CN108601215A - Rigid Flex and terminal - Google Patents
Rigid Flex and terminal Download PDFInfo
- Publication number
- CN108601215A CN108601215A CN201810375912.5A CN201810375912A CN108601215A CN 108601215 A CN108601215 A CN 108601215A CN 201810375912 A CN201810375912 A CN 201810375912A CN 108601215 A CN108601215 A CN 108601215A
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- China
- Prior art keywords
- rigid
- base plate
- layer
- copper foil
- circuit base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of Rigid Flex and terminals, the Rigid Flex includes substrate layer, rigid circuit base plate, electronic building brick and screened film, the substrate layer includes the firstth area, the hardness circuit base plate fits in firstth area, orthographic projection region of the hardness circuit base plate on the substrate layer coincides with firstth area, the hardness circuit base plate is equipped with blind zone, the electronic building brick is welded in the blind zone, the screened film is fixed on the rigid circuit base plate, the screened film coincides in the orthographic projection region of the rigid circuit base plate with the blind zone, the screened film presses and covers the electronic building brick.Electronic building brick in the blind zone is stable in by the pressure force of the screened film on the rigid circuit base plate, to which the electronic building brick is not easy to fall off from the rigid circuit base plate, enhances the firm performance of the Rigid Flex.
Description
Technical field
The present invention relates to electronic device field more particularly to a kind of Rigid Flex and terminals.
Background technology
The application of Rigid Flex is more and more extensive at present, and multiple electricity can be arranged in rigid area in most Rigid Flexs
Subcomponent, to realize printed circuit board function.However the hardness due to current most Rigid Flexs in rigid area is not so good as routine
Printed circuit board, thus bearing stress of the Rigid Flex in rigid area is bad, causes Rigid Flex in the more of rigid area
A electronic component is easy to be given a shock stress, so that electronic component is easily damaged or loosens, so as to cause soft or hard knot
Board structure stability is relatively low.
Invention content
In view of this, the present invention provides a kind of Rigid Flex and terminal improving structural soundness.
The present invention provides a kind of Rigid Flex, wherein the Rigid Flex include substrate layer, rigid circuit base plate,
Electronic building brick and screened film, the substrate layer include the firstth area, and the hardness circuit base plate fits in firstth area, described hard
Property orthographic projection region of the circuit base plate on the substrate layer coincide with firstth area, the hardness circuit base plate is equipped with screen
Area is covered, the electronic building brick is welded in the blind zone, and the screened film is fixed on the rigid circuit base plate, the screen
It covers film to coincide with the blind zone in the orthographic projection region of the rigid circuit base plate, the screened film is pressed and covered described
Electronic building brick.
Wherein, the electronic building brick includes multiple first electronic components and second electronic component, and multiple described first
The internal stress of electronic component is more than the internal stress of second electronic component, and first electronic component is arranged in second electricity
Around subcomponent.
Wherein, the Rigid Flex includes two rigid circuit base plates, be respectively the first rigid circuit base plate and
Second rigid circuit base plate, the described first rigid circuit base plate and the second rigid circuit base plate fit in the base material respectively
Layer both sides.
Wherein, the electronic building brick includes third electronic component and the 4th electronic component, the third electronic component it is interior
Stress is more than the internal stress of the 4th electronic component, and the third electronic component is welded in the described first rigid circuit base plate
On, the 4th electronic component is welded on the described second rigid circuit base plate, and positioned at opposite with the third electronic component
Position.
Wherein, the rigid circuit base plate includes rigid insulation layer, line layer and anti-solder ink layer, the rigid insulation layer
Firstth area is fitted in, and the orthographic projection region on the substrate layer coincides with firstth area, the line layer
It fits on the rigid insulation layer, and is located at side opposite with the substrate layer, the anti-solder ink layer is coated on the line
On the floor of road, the line layer is covered, the electronic building brick passes through the anti-solder ink layer, is welded on the line layer.
Wherein, the substrate layer further includes the secondth area for being connected to first area edge, and the Rigid Flex also wraps
Copper foil layer is included, the copper foil layer is arranged in firstth area and secondth area, and is laminated in the substrate layer and the hardness
Between substrate layer.
Wherein, the Rigid Flex includes two layers of copper foil layer, is the first copper foil layer and the second copper foil layer, institute respectively
It states the first copper foil layer and second copper foil layer is laminated in the substrate layer both sides respectively, first copper foil layer is equipped with perforation extremely
The through-hole of second copper foil layer, the interior setting of the through-hole connect the conduction of first copper foil layer and second copper foil layer
Body.
