CN108012415A - Surface Mount pad structure, printed circuit board and its preparation process - Google Patents
Surface Mount pad structure, printed circuit board and its preparation process Download PDFInfo
- Publication number
- CN108012415A CN108012415A CN201711145204.4A CN201711145204A CN108012415A CN 108012415 A CN108012415 A CN 108012415A CN 201711145204 A CN201711145204 A CN 201711145204A CN 108012415 A CN108012415 A CN 108012415A
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- China
- Prior art keywords
- sub
- pad
- area
- surface mount
- main weldering
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
Abstract
The present invention provides a kind of Surface Mount pad structure, printed circuit board and its preparation process, it is related to integrated circuit fields.The Surface Mount pad structure includes main weldering panel and sub- pad area.Wherein, the one end in main weldering panel is used to be connected with the signal lead of printed circuit board, and the other end is used to be connected with electronic component.Sub- pad area is arranged at the other end in main weldering panel, and the length on sub- pad area as the region of stub is less than or equal to 12mil.Surface Mount pad structure, printed circuit board and its preparation process provided in an embodiment of the present invention have taken into account signal quality and technique processing, the effectively stub length of control pad, lift the performance of full link while, the connection reliability of electronic component and Surface Mount pad structure during beneficial to large-scale processing.
Description
Technical field
The present invention relates to integrated circuit fields, in particular to a kind of Surface Mount pad structure and use the Surface Mount pad
The printed circuit board of structure.
Background technology
The one of predominant package type of optical port connector is SMD Surface Mount pad forms.With the increase of signal rate, table
The corresponding Surface Mount pad of patch connector can have a huge impact electric property.General Surface Mount pad can produce electric stub
(stub), stub is a kind of useless signal branch, and not in signal flow direction, usual terminal open circuit is formed after reflection to signal matter
Amount produces serious adverse effect, can influence the impedance of signal link, reflecting to form resonance by terminal open circuit when serious causes
Signal can not transmit.
In addition, although another Surface Mount pad completely eliminates the influence of stub, but this Surface Mount pad is disappearing completely
While except stub, also result in Surface Mount pad and welding material is not present in the side that stub is completely eliminated so that connected during welding
The side that stub cannot be completely eliminated in device pin from Surface Mount pad attracts welding material, causes connector pin to be connected not with pad
Reliably；Connector position when on the other hand, due to actual welding, no matter toward which direction offset, all can it is possible that offset
The wherein connection area of a terminal adapter and pad reduction is caused, therefore this Surface Mount pad reliability reduces, and is unfavorable for advising greatly
Mould is processed.
In view of this, soldering reliability can either be ensured by how designing one kind, and disclosure satisfy that the resistance of Surface Mount pad
The Surface Mount pad structure that can be required becomes technical staff's problems faced.
The content of the invention
It is an object of the present invention to providing a kind of Surface Mount pad structure, it can either ensure that the welding of electronic component can
It by property, and can significantly optimize the impedance behavior of Surface Mount pad structure, meet the requirements the impedance behavior of Surface Mount pad structure.
Another object of the present invention is to provide a kind of printed circuit board, it can either ensure that the welding of electronic component is reliable
Property, and can significantly optimize the impedance behavior of Surface Mount pad structure, meet the requirements the impedance behavior of Surface Mount pad structure.
A further object of the present invention is to provide a kind of preparation method of printed circuit board, it can either ensure electronic component
Soldering reliability, and can significantly optimize the impedance behavior of Surface Mount pad structure, make the impedance behavior of Surface Mount pad structure
Meet the requirements.
What the embodiment of the present invention was realized in：
A kind of Surface Mount pad structure, for connecting printed circuit board and electronic component, the Surface Mount pad structure includes master
Pad area and sub- pad area.The one end in the main weldering panel is used to be connected with the signal lead of the printed circuit board, the other end
For being connected with the electronic component.The sub- pad area is arranged at the other end in the main weldering panel, on the sub- pad area
Length as the region of stub is less than or equal to 12mil.
Further, the sub- pad area is connected to the other end in the main weldering panel.
Further, the length of the sub- pad area is 8-12mil.
Further, the sub- pad area is connected to the other end in the main weldering panel, and the sub- pad area is away from described
The one end in main weldering panel is provided with the first welding material area, and the first welding material area is used to carry welding material.
