CN205566796U - Printed circuit board convenient to patch element wiring - Google Patents
Printed circuit board convenient to patch element wiring Download PDFInfo
- Publication number
- CN205566796U CN205566796U CN201620268658.5U CN201620268658U CN205566796U CN 205566796 U CN205566796 U CN 205566796U CN 201620268658 U CN201620268658 U CN 201620268658U CN 205566796 U CN205566796 U CN 205566796U
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- CN
- China
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- surface mount
- foil wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a printed circuit board convenient to patch element wiring, including the base plate body, be equipped with the via hole on the base plate body, the front of base plate body is equipped with first copper foil wire, is used for the first metal pad of welding lead and is used for corresponding the both sides metal bonding site of welding patch element both sides pin, the base plate body back is equipped with second copper foil wire and is used for the second metal pad of welding lead, and wherein first metal pad is connected through first copper foil wire in the metal bonding site of one side, and the one end of jogged joint second copper foil wire was passed through in opposite side metal bonding site, and the second copper foil wire other end is connected on second metal pad. Consequently, through can realize the external conductors welding mode on printed circuit board's both sides surface with the electric connection of patch element pin to because of the easy short circuit of the less resistance that causes of pin interval, the not high technical problem of welding efficiency when solving external conductors beading patch element's pin.
Description
Technical field
This utility model belongs to electronic technology field, is specifically related to a kind of patch and is easy to the printed circuit board (PCB) of surface mount elements wiring.
Background technology
Printed circuit board (PCB) i.e. printed circuit board (PCB), is the supplier of electronic devices and components electrical connection, is widely used in the middle of electronic equipments, equipment.
It is the same surface that external wire is connected with the pin of surface mount elements and is welded on printed circuit board (PCB) respectively when surface mount elements on conventional print-circuit board connects external wire, owing to the distance between pin is little, easily cause when welding operation the short circuit of component, welding required precision high, operation easier is big.
Summary of the invention
This utility model provides a kind of printed circuit board (PCB) being easy to surface mount elements wiring, to solve the problems referred to above.
A kind of printed circuit board (PCB) being easy to surface mount elements wiring, including substrate body, described substrate body is provided with via, the front of described substrate body is provided with the first Copper Foil wire, for the first metal pad of welding lead and for the metal solder site, both sides of corresponding soldering surface mounted element both sides pin, the described substrate body back side is provided with the second Copper Foil wire and the second metal pad for welding lead, wherein the metal solder site of side connects the first metal pad by the first Copper Foil wire, opposite side metal solder site connects one end of the second Copper Foil wire by via, the second Copper Foil wire other end is connected on the second metal pad.
Preferably, substrate body being welded with surface mount elements, the both sides pin correspondence respectively of described surface mount elements is welded in metal solder site, described both sides, and described surface mount elements is Chip-R, patch capacitor or chip inductor.
Preferably, Chip-R is paster platinum resistance.
Preferably, the first metal pad is relative with described second metal pad is located at substrate body both sides.
Preferably, substrate body front is provided with the 3rd Copper Foil wire, and described via connects the metal solder site of described side by the 3rd Copper Foil wire.
Preferably, the first Copper Foil wire and described second Copper Foil wire extend to S-shaped along the length direction in substrate body front, the back side respectively.
Preferably, the bending place of S-shaped Copper Foil wire is right angle, acute angle, obtuse angle or arc bending.
Therefore, a kind of printed circuit board (PCB) being easy to surface mount elements wiring that this utility model provides, have the advantage that or beneficial effect:
Printed circuit board (PCB) in this utility model passes through via and the setting of conducting wire, make external wire carry out welding respectively in the both sides of substrate body and can realize the electric connection with surface mount elements, thus the welding difficulty caused because of pin hypotelorism when reducing direct soldering surface mounted element pin, improve manual operation and machine welding efficiency, and also efficiently solve and cause the technical problem of resistive short because solder connects, the mode of both sides welding simultaneously reduces the volume of electronic component further, it is simple to realize that electronics is integrated and industrialized production.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only embodiments more of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic perspective view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 1；
Fig. 2 is the front view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 1；
Fig. 3 is the rearview of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 1；
Fig. 4 is the schematic perspective view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 2
Fig. 5 is the front view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 2；
Fig. 6 is the front view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 3.
