CN108770198A - A kind of circuit board being packaged with chip component - Google Patents
A kind of circuit board being packaged with chip component Download PDFInfo
- Publication number
- CN108770198A CN108770198A CN201810551682.3A CN201810551682A CN108770198A CN 108770198 A CN108770198 A CN 108770198A CN 201810551682 A CN201810551682 A CN 201810551682A CN 108770198 A CN108770198 A CN 108770198A
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- China
- Prior art keywords
- pad
- jin
- areas
- conductive foil
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of circuit board being packaged with chip component, the areas Jin Bu are provided in conductive foil, the areas Jin Bu cover the side that paragraph is preset in the pad；It is not provided with the conductive foil in the areas Jin Bu；Pass through the chip component of solder and the pad solder.Conductive foil will not be provided in the above-mentioned areas Jin Bu, and the above-mentioned areas Jin Bu cover the part side of pad so that conductive foil can be only in contact by another part side with pad.The area contacted between conductive foil and pad side can be reduced by the way that the areas Jin Bu are arranged, to reduce conductive foil due to cooling meat to the tractive force of chip component, and then reduces the occurrence of setting up a monument.Simultaneously under normal conditions, the pin that chip component is in contact with conductive foil only needs to transmit electric current, the contact area of conductive foil is limited there is no specific, to be impacted to signal caused by chip component.
Description
Technical field
The present invention relates to PCB design fields, more particularly to a kind of circuit board being packaged with chip component.
Background technology
With the continuous progress of science and technology in recent years, the structure and manufacture craft of PCB (printed circuit board) have been achieved for
Greatly development.
At this stage, usually require to be provided with chip component in pcb board.So-called chip component needs to be directly attached to
The positive component of pcb board.
In the prior art, it will usually chip component is welded on pcb board surface using solder reflow techniques.But existing
In technology, chip component is welded on pcb board surface by solder reflow techniques and often will appear the case where setting up a monument.When setting up a monument
The case where, it usually needs chip component is welded on pcb board surface by staff again manually, to significantly increase PCB
The Production Time of plate and cost of manufacture.
Invention content
The object of the present invention is to provide a kind of circuit board being packaged with chip component, the hair for the situation that can effectively prevent setting up a monument
It is raw.
In order to solve the above technical problems, the present invention provides a kind of circuit board being packaged with chip component, the circuit board packet
It includes：
At least two pads；
At least one conductive foil being in contact with any pad；Wherein, the areas Jin Bu, the taboo are provided in the conductive foil
Cloth area covers the side that paragraph is preset in the pad；It is not provided with the conductive foil in the areas Jin Bu；
Pass through the chip component of solder and the pad solder.
Optionally, the conductive foil is copper foil.
Optionally, the encapsulating structure includes two pads, and the pad is rectangular pads.
Optionally, the solder is solder(ing) paste.
Optionally, the circuit board includes the first pad and the second pad, wherein first pad and the conductive foil
It is in contact, second pad is in contact with signal wire；
The length for the side that the signal wire and second pad are in contact and the conductive foil and first pad
Difference between the length for the side being in contact is within a preset range.
Optionally, the areas Jin Bu include the first areas Jin Bu, the second areas Jin Bu and the areas third Jin Bu；Wherein the first areas Jin Bu
Cover side of first pad towards second pad side；Distinguish with the areas the third Jin Bu in the areas second Jin Bu
Cover turning of first pad backwards to the side both ends of second pad side.
Optionally, first pad and the second pad are the square pad that the length of side is 20mil, and described first prohibits cloth
The long length of side 30mil in area, the long 11mil of short side；The areas second Jin Bu and the areas the third Jin Bu be the length of side be 11mil just
The rectangular areas Jin Bu, the areas first Jin Bu, the areas second Jin Bu and the areas the third Jin Bu protrude first pad side
The width in region be 5mil.
