CN101959376A - The manufacture method of multilayer flexible printed wiring plate and multilayer circuit basis material - Google Patents
The manufacture method of multilayer flexible printed wiring plate and multilayer circuit basis material Download PDFInfo
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- CN101959376A CN101959376A CN2010101973772A CN201010197377A CN101959376A CN 101959376 A CN101959376 A CN 101959376A CN 2010101973772 A CN2010101973772 A CN 2010101973772A CN 201010197377 A CN201010197377 A CN 201010197377A CN 101959376 A CN101959376 A CN 101959376A
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Abstract
The invention provides can carry out the lift-launch of thin space CSP and possess outer circuit, internal layer circuit can form fine circuitry the pliability cable multilayer flexible printed wiring plate manufacture method and be used for the multilayer circuit basis material of this multilayer flexible printed wiring plate.In manufacture method, prepare double-side type copper-surfaced plywood, be formed on the outer layer side of this copper-surfaced plywood and internal layer side with cathode copper plating method and have the outer layer side of the opening that via uses and the copper coating of internal layer side respectively, so that the thickness of internal layer side copper coating becomes 2 to 3 times of the outer layer side copper coating, on internal layer side copper coating, form cover layer (11) and as from outer field stacked basis material (12).On the other hand, preparation has the wiring basis material (8) of at least 1 wiring layer, again that stacked basis material is stacked and form multilayer circuit basis material (15), carry out laser processing formation conducting by first and second opening unification of this multilayer circuit basis material and use hole (16,17), conduction processing and electrolysis are plated and are formed through hole (16b, 17b).In this manufacture method, use the multilayer circuit basis material.
Description
Technical field
The present invention relates to the manufacturing technology of multilayer flexible printed wiring plate, but relate in particular to pliability cable (cable) portion with high-density installation multilayer flexible printed wiring plate manufacture method and be used for the multilayer circuit basis material of this multilayer flexible printed wiring plate.
Background technology
In recent years, more and more promote the miniaturization and the multifunction of electronic equipment, therefore the densification for circuit substrate requires also more and more higher.Therefore, by circuit substrate is made Mulitilayer circuit boards two-sided or more than three layers from single face, seek the densification of circuit substrate.
As the one ring, flexible distributing board, flexible flat cable and the connector by another body waits the Mulitilayer circuit board of the various electronic units of connection or hard circuit substrate each other.
Moreover, be the center with the miniaturized electronics of portable phone etc., the multilayer flexible wiring plate (patent documentation 1 (the 4th page, the 5th figure)) with incorporate pliability cable such as flexible distributing board with this another body portion is widely used.
Especially, the multifunction of portable phone is more obvious, multifunction along with portable phone, have such flow process: the parts that are installed to multilayer flexible wiring plate also are replaced by CSP (ChipSize Package: wafer-level package), to reach high function and to encapsulate to high-density, do not increase substrate size and additional high function.The solder pad space length of this CSP is the 0.8mm spacing also originally, but begins the following thin space of requirement 0.5mm spacing in recent years.
Therein, carry have 10 pads * pad of the CSP of the above pad number of 10 pads is with the thin space CSP that full grating array (full grid) mode disposes, and is unusual difficulty in the former multilayer flexible wiring plate.
Necessary condition aspect multilayer flexible wiring plate carrying narrow space length CSP is as follows.
(a) there is not through hole at the CSP installation base.
Be for the required scolding tin of installation is not flowed.
(b) can be with the conducting portion arranged in high density.
Owing to the wiring layer that is directly connected to the below from thin space CSP installation base, so desired minimum spacing need become the spacing identical with the solder pad space length of the CSP that is carried.
(c) can form forming fine wiring.
This is because no matter be skin or internal layer, all need from the cause of the more pad cabling more than 100.In addition, the bar number of the wiring of cabling is the key factor of the specification of the decision CSP that can carry between the CSP installation base.
Particularly, when carrying CSP, be that the wiring than the internal layer below the outer field wiring that is present in the CSP installation base is more become more meticulous than effective method.But,, need form spacing 60 μ m (minimum clearance between pattern: 30 μ m) in the needed outer circuit pattern-pitch in this equipped section carrying under the situation of CSP with the thin space below the 0.4mm spacing.
