CN108774470A - A kind of thermal stability LED packaging plastics and preparation method thereof - Google Patents
A kind of thermal stability LED packaging plastics and preparation method thereof Download PDFInfo
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- CN108774470A CN108774470A CN201810696088.3A CN201810696088A CN108774470A CN 108774470 A CN108774470 A CN 108774470A CN 201810696088 A CN201810696088 A CN 201810696088A CN 108774470 A CN108774470 A CN 108774470A
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- parts
- thermal stability
- calcium carbonate
- led packaging
- vinyltrimethoxysilane
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Abstract
A kind of thermal stability LED packaging plastics of present invention offer and preparation method thereof, the thermal stability LED packaging plastics include following raw material：Epoxy resin, isoprene styrene copolymer, hexamethyldisilazane, calcium carbonate, carbamate fibre, vinyltrimethoxysilane, sodium sulfate of polyethenoxy ether of fatty alcohol, petroleum sodium sulfonate, cumyl peroxide, diamino diphenyl sulfone, benzene dimethylamine tripolymer；Preparation method includes the following steps：S1, prepare raw material；S2, calcium carbonate and carbamate fibre, which are distributed in vinyltrimethoxysilane, obtains mixture A；The mixing of S3, epoxy resin, isoprene styrene copolymer and hexamethyldisilazane are blended into other raw materials and obtain thermal stability LED packaging plastics.Packaging plastic proposed by the present invention, formula is reasonable, has good thermal stability, light transmittance and ageing resistance, use scope is wide, and service life is long, and preparation method is simple, and differences between batches are small.
Description
Technical field
The present invention relates to packaging plastic technical fields more particularly to a kind of thermal stability LED packaging plastics and preparation method thereof.
Background technology
Microelectric technique be with integrated circuit, especially Large Scale integrated circuit and grow up one it is new
Technology.Packaging plastic is one of most common auxiliary material of microelectronic product, frequently as the adhesive of certain components, for member
Sealing, encapsulating or the embedding of device, can be played after encapsulation waterproof, it is moisture-proof, shockproof, dust-proof, heat dissipation, secrecy the effects that.At present
The material of packaging plastic mainly has epoxy resin, polyurethane, condensed type silica gel etc., and epoxy resin is because having good sealing
Property, electric insulating quality, cheap cost and easy processing the features such as being molded is as the most wide encapsulating material of use scope.However it passes
The thermal stability of the epoxy resin-matrix packaging plastic of system is poor, although stability makes moderate progress after addition thermostabilization filler, light transmittance
It can be severely impacted again.Based on the deficiencies in the prior art, the present invention propose a kind of thermal stability LED packaging plastics and its
Preparation method.
Invention content
The purpose of the present invention is to solve existing packaging plastic thermal stability is poor, add after thermostabilization filler to light transmittance shadow
The big problem of sound, and a kind of thermal stability LED packaging plastics and preparation method thereof proposed.
In order to achieve the above object, the present invention is achieved by the following technical programs：
A kind of thermal stability LED packaging plastics, include the raw material of following parts by weight：80~120 parts of epoxy resin, isoamyl two
10~30 parts of alkene-styrol copolymer, 3~8 parts of hexamethyldisilazane, 2~4 parts of calcium carbonate, carbamate fibre 1~8
Part, 3~6 parts of vinyltrimethoxysilane, 0.5~1.5 part of sodium sulfate of polyethenoxy ether of fatty alcohol, petroleum sodium sulfonate 0.5~
4.5 parts, 0.15~0.35 part of cumyl peroxide, 0.5~2 part of diamino diphenyl sulfone, 2~4 parts of benzene dimethylamine tripolymer.
Preferably, the thermal stability LED packaging plastics include the raw material of following parts by weight：It is 90~110 parts of epoxy resin, different
15~25 parts of isoprene-styrene copolymer, 4~7 parts of hexamethyldisilazane, 2.5~3.5 parts of calcium carbonate, carbamate
1.25~7 parts of fiber, 3~6 parts of vinyltrimethoxysilane, 0.5~1.5 part of sodium sulfate of polyethenoxy ether of fatty alcohol, oil
0.5~4.5 part of sodium sulfonate, 0.15~0.35 part of cumyl peroxide, 0.8~2 part of diamino diphenyl sulfone, benzene dimethylamine three
3.2~4 parts of aggressiveness.
Preferably, the mass ratio of the calcium carbonate and carbamate fibre is 1：(0.5~2).
Preferably, the mass ratio of the diamino diphenyl sulfone and benzene dimethylamine tripolymer is 1：(2~4).
