CN108601206A - A kind of embedding aluminium nitride PCB substrate and preparation method thereof - Google Patents
A kind of embedding aluminium nitride PCB substrate and preparation method thereof Download PDFInfo
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- CN108601206A CN108601206A CN201810589756.2A CN201810589756A CN108601206A CN 108601206 A CN108601206 A CN 108601206A CN 201810589756 A CN201810589756 A CN 201810589756A CN 108601206 A CN108601206 A CN 108601206A
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- aluminium nitride
- aluminium block
- nitridation
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- storage tank
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of embedding aluminium nitride PCB substrates comprising rigid substrates, rigid substrates offer storage tank, nitridation aluminium block are provided in storage tank, and the top and bottom for nitrogenizing aluminium block have been sequentially arranged conductive layer and copper plate along the direction far from the nitridation aluminium block.Since nitridation aluminium block has high thermal conductivity, low-k, low-dielectric loss, excellent electrical insulating property, significantly improve the heat dissipation performance of rigid substrates, the aluminium nitride substrate not titaniferous, the step of saving except titanium, the production process of substrate is shortened, while also avoiding the environmental problem caused by except titanium liquid medicine.Also disclose a kind of method making embedding aluminium nitride PCB substrate, Precision of Laser Cutting and efficient.Nitridation aluminium block insertion processing is carried out in such a way that manipulator captures nitridation aluminium block automatically and is positioned over storage tank, compared with conventional manual loading or unloading operation, processing efficiency is obviously improved, and is also avoided operating personnel and is in direct contact nitridation aluminium block, pollution nitridation aluminium block, reduces quality hidden danger.
Description
Technical field
The invention belongs to printed circuit board production technical fields, relate in particular to a kind of printed circuit board of embedding aluminium nitride
Substrate and preparation method thereof.
Background technology
With the high speed development of integrated technology and microelectronic packaging technology, the overall power density of electronic component constantly increases
It is long, and the physical size of electronic component and electronic equipment is gradually tending to small-sized, micromation, the heat that electronic component generates
The rapid accumulation of amount, causes the heat flow density near integrated device to increase, forms hot environment, and temperature is excessively high so that electronics member device
Part and the performance and used life of equipment reduce.For providing fixed, assembly mechanical support for electronic component, realizing electronics
The heat dissipation performance for the printed circuit board being electrically connected between component influences the quality of electronic component great.
At present for the heat dissipation effect of raising printed circuit board, the side that generally use metallic heat radiating plate is combined with printed circuit board
The circuit board material of method, most high-power hydrid integrated circuits is generally AL2O3It is ceramic with BeO, but AL2O3Substrate
Thermal conductivity is low, coefficient of thermal expansion is less matched with Si；Although BeO has excellent comprehensive performance, it is with higher production
Cost and the disadvantage of severe toxicity limit its application.Therefore consider from factors such as performance, cost and environmental protection, the two cannot
Meet development and the demand of hyundai electronics power device.
Aluminium nitride (AIN) is the new material that developed recently gets up, its high temperature resistant is anticorrosive, and thermal conductivity is good, thermally expands system
Number is low, has very high thermal shock resistance, and have high electrical insulating property, thus as good integrated circuit substrate material and electronics member
The encapsulating material of part, FR4 rigid substrates insertion aluminium nitride belong to the starting stage in industry, and this kind of product is mostly used for high-power photograph
Bright equipment uses, such as car light, projection lamp, will gradually develop into the optimal selection mode of high power small size heat dissipation.At present
There are a small number of printed circuit board manufacturers to increase aln structure in printed circuit board, but traditional aluminium nitride material generally contains
Titanium, while being that aluminium nitride is embedded in FR4 rigid substrates using manual hand manipulation, low production efficiency, there are quality hidden danger, separately
External demand using except titanium liquid medicine handle except titanium, and except hydrogen fluoride is contained in titanium liquid medicine, environmental pollution is serious；There is also aluminium nitride
It is larger with FR4 difference in thickness, cause aluminium nitride position to occur being recessed or the problem of pressure break.
Invention content
For this purpose, the present invention exactly will solve above-mentioned technical problem, to propose that a kind of production efficiency is high, pollution-free, product
High-quality embedding aluminium nitride PCB substrate and preparation method thereof.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of embedding aluminium nitride PCB substrate comprising rigid substrates, the rigid substrates offer accommodating
Slot is provided with nitridation aluminium block in the storage tank, and the top and bottom of the nitridation aluminium block are along the side far from the nitridation aluminium block
To being sequentially arranged conductive layer and copper plate.
