CN108445699A - Projection arrangement - Google Patents
Projection arrangement Download PDFInfo
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- CN108445699A CN108445699A CN201810088972.9A CN201810088972A CN108445699A CN 108445699 A CN108445699 A CN 108445699A CN 201810088972 A CN201810088972 A CN 201810088972A CN 108445699 A CN108445699 A CN 108445699A
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- Prior art keywords
- cooling fin
- imaging modules
- projection arrangement
- heat dissipation
- extension
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Projection Apparatus (AREA)
Abstract
The present invention provides a kind of projection arrangement, can reduce the noise generated when fan running, which includes：Shell, optical-mechanical system and auxiliary heat dissipation piece；The optical-mechanical system is set in the shell, which includes light source module group and imaging modules；And the auxiliary heat dissipation piece is set to the top of the imaging modules, and the auxiliary heat dissipation piece has multiple radiating fins, multiple auxiliary heat dissipation fin configured in parallel and the top-direction extension towards the separate imaging modules, to form multiple secondary ventilation roads.
Description
This divisional application is based on application No. is 201510507599.2, and the applying date is on 08 18th, 2015, invention name
The referred to as divisional application of the Chinese patent application of " projection arrangement ".
Technical field
The present invention relates to a kind of projection arrangements, especially with respect to a kind of throwing with high efficiency Natural Heat Convection mechanism
Image device.
Background technology
The power of projector, because the requirement of brightness the more is done the more big, and the efficiency of light emitting diode fails to be promoted relatively, i.e.,
It is in the case of smaller power, existing product all needs to do forced heat radiation with fan, and in the case of power increase, heat
The problem of effect, is with regard to even more serious.
Fan can be all used in the design of conventional projectors, therefore is smooth with forced convertion to considering mostly for radiating airflow
Degree is primary concern, so that the air-flow energy smooth outflow of fan reaches heat extraction effect.However, since fan will produce in the running
Sizable noise, if rotation speed of the fan can be greatly reduced or even exempt the use of fan, it will be to home audio-visual or needs
One big improvement of quiet use environment.
Furthermore when light emitting diode is increasing using power, heating efficiency will also increase with power is used
Add.For general small projector, since three colors (R/G/B) light source is usually placed in three sides of light mixed component, lead
Cause the integral heat sink efficiency of small projector that will also be affected because of the limitation in space.
Therefore, inner space how is efficiently used, internal element configuration, rotation speed of the fan is reduced or even exempts making for fan
With and effective heat dissipation can be reached no anxiety so that projection arrangement can still run well, the actually important view of projection arrangement heat dissipation design
Topic.
Invention content
The purpose of the present invention is to provide a kind of projection arrangements, with high efficiency Natural Heat Convection mechanism, with substantially
It reduces the rotating speed of fan or even exempts the use of fan, and then reduce the noise generated when fan running.
In order to achieve the above object, the present invention provides a kind of projection arrangement, including：
Shell；
Optical-mechanical system is set in the shell, which includes light source module group and imaging modules；And
Auxiliary heat dissipation piece is set to the top of the imaging modules, and the auxiliary heat dissipation piece has multiple radiating fins, this is more
A auxiliary heat dissipation fin configured in parallel and towards far from the imaging modules top-direction extend, to form multiple secondary ventilation roads.
Preferably, additionally comprise at least one extension cooling fin, the wherein extension cooling fin is from the side of the extension cooling fin
Bottom direction towards the imaging modules extends, with positioned at the side of the imaging modules, which has multiple heat radiating fins
Multiple radiating fins of piece, the extension cooling fin form multiple extension ventilations along the side configured in parallel of the imaging modules
Road, multiple extension ventilating duct are accordingly connected to multiple secondary ventilation road.
Preferably, " L-shaped " that the extension cooling fin is integrated with the auxiliary heat dissipation piece.
Preferably, additionally comprise at least two extension cooling fins, wherein the extension cooling fin from the both sides of the cooling fin towards this
The bottom direction of imaging modules extends, with positioned at the side of the imaging modules, which has multiple radiating fins, should
The multiple radiating fins for extending cooling fin form multiple extension ventilating ducts along the side configured in parallel of the imaging modules, this is more
A extension ventilating duct is accordingly connected to multiple secondary ventilation road.
Preferably, " ㄇ shapes " cooling fin that the auxiliary heat dissipation piece is integrated with the extension cooling fin.
Preferably, the radiating fin positioned at the auxiliary heat dissipation piece of " ㄇ shapes " cooling fin both sides is to extend backwards, with respectively
Extend towards the side plate of the shell and the light source module group.
Preferably, the imaging modules include camera lens module, and the extension cooling fin extends to the side of camera lens module.
Preferably, the cooling fin and the auxiliary heat dissipation piece are integrally formed.
Preferably, the imaging modules include digital micro-mirror device, which is set to the top of the imaging modules
Portion is simultaneously attached at the cooling fin.
Preferably, the shell includes top plate and side plate, which has multiple top ventilation holes, and the side plate has multiple sides
Ventilation hole, the top ventilation hole, the side ventilation hole and the ventilating duct may make up radiating flow passage.
Compared with prior art, projection arrangement of the invention by auxiliary heat dissipation piece cooperation, can reach it is efficient from
Right heat loss through convection mechanism the rotating speed of fan is greatly reduced or even exempts the use of fan, and then is produced when reduction fan running
Raw noise.
Description of the drawings
Figure 1A is the stereogram of the projection arrangement of one embodiment of the invention；
Figure 1B is the explosive view that projection arrangement shown in figure 1A is not painted side plate；
Fig. 1 C are the vertical view that projection arrangement shown in figure 1A is not painted top plate；
Fig. 2A is the top plate and bottom plate of projection arrangement shown in figure 1A and the configuration schematic diagram of cooling fin；
Fig. 2 B are the schematic diagram of the optical-mechanical system of projection arrangement shown in figure 1A；
Fig. 3 A, which are the top plate of one embodiment of the invention, has the partial schematic diagram of thermal insulation barriers；
Fig. 3 B and Fig. 3 C are the side view that thermal insulation barriers are set to the different embodiments on top plate shown in Fig. 3 A；
Fig. 4 A are that the projection arrangement of another embodiment of the present invention is not painted the schematic diagram of top plate and side plate；
Fig. 4 B are the explosive view of projection arrangement shown in Fig. 4 A；
Fig. 5 A are that the projection arrangement of another embodiment of the present invention is not painted the schematic diagram of top plate and side plate；
Fig. 5 B are the side schematic view of the subelement of projection arrangement shown in Fig. 5 A；
Fig. 6 is that the projection arrangement of another embodiment of the present invention is not painted the schematic diagram of top plate and side plate；
Fig. 7 A are that the projection arrangement of another embodiment of the present invention is not painted the schematic diagram of top plate and side plate；
Fig. 7 B are the vertical view that projection arrangement is not painted bottom plate shown in Fig. 7 A；
Fig. 8 A and Fig. 8 B are the vertical view and schematic side view of the projection arrangement of another embodiment of the present invention；
Fig. 9 A to Fig. 9 C are the configuration schematic diagram of the diversion member of different embodiments of the invention；
Figure 10 is the schematic diagram of the diversion member of another embodiment of the present invention；
Figure 11 A and Figure 11 B are the schematic diagram and configuration schematic diagram of the diversion member of another embodiment of the present invention；
Figure 12 is the schematic diagram of the electronic device of one embodiment of the invention.
Specific implementation mode
To make to have further understanding to the purpose of the present invention, construction, feature and its function, hereby coordinate embodiment detailed
It is described as follows.
A kind of projection arrangement of present invention offer, especially a kind of projection arrangement of the heat dissipation design with free convection, with
It reduces rotation speed of the fan or even exempts and use fan, and then reduce noise and promote operation quality.Furthermore projection arrangement of the invention
With optimized circuit board arrangement to reduce fuel factor influence, also using the cooperation of metal heat-conducting piece and cooling fin to be promoted
Heat dissipation.In addition, the present invention also provides a kind of electronic device, by fan and conducting element so that air-flow is with optimized
Angle enters the ventilating duct between radiating fin, to promote heat dissipation.It is filled with reference to the schema projection that the present invention will be described in detail in rear
It sets and the embodiment of electronic device.
