CN108702431A - Array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment - Google Patents
Array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment Download PDFInfo
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- CN108702431A CN108702431A CN201680082094.9A CN201680082094A CN108702431A CN 108702431 A CN108702431 A CN 108702431A CN 201680082094 A CN201680082094 A CN 201680082094A CN 108702431 A CN108702431 A CN 108702431A
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Abstract
The application provides an array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment, wherein the array camera module includes at least two optical lens and a molding photosensory assembly, the molding photosensory assembly further comprises:At least two photosensitive elements, a wiring board and a molded base.Each photosensitive element is connected to the wiring board respectively switched only, the molded base has at least two optical windows, and the fringe region of the molded base and the wiring board is joined integrally, so that each photosensitive element corresponds respectively to each optical window, wherein each optical lens is arranged at the photosensitive path of each photosensitive element respectively, to be respectively that each photosensitive element and each optical lens provide a passage of light by each optical window.
Description
The present invention relates to camera module fields, further, are related to an array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment.
At present, most of electronic product all integrates more functions increasingly, this trend makes product transboundary emerge one after another, for example, mobile phone be highly integrated via initial communication equipment after formed one integrate the diversifications such as communication, camera shooting, online, navigation, three-dimensional function arrival mobile electronic device.
However, being configured in the camera module of mobile electronic device at present is single-lens camera module mostly, and this single-lens camera module is either that all can no longer meet user's application demand multi-functional for mobile electronic device in the quality of image or effect in shooting.
It has already appeared and ever more popular is the camera module for having more than a camera lens, such as twin-lens camera module, twin-lens camera module provides the style of shooting of apish eyes structure, and this twin-lens camera module suffers from the performance more more excellent than single-lens camera module in all various aspects such as 3D shooting and scanning, hand gesture location identification, color fidelity, rapid focus, panorama deeply shooting, background blurring shooting, therefore, the camera module for having more than a camera lens is the important directions of the development of camera module industry from now on.During using twin-lens camera module filmed image, twin-lens camera module utilizes two imaging modules with differences in spatial location to obtain image from two positions respectively, then after the Image compounding shot respectively to two imaging modules according to image composition method, the final image of more camera lens camera modules is obtained.It can be understood that, in this process, the consistency of the image effects such as resolving power, shading, the color of each imaging modules of more camera lens camera modules, and be the important indicator for measuring the image quality of twin-lens camera module in horizontal, vertically, longitudinally three directions deviation.
However, the structure of current stage manufacture, the technique of assembling twin-lens camera module and twin-lens camera module all not can guarantee the image quality of twin-lens camera module much.Figure 1A shows the twin-lens camera module of the prior art comprising a wiring board 10P, two microscope base 20P, two image-forming module 30P and bracket a 40P, each image-forming module 30P respectively include a motor lens assembly 31P.Each microscope base 20P is individually located in the ipsilateral of the wiring board 10P, and each microscope base 20P is linked together by the wiring board 10P, each motor lens assembly 31P is separately positioned on each microscope base 20P, to be supported by each microscope base 20P, the bracket 40P is wrapped in the outside of each motor lens assembly 31P.In the twin-lens camera module of the prior art shown in Figure 1B, the microscope base 20P is also possible to the structure of integral type, that is, each motor lens assembly 31P can be arranged at the different location of the microscope base 20P.It can be understood that, from the point of view of the packaging technology of the twin-lens camera module of the prior art, each microscope base 20P is individually mounted on the wiring board 10P, to will lead to the more difficult to govern controls such as size, position between each microscope base 20P, so that making the consistency of the parameters such as size, the position between each twin-lens camera module bracket poor.From the point of view of the structure of the twin-lens camera module of the prior art, in the example of Figure 1A, each microscope base 20P is independently, and each microscope base 20P only passes through the wiring board 10P and is attached, since the wiring board 10P usually selects PCB circuit board, so that wiring board 10P's is more soft and easily deformable in itself, at this moment, the whole rigidity of the twin-lens camera module is difficult to ensure, in use process after the twin-lens camera module is assembled to be completed, such structure is easy to cause each element of the image-forming module 30P, such as the relative size between the motor lens assembly 31P is unstable, position of related features is big, and the optical axis of each image-forming module 30P is easy the generation for the problems such as deviateing preset position, once in these situations Any one occur, all can bring uncontrollable factor or larger adverse effect to the final imaging effect such as image quality, such as Image compounding of the twin-lens camera module.In addition, in each motor lens assembly
The bracket 40P is wrapped up in the outside of 31P, and needs to fill glue between the motor lens assembly 31P and the bracket 40P, and the size of the twin-lens camera module is caused to be further increased.
Furthermore, the assembling of more camera lens camera modules is based on traditional COB (Chip On Board chip package) technique, usually there is the circuit devcie 11P of protrusion on the wiring board 10P, and a sensitive chip 12P is installed on the wiring board, the sensitive chip 12P usually passes through gold thread 121P and is connected to the wiring board 10P, and the usually arc-shaped protrusion of the gold thread 121P and the wiring board main body, therefore, the circuit devcie 11P and the gold thread 121P of these protrusions also bring some unfavorable factors for the assembling of camera module.
The circuit devcie 11P and gold thread 121P is directly exposed to the surface of the wiring board 10P, therefore during subsequent assembling, for example paste the microscope base 20P, weld the processes such as the motor lens assembly 31P, inevitably it is affected, solder resist when welding, dust etc. is easy to be attached to the circuit devcie 11P, and the circuit devcie 11P and sensitive chip 12P is located in an interconnected space, therefore dust pollutant is easy to influence the sensitive chip 12P, such influence may cause the camera module after assembling, and there are the bad phenomenons such as pitch-black point, reduce product yield.
Secondly, the microscope base 20P is located at the outside of the circuit devcie 11P, therefore when installing the microscope base 20P and wiring board 10P, it needs to reserve certain safe distance between the microscope base 20P and the circuit devcie 11P, and in the horizontal direction and upwardly direction requires reserved safe distance, this increases the demand of camera module thickness to a certain extent, is difficult to decrease its thickness.
In addition, the molding of the opposite single camera of molding for multi-cam, the coordination problem being related between multiple camera modules requires optical axis consistent between a plurality of lenses, and the consistency of a plurality of lenses optical axis based on traditional COB technique is more difficult to get guarantee.And multi-cam mould group overall volume is larger, it is more sensitive to the intensity and flatness of wiring board, therefore the thickness of wiring board is larger.
Summary of the invention
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the circuit board module includes a disjunctor encapsulation part and a wiring board portion, for the disjunctor encapsulation part encapsulated moulding in the wiring board portion, the disjunctor encapsulation part is suitable for corresponding multiple optical lens.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the circuit board module includes a wiring board and an at least electronic component, the electronic component protrudes from the wiring board, the electronic component is coated by the disjunctor encapsulation part, so that outside will not be directly exposed to.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the electronic component is coated by the disjunctor encapsulation part, to not need reserved safe distance between the electronic component and the disjunctor encapsulation part, in this way, it can be further reduced the size of the array camera module, so that the array camera module further develops to lightening direction.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the electronic component is coated by the disjunctor encapsulation part, to which the adjacent electronic component be isolated by the disjunctor encapsulation part, the phenomenon that being interfered with each other to avoid the adjacent electronic component, and then guarantee the image quality of the array camera module.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the electronic component is coated by the disjunctor encapsulation part, to which the distance of the even adjacent electronic component is decreased further, the disjunctor encapsulation part can also guarantee that the adjacent electronic component is not in the phenomenon that interfering with each other, thus can be by attachment larger size and the greater number of electronic component on the wiring board of limited areal, to improve the image quality of the array camera module.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the electronic component is coated by the disjunctor encapsulation part, to make the electronic component and air insulated by the disjunctor encapsulation part, there is the phenomenon that oxidation because of long-time ingress of air to avoid the metal part of the electronic component, and then ensures the stability and reliability of the array camera module.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly, circuit board module and manufacturing method and
Electronic equipment, wherein the array camera module includes multiple photosensitive elements, the disjunctor encapsulation part is around the outside of each photosensitive element.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the disjunctor encapsulation part includes an optical filter construction section, suitable for installing multiple filter elements, without additional independent support member.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the wiring board has multiple inner groovies, each photosensitive element is arranged in the inner groovy, in order to reduce the relative altitude of the photosensitive element Yu the wiring board, the surface on the surface and the wiring board that even make the photosensitive element is in the same plane, to reduce the requirement for height to the disjunctor encapsulation part.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the wiring board has multiple accesses and multiple external grooves, the external groove is connected to the access, and the external groove installs the photosensitive element suitable for upside-down mounting.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the wiring board portion includes a reinforcing layer, it is set to the reinforcing layer laminate wiring board bottom, to enhance the structural strength and heat dissipation performance of the wiring board.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the wiring board has an at least reinforced hole, the disjunctor encapsulation part extends into the reinforced hole at the time of molding and is maintained at the reinforced hole after shaping, to enhance the structural strength of the wiring board.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the disjunctor encapsulation part includes a camera lens construction section, suitable for installing multiple optical lens, to provide installation site for the optical lens.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the disjunctor encapsulation part is joined integrally with the wiring board at the time of molding, to not need the position of reserved filling glue between the disjunctor encapsulation part and the wiring board, to further decrease the height dimension of the array camera module.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the disjunctor encapsulation part is joined integrally with the wiring board at the time of molding, to during making the array camera module, it does not need that glue is arranged on the wiring board, to reduce the process for encapsulating the array camera module, to improve the production efficiency of the array camera module and reduce the cost of the array camera module.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the disjunctor encapsulation part is joined integrally with the wiring board at the time of molding, to during making the array camera module, it does not need that glue is arranged on the wiring board, more need not worry about the chip attachment region for being used to mount the photosensitive element that the wiring board can be polluted in the glue of flow-like, after the photosensitive element is mounted on the wiring board, it is ensured that the flatness of the photosensitive element.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the disjunctor encapsulation part and the wiring board are joined integrally, to after circuit board module molding, the disjunctor encapsulation part and the wiring board have better flatness, to be conducive to improve the product yield of the array camera module and improve the image quality of the array camera module.
It is an object of the present invention to provide an array camera module and its molding photosensory assemblies, circuit board module and manufacturing method and electronic equipment, wherein the disjunctor encapsulation part forms a molded base, wherein the top surface of the molded base forms at least one blocking protrusion, the blocking protrusion is for preventing when a driver or a lens barrel are assembled in the top surface of the molded base, glue for connecting the top surface of the driver or the lens barrel and the molded base enters the optical window of the molded base and pollutes the photosensitive path of the photosensitive element, to be conducive to improve the product yield of the array camera module and improve the image quality of the array camera module.
One aspect under this invention, the present invention provide the circuit board module of an array camera module comprising:
One wiring board portion is used to be electrically connected at least two photosensitive elements of the array camera module wherein the wiring board portion includes a wiring board；With
One disjunctor encapsulation part, wherein the disjunctor encapsulation part integral packaging is in the wiring board in the wiring board portion.
According to one embodiment of present invention, the disjunctor encapsulation part forms at least two optical windows, and each optical window is opposite with each photosensitive element, to provide the photosensitive element passage of light.
According to one embodiment of present invention, disjunctor encapsulation part top is in planar, with supporter, optical lens, driver or the filter element for installing the array camera module.
According to one embodiment of present invention, disjunctor encapsulation part top has at least two mounting grooves, and each mounting groove is connected to the corresponding optical window, to be respectively used to install supporter, filter element, optical lens or the driver of the array camera module.
According to one embodiment of present invention, the disjunctor encapsulation part includes a cladding section, a filter element construction section and an optical lens construction section, the filter element construction section and the optical lens construction section successively mold extension by the cladding section upwards, and it is internal in step-like, in order to install the filter element and optical lens of the array camera module.
According to one embodiment of present invention, the filter element construction section has at least two mounting grooves, each mounting groove is connected to the corresponding optical window, form the first step-like rank, in order to install the filter element, the optical lens construction section has at least two optical lens mounting grooves, and each optical lens mounting groove is connected to the corresponding optical window, the step-like second-order is formed, in order to install the optical lens of the array camera module.
According to one embodiment of present invention, the optical lens construction section has at least two optical lens inner walls, and each optical lens inner wall surface is smooth, is suitable for installing the non-threaded optical lens.
According to one embodiment of present invention, the wiring board portion includes an at least electronic component, and the electronic component protrudes from the wiring board, and the disjunctor encapsulation part coats the electronic component, so that the electronic component will not be directly exposed to outside.
According to one embodiment of present invention, the Electronic Components combination: the one or more of them in resistance, capacitor, diode, triode, potentiometer, relay and processor.
According to one embodiment of present invention, the wiring board portion includes a reinforcing layer, and the reinforcing layer laminate is set to the wiring board bottom, to enhance the structural strength of the wiring board.
According to one embodiment of present invention, the reinforcing layer is metal plate, to enhance the heat dissipation performance in the wiring board portion.
According to one embodiment of present invention, the wiring board portion includes a shielded layer, and the shielded layer wraps up the wiring board and the disjunctor encapsulation part, to enhance the electromagnetism interference performance of the circuit board module.
According to one embodiment of present invention, the shielded layer is metal plate or metal mesh.
According to one embodiment of present invention, wiring board has an at least reinforced hole, and the disjunctor encapsulation part extends into the reinforced hole, in order to enhance the structural strength of the wiring board.
According to one embodiment of present invention, the reinforced hole is groove-like.
According to one embodiment of present invention, the reinforced hole is perforation, so that the moulding material of the disjunctor encapsulation part comes into full contact with the wiring board, and easily fabricated.
According to one embodiment of present invention, wiring board has at least two accesses, is installed on the wiring board from the wiring board back side direction suitable for each photosensitive element.
According to one embodiment of present invention, the access is in step-like, in order to provide stable installation site for the photosensitive element.
According to one embodiment of present invention, the material of the wiring board can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
According to one embodiment of present invention, the material of the disjunctor encapsulation part is selected from combination: one of epoxy resin, nylon, LCP or PP or a variety of.
According to one embodiment of present invention, the circuit board module includes at least two motor connection structures, the motor connection structure includes an at least connecting line, the connecting line is set to the disjunctor encapsulation part, and it is electrically connected to the wiring board, the connecting line has a motor connecting pin, the disjunctor encapsulation part is revealed in, in order to connect a motor pin.
According to one embodiment of present invention, wherein the circuit board module includes at least two motor connection structures, each motor connection
Structure is including an at least connecting line and has an at least pin slot, the connecting line is arranged at the disjunctor encapsulation part, and it is electrically connected to the wiring board, the pin slot is arranged at disjunctor encapsulation part upper end, the connecting line has a motor connecting pin, the motor connecting pin is revealed in the groove bottom wall, and the motor connecting pin is electrically connected to when being plugged in the pin slot in order to a motor pin.
According to one embodiment of present invention, the circuit board module includes at least two motor connection structures, each motor connection structure has at least a pin slot and at least a circuit junction, the circuit junction is electrically connected to the wiring board, the pin slot is arranged at the disjunctor encapsulation part, the top of the disjunctor encapsulation part is extended to by the wiring board, and the circuit junction is revealed in the pin slot, be electrically connected to the circuit junction when being plugged in the pin slot in order to a motor pin.
According to one embodiment of present invention, the circuit board module includes at least two motor connection structures, and each motor connection structure includes at least one engraving route, and the engraving route is set to the disjunctor encapsulation part, it is electrically connected to the wiring board, in order to be electrically connected a motor pin.
According to one embodiment of present invention, the engraving route is set to the disjunctor encapsulation part in a manner of laser formation.
Other side under this invention, the present invention further provides the manufacturing methods of the circuit board module of an array camera module comprising step: the one disjunctor encapsulation part of unitary packed on a wiring board.
According to one embodiment of present invention, the manufacturing method is comprising steps of form at least two optical windows to the disjunctor encapsulation part.
According to one embodiment of present invention, the manufacturing method is comprising steps of protrude from the electronic component of the wiring board by disjunctor encapsulation part cladding.
According to one embodiment of present invention, the manufacturing method is comprising steps of form at least two mounting grooves on disjunctor encapsulation part top, in order to install supporter, filter element, driver or optical lens.
According to one embodiment of present invention, the manufacturing method is comprising steps of upwardly extend the disjunctor encapsulation part, and to form two stage stepped structures inside each institute's optical window, in order to install filter element or optical lens.
According to one embodiment of present invention, the manufacturing method is comprising steps of helicitic texture is arranged in the inner wall in the optical window of the disjunctor encapsulation part, in order to install threaded optical lens.