Preferably, the conductive layer is black holes liquid layer or conductive polymer polymeric layer, thickness is 0.3-0.8 μm.
Preferably, the thickness of coated copper layer is 10-35 μm.
Preferably, the difference in height of the nitridation aluminium block top surface and the rigid substrates top surface is not more than 20 μm, the nitrogen
The side wall spacing for changing aluminium block and storage tank is 50-100 μm.
The present invention also provides a kind of methods making the embedding aluminium nitride PCB substrate comprising following steps：
S1, aluminium nitride substrate is provided, aluminium nitride substrate is done into surface activation process；
S2, conductive layer, copper plate are sequentially prepared in alumina base plate surface；
S3, by the nitridation aluminium block of step S2 treated aluminium nitride substrate is cut into pre-set dimensions；
S4, rigid substrates are made, storage tank is opened in core material, prepreg predeterminated position first, then by internal layer core
Plate and prepreg pre- folded and riveted in order, obtain semi-finished product substrate；
S5, the nitridation aluminium block is positioned in storage tank automatically, is pressed, obtains embedding aluminium nitride printed circuit board.
Preferably, further including being pasted in the semi-finished product base plate bottom and pressing high tempreture tape after the step S4
Step.
It makes and is cut by laser preferably, the step S3 includes the steps that cutting line, first according to default cutting shape
Shape and size paste dry film in aluminum-nitride-based plate surface, and cutting line is made after handling through exposure and development, and etching removes at cutting line
Copper after be cut by laser along the cutting line.
Preferably, the cutting line width is 0.1-0.4mm；Lead to N during the laser cutting2Or He.
Preferably, surface activation process is specially in the step S1：Using H2、N2Mixed gas or H2, He it is mixed
It closes gas and plasma activation processing, processing time 15-30min is carried out to aluminium nitride substrate.
Preferably, the conductive layer is to be prepared in the aluminium nitride after activation by blank hole liquid or conductive polymer polymer
Substrate surface；The copper plate is prepared by electroplating technology.
The above technical solution of the present invention has the following advantages over the prior art：
(1) embedding aluminium nitride PCB substrate of the present invention comprising rigid substrates, the rigid substrates offer accommodating
Slot is provided with nitridation aluminium block in the storage tank, and the top and bottom of the nitridation aluminium block are along the side far from the nitridation aluminium block
To being sequentially arranged conductive layer and copper plate.Since nitridation aluminium block has high thermal conductivity, low-k, low-dielectric loss, excellent
Good electrical insulating property significantly improves the heat dissipation performance of rigid substrates, and the aluminium nitride substrate not titaniferous saves the step except titanium
Suddenly, the production process of substrate is shortened, while also avoiding the environmental problem caused by except titanium liquid medicine.Nitridation aluminium block surface is also set
It is equipped with conductive layer and copper plate, the effect of wherein conductive layer is to deposit one layer of conductive material in the aln surface of insulation will pass through
The mode of plating makes copper plate in aln surface, and copper plate plays the role of being to make figure on nitridation aluminium block.
(2) embedding aluminium nitride PCB substrate of the present invention, the height of nitridation the aluminium block top surface and the rigid substrates top surface
Degree difference is not more than 20 μm, and the aluminium block and the side wall spacing of storage tank of nitrogenizing is 50-100 μm, nitridation aluminium block and storage tank size
It is moderate, it is therefore prevented that in bonding processes because nitrogenize aluminium block and substrate surface height difference it is excessive caused by be recessed or the problem of pressure break, and
Nitridation the distance between aluminium block and accommodating groove sidewall can ensure that nitridation aluminium block insertion is easy, position is correct, and gummosis can after pressing
It is filled into the gap between aluminium nitride and storage tank.
(3) method of the present invention for making the embedding aluminium nitride PCB substrate, makes aluminium nitride by activation process first
Surface is suitable for deposition conductive layer and copper plate, then prepares conductive layer and copper plate, improves the performance of aluminium nitride substrate, then
Aluminium nitride substrate is cut into the nitridation aluminium block of moderate dimensions, makes cutting line before etching, and the layers of copper of cutting line part is gone
It removes, it is therefore prevented that the copper at cutting line remains in cut surface, aluminium nitride two sides is made to be connected, Precision of Laser Cutting and efficient.Using
Manipulator capture automatically nitridation aluminium block and be positioned over storage tank mode carry out nitridation aluminium block insertion processing, picked and placeed with conventional manual
Operation is compared, and processing efficiency is obviously improved, and is also avoided operating personnel and is in direct contact nitridation aluminium block, pollution aluminium nitride
Block reduces quality hidden danger.