With these manufacture method and structures that requires to satisfy multilayer flexible printed wiring plate to a certain degree, be disclosed in the patent documentation 2 (the 18th page, the 5th figure).The feature of the invention that will put down in writing in this patent documentation 2 is listed below: the through hole that the conducting by once is provided for connecting the ground floor and the second layer with the formation and the plating in hole, be used to be connected ground floor, the second layer, the 3rd layer scalariform through hole (step via holl), be used to connect jump (skip) through hole of ground floor and the 3rd layer.Thus, can satisfy the above-mentioned condition for lift-launch CSP: (1) does not have through hole at the CSP installation base; (2) can be with the conducting portion arranged in high density.
Fig. 2 illustrates the technology contents that launches the method that patent documentation 2 put down in writing, be to represent for the internal layer circuit pattern that further becomes more meticulous, and the sectional structure chart of the execution mode of the manufacture method of 4 layers of flexible printing wiring board with cable portion of combination half interpolation (semi-additive) method.
At first, shown in Fig. 2 (1), prepare to have the conductive metal paper tinsel 32 of copper, nickel, chromium or their alloy etc. about thickness 1 μ m and 33 double-sided circuit basis material 34 on pliability dielectric base material 31 two sides of polyimides etc.For this basis material, form resist layer 35 on the two sides, this resist layer 35 is used to utilize semi-additive process to form conformal mask (conformal mask) and circuit pattern that laser adds man-hour.
Then, as partly adding the plating resist, to conductive metal paper tinsel 32 and 33 energisings and carry out the cathode copper plating, make the copper coating 36 of the face that is positioned at an outer side, the copper coating 37 that is positioned at the face of internal layer one side form the thickness of about 10 μ m respectively resist layer 35.
Then shown in Fig. 2 (2), peel off resist layer 35, and conductive metal paper tinsel 32 and 33 etchings are removed, copper coating 36 and 37 is made electrically independently circuit pattern 36b and 37b.In addition, circuit pattern 36b becomes the conformal mask that laser adds man-hour.By operation so far, obtain two-sided wiring basis material 38.
Then as Fig. 2 (3) shown in, preparation has the so-called cover layer (cover lay) 41 of the adhesives 40 of allyl resin/epoxy resin etc. on polyimide film 39.Formed internal layer one side of the wiring basis material 38 of pattern on the two sides, waited the cover layer 41 of fitting by vacuum press, vacuum lamination apparatus.
By operation so far, obtain being with tectal enhancing (built-up) layer 42.Moreover, prepare another group by same operation and be with tectal enhancement layer 43.
Then, utilize metal pattern to wait adhesives 44 to strike out the regulation shape with the stacked usefulness of epoxy resin etc.The space that is stamped is corresponding with the position that is equivalent to flexual cable portion.The position of alignment enhancement layer 42, adhesives 44, enhancement layer 43, it is stacked to utilize vacuum press to wait them.By operation so far, obtain the multilayer circuit basis material 45 after stacked.
Then, shown in Fig. 2 (4), utilize conformal mask 36b, the decontaminate (desmear) of carrying out laser processing and plasma etc. is handled the conducting that is formed for connecting each interlayer and is used the hole, carry out the electrolysis plating and obtain interlayer conduction, make each through hole 46, scalariform through hole 47, jump through hole 48.And, form outer patterns 49 by common photo-fabrication.
Then, as required, substrate surface is implemented plating scolding tin, nickel plating, gold-plated etc. surface treatment, form photoresistance solder flux (photo solder resist) layer, utilize silver paste, film etc. to form screen, obtain having 4 layers of flexible printing wiring board 50 of cable through implementing sharp processing in skin one side of cable.
Patent documentation 1: No. the 2631287th, Japan's special permission
Patent documentation 2: TOHKEMY 2007-128970 communique
Summary of the invention
The internal layer circuit pattern of the multilayer flexible printed wiring plate of making by above-mentioned worker's method can form fine circuitry.
But the conductor thickness of outer circuit pattern becomes about 30 μ m.Therefore, being difficult to form the following required outer circuit pattern-pitch in thin space CSP equipped section of 0.4mm spacing is below the spacing 80 μ m (minimum clearance 40 μ m between pattern).
