JP6929835B2 - 保護膜形成用複合シート - Google Patents
保護膜形成用複合シート Download PDFInfo
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- JP6929835B2 JP6929835B2 JP2018514603A JP2018514603A JP6929835B2 JP 6929835 B2 JP6929835 B2 JP 6929835B2 JP 2018514603 A JP2018514603 A JP 2018514603A JP 2018514603 A JP2018514603 A JP 2018514603A JP 6929835 B2 JP6929835 B2 JP 6929835B2
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- Prior art keywords
- protective film
- forming
- sensitive adhesive
- pressure
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/72—Cured, e.g. vulcanised, cross-linked
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Inorganic Insulating Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016092032 | 2016-04-28 | ||
| JP2016092032 | 2016-04-28 | ||
| PCT/JP2017/016280 WO2017188213A1 (ja) | 2016-04-28 | 2017-04-25 | 保護膜形成用複合シート |
Publications (2)
| Publication Number | Publication Date |
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| JPWO2017188213A1 JPWO2017188213A1 (ja) | 2019-03-07 |
| JP6929835B2 true JP6929835B2 (ja) | 2021-09-01 |
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| JP (1) | JP6929835B2 (ko) |
| KR (1) | KR102441649B1 (ko) |
| CN (1) | CN108778731A (ko) |
| TW (1) | TWI731964B (ko) |
| WO (1) | WO2017188213A1 (ko) |
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| JP7155245B2 (ja) * | 2018-03-23 | 2022-10-18 | リンテック株式会社 | ダイボンディングフィルム、ダイシングダイボンディングシート、及び半導体チップの製造方法 |
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| JPS5144433B1 (ko) | 1970-02-02 | 1976-11-29 | ||
| JP3097619B2 (ja) * | 1997-10-02 | 2000-10-10 | 日本電気株式会社 | 電界放射冷陰極の製造方法 |
| JP3544362B2 (ja) * | 2001-03-21 | 2004-07-21 | リンテック株式会社 | 半導体チップの製造方法 |
| JP4364508B2 (ja) | 2002-12-27 | 2009-11-18 | リンテック株式会社 | チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法 |
| JP4956167B2 (ja) * | 2006-12-12 | 2012-06-20 | 株式会社ブリヂストン | 塗膜形成用転写シート及びそれを用いた被覆塗膜の形成方法 |
| EP2265682A1 (en) | 2008-03-31 | 2010-12-29 | Henkel Corporation | Multilayer uv-curable adhesive film |
| JP2010031183A (ja) | 2008-07-30 | 2010-02-12 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
| JP5144433B2 (ja) * | 2008-08-28 | 2013-02-13 | 古河電気工業株式会社 | チップ保護用フィルム |
| JP5475350B2 (ja) * | 2009-07-02 | 2014-04-16 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP2011204806A (ja) | 2010-03-24 | 2011-10-13 | Nitto Denko Corp | ウエハの加工方法 |
| JP5439264B2 (ja) | 2010-04-19 | 2014-03-12 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム |
| JP5036887B1 (ja) | 2011-03-11 | 2012-09-26 | 日東電工株式会社 | 保護フィルム付きダイシングフィルム |
| JPWO2014155756A1 (ja) * | 2013-03-26 | 2017-02-16 | リンテック株式会社 | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 |
| JP6091955B2 (ja) | 2013-03-26 | 2017-03-08 | リンテック株式会社 | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 |
| SG11201701272UA (en) * | 2014-08-22 | 2017-04-27 | Lintec Corp | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
| KR102467143B1 (ko) | 2014-10-29 | 2022-11-14 | 린텍 가부시키가이샤 | 보호막 형성 필름 및 보호막 형성용 복합 시트 |
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2017
- 2017-04-24 TW TW106113626A patent/TWI731964B/zh active
- 2017-04-25 JP JP2018514603A patent/JP6929835B2/ja active Active
- 2017-04-25 CN CN201780010062.2A patent/CN108778731A/zh active Pending
- 2017-04-25 KR KR1020187023558A patent/KR102441649B1/ko active IP Right Grant
- 2017-04-25 WO PCT/JP2017/016280 patent/WO2017188213A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017188213A1 (ja) | 2017-11-02 |
| TW201741421A (zh) | 2017-12-01 |
| KR102441649B1 (ko) | 2022-09-07 |
| KR20190002423A (ko) | 2019-01-08 |
| JPWO2017188213A1 (ja) | 2019-03-07 |
| TWI731964B (zh) | 2021-07-01 |
| CN108778731A (zh) | 2018-11-09 |
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