CN108573946B - 四面扁平无引脚半导体封装件、其制造方法及其制造用遮蔽片 - Google Patents
四面扁平无引脚半导体封装件、其制造方法及其制造用遮蔽片 Download PDFInfo
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- CN108573946B CN108573946B CN201710867062.6A CN201710867062A CN108573946B CN 108573946 B CN108573946 B CN 108573946B CN 201710867062 A CN201710867062 A CN 201710867062A CN 108573946 B CN108573946 B CN 108573946B
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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KR10-2017-0030580 | 2017-03-10 | ||
KR1020170030580A KR101763852B1 (ko) | 2017-03-10 | 2017-03-10 | Qfn 반도체 패키지, 이의 제조방법 및 qfn 반도체 패키지 제조용 마스크 시트 |
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CN108573946A CN108573946A (zh) | 2018-09-25 |
CN108573946B true CN108573946B (zh) | 2021-12-24 |
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KR (1) | KR101763852B1 (ko) |
CN (1) | CN108573946B (ko) |
MY (1) | MY193624A (ko) |
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SG11202001612UA (en) * | 2018-03-13 | 2020-03-30 | Hitachi Chemical Co Ltd | Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device |
KR20220094011A (ko) * | 2020-12-28 | 2022-07-05 | (주)이녹스첨단소재 | Qfn 반도체 패키지용 마스크 시트 |
KR102313245B1 (ko) * | 2021-01-04 | 2021-10-14 | (주)인랩 | 반도체 패키지용 마스킹 테이프 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US5406124A (en) * | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
CN102911614A (zh) * | 2011-08-02 | 2013-02-06 | 东丽先端素材株式会社 | 用于制造半导体器件的胶粘带和使用该胶粘带制造半导体器件的方法 |
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JP4125668B2 (ja) * | 2003-12-19 | 2008-07-30 | 日東電工株式会社 | 半導体装置の製造方法 |
KR101364438B1 (ko) * | 2012-09-21 | 2014-02-18 | 도레이첨단소재 주식회사 | 에너지선 반응형 내열성 점착시트를 이용한 반도체 장치의 제조방법 |
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- 2017-03-10 KR KR1020170030580A patent/KR101763852B1/ko active IP Right Grant
- 2017-09-06 TW TW106130490A patent/TWI664266B/zh not_active IP Right Cessation
- 2017-09-18 MY MYPI2017703458A patent/MY193624A/en unknown
- 2017-09-22 CN CN201710867062.6A patent/CN108573946B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5406124A (en) * | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
CN102911614A (zh) * | 2011-08-02 | 2013-02-06 | 东丽先端素材株式会社 | 用于制造半导体器件的胶粘带和使用该胶粘带制造半导体器件的方法 |
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Publication number | Publication date |
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TWI664266B (zh) | 2019-07-01 |
MY193624A (en) | 2022-10-20 |
TW201833269A (zh) | 2018-09-16 |
CN108573946A (zh) | 2018-09-25 |
KR101763852B1 (ko) | 2017-08-01 |
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