Therefore, be difficult to substrate etc., to possess the pliability cable as portable phone, and at a low price and stably make the multilayer flexible printed wiring plate of carrying narrow space length CSP.
The present invention has considered that the design of above-mentioned aspect forms, but its purpose be to provide carrying narrow space length CSP and possess outer circuit, internal layer circuit can form fine circuitry the pliability cable multilayer flexible printed wiring plate manufacture method and be used for the multilayer circuit basis material of this multilayer flexible printed wiring plate.
In order to reach above-mentioned purpose, the application provides following manufacture method and is used for the multilayer circuit basis material of this method.
At first manufacture method is the manufacture method with multilayer flexible printed wiring plate of cable portion, it is characterized in that, comprising:
A) preparation has the operation of the double-side type copper-surfaced plywood of metallic film on the two sides of pliability dielectric base material;
B) utilizing with described metallic film is that the conducting of the cathode copper plating method of the Seed Layer outer layer side that is formed on described copper-surfaced plywood has the outer layer side copper coating of first opening and has second opening with the formation position in hole and thickness is the operation of 2 to 3 times internal layer side copper coating of described outer layer side copper coating in the conducting of the internal layer side of described copper-surfaced plywood with the formation position in hole;
C) on described internal layer side copper coating, form cover layer and as operation from outer field stacked basis material;
D) preparation has the operation of the wiring basis material of 1 wiring layer at least;
E) make the described tectal side that forms described stacked basis material wiring layer one side, be laminated to described wiring basis material and form the operation of multilayer circuit basis material across adhesives towards described wiring basis material;
F) described first opening to described multilayer circuit basis material carries out laser processing and forms the operation of conducting with the hole;
G) by described first and second opening to described multilayer circuit basis material unification carry out conducting that laser processes the interlayer that is formed for the described multilayer circuit basis material of conducting operation with the hole; And
H) described conducting is plated and the operation of formation through hole with hole conduction processing and electrolysis.
In addition, the multilayer circuit basis material is that wiring layer one side at the wiring basis material with at least 1 wiring layer is across the stacked stacked basis material with at least 2 layers of cover layer, and come the multilayer circuit basis material that forms between articulamentum by through hole, it is characterized in that:
In described stacked basis material, each face in the two-sided copper-surfaced plywood forms by copper coating,
The copper coating that becomes the face of internal layer when stacked has 2 to 3 times the thickness that becomes outer field copper coating.
(invention effect)
By these features, the present invention has following effect.
Multilayer flexible printed wiring plate of the present invention, the two sides had the two-sided copper-surfaced plywood of metallic film, when utilizing semi-additive process to form laser to add the conformal mask in man-hour and circuit pattern, by making the thinner thickness of copper coating that laser adds the conformal mask face in man-hour that becomes that is positioned at an outer side, and the thickness of the copper coating that becomes the circuit pattern face that is positioned at internal layer one side is thicker, can guarantee internal layer circuit pattern current capacity or can access rigidity as the degree of handling (handling) of the circuit basis material on two sides.
And, the thickness that is used to obtain the outer contact behind the outer plating of interlayer conduction can be suppressed to irreducible minimum, therefore but not only can in utilizing the internal layer circuit pattern of semi-additive process, form the fine circuitry of the CSP of carrying narrow space length, but and in outer circuit pattern, also can form the fine circuitry of the CSP of carrying narrow space length.
Description of drawings
Figure 1A to Fig. 1 C is the notion sectional structure chart of the manufacturing process of expression 4 layers of flexible printing wiring board with cable portion of the present invention.
Fig. 2 is the notion sectional structure chart of expression by the manufacturing process of 4 layers of flexible printing wiring board with cable portion of existing worker's method.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.
Figure 1A to Fig. 1 C is the sectional structure chart of expression wiring board manufacturing method of the present invention.
At first, shown in Figure 1A (1), prepare pliability dielectric base material 1 (at this, the polyimides of thickness 12.5 μ m) two sides, have the copper film 2 of 0.3 μ m thickness and 3 double-sided circuit basis material 4 at polyimides etc.
