TWM447998U - Mini optical image device - Google Patents
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- TWM447998U TWM447998U TW101212476U TW101212476U TWM447998U TW M447998 U TWM447998 U TW M447998U TW 101212476 U TW101212476 U TW 101212476U TW 101212476 U TW101212476 U TW 101212476U TW M447998 U TWM447998 U TW M447998U
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Description
本創作係一種微型光學影像裝置，尤其關於一種具有散熱模組之微型光學影像裝置。This creation is a miniature optical imaging device, and more particularly to a miniature optical imaging device having a heat dissipation module.
日常生活中，投影裝置經常被用來將圖文或影像資料投射放大於投射面上，令使用者觀看時具有視覺上的舒適性，輕鬆地達到娛樂之效果。In daily life, the projection device is often used to project graphics or image data onto the projection surface, so that the user can visually enjoy the viewing and easily achieve the entertainment effect.
以往投影裝置所使用之光源乃是以高壓放電的原理製作，其不但耗電且體積大，一直是投影裝置設計上的瓶頸。不過近年來發光二極體(LED，Light-Emitting Diode)之發光功率及可達流明數值已被大幅提高，因此，以發光二極體作為投影裝置之光源已成為主要的趨勢。然而，隨著光源的功率及流明數日漸提升，其運作時所產生的熱能亦隨之增加，使得投影裝置內的溫度明顯攀升，如此一來，容易影響投影裝置內之相關電子元件的使用壽命與可靠性；因此，投影裝置的散熱設計是影響其成像品質的關鍵因素之一。In the past, the light source used in the projection device was fabricated on the principle of high-voltage discharge, which not only consumes electricity but also has a large volume, and has always been a bottleneck in the design of the projection device. However, in recent years, the luminous power and the luminous lumen value of the LED (Light-Emitting Diode) have been greatly improved. Therefore, the use of a light-emitting diode as a light source of a projection device has become a major trend. However, as the power and lumens of the light source increase, the heat energy generated during operation increases, which causes the temperature inside the projection device to rise significantly, which easily affects the service life of the relevant electronic components in the projection device. And reliability; therefore, the thermal design of the projection device is one of the key factors affecting its image quality.
請參閱圖1，其為習知投影裝置的結構示意圖。投影裝置9 具有殼體91、用以將影像畫面向外投射的光學鏡頭92以及位於殼體91內的複數電子元件(圖中未標示)；其中，殼體91的側面具有一通口911，且於通口911處設置有一垂直於殼體91之底面的風扇93，用以將殼體91內的熱能向外排出。此外，傳統的散熱技術中，更會於投影裝置9的熱源處(如光源處，圖中未標示)貼附一散熱片(圖中未標示)，以提升散熱效率。Please refer to FIG. 1 , which is a schematic structural diagram of a conventional projection device. Projection device 9 The housing 91 has an optical lens 92 for projecting the image frame outward and a plurality of electronic components (not shown) located in the housing 91. The side surface of the housing 91 has a port 911 and is open at the port. A fan 93 perpendicular to the bottom surface of the casing 91 is provided at 911 for discharging the heat energy inside the casing 91 outward. In addition, in the conventional heat dissipation technology, a heat sink (not shown) is attached to the heat source of the projection device 9 (such as a light source, not shown) to improve heat dissipation efficiency.
然而，現今電子設備均有朝向輕、薄、短小之設計趨勢來符合人性的需求，因此投影裝置也不例外地趨於微小化，俾能應用於3G手機、PDA等電子產品，亦或成為一種可隨身攜帶的微型投影裝置。然而，微型投影裝置因其內部空間狹小，使得其內部的熱流密度極劇上升，故傳統僅以風扇及散熱片作為散熱手段的散熱技術已不能滿足現今應有的散熱需求However, today's electronic devices have a trend toward light, thin, and short to meet the needs of human nature. Therefore, projection devices are no exception to miniaturization, and can be applied to electronic products such as 3G mobile phones, PDAs, or the like. A miniature projection device that can be carried with you. However, due to the narrow internal space of the micro-projection device, the heat flux density inside the device is extremely high. Therefore, the conventional heat dissipation technology using only the fan and the heat sink as the heat dissipation means can not meet the heat dissipation demand that should be required today.
是以，習知微型投影裝置的散熱設計仍亟待改善。Therefore, the heat dissipation design of the conventional micro-projection device still needs to be improved.
本創作之主要目的在提供一種微型光學影像裝置，尤其係關於一種具有至少二熱管且該至少二熱管相互上下錯開並交叉排列的微型光學影像裝置。The main object of the present invention is to provide a miniature optical imaging device, and more particularly to a micro-optical imaging device having at least two heat pipes and the at least two heat pipes being staggered and arranged one above another.
