CN100588308C - High heat conductivity ceramic base printed circuit board and method for making the same - Google Patents
High heat conductivity ceramic base printed circuit board and method for making the same Download PDFInfo
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- CN100588308C CN100588308C CN200710019440A CN200710019440A CN100588308C CN 100588308 C CN100588308 C CN 100588308C CN 200710019440 A CN200710019440 A CN 200710019440A CN 200710019440 A CN200710019440 A CN 200710019440A CN 100588308 C CN100588308 C CN 100588308C
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Abstract
The invention relates to a ceramic matrix printed circuit board with high thermal conductivity, which comprises a bottom layer, a middle insulation layer and a surface conducting layer. A conductive circuit is distributed on a conducting layer, the bottom layer is an aluminum nitride ceramic layer with high thermal conductivity, and the middle insulation layer is an epoxy glass fiber fabric bonding sheet with high thermal conductivity or epoxide resin polymer with high thermal conductivity. The fabrication processes are as follows: 1. the epoxide resin copper clad is chosen, the surface is pre-treated by machine, ultrasonic or chemical method, and a clean flat insulation layer is formed after the removal of oil stain, burr and impurity; 2. a radiating ceramic layer is processed on the pre-treated insulation layer surface by vapor deposition method; 3. a conducting layer is further applied on the surface of the insulation layer, and a conductive circuit is etched and processed on the surface of the conducting layer. The printed circuit board has the advantages of good heat-conducting performance, electric insulation performance and mechanical processing performance, thus being suitable for use in high-power light emitting diode element (LED) circuits, thick-film hybrid integrated circuits, etc.
Description
Technical field
The present invention relates to printed circuit board (PCB), relate in particular to a kind of high heat conductivity ceramic base printed circuit board and preparation method thereof, belong to the printed-board technology field.
Background technology
In Development of Packaging Technology, functional promotion and downsizing cause heat generation density more and more higher, and some LED products only by the package design enough heat that can't leave, must be strengthened heat sinking function by the design of PCB.At present, large power semiconductor LED (LED) lighting source is mainly used in the printed circuit board (PCB) that metallic aluminum material is a base material, what stand in the breach is to select the carrier of the aluminium base printed circuit board (PCB) of metal as LED for use, aluminium base plays fixation on the one hand, play thermolysis on the other hand, the heat that produces during the LED operate as normal is at first derived by aluminum-base printing circuit board.Metallic aluminium base printed circuit board for the manufacturing of utilization conventional machining process, between last conductive layer and bottom aluminium base, bear the heat conductive insulating layer of electric insulation, its pyroconductivity is lower, as: the thermal conductivity of resin is generally 0.3w/mk, and the also not enough 1w/mk of the thermal conductivity of glass fibre, therefore, aluminum-base printing circuit board has limited the performance of its superior function when large power semiconductor LED is used as lighting source.
Along with the continuous development of LED scientific research and the continuous lifting of the chip technology level of production, the high-power LED encapsulation technology is ripe day by day, and luminous efficiency is greatly improved, and its application is constantly expanded.But LED is luminous to be changed electric energy in the process of luminous energy, because resistance and radiation recombination are arranged, LED can produce a large amount of heat.If, great power LED is used for extraordinary light fixture, or being used for the light fixture that adverse circumstances are used, the shell protection grade of these light fixtures is generally all more than IP65, if shell is nonmetal (as plastic cement) material, although in the LED connection aluminium base (MCPCB), if but the heat on the aluminium base can not be conducted to case surface effectively, then the heat of Ju Jiing can make the temperature of aluminium base sharply rise, and causes temperature too high, increase the possibility that LED lost efficacy, caused the aggravation of LED light decay, the lost of life.Therefore, how to select printed circuit board material and heat radiation research to become a major challenge of present substrate design.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of high heat conductivity ceramic base printed circuit board and preparation method thereof is provided, be intended to effectively solve the heat dissipation problem of printed circuit board (PCB), obviously improve heat conductivility, electrical insulation properties and machining property.
