CN105505301A - Highly-transparent room temperature deep curing type electronic pouring sealant - Google Patents
Highly-transparent room temperature deep curing type electronic pouring sealant Download PDFInfo
- Publication number
- CN105505301A CN105505301A CN201511008523.1A CN201511008523A CN105505301A CN 105505301 A CN105505301 A CN 105505301A CN 201511008523 A CN201511008523 A CN 201511008523A CN 105505301 A CN105505301 A CN 105505301A
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- CN
- China
- Prior art keywords
- room temperature
- component
- pouring sealant
- temperature deep
- silicone oil
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a highly-transparent room temperature deep curing type electronic pouring sealant. The highly-transparent room temperature deep curing type electronic pouring sealant is prepared from a component A and a component B, wherein the component A is prepared by mixing a base material and a platinum complex according to the weight part ratio of 100:(0.01 to 0.5); the component B is prepared by mxing a base material, a hydrogen-containing silicone oil and an inhibitor according to the weight part ratio of 100:(0.2 to 10):(0.01 to 5); the base material is prepared by shearing divinyl-based silicone oil, white black carbon and a silicon resin solution according to the weight ratio of 100:10:(10 to 50) at high speed, dispersing, mixing, and removing solvent by vacuum for 3 to 6h at the temperature of 70 to 100 DEG C; the inhibitor is propynol, 1,4-butynediol, alkynyl cyclohexanol, isopropyl ether, ethylene glycol monobutyl ether, octabromoether, diallyl maleate or diethyl fumarate; the silicon resin solution is an ethanol and methylbenzene mixed solution containing MQ silicon resin. The highly-transparent room temperature deep curing electronic pouring sealant has the characteristics that the strength is high, and the transparency is high.
Description
Technical field
The present invention relates to a kind of joint sealant, particularly relate to a kind of high transparency room temperature deep cure electron pouring sealant.
Background technology
Embedding Material kind is many, mainly contains: epoxy resin, organosilicon, urethane.The kind of organic silicon potting adhesive is a lot, different types of organic silicon potting adhesive is in heat resistance, water resistance, insulating property, optical property, have very big-difference in the bonding adhesion property and soft durometer etc. of unlike material, organosilicon material can add the performance that the aspects such as its conductive and heat-conductive magnetic conduction given by some functional weighting materials, the physical strength of organic silicon potting adhesive is general all poor, two groups of organic silicon potting adhesives are the most common, this kind of glue comprise condensed type with two classes of additive properties.General condensed type poor to power in the adhesion of components and parts and embedding cavity, can produce volatility lower-molecular substance in solidification process, have more obvious shrinking percentage after solidification.The shrinking percentage of add-on type is minimum, do not have low molecule to produce in solidification process, can heat fast setting, and this type joint sealant can make the good joint sealant of the transparency, is the first-selection of high quality joint sealant.
In recent years, the high-powered LED lamp as environmental protection and energy saving green light source is fast-developing, but practical application still exists the problem that heat radiation is not high and light emission rate is not high, and heat radiation affects the life-span of lamp, the development of light emission rate restriction lamp.And the good joint sealant of the transparency can be dealt with problems.For this reason, be necessary to seek high transparent, the joint sealant of optical property and mechanical property excellence overcomes the defect of existence.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the invention provides and a kind ofly there is favorable optical performance and at room temperature can the high transparency room temperature deep cure electron pouring sealant of deep cure.
Technical scheme of the present invention is such: a kind of high transparency room temperature deep cure electron pouring sealant, comprises component A and B component, described component A by base-material and platinum complex by weight 100 ︰ 0.01 ~ 0.5 mix and form, described B component is by base-material, containing hydrogen silicone oil and inhibitor by weight 100 ︰ 0.2 ~ 10 ︰ 0.01 ~ 5 mix and form, described base-material is by bi-vinyl silicone oil, white carbon black and silicon resin solution are by weight the first high speed shear dispersing and mixing of 100 ︰ 10 ︰ 10 ~ 50, then obtain through 70 ~ 100 DEG C of vacuum desolvation agent 3 ~ 6h, described inhibitor is propiolic alcohol, 1, 4-butynediol, alkynyl hexalin, isopropyl ether, ethylene glycol monobutyl ether, eight bromo ether, diallyl maleate or DEF, described silicon resin solution is the ethanol and the toluene mixed solution that contain MQ silicone resin.