Further, the length of the sub- pad area is 3-8mil, and the length in the first welding material area is 5-
10mil。
Further, the sub- pad area includes at least one sub- pad, at least one sub- pad and the main weldering
Panel is arranged at intervals.
Further, it is the second welding material area between the sub- pad and the main weldering panel, the second welding material
Material area is used to carry welding material, and the length in the second welding material area is 3-5mil, and the length of the sub- pad is 5-
8mil。
A kind of printed circuit board, it includes Surface Mount pad structure, electronic component and signal lead, the Surface Mount pad structure
Including main weldering panel and sub- pad area.The one end in the main weldering panel is connected with the signal lead, the other end and the electronics
Element connects.The sub- pad area is arranged at the other end in the main weldering panel, the region on the sub- pad area as stub
Length be less than or equal to 12mil.
A kind of preparation process of printed circuit board, including：Forming processes are carried out to substrate, form main weldering panel and sub- pad
Area；The one end in wherein described main weldering panel is used to be connected with signal lead, and the other end is used to be connected with electronic component, the sub- weldering
Panel is arranged at the other end in the main weldering panel, and the length on the sub- pad area as the region of stub is less than or equal to
12mil。
Further, described the step of carrying out forming processes to substrate, forming main weldering panel and sub- pad area, includes：
Forming processes are carried out to substrate, form the spaced main weldering panel and the sub- pad area.
The beneficial effect of Surface Mount pad structure provided in an embodiment of the present invention, printed circuit board and its preparation process is：By
In having region as stub on sub- pad area, the welding material on sub- pad area, which disclosure satisfy that, welds needs, even if electronics
Element welding when shift, can also ensure to be connected on sub- pad area, thus ensure that electronic component welding when and table
Patch pad structure is reliably connected；On the other hand, due to having the length in the region as stub to be less than or wait on sub- pad area
In 12mil, stub length is reduced, can significantly optimize the impedance behavior of Surface Mount pad structure, make Surface Mount pad structure
Impedance behavior is met the requirements.Therefore, Surface Mount pad structure and printed circuit board provided in an embodiment of the present invention have taken into account signal matter
Amount and technique processing, while effectively controlling the stub length of pad, lifting the performance of full link, beneficial to large-scale processing
When electronic component and Surface Mount pad structure connection reliability.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore be not construed as pair
The restriction of scope, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structure diagram of the surface mount packages pad of printed circuit board provided in an embodiment of the present invention；
Fig. 2 is the structure diagram of the Surface Mount pad structure of printed circuit board provided in an embodiment of the present invention；
Fig. 3 is the structure diagram for the Surface Mount pad structure that first embodiment of the invention provides；
Fig. 4 is the structure diagram for the Surface Mount pad structure that second embodiment of the invention provides；
Fig. 5 is the structure diagram for the Surface Mount pad structure that third embodiment of the invention provides；
Fig. 6 is the structure diagram for the Surface Mount pad structure that fourth embodiment of the invention provides；
Fig. 7 is the structure diagram for the Surface Mount pad structure that fifth embodiment of the invention provides.
Icon：1- surface mount packages pads；20- ground pin pad；30- signal pins；10、100、200、300、400、500-
Surface Mount pad structure；11st, 110,210,310,410,510- main welderings panel；12nd, 120,220,320,420, the sub- pad areas of 520-；
13rd, 111,211,311,411,511- connecting portions；14th, 112,212,312,412,512- contact sites；The first welding materials of 230-
Area；The second welding materials of 330- area；The 3rd welding material areas of 430-；The 4th welding material areas of 530-；The first sub- pads of 321-；
The second sub- pads of 322-；The 3rd sub- pads of 421-；The 4th sub- pads of 521-；The 5th sub- pads of 522-；The 6th sub- pads of 523-.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.The present invention implementation being usually described and illustrated herein in the accompanying drawings
The component of example can be arranged and designed with a variety of configurations.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this area is common
Technical staff's all other embodiments obtained without creative efforts, belong to the model that the present invention protects
Enclose.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
In the description of the present invention, it is to be understood that term " on " etc. instruction orientation or position relationship be based on attached
Orientation or position relationship shown in figure, or the invention product using when the orientation usually put or position relationship, either
The orientation or position relationship that those skilled in the art usually understand, are for only for ease of the description present invention and simplify description, without
It is instruction or implies that signified equipment or element there must be specific orientation, with specific azimuth configuration and operation, therefore not
It is understood that as limitation of the present invention.
