CN108754590A - Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation - Google Patents
Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation Download PDFInfo
- Publication number
- CN108754590A CN108754590A CN201810959029.0A CN201810959029A CN108754590A CN 108754590 A CN108754590 A CN 108754590A CN 201810959029 A CN201810959029 A CN 201810959029A CN 108754590 A CN108754590 A CN 108754590A
- Authority
- CN
- China
- Prior art keywords
- ring body
- conductive
- electric installation
- devices
- semiconductor components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
The invention discloses a kind of conducting ring, based on its for electric installation and based on the electroplate jig for electric installation, which includes conductive ring body, and the conduction ring body is segmentation structure distribution, and is made of multiple conductive segments；It is separated by the insulation glue-line after disconnection mouth filling insulating cement between each adjacent two conductive segment；The conduction ring body is coated with insulation glue-line；And the conductive ring body is provided at least one electrode and at least one support leg.Conducting ring of the present invention is divided into multistage, and every section can independently carry out current control, so that it is guaranteed that the consistency and uniformity of wafer or printed wiring board overall current distribution density, ensure its electroplating surface layer quality；It is additionally arranged nickel coating and silver coating in conventional conductive ring body, to reduce conducting impedance, and it is enhanced and transmits the stability of electric current, and then reduces maintenance and replaces the frequency of conductive ring body, reduces the cost of overhaul.
Description
Technical field
The present invention relates to electroplating technology more particularly to a kind of conducting ring, based on its for electric installation and based on power supply
The electroplate jig of device.
Background technology
In semiconductor components and devices（Such as wafer or printed circuit board）In production process, need to carry out at plating its surface
Reason, by taking wafer as an example, need to be placed on electroplate jig, conducting ring is provided on wafer electroplate jig, these conducting rings with
Wafer on wafer electroplate jig is in contact, and therefore, the wafer on wafer electroplate jig can be with external power supply in electroplating technology
It is connected, and then required coating can be formed on its surface by the decomposition of electroplate liquid.However in practical electroplating process easily
There is the case where variant region thickness of coating of wafer differs, it is current density in each region the main reason for above problem occur
Deviation is indexed, thus, how to ensure that the consistency of each zone current distribution density of wafer is asked as technical staff is urgently to be resolved hurrily
Topic.
Invention content
Shortcoming present in view of the above technology, the present invention provide a kind of conducting ring, based on its for electric installation and
Based on the electroplate jig for electric installation, subregion is carried out to semiconductor components and devices such as wafer or printed wiring board in electroplating process
Current control, it is ensured that the preferable conducting ring of current distribution density CONSENSUS.
To achieve the above object, the present invention provides a kind of conducting ring, including conductive ring body, and the conduction ring body is point
Segmentation structure distribution, and be made of multiple conductive segments；Pass through after disconnection mouth filling insulating cement between each adjacent two conductive segment
The insulation glue-line is separated；The conduction ring body is coated with insulation glue-line；And the conductive ring body is provided with
At least one electrode and at least one support leg.
Wherein, the outer surface of the conductive ring body is sequentially provided with nickel coating and silver coating, and the plating from inside to outside
Silver layer is placed between nickel coating and insulation glue-line.
Wherein, the thickness of the nickel coating is 3~8 μm, and the thickness of the silver coating is 15~30 μm；The disconnection mouth
Size be 3~5mm.
Wherein, the conductive ring body is made of stainless steel, and is both provided with multiple support legs on each conductive segment,
And it is uniformly distributed along its circumferencial direction.
To achieve the above object, the present invention also provides a kind of based on conducting ring for electric installation, including multiple HF switches
The quantity of rectifier and conducting ring as described above, the high-frequency switching rectifier is identical as the conductive segment number of conducting ring；
And the cathode of each high-frequency switching rectifier is connected with corresponding conductive segment；The anode of each high-frequency switching rectifier is all connected with
Positive plate；The conducting ring connects semiconductor components and devices, and is electroplate liquid between the anode plate and semiconductor components and devices；High frequency is opened
It closes rectifier and provides voltage and current to this entire circuit, under the voltage potential effect of high-frequency switching rectifier, anode plate dissolving
Going out in metal cation to electroplate liquid, the metal ion in electroplate liquid is moved with the direction of power line toward semiconductor components and devices,
Final metal cation obtains electronics on semiconductor components and devices and is precipitated to form metal simple-substance, both completes electroplating process.