Figure 1A is the stereogram of the projection arrangement of one embodiment of the invention；Figure 1B is that projection arrangement shown in figure 1A is not painted
The explosive view of side plate；Fig. 1 C are the vertical view that projection arrangement shown in figure 1A is not painted top plate；Fig. 2A is projection shown in figure 1A
The top plate and bottom plate of device and the configuration schematic diagram of cooling fin；Fig. 2 B are the signal of the optical-mechanical system of projection arrangement shown in figure 1A
Figure；Fig. 3 A, which are the top plate of one embodiment of the invention, has the partial schematic diagram of thermal insulation barriers；Fig. 3 B and Fig. 3 C be Fig. 3 A shown in every
Warmware is set to the side view of the different embodiments on top plate；Fig. 4 A are that the projection arrangement of another embodiment of the present invention is not painted top
The schematic diagram of plate and side plate；Fig. 4 B are the explosive view of projection arrangement shown in Fig. 4 A；Fig. 5 A are the throwing of another embodiment of the present invention
Image device is not painted the schematic diagram of top plate and side plate；Fig. 5 B are the side signal of the subelement of projection arrangement shown in Fig. 5 A
Figure；Fig. 6 is that the projection arrangement of another embodiment of the present invention is not painted the schematic diagram of top plate and side plate；Fig. 7 A are another reality of the present invention
The projection arrangement for applying example is not painted the schematic diagram of top plate and side plate；Fig. 7 B are that projection arrangement shown in Fig. 7 A is not painted bowing for bottom plate
View；Fig. 8 A and Fig. 8 B are the vertical view and schematic side view of the projection arrangement of another embodiment of the present invention；Fig. 9 A to Fig. 9 C are
The configuration schematic diagram of the diversion member of different embodiments of the invention；Figure 10 is the signal of the diversion member of another embodiment of the present invention
Figure；Figure 11 A and Figure 11 B are the schematic diagram and configuration schematic diagram of the diversion member of another embodiment of the present invention；Figure 12 is the present invention
The schematic diagram of the electronic device of one embodiment.
As shown in Figure 1A to Fig. 1 C, in an embodiment, projection arrangement 1 of the invention include shell 10, optical-mechanical system 20 and
Multiple cooling fins 30, middle casing 10 are that have top plate 110 and bottom plate 120 disposed in parallel, and multiple side plates 130 are around connection
The side of top plate 110 and bottom plate 120, to surround accommodating space jointly, for the accommodating projections such as optical-mechanical system 20 and cooling fin 30 dress
Set component.In this embodiment, top plate 110 has multiple top ventilation holes 112, and bottom plate 120 has multiple bottom ventilation holes 122,
Middle top ventilation hole 112 and bottom ventilation hole 122 are the entrances flowed as gas.Furthermore as shown in Figure 1A, side plate 130 is preferable
Also there are multiple side ventilation holes 132, to promote heat sinking benefit.In this embodiment, shell 10 is preferably made of metal, such as aluminium,
But not limited to this.In other embodiment, shell 10 can be made of alloy or nonmetallic (such as polymer).
In this embodiment, as shown in Figure 1B and Fig. 2A, top plate 110 is preferably waffle slab, and top plate 110 is by multiple ribs
114a, 114b staggeredly constitute multiple top ventilation holes 112.For example, multiple rib 114a are the first side 110a along top plate 110
Parallel interval configures, and multiple rib 114b are matched along sides adjacent (such as the second side 110b) parallel interval of the first side 110a
It sets, so that multiple rib 114a, 114b interweave with forming multiple grids as top ventilation hole 112.Herein it may be noted that multiple ribs
Spacing, number, width between 114a etc. may be the same or different spacing, number, width etc. between multiple rib 114b, and
Multiple rib 114a, 114b can otherwise be staggered to form top ventilation hole.In this embodiment, the extension side of multiple rib 114a
To preferably perpendicular to the first side 110a, and the extending direction of multiple rib 114b is preferably perpendicular to the second side 110b, so that
The rectangular opening that multiple top ventilation holes 112 are array configuration is obtained, but not limited to this.In another embodiment (not shown), multiple ribs
The extending direction of 114a, 114b can accompany non-90 degree angle with the first side 110a and the second side 110b respectively, so that multiple
Rib 114a, 114b are respectively relative to the first side 110a and the second side 110b is obliquely extended, and multiple top ventilation holes 112 are array
The diamond hole of configuration.Bottom plate 120 also can form the net partition board of bottom ventilation hole 122 to be interweaved by multiple rib 124a, 124b, wherein
Rib 124a, 124b can have the rib similar to top plate 110 relative to the first side 120a and the second side 120b of bottom plate 120
The configuration of 114a, 114b, repeat no more in this.
Herein it may be noted that top plate 110 and bottom plate 120, which are preferably arranged to top ventilation hole 112, is at least partly directed at bottom ventilation
Hole 122, so that top ventilation hole 112 can be connected to bottom ventilation hole 122 by 312 straight line of corresponding ventilating duct, such as Figure 1B and Fig. 2A
Shown (in rear detailed description).In other words, identical or different shape, size or number can be had by pushing up ventilation hole 112 and bottom ventilation hole 122
Mesh, not to be limited shown in embodiment.For example, in other embodiment, top ventilation hole 112 can be to be formed in top plate 110
Multiple openings, bottom ventilation hole 122 can be the multiple openings for being formed in bottom plate 120, and opening shape can be round, rectangle or any
Suitable geometry or non-regular shape.
As shown in Figure 1B, Fig. 1 C and Fig. 2 B, optical-mechanical system 20 is set in shell 10 and is located at top plate 110 and bottom plate 120
Between.Specifically, optical-mechanical system 20 includes light source module group 210, imaging modules 220 and light Transmission Part 230, wherein being imaged mould
The sides that group 220 is set to light source module group 210, and light Transmission Part 230 be connected to light source module group 210 and imaging modules 220 it
Between.In this embodiment, light Transmission Part 230 can be photoconductive tube, light guide pillar or other be used for transmission the element of light, and light source die
Group 210, imaging modules 220 and light Transmission Part 230 are arranged to L-shaped, and but not limited to this.In other embodiment, foundation is set
Meter demand, light source module group 210, imaging modules 220 and light Transmission Part 230 can be configured to straight line or any suitable shape.Light source
Light is transmitted to imaging modules 220 by module 210 by light Transmission Part 230, and imaging modules 220 are according to image data processing
Light is simultaneously projeced into formation image outside shell 10 by light.
Specifically, light source module group 210 includes multiple luminescence unit 212a, 212b, 212c and mixed light unit 214, wherein
Luminescence unit 212a, 212b, 212c are disposed on around mixed light unit 214, and are emitted beam to mixed light unit 214.In this
Embodiment, the side connection light Transmission Part 230 of mixed light unit 214, and luminescence unit 212a, 212b, 212c are to be respectively set
In mixed light unit 214 not homonymy (such as its excess-three side) and project the light with different colours or wavelength to mixed light unit 214
Line.The light of the receiving of mixed light unit 214 and mixed luminescence unit 212a, 212b, 212c injection is simultaneously exported to light Transmission Part 230
Mix light (such as white light).In this embodiment, luminescence unit 212a, 212b, 212c are preferably respectively output red, green, blue color
The light emitting diode of light, but not limited to this.In other embodiment, luminescence unit 212a, 212b, 212c can be to send out white
Or the light emitting diode of other color (or wavelength) light.Imaging modules 220 include lens unit 222 and image formation optical unit
224, wherein image formation optical unit 224 connects light Transmission Part 230 to receive light, and handles light according to image data and obtain
To corresponding target light, then target light is projeced into outside shell 10 by lens unit 222 and forms image.Implement in one
Example, image formation optical unit 224 include digital micro-mirror device (Digital Micromirror Device, DMD) 224a, basis
Image signal controls micro mirror to form image.
As shown in Figure 1B and Fig. 1 C, multiple cooling fins 30 are set to around optical-mechanical system 20, and plurality of cooling fin 30 is each
With multiple radiating fins 310, and multiple ventilating ducts 312 are formed between multiple radiating fins 310.As described above, multiple heat dissipations
Piece 30 is arranged to, and so that multiple top ventilation holes 112 are via multiple ventilating ducts 312, accordingly straight line is connected to multiple bottom ventilation holes
122.Referring to Fig. 1 C, multiple cooling fins 30 include the first cooling fin 30a, the second cooling fin 30b and third cooling fin 30c, wherein
First cooling fin 30a, the second cooling fin 30b and third cooling fin 30c are respectively arranged at three sides of light source module group 210, i.e.,
Corresponding luminescence unit 212a, 212b, 212c are respectively arranged at three sides of mixed light unit 214, so that multiple radiating fins 310
The corresponding side configured in parallel along three sides of mixed light unit 214 respectively, and radiating fin 310 is backwards to mixed light unit
214 extend.Thereby, ventilating duct 312 also along three sides of mixed light unit 214 configure, and each ventilating duct 312 be connected to it is corresponding
Push up ventilation hole 112 and bottom ventilation hole 122.For another viewpoint, multiple radiating fins 310 are to stand on top plate 110 and bottom plate
It, can be via corresponding ventilating duct 312 and bottom ventilation hole between 120, and when being watched towards bottom plate 120 by the top ventilation hole 112 of top plate 110
122 see through bottom plate 120.In other words, the top ventilation hole 112 of top plate 110, corresponding ventilating duct 312 and bottom ventilation hole 122 are to constitute
Straight line runs through the runner of shell 10.Thereby, projection arrangement 1 can reach effective heat dissipation by the free convection of air.