In addition, term " first ", " second ", " the 3rd " etc. are only used for distinguishing description, and it is not intended that instruction or hint
Relative importance.
In the description of the present invention, it is also necessary to explanation, unless otherwise clearly defined and limited, term " setting ",
" installation ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or integratedly be connected
Connect；Can mechanically connect or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
Fig. 1 and Fig. 2 are please referred to, an embodiment of the present invention provides a kind of printed circuit board (not shown), it includes table
Paste encapsulation welding tray 1, electronic component (not shown), pin (not shown) and signal lead (not shown).Wherein, surface mount packages weld
Disk 1 includes parallel arrangement of Surface Mount pad structure 10 and ground pin pad 20.Ground pin pad 20 is used to be connected with ground pin.Table
Patch pad structure 10 is used to connect the signal lead of printed circuit board and the signal pin 30 of electronic component, the dotted line arrow in Fig. 2
Head represents signal flow direction.
Wherein, electronic component can be according to accordingly selection, such as electronic component can be connector be actually needed, particularly
High speed connector, further, it is particularly possible to be 56G high-speed optical module connectors.
The Surface Mount pad structure 10 includes main weldering panel 11 and sub- pad area 12.Wherein, main weldering panel 11 includes mutually interconnecting
The connecting portion 13 and contact site 14 connect.Connecting portion 13 be used for be connected with the signal lead of printed circuit board, contact site 14 for
Signal pin 30 connects.Sub- pad area 12 is arranged at the one end of contact site 14 away from connecting portion 13.As residual on sub- pad area 12
The length in the region of stake is less than or equal to 12mil.
It should be noted that the region on sub- pad area 12 as stub, can be the sub- pad area 12 in part or
All sub- pad areas 12.On the one hand, sub- pad area 12 retains a certain amount of for the contact position of signal pin 30 and contact site 14
Welding material, to increase firm welding degree, on the other hand, sub- pad area 12 can make the welding of signal pin 30 and contact site 14
Still ensure that connection is reliable when position shifts.It should be appreciated that signal pin 30 and the welding position of contact site 14 occur partially
During shifting, welded on 30 partial offset of signal pin to sub- pad area 12 and with sub- pad area 12, so that ensure that connection is reliable, and
The part do not welded on sub- pad area 12 with signal pin 30 is stub.In the present embodiment, stub is used as on sub- pad area 12
The length in region be less than or equal to 12mil so that the length of stub is less than or equal to 12mil, under its caused link performance
Drop will not make a big impact signal transmission, disclosure satisfy that the impedance behavior requirement of Surface Mount pad structure 10.
Therefore, because having the region as stub on sub- pad area 12, the welding material on sub- pad area 12 can expire
Foot welding needs, even if electronic component shifts in welding, can also ensure to be connected on sub- pad area 12, so as to ensure
It is reliably connected with Surface Mount pad structure 10 during electronic component welding；On the other hand, since there is conduct on sub- pad area 12
The length in the region of stub is less than or equal to 12mil, reduces stub length, can significantly optimize Surface Mount pad structure 10
Impedance behavior, meets the requirements the impedance behavior of Surface Mount pad structure 10.
In addition, sub- pad area 12 is arranged at the one end of contact site 14 away from connecting portion 13, can be that sub- pad area 12 connects
It is arranged at intervals in the one end of contact site 14 away from connecting portion 13 or sub- pad area 12 with contact site 14.
Structure and principle below by way of specific embodiment to Surface Mount pad structure provided in an embodiment of the present invention：
First embodiment
Referring to Fig. 3, present embodiments providing a kind of Surface Mount pad structure 100, which includes main weldering
Panel 110 and sub- pad area 120.Wherein, main weldering panel 110 includes the connecting portion 111 and contact site 112 being connected with each other.Connection
Portion 111 is used to be connected with the signal lead of printed circuit board, and contact site 112 is used to be connected with the signal pin 30 of electronic component.
Sub- pad area 120 is connected to the one end of contact site 112 away from connecting portion 111.
The length of sub- pad area 120 is less than or equal to 12mil.In the present embodiment, the length of sub- pad area 120 is 8-
12mil.Further, the length of sub- pad area 120 can be 8.5mil, 9mil, 10mil, 11mil, 11.5mil etc..
Decline and signal transmission will not be caused it should be appreciated that length is link performance caused by the stub of 8-12mil
Very big influence, while the amount of the welding material on the sub- pad area 120 of this 8-12mil length welds needs enough, so as to ensure
Connection is reliable, also there is the surplus of 8-12mil even if electronic component welding offset.
Second embodiment
Referring to Fig. 4, present embodiments providing a kind of Surface Mount pad structure 200, which includes main weldering
Panel 210 and sub- pad area 220.Wherein, main weldering panel 210 includes the connecting portion 211 and contact site 212 being connected with each other.Connection
Portion 211 is used to be connected with the signal lead of printed circuit board, and contact site 212 is used to be connected with the signal pin 30 of electronic component.
Sub- pad area 220 is connected to the one end of contact site 212 away from connecting portion 211.
The sub- one end of pad area 220 away from contact site 212 is provided with the first welding material area 230, first welding material
Area 230 is used for the welding material for carrying deposition.
In the present embodiment, the length of sub- pad area 220 is 3-8mil, and further, the length of sub- pad area 220 can be
3.5mil, 4mil, 5mil, 6mil, 7mil etc..The length in the first welding material area 230 is 5-10mil, further, the first weldering
The length for connecing material sections 230 can be 6mil, 7mil, 8mil, 9mil etc..
It should be appreciated that the welding material that the first welding material area 230 can make to be added to sub- pad area 220 increases, weldering
It can ensure that signal pin 30 is attracted to enough welding materials when connecing, also, due to sub- pad area 220 so that signal
Surplus of the welding offset of pin 30 with 3-8mil.In the present embodiment, the length on sub- pad area 220 as the region of stub is
3-8mil, can ensure that link performance caused by stub declines will not make a big impact signal transmission.
3rd embodiment
Referring to Fig. 5, present embodiments providing a kind of Surface Mount pad structure 300, which includes main weldering
Panel 310 and sub- pad area 320.Wherein, main weldering panel 310 includes the connecting portion 311 and contact site 312 being connected with each other.Connection
Portion 311 is used to be connected with the signal lead of printed circuit board, and contact site 312 is used to be connected with the signal pin 30 of electronic component.
Sub- pad area 320 is connected to the one end of contact site 312 away from connecting portion 311.
Sub- pad area 320 includes at least two sub- pads, and two neighboring sub- pad is arranged at intervals.At least two sub- pads
Length may be the same or different.Wherein, the sub- pad near contact site 312 is with being connected to contact site 312 away from being connected
The one end in portion 311, its minor pad is successively along the directional spreding away from contact site 312.
The present embodiment is by taking sub- pad area 320 includes two sub- pads as an example, and situation of the sub- pad more than two is with this class
Push away.For convenience of description, two sub- pads are denoted as the first sub- 321 and second sub- pad 322 of pad respectively.First sub- pad
321 and second have the second welding material area 330 between sub- pad 322, and the second welding material area 330 characterizes the first sub- pad
321 and the second interval between sub- pad 322.The second welding material area 330 is used for the welding material for carrying deposition.Wherein,
First sub- pad 321 is the sub- pad near contact site 312, it is connected to the one end of contact site 312 away from connecting portion 311.
In the present embodiment, the length of the first sub- pad 321 is 3-5mil, and further, the length of the first sub- pad 321 can be
3.5mil, 4mil, 4.5mil etc..The length of second sub- pad 322 is 5-7mil, further, the length of the second sub- pad 322
Can be 5.5mil, 6mil, 6.5mil etc..Spacing between first sub- 321 and second sub- pad 322 of pad, i.e., the second welding
The length of material sections 330 can be 5-10mil, further, the length in the second welding material area 330 can be 6mil, 7mil,
8mil, 9mil etc..
It should be appreciated that the first sub- pad 321 provides the surplus of 3-5mil for the welding offset of signal pin 30, when
When the welding of signal pin 30 is not shifted or is offset on the sub- pad being connected with contact site 312, sub- pad area 320 is made
Length for the region of stub is 3-5mil, and can ensure that link performance caused by stub declines will not cause very signal transmission
It is big to influence.The second welding material area 330 can make to be added to sub- pad area 320 between first sub- 321 and second sub- pad 322 of pad
Welding material increase, when welding, can ensure that signal pin 30 is attracted to enough welding materials.When the weldering of signal pin 30
Connect when not shifting or be offset to on the second sub- pad 322, sub- pad area 320 is 5- as the length in the region of stub
7mil, can ensure that link performance caused by stub declines will not make a big impact signal transmission.