Wherein, each high-frequency switching rectifier includes being sequentially connected the anti-electromagnetic interference line filter, rectifier, filter connect
Wave device, high frequency transformer, high frequency filter, mos pipes, control chip and driver；The AC network passes through anti-electromagnetism successively
After disturbing line filter, rectifier, filter, high frequency transformer, high frequency filter, mos pipes, control chip and driver
To stable output current.
To realize above-mentioned purpose, the present invention also provides a kind of electroplate jig based on for electric installation, including jig body,
Cover board and as described in the claims for electric installation；
Groove compatible with semiconductor components and devices, the conductive ring body in electric installation are provided in the jig body
It is set to the lower surface of the semiconductor components and devices；Elastic backing ring and appearance and size and the groove phase are provided on the cover board
The boss of adaptation；
When the cover board compresses semiconductor components and devices upper surface, the two forms a cavity, institute after boss is fallen into groove
It states semiconductor components and devices and conductive ring body is placed in the cavity, be also fixed with multiple conductive coppers in the jig body side by side
Hook, and each high-frequency switching rectifier is hooked in by corresponding conductive copper through corresponding cable connection to corresponding conductive segment
On electrode.
Wherein, the annular groove for placing conductive ring body is provided in the groove.
Wherein, it is provided with external screw thread on the boss, interior spiral shell compatible with external screw thread is provided on the groove inner wall
Line, when cover board is by internal and external screw thread backspin, cover board is to the pressure of semiconductor components and devices with backspin apart from a linear relationship.
Compared with prior art, conducting ring provided by the invention, based on its for electric installation and based on the electricity for electric installation
Jig is plated, is had the advantages that：
1）Conducting ring is divided into multistage, and every section can independently carry out current control, so that it is guaranteed that wafer or printed wiring board
The consistency and uniformity of overall current distribution density ensure its electroplating surface layer quality；
2）It is additionally arranged nickel coating and silver coating in conventional conductive ring body, to reduce conducting impedance, and enhances its biography
The stability of electric current is passed, and then reduces maintenance and replaces the frequency of conductive ring body, reduces the cost of overhaul；
3）Current control is carried out to each segmented conductive ring body by high-frequency switching rectifier, it can be according to electric current during power supply
Feedback is adjusted in real time, to be easier to ensure that the consistency of wafer or printed wiring board overall current distribution density and uniform
Property；
4）The two forms a cavity after boss is fallen into groove, and the semiconductor components and devices and conductive ring body are placed in the cavity
Interior, this frame mode makes the electrically conducting manner of conductive ring body be changed into face contact by traditional point contact, line contact, significantly
Improve the uniformity and current density that electric current is distributed on wafer or printed wiring board, furthermore, wafer or printed wiring board with
There are certain pressures between conductive ring body, and poor contact phenomenon will not be caused to occur concussion occurs for electroplate liquid, in addition,
Under the action of elastic backing ring so that electroplate liquid completely cuts off with the lower surface of wafer or printed wiring board, avoids in the plating process
Liquid medicine crossover erosion phenomenon occurs, to improve wafer or electroplating printed circuit board quality.
Description of the drawings
Fig. 1 is the structural schematic diagram of conducting ring in the present invention；
Fig. 2 is the partial enlarged view in Fig. 1 at I in the present invention；
Fig. 3 is the schematic diagram for electric installation in the present invention；
Fig. 4 is the structural schematic diagram of electroplate jig in the present invention；
Fig. 5 is the stereoscopic schematic diagram of jig body in electroplate jig of the present invention.
Specific implementation mode
In order to more clearly state the present invention, the present invention is further described below in conjunction with the accompanying drawings.
Please refer to Fig.1-2, conducting ring provided by the invention, including conductive ring body 3, the conduction ring body is segmented
Structure distribution, and be made of multiple conductive segments 31；Disconnection mouth 32 between each adjacent two conductive segment passes through after filling insulating cement
The insulation glue-line is separated；The conduction ring body is coated with insulation glue-line；And the conductive ring body is provided with
At least one electrode 33 and at least one support leg 34.