The thickness of this copper film is preferably the thickness of 0.1～0.5 μ m.When being thinner than 0.1 μ m, be easy to generate the film defective of pin hole (pin hole) etc., the formation of the circuit pattern of back is had a negative impact at copper foil membrane.
In addition, when being thicker than 0.5 μ m, by this copper foil membrane is formed circuit pattern as the semi-additive process of seed (seed) layer, when removing Seed Layer then, owing to remove,, might damage the stability of shape etc. so that the film of circuit pattern reduces is more by each circuit pattern etching, perhaps the etching operation burden of removing is bigger, also productivity is had a negative impact.For this basis material, form resist layer 5 on the two sides, this resist layer 5 is used for forming conformal mask and the circuit pattern that laser adds man-hour by semi-additive process.
Then as Figure 1A (2) shown in, with resist layer 5 as partly adding the plating resist, to Copper Foil 2 and 3 energisings and carry out cathode copper and plate.At this moment, be positioned at the thinner thickness of copper coating 6 of the face of an outer side, and it is thicker to be positioned at the thickness of copper coating 7 of face of internal layer one side.
Make the thickness of the copper coating on two sides become different thickness arbitrarily, need only the current value that applies when complying with each single face control cathode copper plating.Particularly, (roll toroll) adds man-hour with the volume to volume operation, the copper plating appts of usage level conveying-type.
As the device specification, selecting the anode of copper plating device needs the separately system of rectifier, can individually control the current value of anode up and down from the device that the mode of the clamping up and down of roller (roll) material disposes.
Thereby, can carry out Optimal Control to copper-plated thickness by above-mentioned.Copper coating 6, i.e. the thickness of outer layer side copper coating works in the shadow mask that is considered as when forming conducting with the hole by laser, and makes and carry out being decided to be 5 μ m under the situation that the total conductor thickness behind the outer plating approaches.
For the function of the shadow mask that plays laser, under the situation of using the high carbonic acid gas laser of productivity, preferably have the above copper thickness of 3 μ m, from reducing the viewpoint of above-mentioned total conductor thickness, be preferably the following copper thickness of 7 μ m.
On the other hand, play the function of shadow mask when consideration forms conducting with the hole by laser, and make the current capacity of internal layer circuit or conductor resistance value become suitable situation, copper coating 7 is that the thickness of internal layer side copper coating is decided to be 10 μ m.But, consider the roughened etc. of back and copper thickness is as thin as the situation of about 0.5～1 μ m, the copper thickness of wiring becomes about 9 μ m.If such thickness and width are the circuit about 30 μ m, therefore the electric current about 500mA of then can switching on can guarantee current capacity under the situation that does not influence fineness.
And, under the situation of the design rule that does not change wiring, realize high current capacity, can deal with by the thickness that increases internal layer side copper coating 7.But, when copper thickness surpasses 18 μ m, being difficult to form subtly half and adding the plating resist of usefulness, infringement is suitable for the advantage of semi-additive process.
Moreover, the thickness of internal layer side coating 7 becomes more than 3 times with respect to the ratio of the thickness of outer layer side coating 6, even carry out the current value control of cathode copper plating, because from electric current the spreading to outer layer side of the high electric current side of internal layer, be difficult to carry out THICKNESS CONTROL, therefore be difficult to be suitable for semi-additive process.Thus, the thickness of internal layer side copper coating 7 can be 1 pair 2 to 1 pairs 3 with respect to the relation of the thickness of outer layer side copper coating 6 by comparing.
Then shown in Figure 1A (3), peel off resist layer 5, the Copper Foil 2 of eliminating the part of resist layer 5 becomes the state that exposes.
Then shown in Figure 1A (4), Copper Foil 2 and 3 etchings are removed, removed the Copper Foil 2,3 that is connected to each other outer layer side copper coating 6 and internal layer side copper coating 7.Thereby,, make electrically independently circuit pattern 6b and circuit pattern 7b with outer layer side copper coating 6 and internal layer side copper coating 7 electrical isolation.
At this, circuit pattern 6b becomes the conformal mask that laser adds man-hour.When Copper Foil 2 and 3 etchings are removed, use roughened liquid, thereby be used to improve the roughened of the dhering strength of internal layer simultaneously with etching.