Purpose of the present invention is achieved through the following technical solutions:
High heat conductivity ceramic base printed circuit board, comprise bottom, intermediate insulating layer and surface conductance layer, be distributed with the conducting wire on the conductive layer, it is characterized in that: described bottom is the aluminium nitride ceramics layer of high heat conductance, and intermediate insulating layer is the epoxy glass cloth bonding sheet or the high-thermal-conductivity epoxy resin polymer of high heat conduction.
Further, above-mentioned high heat conductivity ceramic base printed circuit board, wherein, the thickness of described ceramic layer is 10～1000um, the granular size of ceramic powders is 10～200nm, its insulation resistance 〉=100M Ω.
Further, above-mentioned high heat conductivity ceramic base printed circuit board, wherein, the material of described conductive layer is copper, gold, silver or palladium, the part of conductive layer also scribbles indium billon or gold-tin alloy.
Further, above-mentioned high heat conductivity ceramic base printed circuit board, wherein, described high heat conductivity ceramic base printed circuit board is a double sided board, and conductive layer is also arranged below the Thermal Conductivity Ceramics Used layer.
Again further, the manufacture method of above-mentioned high heat conductivity ceramic base printed circuit board is characterized in that: may further comprise the steps---
1. it is thin to select for use epoxy resin to cover copper, adopts machinery, ultrasonic wave or chemical method that plate surface is carried out preliminary treatment, degreasing, burr, and impurity forms the smooth insulating barrier of cleaning;
2. adopt the method for vapor deposition surface ceramic deposition to make ceramic layer at pretreated surface of insulating layer: the laser beam of usefulness high-energy-density, ion beam are as thermal source, auxiliary and induce gas-phase reaction to prepare thin-film material, use the airflow blow ceramic powders, to the circuit board high velocity jet, utilize with the bump of circuit board and form film, the surface forms the intensified ceramic film, then ceramic membrane is sealed vapor deposition and handles, and obtains the Thermal Conductivity Ceramics Used layer after the drying;
3. all cover conductive layer in the outside of insulating barrier, facet etch is made the conducting wire on conductive layer again; Perhaps, directly make the conducting wire by the method for sputter or evaporation again at the outside of insulating barrier topical application protecting film.
The outstanding substantive distinguishing features and the obvious improvement of technical solution of the present invention is mainly reflected in:
(1) the present invention generates ceramic film at glass fabric bonding sheet or epoxide resin polymer surface, adopts vapour deposition, and process stabilizing is reliable, and key reaction is carried out at normal temperatures, the raw material compliance with environmental protection requirements;
(2) coefficient of thermal expansion of high heat conductivity ceramic base printed circuit board is little, has excellent heat dispersion, its radiating effect brilliance; When ceramic membrane thickness 100 μ m, the thermal expansion coefficient difference of the raw material thickness direction of plate is little, and it is little that heated substrate expand to change difference, avoids fracture between copper wire and plated-through hole and damages; In addition, the thermal resistance of aluminium nitride ceramics film is lower, has good heat dissipation characteristics;
(3) antistatic performance is better, and when ceramic membrane thickness 100 μ m, surface insulation resistance can reach 100M Ω, is static dissipative material, can effectively spread static, prevents the electrostatic breakdown electric elements;
(4) the high heat conductivity ceramic base plate has high mechanical properties and toughness, on the high heat conductivity ceramic base plate, can realize the manufacturing of large-area printed board, combine firmly with glass fabric bonding sheet or epoxide resin polymer, the stress effect that causes because of the different coefficients of expansion between conductive layer, insulating barrier, the substrate can be overcome effectively, processing such as boring, punching, cutting, etching can be born;
(5) capability of electromagnetic shielding is good, and the high heat conductivity ceramic base plate can serve as barricade, plays the effect of shielding electromagnetic wave, can be used for making the larger area wiring board, has more wide application prospect aspect compatible improving electronics;
(6) high heat conductivity ceramic base printed circuit board is applicable to the circuit that specific (special) requirements is arranged, as: the extensive substrate that great power LED LED device circuit, thick film hybrid integrated circuit, polycrystalline sheet module (multichip module), ceramic substrate are difficult to be competent at, use common radiator can not solve the circuit etc. of reliability.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further:
Fig. 1: the structural representation of single side high heat conductivity ceramic base printed circuit board of the present invention;
Fig. 2: the structural representation of double-side type high heat conductivity ceramic base printed circuit board of the present invention;
Fig. 3: the manufacture craft flow chart of high heat conductivity ceramic base printed circuit board of the present invention.