As shown in Figure 1 C, in an embodiment, multiple luminescence unit 212a, 212b, 212c are preferably attached at multiple respectively
Cooling fin (such as the first cooling fin 30a, the second cooling fin 30b and third cooling fin 30c).In other words, luminescence unit 212a,
212b, 212c are preferably attached to cooling fin 30 back on the surface of the side of radiating fin 310, to promote heat dissipation by its substrate
Benefit.
Furthermore as shown in Figure 3A, multiple thermal insulation barriers 140 may be disposed at the outer surface of top plate 110, with for user provide every
Thermal effect.Specifically, thermal insulation barriers 140 are to be made of different materials with top plate 110, and compared to top plate 110, thermal insulation barriers
140 have preferable heat insulation.In this embodiment, thermal insulation barriers 140 are preferably flexible material (such as silica gel), with for user
Preferable sense of touch and heat insulation are provided.In an embodiment, as shown in Figure 3B, thermal insulation barriers 140 are strip and are attached at rib
The surface of 114a.In another embodiment, as shown in Figure 3 C, there are multiple grooves 116, thermal insulation barriers 140 to be for the outer surface of top plate 110
It is inserted in groove 116.For example, groove 116 is formed at the surface of rib 114a ' and along the length side of rib 114a '
To extension, groove 116 is inserted into the bottom of strip thermal insulation barriers 140 so that thermal insulation barriers 140 protrude from top plate 110 (i.e. rib 114a ')
Surface.When projection arrangement 1 by cooling fin 30 and natural convection effect by thermal conductivity to shell 10 when, by thermal insulation barriers 140
Setting, avoidable user is in direct contact the higher top plate 110 of temperature, and provides preferable sense of touch simultaneously.
In addition, in an embodiment, as shown in Figure 1B, Fig. 1 C and Fig. 2A, projection arrangement of the invention additionally comprises auxiliary heat dissipation
Piece 32, and auxiliary heat dissipation piece 32 has multiple radiating fins 320.The preferably corresponding imaging modules 220 of auxiliary heat dissipation piece 32 are arranged,
Especially correspond to the digital micro-mirror device 224a settings of imaging modules 220.In this embodiment, auxiliary heat dissipation piece 32 is disposed on into
As the top of module 224, such as positioned at the top of imaging modules 224, or further extend partially into the top of lens unit 222
Portion, and digital micro-mirror device 224a is preferably disposed on the top of imaging modules 220 and is attached at auxiliary heat dissipation piece 32.Change speech
It, digital micro-mirror device 224a is preferably disposed on the top of imaging modules 224, and is attached to cooling fin 32 by its substrate and carries on the back
To on the surface of the side of radiating fin 320.In multiple radiating fins 320 of this embodiment, auxiliary heat dissipation piece 32 be parallel match
It sets and extends towards top plate 110 to form multiple secondary ventilation roads 322.Herein it may be noted that top ventilation hole 112, the side plate of top plate 110
130 side ventilation hole 132 preferably also corresponds to the setting of auxiliary heat dissipation piece 32 so that top ventilation hole 112, side ventilation hole 132, auxiliary are logical
Air duct 322 may make up radiating flow passage, to promote heat sinking benefit.
Furthermore projection arrangement additionally comprises at least one extension cooling fin 34, wherein it is from auxiliary heat dissipation to extend cooling fin 34
The side of piece 32 extends towards bottom plate 120, with positioned at the side of imaging modules 220.Extending cooling fin 34 has multiple radiating fins
340, the multiple radiating fins 340 for extending cooling fin 34 are along the side configured in parallel of imaging modules 220 to form multiple extensions
Ventilating duct 342, it is plurality of extend ventilating duct 342 accordingly straight line be connected to it is multiple top ventilation holes 112 at least one and
At least one of multiple bottom ventilation holes 122.Also that is, similar to above-mentioned, the top ventilation hole 112 of top plate 110 and bottom plate 120
Preferably also the corresponding cooling fin 34 that extends is arranged bottom ventilation hole 122 so that top ventilation hole 112 can pass through corresponding extension ventilating duct
342 straight lines are connected to bottom ventilation hole 122, to constitute the runner of free convection.In this embodiment, extend cooling fin 34 preferably from auxiliary
" ㄇ shapes " cooling fin for helping the both sides of cooling fin 32 to extend downwardly, and being integrated with auxiliary heat dissipation piece 32, but not as
Limit.In this embodiment, it is located at the extension cooling fin 34 of " ㄇ shapes " cooling fin both sides, radiating fin 340 is to extend backwards, to divide
Do not extend towards side plate 130 and light source module group 210.Extend heat dissipation according to configuration space, radiating requirements etc. in other embodiment
Piece 34 can be extended downwardly from more than the unilateral side or both sides of auxiliary heat dissipation piece 32, with " the L integrated with auxiliary heat dissipation piece 32
The cooling fin of shape " or other shapes.Herein it may be noted that extend that cooling fin 34 and auxiliary heat dissipation piece 32 be preferably one of the forming dissipates
Backing, but also can be the cooling fin of separation.When extending cooling fin 34 and auxiliary heat dissipation piece 32 integrates, extend cooling fin
34 radiating fin 340 and the radiating fin 320 of auxiliary heat dissipation piece 32 are preferably placed so that extending heat dissipation channel 342 distinguishes
Corresponding connection auxiliary heat dissipation channel 322, but not limited to this.Extend along 32 side of auxiliary heat dissipation piece in addition, extending cooling fin 34
Length, may be the same or different in the length of 32 side of auxiliary heat dissipation piece, not to be limited shown in embodiment.For example, when auxiliary
When cooling fin 32 being helped to be only arranged at the top of imaging modules 224, the side of imaging modules 224 can be only located at by extending cooling fin 34,
Also it may be further extended to the side of camera lens module 222.Alternatively, when auxiliary heat dissipation piece 32 is set to the top of imaging modules 224
And when extending to the top of camera lens module 222, the side of imaging modules 224 can be located at and extend to camera lens mould by extending cooling fin 34
The side of group 222, can also be only located at the side of imaging modules 224.
Furthermore projection arrangement of the invention separately can be by the configuration of optimization circuits plate, to reduce the influence of fuel factor.Tool
For body, projection arrangement of the invention additionally comprises multiple circuit boards (such as 410,420,430), wherein each circuit board has difference
Temperature/power.The present invention can carry out optimization configuration according to temperature/power height of each circuit board, to reduce fuel factor
It influences.As shown in fig. 4 a and fig. 4b, in an embodiment, projection arrangement additionally comprises circuit board 410,420, and wherein circuit board 410 is set
It is placed in 210 lower section of light source module group, and circuit board 420 is set to the side of imaging modules 220 and far from circuit board 410 and light source die
Group 210.For example, circuit board 410 is main circuit board, and circuit board 420 is power supply circuit plate, wherein power supply supply electricity
Temperature/power of road plate 420 is higher than temperature/power of main circuit board 410.In this embodiment, relative to bottom plate 120, main circuit
Plate 410 is horizontally placed on the lower section of light source module group 210, and power supply circuit plate 420 is uprightly set to the one of imaging modules 220
Side, power supply circuit plate 420 are set to far from imaging modules 220.Thereby, multiple circuits of projection arrangement 1 are distributed
The higher circuit board of temperature/power (such as power supply circuit plate 420) is especially independently placed, be can avoid by plate 410,420
Heat caused by circuit board 410,420 concentrates on same position (such as near light source module group 210) and aggravates the influence of fuel factor.