A kind of circuit board being packaged with chip component provided by the present invention, including at least two pads；With any pad
At least one conductive foil being in contact；Wherein, the areas Jin Bu are provided in the conductive foil, the areas Jin Bu cover in the pad
The side of default paragraph；It is not provided with the conductive foil in the areas Jin Bu；Pass through the sheet of solder and the pad solder
Element.Conductive foil will not be provided in the above-mentioned areas Jin Bu, and the above-mentioned areas Jin Bu cover the part side of pad so that conductive foil is only
It can be only in contact with pad by another part side.It can be reduced by the areas setting Jin Bu and be connect between conductive foil and pad side
Tactile area to reduce conductive foil due to cooling meat to the tractive force of chip component, and then reduces the occurrence of setting up a monument.
Simultaneously under normal conditions, the pin that chip component is in contact with conductive foil only needs to transmit electric current, for the contact surface of conductive foil
Product is limited there is no specific, to be impacted to signal caused by chip component.
Description of the drawings
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing is briefly described needed in technology description, it should be apparent that, the accompanying drawings in the following description is only this hair
Some bright embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
A kind of structural schematic diagram for circuit board being packaged with chip component that Fig. 1 is provided by the embodiment of the present invention；
Fig. 2 is packaged with the structural schematic diagram of the circuit board of chip component by the another kind that the embodiment of the present invention provides；
The another kind that Fig. 3 is provided by the embodiment of the present invention is specifically packaged with the structural representation of the circuit board of chip component
Figure.
In figure：1. chip component, 2. pads, 21. first pads, 22. second pads, 3. conductive foils, 4. areas Jin Bu, 41.
First areas Jin Bu, 42. second areas Jin Bu, 43. areas third Jin Bu, 5. signal wires.
Specific implementation mode
Core of the invention is to provide a kind of circuit board being packaged with chip component.In the prior art, passing through reflux
When welding technology welds chip component, it will usually heat the weldering between chip component and pad by heating meanss such as hot winds
Material, at the same time can heat the components such as the conductive foil being in contact with pad in whole circuit board.When conductive foil cooling meat, meeting
Tractive force is generated to chip component, to generate the case where setting up a monument.
And a kind of circuit board being packaged with chip component provided by the present invention, including at least two pads；With any weldering
At least one conductive foil that disk is in contact；Wherein, the areas Jin Bu are provided in the conductive foil, the areas Jin Bu cover the pad
In preset paragraph side；It is not provided with the conductive foil in the areas Jin Bu；Pass through the piece of solder and the pad solder
The very best part.Conductive foil will not be provided in the above-mentioned areas Jin Bu, and the above-mentioned areas Jin Bu cover the part side of pad so that conductive foil
It can be only in contact with pad by another part side.It can be reduced between conductive foil and pad side by the way that the areas Jin Bu are arranged
The area of contact to reduce conductive foil due to cooling meat to the tractive force of chip component, and then reduces the hair for situation of setting up a monument
It is raw.Simultaneously under normal conditions, the pin that chip component is in contact with conductive foil only needs to transmit electric current, the contact for conductive foil
Area is limited there is no specific, to be impacted to signal caused by chip component.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
Referring to FIG. 1, a kind of structure for circuit board being packaged with chip component that Fig. 1 is provided by the embodiment of the present invention is shown
It is intended to.
Referring to Fig. 1, in embodiments of the present invention, the circuit board includes at least two pads 2；Connect with any pad 2
Tactile at least one conductive foil 3；Wherein, the areas Jin Bu 4 are provided in the conductive foil 3, the areas Jin Bu 4 cover the pad 2
In preset paragraph side；It is not provided with the conductive foil 3 in the areas Jin Bu 4；It is welded by solder and the pad 2
Chip component 1.
Above-mentioned chip component 1 in embodiments of the present invention can be flaky electric capacity or pellet inductor etc., as long as
Chip component 1, the concrete type in relation to chip component 1 in embodiments of the present invention and are not specifically limited.