Further, described white carbon black specific surface area is 150 ~ 200m
2/ g.
Further, described platinum complex is the coordinate platinum complex that thiazolinyl end-blocking main chain is made up of organopolysiloxane, and wherein relative to A and B component gross weight, platinum consumption is 400 ~ 2500ppm.
Further, the vinyl mass content of described MQ silicone resin is 2 ~ 5%, MQ ratio is 0.7 ~ 1.3.MQ silicone resin accounts for 2% ~ 10% of silicon resin solution gross weight.
Further, also comprise MDQ and MTQ silicone resin in described silicon resin solution, wherein the molar mass of D unit and T unit is respectively 5% ~ 10% and 15% ~ 20%.
Further, described bi-vinyl silicone oil refers to that the vinyl mass content in molecule is the bi-vinyl silicone oil of 0.25 ~ 3%.
Further, the viscosity of described base-material is 100 ~ 20000mPaS.
Further, described containing hydrogen silicone oil is the containing hydrogen silicone oil of silicon hydrogen in the middle of molecular chain, and viscosity is 20 ~ 100PaS, and in molecule, silicon hydrogen richness is 0.1 ~ 1.5%.
Described component A and B component in use in mass ratio 1 ︰ 1 mix.
The beneficial effect of technical scheme provided by the present invention is: the mechanical tensile property of joint sealant and transmittance all comparatively prior art are improved.
Embodiment
Below in conjunction with embodiment, the invention will be further described, but not as a limitation of the invention.
Embodiment 1
Component A by base-material, pure platinum content be 1100ppm platinum complex by weight 100 ︰ 0.01 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 0.9% and Isosorbide-5-Nitrae-butynediol by weight 100 ︰ 1.5 ︰ 0.8 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 170g contents of ethylene 0.25%, the first high speed shear dispersing and mixing of 17g white carbon black and 70g silicon resin solution, and then vacuum row bubble 3h obtains at 70 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 24g, comprises molar content 5%MDQ and 15%MTQ silicone resin, and M/Q value is 1.3, contents of ethylene 2%, ethanol 14g, toluene 30g.
Embodiment 2
Component A by base-material, pure platinum content be 700ppm platinum complex by weight 100 ︰ 0.08 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 0.85% and isopropyl ether by weight 100 ︰ 2.5 ︰ 1 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 180g contents of ethylene 0.9%, the first high speed shear dispersing and mixing of 18g white carbon black and 78g silicon resin solution, and then vacuum row bubble 3.5h obtains at 75 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 28g, comprises molar content 10%MDQ and 20%MTQ silicone resin, and M/Q value is 0.7, contents of ethylene 5%, ethanol 16g, toluene 31g.
Embodiment 3
Component A by base-material, pure platinum content be 1400ppm platinum complex by weight 100 ︰ 0.05 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 0.7% and diallyl maleate by weight 100 ︰ 4 ︰ 1.1 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 155g contents of ethylene 2.3%, the first high speed shear dispersing and mixing of 15.5g white carbon black and 65g silicon resin solution, and then vacuum row bubble 4h obtains at 80 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 15g, comprises molar content 10%MDQ and 20%MTQ silicone resin, and M/Q value is 1, contents of ethylene 2.2%, ethanol 22g, toluene 20g.
Embodiment 4
Component A by base-material, pure platinum content be 2400ppm platinum complex by weight 100 ︰ 0.03 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 1% and DEF by weight 100 ︰ 1 ︰ 2 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 200g contents of ethylene 1.7%, the first high speed shear dispersing and mixing of 20g white carbon black and 100g silicon resin solution, and then vacuum row bubble 4.5h obtains at 85 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 38g, comprises molar content 8%MDQ and 15%MTQ silicone resin, and M/Q value is 0.9, contents of ethylene 3%, ethanol 22g, toluene 30g.