Main element symbol description:
1: substrate body
11: substrate body front
111: the first Copper Foil wires
112: the first metal pads
113: the first metal solder ends
114: the second metal solder ends
12: the substrate body back side
121: the second Copper Foil wires
122: the second metal pads
2: via
3: surface mount elements
4: the three Copper Foil wires
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
Embodiment 1:
Fig. 1 shows the schematic perspective view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 1；Fig. 2 shows the front view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 1；Fig. 3 shows the rearview of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 1.Refer to Fig. 1, Fig. 2, Fig. 3, this utility model provides a kind of printed circuit board (PCB) being easy to surface mount elements wiring, including substrate body 1, described substrate body 1 includes substrate body front 11 and the substrate body back side 12, described substrate body 1 is provided with the via 2 running through substrate body 1, covers copper to ensure that substrate body front 11 and the substrate body back side 12 realize being electrically connected with in described via 2 during carrying out early stage circuit production.Described substrate body front 11 is provided with the first Copper Foil wire 111, for the first metal pad 112 of welding lead and for the metal solder site, both sides (113,114) of corresponding soldering surface mounted element both sides pin.The described substrate body back side 12 is provided with the second Copper Foil wire 121 and the second metal pad 122 for welding lead, wherein the metal solder site 113 of side connects the first metal pad 112 by the first Copper Foil wire 111, opposite side metal solder site 114 connects one end of the second Copper Foil wire 121 by via 2, and second Copper Foil wire 121 other end is connected on the second metal pad 122.Described Copper Foil wire and metal solder site one_to_one corresponding, quantity and the position of the i.e. first Copper Foil wire 111 are corresponding with metal solder site 113, second Copper Foil wire 121 is corresponding with metal solder site 114, described metal solder site can be configured with quantity according to the position of actual surface mount elements pin, only show the corresponding actual surface mount elements pin number in metal solder site (113,114) in the present embodiment is the situation of 2.Therefore, this utility model provides a kind of novel printed circuit board (PCB) being easy to surface mount elements wiring, can realize realizing the electric connection of external wire and surface mount elements pin by being respectively welded external wire in the both sides of substrate body, reduce external wire and weld difficulty with surface mount elements because of what pin hypotelorism caused, improve manual operation and machine welding efficiency, and also efficiently solve and cause the technical problem of resistive short because solder connects, welding circuit element in both sides reduces the volume of electronic component further simultaneously, facilitate implementation electronics integrated.
As shown in Figure 1, Figure 2, Figure 3 shows, first substrate surface 11 and second substrate surface 12 are respectively equipped with the first metal pad 112 and the second metal pad 122, and on the identical correspondence position of the two both side surface being arranged at substrate body 1, i.e. the two is completely superposed relative to the position on printed circuit board (PCB), i.e. from identical with the distance that the substrate body back side 12 extends longitudinally beyond substrate body both sides of the edge along substrate body front 11.Therefore, present embodiments provide a kind of printed circuit board (PCB) being easy to surface mount elements wiring, owing to metal pad is oppositely arranged in substrate body both side surface, when outer lead welds with printed circuit board (PCB), the same length that the wire of equal length stretches out on printed circuit board (PCB) two sides, consequently facilitating the installation operation of wire and electronic circuit, and in actual industrial production, only need to be performed the cutting of a kind of predetermined length of wire, consequently facilitating realize being easy to the automatization that the printed circuit board (PCB) of surface mount elements wiring produces.
nullSuch as Fig. 2、Shown in Fig. 3，The first Copper Foil wire 111 and the second Copper Foil wire 121 it is respectively equipped with on the first substrate surface 11 of substrate body 1 and second substrate surface 12，Described first Copper Foil wire and described second Copper Foil wire are respectively along substrate body front、The length direction at the back side extends to S-shaped，Described S-shaped (the most snakelike) wiring can form a small inductance，The change of the signal code of suppression line，Ensure the isometric of some circuit simultaneously，And crosstalk can also be suppressed to a certain extent，Especially for the printed circuit board (PCB) being provided with platinum resistance，The printed circuit board (PCB) being easy to surface mount elements wiring in the present embodiment uses S-shaped wiring，In addition，S-shaped Copper Foil wire described in the present embodiment reduces the electric current by platinum resistance by increase conductor resistance the most to a certain extent in the case of electric current is relatively big，Reduce the sensor measurement errors that platinum resistance causes resistance temperature rising to cause because of heating effect of current.Described S-shaped bending place can use with radian or acute angle, right angle, the wire laying mode at obtuse angle, and the bending place of the S-shaped cabling of the printed circuit board (PCB) being easy to surface mount elements wiring provided in the present embodiment is right angle.
Embodiment 2:
Fig. 4 shows the schematic perspective view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 2；Fig. 5 shows the front view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 2；Refer to Fig. 2, Fig. 4, Fig. 5, the present embodiment improves on the basis of embodiment 1, provide a kind of printed circuit board (PCB) being easy to surface mount elements wiring being welded with surface mount elements, the pin of described surface mount elements 3 is respectively welded the metal solder site (113,114) that both sides pin is correspondingly arranged, and Copper Foil wire and the metal pad arranged by printed circuit board surface is electrically connected with external wire, described surface mount elements can select Chip-R, patch capacitor or chip inductor.In the present embodiment, described surface mount elements selects paster platinum resistance.
