CN108796314A - A kind of preparation method of alusil alloy used for electronic packaging - Google Patents
A kind of preparation method of alusil alloy used for electronic packaging Download PDFInfo
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- CN108796314A CN108796314A CN201810777513.1A CN201810777513A CN108796314A CN 108796314 A CN108796314 A CN 108796314A CN 201810777513 A CN201810777513 A CN 201810777513A CN 108796314 A CN108796314 A CN 108796314A
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- alusil alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/026—Alloys based on aluminium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/248—Thermal after-treatment
Abstract
The invention discloses a kind of preparation methods of alusil alloy used for electronic packaging, include the following steps：S1：Spray deposition blank-making；S2：Homogenization Treatments；S3：Densification；S4：Ausrolling；S5：Annealing.The present invention directly manufactures final thickness in conjunction with traditional plastic translating means or close to the alusil alloy of final thickness by quickly solidifying, to reduce the mechanical processings such as wire cutting, sawing, turning, stock utilization and production efficiency are substantially increased, industrialized production is suitble to；There is good mechanical processing, coating surface and welding performance using the alusil alloy that this method obtains, meet the requirement of Electronic Packaging, be suitable for Electronic Packaging cover plate materials.
Description
Technical field
The present invention relates to the processing and forming fields of electronic package material, and in particular to a kind of alusil alloy used for electronic packaging
Preparation method.
Background technology
Electronic Packaging alusil alloy is by aluminum substrate and silicon phase composition, also referred to as Al/Sip composite materials.Electronic Packaging aluminium silicon
Alloy integrates the superperformance of aluminum substrate and silicon phase, have thermal conductivity is high, coefficient of thermal expansion is controllable, specific strength is high, density it is small (<
2.7g/cm3), easy to process and plating the features such as, and the content of silicon (27.7%) and aluminium (8.1%) in the earth's crust is very rich
Richness, of low cost, the material is environmentally safe, harmless, facilitates recycling.Therefore, alusil alloy can expire
Sufficient hyundai electronics encapsulate the requirement to the mechanics of materials, ermal physics and processing performance, are answered in fields such as Aeronautics and Astronautics, electronics, communications
With having a extensive future, especially high power density and the field high to density requirements.
However, often forming coarse starlike primary silicon phase and needle using the alusil alloy of traditional melting and casting method manufacture
Shape eutectic silicon, one side primary silicon phase size can reach hundreds of microns, matrix caused seriously to be isolated, and can not be formed certain
The light sheet of thickness；The defects of there are hole, crackles in another aspect primary silicon phase, causes the plasticity of alloy very low, it is difficult to logical
Later continue the mechanical property that deformation processing improves alloy；In addition, silicon mutually often has sharp corner angle in melt cast alloys, this will lead
Alloy is caused to generate stress concentration in sharp corner under service condition and fail and even crack.Metamorphism treatment is to reduce and change silicon phase
The effective means of size and shape, however the effect of Metamorphism treatment is limited and silicone content is generally relatively low, at the same alterant plus
Enter the technological parameters such as amount, melt temperature, soaking time must be strictly controlled, technology stability is poor.
According to the characteristics of alusil alloy and result of study shows (Hogg SC, et al.Microstructural
characterization of spray formed Si-30Al for thermal management
applications.Scripta Materialia,2006,55(1):111-114；Jia YD et
al.Microstructure and thermal expansion behavior of spray-deposited Al-
50Si.Materials&Design,2014,57:585-591), it is that the practical aluminium silicon of exploitation closes to improve cooling velocity or degree of supercooling
The effective way of gold, quick setting method can limit refinement silicon phase and obtain supersaturated matrix, shape under the conditions of subsequent heat
It is pointed at the silicon phase of passivation, wherein jet deposition is to be smashed using high-speed flow, cool down metal bath, incomplete in atomized drop
The deposition ingot blank of definite shape and size is deposited into when solidification.Some holes can be remained in deposition ingot blank, lead to material
Relative density can only achieve 80~96%, need by densification.Jet deposition combination hot isostatic pressing (HIP), such as English
State's Osprey metal companies prepare the method for different silicon content aluminium silicon alloys using this method and have obtained commercial applications (EP
0839078B1, US6312535B1), be obtain big specification ingot blank it is important by way of and be used widely.
The larger cylindrical block material of usually specification obtained using jet deposition combination hot isostatic pressing, and heat etc.
