CN114553985A - Camera module and electronic device using same - Google Patents
Camera module and electronic device using same Download PDFInfo
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- CN114553985A CN114553985A CN202011340610.8A CN202011340610A CN114553985A CN 114553985 A CN114553985 A CN 114553985A CN 202011340610 A CN202011340610 A CN 202011340610A CN 114553985 A CN114553985 A CN 114553985A
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- image sensor
- driver
- camera module
- carrier
- circuit board
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The application provides a module of making a video recording, include from last camera lens subassembly, image sensor, the driver of extremely stacking gradually the setting down. The driver bears the image sensor and is movable relative to the lens assembly so as to drive the image sensor to move. A soft adhesive layer is arranged on the surface of the lens assembly facing the image sensor; a soft rubber film is arranged in the driver; the soft rubber layer and the soft rubber film are used for buffering collision caused by movement of the driver and the image sensor. The application also provides the electronic device applying the camera module. When the driver collides with the lens component under external disturbance, the soft rubber layer can buffer/reduce collision impact force and avoid structural or functional failure; when the drivers collide with each other inside the drivers under external disturbance, the soft rubber film can buffer/reduce impact force, and structural or functional failure is avoided.
Description
Technical Field
The application relates to a camera module and an electronic device using the same.
Background
The automatic focusing or optical anti-shake function of a camera module of an electronic device (such as a mobile phone) is mainly realized by moving a lens; currently, some camera modules start to use a method for moving an image sensor to realize auto-focusing and optical anti-shake functions. Specifically, the image sensor is arranged on an image sensor driver, and the image sensor is driven to move through the movement of the image sensor driver. The image sensor driver may be moved in space magnetically or otherwise; compare in the drive camera lens of traditional module and remove, image sensor's weight is far lighter than the camera lens, drives image sensor and removes and does not need great thrust, can compensate the pain point that most present camera lens drivers can't drive big camera lens. But simultaneously, image sensor is as accurate device, and image sensor takes place to damage extremely easily under the influence of external force, and current module size trend is the miniaturization, and it is difficult to vacate enough space near the image sensor and arranges buffer.
Disclosure of Invention
A first aspect of the embodiments of the present application provides a camera module, which includes a lens assembly, an image sensor, and a driver, which are sequentially stacked from top to bottom, where the driver bears the image sensor and is movable relative to the lens assembly, so as to drive the image sensor to move; a soft adhesive layer is arranged on the surface of the lens component facing the image sensor; a soft rubber film is arranged in the driver; the soft rubber layer and the soft rubber film are used for buffering collision caused by movement of the driver and the image sensor.
In the automatic focusing and optical anti-shake processes, the driver drives the image sensor to move, and if the driver and the image sensor collide with the lens component under external disturbance, the soft rubber layer can buffer/reduce collision impact force, so that collision buffer is brought to the driver and the image sensor, and structural or functional failure is avoided; when the driver collides with each other inside under external disturbance, the soft rubber film can buffer/reduce impact force, thereby bringing collision buffer to the driver and avoiding structural or functional failure.
In the embodiment of the application, the soft glue layer is at least positioned at two opposite sides of the image sensor.
The soft adhesive layer can be arranged on the surface, facing the image sensor, of the carrier of the lens assembly, the soft adhesive layer does not cover the lens so as to avoid influencing the image pickup effect, and the soft adhesive layer can be formed on the surface of the carrier of the lens assembly through secondary injection molding; the soft adhesive layer can be made of silica gel, but is not limited to silica gel. When the driver collides to the lens component under external disturbance, the soft adhesive layer can effectively buffer/reduce collision impact force, so that collision buffering is brought to the driver and the image sensor, and structural or functional failure is avoided.
In the embodiment of the application, the camera module further comprises a lower cover, the lower cover comprises a bottom and a side part connected with the periphery of the bottom, the bottom and the side part are matched to form an accommodating cavity, the driver and the image sensor are located in the accommodating cavity, and the driver is located between the bottom and the image sensor; the lens assembly is arranged on the lower cover and is positioned on one side of the lower cover, which is provided with the side part.
The lower cover is used for accommodating and protecting the driver and the image sensor; the driver can move in at least X direction and Y direction in the containing cavity of the lower cover.
In the embodiment of the application, an outer circuit board is further arranged between the lens assembly and the lower cover; the outer circuit board surrounds the image sensor so as not to affect the transmission of optical signals into the image sensor.
The outer circuit board is used for being connected with a control circuit and the like outside the camera module to receive electric signals and transmit the electric signals to the image sensor and the driver.
In the embodiment of the present application, the image sensor is electrically connected to the outer circuit board through a wire.
External optical signals are transmitted to the image sensor after sequentially passing through the lens and the infrared filter, the image sensor can be powered on and work all the time when the driver achieves the optical anti-shake function, the lead can be a long gold wire, and the long gold wire can shake or deform due to the actuation of the driver, but can be kept in good electric connection all the time.
In the embodiment of the application, still be provided with the sheetmetal in the lower cover, the driver with the outside circuit board passes through sheetmetal electric connection, sheetmetal one end with outside circuit board electric connection, other end electric connection the driver.
The outer circuit board receives an electric signal from the outside of the camera module, and the electric signal is transmitted to the driver through a metal sheet connected with the outer circuit board.
In an embodiment of the application, an additional soft glue layer is arranged on a surface of the side portion facing the driver.
The soft adhesive layer on the side portion can further effectively buffer the collision between the driver and the image sensor and the side portion of the lower cover.
In the embodiment of the application, the driver comprises an optical anti-shake coil, a focusing carrier and an inner side circuit board which are sequentially stacked on the bottom; the inner circuit board is electrically connected with the outer circuit board through a lead; the image sensor is electrically connected with the inner side circuit board through a lead; the driver also comprises a focusing coil, an optical anti-shake carrier and a magnet, wherein the focusing coil is wound outside the focusing carrier and positioned between the inner side circuit board and the optical anti-shake coil; the optical anti-shake carrier is arranged on the optical anti-shake coil and is positioned between the focusing carrier and the side part; the magnet is loaded on the optical anti-shake carrier; the optical anti-shake carrier and the focusing carrier are both made of electrically insulating materials.
The driver can move in X, Y and Z directions in the accommodating cavity of the lower cover, and the X, Y, Z directions are perpendicular to each other, so that the image sensor is driven to move in X, Y and Z directions in the accommodating cavity, and the functions of automatic focusing and optical anti-shake are achieved.
In the embodiment of the application, the soft rubber film is arranged on the surfaces of the optical anti-shake carrier and the focusing carrier, and the magnets face the focusing carrier.
The soft rubber film can effectively buffer the collision inside the driver.
In the embodiment of the application, the surface of the bottom facing the driver is provided with another soft rubber layer, and the optical anti-shake coil is provided with a through hole for the other soft rubber layer on the bottom to pass through; the other soft rubber layer is positioned between the bottom and the focusing carrier.
The soft rubber film can effectively buffer the collision between the bottom of the lower cover and the focusing carrier.
In the embodiment of the application, a circuit is arranged on the surface of the bottom facing the driver, the optical anti-shake coil is electrically connected with the circuit, a metal sheet is further arranged in the lower cover, the circuit is electrically connected with the outer side circuit board through the metal sheet, one end of the metal sheet is electrically connected with the outer side circuit board, and the other end of the metal sheet is electrically connected with the circuit; the driver further comprises a plurality of suspension wires, each suspension wire is a metal thin rod and is vertically arranged on the bottom, one end of each suspension wire is electrically connected with the circuit, and the other end of each suspension wire is electrically connected with an elastic sheet which is electrically connected with the focusing coil.
When the camera module is focused, the outer circuit board receives an electric signal from the outside of the camera module, the electric signal is transmitted to the circuit of the lower cover through the outer circuit board and the metal sheet in sequence, then is transmitted to the suspension wire through the circuit of the lower cover, then is transmitted to the elastic sheet through the suspension wire, and then is transmitted to the focusing coil through the elastic sheet; after the focusing coil is electrified, Z-direction electromagnetic force is generated under the action of the magnetic field of the magnet, so that the focusing coil drives the focusing carrier, the inner side circuit board and the image sensor to realize the focusing function of Z-direction actuation.
When the camera module is in optical anti-shake, the outer circuit board receives an electric signal from the outside of the camera module, and the electric signal is transmitted to a circuit of the lower cover through the outer circuit board and the metal sheet and then transmitted to the optical anti-shake coil through the circuit of the lower cover; after the optical anti-shake coil is electrified, electromagnetic force in X and Y directions is generated under the action of a magnetic field of the magnet, so that the magnet drives the optical anti-shake carrier, the elastic sheet, the focusing carrier, the focusing coil, the inner side circuit board and the image sensor to realize the optical anti-shake function of X and Y direction movement.
In an embodiment of the present application, the driver is a mems actuator, a gap is formed in the mems actuator, and the soft glue film is formed in the gap.
The soft rubber film can effectively buffer the collision inside the driver.
In the embodiment of the application, the lens subassembly orientation image sensor's one side still is provided with infrared filter, image sensor is located infrared filter with between the driver.
And an external light signal is transmitted to the image sensor after passing through the lens and the infrared filter in sequence, and the infrared filter can be used for filtering out unwanted infrared light.
A second aspect of the embodiments of the present application provides an electronic apparatus, including the above-mentioned camera module.
The electronic device with the camera module has the advantages that the driver arranged by the camera module moves for driving the image sensor, so that the size of the camera module can be effectively reduced, the electronic device has good focusing and optical anti-shake functions, and the use performance of the electronic device can be effectively improved.
Drawings
Fig. 1 is a schematic perspective view of a camera module according to an embodiment of the present application.
Fig. 2 is an exploded view of the camera module of the first embodiment.
Fig. 3 is a schematic cross-sectional view of the camera module according to the first embodiment.
Fig. 4 is a schematic cross-sectional view of another position of the camera module according to the first embodiment.
Fig. 5 is a schematic cross-sectional view of the camera module according to the second embodiment.
Fig. 6 is a schematic cross-sectional view of another position of the camera module according to the second embodiment.
Fig. 7 is a partially exploded schematic view of a camera module according to a second embodiment of the present application.
Fig. 8 is a schematic partial explosion diagram of a camera module according to a second embodiment of the present application.
Fig. 9A and 9B are schematic cross-sectional views for improving the soft adhesive strength.
Description of the main elements
Accommodating cavity 65
Optical anti-shake coil 51
Focusing carrier 52
Inner side circuit board 53
Focusing coil 54
Optical anti-shake carrier 56
Through-hole 510
Detailed Description
The embodiments of the present application will be described below with reference to the drawings.
Example one
Referring to fig. 1 and 3 together, a camera module 100 according to a first embodiment of the present disclosure includes a lens assembly 10, an image sensor 30, and a driver 50 stacked in sequence from top to bottom. Referring to fig. 3, an infrared filter 20 is further disposed on a side of the lens assembly 10 facing the image sensor 30, and the lens assembly 10 is connected to a periphery of the infrared filter 20. The image sensor 30 is located between the infrared filter 20 and the driver 50; the infrared filter 20 is spaced opposite to the image sensor 30. The driver 50 carries the image sensor 30 and is movable, thereby moving the image sensor 30. The camera module 100 moves the image sensor 30 to realize an optical anti-shake function. However, during the implementation of the optical anti-shake function, the image sensor 30 or the driver 50 is likely to collide due to movement, and thus to be deformed and failed.
The camera module 100 of the present application can effectively prevent the image sensor 30 or the driver 50 from being deformed and disabled due to collision in the implementation process of the optical anti-shake function, as shown in fig. 3, a surface of the lens assembly 10 facing the image sensor 30 is provided with a soft adhesive layer 40; the driver 50 is internally provided with a soft rubber film 42.
In the present application, the lens assembly 10 is considered as a whole, and may actually include a lens (not shown), a carrier (not shown) for loading and connecting the lens, a carrier (not shown) for connecting the infrared filter 20, and the like.
As shown in fig. 1, the camera module 100 further includes a lower cover 60, the lens assembly 10 is covered on the lower cover 60, and an outer circuit board 70 is further disposed between the lens assembly 10 and the lower cover 60. As shown in fig. 2 and 3, the lower cover 60 includes a bottom portion 61 and a side portion 63 connecting the periphery of the bottom portion 61, and the bottom portion 61 and the side portion 63 cooperate to form a receiving cavity 65. The driver 50 and the image sensor 30 are located in the accommodating cavity 65 and are sequentially stacked on the bottom portion 61. The lower cover 60 is used to house and protect the driver 50 and the image sensor 30. In this embodiment, the side portion 63 is vertically connected to the bottom portion 61; the bottom portion 61 is rectangular plate-shaped, the number of the side portions 63 is four, and the four side portions 63 are sequentially connected to form a rectangular frame. The driver 50 is movable in the accommodation chamber 65 of the lower cover 60 in at least an X direction and a Y direction, which are perpendicular to each other. The lower cover 60 may be made of plastic. The outer circuit board 70 is located between the side portion 63 and the lens assembly 10. In this embodiment, the outer circuit board 70 is a rectangular frame surrounding the image sensor 30, so that the image sensor 30 is not shielded, and the optical signal is not influenced to be transmitted into the image sensor 30. The outer circuit board 70 is used to connect with a control circuit and the like outside the camera module 100, so as to receive an electrical signal and transmit the electrical signal to the image sensor 30 and the driver 50.
In this embodiment, the lens assembly 10 is connected to the periphery of the infrared filter 20, and the lens assembly 10 and the infrared filter 20 are bonded together by an adhesive (not shown). The outer circuit board 70 is bonded to the lens assembly 10 by an adhesive (not shown) on one side, and is bonded to the side portion 63 of the lower cover 60 by an adhesive (not shown) on the other side. The image sensor 30 is bonded to the driver 50 by an adhesive (not shown). The surface of the actuator 50 adjacent to the lower cover 60 is bonded to the bottom 61 of the lower cover 60 by an adhesive (not shown).
The image sensor 30 is electrically connected to the outer circuit board 70 through a conducting wire (e.g., a long gold wire 81 shown in fig. 2), that is, one end of the long gold wire 81 is connected to the outer circuit board 70, and the other end is connected to the image sensor 30; the long gold wire 81 may connect the outer circuit board 70 and the image sensor 30 by soldering.
As shown in fig. 2, a plurality of metal sheets 80 are further disposed in the receiving cavity 65 of the lower cover 60. The driver 50 is electrically connected to the outer circuit board 70 through a metal plate 80. In this embodiment, the number of the metal sheets 80 is four, and the metal sheets 80 are respectively disposed at four corners of the lower cover 60, and each metal sheet 80 is L-shaped and connects the bottom portion 61 and one side portion 63 of the lower cover 60. One end of the metal sheet 80 is electrically connected to the outer circuit board 70, and the other end is electrically connected to the driver 50; the connection mode can be welding connection.
The driver 50 is a Micro-Electro-Mechanical System (MEMS) actuator. A MEMS actuator is a MEMS device that converts an electrical signal into a micro-action or micro-manipulation. Typical MEMS actuators include micro-motors (not shown), micro-switches (not shown), micro-clamps (not shown), and the like. The operating principle of the driver 50 is as follows: the outer circuit board 70 receives an electrical signal from outside the camera module 100, and the electrical signal is transmitted to the metal sheet 80 through the outer circuit board 70 and then transmitted to the MEMS actuator from the metal sheet 80; the MEMS actuator controls the center of the MEMS actuator to displace in the X direction and/or the Y direction under the electrified condition through an electrostatic driving principle, so that the image sensor 30 arranged on the MEMS actuator is driven to displace, and optical anti-shake is realized.
The working principle of the image sensor 30 is as follows: the outer circuit board 70 receives an electrical signal from outside the camera module 100, and the electrical signal is transmitted to the image sensor 30 through the long gold wire 81 connected to the outer circuit board 70; similarly, the electrical signal of the image sensor 30 is transmitted to the outside of the outer circuit board 70 and the camera module 100.
In this embodiment, an external optical signal sequentially passes through the lens and the infrared filter 20 and then is transmitted to the image sensor 30, and the image sensor 30 can be powered on to work all the time when the driver 50 implements the optical anti-shake function; the long gold wire 81 is shaken or deformed by the operation of the driver 50, but a good electrical connection is always maintained.
As shown in fig. 2 and fig. 3, the soft adhesive layer 40 is disposed on a surface of the carrier of the lens assembly 10 facing the image sensor 30 (the soft adhesive layer 40 does not cover the lens to avoid affecting the image capturing effect), and the soft adhesive layer 40 is at least located on two opposite sides of the image sensor 30. In this embodiment, the number of the soft adhesive layers 40 is two, and each soft adhesive layer 40 is a long strip. The soft adhesive layer 40 may be formed on the carrier surface of the lens assembly 10 by two-shot molding. That is, the carrier is preformed or prepared, and then the carrier is placed in a mold, and the soft adhesive layer 40 is formed on the surface of the carrier by injection molding. The material of the carrier can be metal, plastic or metal-plastic integration. The soft adhesive layer 40 and the soft adhesive film 42 may be made of silica gel, but are not limited to silica gel. When the driver 50 collides with the lens assembly 10 under external disturbance, the soft rubber layer 40 can buffer/reduce the collision impact force, so as to provide collision buffer for the driver 50 and the image sensor 30, and avoid structural or functional failure.
As shown in fig. 3 and 4, a gap 501 is formed in the actuator 50(MEMS actuator), and the soft adhesive film 42 is formed in the gap 501. The soft film 42 inside the MEMS actuator may be formed by drop molding or spray coating. The plastic dropping is to perform ink-jet printing on a liquid or molten material forming the soft plastic film 42 to a target component (MEMS actuator) and then perform curing under certain conditions, so as to achieve the effect of covering the soft plastic film 42 on the surface of the target component. In the spraying, a liquid or molten material forming the soft rubber film 42 is sprayed onto a target component (MEMS actuator) through a spray gun and then cured under a certain condition, so that the effect of covering the soft rubber film 42 on the surface of the target component is achieved. When the MEMS actuators collide with each other inside the MEMS actuators under external disturbance, the soft rubber film 42 may buffer/reduce the impact force, thereby providing collision buffering for the driver 50 and avoiding structural or functional failure.
Example two
Referring to fig. 1 and fig. 5, a camera module 200 according to a second embodiment of the present application is substantially the same as the camera module 100 according to the first embodiment, and includes a lens assembly 10, an image sensor 30, and a driver 50, which are stacked in sequence from top to bottom, wherein an infrared filter 20 is disposed on a side of the lens assembly 10 facing the image sensor 30, and the lens assembly 10 is connected to a periphery of the infrared filter 20; the image sensor 30 is located between the infrared filter 20 and the driver 50; the infrared filter 20 is spaced opposite to the image sensor 30. For clarity of illustration, the lens assembly 10 and the infrared filter 20 are not shown in fig. 7 and 8.
Like the camera module 100 of the first embodiment, the camera module 200 of the second embodiment also includes a lower cover 60, the lens assembly 10 is disposed on the lower cover 60, and an outer circuit board 70 is disposed between the lens assembly 10 and the lower cover 60. The outer circuit board 70 has a frame shape surrounding the image sensor 30 so as not to shield the image sensor 30. The lower cover 60 comprises a bottom part 61 and a side part 63 connected with the periphery of the bottom part 61, and the bottom part 61 and the side part 63 are matched to form a containing cavity 65. The driver 50 and the image sensor 30 are positioned in the accommodating cavity 65 and are sequentially stacked on the bottom 61; the lens assembly 10 is disposed on a side of the lower cover 60 having the side portion 63. In this embodiment, the side portion 63 is vertically connected to the bottom portion 61; the bottom portion 61 is rectangular plate-shaped, the number of the side portions 63 is four, and the four side portions 63 are sequentially connected to form a rectangular frame. The outer circuit board 70 is shaped like a rectangular frame and is located between the side portion 63 and the lens assembly 10. The lower cover 60 may be made of insulating plastic.
Substantially the same as the camera module 100 of the first embodiment, the surface of the lens assembly 10 of the camera module 200 facing the image sensor 30 is provided with a soft adhesive layer 40 a; the soft adhesive layers 40a are at least located on two opposite sides of the image sensor 30, the number of the soft adhesive layers 40a is two, and each soft adhesive layer 40a is in a long strip shape. The soft adhesive layer 40a may be formed by the above-mentioned two-shot molding.
Unlike the camera module 100 of the first embodiment, as shown in fig. 5 and 6, in the camera module 200, a soft adhesive layer 40b is further disposed on a surface of each side portion 63 of the lower cover 60 facing the driver 50, and each soft adhesive layer 40b is substantially in a long strip shape. The soft adhesive layer 40b may further buffer the impact of the driver 50 and the image sensor 30 against the side 63 of the lower cover 60.
Unlike the camera module 100 of the first embodiment, the driver 50 of the camera module 200 is not a MEMS actuator, and the driver 50 can move in X, Y and Z directions in the receiving cavity 65 of the lower cover 60, wherein the directions X, Y, Z are perpendicular to each other.
As shown in fig. 5 and 6, the actuator 50 includes an optical anti-shake coil 51, a focus carrier 52, an inner circuit board 53, a focus coil 54, a plurality of spring pieces 55, an optical anti-shake carrier 56, a magnet 57, and a plurality of suspension wires 58. The surface of the bottom 61 of the lower cover 60 facing the driver 50 is provided with an electric circuit (not shown). The optical anti-shake coil 51, the focus carrier 52, and the inner circuit board 53 are sequentially stacked on the bottom portion 61. The optical anti-shake coil 51 is electrically connected (e.g., soldered) to the circuit on the bottom portion 61. A focusing coil 54 is wound outside the focusing carrier 52 and located between the inner circuit board 53 and the optical anti-shake coil 51. An optical anti-shake carrier 56 is disposed on the optical anti-shake coil 51 and surrounds the focus carrier 52, the optical anti-shake carrier 56 is located between the focus carrier 52 and the side portion 63 and spaced from both the focus carrier 52 and the side portion 63. In this embodiment, the optical anti-shake carrier 56 carries a plurality of magnets 57. The optical anti-shake carrier 56 and the focusing carrier 52 are both made of electrically insulating material, such as plastic. In the camera module 200 of the present embodiment, as shown in fig. 7 and 8, the optical anti-shake carrier 56 is substantially rectangular frame-shaped, and four grooves 560 are formed thereon, each groove 560 is used to provide one magnet 57, the four magnets 57 are respectively located on the front, rear, left, right, and four sides of the focusing carrier 52, and each magnet 57 is in a long column shape.
One end of each elastic sheet 55 is connected with the focusing carrier 52, and the other end is connected with the optical anti-shake carrier 56; the focusing carrier 52 and the optical anti-shake carrier 56 are connected into a whole through the plurality of elastic sheets 55. Part of the spring 55 is also electrically connected to the focusing coil 54 (e.g., by soldering). Each elastic sheet 55 and the focusing carrier 52 may be connected by riveting, and the elastic sheet 55 and the optical anti-shake carrier 56 may be connected by riveting. In this embodiment, the camera module 200 has eight elastic pieces 55, which are respectively connected to four corners of the upper side of the focusing carrier 52 far away from the bottom 61 and four corners of the lower side of the focusing carrier 52 near the bottom 61; the four spring pieces 55 connected to the four corners of the upper side of the focusing carrier 52 away from the bottom 61 are all electrically connected to the focusing coil 54. In this embodiment, each spring 55 is curved and extends.
Each suspension wire 58 is a thin metal rod vertically disposed on the bottom portion 61, and one end of each suspension wire 58 is electrically connected (e.g., soldered) to the circuit of the bottom portion 61, and the other end is electrically connected to a spring 55 electrically connected to the focusing coil 54. As shown in fig. 7, the elastic sheet 55 located on the upper side of the focusing carrier 52 is provided with an extension end 550, and the extension end 550 is connected with the suspension wire 58 by welding. In this embodiment, the camera module 200 is provided with four suspension wires 58, which are respectively located at four corners of the lower cover 60. Each suspension wire 58 is electrically connected to the spring plate 55 located on the upper side of the focus carrier 52 away from the bottom 61.
The surface of the bottom 61 facing the driver 50 is provided with a soft glue layer 40 c. As shown in fig. 7 and 8, the optical anti-shake coil 51 is provided with a through hole 510 for the soft adhesive layer 40c on the bottom portion 61 to pass through. The soft adhesive layer 40c is located between the bottom portion 61 and the focus carrier 52. The soft adhesive layer 40c may buffer the collision between the bottom 61 of the lower cover 60 and the focus carrier 52. In this embodiment, the number of the soft adhesive layers 40c is four, the soft adhesive layers are arranged at the bottom 61 at intervals, and each soft adhesive layer 40c is circular. As shown in fig. 5, the surfaces of the optical anti-shake carrier 56 and the magnet 57 facing the focusing carrier 52 are provided with a soft film 42, and the manner of providing the soft film 42 may be the above-mentioned dripping/spraying manner. The soft gel film 42 may cushion the interference impact inside the actuator 50.
In this embodiment, the lens assembly 10 is connected to the periphery of the infrared filter 20, and the lens assembly 10 and the infrared filter 20 are bonded together by an adhesive (not shown). The outer circuit board 70 is bonded to the lens assembly 10 by an adhesive (not shown) on one side, and is bonded to the side portion 63 of the lower cover 60 by an adhesive (not shown) on the other side. The image sensor 30 is bonded to the inner circuit board 53 of the driver 50 by an adhesive (not shown). The inner circuit board 53 and the focusing carrier 52 are bonded together by an adhesive (not shown). The focusing coil 54 is wound around the focusing carrier 52 and then bonded thereto by an adhesive (not shown). The optical anti-shake carrier 56 and the magnet 57 are bonded by an adhesive (not shown). The optical anti-shake coil 51 is bonded to the bottom 61 of the lower cover 60 by an adhesive (not shown).
The image sensor 30 is electrically connected to the inner circuit board 53 through a wire (e.g., a short gold wire 82 shown in fig. 6 and 7), that is, one end of the short gold wire 82 is connected to the inner circuit board 53, and the other end is connected to the image sensor 30; the short gold wire 82 may be connected to the outer circuit board 70 and the image sensor 30 by soldering. The inner circuit board 53 is electrically connected to the outer circuit board 70 through a wire (e.g., a long gold wire 81 shown in fig. 6 and 7), that is, one end of the long gold wire 81 is connected to the outer circuit board 70, and the other end is connected to the inner circuit board 53; the long gold wire 81 may be connected to the outer circuit board 70 and the inner circuit board 53 by soldering.
As shown in fig. 7 and 8, a plurality of metal sheets 80 are further provided on the lower cover 60. The circuit of the lower cover 60 is electrically connected to the outer circuit board 70 through a metal plate 80. In this embodiment, the number of the metal sheets 80 is four, and the metal sheets 80 are respectively disposed at four corners of the lower cover 60, and each metal sheet 80 is L-shaped and connects the bottom portion 61 and one side portion 63 of the lower cover 60. One end of the metal sheet 80 is electrically connected to the outer circuit board 70, and the other end is electrically connected to the circuit of the lower cover 60; the connection mode can be welding connection.
The working principle of the driver 50 for focusing is as follows: the outer circuit board 70 receives an electrical signal from the outside of the camera module 200, the electrical signal is transmitted to the circuit of the lower cover 60 through the outer circuit board 70 and the metal sheet 80 in sequence, then is transmitted to the suspension wire 58 through the circuit of the lower cover 60 and the welding point of the suspension wire 58, then is transmitted to the elastic sheet 55 through the welding point of the suspension wire 58 and the elastic sheet 55, and then is transmitted to the focusing coil 54 through the welding point of the elastic sheet 55 and the focusing coil 54; after the focusing coil 54 is energized, a Z-direction electromagnetic force is generated under the action of the magnetic field of the magnet 57, so that the focusing coil 54 carries the focusing carrier 52, the inner circuit board 53 and the image sensor 30 to realize the focusing function of Z-direction movement.
The optical anti-shake operation principle of the driver 50 is as follows: the outer circuit board 70 receives an electrical signal from the outside of the camera module 200, and the electrical signal is transmitted to the circuit of the lower cover 60 through the outer circuit board 70 and the metal sheet 80, and then transmitted to the optical anti-shake coil 51 through the circuit of the lower cover 60 and the welding point of the optical anti-shake coil 51; after the optical anti-shake coil 51 is energized, electromagnetic forces in the X and Y directions are generated under the action of the magnetic field of the magnet 57, so that the magnet 57 carries the optical anti-shake carrier 56, the spring 55, the focus carrier 52, the focus coil 54, the inner circuit board 53 and the image sensor 30 to realize the optical anti-shake function of movement in the X and Y directions.
The working principle of the image sensor 30 is as follows: the outer circuit board 70 receives the electrical signal from the outside of the camera module 200, and the electrical signal is transmitted to the inner circuit board 53 through the long gold wire 81 welded with the outer circuit board 70 and then transmitted to the image sensor 30 through the short gold wire 82 welded with the inner circuit board 53; similarly, the electrical signal of the image sensor 30 is transmitted to the outside of the outer circuit board 70 and the camera module.
External light signals are transmitted to the image sensor 30 through the lens and the infrared filter 20, and the image sensor 30 can be powered on to work all the time when the driver 50 of the image sensor 30 realizes focusing and optical anti-shake functions; the long gold wire 81 is shaken or deformed by the operation of the driver 50, but a good electrical connection is always maintained.
In this embodiment, the surface of the lens assembly 10 facing the image sensor 30 is injection molded with a strip-shaped soft rubber layer 40a twice, the surface of each side portion 63 of the lower cover 60 is injection molded with a strip-shaped soft rubber layer 40b, and the bottom portion 61 of the lower cover 60 is injection molded with a circular soft rubber layer 40c, so that when the driver 50 collides with the lower cover 60 or the lens assembly 10 under external disturbance, the soft rubber layers 40a, 40b, and 40c can buffer/reduce the collision impact force, thereby providing collision buffer for the driver 50 and the image sensor 30 and avoiding structural or functional failure. In addition, the soft rubber film 42 is formed on the surface of the optical anti-shake carrier 56 facing the focus carrier 52 by means of plastic dropping/spraying, and when the optical anti-shake carrier 56 and the focus carrier 52 of the actuator 50 collide with each other under external disturbance, the soft rubber film 42 can buffer/reduce the impact force, so as to provide collision buffer for the actuator 50 and the image sensor 30, and avoid structural or functional failure.
As shown in fig. 5, the area of the soft adhesive layer 40a disposed on the surface of the lens assembly 10 is provided with a shallow groove 11, and the area of the soft adhesive layer 40b disposed on the surface of the side portion 63 is also provided with a shallow groove 11, so that when the material forming the soft adhesive layer is formed by injection molding, the material forming the soft adhesive layer can enter the shallow groove 11, and thus the bonding strength between the soft adhesive layer 40 and the attachment surface can be effectively improved. It is to be understood that the manner of improving the adhesive strength is not limited thereto, and as shown in fig. 9A and 9B, the surface on which the soft adhesive layer 40 and the soft adhesive film 42 are disposed may be perforated or the surface may be roughened.
The present application further provides an electronic device (not shown) using the camera module 100 or 200, wherein the electronic device may be a mobile phone, a notebook, a tablet computer, etc.
It should be noted that the above is only a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all should be covered by the scope of the present application; in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (15)
1. A camera module is characterized by comprising a lens component, an image sensor and a driver which are sequentially stacked from top to bottom, wherein the driver bears the image sensor and is movable relative to the lens component so as to drive the image sensor to move; a soft adhesive layer is arranged on the surface of the lens assembly facing the image sensor; a soft rubber film is arranged in the driver; the soft rubber layer and the soft rubber film are used for buffering collision caused by movement of the driver and the image sensor.
2. The camera module of claim 1, wherein the soft adhesive layer is at least on opposite sides of the image sensor.
3. The camera module according to claim 1 or 2, further comprising a lower cover, wherein the lower cover comprises a bottom portion and a side portion connected to a periphery of the bottom portion, the bottom portion and the side portion cooperate to form a receiving cavity, the driver and the image sensor are located in the receiving cavity, and the driver is located between the bottom portion and the image sensor; the lens assembly is arranged on the lower cover and is positioned on one side of the lower cover, which is provided with the side part.
4. The camera module of claim 3, wherein an outer circuit board is further disposed between the lens assembly and the lower cover; the outer circuit board surrounds the image sensor so as not to affect the transmission of optical signals into the image sensor.
5. The camera module of claim 4, wherein the image sensor is electrically connected to the outer circuit board by a wire.
6. The camera module according to claim 4, wherein a metal plate is further disposed in the lower cover, the driver is electrically connected to the outer circuit board through the metal plate, one end of the metal plate is electrically connected to the outer circuit board, and the other end of the metal plate is electrically connected to the driver.
7. The camera module of claim 3, wherein the side portion has an additional layer of soft gel disposed on a surface thereof facing the actuator.
8. The camera module according to claim 4, wherein the driver comprises an optical anti-shake coil, a focusing carrier and an inner circuit board which are sequentially stacked on the bottom; the inner circuit board is electrically connected with the outer circuit board through a lead; the image sensor is electrically connected with the inner side circuit board through a lead; the driver also comprises a focusing coil, an optical anti-shake carrier and a magnet, wherein the focusing coil is wound outside the focusing carrier and positioned between the inner side circuit board and the optical anti-shake coil; the optical anti-shake carrier is arranged on the optical anti-shake coil, and the optical anti-shake carrier is positioned between the focusing carrier and the side part; the magnet is loaded on the optical anti-shake carrier; the optical anti-shake carrier and the focusing carrier are both made of electrically insulating materials.
9. The camera module of claim 8, wherein the soft film is disposed on the surfaces of the optical anti-shake carrier and the magnet facing the focus carrier.
10. The camera module according to claim 8, wherein an additional soft rubber layer is disposed on a surface of the bottom facing the driver, and a through hole is formed in the optical anti-shake coil for the additional soft rubber layer on the bottom to pass through; the other soft rubber layer is positioned between the bottom and the focusing carrier.
11. The camera module according to claim 8, 9 or 10, wherein the actuator further comprises a plurality of resilient pieces, one end of each resilient piece is fixedly connected to the focusing carrier, and the other end of each resilient piece is fixedly connected to the optical anti-shake carrier, so that the focusing carrier and the optical anti-shake carrier are connected into a whole through the plurality of resilient pieces; and part of the elastic sheets are electrically connected with the focusing coil.
12. The camera module according to claim 11, wherein a surface of the bottom facing the driver is provided with a circuit, the optical anti-shake coil is electrically connected to the circuit, the lower cover is further provided with a metal sheet, the circuit is electrically connected to the outer circuit board through the metal sheet, one end of the metal sheet is electrically connected to the outer circuit board, and the other end of the metal sheet is electrically connected to the circuit; the driver further comprises a plurality of suspension wires, each suspension wire is a metal thin rod and is vertically arranged on the bottom, one end of each suspension wire is electrically connected with the circuit, and the other end of each suspension wire is electrically connected with an elastic sheet which is electrically connected with the focusing coil.
13. The camera module of claim 1, wherein the actuator is a mems actuator having a void formed therein, the soft gel membrane being formed in the void.
14. The camera module of claim 1, wherein the lens assembly is further provided with an infrared filter on a side facing the image sensor, and the image sensor is located between the infrared filter and the driver.
15. An electronic device comprising the camera module according to any one of claims 1 to 14.
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| CN202011340610.8A CN114553985B (en) | 2020-11-25 | 2020-11-25 | Camera module and electronic device using same |
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| CN202011340610.8A CN114553985B (en) | 2020-11-25 | 2020-11-25 | Camera module and electronic device using same |
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| CN114553985B (en) | 2023-09-12 |
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