Above-mentioned pad 2 is the pad 2 of the corresponding same chip component 1, it is generally the case that chip component 1 has multiple draw
Foot, while the pad 2 in the circuit board with multiple pins in the same chip component 1 of multiple correspondences.Above-mentioned pad 2 it is specific
Structure is referred to the prior art, in embodiments of the present invention and is not specifically limited.
Corresponding in multiple pads 2 of the same chip component 1, each pad 2 only can be with most conductions
Foil 3 is in contact.Certainly, the same conductive foil 3 can be in contact with multiple pads 2, but be electrically connected with the same chip component 1
Pad 2 cannot be in contact with the same conductive foil 3.
Under normal conditions, for the ease of the setting of pad 2, and the contact area between pad 2 and conductive foil 3 is controlled,
In embodiments of the present invention, above-mentioned pad 2 is rectangular pads 2, is preferably square pad 2.
When the needs of pad 2 are in contact with conductive foil 3, at least three sides can be with conductive foil 3 in pad 2 at this stage
It completely attaches to, entire pad 2 can be completely attached to conductive foil 3 under normal conditions.But when pad 2 is in contact with conductive foil 3
When, the signal transmitted in the pin for illustrating to connect 2 points of the pad is only electric current, logical for the size of the electric current at this stage
Specific requirement is not often done, i.e., there is no specific requirements for the contact area between pad 2 and conductive foil 3 at this stage.
It is provided with the areas Jin Bu 4 in above-mentioned conductive foil 3, that is, forbids wiring area.Above-mentioned lead is not provided in the areas Jin Bu 4
Electric foil 3, that is, the conductive foil 3 for being provided with the areas Jin Bu 4 is engraved structure, wherein by the region areas Ji Jinbu 4 of hollow out.
In embodiments of the present invention, the areas Jin Bu 4 cover the side that paragraph is preset in the pad 2.I.e. above-mentioned taboo cloth
Area 4 can cover the part side of pad 2, and conductive foil 3 can be in contact with the side that not banned cloth area 4 covers in pad 2, with reality
Existing being electrically connected between conductive foil 3 and pad 2.It should be noted that the above-mentioned areas Jin Bu 4 will not cover whole sides of pad 2,
Because conductive foil 3 would not be in contact with the pad 2 at this time.
Above-mentioned chip component 1 would generally be welded by solder and above-mentioned pad 2.In embodiments of the present invention, for above-mentioned
The specific ingredient of solder is simultaneously not specifically limited, as long as can be welded to each other chip component 1 and pad 2, depending on concrete condition
Depending on.Under normal conditions, in embodiments of the present invention, solder(ing) paste can be used as solder by above-mentioned chip component 1 and 2 phase of pad
Mutually welding.
Preferably, in embodiments of the present invention, in order to reduce the cost of manufacture of circuit board, above-mentioned conductive foil 3 is preferred
For copper foil.Certainly, above-mentioned conductive foil 3 can also have other materials to be made, and the specific material in relation to above-mentioned conductive foil 3 is in the present invention
In embodiment and it is not specifically limited.
Under normal conditions, in embodiments of the present invention, there are two pins for the tool of the chip component 1, accordingly in circuit board
The middle correspondence chip component 1 two pads 2 need to set.
In at least two pads 2 of the same chip component of above-mentioned correspondence 1, at least one pad 2 needs and conductive foil 3
It is in contact.By taking chip component 1 corresponds to two pads 2 as an example, in the two pads 2 can only there are one pad 2 with lead
Electric foil 3 is in contact, and another pad 2 can then be in contact with signal wire 5.Such case will be done in detail in following inventive embodiments
It is thin to introduce, it is no longer repeated herein.
