CN108601210A - Printed circuit board and preparation method thereof - Google Patents
Printed circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN108601210A CN108601210A CN201810218108.6A CN201810218108A CN108601210A CN 108601210 A CN108601210 A CN 108601210A CN 201810218108 A CN201810218108 A CN 201810218108A CN 108601210 A CN108601210 A CN 108601210A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- pad
- printed circuit
- circuit board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
A kind of printed circuit board of present invention offer and preparation method thereof.The printed circuit board includes as follows：Insulating layer is provided, the insulating layer has opposite two surfaces；Copper-foil conducting electricity is provided, the copper-foil conducting electricity is respectively the first conductive layer and the second conductive layer, is set up separately on two surface of the insulating layer；By organic polymer binder between the copper-foil conducting electricity and the insulating layer；With laser technology burn off in the partial insulative layer of second conductive layer surface, and the first pad and the second pad are set in first conductive layer and second conductive layer surface；First pad is connect with the second pad scolding tin, is made to be arranged first conductive layer and second conductive layer on opposite two surfaces of the insulation board and is realized electrical connection.Print circuit plates making method provided by the invention, simple for process, product is reliable, solves the problems, such as the harmomegathus that prior art products production process occurs.
Description
Technical field
The present invention relates to art of printed circuit boards more particularly to a kind of flexible printed circuit board production methods.
Background technology
Flexible printed circuit board (Flexible Printed Circuit, FPC), also known as flexible circuit board, soft circuit
Plate, flex circuit application, soft board are a kind of special printed circuit boards, have that light-weight, thickness is thin, the spies such as soft, flexible
Point.It is widely used in the electronic products such as mobile phone, laptop, PDA, digital camera, liquid crystal display.
With the development of hyundai electronics science and technology, electronic product plays the part of more importantly role, people in people's lives
The demand of electronic product is also continuously increased, each electronic product, is required to printed circuit board and realizes various electronic components
Layout and logical connection.
The making processing technology of flexible printed circuit board in the prior art, the mode of generally use equipment through-hole conducting, and
The two-sided conductive layer of printed circuit board is made in conductive layer is arranged in the through-hole in insulating substrate setting through-hole using bore process
It realizes and is electrically connected.
However, there are the following problems for the prior art：
First, existing flexible printed circuit board production technology needs to give birth to by kinds of processes such as drilling, plating, etchings
Flexible printed circuit board described in output, production efficiency are low；
Secondly, flexible printed circuit board is susceptible to deformation in prior art technology process, so as to cause wiring board
It is susceptible to harmomegathus when continuous production, the product rejection rate of production is made to increase；
Therefore, it is necessary to provide a kind of flexible printed circuit board production method to solve the above problems.
Invention content
What the present invention needed to solve is that lowly and in production process product is susceptible to harmomegathus to prior art production efficiency
Problem.The present invention provides that a kind of production efficiency is high, solves the problems, such as the printed circuit board for occurring harmomegathus in production process.
The present invention also provides a kind of production methods of above-mentioned printed circuit board simultaneously.
A kind of printed circuit board, including the first conductive layer, the first pad, insulating layer, the second conductive layer, the second pad and weldering
Tin, first conductive layer are set to one side surface of the insulating layer, and the multiple first pad is set to the first conductive layer table
Face, second conductive layer are set to another side surface of the insulating layer, scolding tin between first pad and second pad.
Above-mentioned printed circuit board as the present invention is further improved, and first conductive layer edge is recessed in described the
Two conductive layer edges are arranged at random to form step.
As being further improved for above-mentioned printed circuit board of the invention, first conductive layer and second conductive layer
It is adhered to two surface of the insulating layer by organic polymer.
Above-mentioned printed circuit board as the present invention is further improved, the insulating layer be set to first conductive layer with
Between second conductive layer.
As being further improved for above-mentioned printed circuit board of the invention, the first conductive layer surface setting is the multiple
First pad, the multiple first pad array setting.
As being further improved for above-mentioned printed circuit board of the invention, the second conductive layer surface setting is the multiple
Second pad, the multiple second pad array setting.
As being further improved for above-mentioned printed circuit board of the invention, first pad passes through with second pad
Scolding tin realizes first conductive layer and second conductive layer electrical connection.
Above-mentioned printed circuit board as the present invention is further improved, and first conductive layer is copper foil layer, and described the
Two conductive layers are copper foil layers.
A kind of production method of printed circuit board, includes the following steps：There is provided the first conductive layer, the first pad, insulating layer,
Second conductive layer and the second pad, first conductive layer are set to the insulating layer side, are set in first conductive layer surface
The multiple first pad is set, second conductive layer is set to the insulating layer other side, is removed using laser processing technology
The part insulating layer keeps second Conductive layer portions exposed, and multiple arrays are arranged in second Conductive layer portions exposed section
Second pad realizes that first conductive layer is conductive with described second in first pad and the second pad scolding tin
Layer electrical connection.