The equipment requirement of static pressure and of high cost；And Electronic Packaging cover plate materials are usually the plank of 1~2mm thickness.In this way, jet deposition ingot
Base will be not only densified by hot isostatic pressing, and it needs the processes such as to machine, flatten again by wire cutting, not only increases flow
And take considerable time, greatly improve production cost.
Invention content
It is an object of the invention to overcome shortcoming and defect in the prior art, a kind of alusil alloy used for electronic packaging is provided
Preparation method, prepared using quick solidification jet deposition have uniformly, the alusil alloy ingot blank of fine tissue, use is multi-direction
Flat-die forging or the densification for squeezing progress ingot blank obtain alloy slab, and aluminium used for electronic packaging is made by slab rolling forming
Silicon alloy.The present invention can directly obtain nearly whole thickness according to the size requirements of Electronic Packaging cover plate materials using roll forming
Plank, to reduce process, shorten manufacturing time.Due to inevitably there is residual porosity (5% in jet deposition ingot blank
~20%), and rolling deformation is limited to the densification effect of ingot blank, therefore before rolling deformation, passes through multi-direction freedom first
Forging squeezes raising consistency, obtains the slab of certain size.Matrix is aluminium solid solution, balance in aluminium silicon Electronic Packaging alloy
Solid solubility of the silicon in aluminium is very low under state, and matrix can be regarded as fine aluminium；As temperature increases, the softening degree of alusil alloy
Obviously, this just provides advantage to thermal deformation processing.The technology stability of the present invention is good, and reduces production cost, fits
Close industrialized production.The present invention is achieved by the following technical solutions：
A kind of preparation method of alusil alloy used for electronic packaging, it is characterised in that include the following steps：
S1：Spray deposition blank-making：Al-Si alloy melt jet deposition is obtained alusil alloy and deposits ingot by melting alusil alloy
Base；
S2：Homogenization Treatments：Alusil alloy deposition ingot blank is subjected to homogenization heat treatment, heating temperature is 350~450
DEG C, soaking time is 12~48h；
S3：Densification：Alusil alloy after step S2 Homogenization Treatments is deposited into ingot blank, is used after Vehicle Processing
Multi-direction flat-die forging or pressing method carry out densification, prepare alusil alloy slab, carry out the deposition of densification
The silicon phase size of ingot blank is 3~18 μm, and even dispersion is distributed in the deposition ingot blank in aluminum substrate, and the phase of alusil alloy slab
99% is higher than to density, and silicon is mutually without apparent roughening and fragmentation phenomenon；
S4：Ausrolling：
(1) by alusil alloy slab in dynamic recrystallization temperature range rolling-cogging, deflection is 5~20%, rolling speed
Degree is 30~60mmin-1；
(2) by alusil alloy slab then dynamic recovery temperature range carry out multi- pass rolling, deflection be 10~
30%, mill speed is 40~80mmin-1；
(3) when alusil alloy slab is close to final thickness, the zerolling in, finish to gauge deflection is 3~10%, is rolled
Speed processed is 10~50mmin-1Obtain rolled plate；
S5：Annealing：
The rolled plate that S4 is obtained keeps the temperature 6~12h in 340~380 DEG C of constant temperature, that is, obtains aluminium silicon used for electronic packaging and close
Gold.
Further, melting alusil alloy makees raw material using aluminium ingot and monocrystalline silico briquette in step S1, and wherein Si contents are not high
In 42%, Al be surplus.
Further, melting aluminium ingot purity is 99.95% in step S1, and the preparation method of the Al-Si alloy melt is：
In medium frequency induction melting furnace, temperature is 1200~1400 DEG C, and load weighted Al and Si meltings are obtained alloy melt, are dropped later
Temperature is to 850~1000 DEG C and keeps the temperature 10~15min.
Further, in step S1, spray deposition blank-making method is：Al-Si alloy melt is poured into jet deposition equipment
Middle preheated tundish crucible, the high pressure gas ejected using atomizer, to carrying out mist by the alloy melt of diversion pipe
Change, atomizing pressure is 0.7~1.2MPa, and the scan frequency of atomizer is 1~5Hz, is then deposited into take-up reel and obtains aluminium silicon
The temperature of alloy deposition ingot blank, the tundish crucible and diversion pipe be 700~900 DEG C, take-up reel decrease speed be 10~
30mm/min, reception disc spin speed are 60~120rpm, a diameter of 2.0~4.0mm of diversion pipe, and exporting to for diversion pipe connect
The deposited distance of closing quotation is 350~500mm.Deposition ingot blank is obtained in take-up reel, the size for depositing ingot blank isRelative density by jet deposition ingot blank made from the first step is 88~96%, and fine microstructures are equal
It is even.