As shown in fig. 4 a and fig. 4b, in this embodiment, extend cooling fin 34 and be preferably disposed on circuit board 420 and imaging mould
Between group 220, with isolating circuit plate 420 and imaging modules 220.Also that is, it is from the one of auxiliary heat dissipation piece 32 to extend cooling fin 34
The bottom direction of side towards imaging modules 220 extends, be parallel to circuit board 420 and positioned at circuit board 420 and imaging modules 220 it
Between.In this embodiment, the radiating fin 340 of extension cooling fin 34 is directed towards circuit board 420 and extends, and the temperature of circuit board 420/
The higher element of power is preferably towards side plate 130, and the lower element of temperature/power of circuit board 420 is then towards heat radiating fin
Piece 340.Herein it may be noted that the bottom ventilation hole 122 of the top ventilation hole 112 of top plate 110 and bottom plate 120 is preferably also corresponding to extend heat dissipation
Piece 34 is arranged so that top ventilation hole 112 can be connected to bottom ventilation hole 122 by 342 straight line of corresponding ventilating duct, to constitute nature pair
The runner of stream (with reference to the related description of figure 1B).
In another embodiment, projection arrangement is the electronics member having according to temperature/power height or circuit board of circuit board
The heat sensitivity of part makees the configuration of different height, and plurality of circuit board is the height or its electronic component according to temperature/power
Heat sensitivity be sequentially stacked, there is lower temperature/power closer to the circuit board of bottom plate or closer to the circuit board of bottom plate
The electronic component having more easily is influenced by heat.As shown in Figure 5A, multiple circuit boards 410,430 are set under light source module group 210
Side, and parallel mat 120, wherein temperature/power of circuit board 410 are less than temperature/power of circuit board 430.For example, electric
Road plate 410 is the main circuit board of projector's running in order to control, and circuit board 430 is the drive circuit board for driving light source, wherein main
Circuit board 410 is set to 210 lower section of light source module group, and drive circuit board 430 is set to main circuit board 410 and light source module group 210
Between.As shown in Fig. 5 A and Fig. 5 B, projection arrangement additionally comprises metal heat-conducting piece 50, and wherein metal heat-conducting piece 50 includes body part
510 and extension 520.Body part 510 is the surface that essence is covered in circuit board 410,430, and extension 520 is from body part
510 bendings extend the side of circuit board 410,430.In an embodiment, metal heat-conducting piece 50 can be bent by aluminium sheet, wherein
Extension 520 be preferably smooth cooling fin (such as second cooling fin 30b) so that circuit board generate thermal energy be conducted to it is scattered
Backing 30b.
Furthermore as shown in Figure 5 B, circuit board 410 has the electronic component 412 of relatively low heat sensitivity, and circuit board 430 has
There is the electronic component 432 of higher thermal susceptibility, and metal heat-conducting piece 50 is inserted between circuit board 410 and 430, wherein electronics member
Part 412,432 is the apparent surface for the body part 510 for facing metal heat-conducting piece 50 respectively.Herein it may be noted that low-heat susceptibility
Electronic component 412 refers to the electronic component for being easier to be influenced by heat, and the electronic component 432 of high heat sensitivity refers to being less susceptible to be heated
The electronic component of influence.Also that is, when multiple circuit boards are stacked, the circuit with the easier electronic component being influenced by heat
Plate is preferably disposed on more lower section, and has on more the circuit board for the electronic component for being not easy to be influenced by heat preferably is disposed on
Side, so that low-heat susceptibility electronic component can more be operated in normal temperature.Projection arrangement additionally comprises (such as the heat conduction of Heat Conduction Material 60
Glue), wherein Heat Conduction Material 60 is to be filled between circuit board 410 and body part 510 and/or Heat Conduction Material 60 is filled in circuit board
Between 430 and body part 510, to promote heat via 50 heat conduction of metal heat-conducting piece to cooling fin 30b.Herein it may be noted that Fig. 5 A,
Though being painted the tool of metal heat-conducting piece 50, there are one extensions 520, and to attach cooling fin 30b, this is not limited.In other implementations
Example, metal heat-conducting piece can have the extension of one or more bendings, and extension can be attached at identical or different cooling fin
(such as 30a, 30b, 30c).In addition, the overbending direction of extension 520 can change according to design requirement, not be folded upward at for
Limit.In other embodiment, extension 520 can be bent downward from body part 510.Furthermore in this embodiment, though show metal
The surface of the body part 510 of heat-conducting piece 50 is plane, however in other embodiment, and body part 510 can be according to being set to its both sides
The electronic component-sized of circuit board, position, and with corresponding concave-convex surface.Furthermore though being only painted two in the present embodiment
Circuit board (such as 410,430) is stacked, and but not limited to this.It (is not painted) in other embodiment, when projection arrangement includes two
When the above circuit board (such as 410,410,430), multiple circuit boards 410,420,430 also can be according to the height of temperature/power
It is sequentially stacked, the circuit board closer to bottom plate has lower temperature/power, such as the main circuit board 410 that temperature/power is minimum
It is located nearest to bottom plate, the high drive circuit board 430 of temperature/power time is stacked and placed on main circuit board 410, and temperature/power phase
Highest power supply circuit plate 420 is then stacked on drive circuit board 430.The projection arrangement of the present invention is by by temperature/work(
The higher circuit board of rate is set to more top, and the lower circuit board of temperature/power is set to more lower section, may make low temperature/low
The circuit board of power is not heated by the circuit board of high temperature/high-capacity, and so that low temperature heat sensitivity element more can be in normal temperature
Running, and reach optimized to stream configuration.
Furthermore as shown in fig. 6, in another embodiment, projection arrangement of the invention by by circuit board be distributed and according to
The height of temperature/power is stacked, can further improve fuel factor influence.In this embodiment, the highest circuit board of temperature/power
420 are preferably disposed on the sides of imaging modules 224, and the relatively low circuit board 410 and 430 of temperature/power is preferably according to temperature
The height of degree/power is set to the lower section of light source module group 210.Illustrate with reference to the embodiment of figure 4B and Fig. 5 A, power supply circuit
Plate 420 is with highest temperature/power, drive circuit board 430 with time high temperature/power, and main circuit board 410 has phase
To minimum temperature and power.In this embodiment, power supply circuit plate 420 is disposed on the side of imaging modules 224 and remote
Separate with imaging modules 220 from light source module group 210, and by cooling fin 34 is extended, and main circuit board 420 is set to mixed light unit
Below 214 and it is closer to bottom plate 120, drive circuit board 430 is set between main circuit board 420 and mixed light unit 214.
In another embodiment, as shown in figs. 7 a and 7b, multiple circuit boards (such as 410a, 410b, 420,430) are settings
In the side of optical-mechanical system 20, plurality of circuit board 410a, 410b, 420,430 are uprightly to be arranged relative to bottom plate 120, with
So that at least one of multiple top ventilation holes 112 is straight by the space by multiple circuit board 410a, 410b, 420,430
Line is connected at least one of multiple bottom ventilation holes 122.Specifically, in response to space limitation and radiating requirements, multiple circuits
Plate 410a, 410b, 420,430 are preferably disposed on the side of imaging modules 220, and far from light source module group 210, i.e., multiple circuits
Plate 410a, 410b, 420,430 are preferably disposed on the side of the separate light source module group 210 of imaging modules 220, that is, multiple electricity
Road plate 410a, 410b, 420,430 and light source module group 210 are set to the opposite both sides of imaging modules 220.Furthermore in this implementation
Example, can independently design the control unit of input/output (I/O) unit and main circuit board, to form master control circuit board
(such as 410a) and input/output circuitry plate (such as 410b).In this embodiment, drive circuit board 430 is preferably disposed on into
The other side as module 224 relative to lens unit 222 is arranged, and master control circuit board 410a, input/output circuitry plate
410b, power supply circuit plate 420, which are preferably, to be arranged in imaging modules 224 relative to the other side interval of light source module group 210.