By taking a chip component 1 corresponds to two pads 2 as an example, the two pads 2 can connect with two conductive foils 3 respectively
It touches.The above-mentioned areas Jin Bu 4 can effectively reduce the contact area between 2 side of conductive foil 3 and pad at this time, in Reflow Soldering
During processing procedure, even if the speed that above-mentioned two conductive foil 3 cools down is different, therefore larger lead will not be generated to a direction
Gravitation, the occurrence of so as to cause setting up a monument.
In embodiments of the present invention, the position of all parts in being usually required to circuit board between making foregoing circuit plate
It sets and is designed and is laid out.During designing foregoing circuit plate in software, it will usually in the encapsulation of above-mentioned pad 2
Route keepout levels are added in structure, and wiring area is forbidden in addition in the level, this forbids wiring area to correspond to
The above-mentioned areas Jin Bu 4.Under normal conditions, wiring area and the encapsulating structure of pad 2 this can be forbidden mutually to bind.It states in use
When being provided with 2 encapsulating structure of pad for forbidding wiring area, forbid wiring area that would not be arranged corresponding to above-mentioned in software
Have conductive foil 3, correspond to actual product circuit board in, i.e., conductive foil 3 be engraved structure, wherein by the region of hollow out be on
The areas Shu Jinbu 4, the above-mentioned areas Jin Bu 4 can cover the part side of corresponding pad 2.
A kind of circuit board being packaged with chip component 1 that the embodiment of the present invention is provided, including at least two pads 2；With
At least one conductive foil 3 that any pad 2 is in contact；Wherein, the areas Jin Bu 4, the areas Jin Bu 4 are provided in the conductive foil 3
Cover the side that paragraph is preset in the pad 2；It is not provided with the conductive foil 3 in the areas Jin Bu 4；Pass through solder and institute
State the chip component 1 of the welding of pad 2.Conductive foil 3 will not be provided in the above-mentioned areas Jin Bu 4, and the above-mentioned areas Jin Bu 4 cover pad 2
Part side so that conductive foil 3 can be only in contact by another part side with pad 2.It can be with by the way that Jin Bu areas 4 are arranged
The area contacted between conductive foil 3 and 2 side of pad is reduced, to reduce conductive foil 3 due to cooling meat to chip component 1
Tractive force, and then reduce the occurrence of setting up a monument.Simultaneously under normal conditions, the pin that chip component 1 is in contact with conductive foil 3
It needs to transmit electric current, the contact area of conductive foil 3 be limited there is no specific, thus will not be to caused by chip component 1
Signal impacts.
In at least two pads 2 of the corresponding same chip component 1, only it is in contact with conductive foil 3 there are one pad 2,
And be in contact with signal wire 5 concrete structure of circuit board of this case of another pad 2 will be done in detail in following inventive embodiments
It is thin to introduce.
It please refers to Fig.2 and Fig. 3, Fig. 2 is packaged with the circuit board of chip component 1 by the another kind that the embodiment of the present invention provides
Structural schematic diagram；The another kind that Fig. 3 is provided by the embodiment of the present invention is specifically packaged with the knot of the circuit board of chip component 1
Structure schematic diagram.
It is different from foregoing invention embodiment, the embodiment of the present invention is on the basis of foregoing invention embodiment, further
For being only in contact with conductive foil 3 there are one pad 2, and another pad 2 be in contact with signal wire 5 this case that circuit board
Concrete structure specifically limited.Remaining content is described in detail in foregoing invention embodiment, herein no longer into
Row repeats.
Referring to Fig. 2, in embodiments of the present invention, the circuit board includes the first pad 21 and the second pad 22, wherein institute
It states the first pad 21 to be in contact with the conductive foil 3, second pad 22 is in contact with signal wire 5；The signal wire 5 and institute
State the length for the side that the length of the side that the second pad 22 is in contact is in contact with the conductive foil 3 and first pad 21
Between difference within a preset range.