Fourth embodiment
Referring to Fig. 6, present embodiments providing a kind of Surface Mount pad structure 400, which includes main weldering
Panel 410 and sub- pad area 420.Wherein, main weldering panel 410 includes the connecting portion 411 and contact site 412 being connected with each other.Connection
Portion 411 is used to be connected with the signal lead of printed circuit board, and contact site 412 is used to be connected with the signal pin 30 of electronic component.
Sub- pad area 420 is connected to the one end of contact site 412 away from connecting portion 411.
Sub- pad area 420 includes a sub- pad, has the 3rd welding material area between the sub- pad and contact site 412
430, the 3rd welding material area 430 characterizes the interval between the sub- pad and contact site 412.3rd welding material area 430 uses
In the welding material of carrying deposition..In order to facilitate description, which is denoted as the 3rd sub- pad 421.
In the present embodiment, the length of the 3rd sub- pad 421 is 5-8mil, and further, the length of the 3rd sub- pad 421 can
Think 5.5mil, 6mil, 6.5mil, 7mil, 7.5mil etc..The spacing of 3rd sub- pad 421 and contact site 412, i.e., the 3rd weldering
The length for connecing material sections 430 can be 3-5mil, further, the length in the 3rd welding material area 430 can be 3.5mil,
4mil, 4.5mil etc..
It should be appreciated that the 3rd welding material area 430 between the 3rd sub- pad 421 and contact site 412 can ensure
Signal pin 30 is attracted to enough welding materials during welding.Do not shift when signal pin 30 welds, sub- pad area 420
On as stub region length be 0, i.e., no stub., will if signal pin 30 is shifted when welding more than 5mil
It is connected on the 3rd sub- pad 421, still ensures that the reliability of connection, stub is 5-8mil at this time, can ensure that stub causes
Link performance decline will not make a big impact to signal transmission.
5th embodiment
Referring to Fig. 7, present embodiments providing a kind of Surface Mount pad structure 500, which includes main weldering
Panel 510 and sub- pad area 520.Wherein, main weldering panel 510 includes the connecting portion 511 and contact site 512 being connected with each other.Connection
Portion 511 is used to be connected with the signal lead of printed circuit board, and contact site 512 is used to be connected with the signal pin 30 of electronic component.
Sub- pad area 520 is connected to the one end of contact site 512 away from connecting portion 511.
Sub- pad area 520 includes more sub- pads, and contact site 512 and more sub- pads are arranged at intervals successively.Namely
Say, sub- pad and the contact site 512 near contact site 512 are arranged at intervals, and two neighboring sub- pad is also interval setting.
The length of more sub- pads may be the same or different.Spacing between two neighboring may be the same or different, and
And it is two neighboring between spacing can be identical with the spacing between the sub- pad and contact site 512 of contact site 512,
Can be different.
For the present embodiment by taking sub- pad is three as an example, sub- pad is that two or the situation more than three are analogized i.e. with this example
Can.In order to facilitate description, three sub- pads are denoted as the 4th sub- pad 521, the 5th sub- 522 and the 6th sub- pad 523 of pad respectively.
4th sub- pad 521, the 5th sub- 522 and the 6th sub- pad 523 of pad are arranged at intervals two-by-two, wherein, the 4th sub- pad 521 most leans on
Proximity contact portion 512, and there is the 3rd welding material area 430 between contact site 512, in the present embodiment, the 3rd welding material area
430 can characterize the interval between the 4th sub- pad 521 and contact site 512.4th sub- pad 521, the 5th sub- pad 522 and
The interval of six sub- pads 523 between any two is denoted as the 4th welding material area 530, the 3rd welding material area 430 and the 4th welding
Material sections 530 are used to the welding material of carrying deposition.4th sub- pad 521, the 5th sub- 522 and the 6th sub- pad 523 of pad
Length be 5-8mil, further, the 4th sub- pad 521, the length of the 5th sub- 522 and the 6th sub- pad 523 of pad are equal
Can be 5.5mil, 6mil, 6.5mil, 7mil, 7.5mil etc..4th sub- pad 521, the 5th sub- of pad 522 and the 6th weldering
In disk 523 it is two neighboring between spacing, i.e. the length in the 4th welding material area 530 is 3-5mil, further, the distance values
Can be 3.5mil, 4mil, 4.5mil etc..Spacing between 512 and the 4th sub- pad 521 of contact site, i.e. the 3rd welding material
The length in area 430 can be 3-5mil and with adjacent two in the 4th sub- pad 521, the 5th sub- 522 and the 6th sub- pad 523 of pad
Spacing between a is equal, the length in the 3rd welding material area 430 and the equal length in the 4th welding material area 530.Further
Ground, the length in the 3rd welding material area 430 can be 3.5mil, 4mil, 4.5mil etc..