Production method as the above-mentioned printed circuit board of the present invention is further improved, and the laser processing technology includes two
Carbon oxide laser technology, YAG laser technologies and ultraviolet laser processing technology.
Production method as the above-mentioned printed circuit board of the present invention is further improved, the partial insulative layer packet of the removing
Include insulating substrate.
Compared with prior art, printed circuit board provided by the invention and preparation method thereof is that insulating layer is bonded bilayer
Conductive layer is processed, and is increased printed circuit board and is processed thickness, the ability of anti-deformation of printed circuit board is improved, in Continuous maching mistake
Cheng Zhong, external force are small to the influence of crust deformation of printed circuit board, overcome the problems, such as that Continuous maching is susceptible to harmomegathus, can be to printed circuit board
Continuous maching improves production efficiency.
Meanwhile printed circuit board provided by the invention is burnt to carve using laser technology and substitutes punching and chemical etching step, is exempted from
Discharging of waste liquid is removed, it is environmentally friendly, it can automatically be processed by equipment, simplify making step, reduce human cost.
Description of the drawings
To become apparent from the technical solution illustrated in the embodiment of the present invention, embodiment will be described below required attached
Figure, which is done, simply to be introduced, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this field
For those of ordinary skill, under the premise of without involving an inventive effort, it is attached can also to obtain other according to these following attached drawings
Figure, wherein：
Fig. 1 is the side sectional view of printed circuit board of the present invention；And
Fig. 2 is the floor map of printed circuit board of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and detailed complete description is carried out to this case, it should be apparent that, under
It is only the section Example of the invention described in face, instead of all the embodiments.Based on the embodiment in invention, this field is general
The every other embodiment that logical technical staff is obtained without making creative work, belongs to protection of the present invention
Range.
Fig. 1 is please referred to, the printed circuit board 10 includes the first conductive layer 11, first the 111, second conduction of pad
The 13, second pad 131 of layer, insulating layer 15 and scolding tin 17.
First conductive layer 11 by the adherency setting of organic polymer (not shown) in 15 side of the insulating layer, it is described
Second conductive layer 13 is arranged by the adherency of organic polymer (not shown) in 15 other side of the insulating layer, while first weldering
The setting of disk 111 is arranged in 11 surface of the first conductive layer, second pad 131 in 13 surface of the second conductive layer, institute
It states and the scolding tin 17 is set between the first pad 111 and second pad 131.
Referring to Fig. 1, first conductive layer 11 and second conductive layer 13 are arranged in the insulating layer 15, it is described
Second conductive layer 13 is aligned setting with the insulating layer 15, and 11 edge of the first conductive layer is shunk in second conductive layer 13
It is arranged at random to form step.Hollow out, which is arranged, in the insulating layer 15 at the step keeps 13 part of the second conductive layer naked
Dew, society's second pad at 13 partial denudation of the second conductive layer；The first pad setting is led described first
11 surface of electric layer is arranged described 17 between first pad 111 and second pad 131, realize first conductive layer
It is electrically connected between 11 and second conductive layer 13.
Again referring to Fig. 2, the hollow out on 15 surface of the insulating layer is arranged, make 13 partial denudation of the second conductive layer,
Surface is arranged at 13 partial denudation of the second conductive layer in second pad, and the scolding tin 17 passes through the insulating layer 15 real
It is existing to be electrically connected between first conductive layer 11 and the second conductive layer 13.
The multiple first pad, 111 spaced array setting is in 11 surface of the first conductive layer, the multiple second weldering
131 spaced array of disk is arranged at 13 step of the second conductive layer, and first pad 111 and second pad 131 are right
It should be arranged.
In a kind of most preferred embodiment of the present invention, first conductive layer 11 is copper foil layer, and second conductive layer 13 is
Copper foil layer.
When being processed to the printed circuit board 10, include the following steps：
Step S1：The insulating layer 15, first conductive layer 11 and second conductive layer 13 are provided；
Step S2：First conductive layer 11 and second conductive layer 13 are arranged by organic polymer adherency described
Insulating layer 15 is with respect to two surfaces；
Step S3：Second conductive layer 13 is aligned setting, 11 side of the first conductive layer with 15 edge of the insulating layer
Edge is recessed in 13 edge of the second conductive layer and is arranged at random to form step structure；
Step S4：The part insulating layer 15 removed at the step using carbon dioxide laser technology, is etched
Hollow out makes 13 partial denudation of the second conductive layer；
Step S5：The first pad 111 is set on 11 surface of the first conductive layer, described in 15 hollow part of the insulating layer
Second pad 131 is arranged in second conductive layer surface, and first pad 111 is correspondingly arranged with second pad 131.
Step S6：The scolding tin 17 is set between first pad 111 and second pad 131, makes described first
Conductive layer 11 is electrically connected with second conductive layer 13 realization.