In the present embodiment, the outer surface of the conduction ring body 31 is sequentially provided with nickel coating and silver-plated from inside to outside
Layer, and it is described it is silver-plated be placed on nickel coating insulation glue-line between.
In the present embodiment, the thickness of the nickel coating is 3~8 μm, and the thickness of the silver coating is 15~30 μm；
The size for disconnecting mouth is 3~5mm.The conduction ring body is made of stainless steel, and is both provided on each conductive segment more
A support leg, and it is uniformly distributed along its circumferencial direction.Using the conducting ring of above-mentioned technical proposal, it is divided into multistage, and every
Duan Junke independently carries out current control, so that it is guaranteed that the consistency of wafer or printed wiring board overall current distribution density and uniformly
Property, ensure its electroplating surface layer quality.
It, can be by order to improve the corrosion stability of conductive ring body 3 as advanced optimizing for above-mentioned conductive ring body 3
Stainless steel is made, and has nickel coating and silver coating in its electroplating surface, is sequentially arranged from inside to outside, to reduce conductive resistance
It is anti-, and enhance it and transmit the stability of electric current, and then reduce maintenance and replace the frequency of conductive ring body 3, reduce inspection
Accomplish this.The thickness of nickel coating is preferably 3~8 μm；The thickness of silver coating is preferably 15~30 μm.
Further referring to Fig. 3, the present invention also provides a kind of based on conducting ring for electric installation, including multiple HF switches
The quantity of rectifier 6 and above-mentioned conducting ring, the high-frequency switching rectifier is identical as 31 quantity of conductive segment of conducting ring；And it is every
A high-frequency switching rectifier is connected with corresponding conductive segment.The anode of each high-frequency switching rectifier is connected to anode plate
10；The conducting ring connects semiconductor components and devices, and is electroplate liquid between the anode plate and semiconductor components and devices；HF switch rectification
Device provides voltage and current to this entire circuit, and under the voltage potential effect of high-frequency switching rectifier, anode plate dissolves metal
In cation to electroplate liquid, the metal ion in electroplate liquid is moved with the direction of power line toward semiconductor components and devices, final gold
Category cation obtains electronics on semiconductor components and devices and is precipitated to form metal simple-substance, both completes electroplating process.Here semiconductor
Component is wafer.
Each high-frequency switching rectifier include be sequentially connected the anti-electromagnetic interference line filter connect, rectifier, filter,
High frequency transformer, high frequency filter, mos pipes, control chip and driver；The AC network passes through anti-electromagnetic interference line successively
Stablized after path filter, rectifier, filter, high frequency transformer, high frequency filter, mos pipes, control chip and driver
Output current.Fig. 3 shows the schematic diagram of plating power device in the present invention, and four segmentations of conductive ring body 3 are respectively
It is independently connected with four high-frequency switching rectifiers.High-frequency switching rectifier is by AC network through anti-electromagnetic interference line filter
Device, direct rectification, filtering, transformed device by DC voltage conversion at the high frequency square wave of tens of or hundreds of kHz, through high frequency transformer
Isolation, decompression, then export DC voltage through High frequency filter.It is sampled, compare, amplify and control, driving circuit, control converter
The duty ratio of middle power tube obtains stable output current.High-frequency switching rectifier has constant current pressure limiting pattern.Work as galvanizer
Skill parameter（Such as part area, temperature, concentration, acid-base value）When changing, output current automatic constant is not sent out in setting value
It is raw to change, it is ensured that the consistency and uniformity of wafer overall current distribution density ensure its electroplating surface layer quality.Here height
Frequency switching rectifier electric current is 10A, and voltage is 15V；It can buy on the market at present.
