CN203788544U

CN203788544U - Circuit board

Info

Publication number: CN203788544U
Application number: CN201320813037.7U
Authority: CN
Inventors: 陈华
Original assignee: Shenzhen Refond Optoelectronics Co Ltd
Current assignee: Shenzhen Refond Optoelectronics Co Ltd
Priority date: 2013-12-10
Filing date: 2013-12-10
Publication date: 2014-08-20
Anticipated expiration: 2023-12-10

Abstract

The utility model relates to electronic engineering, and provides a circuit board, comprising an insulating substrate. The upper surface of the insulating substrate is covered by a first ZnO film layer. The first ZnO film layer forms a first circuit figure, and the first ZnO film layer is also plated with a first conducting layer. The ZnO film is deposited on the insulating substrate of the circuit board, and the conducting layer is on the ZnO film to form a conducting circuit. The conducting layer and the insulating substrate are connected through the ZnO film. The stability of the whole circuit board is greatly improved through relatively strong attachment characteristics between the insulating substrate and the conducting layer by the ZnO film, and meanwhile because of the characteristics of the ZnO film, uniformity of the conducting layer is relatively good, roughness is relatively low, so as to ensure that the conducting layer is easy to connect with an external electronic device in an abutting manner.

Description

Circuit board

Technical field

The utility model relates to electronic engineering, relates in particular to a kind of circuit board.

Background technology

Circuit board makes circuit miniaturization, visualize, plays an important role for batch production and the optimization electrical appliance layout of permanent circuit.Circuit board is mainly to make conducting wire on an insulated substrate, insulated substrate can adopt pottery, glass and resin etc., the making of circuit board is at present mainly to adopt the methods such as cathode copper, directly covers copper on these insulated substrate surfaces, then on copper-clad base plate, makes conducting wire.But the associativity between conducting wire and insulated substrate that this method is made is poor, under the impacts such as extraneous heat, electricity and moisture, between conducting wire and insulated substrate, easily occur peeling off, and in the time covering process for copper, copper-clad plate surface smoothness is not very high, the conducting wire surface roughness of making is larger, is difficult for fitting with electronic devices and components.

Utility model content

The purpose of this utility model is to provide a kind of circuit board, and the problem of peeling off easily appears in insulated substrate and the conducting wire of being intended to for solving available circuit plate.

For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of circuit board is provided, comprise insulated substrate, the upper surface of described insulated substrate is coated with the first ZnO film layer, described the first ZnO film layer forms the first line pattern, on described the first ZnO film layer, also plating is provided with the first conductive layer, the lower surface of described insulated substrate is also coated with the second ZnO film layer, described the second ZnO film layer forms the second line pattern, on described the second ZnO film layer, plating is provided with the second conductive layer, between described the first ZnO film layer and described the second ZnO film layer, be connected by some through holes, and each described through-hole wall plating is provided with the 3rd conductive layer, and described the 3rd conductive layer and described the first conductive layer and described the second conductive layer are all electrically connected.

Further, be respectively equipped with for preventing that scolder from flowing into the some interstage sleeves in described through hole on described the first conductive layer and described the second conductive layer, described in each, interstage sleeve encloses wherein through hole described in.

Further, the surface of the surface of described the first conductive layer and described the second conductive layer is also all coated with antioxidation coating.

Particularly, described insulated substrate is porous ceramic plate.

The utlity model has following technique effect:

Circuit board of the present utility model, between insulated substrate and conductive layer, be also folded with ZnO film, by ZnO film, insulated substrate and conductive layer are all had to the characteristic compared with strong adhesive force, thereby conductive layer can be attached on insulated substrate more securely, ensure the stability of conductive plate, but also because the uniformity of ZnO film and lower roughness characteristic, make conductive layer uniformity better, its surperficial roughness is also lower, and conductive layer can be easy to being fitted and connected of realization and electronic devices and components.

Brief description of the drawings

Fig. 1 is the profile of the circuit board of the utility model embodiment.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.

The utility model embodiment provides a kind of method of making conducting wire on insulated substrate, to make conducting wire as example on the one side of insulated substrate, comprises the steps: particularly below

(1) get an insulated substrate processing, it can be circular or square etc., the upper surface of insulated substrate should be smoother, at the upper surface deposition layer of ZnO film of this insulated substrate, certainly a certain amount of other materials also can adulterate in this ZnO film, such as Al3+ etc., make ZnO film there is certain electric conductivity;

(2) on ZnO film, be coated with photoresist layer, then press an egative film at photoresist layer upper cover, on this egative film, there is pre-designed line pattern, then adopt ultraviolet ray to carry out exposure-processed to egative film, on egative film, there is line pattern, can play the effect of blocking, because photoresist is photosensitive material, the photoresist layer generation photocuring reaction not blocked by line pattern after exposure, its dissolubility and compatibility strengthen, and another part photoresist layer does not have exposure because being blocked by line pattern, therefore material itself does not change;