Compared to the prior art, in printed circuit board 10 provided by the invention, using carbon dioxide laser technology burn off
The insulating layer 15, and first pad 111 and 13 table of the second conductive layer are set on 11 surface of the first conductive layer
Face is arranged second pad 131, the scolding tin 17 connects first pad 111 and second pad 131 realize it is described
It is electrically connected between first conductive layer 11 and second conductive layer 13, substitutes and insulating layer and the first conductive layer are bored in the prior art
The step of hole, simplifies technique, cost-effective, while also improving production reliability, reduces difficulty of processing.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of printed circuit board, including：
First conductive layer；
Insulating layer, first conductive layer are set to the insulating layer side；
First pad, first pad are set to first conductive layer surface；
Second conductive layer, second conductive layer are set to the insulating layer other side；
Second pad, second pad are set to second conductive layer surface；
Scolding tin；
It is characterized in that, the removal part insulating layer keeps second conductive layer exposed, in second conductive layer exposed section
Second pad is set, and first pad makes first conductive layer and described second with second pad by the scolding tin
Conductive layer realizes electrical connection.
2. printed circuit board according to claim 1, which is characterized in that first conductive layer edge is recessed in described
Two conductive layer edges are arranged at random to form step.
3. printed circuit board according to claim 1, which is characterized in that first conductive layer and second conductive layer
It is adhered to two surface of the insulating layer by organic polymer.
4. printed circuit board according to claim 1, which is characterized in that the insulating layer be set to first conductive layer with
Between second conductive layer.
5. printed circuit board according to claim 1, which is characterized in that first conductive layer surface is provided with multiple institutes
The first pad is stated, second conductive layer surface is provided with multiple second pads.
6. printed circuit board according to claim 5, which is characterized in that multiple first pad spaced arrays are set
It sets, multiple second pad spaced array settings.
7. printed circuit board according to claim 1, which is characterized in that first conductive layer is copper foil layer, described
Two conductive layers are copper foil layers.
8. a kind of production method of printed circuit board, including：
Insulating layer is provided；
The first conductive layer is provided, first conductive layer is set to the insulating layer side；
Multiple first pads are arranged in first conductive layer surface；
The multiple first pad array setting；
The second conductive layer is provided, second conductive layer is set to the insulating layer other side；
Keep second Conductive layer portions exposed using partial insulative layer described in laser processing technology burn off；
In second Conductive layer portions exposed section, multiple second pads are set；
The multiple second pad array setting；And
First pad realizes first conductive layer and second conductive layer with second pad by the scolding tin
Electrical connection.
9. the production method of printed circuit board according to claim 8, which is characterized in that the laser processing technology includes
Carbon dioxide laser technology, YAG laser technologies and ultraviolet laser processing technology.
10. the production method of printed circuit board according to claim 8, which is characterized in that the insulating layer portion of burn off
It includes insulating substrate to divide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218108.6A CN108601210A (en) | 2018-03-16 | 2018-03-16 | Printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218108.6A CN108601210A (en) | 2018-03-16 | 2018-03-16 | Printed circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108601210A true CN108601210A (en) | 2018-09-28 |
Family
ID=63626573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810218108.6A Pending CN108601210A (en) | 2018-03-16 | 2018-03-16 | Printed circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108601210A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501663B1 (en) * | 2000-02-28 | 2002-12-31 | Hewlett Packard Company | Three-dimensional interconnect system |
| TWM397596U (en) * | 2010-03-22 | 2011-02-01 | Mao Bang Electronic Co Ltd | Integrated circuit chip card |
| CN107567206A (en) * | 2017-08-11 | 2018-01-09 | 沈雪芳 | Double-side conduction construction processing method, linear circuit plate processing method and line source |
-
2018
- 2018-03-16 CN CN201810218108.6A patent/CN108601210A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501663B1 (en) * | 2000-02-28 | 2002-12-31 | Hewlett Packard Company | Three-dimensional interconnect system |
| TWM397596U (en) * | 2010-03-22 | 2011-02-01 | Mao Bang Electronic Co Ltd | Integrated circuit chip card |
| CN107567206A (en) * | 2017-08-11 | 2018-01-09 | 沈雪芳 | Double-side conduction construction processing method, linear circuit plate processing method and line source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190816 Address after: 516000 Dongjiang Hi-tech Industrial Park, Zhongkai Hi-tech Zone, Huizhou City, Guangdong Province, No. 3, Xingping West Road Applicant after: Huizhou Over-Frequency Sanquan Intelligent Lighting Technology Co., Ltd. Address before: 528437 One of the Second Bottom Floors of Qiwan Sha, Qiwan Road, East District, Zhongshan City, Guangdong Province Applicant before: Shen Xuefang |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180928 |
|
| RJ01 | Rejection of invention patent application after publication |