Fig. 4-5 is please referred to, the present invention also provides a kind of electroplate jigs based on for electric installation, including jig body 1, cover board
4 and described for electric installation；
Groove 11 compatible with semiconductor components and devices, the conducting ring sheet in electric installation are provided in the jig body
Body is set to the lower surface of the semiconductor components and devices；Be provided on the cover board 4 elastic backing ring 5 and appearance and size with it is described recessed
The compatible boss of slot 7；Semiconductor components and devices is wafer or printed wiring board, and semiconductor components and devices shown in figure is wafer 2；
When the cover board compresses semiconductor components and devices upper surface, the two forms a cavity, institute after boss is fallen into groove
It states semiconductor components and devices and conductive ring body is placed in the cavity, multiple conductive copper hooks are fixed in jig body side by side, and every
On electrode of a high-frequency switching rectifier by corresponding conductive copper hook 9 by cable connection to corresponding conductive segment.In jig
The slot that bursts at the seams is carried out on ontology, correspondingly, the cable 8 that arrangement is connected with each section of conductive ring body in wire casing, at this stage
The reasonability of product layout considers that conductive ring body is separated into 4 sections, and correspondingly, the quantity of high-frequency switching rectifier is set
4 are set to, it is of course also possible to which conductive ring body is divided into 6 sections, 8 sections etc. according to actual conditions.
Thus so that the electrically conducting manner of conducting ring ontology 3 is changed into face by traditional point contact, line contact and contacts,
The uniformity and current density that electric current is distributed on wafer 2 are substantially increased, furthermore, exist between wafer 2 and conductive ring body 3
Certain pressure will not cause poor contact phenomenon to occur, in addition, in the effect of elastic backing ring 5 concussion occurs for electroplate liquid
Under so that the lower surface of electroplate liquid and wafer 2 completely cuts off, and avoids that liquid medicine crossover erosion phenomenon occurs in the plating process, to carry
The high electroplating quality of wafer 2.
In the present embodiment, the annular groove for placing conductive ring body is provided in the groove.In order to avoid electricity
Plating jig, tangling phenomenon occurs for conductive ring body 3 in the long-term use, annular groove can also be provided in groove and is used for
Place conductive ring body 3, shape is adapted with conductive ring body 3, so as to avoid it during compressing wafer 2 conduction
Ring body 3 is overturn, and then leads to the non-uniform problem of 2 Surface current distribution of wafer.
In the present embodiment, it is provided with external screw thread on the boss, is provided on the groove inner wall and is mutually fitted with external screw thread
The internal thread matched, when cover board is by internal and external screw thread backspin, cover board is linear to the pressure and backspin distance of semiconductor components and devices
Relationship.When cover board 4 is by screw thread backspin, cover board 4 to the pressure of wafer 2 and backspin apart from a linear relationship, convenient for pressure
It is adjusted, in addition to this, unbalance stress problem is not present in the conductive ring body 3 being in contact with wafer 2, to ensure that wafer
The electric conductivity consistency in 2 each regions, and the leakproofness of 2 surrounding of wafer is also consistent.It is carried out only by taking wafer as an example in the present embodiment
Explanation, the content are equally applicable to printed circuit board.
Disclosed above is only several specific embodiments of the present invention, but the present invention is not limited to this, any ability
What the technical staff in domain can think variation should all fall into protection scope of the present invention.
Claims (9)
1. a kind of conducting ring, which is characterized in that including conductive ring body, the conduction ring body is distributed for segmentation structure, and
It is made of multiple conductive segments；Between each adjacent two conductive segment disconnection mouth filling insulating cement after by the insulation glue-line carry out every
It opens；The conduction ring body is coated with insulation glue-line；And the conductive ring body is provided at least one electrode and extremely
A few support leg.
2. conducting ring according to claim 1, which is characterized in that the outer surface of the conduction ring body is from inside to outside sequentially
It is provided with nickel coating and silver coating, and described silver-plated is placed between nickel coating and insulation glue-line.
3. conducting ring according to claim 2, which is characterized in that the thickness of the nickel coating is 3~8 μm, and the plating
The thickness of silver layer is 15~30 μm；The size for disconnecting mouth is 3~5mm.
4. conducting ring according to claim 1, which is characterized in that the conduction ring body is made of stainless steel, and each
Multiple support legs are both provided on conductive segment, and uniformly distributed along its circumferencial direction.