Further, the heating temperature of step S2 Homogenization Treatments is 350~450 DEG C, and soaking time is 12~48h, is sunk
100~200 DEG C are cooled to the furnace hereinafter, being air-cooled to room temperature after product ingot blank heat preservation.
Further, step S3 selections forging method, ingot blank smithing technological parameter are：Ingot blank keeps the temperature 2 at 400~500 DEG C
It after~4h, is forged, deflection is 10~30%, and Soft reduction rate is 0.1~1m/min.
Further, step S3 selections pressing method, ingot blank extrusion process parameters are：Using forward direction on 800t extruders
Fashion of extrusion is squeezed, and deposition ingot blank keeps the temperature 2~4h at 350~460 DEG C before squeezing, and extrusion ratio is 10~21, will before squeezing
Each extrusion die is placed in heating furnace, and heat preservation is fully warmed-up at 300~350 DEG C.
Further, during the ausrolling of step S4, the dynamic recrystallization temperature range is 420~500 DEG C, institute
It is 320~400 DEG C to state dynamic recovery temperature range.
Further, during the ausrolling of step S4, use commutation rolling to reduce plank anisotropy.
Further, during the ausrolling of step S4, finishing temperature is 200~350 DEG C.
Further, the specific annealing method of step S5 is：Rolled plate is warming up to 340 with 5~10 DEG C/min
~380 DEG C, constant temperature keeps the temperature 6~12h, cools to 150~200 DEG C after heat preservation with the furnace, is air-cooled to room temperature later, that is, produces
Alusil alloy used for electronic packaging.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) alusil alloy ingot blank is produced using quickly solidification jet deposition, makes ingot blank that there is uniform, tiny microcosmic group
Knit, and silicon mutually with nearly spherical particle Dispersed precipitate in aluminum substrate, to improve the quality of original ingot blank；By it is multi-direction from
By forging or squeeze promotion consistency, improve ingot blank tissue and close performance, ensure ingot blank under moderate finite deformation amount roll forming without
Cracking；In addition, the relative density of the slab by densification is higher than 99%, densification need not be realized by rolling, from
And roll forming can be carried out at a lower temperature, be conducive to control Deformation structure and improves alloy property.
(2) since the present invention by multi-direction flat-die forging in addition to using acquisition slab is squeezed, also manufacturing slab, injection is heavy
Product ingot blank, which directly carries out forging processing, can obtain big sectional dimension slab, and reduce the anisotropy in slab, and rolling is opened
Base process is not allowed to be also easy to produce cracking.
(3) present invention manufactures plank using ausrolling, on the one hand, rolling is conducive to improve rolling efficiency, drop under high temperature
Low slab anisotropy, and avoid the vertical direction of extrusion from rolling or commutate and crack when rolling；On the other hand, it is rolled then under low temperature
Be conducive to improve plate surface quality and dimensional accuracy, to obtain the sheet alloy of nearly whole thickness；In addition, finish to gauge is compared with low temperature
The defects of degree is lower to carry out, and small deformation amount can be to avoid cracking, is conducive to improve lumber recovery.
(4) synergistic effect of the invention by spray deposition blank-making-forging/three kinds of technique of compactly extruding-roll forming,
Final to produce the excellent alusil alloy used for electronic packaging of Physical and mechanical properties, thermal conductivity is more than 146W/mK, thermally expands system
Number is 14~20 × 10-6Between/K, density is less than 2.7g/cm3, tensile strength is higher than 150MPa, air-tightness not less than 5.0 ×
10-8Pa·m3/ s, Si phase are mainly uniformly distributed in tiny particle in aluminum substrate, and alloy has certain elongation percentage, and
Si phases are well combined with Al basal body interfaces；Mechanical processing, coating surface and the welding performance of the alusil alloy used for electronic packaging
Well.Such alloy disclosure satisfy that performance requirement of the fields such as Aeronautics and Astronautics, naval vessel to Electronic Packaging cover plate materials.