Wherein, the Rigid Flex further includes the first cover film and the second cover film, is to fit in described first respectively
First cover film of copper foil layer and the second cover film for fitting in second copper foil layer, first cover film and described second
Orthographic projection region of the cover film on the substrate layer coincides with secondth area.
Wherein, the first copper foil layer setting ground connection cabling, the second copper foil layer setting signal cabling, the electric conductor
It is connected to the signal lead and the ground connection cabling.
The present invention also provides a kind of terminals, wherein the terminal include ontology, set on the body interior mainboard and
Rigid Flex described in above-mentioned any one, the Rigid Flex is set to the body interior, and is electrically connected with the mainboard.
The Rigid Flex and terminal of the present invention utilizes institute by the way that the electronic building brick to be welded in the blind zone
It states screened film and presses and cover the electronic building brick, and orthographic projection region of the screened film on the rigid circuit base plate
It coincides with the blind zone, to which the electronic building brick in the blind zone is by the pressure force of the screened film, is stable in institute
It states on rigid circuit base plate, to which the electronic building brick is not easy to fall off from the rigid circuit base plate, enhances the soft or hard knot
The firm performance of plywood.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the schematic cross-section of Rigid Flex provided by the invention.
Specific implementation mode
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
Referring to Fig. 1, a kind of Rigid Flex 100 provided by the invention, the Rigid Flex 100 includes substrate layer
10, rigid circuit base plate 20, electronic building brick 30 and screened film 40, the substrate layer 10 include the first area 10a, the hardness circuit
The correspondence of substrate 20 fits in the firstth area 10a, and the hardness circuit base plate 20 is equipped with blind zone 20a, the electronic building brick 30
It is welded in the blind zone 20a of the rigid circuit base plate 20, and concentrates on the geometric center of the blind zone 20a, the screen
It covers film 40 to be fixed on the rigid circuit base plate 20, presses and cover the electronic building brick 30, the screened film 40 is described
The orthographic projection region of rigid circuit base plate 20 coincides with the blind zone.
By the way that the electronic building brick 30 to be welded in the blind zone 20a, presses and cover using the screened film 40
The electronic building brick 30, and orthographic projection region and the blind zone of the screened film 40 on the rigid circuit base plate 20
It coincides, to which the electronic building brick in the blind zone 20a is by the pressure force of the screened film 40, is stable in the hard rays
On base board 20, to which the electronic building brick 30 is not easy to fall off from the rigid circuit base plate 20, enhance the soft or hard combination
The firm performance of plate 100.
In present embodiment, polyimides or the double stupid diformates of polyethylene can be used in the substrate layer 10
Materials such as (Polyethylene terephthalate PET), in order to which copper foil circuit is arranged on the substrate layer 10, and
And the substrate layer 10 can provide insulation environment for copper foil circuit.Preferably, the thickness of the substrate layer 10 can be 20 μm.Institute
The first area 10a and the second area 10b can be arranged by stating substrate layer 10, and the secondth area 10b is flexible for rendering, facilitates described soft
Board 100 generates deformation, and then facilitates the connection external device of the Rigid Flex 100, described in the firstth area 10a fixations
Rigid circuit base plate 20, to improve the rigidity of the Soft Bonding plate 100, using fixing institute on the rigid circuit base plate 20
Electronic building brick 30 is stated, and using the hardness of the rigid circuit base plate 20, to facilitate the Soft Bonding plate 100 to be assemblied in
In terminal.
In present embodiment, the hardness circuit base plate 20 is molded through rigid circuit board manufacturing process, the hardness circuit
Substrate 20 carries the electronic building brick 30, and the hardness circuit base plate 20 has the letter for being electrically connected the electronic building brick 30
Number circuit, to provide electric signal for the electronic building brick 30 so that the electronic building brick 30 works.Specifically, the hardness
Circuit base plate 20 is in plate shape, and the hardness circuit base plate 20 is adhered to the first area 10a of the substrate layer 10, the hard rays
Road floor 20 welds the electronic building brick 30 away from the side of the substrate layer 10, and is bonded the screened film 40.The hardness
The geometric center of the blind zone 20a of circuit base plate 20 and the geometric center of the firstth area 10a coincide, and the blind zone
The periphery of 20a and the periphery of the firstth area 10a are placed equidistant with.To which the electronic building brick 30 in the blind zone 20a is right
The stress concentration of the hardness line layer 20 is around the geometric center of the firstth area 10a, so that rigid line layer 20
The electronic building brick 30 can effectively be supported.