(3) exposure work completes, remove this egative film, insulated substrate entirety is placed in to the development liquid medicine that is diluted alkaline after 10-15min, the photoresist layer being exposed is owing to having stronger dissolubility and compatibility, the photoresist layer of this part is dissolved in development liquid medicine, take out insulated substrate, remaining photoresist layer forms line pattern, exposes the ZnO film of the photoresist layer covering being developed on insulated substrate simultaneously;

(4) ZnO film exposing is carried out to etching, by the ZnO film of this part of chemical medicinal liquid dissolved corrosion, now on remaining ZnO film, be coated with the photoresist layer that photocuring reaction does not occur, remove this photoresist layer, expose remaining ZnO film, now remaining ZnO film also forms line pattern;

(5) again the insulated substrate that removes photoresist layer is placed in electrolysis tank and is electroplated, regulate relevant electroplating parameter, form one deck conductive layer on remaining ZnO film surface, electroplating parameter generally has current density, plating solution density and bath temperature, this conductive layer is copper or the silver etc. that electric conductivity is stronger, by regulating these electroplating parameters to ensure the thickness etc. of conductive layer, in the process using, to be there is to oxidation in order preventing in this, also should to be coated with one deck antioxidation coating at this conductive layer surface.

After remaining photoresist layer is removed and before insulated substrate is electroplated, also tackle insulated substrate and remaining ZnO film carries out plasma cleaning, can effectively ensure so can not retain a small amount of ZnO on the insulated substrate at etching ZnO film place, on the insulated substrate of avoiding leaking outside in the time electroplating, also plating is provided with conductive layer, affect the work of conducting wire, also can ensure can not be attached with other materials on remaining ZnO film surface, affect uniformity and the roughness of conductive layer.

In above-mentioned manufacture method, the upper surface of insulated substrate has formed conducting wire, be single-sided circuit board, if desired this insulated substrate is made as to double-sided PCB, also should form conducting wire at the lower surface of insulated substrate, to this, in the time processing insulated substrate, the lower surface of insulated substrate also should be processed smoothly.Usually, in the time making double-sided PCB, upper and lower surface should synchronously carry out, and can conveniently develop and plating, if desired makes separately, should, completing after one side, carry out tighter protection to the conducting wire of this face, prevents damage.

Make ZnO film on insulated substrate time, adopt chemical vapour deposition technique first insulated substrate to be placed in a reative cell, then in reative cell, blast ZnCl ₂gas, a part of ZnCl ₂gas is adsorbed on upper surface or the lower surface of insulated substrate, simultaneously also by unnecessary ZnCl ₂gas is by disposing in reative cell, and then supplements a certain amount of H in reative cell ₂o gas, H ₂o gas be adsorbed on the ZnCl on insulated substrate ₂thereby gas reaction generate ZnO film, after reacting completely again by unnecessary H ₂the HCl gas that O gas and reaction generate is by removing in reative cell, and can obtain Surface Creation like this has on the insulated substrate of ZnO film.For generating ZnO film on insulated substrate, can also adopt radio frequency sputtering method (during with the energetic particle hits surface of solids, its material sputtering out is in the method for matrix or surface of the work film forming) and sol-gel process (in inorganic solute being dissolved in to smuggled goods organic solution, form colloidal sol, colloidal sol is formed with the colloidal sol of space structure by evaporation drying etc., prepare required inorganic crystal material finally by heat treatment colloidal sol) etc.

On insulated substrate, make conducting wire by this method, conductive layer is not directly fixed on insulated substrate, but first on insulated substrate, make ZnO film, then conductive layer is fixed on ZnO film, because ZnO film has stronger adhesive force to insulation body and conductive layer, thereby can make conductive layer to be attached to more securely on insulated substrate, ensure the stability of the circuit board forming after preparation, and due to the good uniformity of ZnO film, roughness is lower, like this in the time electroplating, the conductive layer generating on ZnO film surface also has good uniformity and lower roughness, greatly facilitate being fitted and connected between follow-up electronic devices and components and conductive layer.