Preferably, the thermal stability LED packaging plastics include the raw material of following parts by weight：100 parts of epoxy resin, isoamyl two
20 parts of alkene-styrol copolymer, 5 parts of hexamethyldisilazane, 3 parts of calcium carbonate, 3 parts of carbamate fibre, vinyl front three
4 parts of oxysilane, 1 part of sodium sulfate of polyethenoxy ether of fatty alcohol, 2.5 parts of petroleum sodium sulfonate, 0.25 part of cumyl peroxide, two
1.2 parts of aminodiphenyl base sulfone, 3.6 parts of benzene dimethylamine tripolymer.
The invention also provides a kind of preparation methods of thermal stability LED packaging plastics, include the following steps：
S1, according to 80~120 parts of epoxy resin, 0~30 part of isoprene styrene copolymer 1, hexamethyldisilazane
3~8 parts, 2~4 parts of calcium carbonate, 1~8 part of carbamate fibre, 3~6 parts of vinyltrimethoxysilane, fatty alcohol polyoxy
0.5~1.5 part of ethylene ether sodium sulfate, 0.5~4.5 part of petroleum sodium sulfonate, 0.15~0.35 part of cumyl peroxide, diamino
0.5~2 part of diphenyl sulfone, 2~4 parts of benzene dimethylamine tripolymer weigh each raw material, spare；
S2, the step S1 calcium carbonate weighed and carbamate fibre are added in vinyltrimethoxysilane, and
It is dispersed in the blender that rotating speed is 100~300r/min uniformly up to mixture A；
S3, epoxy resin, isoprene styrene copolymer and hexamethyldisilazane that step S1 is weighed are added to
Mixture B is stirred until homogeneous to obtain with the speed of 200~400r/min in mixing machine, improves mixing speed to 300~500r/min
Again by sodium sulfate of polyethenoxy ether of fatty alcohol, petroleum sodium sulfonate, cumyl peroxide, diamino diphenyl sulfone, benzene dimethylamine
The mixture A that tripolymer and step S2 are prepared is added sequentially in mixture B, is stirred until homogeneous up to thermal stability LED
Packaging plastic.
Thermal stability LED packaging plastics provided by the invention, compared with prior art advantage be：
1, packaging plastic proposed by the present invention, formula is reasonable, using epoxy resin as major ingredient, is copolymerized with isoprene styrene
Object and hexamethyldisilazane are auxiliary material, and by add calcium carbonate, carbamate fibre, vinyltrimethoxysilane,
Sodium sulfate of polyethenoxy ether of fatty alcohol, petroleum sodium sulfonate, cumyl peroxide, diamino diphenyl sulfone and benzene dimethylamine trimerization
Body is modified packaging plastic, so that packaging plastic is had excellent thermostabilization, light transmittance and ageing resistance, avoids traditional packaging plastic
Thermal stability is poor, at the same time the short phenomenon of service life avoids the addition of thermal-stabilizing filler to the influence of light transmittance, ensures
Encapsulating material not only has good thermal stability, but also has excellent light transmittance, expands the use scope of packaging plastic, is particularly suitable for
Applied to microelectronic product field.
2, packaging plastic proposed by the present invention, by adding the calcium carbonate and carbamate fibre of rational proportion, to improve
The thermal stability and light transmittance of packaging plastic, and the experiment proved that the calcium carbonate in encapsulation glue formula proposed by the present invention and amino first
Acid esters fiber has the function of synergy, is 1 in the mass ratio of calcium carbonate and carbamate fibre：It is hot when between 0.5~2
Stability and light transmittance are preferable, are especially 1 in the mass ratio of calcium carbonate and carbamate fibre:Resultant effect is most when 3
It is good.
3, packaging plastic proposed by the present invention, by the diamino diphenyl sulfone and benzene dimethylamine tripolymer that add rational proportion
To accelerate the curing rate of packaging plastic, packaging plastic hardening time is effectively shortened, accelerate construction efficiency.
4, the invention also provides a kind of preparation method easy to operate, the miscible packaging plastic of raw material, pass through calcium carbonate
It is evenly dispersed in vinyltrimethoxysilane with carbamate fibre, calcium carbonate can either be modified and be activated,
The dispersion effect of calcium carbonate and carbamate fibre in the epoxy can be improved again simultaneously, ensures the packaging plastic being prepared
Performance is consistent, and differences between batches are small, is more suitable for industrialized production.
Specific implementation mode
The present invention is made further to explain with reference to specific embodiment.