According to one embodiment of present invention, the manufacturing method on the wiring board comprising steps of be arranged an at least groove-like reinforced hole, and the disjunctor encapsulation part is made to extend into the reinforced hole.
According to one embodiment of present invention, the manufacturing method on the wiring board comprising steps of be arranged an at least perforated reinforced hole, and the disjunctor encapsulation part is made to extend into the reinforced hole.
According to one embodiment of present invention, the manufacturing method is comprising steps of attach a reinforcing layer in the wiring board bottom, to enhance the structural strength of the wiring board.
According to one embodiment of present invention, the manufacturing method is comprising steps of coat a shielded layer in the wiring board and the disjunctor encapsulation part, to enhance the electromagnetism interference performance of the circuit board module.
According to one embodiment of present invention, the manufacturing method is comprising steps of bury multiple connecting lines to the disjunctor encapsulation part, and the connecting line is made to be electrically connected the wiring board, in order to be separately connected a driver.
According to one embodiment of present invention, the manufacturing method is comprising steps of be arranged multiple pin slots to disjunctor encapsulation part upper end, and the motor connecting pin of the connecting line is made to be revealed in the pin slot.
According to one embodiment of present invention, the manufacturing method is comprising steps of be arranged multiple circuit junctions to the wiring board, and corresponding pin slot is set to the disjunctor encapsulation part, so that the circuit junction is revealed in the pin slot, the circuit junction is electrically connected to when being inserted into the pin slot in order to motor pin.
According to one embodiment of present invention, the manufacturing method is comprising steps of the multiple engraving routes of setting are to the disjunctor encapsulation part, and the engraving route is electrically connected to the wiring board, in order to be electrically connected a driver.
According to one embodiment of present invention, the engraving route is set to the disjunctor encapsulation part in a manner of laser formation.
According to one embodiment of present invention, the disjunctor encapsulation part is integrally formed at the wiring board by injection molding or mould pressing process.
Other side under this invention, the present invention further provides an array camera modules comprising:
One circuit board module, wherein the circuit board module includes:
One wiring board portion is used to be electrically connected at least two photosensitive elements of the array camera module；With
One disjunctor encapsulation part；The disjunctor encapsulation part integral packaging is in the wiring board portion.
At least two optical lens；And
At least two photosensitive elements；Each optical lens is located at the photosensitive path of the corresponding photosensitive element, and each photosensitive element is electrically connected to the circuit board module.
According to one embodiment of present invention, the array camera module includes an at least supporter, and the supporter is installed in the circuit board module, and the array camera module includes at least two filter elements, and each filter element is installed in the supporter.
According to one embodiment of present invention, the array camera module includes at least two drivers, and each optical lens is installed in the corresponding driver, and each driver is installed on the circuit board module.
According to one embodiment of present invention, the array camera module includes at least two filter elements, and each filter element is installed in the circuit board module.
Other side under this invention, the present invention further provides an array camera modules comprising:
At least two optical lens；With
One molding photosensory assembly, wherein the molding photosensory assembly further comprises:
At least two photosensitive elements；
One wiring board, wherein each photosensitive element is connected to the wiring board respectively switched only；And
One molded base, wherein the molded base has at least two optical windows, and the fringe region of the molded base and the wiring board is joined integrally, so that each photosensitive element corresponds respectively to each optical window, wherein each optical lens is arranged at the photosensitive path of each photosensitive element respectively, to be respectively that each photosensitive element and each optical lens provide a passage of light by each optical window.
According to one embodiment of present invention, the array camera module further comprises an at least filter element, wherein each filter element is respectively held between the optical lens and the photosensitive element.
According to one embodiment of present invention, each filter element is assembled in the top surface of the molded base respectively, so that each filter element is respectively held between each optical lens and each photosensitive element.
According to one embodiment of present invention, each filter element is assembled in the camera lens shell of each optical lens respectively, so that each filter element is respectively held between each optical lens and each photosensitive element.
According to one embodiment of present invention, the array camera module further comprises the supporter of an at least frame shape, wherein each filter element is assembled in each supporter respectively, each supporter is assembled in the top surface of the molded base respectively, so that each filter element is respectively held between each optical lens and each photosensitive element.
According to one embodiment of present invention, the top surface of the molded base forms an at least groove, and each groove is respectively communicated in each optical window, wherein each filter element is housed inside each groove respectively.
According to one embodiment of present invention, the surface of the molded base forms an at least groove, and each groove is respectively communicated in each optical window, wherein each supporter is housed inside each groove respectively.
According to one embodiment of present invention, the molding photosensory assembly further comprises at least one set of lead, wherein the both ends of each lead are respectively communicated with the wiring board connector of chip contacts and the wiring board in each photosensitive element, so that each photosensitive element and the wiring board are switched on.
According to one embodiment of present invention, the molding photosensory assembly further comprises an at least electronic component, wherein each electronic component is mounted on the wiring board respectively, and the molded base coats at least one described electronic component.
According to one embodiment of present invention, the whole electronic component of the molded base cladding.
According to one embodiment of present invention, the molded base further comprises a substrate, wherein the substrate is overlappingly set to the wiring board, to make the wiring board keep smooth by the substrate.
According to one embodiment of present invention, the wiring board has at least one first reinforcement space, and a part of the molded base is formed in each of described wiring board first reinforcement space, so that the molded base and the wiring board are combined as a whole.
According to one embodiment of present invention, the substrate has at least one second reinforcement space, and each second reinforcement space corresponds respectively to the first reinforcement of each of described wiring board space, wherein a part of the molded base is formed simultaneously in the wiring board
Each of each first reinforcement space and the substrate second reinforcement space, so that the molded base, the wiring board and the substrate are combined as a whole.
According to one embodiment of present invention, the substrate includes a base main body and at least two conductive bodies, each conductive body integrally extends the base main body respectively, wherein the wiring board has at least two channels, wherein the base main body is overlappingly set to the wiring board main body, so that each conductive body is respectively held in each of described wiring board channel, wherein each photosensitive element is contacted with each conductive body respectively.
According to one embodiment of present invention, each conductive body protrudes from the surface of the wiring board respectively, wherein each photosensitive element is mounted on each conductive body respectively.
According to one embodiment of present invention, the wiring board has an at least accommodation space, and each photosensitive element is housed inside each accommodation space respectively.
According to one embodiment of present invention, the quantity of the accommodation space of the wiring board is less than the quantity of the photosensitive element, so that at least one described photosensitive element is housed inside the accommodation space, the photosensitive element in addition is mounted on the chip attachment region of the wiring board.
According to one embodiment of present invention, the accommodation space is holding tank or through-hole.
According to one embodiment of present invention, at least one described photosensitive element has small size photosensitive region, and the photosensitive element in addition has large scale photosensitive region.
According to one embodiment of present invention, the wiring board has an at least accommodation space, wherein the photosensitive element with small size photosensitive region is housed inside the accommodation space, and the photosensitive element with large scale photosensitive region is housed inside the accommodation space or is mounted on the surface of the wiring board.
According to one embodiment of present invention, the array camera module further comprises at least two drivers, wherein each optical lens is assembled in each driver respectively, each driver is assembled in the molded base respectively, to make each optical lens be respectively held in the photosensitive path of each photosensitive element by each driver.
According to one embodiment of present invention, the array camera module further comprises at least two lens barrels, wherein each optical lens is assembled in each lens barrel respectively, each lens barrel is assembled in the top surface of the molded base respectively, or each lens barrel integrally extends the top surface of the molded base respectively, or at least one described lens barrel is assembled in the top surface of the molded base, in addition the lens barrel integrally extends the top surface of the molded base, to make each optical lens be respectively held in the photosensitive path of each photosensitive element by each lens barrel.
According to one embodiment of present invention, the array camera module further comprises an at least driver and an at least lens barrel, wherein each optical lens is assembled in each driver and each lens barrel respectively, wherein each driver is assembled in the top surface of the molded base respectively, each lens barrel is assembled in respectively or integrally extends the top surface of the molded base, to make each optical lens be respectively held in the photosensitive path of each photosensitive element by each driver and each lens barrel.
According to one embodiment of present invention, the middle part of the top surface of the molded base forms at least one and stops protrusion, the top surface of the molded base is divided into an inner surface and an outer surface by the blocking protrusion, wherein the driver is assembled in the outer surface of the mould group pedestal, and the glue for stopping protrusion prevention to be arranged between the driver and the outer surface enters the inner surface.
According to one embodiment of present invention, the array camera module further comprises a bracket, wherein the bracket has at least two installation spaces, each driver is installed in each of described bracket installation space respectively.
According to one embodiment of present invention, a filler is filled between the outer wall of the driver and the inner wall of the bracket.
According to one embodiment of present invention, the filler is glue.
Other side under this invention, the present invention further provides an electronic equipments comprising:
One electronic equipment ontology；With
At least an array camera module, wherein the array camera module is arranged at the electronic equipment ontology, to be used to obtain image, wherein the array camera module includes:
At least two optical lens；With
One molding photosensory assembly, wherein the molding photosensory assembly further comprises:
At least two photosensitive elements；
One wiring board, wherein each photosensitive element is connected to the wiring board respectively switched only；And
One molded base, wherein the molded base has at least two optical windows, and the fringe region of the molded base and the wiring board is joined integrally, so that each photosensitive element corresponds respectively to each optical window, wherein each optical lens is arranged at the photosensitive path of each photosensitive element respectively, to be respectively that each photosensitive element and each optical lens provide a passage of light by each optical window.
According to one embodiment of present invention, the length direction of the array camera module is consistent with the width direction of the electronic equipment ontology, and the array camera module is arranged at the corner or middle part of the electronic equipment ontology.
According to one embodiment of present invention, the length direction of the array camera module is consistent with the length direction of the electronic equipment ontology, and the array camera module is arranged at the corner or middle part of the electronic equipment ontology.
Other side under this invention, the present invention further provides a molding photosensory assemblies comprising:
At least two photosensitive elements；
One wiring board, wherein each photosensitive element is connected to the wiring board respectively switched only；And
One molded base, wherein the molded base has at least two optical windows, and the fringe region of the molded base and the wiring board is joined integrally, so that each photosensitive element corresponds respectively to each optical window.
According to one embodiment of present invention, the molding photosensory assembly further comprises at least one set of lead, wherein the both ends of each lead are respectively communicated with the wiring board connector of chip contacts and the wiring board in each photosensitive element, so that each photosensitive element and the wiring board are switched on.
According to one embodiment of present invention, the wiring board has an at least accommodation space, and each photosensitive element is housed inside the accommodation space respectively.
According to one embodiment of present invention, at least one described photosensitive element has small size photosensitive region, and the photosensitive element in addition has large scale photosensitive region.
According to one embodiment of present invention, the photosensitive element with small size photosensitive region is housed inside the accommodation space, and the photosensitive element with large scale photosensitive region is housed inside the accommodation space or is mounted on the surface of the wiring board.
According to one embodiment of present invention, the accommodation space is holding tank or through-hole.
According to one embodiment of present invention, the molded base further comprises a substrate, wherein the substrate is overlappingly set to the wiring board, to make the wiring board keep smooth by the substrate.
According to one embodiment of present invention, the wiring board has at least one first reinforcement space, and a part of the molded base is formed in each of described wiring board first reinforcement space, so that the molded base and the wiring board are combined as a whole.
According to one embodiment of present invention, the substrate has at least one second reinforcement space, each second reinforcement space corresponds respectively to the first reinforcement of each of described wiring board space, wherein a part of the molded base is formed simultaneously in each of each of the wiring board first reinforcement space and the substrate second reinforcement space, so that the molded base, the wiring board and the substrate are combined as a whole.
According to one embodiment of present invention, the substrate includes a base main body and at least two conductive bodies, each conductive body integrally extends the base main body respectively, wherein the wiring board has at least two channels, wherein the base main body is overlappingly set to the base main body, so that each conductive body is respectively held in each of described wiring board channel, wherein each photosensitive element is contacted with each conductive body respectively.
According to one embodiment of present invention, each conductive body protrudes from the surface of the wiring board respectively, wherein each photosensitive element is mounted on each conductive body respectively.
According to one embodiment of present invention, the top surface of the molded base forms a groove.
According to one embodiment of present invention, the top surface of the molded base forms at least one blocking protrusion, the top surface of the molded base is divided into an inner surface and an outer surface by the blocking protrusion.
Other side under this invention, the present invention further provides the manufacturing methods of a molding photosensory assembly, wherein the manufacturing method includes the following steps:
(a) at least a wiring board will be mounted on by an electronic component；
(b) at least optical window for forming with a wiring board molded base joined integrally and being formed the molded base by moulding technology, wherein the molded base coats at least one described electronic component；And
(c) each photosensitive element is connected to the wiring board with being respectively turned on, wherein each photosensitive element corresponds respectively to each optical window.
According to one embodiment of present invention, the step (c) is before the step (b), to first conductively connect each photosensitive element and the wiring board, the molded base joined integrally with the wiring board and with optical window is formed by moulding technology again, wherein after the molded base is formed, each photosensitive element corresponds respectively to each optical window.
According to one embodiment of present invention, further comprise step in the step (b):
(b.1) wiring board with the electronic component is placed in a molding tool；
(b.2) to a upper mold of the molding die and once, mold carries out die closing operation, so that the fringe region of the wiring board and middle part correspond respectively to the molding space being formed between the upper mold and the lower mold；And
(b.3) moulding material of flow-like is added in Xiang Suoshu molding space, to form each of the molded base and the molded base optical window after moulding material consolidation.
According to one embodiment of present invention, before the step (b.2), one cover film is overlappingly set in the stitching surface of the upper mold, in the step (b.2), the cover film is located between the stitching surface and the wiring board of the upper mold.
Figure 1A and Figure 1B is that cuing open for prior art twin-lens camera module shows schematic diagram respectively.
Fig. 2A is the array camera module of first preferred embodiment according to the present invention and its cut-away view of circuit board module.
Fig. 2 B is another array camera module and its wiring board cut-away view of first preferred embodiment according to the present invention.
Fig. 3 A is the manufacturing process schematic diagram of the circuit board module of an embodiment of first preferred embodiment according to the present invention.
Fig. 3 B is the manufacturing process schematic diagram of the circuit board module of the another embodiment of first preferred embodiment according to the present invention.
Fig. 4 is the circuit board module manufacturing method schematic diagram of first preferred embodiment according to the present invention.
Fig. 5 A, 5B and 5C are the different embodiments of the motor connection structure of the molding circuit pack of first preferred embodiment according to the present invention.
Fig. 6 is another array camera module schematic diagram of first preferred embodiment according to the present invention.
Fig. 7 is the array camera module of second preferred embodiment according to the present invention and its cut-away view of circuit board module.
Fig. 8 is the array camera module of third preferred embodiment according to the present invention and its cut-away view of circuit board module.
Fig. 9 is the 4th array camera module of preferred embodiment and its cut-away view of circuit board module according to the present invention.
Figure 10 is the 5th array camera module of preferred embodiment and its cut-away view of circuit board module according to the present invention.
Figure 11 is the 6th array camera module of preferred embodiment and its cut-away view of circuit board module according to the present invention.
Figure 12 is the 7th array camera module of preferred embodiment and its cut-away view of circuit board module according to the present invention.
Figure 13 A is the 8th array camera module of preferred embodiment and its cut-away view of circuit board module according to the present invention.
Figure 13 B is the 9th array camera module of preferred embodiment and its cross-sectional view of circuit board module according to the present invention.
Figure 14 is the according to the present invention ten array camera module of preferred embodiment and its cross-sectional view of circuit board module.Figure 15 A is the perspective cross-sectional schematic diagram of one of manufacturing step of array camera module of another preferred embodiment according to the present invention.
Figure 15 B is two perspective cross-sectional schematic diagram of the manufacturing step of the array camera module of another preferred embodiment according to the present invention.
Figure 15 C is three perspective cross-sectional schematic diagram of the manufacturing step of the array camera module of another preferred embodiment according to the present invention.
Figure 15 D is four perspective cross-sectional schematic diagram of the manufacturing step of the array camera module of another preferred embodiment according to the present invention.
Figure 15 E is five perspective cross-sectional schematic diagram of the manufacturing step of the array camera module of another preferred embodiment according to the present invention.
Figure 15 F is six perspective cross-sectional schematic diagram of the manufacturing step of the array camera module of another preferred embodiment according to the present invention.
Figure 15 G is seven perspective cross-sectional schematic diagram of the manufacturing step of the array camera module of another preferred embodiment according to the present invention.
Figure 15 H is eight perspective cross-sectional schematic diagram of the manufacturing step of the array camera module of another preferred embodiment according to the present invention.