As the roughened liquid that Copper Foil is had etch effect, there is weak former electricity to produce NEOBURAUNPROCESS (ネ ォ Block ラ ゥ Application プ ロ セ ス) the NBD series that (strain) makes, carry out the etching of about 0.5～1 μ m by using it, Copper Foil 2 and 3 etchings are removed.Because use semi-additive process, internal layer circuit can be formed into about pattern-pitch 30 μ m.By operation so far, obtain two-sided wiring basis material 8.
At this, in the processing of the Seed Layer of using when forming the double-sided circuit basis material by semi-additive process, it is that the metallic film of main component is the roughened of removing of Seed Layer and circuit pattern that soup that can enough acidity is unified to handle with copper.
Its result has shortened operation, and can the management that comprise soup condition in each operation etc. is unified, can make multilayer flexible printed wiring plate than the low price that flows in another operation.
Thus, can be at a low price and stably provide can carrying narrow space length CSP and outer circuit, internal layer circuit can form multilayer flexible printed wiring plate fine circuitry, that possess the pliability cable.
Moreover, shown in Figure 1B (5), prepare to have on the polyimide film 9 of 12 μ m thickness for example the cover layer 11 of adhesives 10 of allyl resin/epoxy resin etc. of thickness 10 μ m.Form internal layer one side of the wiring basis material 8 of pattern on the two sides, utilize vacuum press, vacuum lamination apparatus to wait the cover layer 11 of fitting.By operation so far, obtain being with tectal enhancement layer 12.
Then, shown in Figure 1B (6), the same operation of utilization and above-mentioned Figure 1A (1)～Figure 1B (5) is prepared another group and is with tectal enhancement layer 13.
Then, utilize metal die type etc., the adhesives 14 of the stacked usefulness of epoxy resin of thickness 10 μ m etc. is stamped into the regulation shape.Space after the punching press, corresponding with the position that is equivalent to flexual cable portion.The position of alignment enhancement layer 12, adhesives 14, enhancement layer 13.
Then, shown in Figure 1B (7), utilize enhancement layer 12, adhesives 14, enhancement layer 13 after vacuum press waits stacked aligned position.By operation so far, obtain stacked multilayer circuit basis material 15.The Copper Foil on multilayer circuit basis material 15 surfaces (conformal mask 6b) when stacked because of oxidation and the variable color of being heated.
Therefore, might add at the laser of back and take place man-hour to guide identification bad, copper face be exposed about 0.5～1 μ m of surperficial Copper Foil etching.In addition, in the above-mentioned roughened, use under the situation of carbonic acid gas laser, improve the absorption of laser, because of the easy melting copper of heat accumulation effect.For anti-situation here, also preferably carry out the etching of surperficial Copper Foil.
Then, shown in Fig. 1 C (8), utilize conformal mask 6b, carry out the decontaminate of laser processing and plasma etc. and handle, be formed for connecting the conducting usefulness hole 16,17,18 of each interlayer.
In laser processing, can select UV-YAG laser, carbonic acid gas laser, excimer laser etc.At this, adopt the high carbonic acid gas laser of productivity.At this moment, the copper thickness of conformal mask 6b is about 3 to 4 μ m, carries out laser with stronger energy and adds Copper Foil fusing in man-hour, therefore should be noted that.
Under the situation of carbonic acid gas laser, shorten pulsewidth, must under the less condition of the energy of each emission, process.As processing mode, from reducing the aspect of pyrolytic damage, the preferred cyclic process of once repeatedly processing in every emission with the hole for a plurality of conductings of Current Zone (galvano area), rather than carry out the pulse train processing of a plurality of emissions processing continuously with the hole for same conducting.
As processing conditions, preferably process in the scope of pulsewidth 5～10 μ sec, energy 5～10mJ, in the case, the influence of being heated is less, can process before and after 5 emissions with the hole each conducting under the situation that above-mentioned material constitutes.
Then, shown in Fig. 1 C (9), carry out electrolysis plating about 10～15 μ m with the multilayer circuit basis material 15 in hole 16,17,18, obtain interlayer conduction, make each through hole 16b, scalariform through hole 17b, jump through hole 18b having conducting.