Embodiment 1
A kind of thermal stability LED packaging plastics proposed by the present invention, include the raw material of following parts by weight：
80 parts of epoxy resin, 0 part of isoprene styrene copolymer 1,3 parts of hexamethyldisilazane, 2 parts of calcium carbonate, ammonia
1 part of carbamate fiber, 3 parts of vinyltrimethoxysilane, 0.5 part of sodium sulfate of polyethenoxy ether of fatty alcohol, petroleum sodium sulfonate
0.5 part, 0.15 part of cumyl peroxide, 0.5 part of diamino diphenyl sulfone, 2 parts of benzene dimethylamine tripolymer；
Preparation method includes the following steps：
S1, according to 80 parts of epoxy resin, 0 part of isoprene styrene copolymer 1,3 parts of hexamethyldisilazane, carbonic acid
2 parts of calcium, 1 part of carbamate fibre, 3 parts of vinyltrimethoxysilane, 0.5 part of sodium sulfate of polyethenoxy ether of fatty alcohol, stone
0.5 part of oily sodium sulfonate, 0.15 part of cumyl peroxide, 0.5 part of diamino diphenyl sulfone, 2 parts of benzene dimethylamine tripolymer weigh
Each raw material, it is spare；
S2, the step S1 calcium carbonate weighed and carbamate fibre are added in vinyltrimethoxysilane, and
It is dispersed in the blender that rotating speed is 100r/min uniformly up to mixture A；
S3, epoxy resin, isoprene styrene copolymer and hexamethyldisilazane that step S1 is weighed are added to
Mixture B is stirred until homogeneous to obtain with the speed of 200r/min in mixing machine, improves mixing speed to 300r/min again by fatty alcohol
Polyethenoxy ether sodium sulfate, petroleum sodium sulfonate, cumyl peroxide, diamino diphenyl sulfone, benzene dimethylamine tripolymer and step
The mixture A that rapid S2 is prepared is added sequentially in mixture B, is stirred until homogeneous up to thermal stability LED packaging plastics.
Embodiment 2
A kind of thermal stability LED packaging plastics proposed by the present invention, include the raw material of following parts by weight：
100 parts of epoxy resin, 20 parts of isoprene styrene copolymer, 5 parts of hexamethyldisilazane, 3 parts of calcium carbonate,
3 parts of carbamate fibre, 4 parts of vinyltrimethoxysilane, 1 part of sodium sulfate of polyethenoxy ether of fatty alcohol, petroleum sodium sulfonate
2.5 parts, 0.25 part of cumyl peroxide, 1.2 parts of diamino diphenyl sulfone, 3.6 parts of benzene dimethylamine tripolymer；
Preparation method includes the following steps：
S1, according to 100 parts of epoxy resin, 20 parts of isoprene styrene copolymer, 5 parts of hexamethyldisilazane, carbonic acid
3 parts of calcium, 3 parts of carbamate fibre, 4 parts of vinyltrimethoxysilane, 1 part of sodium sulfate of polyethenoxy ether of fatty alcohol, oil
2.5 parts of sodium sulfonate, 0.25 part of cumyl peroxide, 1.2 parts of diamino diphenyl sulfone, 3.6 parts of benzene dimethylamine tripolymer weigh
Each raw material, it is spare；
S2, the step S1 calcium carbonate weighed and carbamate fibre are added in vinyltrimethoxysilane, and
It is dispersed in the blender that rotating speed is 200r/min uniformly up to mixture A；
S3, epoxy resin, isoprene styrene copolymer and hexamethyldisilazane that step S1 is weighed are added to
Mixture B is stirred until homogeneous to obtain with the speed of 300r/min in mixing machine, improves mixing speed to 400r/min again by fatty alcohol
Polyethenoxy ether sodium sulfate, petroleum sodium sulfonate, cumyl peroxide, diamino diphenyl sulfone, benzene dimethylamine tripolymer and step
The mixture A that rapid S2 is prepared is added sequentially in mixture B, is stirred until homogeneous up to thermal stability LED packaging plastics.