In present embodiment, the electronic building brick 30 is made of multiple electronic components, which can be capacitance, electricity
The elements such as resistance, diode or triode.The connection of the electronic building brick 30 and the rigid circuit base plate 20, to described
Rigid Flex 100 provides circuit structure, and then the Rigid Flex 100 is applied to terminal, to the Rigid Flex
100 may be implemented electronic information processing.The electronic building brick 30 is welded on the rigid circuit base plate 20, the electronic building brick
30 by the rigid circuit base plate 20 support, to which the electronic building brick 30 answers the rigid circuit base plate 20 in the presence of welding
Power is easy to lead the electronics when to welding gap occur between the electronic building brick 30 and the rigid circuit base plate 20
Component 30 falls off, thus the electronic building brick 30 is more stable in the hard rays under the pressing effect of the screened film 40
On base board 20.
In present embodiment, the periphery of the screened film 40 can be the periphery for being adhered to the blind zone 20a, the screen
It covers film 40 to be electromagnetically shielded the electronic building brick 30, to be protected to the electronic building brick 30, prevents the electronics
Component 30 receives electromagnetic interference, to improve the anti-tampering performance of the Rigid Flex 100 so that the Rigid Flex 100
It can be applied to the more severe scene of electromagnetic environment.In other embodiments, the periphery of the screened film 40 can also be weldering
It is connected to the periphery of the blind zone 20a.
Further, the electronic building brick 30 includes multiple first electronic components 31 and second electronic component 32, more
The internal stress of a first electronic component 31 is more than the internal stress of second electronic component 32, first electronic component 31
It is arranged in around second electronic component 32.
In present embodiment, first electronic component 31 can be resistance, and second electronic component 32 can be electricity
Hold, it is clear that resistance internal stress is more than capacitance internal stress, i.e. the intensity of resistance is more than the intensity of capacitance, thus first electronics member
31 second electronic component 32 of part is easily stable on the rigid circuit base plate 20.Utilize 31 row of the first electronic component
It is distributed in around second electronic component 32, so that first electronic component 31 reinforces second electronic component 32 weeks
The stability of the rigid circuit base plate 20 enclosed so that the rigid circuit base plate 20 around second electronic component 32 is not variable
Shape, so that second electronic component 32 is firm, so that the overall structure of the Rigid Flex 100 is firm.
In other embodiment, first electronic component 31 can also be that electronic chip, second electronic component 32 can also be
Diode.
Further, the Rigid Flex 100 includes two rigid circuit base plates 20, is the first hard rays respectively
Base board 21 and the second rigid circuit base plate 22, the described first rigid circuit base plate 21 and the second rigid circuit base plate 22 divide
10 both sides of the substrate layer are not fitted in.The circuit of described first rigid circuit base plate 21 and the described second rigid circuit base plate 22
Circuit can be different so that a variety of different line constructions are presented in the Rigid Flex 100 so that the soft or hard knot
100 diversification of plywood, and a variety of different terminals can be matched.The electronic building brick 30 can only be welded in described first
Rigid circuit base plate 21 can also be only to be welded in the described second rigid circuit base plate 22, can also be two electricity of setting
Sub-component 30 is respectively welded in the described first rigid circuit base plate 21 and the second rigid circuit base plate 22 or the electricity
Sub-component 30 is welded in the described first rigid circuit base plate 21 and the second rigid circuit base plate 22 simultaneously.In other embodiment party
In formula, if the Rigid Flex 100 is arranged two layers of substrate layer 10 and is laminated, the Rigid Flex 100 can also be set
Rigid circuit base plate 20 described in setting three groups.
Further, the electronic building brick 30 includes a third electronic component 33 and the 4th electronic component 34, and described the
The internal stress of three electronic components 33 is more than the internal stress of the 4th electronic component 34, and the third electronic component 33 is welded in institute
It states on the first rigid circuit base plate 21, the 4th electronic component 34 is welded on the described second rigid circuit base plate 22, and position
In the position opposite with the third electronic component 33.