5. kind based on conducting ring for electric installation, which is characterized in that including multiple high-frequency switching rectifiers and such as claim 1-4
Any one of described in conducting ring, the quantity of the high-frequency switching rectifier is identical as the conductive segment number of conducting ring；And it is each
The cathode of high-frequency switching rectifier is connected with corresponding conductive segment；The anode of each high-frequency switching rectifier is connected to anode
Plate；The conducting ring connects semiconductor components and devices, and is electroplate liquid between the anode plate and semiconductor components and devices；HF switch rectification
Device provides voltage and current to this entire circuit, and under the voltage potential effect of high-frequency switching rectifier, anode plate dissolves metal
In cation to electroplate liquid, the metal ion in electroplate liquid is moved with the direction of power line toward semiconductor components and devices, final gold
Category cation obtains electronics on semiconductor components and devices and is precipitated to form metal simple-substance, both completes electroplating process.
6. it is according to claim 5 based on conducting ring for electric installation, which is characterized in that each high-frequency switching rectifier packet
Include be sequentially connected the anti-electromagnetic interference line filter connect, rectifier, filter, high frequency transformer, high frequency filter, mos pipe,
Control chip and driver；The AC network passes through anti-electromagnetic interference line filter, rectifier, filter, high frequency successively
Stable output current is obtained after transformer, high frequency filter, mos pipes, control chip and driver.
7. a kind of electroplate jig based on for electric installation, which is characterized in that including jig body, cover board and such as claim 5 institute
State for electric installation；
Groove compatible with semiconductor components and devices, the conductive ring body in electric installation are provided in the jig body
It is set to the lower surface of the semiconductor components and devices；Elastic backing ring and appearance and size and the groove phase are provided on the cover board
The boss of adaptation；
When the cover board compresses semiconductor components and devices upper surface, the two forms a cavity, institute after boss is fallen into groove
It states semiconductor components and devices and conductive ring body is placed in the cavity, be also fixed with multiple conductive coppers in the jig body side by side
Hook, and each high-frequency switching rectifier is hooked in by corresponding conductive copper through corresponding cable connection to corresponding conductive segment
On electrode.
8. the electroplate jig according to claim 7 based on for electric installation, which is characterized in that setting is useful in the groove
In the annular groove for placing conductive ring body.
9. the electroplate jig according to claim 7 based on for electric installation, which is characterized in that be provided on the boss outer
Screw thread is provided with internal thread compatible with external screw thread on the groove inner wall, when cover board is by internal and external screw thread backspin, lid
Plate is to the pressure of semiconductor components and devices with backspin apart from a linear relationship.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810959029.0A CN108754590A (en) | 2018-08-22 | 2018-08-22 | Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810959029.0A CN108754590A (en) | 2018-08-22 | 2018-08-22 | Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108754590A true CN108754590A (en) | 2018-11-06 |
Family
ID=63967298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810959029.0A Pending CN108754590A (en) | 2018-08-22 | 2018-08-22 | Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108754590A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110512248A (en) * | 2018-05-21 | 2019-11-29 | 盛美半导体设备（上海）有限公司 | Electroplating device and electro-plating method |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| CN113365709A (en) * | 2019-01-31 | 2021-09-07 | 乐高公司 | Toy system with contactless energy transmission system |
| CN114908403A (en) * | 2022-04-13 | 2022-08-16 | 上海戴丰科技有限公司 | Wafer loading and unloading hanger equipment |
| CN115233279A (en) * | 2022-09-23 | 2022-10-25 | 晟盈半导体设备(江苏)有限公司 | Integrated wafer electroplating equipment and electroplating method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6261433B1 (en) * | 1998-04-21 | 2001-07-17 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
| US6500317B1 (en) * | 1997-12-16 | 2002-12-31 | Ebara Corporation | Plating apparatus for detecting the conductivity between plating contacts on a substrate |