Embodiment 5
Component A by base-material, pure platinum content be 2400ppm platinum complex by weight 100 ︰ 0.03 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 0.2% and alkynyl hexalin by weight 100 ︰ 10 ︰ 2.5 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 185g contents of ethylene 0.4%, the first high speed shear dispersing and mixing of 18.5g white carbon black and 77g silicon resin solution, and then vacuum row bubble 5h obtains at 90 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 28g, comprises molar content 6%MDQ and 12%MTQ silicone resin, and M/Q value is 0.9, contents of ethylene 2.1%, ethanol 9g, toluene 32g.
Embodiment 6
Component A by base-material, pure platinum content be 2500ppm platinum complex by weight 100 ︰ 0.01 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 1.5% and eight bromo ether by weight 100 ︰ 0.2 ︰ 5 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 190g contents of ethylene 0.45%, the first high speed shear dispersing and mixing of 19g white carbon black and 79g silicon resin solution, and then vacuum row bubble 5h obtains at 90 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 42g, comprises molar content 10%MDQ and 15%MTQ silicone resin, and M/Q value is 1.2, contents of ethylene 3.5%, ethanol 15g, toluene 15g.
Embodiment 7
Component A by base-material, pure platinum content be 700ppm platinum complex by weight 100 ︰ 0.5 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 0.5% and propiolic alcohol by weight 100 ︰ 2 ︰ 4 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 200g contents of ethylene 1.9%, the first high speed shear dispersing and mixing of 20g white carbon black and 105g silicon resin solution, and then vacuum row bubble 6h obtains at 95 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 45g, comprises molar content 5%MDQ and 15%MTQ silicone resin, and M/Q value is 1.1, contents of ethylene 3%, ethanol 18g, toluene 30g.
Embodiment 8
Component A by base-material, pure platinum content be 700ppm platinum complex by weight 100 ︰ 0.5 mix and form, B component by the containing hydrogen silicone oil of base-material, hydrogen content 0.5% and ethylene glycol monobutyl ether by weight 100 ︰ 2 ︰ 4 mix and form.During use, by the 1 ︰ 1 Homogeneous phase mixing use in mass ratio of two components.
Aforesaid base-material is by the bi-vinyl silicone oil of 300g contents of ethylene 1.8%, the first high speed shear dispersing and mixing of 30g white carbon black and 40g silicon resin solution, and then vacuum row bubble 3h obtains at 100 DEG C.
Silicon resin solution composed as follows:
MQ silicone resin 10g, comprises molar content 6%MDQ and 16%MTQ silicone resin, and M/Q value is 0.8, contents of ethylene 2.8%, ethanol 16g, toluene 22g.
Product performance are tested:
In order to investigate mechanical property and the transmittance of obtained high transparency room temperature deep cure electron pouring sealant, the present invention is by A/B component obtained in each embodiment, 1 ︰ 1 mixes in mass ratio, make 2mm heavy-gage rubber sheet, after completion of cure, according to the transmittance of GB/T2410-80 test material, according to the mechanical property thermal resistance of GB/T528-1988 test material.Mechanical property comprises shore hardness, elongation at break and tensile strength.
Test result is as following table:
Claims (9)
1. a high transparency room temperature deep cure electron pouring sealant, is characterized in that: comprise component A and B component, described component A by base-material and platinum complex by weight 100 ︰ 0.01 ~ 0.5 mix and form, described B component is by base-material, containing hydrogen silicone oil and inhibitor by weight 100 ︰ 0.2 ~ 10 ︰ 0.01 ~ 5 mix and form, described base-material is by bi-vinyl silicone oil, white carbon black and silicon resin solution are by weight the first high speed shear dispersing and mixing of 100 ︰ 10 ︰ 10 ~ 50, then obtain through 70 ~ 100 DEG C of vacuum desolvation agent 3 ~ 6h, described inhibitor is propiolic alcohol, 1, 4-butynediol, alkynyl hexalin, isopropyl ether, ethylene glycol monobutyl ether, eight bromo ether, diallyl maleate or DEF, described silicon resin solution is the ethanol and the toluene mixed solution that contain MQ silicone resin.