Because the thickness of the resin between attenuated layer is even the thickness of coating of above-mentioned degree also can fully be guaranteed the reliability that interlayer connects.As the interlayer ways of connecting, also can select the mode of utilizing through hole by NC drilling processing etc.
Then, shown in Fig. 1 C (10), utilize common photo-fabrication to form outer patterns 19.Conductive metal paper tinsel 2 also can be removed by the etching of common copper chloride or iron chloride.Because outer field conductor thickness is below the 15 μ m, can form the fine pattern about spacing 60 μ m (minimum clearance 30 μ m between pattern).
Then, as required, substrate surface is implemented plating scolding tin, nickel plating, gold-plated etc. surface treatment, form the photoresistance welding flux layer, utilize silver paste, film to wait the screen that forms at the outer layer side of cable, implement sharp processing and obtain having 4 layers of flexible printing wiring board 20 of cable.
Description of reference numerals
1 pliability dielectric base material; 2,3 Copper Foils; 4 double-sided circuit matrix materials; 5 resist layers; 6,7 copper coatings; 6b, 7b circuit pattern; 8 wiring matrix materials; 9 polyimide films; 10 adhesives; 11 cover layers; 12,13 enhancement layers; 14 adhesives; 15 multilayer circuit matrix materials; 16,17,18 pass through universal hole; The 16b through hole; 17b scalariform through hole; 18b jump through hole; 19 outer patterns; 20 have 4 layers of flexible printing wiring board of cable section; 31 pliability dielectric base materials; 32,33 Copper Foils; 34 double-sided circuit matrix materials; 35 resist layers; 36,37 copper coatings; 36b, 37b circuit pattern; 38 wiring matrix materials; 39 polyimide films; 40 adhesives; 41 cover layers; 42,43 enhancement layers; 44 adhesives; 45 multilayer circuit matrix materials; 46 through holes; 47 scalariform through holes; 48 jump through holes; 49 outer patterns; 50 have 4 layers of flexible printing wiring board of cable section.
Claims (6)
1. the manufacture method with multilayer flexible printed wiring plate of cable portion is characterized in that, comprising:
A) preparation has the operation of the double-side type copper-surfaced plywood of metallic film on the two sides of pliability dielectric base material;
B) utilizing with described metallic film is that the conducting of the cathode copper plating method of the Seed Layer outer layer side that is formed on described copper-surfaced plywood has the outer layer side copper coating of first opening and has second opening with the formation position in hole and thickness is the operation of 2 to 3 times internal layer side copper coating of described outer layer side copper coating in the conducting of the internal layer side of described copper-surfaced plywood with the formation position in hole;
C) on described internal layer side copper coating, form cover layer and as operation from outer field stacked basis material;
D) preparation has the operation of the wiring basis material of 1 wiring layer at least;
E) make the described tectal side that forms described stacked basis material wiring layer one side, be laminated to described wiring basis material and form the operation of multilayer circuit basis material across adhesives towards described wiring basis material;
F) described first opening to described multilayer circuit basis material carries out laser processing and forms the operation of conducting with the hole;
G) by described first and second opening to described multilayer circuit basis material unification carry out conducting that laser processes the interlayer that is formed for the described multilayer circuit basis material of conducting operation with the hole; And
H) described conducting is plated and the operation of formation through hole with hole conduction processing and electrolysis.
2. the manufacture method with multilayer flexible printed wiring plate of cable portion as claimed in claim 1, it is characterized in that: the metallic film of described copper-surfaced plywood is main component with copper, utilize acid same soup unify to carry out removing of described metallic film and at described operation b) in the surface roughening processing of the circuit pattern that forms.
3. the manufacture method with multilayer flexible printed wiring plate of cable portion as claimed in claim 1 is characterized in that: the thickness of the metallic film of described copper-surfaced plywood is 0.1～0.5 μ m.
4. the manufacture method with multilayer flexible printed wiring plate of cable portion as claimed in claim 1 is characterized in that: the thickness of described outer layer side copper coating is 3～7 μ m, and the thickness of described internal layer side copper coating is 9～18 μ m.