(5) alusil alloy used for electronic packaging is manufactured using preparation method of the present invention, the plank obtained by roll forming is thick
Degree is final thickness or close to final thickness, reduces the machining amounts such as wire cutting, turning, improve material utilization rate and
Production efficiency is suitble to industrialized production.In order to better understand and implement, this hair is described in detail With reference to embodiment
It is bright.
Description of the drawings
Fig. 1 is the preparation process flow of the alusil alloy used for electronic packaging of the present invention；
Fig. 2 is the Electronic Packaging Al-27%Si cover board alloy microstructures that the embodiment of the present invention 2 obtains；
Fig. 3 is the Electronic Packaging Al-34%Si cover board alloy microstructures that the embodiment of the present invention 3 obtains；
Specific implementation mode
For a further understanding of the present invention, with reference to specific embodiment to jet deposition Electronic Packaging provided by the invention
It is described in detail with the roll-forming method of alusil alloy, protection scope of the present invention is not limited by the following examples.Fig. 1
It is the preparation process flow of Electronic Packaging cover board alloy of the present invention.
Embodiment 1Al-22%Si Electronic Packaging alusil alloys and preparation method thereof
The alusil alloy preparation method used for electronic packaging of the present embodiment carries out according to the following steps：
(1) raw material is monocrystalline silicon, fine aluminium (99.95%Al), and alloying component carries out dispensing, food ingredient by weight percentage
For：Si：22%, Al：78%；
(2) in intermediate frequency furnace, 780~860 DEG C is warming up to and melts Al, be brought rapidly up after being completely melt to 1200~
1300 DEG C, the Si for preparing weight is added, 5~10min is sufficiently stirred using graphite rod, by 30%NaCl+47%KCl+23% ice
Spar is placed in graphite cover, is stretched into melt bottom and is carried out slag making, hexachlorethane degasification is used in combination, and 850~950 DEG C of heat preservations 10 are cooled to
~15min；
(3) tundish crucible uses resistance heating to 700~800 DEG C, and keeps the temperature 30min, during alloy melt is poured into
Between packet crucible, open atomization air source, be atomized by atomizer, gas pressure be 0.7~0.9MPa, the rotation of take-up reel
Speed is 60~120rpm, and the decrease speed of take-up reel is 20~30mm/min, and atomized drop constantly deposits in take-up reel
To deposition ingot blank, ingot blank diameter 250mm, height 400mm；
(4) Al-22%Si alloy depositions ingot blank is homogenized to heat treatment at 400 DEG C for 24 hours；
(5) ingot blank keeps the temperature 4h at 360 DEG C, using 800 tons of horizontal extruders will deposit ingot blank be squeezed into section be 200 ×
The slab of 12mm (extrusion ratio is about 21)；
(6) it squeezes slab and keeps the temperature 3h at 400 DEG C, along its length rolling-cogging, deflection is 15~30%, mill speed
For 40~60m/min, thickness drops to 10mm from 12mm；Slab after cogging is reheated to 350 DEG C and keeps the temperature 1h, rolling speed
50~80m/min is spent, every time deflection is 15~30%, keeps the temperature 0.5h between passage at 350 DEG C, the final thickness that obtains is 2mm
Slab；Heating of plate blank to 220 DEG C and is kept the temperature into 1h, carries out multi- pass rolling, mill speed 20m/min, obtaining thickness is
The first base of the plank of 1.0mm；During ausrolling, use commutation rolling to reduce plank anisotropy；
(7) plank that hot rolling obtains anneal 6h at 340 DEG C, acquisition Electronic Packaging Al-22%Si cover board alloys.
The related physical of above-mentioned Al-22%Si cover boards alloy, mechanical property are listed in table 1, illustrate that the alloy meets electronic seal
Fill the performance requirement to cover plate materials.