The implication of each Reference numeral is among the figure: 1-conductive layer, 2-insulating barrier, 3-Thermal Conductivity Ceramics Used layer, 4-conductive layer.
Embodiment
As everyone knows, the performance of aluminium nitride and purposes and beryllium oxide are similar, have high heat conductance (120～200W/mk) and good electric, mechanical performance, but have toxicity unlike beryllium oxide.The thermal coefficient of expansion (4.4 * 10 of aluminium nitride
-6/ ℃) low, can with the thermal coefficient of expansion (3 * 10 of silicon
-6/ ℃) the good coupling of formation.Aluminium nitride has higher thermal conductivity (ratio aluminum oxide is high 3～5 times), low conductivity, dielectric constant and dielectric loss in pottery.The thickness of ceramic layer is 10～1000um, and the granular size of ceramic powders is 10～200nm, its insulation resistance 〉=100M Ω; Simultaneously, the thermal conductivity of aluminium nitride film can reach 120w/mk, is higher than general fiber and resin far away, and the film quality is evenly fine and close, and thermal endurance and corrosion resistance are good.
The invention provides a kind ofly with the printed circuit board (PCB) of ceramic film as bottom, the chemical composition of ceramic film is the nitride of aluminium, i.e. aluminium nitride.The basic structure of single sided board high heat conductivity ceramic base printed circuit board is divided into three layers, as shown in Figure 1, comprises outer conductive layers 1, intermediate thermal conductivity insulating barrier 2, aluminium nitride ceramics thin layer 3; Outer conductive layers 1 can be the metal level that all covers, and also can be the conducting wire that directly makes; Intermediate thermal conductivity insulating barrier 2 is the epoxy glass cloth bonding sheet of high heat conduction or special high-thermal-conductivity epoxy resin polymer; The thickness of the aluminium nitride ceramics thin layer 3 of high heat conductance is 10～1000 μ m, its insulation resistance 〉=100M Ω.
Fig. 2 is the structural representation of double sided board high heat conductivity ceramic base printed circuit board, basic structure is divided into four layers: outer conductive layers 1 and 4, insulating barrier 2 and ceramic layer 3, outer conductive layers 1 and 4 material are Copper Foil, thickness can make conductive layer obtain bigger current capacity by strengthening copper thickness and area generally at 9～70 μ m; The general epoxy glass cloth bonding sheet of high heat conduction or the special high-thermal-conductivity epoxy resin polymer of adopting of the dielectric of insulating barrier 2, the thickness of insulating barrier is 50～100 μ m, thermal resistance is little, adhesive property is good, have the ability of resistant to thermal aging, and can bear machinery and thermal stress; The material of Thermal Conductivity Ceramics Used layer 3 is an aluminium nitride, has very strong dimensional stability and machining property and good thermal diffusivity.
The manufacture craft of high heat conductivity ceramic base printed circuit board is: it is thin 1. to select for use epoxy resin to cover copper, adopts machinery, ultrasonic wave or chemical method that plate surface is carried out preliminary treatment, degreasing, burr, and impurity forms the smooth insulating barrier of cleaning; 2. adopt the method for vapor deposition surface ceramic deposition to make ceramic layer at pretreated surface of insulating layer: the laser beam of usefulness high-energy-density, ion beam are as thermal source, auxiliary and induce gas-phase reaction to prepare thin-film material, use the airflow blow ceramic powders, to the circuit board high velocity jet, utilize with the bump of circuit board and form film, the surface forms the intensified ceramic film, then ceramic membrane is sealed vapor deposition and handles, and obtains the Thermal Conductivity Ceramics Used layer after the drying; 3. all cover conductive layer in the outside of insulating barrier, facet etch is made the conducting wire on conductive layer again; Perhaps, directly make the conducting wire by the method for sputter or evaporation again at the outside of insulating barrier topical application protecting film.