2. high transparency room temperature deep cure electron pouring sealant according to claim 1, is characterized in that: described white carbon black specific surface area is 150 ~ 200m
2/ g.
3. high transparency room temperature deep cure electron pouring sealant according to claim 1, it is characterized in that: described platinum complex is the coordinate platinum complex that thiazolinyl end-blocking main chain is made up of organopolysiloxane, wherein relative to A and B component gross weight, platinum consumption is 400 ~ 2500ppm.
4. high transparency room temperature deep cure electron pouring sealant according to claim 1, is characterized in that: the vinyl mass content of described MQ silicone resin is 2 ~ 5%, MQ ratio is 0.7 ~ 1.3.MQ silicone resin accounts for 2% ~ 10% of silicon resin solution gross weight.
5. high transparency room temperature deep cure electron pouring sealant according to claim 1, it is characterized in that: also comprise MDQ and MTQ silicone resin in described silicon resin solution, wherein the molar mass of D unit and T unit is respectively 5% ~ 10% and 15% ~ 20%.
6. high transparency room temperature deep cure electron pouring sealant according to claim 1, is characterized in that: described bi-vinyl silicone oil refers to that the vinyl mass content in molecule is the bi-vinyl silicone oil of 0.25 ~ 3%.
7. high transparency room temperature deep cure electron pouring sealant according to claim 1, is characterized in that: the viscosity of described base-material is 100 ~ 20000mPaS.
8. high transparency room temperature deep cure electron pouring sealant according to claim 1, is characterized in that: described containing hydrogen silicone oil is the containing hydrogen silicone oil of silicon hydrogen in the middle of molecular chain, and viscosity is 20 ~ 100PaS, and in molecule, silicon hydrogen richness is 0.1 ~ 1.5%.
9. high transparency room temperature deep cure electron pouring sealant according to claim 1, is characterized in that: described component A and B component in use in mass ratio 1 ︰ 1 mix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511008523.1A CN105505301A (en) | 2015-12-29 | 2015-12-29 | Highly-transparent room temperature deep curing type electronic pouring sealant |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511008523.1A CN105505301A (en) | 2015-12-29 | 2015-12-29 | Highly-transparent room temperature deep curing type electronic pouring sealant |
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| CN105505301A true CN105505301A (en) | 2016-04-20 |
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| CN201511008523.1A Pending CN105505301A (en) | 2015-12-29 | 2015-12-29 | Highly-transparent room temperature deep curing type electronic pouring sealant |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108587559A (en) * | 2018-05-21 | 2018-09-28 | 广州市淳淇新材料有限公司 | A kind of novel organosilicon casting glue and preparation method thereof |
| CN112480863A (en) * | 2020-12-04 | 2021-03-12 | 晟大科技(南通)有限公司 | Preparation method of organic silicon pouring sealant |
| CN114702829A (en) * | 2022-03-23 | 2022-07-05 | 江苏天辰新材料股份有限公司 | Addition type silicone rubber for chip transmission film and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205235A (en) * | 2013-02-19 | 2013-07-17 | 浙江中天氟硅材料有限公司 | Novel transparent deep curing electronic pouring sealant and preparation method thereof |
-
2015
- 2015-12-29 CN CN201511008523.1A patent/CN105505301A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205235A (en) * | 2013-02-19 | 2013-07-17 | 浙江中天氟硅材料有限公司 | Novel transparent deep curing electronic pouring sealant and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李子东等: "《胶黏剂助剂》", 30 June 2009, 化学工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108587559A (en) * | 2018-05-21 | 2018-09-28 | 广州市淳淇新材料有限公司 | A kind of novel organosilicon casting glue and preparation method thereof |
| CN112480863A (en) * | 2020-12-04 | 2021-03-12 | 晟大科技(南通)有限公司 | Preparation method of organic silicon pouring sealant |
| CN114702829A (en) * | 2022-03-23 | 2022-07-05 | 江苏天辰新材料股份有限公司 | Addition type silicone rubber for chip transmission film and preparation method thereof |
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Application publication date: 20160420 |