Embodiment 2Al-27%Si Electronic Packaging alusil alloys and preparation method thereof
The alusil alloy preparation method used for electronic packaging of the present embodiment carries out according to the following steps：
(1) raw material is monocrystalline silicon, fine aluminium (99.95%Al), and alloying component carries out dispensing, food ingredient by weight percentage
For：Si：27%, Al：73%；
(2) in intermediate frequency furnace, 780~860 DEG C is warming up to and melts Al, be brought rapidly up after being completely melt to 1250~
1350 DEG C, the Si for preparing weight is added, 5~10min is sufficiently stirred using graphite rod, by 30%NaCl+47%KCl+23% ice
Spar is placed in graphite cover, is stretched into melt bottom and is carried out slag making, hexachlorethane degasification is used in combination, is cooled to 950~1050 DEG C of heat preservations
10~15min；
(3) tundish crucible uses resistance heating to 800~900 DEG C, and keeps the temperature 30min, during alloy melt is poured into
Between packet crucible, open atomization air source, be atomized by atomizer, gas pressure be 0.8~1.0MPa, the rotation of take-up reel
Speed is 60~120rpm, and the decrease speed of take-up reel is 20~30mm/min, and atomized drop constantly deposits in take-up reel
To deposition ingot blank, ingot blank diameter 250mm, height 400mm；
(4) Al-27%Si alloy depositions ingot blank is homogenized to heat treatment at 400 DEG C for 24 hours；
(5) ingot blank keeps the temperature 4h at 400 DEG C, using 800 tons of horizontal extruders will deposit ingot blank be squeezed into section be 200 ×
The slab of 12mm (extrusion ratio is about 20)；
(6) it squeezes slab and keeps the temperature 3h at 420 DEG C, along its length rolling-cogging, deflection is 10~20%, mill speed
For 30~50m/min, thickness drops to 10mm from 12mm；Slab after cogging is reheated to 350 DEG C and keeps the temperature 1h, along cogging
Direction rolls, 40~60m/min of mill speed, every time deflection is 10~25%, 0.5h is kept the temperature at 350 DEG C between passage, most
The slab that thickness is 2mm is obtained eventually；Heating of plate blank to 250 DEG C and is kept the temperature into 1h, carry out multi- pass rolling, mill speed be 20~
40m/min obtains the first base of plank that thickness is 1.2mm；During ausrolling, use commutation rolling to reduce plank respectively to different
Property；
(7) plank that hot rolling obtains anneal 6h at 360 DEG C, acquisition Electronic Packaging Al-27%Si cover board alloys.
The related physical of above-mentioned Al-27Si cover boards alloy, mechanical property are listed in table 1, illustrate that the alloy meets Electronic Packaging
To the performance requirement of cover plate materials.Fig. 2 is microcosmic group of the Electronic Packaging Al-27%Si cover board alloys that the embodiment of the present invention 2 obtains
It knits, the arrow direction in figure is rolling direction.
Embodiment 3Al-34%Si Electronic Packaging alusil alloys and preparation method thereof
The alusil alloy preparation method used for electronic packaging of the present embodiment carries out according to the following steps：
(1) raw material is monocrystalline silicon, fine aluminium (99.95%Al), and alloying component carries out dispensing, food ingredient by weight percentage
For：Si：34%, Al：66%；
(2) in intermediate frequency furnace, 780~860 DEG C is warming up to and melts Al, be brought rapidly up after being completely melt to 1250~
1350 DEG C, the Si for preparing weight is added, 5~10min is sufficiently stirred using graphite rod, by 30%NaCl+47%KCl+23% ice
Spar is placed in graphite cover, is stretched into melt bottom and is carried out slag making, hexachlorethane degasification is used in combination, is cooled to 950~1050 DEG C of heat preservations
10~15min；
(3) tundish crucible uses resistance heating to 800~900 DEG C, and keeps the temperature 30min, during alloy melt is poured into
Between packet crucible, open atomization air source, be atomized by atomizer, gas pressure be 0.8~1.0MPa, the rotation of take-up reel
Speed is 60~120rpm, and the decrease speed of take-up reel is 20~30mm/min, and atomized drop constantly deposits in take-up reel
To deposition ingot blank, ingot blank diameter 250mm, height 300mm；
(4) Al-34%Si alloy depositions ingot blank is homogenized to heat treatment at 400 DEG C for 24 hours；
(5) ingot blank keeps the temperature 4h at 460 DEG C, using 400 t hydraulic press along ingot blank it is axially free forging to 180mm, radially
By ingot blank rule side, and it is processed into the rectangular slab of 200 × 500 × 16mm；
(6) forging slab keeps the temperature 3h at 470 DEG C, and along the cogging of the directions 500mm, cogging deflection is 10~20%, rolling speed
Degree is 30~40m/min, and thickness drops to 14mm from 16mm；Slab after cogging is reheated to 350 DEG C and keeps the temperature 1h, and edge is opened
Base direction rolls, 40~50m/min of mill speed, every time deflection is 15~20%, and 0.5h is kept the temperature at 350 DEG C between passage,
It is final to obtain the slab that thickness is 2mm；Heating of plate blank to 280 DEG C and is kept the temperature into 1h, carries out multi- pass rolling, mill speed is
20m/min obtains the first base of plank that thickness is 1.5mm；During ausrolling, use commutation rolling to reduce plank respectively to different
Property.