Fig. 3 is the processing process figure that adopts gas phase deposition technology, during making, the epoxy glass cloth bonding sheet of the high heat conduction that common employing thickness is 100～1000 μ m or special high-thermal-conductivity epoxy resin polymer, large-area material surface need adopt machinery and chemical method to carry out preliminary treatment, through deoiling and washing, form the smooth plane of cleaning; Utilize the laser beam of high-energy-density then, ion beams etc. are as thermal source, auxiliary and induce gas-phase reaction to prepare thin-film material, use the airflow blow ceramic powders, the granular size of ceramic powders is controlled at 10～200nm, to the circuit board high velocity jet, utilize with the bump of circuit board and form film, the surface forms the intensified ceramic film, then this ceramic membrane being sealed vapor deposition handles, the oven dry back forms the heat conductive insulating layer of high heat conductivity ceramic base printed circuit board, overcome the deficiency on general chemistry vapour deposition and the physical vapour deposition (PVD) super-hard film material performance, significantly improved the depositing of thin film effect.
After vapour deposition processing, surface ceramic shape oxide-film densification, even, colour consistency is good, thickness range can be controlled at 10～1000um, hardness and relative wear resistance are improved, and anti-oxidant and decay resistance improves greatly, and the heat resistance of aluminium nitride is not less than 1000 ℃.
Bottom is made and is finished, can be at its outer processing conductive layer, and layout conducting wire, the process for making of conductive layer and conducting wire can take to make earlier the metal level that all covers on the heat conductive insulating layer, also can be when making double sided board two-sided deposited copper, and then the conducting wire is made in etching on metal level.Usually, the conducting wire of conductive layer adopts metallic copper to make, and still, according to the application demand of printed circuit board (PCB), can also use or assist on the copper layer metals such as using gold, silver, palladium to make the conducting wire; At all right special coating by vaporization indium gold of the chip paster part of direct packaged high-power LED, Jin Xi or similar alloy, to form the alloy coat that is fit to the die bottom surface welding.
It should be noted that, the manufacture craft of the epoxy glass cloth bonding sheet sheet material of high heat conduction is: at first, configuration material plate resin adhesive liquid, dimethyl formamide, EGME, dicyandiamide, epoxy resin, promoter are mixed, again the monomethyl imidazoles is dissolved in an amount of dimethyl formamide in advance, be added to then in the above-mentioned material, continue fully to stir, after the slaking 7 hours, sampling detects, and enters manufacturing process after waiting to meet specification requirement.
With after the uncoiling of glass cloth, enter the glue groove again through guide roller, behind the impregnation by the plastic squeeze roller, the control resin content, enter baking oven then,, remove volatile matters such as solvent through during the baking oven, make resin be in semi-cured state simultaneously, after going out baking oven, shear by dimensional requirement, and neat overlaying on the storage rack, temperature, air quantity and the speed of a motor vehicle control gel time and the volatile content of each warm area of baking oven regulated with the control resin content in the gap of regulating the plastic squeeze roller.In order to ensure quality, must periodically detect every specification requirement, detect resin content, gel time, resin flow, volatile content, treat that every index meets the requirements after, generate bonding sheet; Bonding sheet should neatly stack, epoxy resin in the bonding sheet is in semi-cured state, in depositing process, the quality of bonding sheet will change with the variation of storage condition and resting period, under the situation of high humidity, the hydroscopicity of bonding sheet can obviously increase, and will have a strong impact on product quality after the bonding sheet moisture absorption, and bonding sheet is deposited in temperature below 25 ℃, the condition of relative humidity below 50%.
Then bonding sheet is suppressed, the pressing process of base material is divided into intensification, insulation and cooling three phases substantially.Pressing process is manually actuated, also can be controlled by computer.In the temperature rise period, make heat progressively be delivered to every product of interlayer from heating plate, make the resin fusing, flow.Simultaneously, fusing and mobility status according to resin pressurize.
At last, to advanced row machinery in surface and chemical method preliminary treatment, form bright and clean smooth plane, the epoxy glass fabric of very thin one deck is covered in the shop then, and coated one deck specific polymers constitutes the epoxy glass cloth bonding sheet sheet material of high heat conduction again.