Figure 16 is the perspective cross-sectional schematic diagram of a variant embodiment of the array camera module of above-mentioned preferred embodiment according to the present invention.
Figure 17 is the stereoscopic schematic diagram of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 18 is the stereoscopic schematic diagram of first variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 19 is the perspective cross-sectional schematic diagram of second variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 20 is the perspective cross-sectional schematic diagram of the third variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 21 is the perspective cross-sectional schematic diagram of the 4th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 22 is the perspective cross-sectional schematic diagram of the 5th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 23 is the perspective cross-sectional schematic diagram of the 6th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 24 is the perspective cross-sectional schematic diagram of the 7th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 25 is the perspective cross-sectional schematic diagram of the 8th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 26 is the perspective cross-sectional schematic diagram of the 9th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 27 is the perspective cross-sectional schematic diagram of the tenth variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 28 is the perspective cross-sectional schematic diagram of the 11st variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 29 is the perspective cross-sectional schematic diagram of the 12nd variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 30 is the perspective cross-sectional schematic diagram of the 13rd variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 31 is the perspective cross-sectional schematic diagram of the 14th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 32 is the perspective cross-sectional schematic diagram of the 15th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 33 is the perspective cross-sectional schematic diagram of the 16th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 34 is the perspective cross-sectional schematic diagram of the 17th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 35 is the perspective cross-sectional schematic diagram of the 18th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 36 is the perspective cross-sectional schematic diagram of the 19th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 37 is the perspective cross-sectional schematic diagram of the 20th variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 38 is the perspective cross-sectional schematic diagram of the 21st variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 39 is the block diagram representation of the electronic equipment of the array camera module with above-mentioned preferred embodiment of the invention.
Figure 40 A to Figure 40 C is the schematic diagram of the electronic equipment with the array camera module respectively.
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.Preferred embodiment in being described below is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.The basic principle of the invention defined in the following description can be applied to other embodiments, deformation scheme, improvement project, equivalent program and the other technologies scheme without departing from the spirit and scope of the present invention.
It will be understood by those skilled in the art that, in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", "lower", " preceding ", " rear ", " left side ", " right side ", "vertical", "horizontal", "top", "bottom" "inner", the orientation or positional relationship of the instructions such as "outside" is to be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have a particular orientation, it is constructed and operated in a specific orientation, therefore above-mentioned term is not considered as limiting the invention.
If Fig. 2A to Fig. 4 is the array camera module and its circuit board module of first preferred embodiment according to the present invention.The array camera module can be applied to various electronic equipments, to assist user that can shoot the image of object or person by the array camera module, such as the array camera module can be used to shoot the image datas such as image or the video of object or personage.Preferably, the array camera module can be applied to a mobile electronic device, such as the mobile electronic device can be but not limited to mobile phone, tablet computer, MP3/4/5, personal digital assistant, e-book, laptop, digital camera etc..
As shown in Fig. 2A to Fig. 4, the array camera module of the invention illustrates the contents of the present invention and advantage in following description so that it is implemented as the array camera module of a twin-lens as an example.The array camera module includes a circuit board module 220, two optical lens 10 and two photosensitive elements 21.
It is worth mentioning that, it is of the invention in order to facilitate disclosing, in this embodiment in accordance with the invention, it is illustrated by taking the array camera module that two optical lens 10 are constituted as an example, and in other embodiments of the invention, the quantity of the optical lens 10 and the photosensitive element 21 can be more, such as three or more, those skilled in the art is it should be understood that its quantity is not the limitation of array camera module of the invention.
Further, each photosensitive element 21 is switched on respectively in the circuit board module 220, each optical lens 10 is maintained at the top of the circuit board module 220, and each optical lens 10 is located at the photosensitive path of each of corresponding position photosensitive element 21, the circuit board module 220 can be coupled to the electronic equipment.Those skilled in the art is it should be understood that an optical lens 10 and a photosensitive element 21 can cooperate to form an imaging system, to be used for filmed image.Specifically, subject, such as object or person, the light of reflection can enter the inside of the array camera module after through the optical lens 10, to be received subsequent by the photosensitive element 21 to carry out photoelectric conversion, in other words, the photosensitive element 21 can convert optical signal into electric signal, and the electric signal can be transferred into the electronic equipment by the circuit board module 220, to generate image relevant to reference object on the electronic equipment.
The circuit board module 220 include a disjunctor encapsulation part 2201 and a wiring board portion 2202, be connected to the wiring board portion 2202 to 2201 integral packaging of disjunctor encapsulation part, as mold be connected to as described in wiring board portion 2202.More specifically, the disjunctor encapsulation part 2201 (Molding On Board, MOB) molding by way of being molded into wiring board is connected to the wiring board portion 2202.In other words, the disjunctor encapsulation part 2201 and the wiring board portion 2202 integrally combine.
The wiring board portion 2202 includes a wiring board 22, each photosensitive element 21 is connected to the wiring board 22 respectively switched only, the disjunctor encapsulation part 2201 and the wiring board 22 integrally combine, and the disjunctor encapsulation part 2201 forms two optical windows 231, wherein the disjunctor encapsulation part 2201 is respectively around each 21 outside of photosensitive element, and each optical window 231 provides the passage of light of each optical lens 10 with the corresponding photosensitive element 21 respectively.That is, each photosensitive element 21 is arranged at the wiring board 22 of position corresponding to each optical window 231.
In one embodiment, it can be initially formed the disjunctor encapsulation part 2201 joined integrally with the wiring board 22, then pasted again
The photosensitive element 21 is filled to the wiring board 22, so that the photosensitive element 21 and the wiring board 22 are switched on.In another embodiment, first the photosensitive element 21 can also be mounted to the wiring board 22, and the photosensitive element 21 and the wiring board 22 is connected, then re-form the disjunctor encapsulation part 2201 joined integrally with the wiring board 22.
The disjunctor encapsulation part 2201 includes a connector 22011 and two outer ring bodies 22012, the molding of connector 22011 is connected integrally between two outer ring body 22012, and two outer ring bodies 22012 are divided into adjacent two parts, wherein each outer ring body 22012 is respectively formed the optical window 231, two photosensitive elements 21 are located at the two sides of the connector 22011, to be suitable for being used for assembling forming the array camera module.It is noted that the connector 22011 is the common portion of two optical lens 10, i.e., when installing the optical lens 10, each optical lens 10 respectively occupies the corresponding part of the connector 22011.
It is worth mentioning that, the connector 22011 of the disjunctor encapsulation part 2201 and each outer ring body 22012 can integrally be incorporated into the wiring board 22 by moulding technology, wherein outer edge of each outer ring body 22012 respectively with the wiring board 22 integrally combines, and combines to the integral middle of the connector 22011 and the wiring board 22.It can be understood that, the connector 22011 in conjunction with the integral middle of the wiring board 22 forms a reinforcing rib with the rigidity for reinforcing the wiring board 22, to prevent the wiring board 22 from deforming, the outer ring body 22012 joined integrally can reinforce the rigidity of the outer edge of the wiring board 22 with the outer edge of the wiring board 22, that is, the disjunctor encapsulation part 2201 can play the role of enhancing the hardness of the wiring board 22.
The wiring board portion 2202 includes a connection line (not shown) and an at least electronic component 26.The connection line defaults in the wiring board 22, the electronic component 26 is electrically connected to the connection line and the photosensitive element 21, to which the electronic component 26 and the photosensitive element 21 be connected by the connection line, so that the electronic component 26 participates in the photosensitive course of work of the photosensitive element 21.The electronic component 26 can be, citing ground but be not limited to, resistance, capacitor, diode, triode, potentiometer, relay, driver, processor etc..
In this embodiment in accordance with the invention, the corresponding each photosensitive element 21 of each electronic component 26, in order to cooperate the work of each photosensitive element 21.
It is worth mentioning that, the electronic component 26 can be coated on inside by the disjunctor encapsulation part 2201, so that the electronic component 26 will not be directly exposed in space, more specifically, it is not exposed in the enclosed environment communicated with the photosensitive element 21, different from the existing way of electronic component 26 described in traditional camera module, such as capacitance resistance ware, to prevent dust, sundries from staying in the electronic component 26, photosensitive element 21 is polluted.In this embodiment, it is illustrated so that the electronic component 26 protrudes the wiring board 22 as an example, in the other embodiments of invention, the electronic component 26 is embedded in inside the wiring board 22, without protruding from the wiring board 22, those skilled in the art is it should be understood that structure, type and the setting position of the electronic component 26 are not limitation of the invention.It can be understood that, it can have the electronic component 26 of protrusion between two photosensitive elements 21, it can be coated by the connector 22011, the additional installation space that microscope base is needed in traditional array mould group is not needed in this way, so that the size of the array camera module of the invention be made to reduce.
It is worth mentioning that; the disjunctor encapsulation part 2201, which coats the electronic component 26, has the advantage for protecting the electronic component 26 and the advantage in terms of corresponding camera module; it will be understood by those skilled in the art that the disjunctor encapsulation part 2201 is not limited to coat the electronic component 26.That is, in other embodiments of the invention, the disjunctor encapsulation part 2201 can directly be molded into the wiring board 22 for the electronic component 26 not protruded, it is also possible to be molded into the different locations such as outside, the surrounding of the electronic component 26.
It is worth mentioning that, in one embodiment of this invention, the disjunctor encapsulation part 2201 is raisedly around 21 outside of photosensitive element, particularly, the disjunctor encapsulation part 2201 is integrally closed connection, makes it have good leakproofness, thus when each optical lens 10 is installed in the disjunctor encapsulation part 2201, each photosensitive element 21 is sealed in inside respectively, forms space in corresponding closing.
It when manufacturing the circuit board module 220, can specifically be molded in a traditional wiring board as the wiring board 22 of the invention on 22 surface of wiring board referring to Fig. 3 A to Fig. 4.For example, in one embodiment, injection molding machine can be used, SMT technique (Surface Mount Technology surface mount process) will be carried out by insert molding (insert molding) technique
The wiring board 22 afterwards carries out integral packaging, such as molded packages, forms the disjunctor encapsulation part 2201, or form the disjunctor encapsulation part 2201 by mould pressing process common in semiconductor packages.Further, each photosensitive element 21 is mounted on the wiring board 22, is then electrically connected each photosensitive element 21 with the wiring board 22, for example play gold thread electrical connection.The wiring board 22 can choose for, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the disjunctor encapsulation part 2201 is formed can choose as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the disjunctor encapsulation part 2201 can choose is, citing ground but be not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use epoxy resin.It will be apparent to a skilled person that the aforementioned manufacture that can choose and the material that can choose, are illustrative only the mode that can be implemented of the invention, it is not limitation of the invention.
In other embodiments of the invention, the process for manufacturing the circuit board module 220 can also be, SMT technique first is carried out to the wiring board 22, and then each photosensitive element 21 is mounted on the wiring board 22, and each photosensitive element 21 is electrically connected with the wiring board 22, for example play gold thread electrical connection, then integral packaging will be carried out to the wiring board 22, such as molded packages, the disjunctor encapsulation part 2201 is formed by way of insert molding, or the disjunctor encapsulation part 2201 is formed by mould pressing process common in semiconductor packages.Those skilled in the art is it should be understood that the manufacturing sequence of the circuit board module 220 is not limitation of the invention.
It will also be appreciated that, each optical lens 10 is installed in the disjunctor encapsulation part 2201 of the circuit board module 220, to which the disjunctor encapsulation part 2201 is equivalent to the function of the bracket in traditional camera module, support, fixed position are provided for the optical lens 10, but assembles and is but different from tradition COB technical process.The bracket of the camera module of traditional COB technique is fixed on wiring board in a manner of pasting, and the disjunctor encapsulation part 2201 (Molding On Board by way of being molded into wiring board, MOB) it is fixed on the wiring board 22, it does not need to paste fixation procedure, molding mode is relative to the fixed controllability with better connective stability and technical process of stickup, and in the disjunctor encapsulation part 27 and be mounted between the electronic component 26 of the wiring board 22 and do not need reserved safe distance, so that the thickness of the array camera module is reduced；On the other hand, the disjunctor encapsulation part 2201 is coated on the electronic component 26, traditional cradling function and the electronic component 26 are spatially overlapped, it does not need as traditional camera module, safe distance is reserved around circuit devcie, so that the height of the disjunctor encapsulation part 2201 with cradling function can be set in lesser range, to further provide the space that camera module thickness can reduce.In addition, the disjunctor encapsulation part 2201 replaces traditional bracket, bracket bring heeling error when pasting assembling is avoided, reduces the cumulative limit of the array camera module assembling.
It will also be appreciated that, the shape of the disjunctor encapsulation part 2201 can more it needs to be determined that, for example it extends internally in 26 position of electronic component, form a protrusion, to increase the corresponding width of the disjunctor encapsulation part 2201, and in the position of no electronic component 26, the disjunctor encapsulation part 22011 consistently extends, the shape of comparison rule is formed, and width is smaller.Those skilled in the art is it should be understood that the concrete shape of the disjunctor encapsulation part 2201 is not limitation of the invention.
Further, the disjunctor encapsulation part 2201 includes a cladding section 22013 and a filter element construction section 22014, it is integrally connected to the cladding section 22013 to the molding of filter element construction section 22014, the molding of cladding section 22013 is connected to the wiring board 22, for coating the electronic component 26.The filter element construction section 22014 may be implemented as installing two filter elements 40, the filter element 40 but be not limited to cutoff filter (IRCF).
That is, when the circuit board module 220 be used to assemble the array camera module, each filter element 40 of the array camera module is installed in the filter element construction section 22014, so that the filter element 40 is located on the photosensitive path of the corresponding photosensitive element 21, and do not need to provide additional 40 mounting bracket of filter element.That is, the disjunctor encapsulation part 2201 has the function of conventional stent here, but the advantage based on moulding technology, it can be by the technology mode of mold at the top of the filter element construction section 22014, make it have good planarization, so that the filter element 40 is entirely mounted, this point is also an advantage over traditional camera module.
Further, the filter element construction section 22014 forms an at least mounting groove 220141, such as in this illustration, the filter element construction section 22014 forms two mounting grooves 220141, each mounting groove 220141 is respectively communicated in the corresponding optical window 231, wherein each mounting groove 220141 is respectively that the filter element 40 provides sufficient installation space, so that institute
The top surface of filter element construction section 22014 will not be protruded from by stating filter element 40.That is, two mounting grooves 220141 are arranged in 2201 upper end of disjunctor encapsulation part, thus by each filter element 40 it is stable be installed on the disjunctor encapsulation part 2201, and the top of the disjunctor encapsulation part 2201 will not be protruded from.
It is worth mentioning that, in this embodiment in accordance with the invention, the mounting groove 220141 can be used for installing the filter element 40, and in other implementations of the invention, the mounting groove 220141 can be used to install the components such as motor or the camera lens of the array camera module, those skilled in the art is it should be understood that the purposes of the mounting groove 220141 is not limitation of the invention.
This embodiment according to the invention, the photosensitive element 21 is connected to the wiring board 22 by an at least lead 24, and is electrically connected to the connection line.The lead 24 may be implemented as, citing ground but be not limited to, gold thread, copper wire, aluminum steel, silver wire.Particularly, the lead 24 of the photosensitive element 21 can be connected to the wiring board 22 by traditional COB mode, citing ground but be not limited to, the mode of welding.That is, the connection of the photosensitive element 21 and the wiring board 22 can make full use of existing mature interconnection technique to make full use of to traditional technique and equipment to reduce the cost of improved technology, avoid the wasting of resources.In addition, the routing direction of the lead 24 is also unrestricted, such as the routing direction of the lead 24 can be from the photosensitive element 21 to the wiring board 22, can also be from the wiring board 22 to the photosensitive element 21.Certainly, for those skilled in the art it is to be understood that the connection of the photosensitive element 21 and the wiring board 22 can also be realized by the connection type of other any goals of the invention of the invention that can be realized, the present invention is unrestricted in this regard.
It is worth mentioning that, in of the invention this embodiment, each photosensitive element 21 is arranged at the upper surface of the wiring board 22, the disjunctor encapsulation part 2201 is around the outside of the photosensitive element 21, when manufacturing the circuit board module 220, it can choose different manufacturing sequences, citing ground but be not limited to, in one embodiment, two photosensitive elements 21 can be first installed on the wiring board 22, then in each 21 outside of photosensitive element, the 22 upper mold moulding of wiring board is at the disjunctor encapsulation part 2201, and the electronic component 26 that will protrude above the wiring board 22 is coated on inside it.And in another embodiment of the invention, it can be first in the 22 upper mold moulding of wiring board at the disjunctor encapsulation part 2201, and the electronic component 26 that will protrude above the wiring board 22 is coated on inside it, then the photosensitive element 21 is installed on the wiring board 22, the photosensitive element 21 is made to be located at the inside of the disjunctor encapsulation part 2201.