Description of the drawings
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the schematic cross-section of the embedding aluminium nitride substrate described in the embodiment of the present invention；
Fig. 2 is the vertical view of the embedding aluminium nitride substrate described in the embodiment of the present invention；
Aluminium nitride substrate cutting process shows in the production method of embedding aluminium nitride PCB substrate described in Fig. 3 embodiment of the present invention
It is intended to；
Fig. 4 be the embedding aluminium nitride PCB substrate described in the embodiment of the present invention production method in paste High temperature-resistanadhesive adhesive tape signal
Figure.
Reference numeral is expressed as in figure：1- rigid substrates；2- storage tanks；3- nitrogenizes aluminium block；4- conductive layers；5- copper plates；
6- cutting lines；7- high tempreture tapes.
Specific implementation mode
Embodiment 1
The present embodiment provides a kind of embedding aluminium nitride PCB substrates, and as shown in Figs. 1-2, the embedding aluminium nitride PCB substrate includes rigid
Property substrate 1, the rigid substrates 1 are FR4 plates, offer storage tank 2 on the rigid substrates 1, are provided in the storage tank 2
Nitrogenize aluminium block 3, as shown, it is described nitridation aluminium block 3 bottom surface fitting with 2 bottom surface of storage tank, nitrogenize aluminium block 3 top surface with it is described
The apical side height difference of rigid substrates 1 is not more than 20 μm, nitrogenizes aluminium block 3 for the ease of assembling, nitridation aluminium block 3 is interior with storage tank 2
Side wall has 50 μm of spacing.
Further, the top and bottom of the nitridation aluminium block 3 have been sequentially arranged along the direction far from nitridation aluminium block 3 and have led
Electric layer 4 and copper plate 5, wherein conductive layer 4 are that blank hole liquid (graphite or charcoal blacking) is coated in leading for nitridation aluminium block 3 surface formation
Electrocoat, thickness are 0.3 μm.The copper plate 5 is by metal copper layer made from VCP plating lines, and thickness is 10 μm.
Embodiment 2
The present embodiment provides a kind of embedding aluminium nitride PCB substrates, and as shown in Figs. 1-2, the embedding aluminium nitride PCB substrate includes rigid
Property substrate 1, the rigid substrates 1 are FR4 plates, offer storage tank 2 on the rigid substrates 1, are provided in the storage tank 2
Nitrogenize aluminium block 3, as shown, it is described nitridation aluminium block 3 bottom surface fitting with 2 bottom surface of storage tank, nitrogenize aluminium block 3 top surface with it is described
The apical side height difference of rigid substrates 1 is not more than 20 μm, nitrogenizes aluminium block 3 for the ease of assembling, nitridation aluminium block 3 is interior with storage tank 2
Side wall has 100 μm of spacing.
Further, the top and bottom of the nitridation aluminium block 3 have been sequentially arranged along the direction far from nitridation aluminium block 3 and have led
Electric layer 4 and copper plate 5, wherein conductive layer 4 are that the conduction that conductive polymer polymeric layer is formed coated in 3 surface of nitridation aluminium block applies
Layer, such as gather this aniline, polythiophene conducting polymer composite, thickness is 0.8 μm.The copper plate 5 is to pass through VCP plating lines
Metal copper layer obtained, thickness are 35 μm.
Embodiment 3
The present embodiment provides a kind of embedding aluminium nitride PCB substrates, and as shown in Figs. 1-2, the embedding aluminium nitride PCB substrate includes rigid
Property substrate 1, the rigid substrates 1 are FR4 plates, offer storage tank 2 on the rigid substrates 1, are provided in the storage tank 2
Nitrogenize aluminium block 3, as shown, it is described nitridation aluminium block 3 bottom surface fitting with 2 bottom surface of storage tank, nitrogenize aluminium block 3 top surface with it is described
The apical side height difference of rigid substrates 1 is not more than 20 μm, nitrogenizes aluminium block 3 for the ease of assembling, nitridation aluminium block 3 is interior with storage tank 2
Side wall has 80 μm of spacing.