Herein it may be noted that though Fig. 7 A and Fig. 7 B are painted circuit board 430 is configured to extend vertically backwards to imaging modules 224,
It is not limited.In other embodiment, circuit board 430 can be configured to the side horizontal extension of parallel imaging module 224.Furthermore
When multiple circuit board 410a, 410b, 420,430 are spaced upright setting, the higher circuit board of temperature/power (such as power supply supplies
Answer circuit board 420) it is preferably disposed on outermost (or farthest away from imaging modules 220 at), and preferably make electronic component thereon
In face of the side ventilation hole 132 of side plate 130.In this embodiment, input/output circuitry plate 410b is disposed on master control circuit board
Between 410a and power supply circuit plate 420, and input/output circuitry plate 410b and power supply circuit plate 420 are to set opposite to each other
It sets so that electronic component thereon is towards opposite direction.Master control circuit board 410a is placed so that electronic component thereon
Towards the radiating fin 340 for extending cooling fin 34.In this embodiment, electronic component is arranged in circuit board 410a, 410b, 420,430
The normal direction of plate face be perpendicular to 120 normal to a surface direction of top plate 110 and bottom plate.Thereby so that circuit board 410a,
The ventilating duct being similar between radiating fin 310 is formed between 410b, 420,430.It divulges information in the top of this embodiment, top plate 110
Also corresponding circuits plate 410a, 410b, 420,430 are arranged the bottom ventilation hole 122 of hole 112 and bottom plate 120 so that top ventilation hole 112
It can be connected to bottom ventilation hole 122 by the space line by circuit board 410a, 410b, 420,430, to constitute the stream of free convection
Road.
Furthermore when projection arrangement is set to higher temperature environment or wants the enhancing intensity of light source, projection of the invention dress
Fan can be further equipped with improving heat radiation efficiency by setting.In another embodiment, as shown in Fig. 8 A and Fig. 8 B, projection arrangement can be into one
Step includes fan 70 and diversion member 80, and wherein fan 70 is set to bottom plate 120 and provides air-flow, and diversion member 80 corresponds to fan
Air-flow to be imported multiple ventilating ducts 312 of cooling fin 30 by 70 settings.Also that is, diversion member 80 and radiating fin 310 are set to
The same side of cooling fin 30, and fan 70 is set to the opposite side of cooling fin 30.Specifically, fan 70 can be blowing machine type wind
Fan, and about 90 degree of the angle of the inspiratory direction of fan 70 and gas supply direction.In this embodiment, fan 70 is from vertical base plate 120
Direction suction airflow (i.e. air), and air-flow is provided to diversion member 80 from the direction of parallel mat 120.Also that is, fan 70 carries
For the substantial air-flow vertical with multiple ventilating ducts 312, and diversion member 80 by air-flow with the multiple ventilating ducts of substantial out of plumb
312 mode imports multiple ventilating ducts 312.Furthermore fan 70 preferably corresponds to the centrally disposed of 30 enclosed range of multiple cooling fins.
In this embodiment, the center of preferably the enclosed ranges of three cooling fin 30a~30c of setting of fan 70, that is, fan 70 corresponds to
It is set to the bottom plate 120 of 210 lower section of light source module group.The preferably corresponding fan 70 of diversion member 80 is arranged and couples multiple cooling fins
30a~30c, the air-flow that fan 70 is provided enter multiple ventilating ducts 312 with 45 degree of angular direction of essence.In this embodiment, such as
Shown in Fig. 8 A, diversion member 80 is coupled with cooling fin 30a~30c respectively, is led with forming the ㄇ shapes that essence is trapped among around fan 70
Stream circle, but not limited to this.
In an embodiment, as shown in Figure 9 A, diversion member 80 includes multiple flow deflectors 810, and each in multiple ventilating ducts 312
It is provided at least one flow deflector 810, wherein each flow deflector 810 is coupled to the radiating fin adjacent with corresponding ventilating duct 312
310, so that the air-flow that fan 70 provides enters multiple ventilating ducts 312 of cooling fin 30a~30c with 45 degree of angular direction of essence.
Flow deflector 810 can be fixed on by modes such as adhesion, engagings on radiating fin 310, so that flow deflector 810 is adjacent scattered positioned at two
In ventilating duct 312 between hot fin 310.Flow deflector 810 is set to the position of ventilating duct 312 preferably close to fan 70 and close
312 bottom end of ventilating duct so that the air-flow provided from the outlet of fan 70 can more early contact flow deflector 810 and then promote water conservancy diversion effect.
In an embodiment, as shown in Figure 9 A, flow deflector 810 can be adhered to two adjacent heat radiation fins 310 with predetermined inclination or bending angle
Relative wall, and make fan 70 provide it is distinguished and admirable encounter flow deflector 810 after, by the guiding of flow deflector 810 preferably with reality
45 degree of angular direction of matter enter ventilating duct 312, use the heat for taking away radiating fin 310 and improving heat radiation efficiency.In another implementation
Example, as shown in Figure 9 B, flow deflector 810 can have holding section 812, and radiating fin 310 can have connecting hole 310a so that water conservancy diversion
Piece 810 is positioned at radiating fin 310 by holding section 812 with the engaging of connecting hole 310a.Herein it may be noted that though Fig. 9 B are painted
There are one holding sections 812 for each tool in 810 both sides of flow deflector to engage with the corresponding connecting hole 310a of each side radiating fin 310, but not
As limit.In other embodiment, multiple holding sections 812 can be arranged in 810 each side of flow deflector, and radiating fin 310 has correspondence
Multiple connecting hole 310a, plurality of connecting hole 310a can according to flow deflector 810 inclination or bending demand be distributed in heat dissipation
The appropriate location of fin 310, so that flow deflector 810 possesses required inclination or curved shape.
Furthermore though the embodiment of Fig. 9 A and Fig. 9 B be painted each ventilating duct 312 be arranged a flow deflector 810, not as
Limit.In another embodiment, as shown in Figure 9 C, single ventilation road 312 may be provided at least two flow deflectors (such as three flow deflectors
810a, 810b, 810c), wherein flow deflector 810a, 810b, 810c is arranged along wind direction, and the flow deflector closer from fan 70
The installation position of 810a is higher (i.e. closer to top plate 110).For example, three flow deflectors 810a, 810b, 810c are along fan 70
Air-out direction W configured in staged, flow deflector 810a be arranged closest to fan 70 it is farthest (i.e. position highest) from bottom plate 120,
Flow deflector 810c is farthest from fan 70 and is arranged from bottom plate 120 recently (i.e. position is minimum), and flow deflector 810b is then set to water conservancy diversion
Between piece 810a and flow deflector 810c.
Furthermore multiple flow deflectors 810 can be the flow deflector of separation, and each flow deflector 810 is inserted in adjacent heat radiation fin respectively
Ventilating duct 312 between 310, but not limited to this, and single flow deflector group can be integrated into the multiple flow deflectors of other embodiment 810
It closes.In another embodiment, as shown in Figure 10, diversion member 80 additionally comprises connection sheet 820, and multiple flow deflectors 810 are connected to
The same side of contact pin 820 is simultaneously spaced setting.Specifically, the width D w of flow deflector 810 is preferably substantially equal to the width of ventilating duct 312
It spends, the interval G between adjacent baffle 810 is the thickness of radiating fin 310, and but not limited to this.In other embodiment, water conservancy diversion
The width D w of piece 810 can be slightly less than the width of ventilating duct 312, and the interval G between adjacent baffle 810 may be slightly larger than radiating fin
310 thickness.It, can by connection sheet 820 so that multiple flow deflectors 810 connect into the diversion member 80 of monolithic in this embodiment
Simplify the assembly program of diversion member 80 and cooling fin 30, promotes packaging efficiency.
In another embodiment, as shown in FIG. Figure 11 A and 11 B, diversion member 80A is arc flow deflector, and arc flow deflector
With multiple coupling aperture 830 to be respectively coupled to multiple radiating fins 310 of cooling fin 30.Specifically, diversion member 80A is whole
The sheet material of piece, and multiple coupling aperture 830 correspond to the position of radiating fin 310 and thickness opens up, so that each radiating fin 310 can
In the corresponding coupling aperture of partial insertion 830.Herein it may be noted that the width Ow of coupling aperture 830 is desirably equal to or is slightly larger than heat radiating fin
The thickness of piece 310, and the length OL of coupling aperture 830 can change according to inclination or the bending demand of diversion member 80A.In addition,
The diversion member 80A of arc water conservancy diversion chip can also form above-mentioned holding section 812 in the two side in coupling aperture 830, with dissipate
The connecting hole 310a engagings of hot fin 310, and then diversion member 80A is positioned in cooling fin 30.