(7) plank that hot rolling obtains anneal 6h at 380 DEG C, acquisition Electronic Packaging Al-34%Si cover board alloys.
The related physical of above-mentioned Al-34%Si cover boards alloy, mechanical property are listed in table 1, illustrate that the alloy meets electronic seal
Fill the performance requirement to cover plate materials.Fig. 3 is that the Electronic Packaging Al-34%Si cover board alloys that the embodiment of the present invention 3 obtains are microcosmic
It organizes, the arrow direction in figure is rolling direction.
Embodiment 4Al-42%Si Electronic Packaging alusil alloys and preparation method thereof
The alusil alloy preparation method used for electronic packaging of the present embodiment carries out according to the following steps：
(1) raw material is monocrystalline silicon, fine aluminium (99.95%Al), and alloying component carries out dispensing, food ingredient by weight percentage
For：Si：42%, Al：58%；
(2) in intermediate frequency furnace, 780~860 DEG C is warming up to and melts Al, be brought rapidly up after being completely melt to 1250~
1400 DEG C, the Si for preparing weight is added, 5~10min is sufficiently stirred using graphite rod, by 30%NaCl+47%KCl+23% ice
Spar is placed in graphite cover, is stretched into melt bottom and is carried out slag making, hexachlorethane degasification is used in combination, is cooled to 950~1000 DEG C of heat preservations
10~15min；
(3) tundish crucible uses resistance heating to 700~750 DEG C, and keeps the temperature 30min, during alloy melt is poured into
Between packet crucible, open atomization air source, atomization gas is nitrogen, is atomized by atomizer, the scan frequency of atomizer
For 1~5Hz, gas pressure is 0.9~1.2MPa, and the rotary speed of take-up reel is 80~120rpm, the decrease speed of take-up reel
For 10~30mm/min, atomized drop deposits constantly in take-up reel obtains deposition ingot blank, ingot blank diameter 250mm, height
300mm, relative density is 88~96%, and fine microstructures are uniform；
(4) Al-42%Si alloy depositions ingot blank is homogenized to heat treatment 12h at 350 DEG C, then cools to 100 with the furnace again
DEG C hereinafter, being air-cooled to room temperature；
(5) ingot blank keeps the temperature 4h at 500 DEG C, using 400 t hydraulic press along ingot blank it is axially free forging to 180mm, radially
By ingot blank rule side, and it is processed into the rectangular slab of 200 × 500 × 16mm；
(6) it squeezes slab and keeps the temperature 3h at 500 DEG C, along its length rolling-cogging, deflection is 5~10%, mill speed
For 30~40m/min, thickness drops to 10mm from 12mm；Slab after cogging is reheated to 400 DEG C and keeps the temperature 1h, along cogging
Direction rolls, 40~50m/min of mill speed, every time deflection is 10~20%, 0.5h is kept the temperature at 350 DEG C between passage, most
The slab that thickness is 2mm is obtained eventually；Heating of plate blank to 300 DEG C and is kept the temperature into 1h, carries out multi- pass rolling, mill speed 10m/
Min obtains the first base of plank that thickness is 1.0mm；
(7) plank that hot rolling obtains is placed in chamber type electric resistance furnace, is warming up to 380 DEG C with 5~10 DEG C/min, constant temperature heat preservation
12h cools to 150 DEG C with the furnace after heat preservation, be air-cooled to room temperature later, that is, produces and obtain Electronic Packaging Al-42%Si lids
Plate alloy.
The related physical of above-mentioned Al-42%Si cover boards alloy, mechanical property are listed in table 1, illustrate that the alloy meets electronic seal
Fill the performance requirement to cover plate materials.
The typical performance for the alusil alloy used for electronic packaging that 1 Examples 1 to 5 of table is prepared
The invention is not limited in the above embodiments, if the various changes or deformation to the present invention do not depart from the present invention
Spirit and scope, if these changes and deformation belong within the scope of the claim and equivalent technologies of the present invention, then this hair
It is bright to be also intended to comprising these changes and deformation.