It should be appreciated that the 3rd welding material area 430 between the 4th sub- pad 521 and contact site 512 can ensure
Signal pin 30 is attracted to enough welding materials during welding.Do not shift when signal pin 30 welds, sub- pad area 520
On as stub region length be 0, i.e., no stub., will if signal pin 30 is shifted when welding more than 5mil
It is connected on the 4th sub- pad 521, still ensures that the reliability of connection, stub is 5-8mil at this time, can ensure that stub causes
Link performance decline will not make a big impact to signal transmission.Bigger occurs when if signal pin 30 welds to deviate and connect
When being connected to the 5th sub- pad 522 or six sub- pads 523, the reliability of connection is still ensured that, stub is 5-8mil at this time, still
Can ensure that link performance caused by stub declines will not make a big impact signal transmission.
Sixth embodiment
A kind of preparation process of printed circuit board is present embodiments provided, is used to prepare printing provided in an embodiment of the present invention
Circuit board 1.The preparation process of the printed circuit board includes：
Forming processes are carried out to substrate, form main weldering panel 11 and sub- pad area 12；Wherein the one end in main weldering panel 11 is used
It is connected in signal lead, the other end is used to be connected with electronic component, and sub- pad area 12 is arranged at the other end in main weldering panel 11,
The length in the region on sub- pad area 12 as stub is less than or equal to 12mil.
It should be noted that substrate can be the base material equipped with copper foil layer.Forming processes are included on plate body to be carried out successively
Coating photoresist, exposure, development, etching the step of, to form main weldering panel 11 and sub- pad area 12.
Further, in embodiments of the present invention,, should using the mask plate of predetermined pattern in the step of above-mentioned exposure
Main weldering disc molding region and sub- pad forming area are provided with mask plate, main weldering disc molding region and sub- pad forming area connect
An overall region is connect, wherein main weldering disc molding region is used to cover photoresist, so that the area that main weldering disc molding region is covered
Domain obtains main weldering panel 11 by subsequent step machine-shaping, and sub- pad forming area is used to cover photoresist, so that sub- pad
The region that forming area is covered obtains sub- pad area 12 by subsequent step machine-shaping.Also, sub- pad forming area
Length is less than or equal to 12mil, so that the sub- pad area 12 that shaping obtains is less than or equal to 12mil.So as to be had
The plate body for the Surface Mount pad structure 100 that first embodiment provides.Furthermore it is also possible to after an etching step, it is remote in sub- pad area 120
The first welding material area 230 is reserved in one end from main weldering panel 110, to receive the welding material of deposition.So as to be had
The plate body of the Surface Mount pad structure 200 of second embodiment offer is provided.
Further, in embodiments of the present invention, in the step of exposure, using the mask plate of predetermined pattern, the mask
Main weldering disc molding region and sub- pad forming area are provided with plate, wherein, sub- pad forming area can include at least two
Sub- pad forming area, sub- pad forming area are used to cover photoresist to be molded to obtain sub- pad.Two neighboring sub- pad into
Type region is arranged at intervals, and the sub- pad forming area wherein near main weldering disc molding region connects with main weldering disc molding region
Connect.By taking sub- pad forming area is two as an example, two sub- pad forming areas are respectively the first sub- pad forming area and the
Two sub- pad forming areas, wherein, one end of the first sub- pad forming area is connected with main weldering disc molding region, the other end and
Two sub- pad forming areas are arranged at intervals, and the first sub- pad forming area can be 3-5mil, and the second sub- pad forming area can
Think 5-7mil, the spacing between the first sub- pad forming area and the second sub- pad forming area can be 5-10mil.By
After subsequent step, the plate body of Surface Mount pad structure 300 with 3rd embodiment can be obtained.
In addition, in embodiments of the present invention, forming processes can be carried out to substrate, form spaced main weldering panel 11
With sub- pad area 12.
Further, in embodiments of the present invention, in the step of exposure, using the mask plate of predetermined pattern, the mask
Main weldering disc molding region and sub- pad forming area are provided with plate, wherein, sub- pad forming area can include a son and weld
Disc molding region, is denoted as the 3rd sub- pad forming area.3rd sub- pad forming area is arranged at intervals with main weldering disc molding region.