Furthermore the heat dissipation design of projection arrangement of the invention can be applied to other and need the electronics to radiate due to heat source
Device, such as desktop/notebook computer etc., are not limited to projection arrangement.In an embodiment, as shown in figure 12, electronic device 90
It may include heat source 910, at least one cooling fin 920, fan 930 and diversion member 940.At least one cooling fin 920 is set to
Around heat source 910, wherein cooling fin 920 has multiple radiating fins 922, and is formed between multiple radiating fins 922 multiple logical
Air duct 924.Fan 930 corresponds to cooling fin 920 and is arranged, to provide air-flow substantially vertical with multiple ventilating ducts 924.Water conservancy diversion member
Part 940 corresponds to fan 930 and is arranged, air-flow is imported multiple ventilating ducts in a manner of the multiple ventilating ducts of substantial out of plumb 924
924.For example, when applied to computer, heat source 910 can be central processing unit, and at least one cooling fin 920, fan 930
And diversion member 940 can have with optical-mechanical system 20 (especially light source module group 210) in above-mentioned projection arrangement be heat source when radiate
The similar configuration of piece 30, fan 70 and diversion member 80 (or 80A).Also that is, fan 930 is from 90 outer suction airflow of electronic device
(i.e. air), and to be substantially parallel to the direction suction airflow of multiple ventilating ducts 924 and provide air-flow to diversion member 940.Tool
For body, the direction Wi of 930 suction airflow of the fan and direction Wo for providing air-flow about accompanies an angle of 90 degrees, and diversion member 940 can
Any form of implementation with above-mentioned Fig. 9 A~Figure 11 B, the air-flow that fan 930 is provided is oriented to be pressed from both sides with suction airflow direction Wi
There is the guiding direction Wh less than an angle of 90 degrees (preferably 45 degree of angles) to enter the ventilating duct 924 between radiating fin 922.It needs to note herein
Meaning, each component details of electronic device 90 and configuration can refer to the related description of above-mentioned projection arrangement embodiment, no longer superfluous in this
It states.
Compared to prior art, projection arrangement of the invention coordinates cooling fin by the top ventilation hole and bottom ventilation hole of shell
Upright configuration, efficient Natural Heat Convection mechanism is can reach, the rotating speed of fan is greatly reduced or even exempts fan
Use, and then the noise that generates when reducing fan running.Furthermore projection arrangement of the invention has optimized circuit board
Configuration design and the setting of metal heat-conducting piece, can reduce the influence of fuel factor, lifting device function.In addition, the projection of the present invention
Device can coordinate the design of fan and diversion member, not only may be used with the heat dissipation design of further improving heat radiation efficiency, and the present invention
Applied to projection arrangement, more can be applied to it is any have heat source and need the electronic device to radiate.
The present invention is described by above-mentioned related embodiment, however above-described embodiment is only the example for implementing the present invention.
It must be noted that the embodiment disclosed is not limiting as the scope of the present invention.On the contrary, do not depart from the present invention spirit and
It is changed and retouched made by range, belongs to the scope of patent protection of the present invention.
Claims (10)
1. a kind of projection arrangement, which is characterized in that include：
Shell；
Optical-mechanical system is set in the shell, which includes light source module group and imaging modules；And
Auxiliary heat dissipation piece is set to the top of the imaging modules, and the auxiliary heat dissipation piece has multiple radiating fins, multiple auxiliary
It helps radiating fin configured in parallel and extends towards the top-direction far from the imaging modules, to form multiple secondary ventilation roads.
2. projection arrangement as described in claim 1, which is characterized in that additionally comprise at least one extension cooling fin, wherein this prolongs
It stretches bottom direction of the cooling fin from the side of the extension cooling fin towards the imaging modules to extend, with positioned at the side of the imaging modules
Side, the extension cooling fin have multiple radiating fins, and multiple radiating fins of the extension cooling fin are along the side of the imaging modules
For side configured in parallel to form multiple extension ventilating ducts, multiple extension ventilating duct is accordingly connected to multiple secondary ventilation road.
3. projection arrangement as claimed in claim 2, which is characterized in that the extension cooling fin is integrated into one with the auxiliary heat dissipation piece
" L-shaped " of body.
4. projection arrangement as described in claim 1, which is characterized in that additionally comprise at least two extension cooling fins, wherein this prolongs
It stretches bottom direction of the cooling fin from the both sides of the cooling fin towards the imaging modules to extend, positioned at the side of the imaging modules, to be somebody's turn to do
Extending cooling fin has multiple radiating fins, multiple radiating fins of the extension cooling fin parallel along the side of the imaging modules
To form multiple extension ventilating ducts, multiple extension ventilating duct is accordingly connected to multiple secondary ventilation road for configuration.
5. projection arrangement as claimed in claim 4, which is characterized in that the auxiliary heat dissipation piece is integrated into one with the extension cooling fin
" ㄇ shapes " cooling fin of body.
6. projection arrangement as claimed in claim 5, which is characterized in that be located at the auxiliary heat dissipation piece of " ㄇ shapes " cooling fin both sides
Radiating fin be to extend backwards, be respectively facing the shell side plate and the light source module group extend.
7. the projection arrangement as described in claim 2 or 4, which is characterized in that the imaging modules include camera lens module, and this prolongs
Stretch the side that cooling fin extends to camera lens module.
8. the projection arrangement as described in claim 2 or 4, which is characterized in that the cooling fin and the auxiliary heat dissipation piece are integrated
Molding.
9. projection arrangement as described in claim 1, which is characterized in that the imaging modules include digital micro-mirror device, the number
Micro-mirror device is set to the top of the imaging modules and is attached at the cooling fin.
10. projection arrangement as described in claim 1, which is characterized in that the shell includes top plate and side plate, which has more
A top ventilation hole, and the side plate has multiple side ventilation holes, the top ventilation hole, the side ventilation hole and the ventilating duct may make up heat dissipation
Runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810088972.9A CN108445699A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510237891.7A CN104834167A (en) | 2015-05-12 | 2015-05-12 | Projection device |
| CN201510507599.2A CN105159018B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201810088972.9A CN108445699A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510507599.2A Division CN105159018B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108445699A true CN108445699A (en) | 2018-08-24 |
Family
ID=53812142
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510237891.7A Pending CN104834167A (en) | 2015-05-12 | 2015-05-12 | Projection device |