Referring to Fig. 1, the utility model embodiment also provides a kind of circuit board, it is mainly to adopt the above-mentioned method of making conducting wire on insulated substrate 1 to make, comprise insulated substrate 1, be coated with the first ZnO film layer 2 at the upper surface 11 of insulated substrate 1, and this first ZnO film layer 2 forms the first line pattern (not shown) of circuit board, on the first ZnO film layer 2, also plating is provided with one deck the first conductive layer 3.In this circuit board, the first conductive layer 3 is the first conducting wire of insulated substrate 1 upper surface 11, by the adhesive force of the first ZnO film layer the last 2, the first conductive layer 3 can be firmly fixed on the upper surface 11 of insulated substrate 1, the stability of the conducting wire of guarantee circuit board on insulated substrate 1, and because the characteristic such as the first ZnO film layer 2 also has good uniformity and roughness is low, make the uniformity of the first conductive layer also better, roughness is lower, can make it more easily and other electronic devices and components are fitted and connected.Insulated substrate 1 can adopt porous ceramic plate, because having cellular structure, it make the surface area of insulated substrate 1 larger, make in the circuit board course of work, the heat that conducting wire and electronic devices and components produce can fall apart and remove rapidly, ensures the heat dissipation characteristics of circuit board.

Further, on the basis of above-described embodiment circuit board, on the lower surface 12 of its insulated substrate 1, cover the second ZnO film layer 4, and establish the second conductive layer 5 in the second ZnO film layer 4 plating, the second ZnO film layer 4 forms the second line pattern of insulated substrate 1 lower surface 12, and the second conductive layer 5 is the conducting wire of insulated substrate 1 lower surface 12.Like this, upper surface 11 and the lower surface 12 of insulated substrate 1 all have conducting wire, circuit board is double-sided PCB, in the situation of the conducting wire of same function, compare single-sided circuit board, double-sided PCB takes up room less, also the layout of more convenient conducting wire, and because the adhesive force of the first ZnO film layer 2 and the second ZnO film layer 4, the conducting wire stability of circuit board levels is all stronger.

Further, on insulated substrate 1, be provided with some through holes 13, each through hole 13 all connects the first ZnO film layer 2 and the second ZnO film layer 4, and 13 inwalls 131 platings of each through hole are provided with the 3rd conductive layer 6, the three conductive layers 6 and the first conductive layer 3 and the second conductive layer 5 and are all electrically connected.These through holes 13 can take the method for laser drill to drill through, on wall 131, also deposit ZnO film therein, then in the time electroplating, on the inwall 131 of each through hole 13, the 3rd conductive layer 6 is established in plating, and under the effect of these the 3rd conductive layers 6, the conducting wire of insulated substrate 1 upper surface 11 is electrically connected with the conducting wire of its lower surface 12, and making upper surface 11 and the conducting wire of lower surface 12 is an entirety.

Further, on the first conductive layer 3 and the second conductive layer 5, some interstage sleeves 7 are also set respectively, and the first conductive layer 3 is all identical with the quantity of through hole 13 with interstage sleeve 7 quantity on the second conductive layer 5, each interstage sleeve 7 all encloses a wherein through hole 13, and its effect is to prevent that the scolder producing in the time of the first conductive layer 3 or the second conductive layer 5 and electronic devices and components welding from flowing into 13 formation obstructions in through hole.Surface at the first conductive layer 3 and the second conductive layer 5 is also all coated with antioxidation coating 8, due to usually, the first conductive layer 3 and the second conductive layer 5 are the good copper of electric conductivity or silver etc., to this in order to prevent in the long-term process using, there is oxidation in the surface of copper or silver, affect the electric conductivity of the first conductive layer 3 or the second conductive layer 5, be all coated with antioxidation coating 8 on the surface of the first conductive layer 3 and the second conductive layer 5, improve the useful life of circuit board.

The foregoing is only the utility model preferred embodiment; its structure is not limited to the above-mentioned shape of enumerating; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.

Claims

1. a circuit board, comprise insulated substrate, it is characterized in that: the upper surface of described insulated substrate is coated with the first ZnO film layer, described the first ZnO film layer forms the first line pattern, on described the first ZnO film layer, also plating is provided with the first conductive layer, the lower surface of described insulated substrate is also coated with the second ZnO film layer, described the second ZnO film layer forms the second line pattern, on described the second ZnO film layer, plating is provided with the second conductive layer, between described the first ZnO film layer and described the second ZnO film layer, be connected by some through holes, and each described through-hole wall plating is provided with the 3rd conductive layer, and described the 3rd conductive layer and described the first conductive layer and described the second conductive layer are all electrically connected.

2. circuit board as claimed in claim 1, is characterized in that: on described the first conductive layer and described the second conductive layer, be respectively equipped with for preventing that scolder from flowing into the some interstage sleeves in described through hole, described in each, interstage sleeve encloses wherein through hole described in.

3. circuit board as claimed in claim 1, is characterized in that: the surface of the surface of described the first conductive layer and described the second conductive layer is also all coated with antioxidation coating.

4. circuit board as claimed in claim 1, is characterized in that: described insulated substrate is porous ceramic plate.