It should be noted that when high heat conductivity ceramic base printed circuit board is double sided board shown in Figure 2 manufacturing process realizes that at the ceramic base lower surface surface applies copper by the electroless copper plating mode on the basis of single sided board.Master operation comprises: 1. substrate preliminary treatment baking, and the 2. cleaning on brush board surface, deslagging process, 3. oil removing activation, plate is removed surface passivated membrane behind the 4. heavy copper, 5. Direct Electroplating acid copper.
Its concrete technology is: at first, substrate preliminary treatment baking, the substrate meeting moisture absorption and this part resin solidification when being pressed into substrate are bad, when boring, can cause the poor quality of boring because of the insufficient strength of resin itself, need carry out necessary baking when therefore opening material, substrate can be put into baking box, temperature is controlled at 50～80 ℃, time was controlled at 10～20 minutes, removed inner moisture and moisture.Substrate after the baking is carried out brush board handle, brush board is removed pollution and the deburring and the burr on surface by mechanical means, carries out the cleaning on surface.Carry out suitable deslagging process rationally, the reliability that the adhesion of increase boring ratio is connected with internal layer.In addition, before aluminium nitride ceramics thin layer 3 lower surfaces form, should note the granular size of ceramic powders, powder particle is controlled at 10～200nm, otherwise the difficult activation of top layer particle, behind the heavy copper because of coating deposits in extremely uneven substrate, the increasing that the stress of chemical copper can be at double, the chemical copper slices come off from the top layer after can obviously seeing heavy copper when serious, cause the generation of follow-up no copper.
Secondly, single sided board is put into the deposition tank liquor, the oil removing activation, the temperature of degreaser is controlled at 50～80 ℃, and 20～30 minutes time, if tank liquor temperature is too high, tank liquor is long aging service time, and colloid palladium can precipitate.The bad material of processing time deficiency, heating tube or Hanging Basket or misuse and cause iron ion, copper ion or other metal ion contents in the tank liquor higher, and influence the activity of tank liquor.Certainly stannic increase in the bringing into of moisture, other pollutants, the tank liquor all has certain influence to the reactivity of tank liquor.Quicken the general fluoboric acid that uses, activation and quicken back precipitation number hour, plate generally will soak sulfuric acid and removes the residual alkali on surface and the passivating film of alkalescence, Direct Electroplating acid copper behind the heavy copper.Remaining moisture need dry up, if dry up the oxidation that the too high meeting of temperature causes chemical copper, causes follow-up distortion.So should electroplate copper rapidly one time behind the heavy copper, RT can not be long, generally is no more than 12 hours.And then the conducting wire is made in etching on metal level, carries out machining, makes required printed board.
In sum, high heat conductivity ceramic base printed circuit board has good heat-conducting, electrical insulation properties and machining property.The high heat conductivity ceramic base printed circuit board has replaced traditional epoxy resin base plate, frangible ceramic substrate; Simultaneously, the high heat conductivity ceramic base plate efficiently solves the heat dissipation problem of components and parts, has reduced the product working temperature, has improved product reliability and stability, has prolonged the useful life of product.
High heat conductivity ceramic base printed circuit board provided by the invention can be applicable to some specific power-type electronic circuit and device, as: the extensive substrate that great power LED LED device circuit, thick film hybrid integrated circuit, polycrystalline sheet module (multichip module), ceramic substrate are difficult to be competent at, use common radiator can not solve the circuit of reliability etc.
Certainly, more than only be concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.All employing equivalents or equivalence are replaced and the technical scheme of formation, all drop within the rights protection scope of the present invention.
Claims (4)
1. high heat conductivity ceramic base printed circuit board, comprise bottom, intermediate insulating layer and surface conductance layer, be distributed with the conducting wire on the conductive layer, it is characterized in that: described bottom is the aluminium nitride ceramics layer of the high heat conductance of 120～200W/mk, and intermediate insulating layer is heat conduction epoxy glass cloth bonding sheet or heat-conduction epoxy resin polymer; The thickness of described aluminium nitride ceramics layer is 10～1000 μ m, and its particles of powder size is 10～200nm, its insulation resistance 〉=100M Ω.