5. multilayer circuit basis material, and comes to form between articulamentum by through hole across the stacked stacked basis material with at least 2 layers of cover layer in wiring layer one side of the wiring basis material with at least 1 wiring layer, it is characterized in that:
In described stacked basis material, each face in the two-sided copper-surfaced plywood forms by copper coating,
The copper coating that becomes the face of internal layer when stacked has 2 to 3 times the thickness that becomes outer field copper coating.
6. multilayer circuit basis material as claimed in claim 5 is characterized in that: the thickness that becomes described outer field copper coating is 3～7 μ m, and the thickness that becomes the copper coating of described internal layer is 9～18 μ m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-126726 | 2009-05-26 | ||
| JP2009126726A JP2010278067A (en) | 2009-05-26 | 2009-05-26 | Method of manufacturing multilayer flexible printed circuit board, and multilayer circuit base material |
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| Publication Number | Publication Date |
|---|---|
| CN101959376A true CN101959376A (en) | 2011-01-26 |
| CN101959376B CN101959376B (en) | 2016-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010197377.2A Active CN101959376B (en) | 2009-05-26 | 2010-05-26 | The manufacture method of multilayer flexible printed wiring plate |
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|---|---|
| JP (1) | JP2010278067A (en) |
| CN (1) | CN101959376B (en) |
| TW (1) | TWI459879B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768242A (en) * | 2014-01-06 | 2015-07-08 | 黄伟聪 | Heating cloth using flexible thick film heating unit and cloth making method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013074270A (en) * | 2011-09-29 | 2013-04-22 | Nec Toppan Circuit Solutions Inc | Manufacturing method of rigid flexible printed wiring board |
| EP2765163A1 (en) * | 2013-02-12 | 2014-08-13 | Solvay Specialty Polymers USA, LLC. | Mobile electronic device |
| WO2015141004A1 (en) * | 2014-03-20 | 2015-09-24 | 富士通株式会社 | Multilayer circuit board, semiconductor device, and multilayer circuit board manufacturing method |
| TWI566659B (en) * | 2014-09-18 | 2017-01-11 | 矽品精密工業股份有限公司 | Package substrate and method of manufacture |
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|---|---|---|---|---|
| JPH08148828A (en) * | 1994-11-18 | 1996-06-07 | Hitachi Ltd | Thin film multilayered circuit board and its manufacture |
| JP2001189548A (en) * | 1999-12-28 | 2001-07-10 | Tdk Corp | Method of manufacturing substrate for electronic part |
| JP2006210492A (en) * | 2005-01-26 | 2006-08-10 | Hitachi Chem Co Ltd | Method of manufacturing printed wiring board |
| CN1972571A (en) * | 2005-11-01 | 2007-05-30 | 日本梅克特隆株式会社 | Method for manufacturing multilayer wiring substrate with cable |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002289743A (en) * | 2001-03-28 | 2002-10-04 | Cmk Corp | Non-through hole printed wiring board and its manufacturing method |
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2009
- 2009-05-26 JP JP2009126726A patent/JP2010278067A/en active Pending
-
2010
- 2010-03-30 TW TW99109652A patent/TWI459879B/en active
- 2010-05-26 CN CN201010197377.2A patent/CN101959376B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148828A (en) * | 1994-11-18 | 1996-06-07 | Hitachi Ltd | Thin film multilayered circuit board and its manufacture |
| JP2001189548A (en) * | 1999-12-28 | 2001-07-10 | Tdk Corp | Method of manufacturing substrate for electronic part |
| JP2006210492A (en) * | 2005-01-26 | 2006-08-10 | Hitachi Chem Co Ltd | Method of manufacturing printed wiring board |
| CN1972571A (en) * | 2005-11-01 | 2007-05-30 | 日本梅克特隆株式会社 | Method for manufacturing multilayer wiring substrate with cable |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768242A (en) * | 2014-01-06 | 2015-07-08 | 黄伟聪 | Heating cloth using flexible thick film heating unit and cloth making method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010278067A (en) | 2010-12-09 |
| TW201112908A (en) | 2011-04-01 |
| TWI459879B (en) | 2014-11-01 |
| CN101959376B (en) | 2016-01-13 |
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