The length of 3rd sub- pad forming area can be 5-8mil.3rd sub- pad forming area and the spacing in main weldering disc molding region
Can be 3-5mil.So as to obtain the plate body of the Surface Mount pad structure 400 with fourth embodiment.
Further, in embodiments of the present invention, in the step of exposure, using the mask plate of predetermined pattern, the mask
Main weldering disc molding region and sub- pad forming area are provided with plate, wherein, sub- pad forming area can include at least two
Sub- pad forming area, wherein, sub- pad forming area and main weldering disc molding near main weldering disc molding region it is interregional every
Set, two neighboring sub- pad forming area is arranged at intervals.By taking sub- pad forming area is three as an example, three sub- pad shapings
Region is respectively the spaced 4th sub- pad forming area, the 5th sub- pad forming area and the 6th sub- pad shaping successively
Region, wherein, the 4th sub- pad forming area is connected close to the one end in main weldering disc molding region with main weldering disc molding region, and the 4th
The length of sub- pad forming area, the 5th sub- pad forming area and the 6th sub- pad forming area can be 5-8mil, the
In four sub- pad forming areas, the 5th sub- pad forming area and the 6th sub- pad forming area it is two neighboring between spacing can
Think 3-5mil, the 4th sub- pad forming area and the spacing in main weldering disc molding region can be 3-5mil.So as to obtain
The plate body of Surface Mount pad structure 500 with the 5th embodiment.
Further, the preparation process of printed circuit board provided in an embodiment of the present invention can also include：
Have on plate body and be laid with strainer net on the one side of main weldering panel 11 and sub- pad area 12, wherein, strainer net is used
In deposit weld material.In the present embodiment, strainer net is chosen as steel mesh.
There is deposit weld material on the one side of main weldering panel 11 and sub- pad area 12 in plate body by strainer net.Need
Illustrate, remove strainer net after deposit weld material.
The signal pin 30 of electronic component is welded in main weldering panel 11.In embodiments of the present invention, signal pin 30 welds
It is connected to the contact site 14 in main weldering panel 11.
Further, in the embodiment of the present invention, for the plate of the Surface Mount pad structure 100 provided with first embodiment
Body, when being laid with strainer net, strainer net is layed on main weldering panel 110 and sub- pad area 120, so that welding material is deposited on master
On pad area 110 and sub- pad area 120.And the signal pin 30 of electronic component is welded in main weldering panel 110, so that sub- pad
The length for having the region as stub in area 120 is less than or equal to 12mil.
Further, in the embodiment of the present invention, for the plate of the Surface Mount pad structure 200 provided with second embodiment
Body, when being laid with strainer net, strainer net is layed on main weldering panel 210 and sub- pad area 220, and get over one end of strainer net
The sub- one end of pad area 220 away from main weldering panel 210 is crossed, crosses length and 230, the first welding material area of sub- pad area 220
Match somebody with somebody, can be 5-10mil.
Further, in the embodiment of the present invention, for the plate of the Surface Mount pad structure 300 provided with 3rd embodiment
Body, when being laid with strainer net, is layed in 310 and first sub- pad 321 of main weldering panel, also, one end of strainer net is got over by strainer net
Cross the first sub- pad 321 and cover the gap between the first sub- 321 and second sub- pad 322 of pad, and extend to and the second son
One end end face of the pad 322 away from the first sub- pad 321 is concordant.
Further, in the embodiment of the present invention, for the plate of the Surface Mount pad structure 400 provided with fourth embodiment
Body, when being laid with strainer net, main weldering panel 410 is layed in by strainer net, also, main weldering panel 410 is crossed in one end of strainer net, and
The gap between main weldering panel 410 and the 3rd sub- pad 421 is covered, and is extended to the 3rd sub- pad 421 away from main weldering panel
410 one end end face is concordant.
Further, in the embodiment of the present invention, for the plate of the Surface Mount pad structure 500 provided with the 5th embodiment
Body, when being laid with strainer net, is layed in main weldering panel 510, also, main weldering panel 510 is crossed in one end of strainer net, covers by strainer net
Gap between 510 and the 4th sub- pad 521 of lid main weldering panel, and extend to the 6th sub- pad 523 away from main weldering panel 510
One end end face it is concordant.