Embodiment 3
A kind of thermal stability LED packaging plastics proposed by the present invention, include the raw material of following parts by weight：
120 parts of epoxy resin, 30 parts of isoprene styrene copolymer, 8 parts of hexamethyldisilazane, 4 parts of calcium carbonate,
8 parts of carbamate fibre, 6 parts of vinyltrimethoxysilane, 1.5 parts of sodium sulfate of polyethenoxy ether of fatty alcohol, mahogany acid
4.5 parts of sodium, 0.35 part of cumyl peroxide, 2 parts of diamino diphenyl sulfone, 4 parts of benzene dimethylamine tripolymer；
Preparation method includes the following steps：
S1, according to 120 parts of epoxy resin, 30 parts of isoprene styrene copolymer, 8 parts of hexamethyldisilazane, carbonic acid
4 parts of calcium, 8 parts of carbamate fibre, 6 parts of vinyltrimethoxysilane, 1.5 parts of sodium sulfate of polyethenoxy ether of fatty alcohol, stone
4.5 parts of oily sodium sulfonate, 0.35 part of cumyl peroxide, 2 parts of diamino diphenyl sulfone, 4 parts of benzene dimethylamine tripolymer weigh respectively
Raw material, it is spare；
S2, the step S1 calcium carbonate weighed and carbamate fibre are added in vinyltrimethoxysilane, and
It is dispersed in the blender that rotating speed is 300r/min uniformly up to mixture A；
S3, epoxy resin, isoprene styrene copolymer and hexamethyldisilazane that step S1 is weighed are added to
Mixture B is stirred until homogeneous to obtain with the speed of 400r/min in mixing machine, improves mixing speed to 500r/min again by fatty alcohol
Polyethenoxy ether sodium sulfate, petroleum sodium sulfonate, cumyl peroxide, diamino diphenyl sulfone, benzene dimethylamine tripolymer and step
The mixture A that rapid S2 is prepared is added sequentially in mixture B, is stirred until homogeneous up to thermal stability LED packaging plastics.
The packaging plastic and commercial package glue prepared to Examples 1 to 3 is tested for the property respectively, the results are shown in Table 1.
Table 1：
1 experimental result of table is shown：1) dead lamp phenomenon is not found in packaging plastic test process prepared by Examples 1 to 3, and city
The dead lamp rate for selling packaging plastic reaches 2%.2) packaging plastic prepared by Examples 1 to 3 is under the xanthochromia test of 1000h, obtained Huang
Varying index is 2 hereinafter, and the yellowness index of commercial package glue has reached 3.2 under equal conditions.3) prepared by Examples 1 to 3
Packaging plastic light transmittance is 90% or more, and commercial package glue only has 87%.4) the heat-resisting temperature of packaging plastic prepared by Examples 1 to 3
Degree is 289.2~297.3 DEG C, and commercial package glue only has 267.8 DEG C of in terms of comprehensive, packaging plastic thermostabilization proposed by the present invention
Property, light transmittance and yellowing-resistant phenomenon be substantially better than the prior art, there is significant progress.
Under the premise of the gross mass of calcium carbonate and carbamate fibre is identical, by calcium carbonate and amino in embodiment 1
The mass ratio of formic acid ester fiber is replaced according to table 2, and the packaging plastic to being prepared carries out performance detection, the results are shown in Table 2.
Table 2：
In table 2, " A:B " indicates the mass ratio of calcium carbonate and carbamate fibre.
2 experimental result of table is shown, calcium carbonate or the obtained packaging plastic light transmittance of carbamate fibre is used alone only
Have 80% or so, heat resisting temperature is used in compounding calcium carbonate and the obtained encapsulation of carbamate fibre only at 260 DEG C or so
Glue light transmittance and heat resisting temperature significantly improve, and are 1 in the mass ratio of calcium carbonate and carbamate fibre:Between (0.5~2)
When, light transmittance is 92%~95%, and heat resisting temperature can reach 285 DEG C or more, shows calcium carbonate and carbamate fibre tool
There is synergy, is especially 1 in the mass ratio of calcium carbonate and carbamate fibre：Light transmittance can reach when 1
95%, heat resisting temperature can reach 295 DEG C or more, and comprehensive performance is best.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of thermal stability LED packaging plastics, which is characterized in that include the raw material of following parts by weight：Epoxy resin 80~120
Part, 0~30 part of isoprene styrene copolymer 1,3~8 parts of hexamethyldisilazane, 2~4 parts of calcium carbonate, carbamate
1~8 part of fiber, 3~6 parts of vinyltrimethoxysilane, 0.5~1.5 part of sodium sulfate of polyethenoxy ether of fatty alcohol, mahogany acid
0.5~4.5 part of sodium, 0.15~0.35 part of cumyl peroxide, 0.5~2 part of diamino diphenyl sulfone, benzene dimethylamine tripolymer
2~4 parts.