In this embodiment in accordance with the invention, it is illustrated by taking the array camera module of the composition of two optical lens 10 as an example, a kind of mode that the array camera module can be carried out, and by the advantage of moulding technology, consistent installation environment is provided for two filter elements 40 and two optical lens 10, so that the array camera module obtains more preferably optical property.In other embodiments of the invention, the array camera module can also include more than two optical lens 10, correspondingly, the circuit board module 220 forms more than two optical windows 231, those skilled in the art is not it should be understood that the quantity of the optical lens 10 is limitation of the invention.
Referring to Fig. 6, in of the invention one preferable embodiment, each optical lens 10 can be directly connected in the disjunctor encapsulation part 2201 of the circuit board module 220.That is, in this embodiment, the optical lens 10 is tight shot component, the focal length of the i.e. described optical lens 10 cannot be adjusted freely, it will be appreciated by those skilled in the art that be, the optical lens 10 described in the invention can be directly connected in the disjunctor encapsulation part 2201, include the case where that the optical lens 10 is connected to the disjunctor by a shell.And in preferable embodiment of the invention, referring to Fig. 2 B, the array camera module includes an at least driver 30, each driver 30 is installed in the disjunctor encapsulation part 2201, the optical lens 10 can be drivingly coupled to the driver 30, to which the driver 30 can drive the optical lens 10 to move along the photosensitive path of the photosensitive element 21, to adjust the focal length of the optical lens 10.That is, in this embodiment, the optical lens 10 is burnt optical lens assembly, the focal length of the i.e. described optical lens 10 can be adjusted, such as user is when using the array camera module filmed image, can adjust shooting effect by adjusting the focal length of the optical lens 10.
The type of the driver 30 is unrestricted, as long as the optical lens 10 can be driven to move along the photosensitive path of the photosensitive element 21, such as the driver 30 can be but not limited to voice coil motor.
It is worth mentioning that, this preferred embodiment according to the present invention, the disjunctor encapsulation part 2201 can be used to support each filter element 40 of installation, each optical lens 10 or each driver 30, has the function of conventional stent, and the advantage based on molding, the disjunctor encapsulation part 2201 can control the planarization and consistency of the disjunctor encapsulation part by mold, thus for institute
Each filter element 40, each optical lens 10 and each driver 30 for stating array camera module provide smooth and consistent installation environment, to be easier to ensure that the consistency of each camera lens optical axis, this point is that traditional array camera module is not readily reachable by.
It will also be appreciated that, integrally disjunctor is molded to wiring board 22 to the disjunctor encapsulation part 2201, enhance the structural strength of the wiring board 22, therefore the array camera module of relatively traditional COB mode, the wiring board 22 of array camera module of the invention can achieve smaller thickness, and can satisfy each camera lens and the requirement of each motor strength.On the other hand, the disjunctor encapsulation part 2201 can make the distance between each described optical lens 10 reduce, therefore further decrease the lateral length and width dimensions of the array camera module.
Further, such as Fig. 3 A, this preferred embodiment according to the present invention, the circuit board module 220 includes at least two motor connection structures 2203, is respectively used to connect two drivers 30 of the array camera module.Each driver 30 is respectively provided with an at least motor pin 31.Each motor connection structure 2203 includes at least one first connecting line 22031, and each first connecting line 22031 is for being electrically connected the driver 30 and the wiring board 22.Each first connecting line 22031 is electrically connected to wiring board 22.Further, each first connecting line 22031 is electrically connected to the connection circuit of the wiring board 22.First connecting line 22031 is arranged at the disjunctor encapsulation part 2201, and extends to the top of the disjunctor encapsulation part 2201.First connecting line 22031 includes one first motor connecting pin 220311, wherein first motor connecting pin 220311 is revealed in the top of the disjunctor encapsulation part 2201, to be subsequently used for being electrically connected the motor pin 31 of the driver 30.It is noted that first connecting line 22031 embedding manner can be arranged when forming the disjunctor encapsulation part 2201.In traditional connection type, the components such as drive motor are all to be connected to wiring board by the way that individual conducting wire is arranged, manufacturing process is relative complex, and the mode that first connecting line 22031 is buried in this molding of the invention can replace traditional motor the technical process such as to weld, and make circuit connection more stable.Particularly, in implementing of the invention one, first connecting line 22031 is a conducting wire, is embedded in inside the disjunctor encapsulation part 2201.Citing ground, the motor pin 31 can be connected to first motor connecting pin 220311 by anisotropic conductive film, can also be connected to first motor connecting pin 220311 by welding.
That is, before the disjunctor encapsulation part 2201 formation, the lower end of first connecting line 22031 is first electrically connected to the connection circuit of the wiring board 22, then after the disjunctor encapsulation part 2201 formation, so that the main part of first connecting pin 22031 is wrapped in the inside of the disjunctor encapsulation part 2201, and the upper end of first connecting pin 22031 is made to form first motor connecting pin 220311 in the top surface of the disjunctor encapsulation part 2201.
It is worth mentioning that, first motor connecting pin 220311 of the burial place of first connecting line 22031 and first connecting line 22031 can according to need setting in the position that the disjunctor encapsulation part 2201 is shown, such as, in one embodiment of this invention, first motor connecting pin 220311 of first connecting line 22031 can be arranged at the periphery of the disjunctor encapsulation part 2201, the top surface of the i.e. described disjunctor encapsulation part 2201, and in another embodiment of the invention, first motor connecting pin 220311 can be arranged at the interior of the disjunctor encapsulation part 2201 and enclose, 220141 bottom surface of the mounting groove of the i.e. described disjunctor encapsulation part 2201, so as to provide the driver 30 different installation sites.In other words, when the driver 30 needs installation to the top of the disjunctor encapsulation part 2201, first motor connecting pin 220311 is set to the peripheral top surface of the disjunctor encapsulation part 2201, when the driver 30 needs installation to the mounting groove 220141, first motor connecting pin 220311 is set to the interior of the disjunctor encapsulation part 2201 and encloses, i.e., described 220141 bottom surface of mounting groove.
That is, when manufacturing the circuit board module 220, each photosensitive element 21 can first be mounted to the wiring board 22, then mold to form the disjunctor encapsulation part 2201 in a manner of MOB on the wiring board 22, and first connecting line 22031 can be arranged inside the disjunctor encapsulation part 2201 in molding with embedding manner, and first connecting line 22031 is made to be electrically connected to the wiring board 22, and first motor connecting pin 220311 of first connecting line 22031 is made to be shown in the top of the disjunctor encapsulation part 2201, in order to be connected to the motor pin 31 of the driver 30.Citing ground, when the circuit board module 220 be used to assemble the array camera shooting molding, each motor pin 31 of the driver 30 is connected to first motor connecting pin 220311 of first connecting line 22031 by welding, so that the driver 30 is electrically connected to the wiring board 22, and it needs to be arranged individual conducting wire and connects the driver 30 and the wiring board 22, and the length of the motor pin 31 of the driver 30 can reduce.
It is an equivalent embodiment of the motor connection structure of above preferred embodiment according to the present invention referring to Fig. 5 A.Each motor connection structure 2203 has at least one first pin slot 22032, and the first pin slot 22032 is used to accommodate the motor pin 31 of the driver 30 of the array camera module.The first pin slot 22032 is arranged at 2201 upper end of disjunctor encapsulation part, that is, the first pin slot 22032 of the motor connection structure 2203 can be formed on the top of the disjunctor encapsulation part 2201.The motor connection structure 2203 includes at least one second connecting line 22033, and each second connecting line 22033 is for being electrically connected the driver 30 and the wiring board 22.Second connecting line 22033 is arranged at the disjunctor encapsulation part 2201, and extends upwardly to the groove bottom wall of the first pin slot 22032 of the disjunctor encapsulation part 2201.Second connecting line 22033 includes one second motor connecting pin 220331, wherein second motor connecting pin 220331 is revealed in the groove bottom wall of the first pin slot 22032 of the disjunctor encapsulation part 2201, for being electrically connected the motor pin 31 of the driver 30.Particularly, in one embodiment, second motor connecting pin 220331 may be implemented as a pad.Second connecting line 22033 may be implemented as a conducting wire, be embedded in inside the disjunctor encapsulation part 2201.
That is, when manufacturing the circuit board module 220, the photosensitive element 21 is first mounted in the wiring board 22, then on the wiring board 22, it molds to form the disjunctor encapsulation part 2201 in a manner of MOB, and the first pin slot 22032 of default predetermined length, and second connecting line 22033 can be set with embedding manner in molding, and second connecting line 22033 is made to be electrically connected to the wiring board 22, and make second motor connecting pin 220331 of second connecting line 22033 be shown in the disjunctor encapsulation part 2201 the first pin slot 22032 groove bottom wall, in order to be connected to the motor pin 31 of the driver 30.Citing ground, when the circuit board module 220 be used to assemble camera shooting molding, each motor pin 31 of the driver 30 is inserted into the first pin slot 22032, and it is connected to second motor connecting pin 220331 of second connecting line 22033 by welding, so that the driver 30 is electrically connected to the wiring board 22, and it needs to be arranged individual conducting wire and connects the driver 30 and the wiring board 22, and the motor pin 31 of the driver 30 can steadily be connected, prevent outside is unwanted from necessarily touching the motor pin 31.Particularly, second connecting line 22033 may be implemented as a conducting wire, be embedded in inside the disjunctor encapsulation part 2201.
It is another equivalent embodiment of the motor connection structure of above preferred embodiment according to the present invention referring to attached drawing 3B and Fig. 5 B.Each motor connection structure 2203 has an at least second pin slot 22034, the second pin slot 22034 is used to accommodate the motor pin 31 of the driver 30 of the array camera module, that is, the lateral wall of the disjunctor encapsulation part 2201 can form the second pin slot 22034.The motor connection structure 2203 includes an at least circuit junction 22035, and the circuit junction 22035 defaults in the wiring board 22, and is electrically connected to the connection line of the wiring board 22.Further, each second pin slot 22034 extends to the wiring board 22 by the top of the disjunctor encapsulation part 2201, and the circuit junction 22035 is made to correspond to the second pin slot 22034.In a kind of way of example, the motor pin 31 is adapted for insertion into and is maintained at the second pin slot 22034, and can be welded to connect with the circuit junction 22035, the driver 30 and the wiring board 22 is connected.
That is, when manufacturing the circuit board module 220, each circuit junction 22035 is preset on the wiring board 22, and then mount the photosensitive element 21 and electronic component 26, then on the wiring board 22, the disjunctor encapsulation part 2201, and the second pin slot 22034 of default predetermined length are molded in a manner of MOB, and the circuit junction 22035 is shown by the second pin slot 22034, in order to be connected to the motor pin 31 of the driver 30.Citing ground, when the circuit board module 220 be used to assemble camera shooting molding, each motor pin 31 of the driver 30 is inserted and retained in the second pin slot 22034, and it is connected to the circuit junction 22035 on wiring board 22 by welding, so that the driver 30 is electrically connected to the wiring board 22, and the motor pin 31 of the driver 30 is steadily connected, prevent outside from unnecessarily touching the motor pin 31.
It is another equivalent embodiment of motor connection structure in above-mentioned preferred implementation according to the present invention referring to Fig. 5 C.The motor connection structure 2203 includes an engraving route 22036, the components such as the connection line, the photosensitive element 21 and motor that the engraving route 22036 is used to be electrically connected on the wiring board 22.It citing ground but is not limited to, the engraving route 22036 can be by plating mode setting when forming the disjunctor encapsulation part 2201 of metal after laser formation (Laser Direct Structuring, LDS).In traditional connection type, the components such as drive motor are all to be connected to wiring board, manufacturing process by the way that individual conducting wire is arranged
It is relative complex, and the mode that the engraving route 22036 is arranged in this molding of the invention can replace traditional motor the technical process such as to weld, and make circuit connection more stable.More specifically, the forming process of the engraving route 22036 can be, the setting of the disjunctor encapsulation part 2201 engraving slot, is then arranged circuit in the engraving slot in a manner of plating now.
In one embodiment of the invention, the mode that the driver 30 of the array camera module is connected to the disjunctor encapsulation is illustrated by taking the connection type of the motor connection structure 2203 as an example, it is such as described by the way of first connecting line 22031, and in other embodiments of the invention, the connection type of the driver 30 can also connection type corresponding with Fig. 5 A, Fig. 5 B and Fig. 5 C be combined, such as using the first pin slot 22032 and second connecting line 22033, the second pin slot 22034 and the circuit junction 22035.And in one embodiment of this invention, referring to Fig. 2A, the driver 30 can be connected to the circuit board module 220 by traditional mode, such as by welding.Those skilled in the art is it should be understood that the connection type of the driver 30 and the circuit board module 220 is not limitation of the present invention.
As shown in fig. 7, being the array camera module and its circuit board module 220 of second preferred embodiment according to the present invention.It is not both that the circuit board module 220 includes a wiring board 22A with above preferred embodiment.The wiring board 22A has two inner groovy 224A, and each photosensitive element 21 is arranged in the corresponding inner groovy 224A.Different from the circuit board module 220 in above-described embodiment, the photosensitive element 21 is arranged in the inner groovy 224A, and the photosensitive element 21 is contained in the inner groovy 224A, so that the photosensitive element 21 will not obviously protrude from the upper surface of the wiring board 22A, so that the height of the relatively described disjunctor encapsulation part 2201 of the photosensitive element 21 reduces, to reduce the photosensitive element 21 to the height limitation of the disjunctor encapsulation part 2201, a possibility that further decreasing height is provided.
Further, the photosensitive element 21 is connected to the wiring board 22 by the lead 24, and is electrically connected to the connection line.The lead 24 may be implemented as, citing ground but be not limited to, gold thread, copper wire, aluminum steel, silver wire.That is, the photosensitive element 21 and the lead 24 are all located in the inner groovy 224A of the wiring board 22A.In one embodiment, it when manufacturing the circuit board module 220, needs that the inner groovy 224A is first arranged on the wiring board 22A.That is, opening the inner groovy 224A on traditional wiring board, it is adapted to accommodate and the photosensitive element 21 is installed.
Fig. 8 is the array camera module of third preferred embodiment according to the present invention and its cut-away view of circuit board module.
Different from above preferred embodiment, the circuit board module 220 includes that wiring board a 22B, the wiring board 22B is suitable for installing the photosensitive element 21 with the lower part of two access 225B, each access 225B.Each access 225B makes the two sides wiring board 22B or more be connected, to which when the photosensitive element 21 is installed on the wiring board 22B by the back side and photosensitive region of the wiring board 22B upward, the photosensitive region of the photosensitive element 21 can receive the light entered by the optical lens 10.
Further, there is the wiring board 22 two external groove 226B, each external groove 226B to be connected to the corresponding access 225B, provide the installation site of the photosensitive element 21.Particularly, when the photosensitive element 21 is installed in the external groove 226B, the outer surface of the photosensitive element 21 is consistent with the surface of the wiring board 22B, is generally aligned in the same plane, to guarantee the profile pattern of the circuit board module 220.
In this embodiment in accordance with the invention, the access 225B is in step-like, consequently facilitating installing the photosensitive element 21, provides stable installation site for the photosensitive element 21, and show its photosensitive region in interior space.
It is noted that in this embodiment in accordance with the invention, providing a kind of different from traditional chip mounting means, that is, flip-chip mode (Flip Chip, FC).The photosensitive element 21 is installed on the wiring board 22B from the back side direction of the wiring board 22B, rather than as needing the front from the wiring board 22B in above-described embodiment, i.e., from the top of the wiring board 22B, and the photosensitive region of the photosensitive element 21 is installed on the wiring board 22B upward.Such structure and mounting means, so that the photosensitive element 21 and the disjunctor encapsulation part 2201 are relatively independent, the installation of the photosensitive element 21 not will receive the influence of the disjunctor encapsulation part 2201, and the molded influence to the photosensitive element 21 of the disjunctor encapsulation part 2201 is also smaller.Furthermore, the photosensitive element 21 is embedded in the lateral surface of the wiring board 22B, and the medial surface of the wiring board 22B will not be protruded from, so that reserving bigger space on the inside of the wiring board 22B, so that the height of the disjunctor encapsulation part 2201 not will receive the height limitation of the photosensitive element 21, the disjunctor encapsulation part 2201 is enabled to reach smaller height.