In conclusion Surface Mount pad structure, printed circuit board and its preparation process provided in an embodiment of the present invention, due to son
There is region as stub, the welding material on sub- pad area, which disclosure satisfy that, welds needs, even if electronic component on pad area
Shift in welding, can also ensure to be connected on sub- pad area, welded so as to ensure that during electronic component welding with Surface Mount
Dish structure is reliably connected；On the other hand, due to having the length in the region as stub to be less than or equal on sub- pad area
12mil, reduces stub length, can significantly optimize the impedance behavior of Surface Mount pad structure, make the resistance of Surface Mount pad structure
Anti-performance is met the requirements.Therefore, Surface Mount pad structure and printed circuit board provided in an embodiment of the present invention have taken into account signal quality
Processed with technique, the effectively stub length of control pad, lift the performance of full link while, during beneficial to large-scale processing
The connection reliability of electronic component and Surface Mount pad structure.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention, for the skill of this area
For art personnel, the invention may be variously modified and varied.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
- A kind of 1. Surface Mount pad structure, for connecting printed circuit board and electronic component, it is characterised in that the Surface Mount pad knot Structure includes main weldering panel and sub- pad area；The one end in the main weldering panel is used to be connected with the signal lead of the printed circuit board, and the other end is used for and the electronics Element connects；The sub- pad area is arranged at the other end in the main weldering panel, on the sub- pad area as stub region length Less than or equal to 12mil.
- 2. Surface Mount pad structure according to claim 1, it is characterised in that the sub- pad area is connected to the main weldering disk The other end in area.
- 3. Surface Mount pad structure according to claim 3, it is characterised in that the length of the sub- pad area is 8-12mil.
- 4. Surface Mount pad structure according to claim 1, it is characterised in that the sub- pad area is connected to the main weldering disk The other end in area, the one end of the sub- pad area away from the main weldering panel are provided with the first welding material area, first weldering Material sections are connect to be used to carry welding material.
- 5. Surface Mount pad structure according to claim 5, it is characterised in that the length of the sub- pad area is 3-8mil, The length in the first welding material area is 5-10mil.
- 6. Surface Mount pad structure according to claim 1, it is characterised in that the sub- pad area includes at least one sub- weldering Disk, at least one sub- pad are arranged at intervals with the main weldering panel.
- 7. Surface Mount pad structure according to claim 6, it is characterised in that between the sub- pad and the main weldering panel For the 3rd welding material area, the 3rd welding material area is used to carry welding material, the length in the 3rd welding material area For 3-5mil, the length of the sub- pad is 5-8mil.
- 8. a kind of printed circuit board, it includes Surface Mount pad structure, electronic component and signal lead, it is characterised in that the table Patch pad structure includes main weldering panel and sub- pad area；The one end in the main weldering panel is connected with the signal lead, and the other end is connected with the electronic component；The sub- pad area is arranged at the other end in the main weldering panel, on the sub- pad area as stub region length Less than or equal to 12mil.
- A kind of 9. preparation process of printed circuit board, it is characterised in that including：Forming processes are carried out to substrate, form main weldering panel and sub- pad area；The one end in wherein described main weldering panel is used for and letter The connection of number cabling, the other end are used to be connected with electronic component, and the sub- pad area is arranged at the other end in the main weldering panel, institute The length for stating the region on sub- pad area as stub is less than or equal to 12mil.
- 10. the preparation process of printed circuit board according to claim 9, it is characterised in that described to be molded to substrate The step of processing, formation main weldering panel and sub- pad area, includes：Forming processes are carried out to substrate, form the spaced main weldering panel and the sub- pad area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711145204.4A CN108012415A (en) | 2017-11-17 | 2017-11-17 | Surface Mount pad structure, printed circuit board and its preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711145204.4A CN108012415A (en) | 2017-11-17 | 2017-11-17 | Surface Mount pad structure, printed circuit board and its preparation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012415A true CN108012415A (en) | 2018-05-08 |
Family
ID=62052763
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711145204.4A Pending CN108012415A (en) | 2017-11-17 | 2017-11-17 | Surface Mount pad structure, printed circuit board and its preparation process |
Country Status (1)
| Country | Link |
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| CN (1) | CN108012415A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113766730A (en) * | 2021-07-29 | 2021-12-07 | 苏州浪潮智能科技有限公司 | Connector PCB and differential signal non-stub fan-out wiring structure thereof |
| WO2024045574A1 (en) * | 2022-08-29 | 2024-03-07 | 中兴通讯股份有限公司 | Printed circuit board having pad and communication device |
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