所述的电子封装件，其特征为，该电子封装件还包括形成于该第一承载结构与第二承载结构之间以包覆该电子元件与支撑件的包覆层。
9.根据权利要求1所述的电子封装件，其特征为，该电子封装件还包括设于该第一承载结构上的电子装置。
10.一种电子封装件的制法，其特征为，该制法包括：
提供一承载结构堆叠组合，其包含通过多个支撑件相互堆叠的第一承载结构与第二承载结构，并于该第一承载结构与第二承载结构之间结合有电子元件；以及
设置天线基板于该第二承载结构上。
11.根据权利要求10所述的电子封装件的制法，其特征为，该承载结构堆叠组合的制程包括：
设置该支撑件与该电子元件于该第一承载结构上；
形成包覆层于该第一承载结构上以包覆该电子元件与支撑件；以及
形成该第二承载结构于该包覆层上，使该支撑件电性连接该第一承载结构与第二承载结构。
12.根据权利要求10所述的电子封装件的制法，其特征为，该承载结构堆叠组合的制程包括：
设置该电子元件于该第二承载结构上；以及
将该第一承载结构通过该支撑件堆叠于该第二承载结构上。
13.根据权利要求10所述的电子封装件的制法，其特征为，该支撑件电性连接该第一承载结构与第二承载结构。
14.根据权利要求10所述的电子封装件的制法，其特征为，该电子元件电性连接该第二承载结构。
15.根据权利要求10所述的电子封装件的制法，其特征为，该电子元件为主动元件。
16.根据权利要求10所述的电子封装件的制法，其特征为，该天线基板形成有至少一天线布设层。
17.根据权利要求10所述的电子封装件的制法，其特征为，该天线基板以导电元件设于该第二承载结构上。
18.根据权利要求10所述的电子封装件的制法，其特征为，该天线基板以结合层设于该第二承载结构上。
19.根据权利要求10所述的电子封装件的制法，其特征为，该制法还包括形成包覆层于该第一承载结构与第二承载结构之间以包覆该电子元件与支撑件。
20.根据权利要求10所述的电子封装件的制法，其特征为，该制法还包括设置电子装置于该第一承载结构上。
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