It is noted that in other embodiments of the invention, the filter element 40 is installed in the upper end of the access 225B,
That is not needing the filter element 40 being installed on the disjunctor encapsulation part 2201, to reduce the back focal length of the array camera module, reduce the height of the camera module.Particularly, it is cutoff filter IRCF that the filter element 40, which can be carried out example,.
Fig. 9 is the array camera module of the 4th preferred embodiment according to the present invention and its cut-away view of circuit board module 220.
The circuit board module 220 includes a reinforcing layer 2204C, is connected to 22 bottom of wiring board, the reinforcing layer 2204C lamination in order to reinforce the structural strength of the wiring board 22.That is, the region bottom at 21 place of the disjunctor encapsulation part 2201 and the photosensitive element mounts the reinforcing layer 2204C on the wiring board 22, so that the wiring board 22 reliablely and stablely supports the disjunctor encapsulation part 2201 and the photosensitive element 21.
Further, the reinforcing layer 2204C is a metal plate, and the metal plate is attached at the bottom of the wiring board 22, increase the structural strength of the wiring board 22, on the other hand, increase the heat dissipation performance of the circuit board module 220, the heat that the photosensitive element 21 that can effectively scatter and disappear issues.
It is worth mentioning that, the wiring board 22 can use FPC (Flex Print Circuit, flexible printed-circuit board), and by the rigidity of wiring board 22 described in the reinforcing layer 2204C, so that the FPC with excellent bending performance can satisfy the bearing requirements of the circuit board module 220.That is, the selectable range of the wiring board 22 is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, R-FPC (Rigid-Flex PCB, Rigid Flex).Increase the structural strength of the wiring board 22 by the reinforcing layer 2204B and improves heat dissipation performance, so as to reduce the thickness of the wiring board 22, so that the height of the circuit board module further decreases, and the height of the camera module obtained by its assembling reduces.
Figure 10 is the array camera module of the 5th preferred embodiment according to the present invention and its cut-away view of circuit board module 220.
Different from above preferred embodiment, the wiring board 22D has an at least reinforced hole 227D, and the disjunctor encapsulation part 2201 extends into the reinforced hole 227D, to enhance the structural strength of the wiring board 22D.
The position of the reinforced hole 227D can according to need selection, and is arranged according to the structural strength demand of the wiring board 22D, for example be in symmetrical structure.By the setting of the reinforced hole 227D so that the structural strength of the wiring board 22D enhance, so as to reduce the thickness of the wiring board 22D, reduce the thickness of the camera module by its assembling, and the heat dissipation performance of the raising circuit board module 220.
It is noted that the reinforced hole 227D is groove-like, that is, the reinforced hole 227D is blind hole, so that the moulding material of the disjunctor encapsulation part 2201 will not be leaked out by the reinforced hole 227D when manufacturing the circuit board module 220.
Figure 11 is the array camera module of the 6th preferred embodiment according to the present invention and its cut-away view of circuit board module 220.
Different from above preferred embodiment, the wiring board 22E has an at least reinforced hole 227E, and the disjunctor encapsulation part 2201 extends into the reinforced hole 227E, to enhance the structural strength of the wiring board 22E.
The position of the reinforced hole 227E can according to need selection, and is arranged according to the structural strength demand of the wiring board 22E, for example be in symmetrical structure.By the setting of the reinforced hole 227E so that the structural strength of the wiring board 22E enhance, so as to reduce the thickness of the wiring board 22E, reduce the thickness of the camera module by its assembling, and the heat dissipation performance of the raising circuit board module 220.
It is worth mentioning that, the reinforced hole 227E is perforation, that is, the reinforced hole 227E is across the wiring board 22E, so that the two sides of the wiring board 22E are connected to, thus when manufacturing the circuit board module 220, the moulding material of the disjunctor encapsulation part 2201 is fully in conjunction with the wiring board 22E, stronger composite structure, and the structure of the relatively described groove-like are formed, the perforation is easier to fabricate.
Figure 12 is the array camera module of the 7th preferred embodiment according to the present invention and its cut-away view of circuit board module 220.
What it is different from above preferred embodiment is, the disjunctor encapsulation part 2201F includes a cladding section 22013F, a filter element construction section 22014F and a camera lens construction section 22015F, successively integrally molding is connected to the cladding section 22013F to the filter element construction section 22014F and camera lens construction section 22015F, the cladding section 22013F molding is connected to the wiring board 22, and the cladding section 22013F is for coating the electronic component 26 and the lead 24.The filter element construction section 22014F is for installing the filter element 40, that is, when the circuit board module 220 be used to assemble the array camera module, the filter element 40 of the array camera module is installed in the filter element construction section 22014F, so that the filter element
40 are located on the photosensitive path of the photosensitive element 21, and do not need to provide additional 40 mounting bracket of the filter element.That is, the disjunctor encapsulation part 2201F has the function of conventional stent here, but the advantage based on moulding technology, it can be by the technology mode of mold at the top of the filter element construction section 22014F, make it have good planarization, so that the filter element 40 is entirely mounted, this point is also an advantage over traditional camera module.The camera lens construction section 22015F is for installing the optical lens 10, that is, when the circuit board module 220 be used to assemble the array camera module, the optical lens 10 is installed on the inside of the camera lens construction section camera lens construction section 22015F of the disjunctor encapsulation part 2201F, in order to provide stable installation site for the optical lens 10.
Further, the filter element construction section 22014F has two mounting groove 220141F, the mounting groove 220141F is connected to the corresponding optical window 231F, and sufficient installation space is provided for each filter element 40, so that each filter element 40 stablizes installation.There are the camera lens construction section 22015F two camera lens mounting groove 220151F, each camera lens mounting groove 220151F to be connected to the corresponding optical window 231F, and respectively each optical lens 10 provides sufficient installation space.
In other words, the filter element construction section 22014F and the camera lens construction section 22015F are integrally upwardly extended, and internal formation step-like structure, the respectively described filter element 40 and the optical lens 10, which provide, supports fixed position, installs the filter element 40 and the optical lens 10 without providing additional component.
The camera lens construction section 22015F has two camera lens inner wall 220152F, and each camera lens inner wall 220152F is in closed annular respectively, is suitable for optical lens 10 and provides installation space.It is noted that each camera lens inner wall 220152F surfacing of the camera lens construction section 220152F forms fixed-focus mould group to be suitable for installing the non-threaded optical lens 10.Particularly, the optical lens 10 can be fixed on the camera lens construction section 22015F by way of bonding.
3A referring to Fig.1 is the circuit board module 220 and the array camera module of the 8th preferred embodiment according to the present invention.What it is different from above preferred embodiment is, the circuit board module 220 includes a shielded layer 2205, the shielded layer 2205 wraps up the wiring board 22 and the disjunctor encapsulation part 2201, to enhance the anti-electromagnetic interference capability of the circuit board module 220 while enhancing the structural strength of the wiring board 22.
With reference to Figure 13 B, the array camera module and its circuit board module 220 of the 9th preferred embodiment according to the present invention.What it is different from above preferred embodiment is, the filter element 40 is not assembled in the molded base 23, but the filter element 40 is assembled in the optical lens 10, when photosensitive path to be maintained at the photosensitive element 21 in the optical lens 10, the filter element 40 is maintained between the photosensitive element 21 and the optical lens 10.That is, needing that the filter element 40 is first assembled in the optical lens 10 during assembling the array camera module, the optical lens 10 then being made to be maintained at the photosensitive path of the photosensitive element 21 again.
It will be appreciated by those skilled in the art that be, although in the example shown in attached drawing 13B, the quantity of the optical lens 10 and the quantity of the filter element 40 correspond, in other examples, the quantity of the filter element 40 can also be also one, to make the filter element 40 while be assembled in multiple optical lens 10.
Referring to Fig.1 4, the array camera module and its circuit board module 220 of the according to the present invention ten preferred embodiment.Different from above preferred embodiment, the array camera module includes an at least supporter 70, for installing each filter element 40, each optical lens 10 or each driver 30.This embodiment according to the invention, the supporter 70 are installed in the disjunctor encapsulation part 2201, and each filter element 40 is installed in the supporter 70, and each driver 30 is installed in the supporter 70.The concrete shape of the supporter 70 can according to need setting, such as setting boss, in order to install each optical filter.Shown supporter 70 can be a disjunctor bracket, that is to say, that can be also possible to support unit, that is, one filter element 40 of installation with the multiple filter elements 40 of once mounting.In this embodiment in accordance with the invention, the supporter 70 is preferably disjunctor bracket.Those skilled in the art is it should be understood that the concrete shape of the supporter 70 is not limitation of the invention.
With reference to Figure 15 A to Figure 15 H of Figure of description of the invention, the manufacturing process of the array camera module of another preferred embodiment under this invention and the array camera module is elucidated with, wherein the array camera module includes at least two optical lens 10 ' and a molding photosensory assembly 20 ', wherein the molding photosensory assembly 20 ' further comprises at least two photosensitive elements 21 ', a wiring board 22 ', a molded base 23 ' and at least two groups lead 24 '.It is noted that the company shown in attached drawing 2A to attached drawing 14
Body encapsulation part 2201 is equivalent to the molded base 23 ' in the array camera module of this embodiment of the invention.
Each photosensitive element 21 ' respectively includes one group of chip contacts 211 ', a photosensitive region 212 ' and a non-photo-sensing region 213 ', wherein the photosensitive region 212 ' and the non-photo-sensing region 213 ' are integrally formed, and the photosensitive region 212 ' is located at the middle part of the photosensitive element 21 ', the non-photo-sensing region 213 ' is located at the outside of the photosensitive element 21 ', and the non-photo-sensing region 213 ' surrounds the photosensitive region 212 ' one weeks, and the chip contacts 211 ' are arranged at the non-photo-sensing region 213 '.
Correspondingly, the wiring board 22 ' includes the smooth chip attachment region 222 ' of at least two groups wiring board connector 221 ', at least two and a fringe region 223 ', wherein the fringe region 223 ' and each chip attachment region 222 ' are integrally formed, and the fringe region 223 ' is located at around each chip attachment region 222 ', and the wiring board connector 221 ' is arranged at the fringe region 223 '.
Each lead 24 ' is respectively provided with a chip connecting pin 241 ' and a wiring board connecting pin 242 ', wherein the lead 24 ' extends deviously between the chip connecting pin 241 ' and the wiring board connecting pin 242 '.
Each photosensitive element 21 ' is mounted on each of described wiring board 22 ' chip attachment region 222 ' respectively, wherein the chip connecting pin 241 ' of the lead 24 ' is connected to the chip contacts 211 ' of the photosensitive element 21 ', the wiring board connecting pin 242 ' of the lead 24 ' is connected to the wiring board connector 221 ' of the wiring board 22 ', the molded base 23 ' is at least integrally combined with the fringe region 223 ' of the wiring board 22 ', to form the molding photosensory assembly 20 ', wherein each optical lens 10 ' is arranged at the photosensitive path of each of the molding photosensory assembly 20 ' photosensitive element 21 ' respectively.The light being reflected by the object enters the inside of the array camera module from each optical lens 10 ', to receive in the subsequent photosensitive region 212 ' by each photosensitive element 21 ' and carry out photoelectric conversion, to obtain image associated with object.
In an example of the array camera module of the invention, the chip contacts 211 ' of the photosensitive element 21 ' and the wiring board connector 221 ' of the wiring board 22 ' can be terminal pad respectively, i.e., the chip contacts 211 ' of the photosensitive element 21 ' and the wiring board connector 221 ' of the wiring board 22 ' can be disc-shaped, for making the chip connecting pin 241 ' of the lead 24 ' be connected to the chip contacts 211 ' of the photosensitive element 21 ' and the wiring board connecting pin 242 ' of the lead 24 ' being made to be connected to the wiring board connector 221 ' of the wiring board 22 ' in another example of the array camera module of the invention, the chip contacts of the photosensitive element 21 ' 211 ' and the wiring board connector 221 ' of the wiring board 22 ' can be respectively in spherical, such as by tin cream or other welding material points in the non-photo-sensing region 213 ' of the photosensitive element 21 ' and the fringe region 223 ' of the wiring board 22 ', to be respectively formed the chip contacts 211 ' of the photosensitive element 21 ' and the wiring board connector 221 ' of the wiring board 22 '.However, those skilled in the art should be understood that, the chip contacts 211 ' of the photosensitive element 21 ' and the wiring board connector 221 ' of the wiring board 22 ' do not constitute the limitation to the contents of the present invention and range, i.e., in other examples, the chip contacts 211 ' of the photosensitive element 21 ' and the wiring board connector 221 ' of the wiring board 22 ' also can have other above-mentioned shapes not enumerated.
The non-photo-sensing region 213 ' of the photosensitive element 21 ' further has a chip inside portion 2131 ', a chip interconnecting piece 2132 ' and a chip outside portion 2133 ', wherein the chip contacts 211 ' are arranged at the chip interconnecting piece 2132 ', the chip inside portion 2131 ' surrounds the photosensitive region 212 ' one weeks, and the two sides of the chip interconnecting piece 2132 ' each extend over and are connected to the chip inside portion 2131 ' and the chip outside portion 2132.That is, in the present invention, the non-photo-sensing region 213 ' is defined as the chip inside portion 2131 ' from the region that marginal position of the position of the chip contacts 211 ' to the photosensitive region 212 ' is set, the region that the chip contacts 211 ' are set in the non-photo-sensing region 213 ' is defined as the chip interconnecting piece 2132 ', the non-photo-sensing region 213 ' is defined as the chip outside portion 2133 ' from the region that outer edge of the position of the chip contacts 211 ' to the photosensitive element 21 ' is set.In other words, from the point of view of the depression angle of the photosensitive element 21 ', the photosensitive element 21 ' is successively the photosensitive region 212 ', the chip inside portion 2131 ', the chip interconnecting piece 2132 ' and the chip outside portion 2133 ' from inside to outside.
Similarly, the fringe region 223 ' of the wiring board 22 ' further has a wiring board inside portion 2231 ', a route
Plate interconnecting piece 2232 ' and a wiring board outside portion 2233 ', wherein the wiring board connector 221 ' is arranged at the wiring board interconnecting piece 2232 ', the wiring board inside portion 2231 ' surrounds the chip attachment region 222 ' one weeks, and the two sides of the wiring board interconnecting piece 2232 ' each extend over and are connected to the wiring board inside portion 2231 ' and the wiring board outside portion 2233 '.That is, in the present invention, the fringe region 223 ' is defined as the wiring board inside portion 2231 ' from the marginal position in position to the chip attachment region 222 ' that the wiring board connector 221 ' is set, the region that the wiring board connector 221 ' is set of the fringe region 223 ' is defined as the wiring board interconnecting piece 2232 ', the fringe region 223 ' is defined as the wiring board outside portion 2233 ' from the region that outer edge of the position of the wiring board connector 221 ' to the wiring board 22 ' is set.It is worth mentioning that, in this embodiment of the array camera module of the invention, the wiring board 22 ' is integral type wiring board, preferably, each chip attachment region 222 ' respectively symmetrically is set to the both ends of the wiring board 22 ', so that the wiring board 22 ' be made to form symmetrical structure.
In addition, the type of the lead 24 ' is unrestricted in the array camera module of the invention, such as in a specific example, the lead 24 ' may be implemented as gold thread, i.e., the photosensitive element 21 ' and the wiring board 22 ' can be linked together by way of beating gold thread, after the electric signal after the photosensitive region 212 ' of the photosensitive element 21 ' is by optical signal conversion, the electric signal can be further transmitted to the wiring board 22 ' by the lead 24 '.It will be appreciated by those skilled in the art that be, in other examples of the array camera module of the invention, the lead 24 ' also may be implemented as that silver wire, copper wire etc. are any to be can be realized the material that the electric signal transmits between the photosensitive element 21 ' and the wiring board 22 ' and be made.
The array camera module can be a fixed-focus camera module, it is also possible to a dynamic burnt camera module, it is also possible to a zoom camera mould group, such as the array camera module can have the ability of auto-focusing and optical zoom under the premise of by control height dimension, to improve the image quality of the array camera module.
Specifically, in this example of the array camera module shown in attached drawing 15A to attached drawing 15H, the array camera module further comprises at least two drivers 30 ', wherein each optical lens 10 ' is assembled in each driver 30 ' respectively, each driver 30 ' is assembled in the top surface of the molded base 23 ' respectively, so that each optical lens 10 ' is respectively held on each of the molding photosensory assembly 20 ' the photosensitive path of the photosensitive element 21 '.Each driver 30 ' is electrically connected to the wiring board 22 ' respectively, after electric energy and control signal are transmitted to each driver 30 ' by the wiring board 22 ', each driver 30 ' can respectively drive each optical lens 10 ' and move back and forth along the photosensitive path of each photosensitive element 21 ', so as to adjust the focal length of the array camera module.That is, the optical lens 10 ' can be drivingly disposed in the driver 30 '.