Claims (10)
1. a kind of preparation method of alusil alloy used for electronic packaging, it is characterised in that include the following steps：
S1：Spray deposition blank-making：Melting alusil alloy prepares alusil alloy using jet deposition and deposits ingot blank；
S2：Homogenization Treatments：Alusil alloy deposition ingot blank is subjected to homogenization heat treatment；
S3：Densification：Alusil alloy after step S2 Homogenization Treatments is deposited into ingot blank, using multi-party after Vehicle Processing
Densification is carried out to flat-die forging or pressing method, prepares alusil alloy slab；
S4：Ausrolling：
(1) by alusil alloy slab in dynamic recrystallization temperature range rolling-cogging, deflection is 5~20%, and mill speed is
30~60mmin-1；
(2) alusil alloy slab is then subjected to multi- pass rolling in dynamic recovery temperature range, deflection is 10~30%, is rolled
Speed processed is 40~80mmin-1；
(3) when alusil alloy slab is close to final thickness, the zerolling in, finish to gauge deflection is 3~10%, rolling speed
Degree is 10~50mmin-1Obtain rolled plate；
S5：Annealing：
The rolled plate that S4 is obtained keeps the temperature 6~12h in 340~380 DEG C of constant temperature, that is, obtains alusil alloy used for electronic packaging.
2. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：Melting in step S1
Alusil alloy makees raw material using aluminium ingot and monocrystalline silico briquette, and wherein Si contents are surplus not higher than 42%, Al.
3. the preparation method of alusil alloy used for electronic packaging according to claim 2, it is characterised in that：Melting in step S1
Aluminium ingot purity is 99.95%, and the preparation method of the Al-Si alloy melt is：In medium frequency induction melting furnace, temperature 1200
~1400 DEG C, load weighted Al and Si meltings are obtained into alloy melt, be cooled to later 850~1000 DEG C and keep the temperature 10~
15min。
4. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：In step S1, spray
Penetrating deposition blank-making method is：Al-Si alloy melt is poured into preheated tundish crucible in jet deposition equipment, using atomization
The high pressure gas that nozzle ejects, to being atomized by the alloy melt of diversion pipe, atomizing pressure is 0.7~1.2MPa, mist
The scan frequency for changing nozzle is 1~5Hz, is then deposited into take-up reel and obtains alusil alloy deposition ingot blank, the tundish crucible
Be 700~900 DEG C with the temperature of diversion pipe, take-up reel decrease speed is 10~30mm/min, receive disc spin speed be 60~
The deposited distance for exporting to take-up reel of 120rpm, a diameter of 2.0~4.0mm of diversion pipe, diversion pipe are 350~500mm.
5. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：Step S2 homogenization
The heating temperature of processing is 350~450 DEG C, and soaking time is 12~48h, and 100~200 are cooled to the furnace after deposition ingot blank heat preservation
DEG C hereinafter, being air-cooled to room temperature.
6. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：Step S3 selects forging
Method is made, ingot blank smithing technological parameter is：After ingot blank keeps the temperature 2~4h at 400~500 DEG C, forged, deflection be 10~
30%, Soft reduction rate is 0.1~1m/min.
7. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：Step S3, which is selected, to be squeezed
Pressure method, ingot blank extrusion process parameters are：It is squeezed using forward extrusion mode on 800t extruders, ingot is deposited before squeezing
Base keeps the temperature 2~4h at 350~460 DEG C, and extrusion ratio is 10~21, and each extrusion die is placed in heating furnace before squeezing, 300~
350 DEG C are fully warmed-up heat preservation.
8. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：The isothermal of step S4
In the operation of rolling, the dynamic recrystallization temperature range is 420~500 DEG C, and the dynamic recovery temperature range is 320~400
DEG C, finishing temperature is 200~350 DEG C.
9. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：The isothermal of step S4
In the operation of rolling, use commutation rolling to reduce plank anisotropy.
10. the preparation method of alusil alloy used for electronic packaging according to claim 1, it is characterised in that：The tool of step S5
Body annealing method is：Rolled plate is warming up to 340~380 DEG C with 5~10 DEG C/min, constant temperature keeps the temperature 6~12h, heat preservation
After cool to 150~200 DEG C with the furnace, be air-cooled to room temperature later, that is, produce alusil alloy used for electronic packaging.
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