| CN201510507599.2A Active CN105159018B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201810088972.9A Pending CN108445699A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201810089613.5A Pending CN108490723A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201510506079.XA Active CN105072873B (en) | 2015-05-12 | 2015-08-18 | Electronic installation |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510237891.7A Pending CN104834167A (en) | 2015-05-12 | 2015-05-12 | Projection device |
| CN201510507599.2A Active CN105159018B (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810089613.5A Pending CN108490723A (en) | 2015-05-12 | 2015-08-18 | Projection arrangement |
| CN201510506079.XA Active CN105072873B (en) | 2015-05-12 | 2015-08-18 | Electronic installation |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104834167A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
| CN109955474A (en) * | 2017-12-22 | 2019-07-02 | 深圳冠特家居健康***有限公司 | It is a kind of can rapid cooling 3D printer |
| WO2019227393A1 (en) * | 2018-05-31 | 2019-12-05 | 深圳市大疆创新科技有限公司 | Heat dissipating system and photographic device |
| CN208752380U (en) | 2018-08-03 | 2019-04-16 | 中强光电股份有限公司 | Projection arrangement |
| CN208521126U (en) | 2018-08-03 | 2019-02-19 | 中强光电股份有限公司 | Projection arrangement |
| CN109739066A (en) * | 2019-02-01 | 2019-05-10 | 深圳一维山科技有限公司 | Micro projector |
| WO2020253167A1 (en) | 2019-06-20 | 2020-12-24 | 青岛海信激光显示股份有限公司 | Laser projection device |
| CN112526806B (en) * | 2019-09-19 | 2022-10-21 | 青岛海信激光显示股份有限公司 | Laser projection device |
| CN112114476B (en) * | 2019-06-20 | 2022-08-30 | 青岛海信激光显示股份有限公司 | Laser projection device |
| CN210725817U (en) * | 2019-09-04 | 2020-06-09 | 中兴通讯股份有限公司 | Composite tooth radiator and communication base station |
| CN112526810B (en) * | 2019-09-19 | 2022-10-14 | 青岛海信激光显示股份有限公司 | Laser projection device |
| CN110687739A (en) * | 2019-10-31 | 2020-01-14 | 青岛海信激光显示股份有限公司 | Laser projection device |
| CN113050352B (en) * | 2021-03-09 | 2022-04-22 | 深圳市火乐科技发展有限公司 | Radiator for DMD chip and projection equipment |
Citations (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1187634A (en) * | 1996-10-04 | 1998-07-15 | 精工爱普生株式会社 | Projection type display apparatus |
| JPH10239774A (en) * | 1997-02-28 | 1998-09-11 | Nec Corp | Liquid crystal projector device |
| JP2001255528A (en) * | 2000-03-14 | 2001-09-21 | Sharp Corp | Transmissive liquid crystal display device |
| CN1381765A (en) * | 2001-04-16 | 2002-11-27 | 财团法人工业技术研究院 | Cooler for liquid crystal projector |
| KR20030025343A (en) * | 2001-09-20 | 2003-03-29 | 삼성전자주식회사 | Projection display device |
| CN2588416Y (en) * | 2002-10-31 | 2003-11-26 | 大亿科技股份有限公司 | Projector with light-shading effect |
| CN2594832Y (en) * | 2002-12-31 | 2003-12-24 | 上海华显数字影像技术有限公司 | Optical engine radiator for LCDS liquid crystal panel projectnig TV set |
| WO2004003660A1 (en) * | 2002-07-01 | 2004-01-08 | Bård Eker Industrial Design As | Projector |
| JP2004279778A (en) * | 2003-03-17 | 2004-10-07 | Seiko Epson Corp | Projector |
| JP2004354795A (en) * | 2003-05-30 | 2004-12-16 | Tochigi Nikon Corp | Projection type display device |
| CN1605929A (en) * | 2003-10-07 | 2005-04-13 | 精工爱普生株式会社 | Optical device and rear projector |
| EP1569467A2 (en) * | 2004-02-27 | 2005-08-31 | LumiLeds Lighting U.S., LLC | Illumination system with aligned leds |
| CN1677227A (en) * | 2004-03-30 | 2005-10-05 | 三洋电机株式会社 | Illuminating device, and projection type video display |
| CN1704839A (en) * | 2004-05-31 | 2005-12-07 | 株式会社东芝 | Projection-type image display apparatus |
| KR20060017292A (en) * | 2004-08-20 | 2006-02-23 | 엘지전자 주식회사 | Cooler for digital micro-mirror device of optical projector |
| KR20060068134A (en) * | 2004-12-16 | 2006-06-21 | 정건영 | Liquid crystal project heat-emitting system |
| US20060209267A1 (en) * | 2005-03-17 | 2006-09-21 | Casio Computer Co., Ltd. | Projection apparatus, ceiling hanging hardware for projection apparatus, and method of controlling operation of projection apparatus |
| CN1867863A (en) * | 2003-10-10 | 2006-11-22 | 精工爱普生株式会社 | Projector |
| CN1873522A (en) * | 2005-06-01 | 2006-12-06 | 普立尔科技股份有限公司 | Projector, and method of heat elimination |
| CN101101439A (en) * | 2007-07-25 | 2008-01-09 | 四川长虹电器股份有限公司 | Projector heat radiation-treatment wind-guiding device |
| JP2008003183A (en) * | 2006-06-21 | 2008-01-10 | Sony Corp | Cooling fan motor and projection display device |
| CN101275787A (en) * | 2007-03-29 | 2008-10-01 | 三洋电机株式会社 | Apparatus including freezing unit and projector including freezing unit |
| CN101308318A (en) * | 2007-05-17 | 2008-11-19 | 中强光电股份有限公司 | Light gate device |
| JP2009038144A (en) * | 2007-07-31 | 2009-02-19 | Sony Corp | Shield case and electronic component unit |
| CN100498513C (en) * | 2005-03-08 | 2009-06-10 | 三星电子株式会社 | Cooling apparatus and a projector having the same |
| CN101498886A (en) * | 2008-01-29 | 2009-08-05 | 佳世达科技股份有限公司 | Image forming apparatus capable of regulating light shielding rate of radiating hole according to external environment brightness |
| CN101535891A (en) * | 2006-10-31 | 2009-09-16 | 三洋电机株式会社 | Projector |
| JP2010032922A (en) * | 2008-07-30 | 2010-02-12 | Nec Corp | Heat generation part cooler, and liquid crystal projector device |
| CN101726974A (en) * | 2008-10-20 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN101726973A (en) * | 2008-10-20 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| KR20100119096A (en) * | 2009-04-30 | 2010-11-09 | 엘지전자 주식회사 | Image projecting apparatus |
| CN101986199A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Heat pipe cooling system for liquid crystal on silicon (LCOS) projector |
| CN101995747A (en) * | 2010-12-14 | 2011-03-30 | 天津爱安特科技股份有限公司 | Heat radiation system for 3 liquid crystal display (LCD) projectors by adopting three LED lamp panels as light source |
| CN102057328A (en) * | 2008-06-13 | 2011-05-11 | 松下电器产业株式会社 | Image display device |
| CN202394030U (en) * | 2011-09-14 | 2012-08-22 | 华柏光电股份有限公司 | Micro optical imaging device |
| WO2013147068A1 (en) * | 2012-03-30 | 2013-10-03 | 株式会社Ｊｖｃケンウッド | Projection device |
| CN103399451A (en) * | 2013-08-16 | 2013-11-20 | 深圳市帅映科技有限公司 | Laser projection machine |
| CN104834168A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
| CN104834167A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
| JPH08222665A (en) * | 1995-02-16 | 1996-08-30 | Fujitsu Ltd | Heat sink |
| US6147411A (en) * | 1998-03-31 | 2000-11-14 | Micron Technology, Inc. | Vertical surface mount package utilizing a back-to-back semiconductor device module |
| DE19926007B4 (en) * | 1998-07-09 | 2004-08-19 | Georg Fischer Rohrleitungssysteme Ag | housing unit |
| MXPA03004441A (en) * | 2000-11-20 | 2005-01-25 | Intel Corp | High performance heat sink configurations for use in high density packaging applications. |
| JP2002271074A (en) * | 2001-03-08 | 2002-09-20 | Toshiba Corp | Cooling device and electronic equipment provided with built-in cooling device |
| US6479895B1 (en) * | 2001-05-18 | 2002-11-12 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
| TW540985U (en) * | 2002-07-16 | 2003-07-01 | Delta Electronics Inc | Improved heat sink |
| JP4454233B2 (en) * | 2003-01-30 | 2010-04-21 | 京セラ株式会社 | Optical package and optical module using the same |
| US7539017B2 (en) * | 2003-03-27 | 2009-05-26 | Kuo Ta Chang | Heat dissipating device for central processor |
| US7112885B2 (en) * | 2003-07-07 | 2006-09-26 | Board Of Regents, The University Of Texas System | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| CN1591280A (en) * | 2003-09-01 | 2005-03-09 | 中美万泰科技股份有限公司 | Non-fan type computer device radiator |
| JP4217917B2 (en) * | 2006-03-14 | 2009-02-04 | 船井電機株式会社 | LCD television or heat sink fixing structure |
| CN2930219Y (en) * | 2006-06-20 | 2007-08-01 | 中兴通讯股份有限公司 | Heat radiator mounting device |
| CN201039635Y (en) * | 2006-11-02 | 2008-03-19 | 华为技术有限公司 | Heat radiation structure |
| JP2008235321A (en) * | 2007-03-16 | 2008-10-02 | Matsushita Electric Ind Co Ltd | Heat conductive substrate and manufacturing method, and circuit module using the same |
| US7766076B2 (en) * | 2007-03-23 | 2010-08-03 | Rocky Research | Spot cooler for heat generating electronic components |