In present embodiment, the third electronic component 33 can be chip, and the 4th electronic component 34 can be electricity
Hold, it is clear that chip internal stress is more than capacitance internal stress, i.e. the intensity of chip is more than the intensity of capacitance, thus third electronics member
Bond strength the 4th electronic component 34 and the described second rigid circuit of part 33 and the described first rigid circuit base plate 21
The bond strength of substrate 22 is big.It is oppositely arranged with the third electronic component 33 using the 4th electronic component 34, to make
It obtains the third electronic component 33 to be supported the 4th electronic component 34 so that the 4th electronic component 34 is more steady
It is fixed on the second rigid circuit base plate 22, so that the overall structure of the Rigid Flex 100 is firm.In other embodiment party
In formula, multiple 4th electronic components 34 can also be set and be located at the position being oppositely arranged with the third electronic component 33,
I.e. multiple 4th electronic components 34 are located at the third electronic component 33 in institute in the orthographic projection region of the substrate layer 10
It states in the orthographic projection region of substrate layer 33.
Further, the rigid circuit base plate 20 includes rigid insulation layer 201, line layer 202 and anti-solder ink layer
203, the rigid insulation floor 201 fits in the firstth area 10a, and the orthographic projection region on the substrate layer 10 and institute
The first area 10a is stated to coincide.The line layer 202 fits on the rigid insulation layer 201 and is located at and the substrate layer 10
Opposite side, the anti-solder ink layer 203 are coated on the line layer 202, cover the line layer 202, the electronics group
Part 20 passes through the anti-solder ink layer 203, is welded on the line layer 202.Specifically, the rigid insulation layer 201 uses
Polyethylene material, the rigid insulation layer 201 have insulating properties characteristic, are lost on 201 to shelter evil people and countenance evil practices in the rigid insulation
Carve the line layer.Utilize the hardness of the rigid insulation layer 201 so that the Rigid Flex 100 is in the firstth area 10a
On intensity increase so that the Rigid Flex 100 is not easy bending in the firstth area 10a.The line layer 202 can be
The etched technological forming of copper foil.The line layer 202 either can be grounded cabling with setting signal cabling.The anti-solder ink layer
Circuit on 203 pairs of line layers 202 is protected, and the line short on the line layer 202 is prevented.The anti-solder ink
Welding hole is set on layer 203, scolding tin is set in welding hole, the electronic building brick 30 is welded in the line layer 202 by scolding tin.
Further, the substrate layer 10 further includes the second area 10b for being connected to the firstth area edges 10a, described soft
The plywood 100 that hardens further includes copper foil layer 50, and the copper foil layer 50 is laminated in the rigid circuit layer group 20 and the substrate layer 10
Between, and be arranged on the firstth area 10a and the secondth area 10b.
In present embodiment, the copper foil layer 50 is the plate that copper foil is arranged on film, the ground connection on the copper foil layer 50
Cabling and signal lead are that copper foil is formed according to the etched technique of prescribed route structure.Ground connection cabling on the copper foil layer 50
Can be wholely set with signal lead, the signal lead on the copper foil layer 50 realizes the conduction between electric elements, described
Ground connection cabling on copper foil layer 50 is grounded.Copper foil layer 50 is set on the substrate layer 100 so that the Rigid Flex
The diversification of 100 circuit structures, and using the copper foil layer 50 can with the secondth area 10b bendings of the substrate layer 10, to
Facilitate the Rigid Flex 100 to connect the functional component of terminal, shows flexible circuit board characteristic.
Further, the Rigid Flex 100 includes two layers of copper foil layer 50, is the first copper foil layer 51 and the respectively
Two copper foil layers 52, first copper foil layer 51 and second copper foil layer 52 are laminated in 10 both sides of the substrate layer respectively, described
First copper foil layer 51 is equipped with perforation to the through-hole 53 of second copper foil layer 52, and the interior setting of the through-hole 53 connects first bronze medal
The electric conductor 54 of layers of foil 51 and second copper foil layer 52.
In present embodiment, first copper foil layer 51 and second copper foil layer 52 are respectively equipped with different circuits, with
The circuit layout space for increasing the Rigid Flex 100, improves the electric conductivity of the Rigid Flex 100.The through-hole
53 are opened in circuit one end of first copper foil layer 51, and the circuit towards second copper foil layer 52 extends.Specifically, described logical
Hole 52 also extends through the substrate layer 10, and the electric conductor 54 is the copper post across the through-hole 52.The electric conductor 52 realizes institute
The first copper foil layer 51 and second copper foil layer 52 conducting are stated, to ensure that the multi-line cabling of the Rigid Flex 100
It is required that.The through-hole 53 is opened in the second area 10b of the substrate layer 10 relatively of the copper foil layer 20, to cut down the copper foil
Floor 50 the second area 10b stress so that Rigid Flex 100 in second area's 10b remitted its furys, improves the soft or hard knot
Flexibility of the plywood 100 in the second area 10b.In other embodiments, the number of the through-hole 53 can be multiple, the conduction
Body 54 may be implemented earth-continuity and either realize signal conduction.