It is worth mentioning that, the type of the driver 30 ' is unrestricted in the array camera module of the invention, such as in a specific example, the driver 30 ' may be implemented as any driver that the optical lens 10 ' can be driven to generate displacement along the photosensitive path of the photosensitive element 21 ' such as voice coil motor, wherein the driver 30 ' can receive electric energy and control signal in running order.
With further reference to attached drawing 15A to attached drawing 15H, the array camera module further comprises an at least filter element 40 '.Such as in an illustrative example of the invention, the array camera module may include the filter element 40 ', wherein the filter element 40 ' is assembled in the top surface of the molded base 23 ', so that the different location of the filter element 40 ' corresponds respectively to the photosensitive path of each photosensitive element 21 '.In another illustrative example, the array camera module may include at least two filter elements 40 ', wherein each filter element 40 ' is assembled in the top surface of the molded base 23 ' respectively, so that each filter element 40 ' corresponds respectively to the photosensitive path of each photosensitive element 21 ', that is, each of described array camera module photosensitive element 21 ', each filter element 40 ' and each optical lens 10 ' are one-to-one relationship respectively.
In the array camera module quilt in use, the light being reflected by the object enters the inside of the array camera module from the optical lens 10 ', and by the photosensitive element 21 ' reception and photoelectric conversion can be carried out by after the filter element 40 ' filtering.That is, the filter element 40 ' can filter the veiling glare entered in the light being reflected by the object inside the array camera module from the optical lens 10 ', such as the infrared part can improve the array camera module in this way
Image quality.
In addition, the filter element 40 ' can be by direct-assembling in the top surface of the molded base 23 ', it can also be by the way that the filter element 40 ' be first assembled in a supporter, then the supporter is assembled in the top surface of the molded base 23 ' again, in this way, the size of the filter element 40 ' can be reduced, to reduce the manufacturing cost of the array camera module.
It will be appreciated by those skilled in the art that be, in the different examples of the array camera module, the filter element 40 ' can be implemented as different types, such as the filter element 40 ' can be implemented as cutoff filter, the combination of full impregnated spectral filter and other optical filters or multiple optical filters, such as the filter element 40 ' can be implemented as the combination of cutoff filter and full impregnated spectral filter, the i.e. described cutoff filter and the full impregnated spectral filter can be switched to be optionally situated on the photosensitive path of the photosensitive element 21 ', such as when under the more sufficient environment of the light such as daytime using the array camera module, the cutoff filter can be switched to the photosensitive path of the photosensitive element 21 ', by the IR cut filter Piece filtering enters the infrared ray in the light of the array camera module being reflected by the object, when using the array camera module in the environment of the darks such as night, the full impregnated spectral filter can be switched to the photosensitive path of the photosensitive element 21 ', the infrared part in the light being reflected by the object to allow access into the array camera module penetrates.
During manufacturing the array camera module, with reference to attached drawing 15A, one group of electronic component 26 ' of the molding photosensory assembly 20 ' is first mounted on to the fringe region 223 ' of the wiring board 22 ' by such as SMT (Surface Mount Technology) technique.Preferably, each electronic component 26 ' is mounted on the wiring board outside portion 2233 ' of the fringe region 223 '.Nevertheless, the electronic component 26 ' can also be mounted on to the middle part of the wiring board 22 ' as needed, it is to be understood that the electronic component 26 ' is not mounted on the chip attachment region 222 ' of the wiring board 22 '.
With reference to attached drawing 15B, the wiring board 22 ' with the electronic component 26 ' is placed in a molding tool 100 ', forms the mould group pedestal 23 ' to carry out moulding technology by the molding die 100 '.Specifically, the molding die 100 ' includes a upper mold 101 ' and mold 102 ' once, wherein the upper mold 101 ' and at least one mold in the lower mold 102 ' can be moved, so that the molding die 100 ' can be carried out molding and draft operation.When the upper mold 101 ' and the lower mold 102 ' are molded, an at least molding space 103 ' is formed between the upper mold 101 ' and the lower mold 102 ', wherein corresponding respectively to the molding space 103 ' in the middle part of the fringe region 223 ' of the wiring board 22 ' and the wiring board 22 '.Preferably, after the molding space 103 ' of the molding die 100 ' is formed, being mounted on each of described wiring board 22 ' electronic component 26 ' can be respectively positioned in the molding space 103 '.
In attached drawing 15C, the moulding material of flow-like is added in the molding space 103 ', so that the moulding material fills the molding space 103 ' and coats each electronic component 26 ', to form the molded base 23 ' joined integrally with the wiring board 22 ' and each electronic component 26 ' after moulding material consolidation in the molding space 103 ', with reference to attached drawing 15D, wherein the molded base 23 ' coats each electronic component 26 ' not only to prevent each electronic component 26 ' and outside air contact, and the adjacent electronic component 26 ' can also be isolated in the molded base 23 ', to avoid the bad phenomenon interfered with each other occur between the adjacent electronic component 26 '.It will be appreciated by those skilled in the art that be, the distance of the adjacent electronic component 26 ' can be decreased further, to mount the greater number of electronic component 26 ' on the wiring board 22 ' of limited areal, in this way, the image quality of the array camera module can further be improved.
It is worth mentioning that, the molding die 100 ' further comprises a cover film 104 ', wherein the stitching surface 1011 ' of the upper mold 101 ' is overlappingly arranged in the cover film 104 ', in this way, when the upper mold 101 ' and the lower mold 102 ' are by carry out die closing operation, the stitching surface 1011 ' of the upper mold 101 ' with the wiring board 22 ' without directly contacting, but buffer function is provided by the cover film 104 ', the impact force generated when being molded to avoid the upper mold 101 ' and the lower mold 102 ' directly acts on the wiring board 22 ' and the wiring board 22 ' is caused to deform, to protect the wiring board 22.In addition, the cover film 104 ' can increase the leakproofness of the stitching surface 1011 ' of the upper mold 101 ' and the surface of the wiring board 22 ', when carrying out moulding technology, the moulding material can be prevented to flow to the chip attachment region 222 ' of the wiring board 22 ' from the molding space 103 ', to guarantee the planarization in the chip attachment region 222 ' of the wiring board 22 '.In addition, the cover film 104 ' can facilitate draft, wherein when the upper mold after the molded base 23 ' consolidation molding
The molded base 23 ' joined integrally, the wiring board 22 ' and the electronic component 26 ' after 101 ' are performed draft operation with the lower mold 102 ', shown in available such as attached drawing 15E.It is worth mentioning that, in the molded base 23 ' molding, the optical window 231 ' of the molded base 23 ' is integrally formed, wherein the optical window 231 ' of the chip attachment region 222 ' of the wiring board 22 ' and the molded base 23 ' corresponds to each other, to provide a passage of light by the optical window 231 ' subsequent for the optical lens 10 ' and the photosensitive element 21 '.
In addition, the top surface of the mould group pedestal 23 ' can also form an at least inner surface 232 ' and an outer surface 233 ', wherein the inner surface 232 ' is for mounting the filter element 40 ', and the outer surface 233 ' is for mounting the driver 30 '.Preferably, plane where the inner surface 232 ' of the molded base 23 ' is lower than the plane where the outer surface 233 ', to make the inner surface 232 ' and the outer surface 233 ' of the molded base 23 ' that there is difference in height, to form a groove 234 ' of the molded base 23 ', the filter element 40 ' for being mounted on the inner surface 233 ' is housed inside in the groove 234 ', in this way, it can reduce the height dimension of the array camera module.
Further; the top surface of the molded base 23 ' is further formed at least one blocking protrusion 235 '; the wherein junction of each inner surface 232 ' and the outer surface 233 ' for stopping protrusion 235 ' to be respectively formed in the molded base 23 '; with in the subsequent assembling driver 30 ', the blocking protrusion 235 ' is by way of the channel for stopping light and pollutant to enter for protecting the photosensitive path of the photosensitive element 21 '.
With reference to attached drawing 15F, each photosensitive element 21 ' is mounted on each of described wiring board 22 ' chip attachment region 222 ' respectively, and after the photosensitive element 21 ' and the wiring board 22 ' are conductively connected by institute's lead 24 ', the molding photosensory assembly 20 ' is formed, wherein each photosensitive element 21 ' corresponds respectively to each optical window 231 '.
With reference to attached drawing 15G, each filter element 40 ' is mounted on to the inner surface 232 ' of the mould group pedestal 23 ' respectively, so that each filter element 40 ' is respectively held on the photosensitive path of the photosensitive element 21 '.Preferably, after each filter element 40 ' is assembled in the molded base 23 ' respectively, each filter element 40 ' closes off each of described molded base 23 ' optical window 231 '.
With reference to attached drawing 15H, each optical lens 10 ' is assembled in each driver 30 ' respectively, and each driver 30 ' is assembled in the outer surface 234 ' of the molded base 23 ' respectively by glue or other equivalent embodiments, so that the optical lens 10 ' is maintained at the photosensitive path of the photosensitive element 21 ', so that the array camera module be made.
It is worth mentioning that, during assembling top surface of the driver 30 ' to the molded base 23 ', the blocking protrusion 235 ' can prevent the glue between the driver 30 ' and the outer surface 234 ' of the molded base 23 ' from entering the optical window 231 ', to prevent the photosensitive path of the filter element 40 ' and the photosensitive element 21 ' contaminated, to improve the product yield of the array camera module.
With reference to attached drawing 16 and attached drawing 17, the array camera module of one variant embodiment of above-mentioned preferred embodiment under this invention further comprises a bracket 50 ', wherein the bracket 50 ' has at least two installation spaces 51 ', and each installation space 51 ' is respectively communicated in two sides of the bracket 50 ', that is, each installation space 51 ' can be respectively formed a channel.Each driver 30 ' is installed in each of described bracket 50 ' installation space 51 ' respectively, to make each driver 30 ' be maintained at stable state by the bracket 50 ', to guarantee to be assembled in each of each driver 30 ' concentricity of the optical lens 10 ' and improve the intensity of the array camera module, to further increase the image quality of the array camera module.
Preferably, after each driver 30 ' is installed in each of described bracket 50 ' installation space 51 ' respectively, some fillers are filled between the inner wall of the bracket 50 ' described in the shell of each driver 30 ', so that the case where each driver 30 ' is not in shaking after being installed in each of described bracket 50 ' installation space 51 '.It is highly preferred that the filler being filled between the shell of each driver 30 ' and the inner wall of the bracket 50 ' can be glue.
With reference to attached drawing 15A to Figure 17, although in following description of the present invention by taking the array camera module is implemented as twin-lens camera module as an example, the feature and advantage for the array camera module that the present invention is furture elucidated, it will be appreciated by those skilled in the art that be, in a variant embodiment of the array camera module of the invention shown in attached drawing 18, the array camera module also may include more optical lens 10 '.
Attached drawing 19 shows second variant embodiment of the array camera module, it is different from the embodiment of above-mentioned preferred embodiment of the invention, the array camera module includes two wiring boards 22 ', wherein each wiring board 22 ' respectively includes a chip attachment region 222 ' and a fringe region 223 ', wherein each photosensitive element 21 ' is mounted on the chip attachment region 222 ' of each wiring board 22 ' respectively, wherein when carrying out moulding technology to form the molded base 23 ', the molded body 232 ' of the molded base 23 ' and at least part of the fringe region 223 ' of each wiring board 22 ' are joined integrally.That is, the wiring board 22 ' is split type wiring board in this embodiment of the array camera module of the invention.
Attached drawing 20 shows the third variant embodiment of the array camera module, wherein the array camera module includes at least a lens barrel 60 ' and at least one described driver 30 ', wherein the lens barrel 60 ' integrally extends the top surface of the molded base 23 ', the driver 30 ' is assembled in the top surface of the molded base 23 ', and the lens barrel 60 ' and the driver 30 ' are respectively used to assemble the optical lens 10 ', preferably, the lens barrel 60 ' and the molded base 23 ' are integrally molded by moulding technology.Such as when the array camera module is implemented as twin-lens camera module, the array camera module includes a driver 30 ' and a lens barrel 60 '.
Figure 21 shows the 4th variant embodiment of the array camera module, wherein the array camera module includes at least one lens barrel 60 ' and at least one described driver 30 ', wherein the lens barrel 60 ' and the driver 30 ' are assembled in the top surface of the molded base 23 ' respectively, and each optical lens 10 ' is assembled in the lens barrel 60 ' and the driver 30 ' respectively, so that the optical lens 10 ' is maintained at the photosensitive path of the photosensitive element 21 '.It is worth mentioning that, although the shown in Figure 21 lens barrel 60 ' is non-threaded lens barrel, it will be appreciated by those skilled in the art that be, the lens barrel 60 ' also may be implemented as threaded lens barrel, so that the lens barrel 60 ' and the optical lens 10 ' can make the optical lens 10 ' be assembled in the lens barrel 60 ' by way of being spirally connected.
Attached drawing 22 shows the 5th variant embodiment of the array camera module, wherein the array camera module includes at least two lens barrels 60 ', wherein each lens barrel 60 ' integrally extends the top surface of the pedestal pedestal 23 respectively, each optical lens 10 ' is assembled in each lens barrel 60 ' respectively, preferably, each lens barrel 60 ' is integrally molded by moulding technology with the molded base 23 ' respectively.
Attached drawing 23 shows the 6th variant embodiment of the array camera module, wherein the array camera module includes at least two lens barrels 60 ', wherein after the molding photosensory assembly 20 ' molding, each lens barrel 60 ' is assembled in the different location of the top surface of the molded base 23 ' respectively, each optical lens 10 ' is assembled in each lens barrel 60 ' respectively, so that each optical lens 10 ' is respectively held in the photosensitive path of each photosensitive element 10.It is noted that the lens barrel 60 ' can be threaded lens barrel, it is also possible to non-threaded lens barrel, the present invention facilitates unrestricted at this.
In addition, the description of two being only for example property of embodiment of the array camera module that attached drawing 22 and attached drawing 23 are shown respectively, in other examples, 7th variant embodiment of the array camera module with reference to shown in attached drawing 24, at least one described lens barrel 60 ' can be integrally formed by moulding technology with the molded base 23 ', and the lens barrel 60 ' in addition can be assembled in the top surface of the molded base 23 '.Such as when the array camera module is implemented as twin-lens camera module, one lens barrel 60 ' can be integrally formed by moulding technology with the molded base 23 ', another lens barrel 60 ' can be assembled in the top surface of the molded base 23 ', in order to focus.
Attached drawing 25 shows the 8th variant embodiment of the array camera module, wherein the wiring board 22 ' has an at least accommodation space 228 ', the photosensitive element 21 ' is housed inside in the accommodation space 228 ' of the wiring board 22 ', to reduce the difference in height of the upper surface of the photosensitive element 21 ' and the upper surface of the wiring board 22 ', even the upper surface of the photosensitive element 21 ' and the upper surface of the wiring board 22 ' is made to be in approximately the same plane, in this way, it can reduce the height dimension of the array camera module, so that the array camera module pursues lightening electronic equipment particularly suitable for being applied to.It is noted that the accommodation space 228 ' can be a holding tank.In the 9th variant embodiment of the array camera module shown in attached drawing 26, the accommodation space 228 ' of the wiring board 22 ' is also possible to a through-hole, to further decrease the height dimension of the array camera module.
Attached drawing 27 shows the tenth variant embodiment of the array camera module, wherein the receiving of the wiring board 22 is empty
Between 228 ' quantity can be less than the photosensitive element 21 ' quantity, such as in this particular example, the wiring board 22 ' can only have an accommodation space 228 ', one of them photosensitive element 21 ' is mounted on the surface of the wiring board 22 ', another described photosensitive element 21 ' can be maintained at the accommodation space 228 ' of the wiring board, so that the upper surface of two photosensitive elements 21 ' is not in approximately the same plane, so as to so that two imaging systems of the array camera module have different focal ranges.
It is noted that although in attached drawing 27 by taking the accommodation space 228 ' is implemented as through-hole as an example, it will be appreciated by those skilled in the art that, in other examples, the accommodation space 228 ' also may be implemented as groove.
Attached drawing 28 shows the 11st variant embodiment of the array camera module, wherein each of described array camera module size of the photosensitive element 21 ' and the specification of each optical lens 10 ' can also be inconsistent, such as in this embodiment, the size of one photosensitive element 21 ' is bigger, the size of another photosensitive element 21 ' is smaller, and the optical lens 10 ' for being maintained at the photosensitive element 21 ' of larger size is wide-angle optical lens, the optical lens 10 ' for being maintained at the photosensitive element 21 ' of smaller size is focal length optical lens, in this way, it can make the array camera module that there is more preferably imaging effect.