2. a kind of thermal stability LED packaging plastics according to claim 1, which is characterized in that include the original of following parts by weight
Material：90~110 parts of epoxy resin, 5~25 parts of isoprene styrene copolymer 1,4~7 parts of hexamethyldisilazane, carbonic acid
2.5~3.5 parts of calcium, 1.25~7 parts of carbamate fibre, 3~6 parts of vinyltrimethoxysilane, aliphatic alcohol polyethenoxy
0.5~1.5 part of ether sodium sulfate, 0.5~4.5 part of petroleum sodium sulfonate, 0.15~0.35 part of cumyl peroxide, diamino hexichol
0.8~2 part of base sulfone, 3.2~4 parts of benzene dimethylamine tripolymer.
3. a kind of thermal stability LED packaging plastics according to claim 1 or 2, which is characterized in that the calcium carbonate and amino
The mass ratio of formic acid ester fiber is 1：(0.5~2).
4. a kind of thermal stability LED packaging plastics according to claim 1 or 2, which is characterized in that the diamino-diphenyl
The mass ratio of sulfone and benzene dimethylamine tripolymer is 1：(2~4).
5. a kind of thermal stability LED packaging plastics according to claim 1, which is characterized in that include the original of following parts by weight
Material：100 parts of epoxy resin, 20 parts of isoprene styrene copolymer, 5 parts of hexamethyldisilazane, 3 parts of calcium carbonate, amino first
3 parts of acid esters fiber, 4 parts of vinyltrimethoxysilane, 1 part of sodium sulfate of polyethenoxy ether of fatty alcohol, 2.5 parts of petroleum sodium sulfonate,
0.25 part of cumyl peroxide, 1.2 parts of diamino diphenyl sulfone, 3.6 parts of benzene dimethylamine tripolymer.
6. a kind of preparation method of thermal stability LED packaging plastics, which is characterized in that include the following steps：
S1, according to 80~120 parts of epoxy resin, 0~30 part of isoprene styrene copolymer 1, hexamethyldisilazane 3~8
Part, 2~4 parts of calcium carbonate, 1~8 part of carbamate fibre, 3~6 parts of vinyltrimethoxysilane, aliphatic alcohol polyethenoxy
0.5~1.5 part of ether sodium sulfate, 0.5~4.5 part of petroleum sodium sulfonate, 0.15~0.35 part of cumyl peroxide, diamino hexichol
0.5~2 part of base sulfone, 2~4 parts of benzene dimethylamine tripolymer weigh each raw material, spare；
S2, the step S1 calcium carbonate weighed and carbamate fibre are added in vinyltrimethoxysilane, and turned
It is dispersed in the blender that speed is 100~300r/min uniformly up to mixture A；
S3, epoxy resin, isoprene styrene copolymer and hexamethyldisilazane that step S1 is weighed are added to mixing
Mixture B is stirred until homogeneous to obtain with the speed of 200~400r/min in machine, raising mixing speed to 300~500r/min again will
Sodium sulfate of polyethenoxy ether of fatty alcohol, petroleum sodium sulfonate, cumyl peroxide, diamino diphenyl sulfone, benzene dimethylamine trimerization
The mixture A that body and step S2 are prepared is added sequentially in mixture B, is stirred until homogeneous up to thermal stability LED encapsulation
Glue.
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| CN201810696088.3A CN108774470A (en) | 2018-06-29 | 2018-06-29 | A kind of thermal stability LED packaging plastics and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007091794A (en) * | 2005-09-27 | 2007-04-12 | Tomoegawa Paper Co Ltd | Adhesive composition and adhesive sheet for semiconductor device |
| US20070256783A1 (en) * | 2006-05-08 | 2007-11-08 | Dietz Raymond L | Thermally enhanced adhesive paste |
| CN101240154A (en) * | 2008-03-04 | 2008-08-13 | 上海回天化工新材料有限公司 | Single-component high peel strength epoxy resin adhesive and preparation method thereof |
| CN104610893A (en) * | 2014-12-29 | 2015-05-13 | 中国神华能源股份有限公司 | Adhesive as well as preparation method and application thereof |
-
2018
- 2018-06-29 CN CN201810696088.3A patent/CN108774470A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007091794A (en) * | 2005-09-27 | 2007-04-12 | Tomoegawa Paper Co Ltd | Adhesive composition and adhesive sheet for semiconductor device |
| US20070256783A1 (en) * | 2006-05-08 | 2007-11-08 | Dietz Raymond L | Thermally enhanced adhesive paste |
| CN101240154A (en) * | 2008-03-04 | 2008-08-13 | 上海回天化工新材料有限公司 | Single-component high peel strength epoxy resin adhesive and preparation method thereof |
| CN104610893A (en) * | 2014-12-29 | 2015-05-13 | 中国神华能源股份有限公司 | Adhesive as well as preparation method and application thereof |
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