Further, the Rigid Flex 100 further includes the first cover film 61 and the second cover film 62, is fitting respectively
In first copper foil layer 51 the first cover film 61 and fit in the second cover film 62 of second copper foil layer 52, described the
The orthographic projection region of one cover film 61 and second cover film 62 on the substrate layer 10 is be overlapped with the secondth area 10b phases
It closes.
In the present embodiment, it is hot-forming that polyester material progress may be used in first cover film 61.First covering
Film 61 is by paste adhesive on first copper foil layer 51.Specifically, first cover film 61 fits in described completely
On one copper foil layer 51, and part covers signal lead and ground connection cabling on first copper foil layer 51, i.e., described first covering
Film 61 is corresponding with the second area 10b of the substrate layer 10, to protect signal lead on first copper foil layer 51 to be grounded cabling
It is not lost or is damaged, meanwhile, by the way of paste adhesive, it is also possible that first cover film 61 and described the
The connection of one copper foil layer 51 is closer, prevent first cover film 61 from shifting and can not be to exposing first cover film 61
Part cabling is protected.Second cover film 62 setting identical as 61 structure of the first cover film, details are not described herein.
Further, the setting ground connection cabling of the first copper foil layer 51 (not shown), the setting of the second copper foil layer 52 letter
Number cabling (not shown), the electric conductor 54, which is connected to, is grounded cabling and second copper foil layer described in first copper foil layer 51
52 signal lead.
In present embodiment, ground connection cabling is only arranged in first copper foil layer 51, i.e., described first copper foil layer 51 is public
Electrode.Signal lead on second copper foil layer 52 realizes that circuit configuration, the electric conductor 54 are connected to ground connection cabling and letter
Number cabling, the electric conductor 54 provide grounding electrode for the circuit on second copper foil layer 52, increase the Rigid Flex
100 use function.In other embodiments, it can also be that second copper foil layer 52 is arranged and be grounded cabling, described first
51 setting signal cabling of copper foil layer, the electric conductor 54 are that first copper foil layer 51 provides grounding electrode.
The present invention also provides a kind of terminal (not shown), the terminal includes ontology (not shown), is set in the ontology
The mainboard (not shown) and the Rigid Flex 100 in portion, the Rigid Flex 100 be set to the body interior, and with
The mainboard electrical connection.The terminal can be mobile phone, computer, tablet, handheld device or media player etc..
The Rigid Flex and terminal of the present invention is fixed on the cover film by the steel reinforcement and deviates from the copper foil layer
Side, and the empty window on the cover film, while using the earth conductor copper foil is connected to by the empty window
Between layer and the steel reinforcement, to realize that the steel reinforcement is connect with the copper foil layer, to realize the steel reinforcement ground connection,
To improve the ground connection performance of the Rigid Flex.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (10)
1. a kind of Rigid Flex, which is characterized in that the Rigid Flex includes substrate layer, rigid circuit base plate, electronics group
Part and screened film, the substrate layer include the firstth area, and the hardness circuit base plate fits in firstth area, the hardness circuit
Orthographic projection region of the substrate on the substrate layer coincides with firstth area, and the hardness circuit base plate is equipped with blind zone,
The electronic building brick is welded in the blind zone, and the screened film is fixed on the rigid circuit base plate, the screened film
It coincides with the blind zone in the orthographic projection region of the rigid circuit base plate, the screened film presses and covers the electronics
Component.
2. Rigid Flex according to claim 1, which is characterized in that the electronic building brick includes multiple first electronics members
Part and second electronic component, the internal stress of each first electronic component are more than the planted agent of second electronic component
Power, first electronic component are arranged in second surrounding electronic component.
3. Rigid Flex according to claim 1 or 2, which is characterized in that the Rigid Flex includes described in two
Rigid circuit base plate, is the first rigid circuit base plate and the second rigid circuit base plate respectively, the described first rigid circuit base plate and
Described second rigid circuit base plate fits in the opposite both sides of the substrate layer respectively.
4. Rigid Flex according to claim 3, which is characterized in that the electronic building brick include third electronic component and
4th electronic component, the internal stress of the third electronic component are more than the internal stress of the 4th electronic component, the third electricity
Subcomponent is welded on the described first rigid circuit base plate, and the 4th electronic component is welded in the described second rigid circuit base plate
On, and it is located at the position opposite with the third electronic component.