Further, the top and bottom of the nitridation aluminium block 3 have been sequentially arranged along the direction far from nitridation aluminium block 3 and have led
Electric layer 4 and copper plate 5, wherein conductive layer 4 are that blank hole liquid (graphite or charcoal blacking) is coated in leading for nitridation aluminium block 3 surface formation
Electrocoat, thickness are 0.5 μm.The copper plate 5 is by metal copper layer made from VCP plating lines, and thickness is 25 μm.
Embodiment 4
The present embodiment provides a kind of production methods making the embedding aluminium nitride PCB substrate described in embodiment 1-3 comprising such as
Lower step：
S1, the aluminium nitride substrate that a size is 250mm*300mm is provided, is handled using plasma activation method aluminum-nitride-based
Plate surface, plasma treatment gas can be H2、N2Mixed gas or H2, He mixed gas, the present embodiment use H2、He
Mixed gas carry out plasma treatment, processing time 15-30min is 20min in the present embodiment, obtains surface active
Aluminium nitride substrate.
S2, the aluminum-nitride-based plate surface progress conductive processing in surface active, are polymerize using blank hole liquid or conductive polymer
The top of the aluminium nitride substrate of object after activation, bottom surface coating prepare conductive layer 4, then use VCP plating lines in 4 table of conductive layer
One layer of copper plate 5 is electroplated in face, and copper layer thickness can need to adjust according to product.
Aluminium nitride substrate after step S2 processing, is cut into the aluminium nitride of pre-set dimension by S3, aluminium nitride substrate cutting
Block specifically includes step：
S31, cutting line 6 make, and make a dry film according to preset cutting profile and size, the dry film corresponds to cutting
Position be made as exposure region, the dry film is covered on aluminum-nitride-based plate surface, is exposed, develops, in aluminium nitride substrate
On form crisscross cutting line 6, as shown in figure 3, the width of the cutting line is 0.1-0.4mm, in the present embodiment, be
0.2mm is etched along the cutting line 6, and the layers of copper at cutting line 6 is etched away, and prevents copper in follow-up cutting process from remaining
In cut surface, aluminium nitride substrate two sides is caused to be connected.
Aluminium nitride substrate is cut by laser along cutting line 6, during cutting, cuts through by S32, laser cutting
Lead to N in journey2Or He, it prevents cut surface to be carbonized, in the present embodiment, aluminium nitride substrate is cut into the aluminium nitride of 16.1mm*7.1mm
Block 3.
S4, rigid substrates 1 are made, the rigid substrates 1 are FR4 copper-clad plates, are specifically comprised the following steps：
Copper-clad plate sawing sheet is the size of working plate by S41, sawing sheet, is 519mm*412mm, including L1- in the present embodiment
Two layers of core plate of L2/L3-L4.
S42, etching produce internal layer circuit by conventional pattern transfer, development, etching.
S43, drilling drill out the location hole of gong plate needs.
S44, gong plate need the position of embedded aluminium nitride to open storage tank 2 on rigid core plate, in this implementation, size of slotting
For 16.2mm*7.2mm.
S45, brown handle the layers of copper brown of rigid core plate to increase the binding force of lamination.
S46, layer of prepreg is made, is work board size by prepreg sawing sheet, prepreg is tree in the present embodiment
The SY PP1080 of fat content 62%, size and number are 519mm*412mm*2, two-sided to be clamped with phenolic resin plate, gummed paper
Fixed quadrangle corresponds to the position gong storage tank 2 of rigid core plate fluting in prepreg, and obtained slot size is 16.2mm*
7.2mm。
It is S47, according to the sequence of core plate, prepreg, core plate that rigid core plate and prepreg is pre- folded, then will with lock seaming machine
Pre- lamination is fixed, and semi-finished product substrate is obtained.
S5, automatically will nitridation aluminium block 3 be positioned in storage tank 2, specifically comprise the following steps：
S51, as shown in figure 4, in semi-finished product substrate base face paste high tempreture tape 7, then cross a false sticker by high temperature resistant
Gummed paper 7 is pressed on semi-finished product substrate bottom surface, and the high tempreture tape is resistant to 220 DEG C of high temperature；
S52, the semi-finished product substrate for being covered with high tempreture tape 7 is moved to automatic placement machine board with manipulator, by nitrogen
Change aluminium block 3 and be placed on automatic placement machine side, captures nitridation aluminium block 3 automatically using manipulator, pass through the automatic school of automatic placement machine
The placement direction of orthofunction correction nitridation aluminium block 3 whether with the position of storage tank 2 always, nitridation aluminium block 2 is grabbed automatically after correction
It gets storage tank 2 and is put in storage tank 2.