Above-mentioned first pad 21 is two welderings that same chip component 1 is corresponded in foregoing invention embodiment with the second pad 22
Disk 2, only in embodiments of the present invention by the two pads 2 be referred to as the first pad 21 and the second pad 22, be not
Chip component 1 is also corresponding with the weldering of the first pad 21 and second other than corresponding above-mentioned two pad 2 in the embodiment of the present invention
Disk 22.
The above-mentioned pad 2 being in contact with conductive foil 3 is the first pad 21, and the above-mentioned pad 2 being in contact with signal wire 5 is
Second pad 22.In relation between the first pad 21 and conductive foil 3 concrete structure and connection relation foregoing invention implement
It is described in detail in example, is no longer repeated herein.
Above-mentioned signal wire 5 is usually a very thin metal wire, and the length that signal wire 5 is in contact with 22 side of the second pad
Degree will usually be less than the length for the side that the second pad 22 is in contact with signal wire 5.Certainly, in embodiments of the present invention for letter
The specific material of number line 5 is simultaneously not specifically limited, and is determined on a case-by-case basis.Under normal conditions, above-mentioned signal wire 5 is copper wire.
In embodiments of the present invention, the length for the side that the signal wire 5 and second pad 22 are in contact with it is described
Difference between the length for the side that conductive foil 3 and first pad 21 are in contact is within a preset range.
When two pads 2 of the same chip component of correspondence 1 are in contact with conductive foil 3 and signal wire 5 respectively, due to
The contact area of 21 side of conductive foil 3 and the first pad will be far longer than the contact area of 22 side of conductor wire and the second pad,
So more easily there is a situation where set up a monument for above structure in Reflow Soldering processing procedure.So in embodiments of the present invention, needing leading
The above-mentioned areas Jin Bu 4 are set in electric foil 3, so that the contact area between 21 side of conductive foil 3 and the first pad becomes smaller, so that
The length for the side that the length for the side that conductive foil 3 and the first pad 21 are in contact is in contact with signal wire 5 and the second pad 22
Between difference within a preset range, to avoid the occurrence of setting up a monument.
Specifically, in embodiments of the present invention, above-mentioned difference is typically the side that conductive foil 3 and the first pad 21 are in contact
Be in contact no more than signal wire 5 and the second pad 22 twice of the length of side of length.Certainly, conductive foil under normal conditions
3 and first the length of side that is in contact of pad 21 need the length of the side being in contact slightly larger than signal wire 5 and the second pad 22
Degree.The side that the length for the side that i.e. conductive foil 3 and the first pad 21 are in contact is in contact with signal wire 5 and the second pad 22
Difference between length needs in the range of zero to one times of 5 width of signal wire, can effectively reduce feelings of setting up a monument in the range
The generation of condition.
As shown in Fig. 2, above-mentioned signal wire 5 usually only can be with the side phase backwards to 21 side of the first pad in the second pad 22
Contact can only apply the tractive force backwards to 21 side of the first pad in Reflow Soldering processing procedure to the second pad 22 accordingly, in order to
This tractive force is offset, needs to cover the first pad 21 towards the side of 22 side of the second pad by the areas Jin Bu 4.Specifically
, in embodiments of the present invention, the areas Jin Bu 4 include the first areas Jin Bu 41, the second areas Jin Bu 42 and the areas third Jin Bu 43；Its
In the first areas Jin Bu 41 cover side of first pad 21 towards 22 side of the second pad；The areas second Jin Bu 42
First pad 21 is covered each by with the areas the third Jin Bu 43 to turn backwards to the side both ends of 22 side of the second pad
Angle.
The above-mentioned areas Jin Bu 4 include the first areas Jin Bu 41, the second areas Jin Bu 42 and the areas third Jin Bu 43.Above-mentioned first prohibits cloth
Area 41 needs to cover side of first pad 21 towards 22 side of the second pad, preferably, the areas above-mentioned first Jin Bu 41 need
Whole side of first pad 21 towards 22 side of the second pad is covered, court is applied to the first pad 21 to avoid conductive foil 3
To the tractive force of 22 side of the second pad.