2. high heat conductivity ceramic base printed circuit board according to claim 1 is characterized in that: the material of described conductive layer is copper, gold, silver or palladium, and the part of conductive layer also scribbles indium billon or gold-tin alloy.
3. high heat conductivity ceramic base printed circuit board according to claim 1 is characterized in that: described high heat conductivity ceramic base printed circuit board is a double sided board, and conductive layer is also arranged below the high-heat conductivity aluminium nitride ceramics layer.
4. the manufacture method of the described high heat conductivity ceramic base printed circuit board of claim 1 is characterized in that: may further comprise the steps---
1. it is thin to select for use epoxy resin to cover copper, adopts machinery, ultrasonic wave or chemical method that plate surface is carried out preliminary treatment, degreasing, burr, and impurity forms the smooth insulating barrier of cleaning;
2. the method that adopts the vapor deposition surface ceramic deposition is made the aluminium nitride ceramics layer at pretreated surface of insulating layer: with laser beam or ion beam as thermal source, auxiliary and induce gas-phase reaction to prepare thin-film material, use the airflow blow ceramic powders, to the circuit board high velocity jet, utilize with the bump of circuit board and form film, the surface forms the intensified ceramic film, then ceramic membrane is sealed vapor deposition and handles, and obtains the aluminium nitride ceramics layer of the high heat conductance of 120～200W/mk after the drying;
3. all cover conductive layer in the outside of insulating barrier, facet etch is made the conducting wire on conductive layer again; Perhaps at the outside of insulating barrier topical application protecting film, make the conducting wire by sputter or evaporation, electric plating method again.
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| CN200710019440A CN100588308C (en) | 2007-01-24 | 2007-01-24 | High heat conductivity ceramic base printed circuit board and method for making the same |
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| CN200710019440A CN100588308C (en) | 2007-01-24 | 2007-01-24 | High heat conductivity ceramic base printed circuit board and method for making the same |
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| CN101767481B (en) * | 2009-01-06 | 2013-07-17 | 金安国纪科技股份有限公司 | Method for preparing highly heat-conductive copper-clad plate |
| CN101699933B (en) * | 2009-11-02 | 2011-11-30 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board |
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| CN101699936B (en) * | 2009-11-02 | 2011-03-30 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating |
| CN101990372B (en) * | 2010-08-03 | 2012-07-04 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-based interconnected rigid circuit board |
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| CN102036472A (en) * | 2011-01-05 | 2011-04-27 | 倪新军 | Microwave high-frequency metal base circuit board |
| CN102076164B (en) * | 2011-01-17 | 2012-07-04 | 倪新军 | Microwave high-frequency circuit board |
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| CN103361640A (en) * | 2012-03-31 | 2013-10-23 | 深圳光启创新技术有限公司 | Metamaterial and processing method thereof |
| DE102012206758B3 (en) * | 2012-04-25 | 2013-05-29 | Semikron Elektronik Gmbh & Co. Kg | Method for manufacturing substrate for power semiconductor component such as MOSFET of power semiconductor module, involves performing galvanic isolation of metal film on broad strip conductor |
| WO2018060247A1 (en) | 2016-09-27 | 2018-04-05 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Flame retardant structure for component carrier |
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| CN108282968B (en) * | 2018-01-31 | 2020-01-31 | 维沃移动通信有限公司 | printed circuit board substrate and manufacturing method thereof |
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| CN110139503A (en) * | 2019-05-31 | 2019-08-16 | 深圳市英创立电子有限公司 | Printed circuit board surface sticked technique |
| CN113194622A (en) * | 2021-04-27 | 2021-07-30 | 江门市德众泰工程塑胶科技有限公司 | Circuit board and manufacturing method thereof |
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Effective date of registration: 20190226 Address after: 211100 Jiangsu Province Jiangning District High-tech Park Corning Road 777A Patentee after: Jiangsu Henderson Intelligent Technology Co., Ltd. Address before: 211100, No. 666, Jian Lu, Science Park, Jiangning, Jiangsu, Nanjing Patentee before: Nanjing Handson Science & Technology Corporation |
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