| US6517689B1 (en) * | 1998-07-10 | 2003-02-11 | Ebara Corporation | Plating device |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| CN106480480A (en) * | 2015-08-28 | 2017-03-08 | 株式会社荏原制作所 | Plater, coating method and substrate holder |
| CN108048887A (en) * | 2018-01-16 | 2018-05-18 | 昆山成功环保科技有限公司 | A kind of wafer electroplate jig |
-
2018
- 2018-08-22 CN CN201810959029.0A patent/CN108754590A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6500317B1 (en) * | 1997-12-16 | 2002-12-31 | Ebara Corporation | Plating apparatus for detecting the conductivity between plating contacts on a substrate |
| US6261433B1 (en) * | 1998-04-21 | 2001-07-17 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
| US6517689B1 (en) * | 1998-07-10 | 2003-02-11 | Ebara Corporation | Plating device |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| CN106480480A (en) * | 2015-08-28 | 2017-03-08 | 株式会社荏原制作所 | Plater, coating method and substrate holder |
| CN108048887A (en) * | 2018-01-16 | 2018-05-18 | 昆山成功环保科技有限公司 | A kind of wafer electroplate jig |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚等: "《电镀手册 第3版》", 国防工业出版社, pages: 301 - 307 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110512248A (en) * | 2018-05-21 | 2019-11-29 | 盛美半导体设备（上海）有限公司 | Electroplating device and electro-plating method |
| CN110512248B (en) * | 2018-05-21 | 2022-04-12 | 盛美半导体设备(上海)股份有限公司 | Electroplating apparatus and electroplating method |
| CN113365709A (en) * | 2019-01-31 | 2021-09-07 | 乐高公司 | Toy system with contactless energy transmission system |
| CN113365709B (en) * | 2019-01-31 | 2023-03-24 | 乐高公司 | Toy system with contactless energy transmission system |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| CN114908403A (en) * | 2022-04-13 | 2022-08-16 | 上海戴丰科技有限公司 | Wafer loading and unloading hanger equipment |
| CN115233279A (en) * | 2022-09-23 | 2022-10-25 | 晟盈半导体设备(江苏)有限公司 | Integrated wafer electroplating equipment and electroplating method |
| CN115233279B (en) * | 2022-09-23 | 2022-12-16 | 晟盈半导体设备(江苏)有限公司 | Integrated wafer electroplating equipment and electroplating method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108754590A (en) | Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation | |
| CN208869693U (en) | Conducting ring, based on its power supply unit and based on the electroplate jig of power supply unit | |
| JP3218713U (en) | Conductive ring, power supply device using conductive ring, and electroplating jig using power supply device | |
| TWI517549B (en) | Three-level rectifier | |
| CN201478694U (en) | Air ion generator | |
| JP6600724B1 (en) | Conductive ring, power supply device using conductive ring, and electroplating jig using power supply device | |
| CN107556060B (en) | Method for metalizing aluminum nitride ceramic plate | |
| TWI666344B (en) | Conductive ring, power supply device based on same, and electroplating fixture based on power supply device | |
| CN210420207U (en) | Copper-clad equipment | |
| CN205946373U (en) | A regulator circuit for printed circuit board | |
| CN209232971U (en) | Tiles pressing plate | |
| CN110010315B (en) | Sleeve pipe | |
| CN209000760U (en) | A kind of capacitor from explosion plate being accurately positioned the anti-short circuit of anti-desoldering | |
| JP6709727B2 (en) | Electrolytic plating equipment | |
| CN208026761U (en) | A kind of self-regulation fixture by capacitor pipeline high current | |
| CN1860566A (en) | Production method of a capacitor | |
| CN105185587A (en) | Electronic tube plate electrode blocking capacitor | |
| CN217334006U (en) | Process cavity structure of plasma ashing equipment for improving electric field uniformity | |
| CN209249737U (en) | A kind of low shelf depreciation insulating sleeve | |
| CN205159679U (en) | Electric connector | |
| CN103973133A (en) | Full-water-cooling high-frequency power transformer and secondary rectifying module structure | |
| CN208760035U (en) | A kind of contravariant high-cycle welding machine power tube heating structure | |
| TWI821692B (en) | Devices, systems and methods for treatment station impedance adjustment | |
| CN203788544U (en) | Circuit board | |
| KR20150019232A (en) | Ceramic mono block, and process of forming in/out port and coupling pattern on ceramic filter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518100 Zhongliang Business Park, No. 2 Liuxian Road, Xin'an Street, Baoan District, Shenzhen City, Guangdong Province, 1403A, 14th floor Applicant after: Shenzhen Chuangzhi Xinlian Technology Co.,Ltd. Address before: 518100 Zhongliang Business Park, No. 2 Liuxian Road, Xin'an Street, Baoan District, Shenzhen City, Guangdong Province, 1403A, 14th floor Applicant before: Shenzhen Chuangzhi Success Technology Co.,Ltd. |
|
| CB02 | Change of applicant information |