It, can be of the invention real in order to further reduce the contact area between 21 side of conductive foil 3 and the first pad
It applies and the second areas Jin Bu 42 and the areas third Jin Bu 43 is further set in example.In order to balance the first pad 21 in Reflow Soldering processing procedure
Stress in the process, the areas second Jin Bu 42 are covered each by first pad 21 backwards to described with the areas the third Jin Bu 43
The turning at the side both ends of 22 side of the second pad.
Referring to Fig. 3, the concrete structure of above-mentioned pad 2 and the above-mentioned areas Jin Bu 4 will be described in detail below.
In embodiments of the present invention, first pad, 21 and second pad 22 be the length of side be 19mil between 21mil
Square pad 2, the long length of side 29mil in the areas first Jin Bu 41 between 31mil, short side long 10mil to 12mil it
Between；It is 10mil to the square areas Jin Bu between 12mil that the areas second Jin Bu 42 and the areas the third Jin Bu 43, which are the length of side,
The area 4, first Jin Bu 41, the areas second Jin Bu 42 and the areas the third Jin Bu 43 protrude 21 side of the first pad
The width in region is 4mil between 6mil.
Preferably, in embodiments of the present invention, first pad, 21 and second pad 22 is that the length of side is 20mil
Square pad 2, the long length of side 30mil in the areas first Jin Bu 41, the long 11mil of short side；The areas second Jin Bu 42 and institute
It is the square areas Jin Bu 4 that the length of side is 11mil, the areas first Jin Bu 41, the areas second Jin Bu to state the areas third Jin Bu 43
The width that the areas the 42 and third Jin Bu 43 protrude the region of 21 side of the first pad is 5mil.
Under normal conditions, the width for the signal wire 5 being in contact with the second pad 22 is 14mil, corresponding signal wire 5 and the
The length that two pads, 22 side is in contact is 14mil.By above-mentioned first pad 21, the second pad 22, the first areas Jin Bu 41, second
When the areas Jin Bu 42 and the areas third Jin Bu 43 are arranged to above structure, due to the areas first Jin Bu 41, the areas second Jin Bu
The width that the areas the 42 and third Jin Bu 43 protrude the region of 21 side of the first pad is 5mil, at this time only in the first weldering
There are one section of preset sides for three sides of disk 21, and the length of every reserved side is 8mil, and conductive foil 3 can pass through at this time
Above-mentioned three reserved sides are in contact with the first pad 21, are in contact between conductive foil 3 and the side of the first pad 21 at this time
Length be 24mil.And since under normal conditions, the length that signal wire 5 is in contact with 22 side of the second pad is 14mil, this
When the length that is in contact of conductive foil 3 and the first length being in contact of pad 21 and signal wire 5 and the second pad 22 between ratio
It is 12:7, the occurrence of setting up a monument can be significantly reduced under this ratio.
A kind of circuit board being packaged with chip component 1 that the embodiment of the present invention is provided, wherein first pad 21 with
The conductive foil 3 is in contact, and second pad 22 is in contact the signal wire 5 and 22 phase of the second pad with signal wire 5
Difference between the length for the side that the length of the side of contact is in contact with the conductive foil 3 and first pad 21 is pre-
If in range.For being only in contact with conductive foil 3 there are one pad 2, and another pad 2 is in contact this feelings with signal wire 5
Condition can be significantly reduced the occurrence of setting up a monument by above structure.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with it is other
The difference of embodiment, just to refer each other for same or similar part between each embodiment.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only that
A little elements, but also include other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of circuit board being packaged with chip component provided by the present invention is described in detail above.It answers herein
With specific case, principle and implementation of the present invention are described, and the explanation of above example is only intended to help to manage
Solve the method and its core concept of the present invention.It should be pointed out that for those skilled in the art, not departing from
, can be with several improvements and modifications are made to the present invention under the premise of the principle of the invention, these improvement and modification also fall into this hair
In bright scope of the claims.
