CN108520868A - Conductive structure - Google Patents
Conductive structure Download PDFInfo
- Publication number
- CN108520868A CN108520868A CN201810548142.XA CN201810548142A CN108520868A CN 108520868 A CN108520868 A CN 108520868A CN 201810548142 A CN201810548142 A CN 201810548142A CN 108520868 A CN108520868 A CN 108520868A
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- CN
- China
- Prior art keywords
- heat
- silicon substrate
- silica gel
- ceramic plate
- alumina ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention proposes a kind of conductive structure, is used for the heat conduction of module, and conductive structure from inside to outside, includes successively：Silicon substrate, silicon substrate have the first preset thickness；Heat-conducting silica gel sheet is mutually pasted with silicon substrate, and heat-conducting silica gel sheet has the second preset thickness；Alumina ceramic plate is mutually pasted with heat-conducting silica gel sheet, and alumina ceramic plate has third preset thickness；Aluminium sheet is mutually pasted with alumina ceramic plate, and aluminium sheet has the 4th preset thickness, wherein module is set in silicon substrate.Technical solution through the invention, by three-level conductive structure, the heat directed outwards for preferably generating module, and then miniscope is made preferably to radiate.
Description
Technical field
The present invention relates to module packaging technique fields, in particular to a kind of conductive structure.
Background technology
It is all integrated in due to all modules of miniscope on one about 1 inch of silicon chip, so in a bright display
When, it is easy to heat is generated in the short time, is distributed if these heats cannot obtain conducting well, will be influenced device
Service life.
Invention content
The present invention is directed to solve at least one of the technical problems existing in the prior art or related technologies.
In view of this, the purpose of the present invention is to provide a kind of conductive structures.
To achieve the goals above, technical scheme of the present invention provides a kind of conductive structure, is used for the heat conduction of module, institute
It states conductive structure from inside to outside, includes successively：Silicon substrate, the silicon substrate have the first preset thickness；Heat-conducting silica gel sheet, with the silicon
Base is mutually pasted, and the heat-conducting silica gel sheet has the second preset thickness；Alumina ceramic plate is mutually pasted with the heat-conducting silica gel sheet,
The alumina ceramic plate has third preset thickness；Aluminium sheet is mutually pasted with the alumina ceramic plate, and the aluminium sheet has the
Four preset thickness, wherein the module is set in the silicon substrate.
Optionally, the heat-conducting silica gel sheet is mutually pasted with the alumina ceramic plate by bond plies；The oxidation
Aluminium potsherd is mutually pasted with the oxygen aluminium sheet by bond plies.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages：
By three-level conductive structure, the heat directed outwards for preferably generating module, and then keep miniscope more preferable
Heat dissipation.
The additional aspect and advantage of the present invention will become apparent in following description section, or practice through the invention
Recognize.
Description of the drawings
Fig. 1 shows the structural schematic diagram of the conductive structure of a specific embodiment according to the present invention.
Wherein, the correspondence in Fig. 1 between reference numeral and component names is：
10 silicon substrates, 20 heat-conducting silica gel sheets, 30 alumina ceramic plates, 40 aluminium sheets.
Specific implementation mode
The present invention is further described in detail with reference to the accompanying drawings and detailed description.It should be noted that
Feature in embodiments herein and embodiment can be combined with each other.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also
To be implemented different from other modes described here using other, therefore, protection scope of the present invention is not by described below
Specific embodiment limitation.
According to some embodiments of the present invention referring to Fig. 1 descriptions.
As shown in Figure 1, according to the conductive structure of one embodiment provided by the invention, it is used for the heat conduction of module, it is described to lead
Heat structure from inside to outside, includes successively：Silicon substrate 10, the silicon substrate 10 have the first preset thickness；Heat-conducting silica gel sheet 20, and it is described
10 phase of silicon substrate is pasted, and the heat-conducting silica gel sheet 20 has the second preset thickness；Alumina ceramic plate 30, with the heat-conducting silica gel sheet
20 phases are pasted, and the alumina ceramic plate 30 has third preset thickness；Aluminium sheet 40, it is viscous with 30 phase of the alumina ceramic plate
Patch, the aluminium sheet 40 have the 4th preset thickness, wherein the module is set in the silicon substrate 10.
The thermal coefficient that the size order and silicon substrate 10 of thermal coefficient K according to three kinds of materials contact is minimum, then successively
Increase, heat-conducting silica gel sheet 20, alumina ceramic plate 30 and aluminium sheet 40 are arranged from inside to outside.
The miniscope of different radiator structures is set to work 0.5 hour, with heat label measurement device temperature, process is repeatedly right
Than in experiment, we obtain：
1. making cooling fin with aluminium sheet 40, measured temperature is about 39 DEG C
2. making cooling fin with heat-conducting silica gel sheet 20, measured temperature is about 48 DEG C
3 make cooling fin with alumina ceramic plate 30, and measured temperature is about 44 DEG C
4. making cooling fin with three-level conductive structure, the temperature of survey is about 27 DEG C
From the above mentioned, the three-level conductive structure of the technical solution of the present embodiment can preferably distribute miniscope heat.