5. according to the Rigid Flex described in claims 1 to 3 any one, which is characterized in that the hardness circuit base plate packet
Rigid insulation layer, line layer and anti-solder ink layer are included, the rigid insulation floor fits in firstth area, and in the base material
Orthographic projection region on floor coincides with firstth area, and the line layer fits on the rigid insulation layer, and positioned at
The opposite side of substrate layer, the anti-solder ink layer are coated on the line layer, cover the line layer, the electronics group
Part passes through the anti-solder ink layer, is welded on the line layer.
6. according to the Rigid Flex described in claim 1 to 5 any one, which is characterized in that the substrate layer further include with
The secondth area that firstth area is connected, the Rigid Flex further include copper foil layer, and the copper foil layer is arranged in described first
Area and secondth area, and be laminated between the substrate layer and the rigid base material layer.
7. Rigid Flex according to claim 6, which is characterized in that the Rigid Flex includes two layers of copper foil
Layer, is the first copper foil layer and the second copper foil layer respectively, and first copper foil layer and second copper foil layer are laminated in described respectively
The opposite both sides of substrate layer, first copper foil layer are equipped with perforation to the through-hole of second copper foil layer, the interior setting of the through-hole
Connect the electric conductor of first copper foil layer and second copper foil layer.
8. Rigid Flex according to claim 7, which is characterized in that the Rigid Flex further includes the first cover film
It is the first cover film for fitting in first copper foil layer and fit in second copper foil layer the respectively with the second cover film
Two cover films, the orthographic projection region of first cover film and second cover film on the substrate layer and secondth area
It coincides.
9. Rigid Flex according to claim 7, which is characterized in that the first copper foil layer setting ground connection cabling, institute
The second copper foil layer setting signal cabling is stated, the electric conductor is connected to the signal lead and the ground connection cabling.
10. a kind of terminal, which is characterized in that the terminal includes ontology, set on the mainboard of the body interior and such as right
It is required that Rigid Flex described in 1~9 any one, the Rigid Flex is set to the body interior, and electric with the mainboard
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810375912.5A CN108601215B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board and terminal |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105678.5A CN105704910B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
| CN201810375912.5A CN108601215B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board and terminal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105678.5A Division CN105704910B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108601215A true CN108601215A (en) | 2018-09-28 |
| CN108601215B CN108601215B (en) | 2020-01-14 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810375912.5A Active CN108601215B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board and terminal |
| CN201610105678.5A Expired - Fee Related CN105704910B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105678.5A Expired - Fee Related CN105704910B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
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| CN (2) | CN108601215B (en) |
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| CN101296568A (en) * | 2007-04-28 | 2008-10-29 | 华通电脑股份有限公司 | Method for soft and hard compound circuit board exerting electromagnetic shielding and system for implementing the same |
| CN101896058A (en) * | 2009-05-22 | 2010-11-24 | 索尼爱立信移动通信日本株式会社 | Electromagnetic shielding method and electromagnetic shielding film |
| CN101932223A (en) * | 2009-06-22 | 2010-12-29 | 通用电气公司 | Form the system and method for isolated conformal shielding areas |
| CN201888027U (en) * | 2010-11-30 | 2011-06-29 | 金壬海 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
| CN102159026A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8276268B2 (en) * | 2008-11-03 | 2012-10-02 | General Electric Company | System and method of forming a patterned conformal structure |
| CN202026528U (en) * | 2011-05-09 | 2011-11-02 | 宁波市鄞州声光电子有限公司 | Safe circuit board |
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2016
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101296568A (en) * | 2007-04-28 | 2008-10-29 | 华通电脑股份有限公司 | Method for soft and hard compound circuit board exerting electromagnetic shielding and system for implementing the same |
| CN101896058A (en) * | 2009-05-22 | 2010-11-24 | 索尼爱立信移动通信日本株式会社 | Electromagnetic shielding method and electromagnetic shielding film |
| CN101932223A (en) * | 2009-06-22 | 2010-12-29 | 通用电气公司 | Form the system and method for isolated conformal shielding areas |
| CN102159026A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN201888027U (en) * | 2010-11-30 | 2011-06-29 | 金壬海 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105704910A (en) | 2016-06-22 |
| CN105704910B (en) | 2018-06-29 |
| CN108601215B (en) | 2020-01-14 |
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