Claims (7)
1. a kind of circuit board being packaged with chip component, which is characterized in that the circuit board includes：
At least two pads；
At least one conductive foil being in contact with any pad；Wherein, the areas Jin Bu, the areas Jin Bu are provided in the conductive foil
Cover the side that paragraph is preset in the pad；It is not provided with the conductive foil in the areas Jin Bu；
Pass through the chip component of solder and the pad solder.
2. circuit board according to claim 1, which is characterized in that the conductive foil is copper foil.
3. circuit board according to claim 2, which is characterized in that the encapsulating structure includes two pads, described
Pad is rectangular pads.
4. circuit board according to claim 3, which is characterized in that the solder is solder(ing) paste.
5. according to the circuit board described in any one of Claims 1-4 claim, which is characterized in that the circuit board includes the
One pad and the second pad, wherein first pad is in contact with the conductive foil, second pad connects with signal wire
It touches；
The length for the side that the signal wire and second pad are in contact connects with the conductive foil and first pad
Difference between the length of tactile side is within a preset range.
6. circuit board according to claim 5, which is characterized in that the areas Jin Bu include the first areas Jin Bu, the second taboo cloth
Area and the areas third Jin Bu；Wherein the first areas Jin Bu cover side of first pad towards second pad side；It is described
Second areas Jin Bu and the areas the third Jin Bu are covered each by side both ends of first pad backwards to second pad side
Turning.
7. circuit board according to claim 6, which is characterized in that first pad and the second pad are that the length of side is
19mil is to the square pad between 21mil, and for the long length of side 29mil in the areas first Jin Bu between 31mil, short side is long
10mil is between 12mil；The areas second Jin Bu and the areas the third Jin Bu be the length of side be 10mil between 12mil just
The rectangular areas Jin Bu, the areas first Jin Bu, the areas second Jin Bu and the areas the third Jin Bu protrude first pad side
The width in region be 4mil between 6mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810551682.3A CN108770198A (en) | 2018-05-31 | 2018-05-31 | A kind of circuit board being packaged with chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810551682.3A CN108770198A (en) | 2018-05-31 | 2018-05-31 | A kind of circuit board being packaged with chip component |
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| Publication Number | Publication Date |
|---|---|
| CN108770198A true CN108770198A (en) | 2018-11-06 |
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| CN201810551682.3A Pending CN108770198A (en) | 2018-05-31 | 2018-05-31 | A kind of circuit board being packaged with chip component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114222425A (en) * | 2021-12-17 | 2022-03-22 | 浪潮商用机器有限公司 | PCB pad and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7098408B1 (en) * | 2003-10-14 | 2006-08-29 | Cisco Technology, Inc. | Techniques for mounting an area array package to a circuit board using an improved pad layout |
| CN101426334A (en) * | 2007-10-29 | 2009-05-06 | 英业达股份有限公司 | Soldering pad construction for printed circuit board |
| CN104470229A (en) * | 2014-12-18 | 2015-03-25 | 浪潮(北京)电子信息产业有限公司 | Method and device for removing copper foil on pins of PCB element |
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2018
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| US7098408B1 (en) * | 2003-10-14 | 2006-08-29 | Cisco Technology, Inc. | Techniques for mounting an area array package to a circuit board using an improved pad layout |
| CN101426334A (en) * | 2007-10-29 | 2009-05-06 | 英业达股份有限公司 | Soldering pad construction for printed circuit board |
| CN104470229A (en) * | 2014-12-18 | 2015-03-25 | 浪潮(北京)电子信息产业有限公司 | Method and device for removing copper foil on pins of PCB element |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114222425A (en) * | 2021-12-17 | 2022-03-22 | 浪潮商用机器有限公司 | PCB pad and circuit board |
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Application publication date: 20181106 |