In the present embodiment, the thickness of silicon substrate 10 is 0.725mm, and the thickness of heat-conducting silica gel sheet 20 is 0.25mm, aluminium oxide pottery
The thickness of tile 30 is 0.25mm, and the thickness of aluminium sheet 40 is 0.5mm, and material can be purchased to obtain from market.
Optionally, the heat-conducting silica gel sheet 20 is mutually pasted with the alumina ceramic plate 30 by bond plies；It is described
Alumina ceramic plate 30 is mutually pasted with the oxygen aluminium sheet 40 by bond plies.
The thickness of bond plies is 0.1mm, can be obtained from buying on the market.
It is understood that the thickness of silicon substrate 10, the thickness of heat-conducting silica gel sheet 20, the thickness of alumina ceramic plate 30, aluminium
The thickness of plate 40 and the thickness of bond plies can be adjusted according to actual needs.
Technical scheme of the present invention is described in detail above in association with attached drawing, technical solution through the invention passes through three-level
Conductive structure, the heat directed outwards for preferably generating module, and then miniscope is made preferably to radiate.
The above, only presently preferred embodiments of the present invention, not does limitation in any form to the present invention, appoints
What those skilled in the art, without departing from the scope of the present invention, when in the technology using the disclosure above
Hold the equivalent embodiment made a little change or be modified to equivalent variations, as long as being the content without departing from technical solution of the present invention,
According to the technical essence of the invention to any simple modification, equivalent change and modification made by above example, this is still fallen within
The range of inventive technique scheme.
Claims (2)
1. a kind of conductive structure, it to be used for the heat conduction of module, which is characterized in that the conductive structure from inside to outside, includes successively：
Silicon substrate, the silicon substrate have the first preset thickness；
Heat-conducting silica gel sheet is mutually pasted with the silicon substrate, and the heat-conducting silica gel sheet has the second preset thickness；
Alumina ceramic plate is mutually pasted with the heat-conducting silica gel sheet, and the alumina ceramic plate has third preset thickness；
Aluminium sheet is mutually pasted with the alumina ceramic plate, and the aluminium sheet has the 4th preset thickness,
Wherein, the module is set in the silicon substrate.
2. conductive structure according to claim 1, which is characterized in that the heat-conducting silica gel sheet and the alumina ceramic plate
It is mutually pasted by bond plies；The alumina ceramic plate is mutually pasted with the oxygen aluminium sheet by bond plies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810548142.XA CN108520868A (en) | 2018-05-31 | 2018-05-31 | Conductive structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810548142.XA CN108520868A (en) | 2018-05-31 | 2018-05-31 | Conductive structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108520868A true CN108520868A (en) | 2018-09-11 |
Family
ID=63426913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810548142.XA Pending CN108520868A (en) | 2018-05-31 | 2018-05-31 | Conductive structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108520868A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110486632A (en) * | 2019-09-12 | 2019-11-22 | 重庆市润金新材料科技有限公司 | A kind of high-powered LED lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0883867A (en) * | 1994-07-15 | 1996-03-26 | Mitsubishi Materials Corp | High heat dissipation ceramic package |
| US20080291633A1 (en) * | 2007-05-21 | 2008-11-27 | National Taiwan University | Package assembly with heat dissipating structure |
| KR20100078455A (en) * | 2008-12-30 | 2010-07-08 | 오리온피디피주식회사 | Structure of heat dissipating sheet for plasma display panel |
| CN103895277A (en) * | 2014-04-11 | 2014-07-02 | 江苏悦达新材料科技有限公司 | Graphite film/heat-conducting silica gel/graphene composite radiating fin and preparation method for same |
| CN203748176U (en) * | 2014-01-20 | 2014-07-30 | 苏州贺尔新电子有限公司 | Novel heat dissipation reflecting sheet |
| CN208173583U (en) * | 2018-05-31 | 2018-11-30 | 湖畔光电科技（江苏）有限公司 | Conductive structure |
-
2018
- 2018-05-31 CN CN201810548142.XA patent/CN108520868A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0883867A (en) * | 1994-07-15 | 1996-03-26 | Mitsubishi Materials Corp | High heat dissipation ceramic package |
| US20080291633A1 (en) * | 2007-05-21 | 2008-11-27 | National Taiwan University | Package assembly with heat dissipating structure |
| KR20100078455A (en) * | 2008-12-30 | 2010-07-08 | 오리온피디피주식회사 | Structure of heat dissipating sheet for plasma display panel |
| CN203748176U (en) * | 2014-01-20 | 2014-07-30 | 苏州贺尔新电子有限公司 | Novel heat dissipation reflecting sheet |
| CN103895277A (en) * | 2014-04-11 | 2014-07-02 | 江苏悦达新材料科技有限公司 | Graphite film/heat-conducting silica gel/graphene composite radiating fin and preparation method for same |
| CN208173583U (en) * | 2018-05-31 | 2018-11-30 | 湖畔光电科技（江苏）有限公司 | Conductive structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110486632A (en) * | 2019-09-12 | 2019-11-22 | 重庆市润金新材料科技有限公司 | A kind of high-powered LED lamp |
| CN110486632B (en) * | 2019-09-12 | 2020-09-15 | 重庆市润金新材料科技有限公司 | High-power LED lamp |
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