Embodiment 3:
Fig. 6 shows the front view of a kind of printed circuit board (PCB) being easy to surface mount elements wiring in this utility model embodiment 3.Refer to Fig. 6, the present embodiment improves on the basis of embodiment 1, the 3rd Copper Foil wire 4 is set up in substrate body front, one end of described 3rd Copper Foil wire 4 connects metal solder site 114, the other end connects via 2 and then is electrically connected with the second Copper Foil wire 121 at the substrate body back side 12, described 3rd Copper Foil conductor length is configured according to the size being welded actual surface mount elements, and then is adjusted welding site spacing.
A kind of printed circuit board (PCB) being easy to surface mount elements wiring provided this utility model embodiment above is described in detail, principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand core concept of the present utility model；Simultaneously for one of ordinary skill in the art, according to thought of the present utility model and method, the most all will change, in sum, this specification content should not be construed as restriction of the present utility model.
Claims (7)
1. the printed circuit board (PCB) being easy to surface mount elements wiring, it is characterized in that, including substrate body, described substrate body is provided with via, the front of described substrate body is provided with the first Copper Foil wire, for the first metal pad of welding lead and for the metal solder site, both sides of corresponding soldering surface mounted element both sides pin, the described substrate body back side is provided with the second Copper Foil wire and the second metal pad for welding lead, wherein the metal solder site of side connects the first metal pad by the first Copper Foil wire, opposite side metal solder site connects one end of the second Copper Foil wire by via, the second Copper Foil wire other end is connected on the second metal pad.
It is easy to the printed circuit board (PCB) of surface mount elements wiring the most as claimed in claim 1, it is characterized in that, it is welded with surface mount elements in described substrate body, the both sides pin correspondence respectively of described surface mount elements is welded in metal solder site, described both sides, and described surface mount elements is Chip-R, patch capacitor or chip inductor.
It is easy to the printed circuit board (PCB) of surface mount elements wiring the most as claimed in claim 2, it is characterised in that described Chip-R is paster platinum resistance.
It is easy to the printed circuit board (PCB) of surface mount elements wiring the most as claimed in claim 1, it is characterised in that described first metal pad is relative with described second metal pad is located at substrate body both sides.
Being easy to the printed circuit board (PCB) of surface mount elements wiring the most as claimed in claim 1, it is characterised in that described substrate body front is provided with the 3rd Copper Foil wire, described via connects the metal solder site of described side by the 3rd Copper Foil wire.
It is easy to the printed circuit board (PCB) of surface mount elements wiring the most as claimed in claim 1, it is characterised in that described first Copper Foil wire and described second Copper Foil wire extend to S-shaped along the length direction in substrate body front, the back side respectively.
It is easy to the printed circuit board (PCB) of surface mount elements wiring the most as claimed in claim 6, it is characterised in that the bending place of described S-shaped Copper Foil wire is right angle, acute angle, obtuse angle or arc bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620268658.5U CN205566796U (en) | 2016-04-01 | 2016-04-01 | Printed circuit board convenient to patch element wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620268658.5U CN205566796U (en) | 2016-04-01 | 2016-04-01 | Printed circuit board convenient to patch element wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205566796U true CN205566796U (en) | 2016-09-07 |
Family
ID=56813737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620268658.5U Expired - Fee Related CN205566796U (en) | 2016-04-01 | 2016-04-01 | Printed circuit board convenient to patch element wiring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205566796U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484337A (en) * | 2017-08-22 | 2017-12-15 | 刘蓉 | A kind of overcurrent protection wiring board |
| CN112423474A (en) * | 2019-08-23 | 2021-02-26 | 中国科学技术大学 | Preparation method of circuit board and circuit board |
| WO2023142965A1 (en) * | 2022-01-29 | 2023-08-03 | 京东方科技集团股份有限公司 | Circuit board, display apparatus, and fabrication method for circuit board |
-
2016
- 2016-04-01 CN CN201620268658.5U patent/CN205566796U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484337A (en) * | 2017-08-22 | 2017-12-15 | 刘蓉 | A kind of overcurrent protection wiring board |
| CN107484337B (en) * | 2017-08-22 | 2023-09-08 | 胜蓝科技股份有限公司 | Overcurrent protection circuit board |
| CN112423474A (en) * | 2019-08-23 | 2021-02-26 | 中国科学技术大学 | Preparation method of circuit board and circuit board |
| WO2023142965A1 (en) * | 2022-01-29 | 2023-08-03 | 京东方科技集团股份有限公司 | Circuit board, display apparatus, and fabrication method for circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171115 Address after: 518000 Building 2, building 365, No. 2-3, quadruple Road, Henggang street, Longgang District, Guangdong, Shenzhen Patentee after: Shenzhen platinum Electric Technology Co., Ltd. Address before: 2 building, 2 building, No. 365, Henggang quadruple Road, Longgang District, Guangdong, Shenzhen, 518000 Patentee before: Fang Xiaopeng |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160907 Termination date: 20190401 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |