CN108630560A - 传感装置的制造方法和传感装置 - Google Patents
传感装置的制造方法和传感装置 Download PDFInfo
- Publication number
- CN108630560A CN108630560A CN201710161544.XA CN201710161544A CN108630560A CN 108630560 A CN108630560 A CN 108630560A CN 201710161544 A CN201710161544 A CN 201710161544A CN 108630560 A CN108630560 A CN 108630560A
- Authority
- CN
- China
- Prior art keywords
- flexible
- chip
- conducting rubber
- manufacturing
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83874—Ultraviolet [UV] curing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710161544.XA CN108630560A (zh) | 2017-03-17 | 2017-03-17 | 传感装置的制造方法和传感装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710161544.XA CN108630560A (zh) | 2017-03-17 | 2017-03-17 | 传感装置的制造方法和传感装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108630560A true CN108630560A (zh) | 2018-10-09 |
Family
ID=63687442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710161544.XA Pending CN108630560A (zh) | 2017-03-17 | 2017-03-17 | 传感装置的制造方法和传感装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108630560A (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102498562A (zh) * | 2009-07-27 | 2012-06-13 | 飞际控股有限公司 | 柔性电路模块 |
CN103309535A (zh) * | 2013-06-06 | 2013-09-18 | 敦泰科技有限公司 | 电容式触摸屏 |
CN104380313A (zh) * | 2012-04-24 | 2015-02-25 | 维普公司 | 制造电子卡的方法 |
CN105375232A (zh) * | 2014-08-18 | 2016-03-02 | 迪睿合株式会社 | 连接结构体的制造方法及各向异性导电粘接膜 |
US20160218289A1 (en) * | 2015-01-23 | 2016-07-28 | Samsung Display Co., Ltd. | Bonding method and system for flexible display device |
-
2017
- 2017-03-17 CN CN201710161544.XA patent/CN108630560A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102498562A (zh) * | 2009-07-27 | 2012-06-13 | 飞际控股有限公司 | 柔性电路模块 |
CN104380313A (zh) * | 2012-04-24 | 2015-02-25 | 维普公司 | 制造电子卡的方法 |
CN103309535A (zh) * | 2013-06-06 | 2013-09-18 | 敦泰科技有限公司 | 电容式触摸屏 |
CN105375232A (zh) * | 2014-08-18 | 2016-03-02 | 迪睿合株式会社 | 连接结构体的制造方法及各向异性导电粘接膜 |
US20160218289A1 (en) * | 2015-01-23 | 2016-07-28 | Samsung Display Co., Ltd. | Bonding method and system for flexible display device |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181009 |