| CN201115248Y (en) * | 2007-09-14 | 2008-09-10 | 杭州华三通信技术有限公司 | A heat radiator |
| JP5062014B2 (en) * | 2008-04-17 | 2012-10-31 | セイコーエプソン株式会社 | Electronic circuit module, power supply device, projector |
| CN101620368B (en) * | 2008-07-04 | 2011-12-28 | 富准精密工业(深圳)有限公司 | Projector with cooling system |
| JP2010087031A (en) * | 2008-09-29 | 2010-04-15 | Tdk-Lambda Corp | Electronic apparatus |
| EP2247172B1 (en) * | 2009-04-27 | 2013-01-30 | Siemens Aktiengesellschaft | Cooling system, cooling board and assembly with cooling system |
| CN201440780U (en) * | 2009-05-22 | 2010-04-21 | 英业达股份有限公司 | Fixing device |
| US20120106173A1 (en) * | 2009-07-02 | 2012-05-03 | Ccs Inc. | Light source device |
| CN101963743B (en) * | 2009-07-24 | 2011-12-14 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN101644878B (en) * | 2009-09-03 | 2012-01-04 | 苏州佳世达光电有限公司 | Projecting device |
| CN201556020U (en) * | 2009-11-13 | 2010-08-18 | 鑫亿光电(深圳)有限公司 | Optical engine cooling device of micro projector |
| TW201116982A (en) * | 2009-11-13 | 2011-05-16 | Sunonwealth Electr Mach Ind Co | Cooling module |
| CN201600540U (en) * | 2009-12-04 | 2010-10-06 | 彩亿科技(深圳)有限公司 | Cooling device of mini projector optical engine |
| CN101848627A (en) * | 2010-02-10 | 2010-09-29 | 苏州佳世达光电有限公司 | Electronic device and projecting camera |
| CN102455762A (en) * | 2010-10-26 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Mainboard and electronic device equipped with same |
| CN102467200A (en) * | 2010-11-12 | 2012-05-23 | 英业达股份有限公司 | Server cabinet |
| JP5614542B2 (en) * | 2011-03-28 | 2014-10-29 | 株式会社安川電機 | Motor control device |
| CN103037664A (en) * | 2011-10-06 | 2013-04-10 | 鸿富锦精密工业（深圳）有限公司 | Radiating device and electronic device using same |
| CN103153021A (en) * | 2011-12-07 | 2013-06-12 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and wind guide cover thereof |
| CN202600344U (en) * | 2012-04-10 | 2012-12-12 | 星盛光电股份有限公司 | Heat-dissipating module structure for projection device |
| CN202613540U (en) * | 2012-05-04 | 2012-12-19 | 米技电子电器(上海)有限公司 | Improved heat dissipating structure of commercial induction cooker |
| TWM447998U (en) * | 2012-06-28 | 2013-03-01 | Hwa Best Optoelectronics Co Ltd | Mini optical image device |
| CN203026618U (en) * | 2012-11-02 | 2013-06-26 | 许昌学院电气信息工程学院 | Novel power storage battery activating instrument device |
| JP6413362B2 (en) * | 2013-06-21 | 2018-10-31 | 日亜化学工業株式会社 | Light source device and optical engine using light source device |
| CN103763874A (en) * | 2013-11-26 | 2014-04-30 | 四川蓝讯宝迩电子科技有限公司 | Heat-dissipation installation box of circuit board |
| KR101403554B1 (en) * | 2014-04-04 | 2014-06-09 | (주)디에이치씨 | Heat sink unit equipped type printed circuit board with excellent heat dissapation efficiency and stack package having the same |
| CN104460195A (en) * | 2014-11-24 | 2015-03-25 | 天津市君威科技发展有限公司 | Small projector |
| CN104582438A (en) * | 2014-12-25 | 2015-04-29 | 苏州佳世达光电有限公司 | Cooling structure |
-
2015
- 2015-05-12 CN CN201510237891.7A patent/CN104834167A/en active Pending
- 2015-08-18 CN CN201510507599.2A patent/CN105159018B/en active Active
- 2015-08-18 CN CN201810088972.9A patent/CN108445699A/en active Pending
- 2015-08-18 CN CN201810089613.5A patent/CN108490723A/en active Pending
- 2015-08-18 CN CN201510506079.XA patent/CN105072873B/en active Active
Patent Citations (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1187634A (en) * | 1996-10-04 | 1998-07-15 | 精工爱普生株式会社 | Projection type display apparatus |
| JPH10239774A (en) * | 1997-02-28 | 1998-09-11 | Nec Corp | Liquid crystal projector device |
| JP2001255528A (en) * | 2000-03-14 | 2001-09-21 | Sharp Corp | Transmissive liquid crystal display device |
| CN1381765A (en) * | 2001-04-16 | 2002-11-27 | 财团法人工业技术研究院 | Cooler for liquid crystal projector |
| KR20030025343A (en) * | 2001-09-20 | 2003-03-29 | 삼성전자주식회사 | Projection display device |
| WO2004003660A1 (en) * | 2002-07-01 | 2004-01-08 | Bård Eker Industrial Design As | Projector |
| CN2588416Y (en) * | 2002-10-31 | 2003-11-26 | 大亿科技股份有限公司 | Projector with light-shading effect |
| CN2594832Y (en) * | 2002-12-31 | 2003-12-24 | 上海华显数字影像技术有限公司 | Optical engine radiator for LCDS liquid crystal panel projectnig TV set |
| JP2004279778A (en) * | 2003-03-17 | 2004-10-07 | Seiko Epson Corp | Projector |
| JP2004354795A (en) * | 2003-05-30 | 2004-12-16 | Tochigi Nikon Corp | Projection type display device |
| CN1605929A (en) * | 2003-10-07 | 2005-04-13 | 精工爱普生株式会社 | Optical device and rear projector |
| US20050094105A1 (en) * | 2003-10-07 | 2005-05-05 | Seiko Epson Corporation | Optical device and rear projector |
| CN1867863A (en) * | 2003-10-10 | 2006-11-22 | 精工爱普生株式会社 | Projector |
| EP1569467A2 (en) * | 2004-02-27 | 2005-08-31 | LumiLeds Lighting U.S., LLC | Illumination system with aligned leds |
| CN1677227A (en) * | 2004-03-30 | 2005-10-05 | 三洋电机株式会社 | Illuminating device, and projection type video display |
| CN1704839A (en) * | 2004-05-31 | 2005-12-07 | 株式会社东芝 | Projection-type image display apparatus |
| KR20060017292A (en) * | 2004-08-20 | 2006-02-23 | 엘지전자 주식회사 | Cooler for digital micro-mirror device of optical projector |
| KR100717544B1 (en) * | 2004-12-16 | 2007-05-17 | 주식회사 현대사 | Liquid crystal project heat-emitting system |
| KR20060068134A (en) * | 2004-12-16 | 2006-06-21 | 정건영 | Liquid crystal project heat-emitting system |
| CN100498513C (en) * | 2005-03-08 | 2009-06-10 | 三星电子株式会社 | Cooling apparatus and a projector having the same |
| US20060209267A1 (en) * | 2005-03-17 | 2006-09-21 | Casio Computer Co., Ltd. | Projection apparatus, ceiling hanging hardware for projection apparatus, and method of controlling operation of projection apparatus |
| CN1873522A (en) * | 2005-06-01 | 2006-12-06 | 普立尔科技股份有限公司 | Projector, and method of heat elimination |
| JP2008003183A (en) * | 2006-06-21 | 2008-01-10 | Sony Corp | Cooling fan motor and projection display device |
| CN101535891A (en) * | 2006-10-31 | 2009-09-16 | 三洋电机株式会社 | Projector |
| CN101275787A (en) * | 2007-03-29 | 2008-10-01 | 三洋电机株式会社 | Apparatus including freezing unit and projector including freezing unit |
| CN101308318A (en) * | 2007-05-17 | 2008-11-19 | 中强光电股份有限公司 | Light gate device |
| CN101101439A (en) * | 2007-07-25 | 2008-01-09 | 四川长虹电器股份有限公司 | Projector heat radiation-treatment wind-guiding device |
| JP2009038144A (en) * | 2007-07-31 | 2009-02-19 | Sony Corp | Shield case and electronic component unit |
| CN101498886A (en) * | 2008-01-29 | 2009-08-05 | 佳世达科技股份有限公司 | Image forming apparatus capable of regulating light shielding rate of radiating hole according to external environment brightness |
| CN102057328A (en) * | 2008-06-13 | 2011-05-11 | 松下电器产业株式会社 | Image display device |
| JP2010032922A (en) * | 2008-07-30 | 2010-02-12 | Nec Corp | Heat generation part cooler, and liquid crystal projector device |
| CN101726974A (en) * | 2008-10-20 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN101726973A (en) * | 2008-10-20 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| KR20100119096A (en) * | 2009-04-30 | 2010-11-09 | 엘지전자 주식회사 | Image projecting apparatus |
| CN101986199A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Heat pipe cooling system for liquid crystal on silicon (LCOS) projector |
| CN101995747A (en) * | 2010-12-14 | 2011-03-30 | 天津爱安特科技股份有限公司 | Heat radiation system for 3 liquid crystal display (LCD) projectors by adopting three LED lamp panels as light source |
| CN202394030U (en) * | 2011-09-14 | 2012-08-22 | 华柏光电股份有限公司 | Micro optical imaging device |
| WO2013147068A1 (en) * | 2012-03-30 | 2013-10-03 | 株式会社Ｊｖｃケンウッド | Projection device |
| CN103399451A (en) * | 2013-08-16 | 2013-11-20 | 深圳市帅映科技有限公司 | Laser projection machine |
| CN104834168A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
| CN104834167A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105072873A (en) | 2015-11-18 |
| CN105159018B (en) | 2018-03-06 |
| CN108490723A (en) | 2018-09-04 |
| CN105072873B (en) | 2017-09-29 |
| CN104834167A (en) | 2015-08-12 |
| CN105159018A (en) | 2015-12-16 |
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Application publication date: 20180824 |