Attached drawing 29 shows the 12nd variant embodiment of the array camera module, wherein the photosensitive element 21 ' of larger size can be mounted on the surface of the wiring board 22 ', the photosensitive element 21 ' of smaller size can be maintained in the accommodation space 228 ' of the wiring board 22 ', so that the photosensitive element 21 ' of smaller size and the imaging system formed by the optical lens for being implemented as focal length optical lens arranged in pairs or groups in the photosensitive element 21 ' are with longer focal length, so that the array camera module has more preferably remote burnt imaging capability.
Attached drawing 30 shows the 13rd variant embodiment of the array camera module, wherein the array camera module can also only have a filter element 40 ', wherein in the filter element 40 ' it is assembled in the molded base 23 ' and after each optical lens 10 ' is maintained at the photosensitive path of each photosensitive element 21 ', each optical lens 10 ' corresponds respectively to the different location of the filter element 40 ', so as to enter the light of the array camera module after by the filtering of the different location of the filter element 40 ' from each optical lens 10 ', it is imaged again by the photosensitive element 21 ' reception and progress photoelectric conversion.
Attached drawing 31 shows the 14th variant embodiment of the array camera module, wherein the array camera module further comprises an at least supporter 70 ', wherein in this particular example, the quantity of the supporter 70 ', the quantity of the filter element 40 ' is consistent with the quantity of the optical lens 10 ', wherein each filter element 40 ' is assembled in each supporter 70 ' respectively, each supporter 70 ' is assembled in the molded base 23 ' respectively, so that each filter element 40 ' is respectively held in the photosensitive path of the photosensitive element 21 ', in this way, the size of the filter element 40 ' can be reduced, to reduce the manufacturing cost of the array camera module.
Attached drawing 32 shows the 15th variant embodiment of the array camera module, wherein the array camera module can also only include a supporter 70 ', wherein the filter element 40 ' is assembled in the supporter 70 ', and the molded base 23 ' is assembled in the supporter 70 ' and after each optical lens 10 ' is respectively held in the photosensitive path of each photosensitive element 21 ', each optical lens 10 ' corresponds respectively to the different location of the filter element 40 '.
Attached drawing 33 shows the 16th variant embodiment of the array camera module, wherein the driver 30 ' of the array camera module is integral type driver, i.e. each optical lens 10 ' is assembled in the same driver 30 ' respectively, with after the driver 30 ' is assembled in the molded base 23 ', each optical lens 10 ' is respectively held in the photosensitive path of each photosensitive element 21 '.The array camera module of the invention is in this embodiment by the way of the driver 30 ' of integral type, the packaging efficiency of the array camera module can not only be improved, but also the size of the array camera module can be further reduced, so that the structure of the array camera module is more compact, so that the array camera module is especially suitable for pursuing lightening electronic equipment.
It is worth mentioning that, the molded base 23 ' with the wiring board 22 ' after integrally combining, also it can play the role of wiring board 22 ' described in reinforcement, i.e., the molded base 23 ' can form a reinforcement part 28 ', wherein the reinforcement part 28 ' can coat the electronic component 26 ', in this way, on the one hand, the adjacent electronic component can be isolated in the reinforcement part 28 '
26 ' and the isolation electronic component 26 ' and air, on the other hand, the electronic component 26 ' can prevent the reinforcement part 28 ' to be detached from from wiring board 22 ', to ensure the reliability and stability of array camera module during assembled and when in use.
Attached drawing 34 shows the 17th variant embodiment of the array camera module, wherein the wiring board 22 ' has at least one first reinforcement space 229 ', wherein after the reinforcement part 28 ' is formed, a part of the reinforcement part 28 ' extends to and is maintained at first reinforcement space 229 ', so that the reinforcement part 28 ' and the wiring board 22 ' are more reliably combined together.It is noted that first reinforcement space 229 ' can be through-hole and be also possible to blind hole, although first reinforcement space 229 ' shown in Figure 34 is implemented as the example of through-hole, the limitation to the contents of the present invention and range is not constituted.
Attached drawing 35 shows the 18th variant embodiment of the array camera module, wherein the molding photosensory assembly 20 ' further comprises a substrate 29 ', wherein the substrate 29 ' is overlappingly set to the wiring board 22 ', with by wiring board 22 ' described in the further reinforcement of the substrate 29 ', so that the wiring board 22 ' be made to keep smooth.It is understood that the wiring board 22 ' can choose the thinner wiring board of size, to reduce the thickness of the array camera module, to keep the array camera module lightening.
Preferably, the substrate 29 ' can be made of metal material or alloy material, such as aluminium can be worth the substrate 29 ', the substrate 29 ' of metal material or alloy material can not only make the wiring board 22 ' keep smooth, but also the wiring board 22 ' can be helped to radiate, to guarantee the array camera module, temperature is not too high when in use, so that it is guaranteed that the reliability of the array camera module.
Further, the substrate 29 ' has at least one second reinforcement space 291 ', wherein after the substrate 29 ' is overlappingly set to the wiring board 22 ', first reinforcement space 229 ' of the wiring board 22 ' and second reinforcement space 291 ' of the substrate 29 ' correspond to each other, so that the moulding material can enter second reinforcement space 291 ' via first reinforcement space 229 ', to after the moulding material consolidates in first reinforcement space 229 ' and second reinforcement space 291 ', form the reinforcement part 28 ' joined integrally with the wiring board 22 ' and the substrate 29 '.It is understood that second reinforcement space 291 ' can be through-hole, it is also possible to blind hole.
Attached drawing 36 shows the 19th variant embodiment of the array camera module, wherein the substrate 29 ' further comprises a base main body 292 ' and at least two conductive bodies 293 ', each conductive body 293 ' is extended the Base body 292 ' respectively spaced reciprocally and integrally, the wiring board 22 ' has at least two channels 300 ', wherein when each photosensitive element 21 ' is mounted on the wiring board 22 ' respectively, each channel 300 ' corresponds respectively to each photosensitive element 21 '.The base main body 292 ' is overlappingly set to the wiring board 21 ', so that each conductive body 293 ' is respectively inserted and is maintained at each of described wiring board 22 ' channel 300 ', and contact each photosensitive element 21 ' with each conductive body 293 ' respectively, rapidly to conduct the heat that the photosensitive element 13 ' generates at work by the conductive body 293 ' and the Base body 292 ', to improve the heat-sinking capability of the array camera module.
Attached drawing 37 shows the 20th variant embodiment of the array camera module, wherein the photosensitive element 21 ' can also not be mounted on the wiring board 22 ', but the conductive body 293 ' for being maintained at the channel 300 ' is made to protrude from the wiring board 22 ', the photosensitive element 21 ' is mounted on the conductive body 293 ', and it is switched on the photosensitive element 21 ' and the wiring board 22 ', in this way, the flatness of the photosensitive element 21 ' no longer needs the wiring board 22 ' to keep, to which the rigid requirements of the wiring board 22 ' of the array camera module can be further reduced, and then make the wiring board 22 ' of the array camera module that can be selected thinner flexible circuit board, described in reducing The height dimension of array camera module.
Attached drawing 38 shows the 21st variant embodiment of the array camera module, the array camera module also may include at least two optical lens 10 ', one molding photosensory assembly 20 ' and at least one additional photosensitive element 21 ", each additional photosensitive element 21 " is assembled in the wiring board 22 ' of the molding photosensory assembly 20 ', each optical lens 10 ' is arranged at the photosensitive path of each of the molding photosensory assembly 20 ' photosensitive element 21 ' and each additional photosensitive element 21 " respectively, to form the array camera module.In addition, the array camera module further comprises at least an additional body 270 " and an at least additional actuators 30 " or at least one additional lens barrel 60 "; wherein each additional body 27 " is assembled in the wiring board 22 ' of the molding photosensory assembly 20 ', each additional actuators 30 " or each described attached respectively
Lens barrel 60 " is added to be assembled in the wiring board 22 ' respectively; each optical lens 10 ' is assembled in the driver 30 ' or the lens barrel 60 ' or the additional actuators 30 " or the additional lens barrel 60 " respectively, so that each optical lens 10 ' is respectively held in the photosensitive path of each of the molding photosensory assembly 20 ' photosensitive element 21 ' and each additional photosensitive element 21 ".In addition, the additional photosensitive element 21 " can also not be mounted on the wiring board 22 ' of the molding photosensory assembly 20 '; but an extension wire plate 22 " is provided by the array camera module, for being mounted on each additional photosensitive element 21 ".
Other side under this invention, with reference to attached drawing 39, the present invention further provides the electronic equipments that one has array camera module, wherein the electronic equipment with array camera module includes an electronic equipment ontology 200 and at least an array camera module, wherein each array camera module is arranged at the electronic equipment ontology 200 respectively, for obtaining figure.In addition, the position that the array camera module is arranged at the electronic equipment ontology 200 can be unrestricted, such as in attached drawing 40A and Figure 40 B, the array camera module can be arranged at the corner of the electronic equipment ontology 200 along the width direction of the electronic equipment ontology 200, and in this example shown in attached drawing 40C, the array camera module can also be arranged at the middle part of the electronic equipment ontology 200 along the length direction of the electronic equipment ontology 200.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating and being not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention has been shown in embodiment and explanation, and under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (92)
- An array camera module characterized by comprisingAt least two optical lens；WithOne molding photosensory assembly, wherein the molding photosensory assembly further comprises:At least two photosensitive elements；One wiring board, wherein each photosensitive element is connected to the wiring board respectively switched only；AndOne molded base, wherein the molded base has at least two optical windows, and the fringe region of the molded base and the wiring board is joined integrally, so that each photosensitive element corresponds respectively to each optical window, wherein each optical lens is arranged at the photosensitive path of each photosensitive element respectively, to be respectively that each photosensitive element and each optical lens provide a passage of light by each optical window.
- Array camera module according to claim 1 further comprises an at least filter element, wherein each filter element is respectively held between the optical lens and the photosensitive element.
- Array camera module according to claim 2, wherein each filter element is assembled in the top surface of the molded base respectively, so that each filter element is respectively held between each optical lens and each photosensitive element.
- Array camera module according to claim 2, wherein each filter element is assembled in the camera lens shell of each optical lens respectively, so that each filter element is respectively held between each optical lens and each photosensitive element.
- Array camera module according to claim 2, it further comprise the supporter of an at least frame shape, wherein each filter element is assembled in each supporter respectively, each supporter is assembled in the top surface of the molded base respectively, so that each filter element is respectively held between each optical lens and each photosensitive element.
- Array camera module according to claim 3, wherein the top surface of the molded base forms an at least groove, each groove is respectively communicated in each optical window, wherein each filter element is housed inside each groove respectively.
- Array camera module according to claim 5, wherein the surface of the molded base forms an at least groove, each groove is respectively communicated in each optical window, wherein each supporter is housed inside each groove respectively.
- Array camera module according to claim 1, wherein the molding photosensory assembly further comprises at least one set of lead, wherein the both ends of each lead are respectively communicated with the wiring board connector of chip contacts and the wiring board in each photosensitive element, so that each photosensitive element and the wiring board are switched on.
- Array camera module according to claim 1, wherein the molding photosensory assembly further comprises an at least electronic component, wherein each electronic component is mounted on the wiring board respectively, and the molded base coats at least one described electronic component.
- Array camera module according to claim 9, wherein the electronic component that molded base cladding is whole.
- Array camera module according to claim 1, wherein the molded base further comprises a substrate, wherein the substrate is overlappingly set to the wiring board, to make the wiring board keep smooth by the substrate.
- Array camera module according to claim 1, wherein the wiring board has at least one first reinforcement space, a part of the molded base is formed in each of described wiring board first reinforcement space, so that the molded base and the wiring board are combined as a whole.
- Array camera module according to claim 11, wherein the substrate has at least one second reinforcement space, each second reinforcement space corresponds respectively to the first reinforcement of each of described wiring board space, wherein a part of the molded base is formed simultaneously in each of each of the wiring board first reinforcement space and the substrate second reinforcement space, so that the molded base, the wiring board and the substrate are combined as a whole.
- Array camera module according to claim 11, wherein the substrate includes a base main body and at least two conductive bodies, each conductive body integrally extends the base main body respectively, wherein the wiring board has at least two channels, wherein The base main body is overlappingly set to the wiring board main body, so that each conductive body is respectively held in each of described wiring board channel, wherein each photosensitive element is contacted with each conductive body respectively.
- The 4 array camera module according to claim 1, wherein each conductive body protrudes from the surface of the wiring board respectively, wherein each photosensitive element is mounted on each conductive body respectively.
- Array camera module according to claim 1, wherein the wiring board has an at least accommodation space, each photosensitive element is housed inside each accommodation space respectively.
- Array camera module according to claim 16, wherein the quantity of the accommodation space of the wiring board is less than the quantity of the photosensitive element, so that at least one described photosensitive element is housed inside the accommodation space, the photosensitive element in addition is mounted on the chip attachment region of the wiring board.
- Array camera module according to claim 16, wherein the accommodation space is holding tank or through-hole.
- Array camera module according to claim 1, photosensitive element described in wherein at least one have small size photosensitive region, and the photosensitive element in addition has large scale photosensitive region.
- Array camera module according to claim 19, wherein the wiring board has an at least accommodation space, wherein the photosensitive element with small size photosensitive region is housed inside the accommodation space, and the photosensitive element with large scale photosensitive region is housed inside the accommodation space or is mounted on the surface of the wiring board.
- According to claim 1 to any array camera module in 20, it further comprise at least two drivers, wherein each optical lens is assembled in each driver respectively, each driver is assembled in the molded base respectively, to make each optical lens be respectively held in the photosensitive path of each photosensitive element by each driver.
- According to claim 1 to any array camera module in 20, it further comprise at least two lens barrels, wherein each optical lens is assembled in each lens barrel respectively, each lens barrel is assembled in the top surface of the molded base respectively, or each lens barrel integrally extends the top surface of the molded base respectively, or at least one described lens barrel is assembled in the top surface of the molded base, in addition the lens barrel integrally extends the top surface of the molded base, to make each optical lens be respectively held in the photosensitive path of each photosensitive element by each lens barrel.
- According to claim 1 to any array camera module in 20, it further comprise an at least driver and an at least lens barrel, wherein each optical lens is assembled in each driver and each lens barrel respectively, wherein each driver is assembled in the top surface of the molded base respectively, each lens barrel is assembled in respectively or integrally extends the top surface of the molded base, to make each optical lens be respectively held in the photosensitive path of each photosensitive element by each driver and each lens barrel.
- Array camera module according to claim 21, wherein the middle part of the top surface of the molded base forms at least one blocking protrusion, the top surface of the molded base is divided into an inner surface and an outer surface by the blocking protrusion, wherein the driver is assembled in the outer surface of the mould group pedestal, and the glue for stopping protrusion prevention to be arranged between the driver and the outer surface enters the inner surface.
- Array camera module according to claim 21 further comprises a bracket, wherein the bracket has at least two installation spaces, each driver is installed in each of described bracket installation space respectively.
- Array camera module according to claim 25, wherein filling a filler between the outer wall of the driver and the inner wall of the bracket.
- Array camera module according to claim 26, wherein the filler is glue.
- One electronic equipment characterized by comprisingOne electronic equipment ontology；WithAccording to claim 1 to any at least one described described array camera module in 27, wherein the array camera module is arranged at the electronic equipment ontology, for obtaining image.
- Electronic equipment according to claim 28, wherein the length direction of the array camera module is consistent with the width direction of the electronic equipment ontology, and the array camera module is arranged at the corner or middle part of the electronic equipment ontology.
- Electronic equipment according to claim 28, wherein the length direction and the electronic equipment of the array camera module The length direction of ontology is consistent, and the array camera module is arranged at the corner or middle part of the electronic equipment ontology.
- One molding photosensory assembly characterized by comprisingAt least two photosensitive elements；One wiring board, wherein each photosensitive element is connected to the wiring board respectively switched only；AndOne molded base, wherein the molded base has at least two optical windows, and the fringe region of the molded base and the wiring board is joined integrally, so that each photosensitive element corresponds respectively to each optical window.
- Molding photosensory assembly according to claim 31, it further comprise at least one set of lead, wherein the both ends of each lead are respectively communicated with the wiring board connector of chip contacts and the wiring board in each photosensitive element, so that each photosensitive element and the wiring board are switched on.
- Molding photosensory assembly according to claim 32, wherein the wiring board has an at least accommodation space, each photosensitive element is housed inside the accommodation space respectively.