S53, pressing, first, in accordance with steel plate, resistance glue release film, the rigid substrates 1 of embedding nitridation aluminium block 3, resistance glue release film, steel
The sequence of plate carries out typesetting, is then pressed according to the pressing parameter that it is as shown in the table.
Table 1
It further include rear process after pressing：Tear high tempreture tape, then through drilling, heavy copper, plate electricity, VCP thickening tables copper, figure
The processes such as transfer, etching, anti-welding, character, turmeric, gong plate-form final PCB finished products.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. a kind of embedding aluminium nitride PCB substrate, which is characterized in that including rigid substrates, the rigid substrates offer storage tank, institute
State and be provided with nitridation aluminium block in storage tank, it is described nitridation aluminium block top and bottom along far from it is described nitridation aluminium block direction sequentially
It is provided with conductive layer and copper plate.
2. embedding aluminium nitride PCB substrate according to claim 1, which is characterized in that the conductive layer is black holes liquid layer or height
Molecule conductive polymer coating, thickness are 0.3-0.8 μm.
3. embedding aluminium nitride PCB substrate according to claim 2, which is characterized in that the thickness of coated copper layer is 10-35 μm.
4. according to the embedding aluminium nitride PCB substrate of claim 1-3 any one of them, which is characterized in that the nitridation aluminium block top surface
It is not more than 20 μm with the difference in height of the rigid substrates top surface, the aluminium block and the side wall spacing of storage tank of nitrogenizing is 50-100 μ
m。
5. a kind of method making embedding aluminium nitride PCB substrate according to any one of claims 1-4, which is characterized in that including
Following steps：
S1, aluminium nitride substrate is provided, aluminium nitride substrate is done into surface activation process；
S2, conductive layer, copper plate are sequentially prepared in alumina base plate surface；
S3, by the nitridation aluminium block of step S2 treated aluminium nitride substrate is cut into pre-set dimensions；
S4, make rigid substrates, open storage tank in core material, prepreg predeterminated position first, then by core material with
Prepreg is pre- in order to fold simultaneously riveted, obtains semi-finished product substrate；
S5, the nitridation aluminium block is positioned in storage tank automatically, is pressed, obtains embedding aluminium nitride printed circuit board.
6. the production method of the embedding aluminium nitride PCB substrate according to right 5, which is characterized in that further include after the step S4
In the step of semi-finished product base plate bottom pastes and presses high tempreture tape.
7. the production method of embedding aluminium nitride PCB substrate according to claim 6, which is characterized in that the step S3 includes
The step of cutting line makes and is cut by laser pastes according to default cutting profile and size in aluminum-nitride-based plate surface dry first
Film, is made cutting line after handling through exposure and development, carrying out laser along the cutting line after the copper at etching removal cutting line cuts
It cuts.
8. the production method of embedding aluminium nitride PCB substrate according to claim 7, which is characterized in that the cutting line width
For 0.1-0.4mm；Lead to N during the laser cutting2Or He.
9. the production method of embedding aluminium nitride PCB substrate according to claim 8, which is characterized in that table in the step S1
Face activation process is specially：Using H2、N2Mixed gas or H2, He mixed gas to aluminium nitride substrate carry out plasma work
Change is handled, processing time 15-30min.
10. the production method of embedding aluminium nitride PCB substrate according to claim 9, which is characterized in that the conductive layer is logical
It crosses blank hole liquid or conductive polymer polymer is prepared in the aluminum-nitride-based plate surface after activation；The copper plate passes through electroplating technology
It prepares.
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| CN111328216A (en) * | 2020-03-02 | 2020-06-23 | 黄石广合精密电路有限公司 | Manufacturing method of PCB (printed circuit board) containing conductive adhesive embedded copper blocks, PCB and electronic equipment |
| CN111491461A (en) * | 2020-05-28 | 2020-08-04 | 苏州欣汇电智能装备技术有限公司 | Automatic embedding device for metal base |
| CN113571435A (en) * | 2021-07-02 | 2021-10-29 | 矽磐微电子(重庆)有限公司 | Method for forming chip packaging structure |
| US11412618B2 (en) | 2020-12-29 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
| US11439018B2 (en) | 2020-12-29 | 2022-09-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
| CN116456619A (en) * | 2022-01-10 | 2023-07-18 | 无锡深南电路有限公司 | Manufacturing method of printed circuit board |
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Application publication date: 20180928 |
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