CN108778731A - 保护膜形成用复合片 - Google Patents

保护膜形成用复合片 Download PDF

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Publication number
CN108778731A
CN108778731A CN201780010062.2A CN201780010062A CN108778731A CN 108778731 A CN108778731 A CN 108778731A CN 201780010062 A CN201780010062 A CN 201780010062A CN 108778731 A CN108778731 A CN 108778731A
Authority
CN
China
Prior art keywords
protective film
film formation
methyl
composite sheet
energy ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780010062.2A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤明徳
稻男洋
稻男洋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN108778731A publication Critical patent/CN108778731A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Inorganic Insulating Materials (AREA)
CN201780010062.2A 2016-04-28 2017-04-25 保护膜形成用复合片 Pending CN108778731A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016092032 2016-04-28
JP2016-092032 2016-04-28
PCT/JP2017/016280 WO2017188213A1 (ja) 2016-04-28 2017-04-25 保護膜形成用複合シート

Publications (1)

Publication Number Publication Date
CN108778731A true CN108778731A (zh) 2018-11-09

Family

ID=60161621

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780010062.2A Pending CN108778731A (zh) 2016-04-28 2017-04-25 保护膜形成用复合片

Country Status (5)

Country Link
JP (1) JP6929835B2 (ko)
KR (1) KR102441649B1 (ko)
CN (1) CN108778731A (ko)
TW (1) TWI731964B (ko)
WO (1) WO2017188213A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7155245B2 (ja) * 2018-03-23 2022-10-18 リンテック株式会社 ダイボンディングフィルム、ダイシングダイボンディングシート、及び半導体チップの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1375866A (zh) * 2001-03-21 2002-10-23 琳得科株式会社 形成芯片保护膜的片材以及制造半导体芯片的方法
JP2008143104A (ja) * 2006-12-12 2008-06-26 Bridgestone Corp 塗膜形成用転写シート及びそれを用いた被覆塗膜の形成方法
CN102472970A (zh) * 2009-07-02 2012-05-23 太阳控股株式会社 光固化性热固化性树脂组合物
WO2014155756A1 (ja) * 2013-03-26 2014-10-02 リンテック株式会社 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
WO2016027883A1 (ja) * 2014-08-22 2016-02-25 リンテック株式会社 保護膜形成用シートおよび保護膜付き半導体チップの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144433B1 (ko) 1970-02-02 1976-11-29
JP3097619B2 (ja) * 1997-10-02 2000-10-10 日本電気株式会社 電界放射冷陰極の製造方法
JP4364508B2 (ja) 2002-12-27 2009-11-18 リンテック株式会社 チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法
EP2265682A1 (en) 2008-03-31 2010-12-29 Henkel Corporation Multilayer uv-curable adhesive film
JP2010031183A (ja) 2008-07-30 2010-02-12 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5144433B2 (ja) * 2008-08-28 2013-02-13 古河電気工業株式会社 チップ保護用フィルム
JP2011204806A (ja) 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
JP5439264B2 (ja) 2010-04-19 2014-03-12 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5036887B1 (ja) 2011-03-11 2012-09-26 日東電工株式会社 保護フィルム付きダイシングフィルム
JP6091955B2 (ja) 2013-03-26 2017-03-08 リンテック株式会社 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
KR102467143B1 (ko) 2014-10-29 2022-11-14 린텍 가부시키가이샤 보호막 형성 필름 및 보호막 형성용 복합 시트

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1375866A (zh) * 2001-03-21 2002-10-23 琳得科株式会社 形成芯片保护膜的片材以及制造半导体芯片的方法
JP2008143104A (ja) * 2006-12-12 2008-06-26 Bridgestone Corp 塗膜形成用転写シート及びそれを用いた被覆塗膜の形成方法
CN102472970A (zh) * 2009-07-02 2012-05-23 太阳控股株式会社 光固化性热固化性树脂组合物
WO2014155756A1 (ja) * 2013-03-26 2014-10-02 リンテック株式会社 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
WO2016027883A1 (ja) * 2014-08-22 2016-02-25 リンテック株式会社 保護膜形成用シートおよび保護膜付き半導体チップの製造方法

Also Published As

Publication number Publication date
WO2017188213A1 (ja) 2017-11-02
TW201741421A (zh) 2017-12-01
KR102441649B1 (ko) 2022-09-07
KR20190002423A (ko) 2019-01-08
JPWO2017188213A1 (ja) 2019-03-07
TWI731964B (zh) 2021-07-01
JP6929835B2 (ja) 2021-09-01

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Application publication date: 20181109