- Molding photosensory assembly according to claim 33, photosensitive element described in wherein at least one have small size photosensitive region, and the photosensitive element in addition has large scale photosensitive region.
- Molding photosensory assembly according to claim 34, wherein the photosensitive element with small size photosensitive region is housed inside the accommodation space, and the photosensitive element with large scale photosensitive region is housed inside the accommodation space or is mounted on the surface of the wiring board.
- Molding photosensory assembly according to claim 33, wherein the accommodation space is holding tank or through-hole.
- Molding photosensory assembly according to claim 31, wherein the molded base further comprises a substrate, wherein the substrate is overlappingly set to the wiring board, to make the wiring board keep smooth by the substrate.
- Molding photosensory assembly according to claim 31, wherein the wiring board has at least one first reinforcement space, a part of the molded base is formed in each of described wiring board first reinforcement space, so that the molded base and the wiring board are combined as a whole.
- The molding photosensory assembly according to claim 37, wherein the substrate has at least one second reinforcement space, each second reinforcement space corresponds respectively to the first reinforcement of each of described wiring board space, wherein a part of the molded base is formed simultaneously in each of each of the wiring board first reinforcement space and the substrate second reinforcement space, so that the molded base, the wiring board and the substrate are combined as a whole.
- The molding photosensory assembly according to claim 37, wherein the substrate includes a base main body and at least two conductive bodies, each conductive body integrally extends the base main body respectively, wherein the wiring board has at least two channels, wherein the base main body is overlappingly set to the base main body, so that each conductive body is respectively held in each of described wiring board channel, wherein each photosensitive element is contacted with each conductive body respectively.
- Molding photosensory assembly according to claim 40, wherein each conductive body protrudes from the surface of the wiring board respectively, wherein each photosensitive element is mounted on each conductive body respectively.
- According to the molding photosensory assembly any in claim 31 to 41, wherein the top surface of the molded base forms a groove.
- According to the molding photosensory assembly any in claim 31 to 41, wherein the top surface of the molded base, which forms at least one, stops protrusion, the top surface of the molded base is divided into an inner surface and an outer surface by the blocking protrusion.
- The manufacturing method of one molding photosensory assembly, which is characterized in that the manufacturing method includes the following steps:(a) at least a wiring board will be mounted on by an electronic component；(b) at least optical window for forming with a wiring board molded base joined integrally and being formed the molded base by moulding technology, wherein the molded base coats at least one described electronic component；And(c) each photosensitive element is connected to the wiring board with being respectively turned on, wherein each photosensitive element corresponds respectively to each optical window.
- Manufacturing method according to claim 44, wherein the step (c) is before the step (b), to first conductively connect each photosensitive element and the wiring board, then is formed joined integrally with the wiring board by moulding technology and had The molded base of optical window, wherein each photosensitive element corresponds respectively to each optical window after the molded base is formed.
- Manufacturing method according to claim 44, wherein further comprising step in the step (b):(b.1) wiring board with the electronic component is placed in a molding tool；(b.2) to a upper mold of the molding die and once, mold carries out die closing operation, so that the fringe region of the wiring board and middle part correspond respectively to the molding space being formed between the upper mold and the lower mold；And(b.3) moulding material of flow-like is added in Xiang Suoshu molding space, to form each of the molded base and the molded base optical window after moulding material consolidation.
- Manufacturing method according to claim 46, wherein before the step (b.2), in the stitching surface of the upper mold, one cover film is overlappingly set, with in the step (b.2), the cover film is located between the stitching surface and the wiring board of the upper mold.
- The circuit board module of an array camera module characterized by comprisingOne wiring board portion is used to be electrically connected at least two photosensitive elements of the array camera module wherein the wiring board portion includes a wiring board；WithOne disjunctor encapsulation part, wherein the disjunctor encapsulation part integral packaging is in the wiring board in the wiring board portion.
- The circuit board module according to claim 48, wherein the disjunctor encapsulation part forms at least two optical windows, each optical window is opposite with each photosensitive element, to provide the photosensitive element passage of light.
- Circuit board module according to claim 49, wherein disjunctor encapsulation part top is in planar, with supporter, optical lens, driver or the filter element for installing the array camera module.
- Circuit board module according to claim 49, wherein disjunctor encapsulation part top has an at least mounting groove, each mounting groove is connected to the corresponding optical window, to be respectively used to install supporter, filter element, optical lens or the driver of the array camera module.
- Circuit board module according to claim 49, wherein the disjunctor encapsulation part includes at least one cladding section, a filter element construction section and an optical lens construction section, the filter element construction section and the optical lens construction section successively mold extension by the cladding section upwards, and it is internal in step-like, in order to install the filter element and optical lens of the array camera module.
- Circuit board module according to claim 52, wherein the filter element construction section has at least two mounting grooves, each mounting groove is connected to the corresponding optical window, form the first step-like rank, in order to install the filter element, the optical lens construction section has at least two optical lens mounting grooves, and each optical lens mounting groove is connected to the corresponding optical window, the step-like second-order is formed, in order to install the optical lens of the array camera module.
- Circuit board module according to claim 53, wherein the optical lens construction section has an at least optical lens inner wall, each optical lens inner wall surface is smooth, is suitable for installing the non-threaded optical lens.
- According to any circuit board module of claim 48 to 54, wherein the wiring board portion includes an at least electronic component, the electronic component protrudes from the wiring board, and the disjunctor encapsulation part coats the electronic component, so that the electronic component will not be directly exposed to outside.
- Circuit board module according to claim 55, wherein the Electronic Components combine: the one or more of them in resistance, capacitor, diode, triode, potentiometer, relay and processor.
- Circuit board module according to claim 55, wherein the wiring board portion includes a reinforcing layer, the reinforcing layer laminate is set to the wiring board bottom, to enhance the structural strength of the wiring board.
- Circuit board module according to claim 57, wherein the reinforcing layer is metal plate, to enhance the heat dissipation performance in the wiring board portion.
- Circuit board module according to claim 55, wherein the wiring board portion includes a shielded layer, the shielded layer wraps up the wiring board and the disjunctor encapsulation part, to enhance the electromagnetism interference performance of the circuit board module.
- Circuit board module according to claim 59, wherein the shielded layer is metal plate or metal mesh.
- Circuit board module according to claim 55, wherein wiring board has an at least reinforced hole, and the disjunctor encapsulation part extends into the reinforced hole, in order to enhance the structural strength of the wiring board.
- Circuit board module according to claim 61, wherein the reinforced hole is groove-like.
- Circuit board module according to claim 61, wherein the reinforced hole is perforation, so that the moulding material of the disjunctor encapsulation part comes into full contact with the wiring board, and easily fabricated.
- Circuit board module according to claim 55, wherein wiring board has at least two accesses, is installed on the wiring board from the wiring board back side direction suitable for each photosensitive element.
- Circuit board module according to claim 64, wherein the access is in step-like, in order to provide stable installation site for the photosensitive element.
- Circuit board module according to claim 55, wherein the material of the wiring board can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
- Circuit board module according to claim 55, wherein the material of the disjunctor encapsulation part is selected from combination: one of epoxy resin, nylon, LCP or PP or a variety of.
- Circuit board module according to claim 55, wherein the circuit board module includes at least two motor connection structures, the motor connection structure includes an at least connecting line, the connecting line is set to the disjunctor encapsulation part, and it is electrically connected to the wiring board, the connecting line has a motor connecting pin, the disjunctor encapsulation part is revealed in, in order to connect a motor pin.
- The circuit board module according to claim 55, wherein the circuit board module includes at least two motor connection structures, each motor connection structure is including an at least connecting line and has an at least pin slot, the connecting line is arranged at the disjunctor encapsulation part, and it is electrically connected to the wiring board, the pin slot is arranged at disjunctor encapsulation part upper end, the connecting line has a motor connecting pin, the motor connecting pin is revealed in the groove bottom wall, and the motor connecting pin is electrically connected to when being plugged in the pin slot in order to a motor pin.
- Circuit board module according to claim 55, wherein the circuit board module includes at least two motor connection structures, each motor connection structure has at least a pin slot and at least a circuit junction, the circuit junction is electrically connected to the wiring board, the pin slot is arranged at the disjunctor encapsulation part, the top of the disjunctor encapsulation part is extended to by the wiring board, and the circuit junction is revealed in the pin slot, is electrically connected to the circuit junction when being plugged in the pin slot in order to a motor pin.
- Circuit board module according to claim 55, wherein the circuit board module includes at least two motor connection structures, each motor connection structure includes at least one engraving route, the engraving route is set to the disjunctor encapsulation part, it is electrically connected to the wiring board, in order to be electrically connected a motor pin.
- Circuit board module according to claim 71, wherein the engraved lines road is set to the disjunctor encapsulation part in a manner of laser formation.
- The manufacturing method of the circuit board module of an array camera module, which is characterized in that comprising steps of the one disjunctor encapsulation part of unitary packed on a wiring board.
- The manufacturing method of the circuit board module according to claim 73, including step: forming at least two optical windows to the disjunctor encapsulation part.
- The manufacturing method of the circuit board module according to claim 73, including step: protruding from the electronic component of the wiring board by disjunctor encapsulation part cladding.
- The manufacturing method of circuit board module according to claim 74, including step: at least two mounting grooves are formed on disjunctor encapsulation part top, in order to install supporter, filter element, driver or optical lens.
- The manufacturing method of circuit board module according to claim 74, including step: upwardly extending the disjunctor encapsulation part, and to form two stage stepped structures inside each institute's optical window, in order to install filter element or optical lens.
- The manufacturing method of circuit board module according to claim 74, including step: helicitic texture is arranged in the inner wall of the optical window of the disjunctor encapsulation part, in order to install threaded optical lens.
- According to the manufacturing method of any circuit board module of claim 73 to 78, including step: an at least groove-like reinforced hole being arranged on the wiring board, and the disjunctor encapsulation part is made to extend into the reinforced hole.
- According to the manufacturing method of any circuit board module of claim 73 to 78, including step: an at least perforated reinforced hole being arranged on the wiring board, and the disjunctor encapsulation part is made to extend into the reinforced hole.
- According to the manufacturing method of any circuit board module of claim 73 to 78, including step: a reinforcing layer is attached in the wiring board bottom, to enhance the structural strength of the wiring board.
- According to the manufacturing method of any circuit board module of claim 73 to 78, including step: a shielded layer is coated in the wiring board and the disjunctor encapsulation part, to enhance the electromagnetism interference performance of the circuit board module.
- According to the manufacturing method of any circuit board module of claim 73 to 78, including step: burying multiple connecting lines to the disjunctor encapsulation part, and the connecting line is made to be electrically connected the wiring board, in order to be separately connected a driver.
- According to the manufacturing method of any circuit board module of claim 83, including step: multiple pin slots are arranged to disjunctor encapsulation part upper end, and the motor connecting pin of the connecting line is made to be revealed in the pin slot.
- According to the manufacturing method of any circuit board module of claim 73 to 78, including step: multiple circuit junctions are arranged to the wiring board, and corresponding pin slot is set to the disjunctor encapsulation part, so that the circuit junction is revealed in the pin slot, the circuit junction is electrically connected to when being inserted into the pin slot in order to motor pin.
- According to the manufacturing method of any circuit board module of claim 73 to 78, including step: the multiple engraving routes of setting are to the disjunctor encapsulation part, and the engraving route is electrically connected to the wiring board, in order to be electrically connected a driver.
- The manufacturing method of the circuit board module according to claim 86, wherein the engraved lines road is set to the disjunctor encapsulation part in a manner of laser formation.
- According to the manufacturing method of any circuit board module of claim 73 to 78, wherein the disjunctor encapsulation part is integrally formed at the wiring board by injection molding or mould pressing process.
- An array camera module characterized by comprisingOne according to any circuit board module of claim 48 to 72；At least two optical lens；WithAt least two photosensitive elements；Each optical lens is located at the photosensitive path of the corresponding photosensitive element, and each photosensitive element is electrically connected to the circuit board module.
- The array camera module according to claim 89, wherein the array camera module includes an at least supporter, the supporter is installed in the circuit board module, and the array camera module includes at least two filter elements, and each filter element is installed in the supporter.
- The array camera module according to claim 89, wherein the array camera module includes at least two drivers, each optical lens is installed in the corresponding driver, and each driver is installed on the circuit board module.
- The array camera module according to claim 89, wherein the array camera module includes at least two filter elements, each filter element is installed in the circuit board module.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2016100914897 | 2016-02-18 | ||
| CN201610091489.7A CN105611134B (en) | 2016-02-18 | 2016-02-18 | Camera module and its molding circuit board module and manufacturing method based on moulding technology |
| CN201610148338.0A CN105744131B (en) | 2016-03-15 | 2016-03-15 | Array camera module and its circuit board module and manufacturing method |
| CN2016101483380 | 2016-03-15 | ||
| CN201610214411X | 2016-04-07 | ||
| CN201610214411.XA CN105763780A (en) | 2016-04-07 | 2016-04-07 | Photosensitive device with reinforcing circuit board, array camera module and manufacturing method thereof |
| PCT/CN2016/103250 WO2017140118A1 (en) | 2016-02-18 | 2016-10-25 | Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108702431A true CN108702431A (en) | 2018-10-23 |
Family
ID=63840557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680082094.9A Pending CN108702431A (en) | 2016-02-18 | 2016-10-25 | Array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108702431A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111988498A (en) * | 2019-05-24 | 2020-11-24 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN112444936A (en) * | 2019-08-16 | 2021-03-05 | 宁波舜宇光电信息有限公司 | Under-screen camera shooting assembly, camera shooting module, optical lens and manufacturing method of optical lens |
| CN114553985A (en) * | 2020-11-25 | 2022-05-27 | 华为技术有限公司 | Camera module and electronic device using same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465109A (en) * | 2001-06-28 | 2003-12-31 | 松下电器产业株式会社 | Cell and cell pack |
| CN102334184A (en) * | 2009-07-10 | 2012-01-25 | 爱信艾达株式会社 | Electronic circuit device |
| JP2013174784A (en) * | 2012-02-27 | 2013-09-05 | Ricoh Co Ltd | Camera module, assembling method of the same, manufacturing method of lens array and mold |
| CN105187697A (en) * | 2015-08-04 | 2015-12-23 | 宁波舜宇光电信息有限公司 | Multi-lens camera module one-piece bracket, multi-lens camera module and application of multi-lens camera module |
| CN204906517U (en) * | 2015-08-17 | 2015-12-23 | 南昌欧菲光电技术有限公司 | Module of making a video recording and circuit board thereof |
| CN204993579U (en) * | 2015-08-04 | 2016-01-20 | 宁波舜宇光电信息有限公司 | Many camera lenses module disjunctor support and many camera lenses module of making a video recording of making a video recording |
-
2016
- 2016-10-25 CN CN201680082094.9A patent/CN108702431A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465109A (en) * | 2001-06-28 | 2003-12-31 | 松下电器产业株式会社 | Cell and cell pack |
| CN102334184A (en) * | 2009-07-10 | 2012-01-25 | 爱信艾达株式会社 | Electronic circuit device |
| JP2013174784A (en) * | 2012-02-27 | 2013-09-05 | Ricoh Co Ltd | Camera module, assembling method of the same, manufacturing method of lens array and mold |
| CN105187697A (en) * | 2015-08-04 | 2015-12-23 | 宁波舜宇光电信息有限公司 | Multi-lens camera module one-piece bracket, multi-lens camera module and application of multi-lens camera module |
| CN204993579U (en) * | 2015-08-04 | 2016-01-20 | 宁波舜宇光电信息有限公司 | Many camera lenses module disjunctor support and many camera lenses module of making a video recording of making a video recording |
| CN204906517U (en) * | 2015-08-17 | 2015-12-23 | 南昌欧菲光电技术有限公司 | Module of making a video recording and circuit board thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111988498A (en) * | 2019-05-24 | 2020-11-24 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN112444936A (en) * | 2019-08-16 | 2021-03-05 | 宁波舜宇光电信息有限公司 | Under-screen camera shooting assembly, camera shooting module, optical lens and manufacturing method of optical lens |
| CN112444936B (en) * | 2019-08-16 | 2024-04-16 | 宁波舜宇光电信息有限公司 | Under-screen camera shooting assembly, camera shooting module, optical lens and manufacturing method of under-screen camera shooting assembly |
| CN114553985A (en) * | 2020-11-25 | 2022-05-27 | 华为技术有限公司 | Camera module and electronic device using same |
| CN114553985B (en) * | 2020-11-25 | 2023-09-12 | 华为技术有限公司 | Camera module and electronic device using same |
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Application publication date: 20181023 |