於一較佳實施例中，本創作提供一種微型光學影像裝置，包括： 一光學引擎，具有一第一熱源以及一第二熱源；以及一散熱模組，包括一第一散熱手段以及一第二散熱手段，該第一散熱手段係設置於該第一熱源之鄰近處，以使該第一熱源所產生之至少部分熱能係經由該第一散熱手段而被向外排出，且該第二散熱手段係設置於該第二熱源之鄰近處，以使該第二熱源所產生之至少部分熱能係經由該第二散熱手段而被被向外排出；其中，該第一散熱手段與該第二散熱手段分別包括一第一熱管以及一第二熱管，且該第一熱管以及該第二熱管係相互上下錯開且交叉排列。In a preferred embodiment, the present disclosure provides a miniature optical imaging device comprising: An optical engine having a first heat source and a second heat source; and a heat dissipation module including a first heat dissipation means and a second heat dissipation means, the first heat dissipation means being disposed adjacent to the first heat source So that at least part of the thermal energy generated by the first heat source is discharged outward through the first heat dissipation means, and the second heat dissipation means is disposed adjacent to the second heat source to generate the second heat source. At least part of the heat energy is discharged to the outside through the second heat dissipating means; wherein the first heat dissipating means and the second heat dissipating means respectively comprise a first heat pipe and a second heat pipe, and the first heat pipe and the first heat pipe The second heat pipes are staggered and arranged one above the other.
於一較佳實施例中，該第一熱管以及該第二熱管係呈正交排列。In a preferred embodiment, the first heat pipe and the second heat pipe are arranged in an orthogonal manner.
於一較佳實施例中，該第一散熱手段係包括一第一熱管、一第一散熱鰭片組以及一第一風扇，且該第一熱管之一第一端設置於該第一熱源之鄰近處，而該第一熱管之一第二端接觸於該第一散熱鰭片組；其中，該第一風扇係用以將集中於該第一散熱鰭片組及其附近之熱能向外排出。In a preferred embodiment, the first heat dissipation means includes a first heat pipe, a first heat sink fin set, and a first fan, and the first end of the first heat pipe is disposed on the first heat source. a first end of the first heat pipe is in contact with the first heat sink fin group; wherein the first fan is configured to discharge heat energy concentrated in the first heat sink fin group and the vicinity thereof .
於一較佳實施例中，該第二散熱手段係包括一第二熱管、一第二散熱鰭片組以及一第二風扇，且該第二熱管之一第一端設置於該第二熱源之鄰近處，而該第二熱管之一第二端接觸於該第二散熱鰭片組；其中，該第二風扇係用以將集中於該第二散熱鰭片組及其附近之熱能向外排出。In a preferred embodiment, the second heat dissipation means includes a second heat pipe, a second heat sink fin set, and a second fan, and the first end of the second heat pipe is disposed on the second heat source. a second end of the second heat pipe is in contact with the second heat sink fin group; wherein the second fan is configured to discharge the heat energy concentrated in the second heat sink fin group and the vicinity thereof .
於一較佳實施例中，該第一風扇以及該第二風扇係分別設置於該微型光學影像裝置之不同表面內側，以使集中於該第一散熱鰭片組與其附近之熱能以及集中於該第二散熱鰭片組與其附近之熱能分別由該微型光學影像裝置之不同表面向外排出；抑或是該第一風扇以及該第二風扇係分別設置於該微型光學影像裝置之相同表面內側，以使集中於該第一散熱鰭片組與其附近之熱能以及集中於該第二散熱鰭片組與其附近之熱能皆由該微型光學影像裝置之相同表面向外排出。In a preferred embodiment, the first fan and the second fan are respectively disposed on different surfaces of the micro-optical image device, so as to concentrate the heat energy concentrated on the first heat-dissipating fin group and the vicinity thereof The second heat sink fin group and the heat energy in the vicinity thereof are respectively discharged outward from different surfaces of the micro optical image device; or the first fan and the second fan system are respectively disposed inside the same surface of the micro optical image device, The thermal energy concentrated in the vicinity of the first heat sink fin group and the heat energy concentrated in the vicinity of the second heat sink fin group are discharged outward from the same surface of the micro optical image device.
於一較佳實施例中，該第一風扇設置於該微型光學影像裝置之一底面內側以及該第一散熱鰭片組之間，且該第二風扇設置於該微型光學影像裝置之一側面內側以及該第二散熱鰭片組之間；抑或是該第一風扇設置於該微型光學影像裝置之該側面內側以及該第一散熱鰭片組之間，且該第二風扇係設置於該微型光學影像裝置之該側面內側以及該第二散熱鰭片組之間。In a preferred embodiment, the first fan is disposed inside a bottom surface of the micro optical imaging device and between the first heat dissipation fin set, and the second fan is disposed on a side of the side of the micro optical imaging device. And the second fan is disposed between the side of the side of the micro-optical imaging device and the first heat-dissipating fin set, and the second fan is disposed on the micro-optical Between the inner side of the side of the image device and the second heat sink fin set.
於一較佳實施例中，微型光學影像裝置更包括至少一進風口，且該至少一進風口與該第一風扇之間以及該至少一進風口與該第二風扇之間形成有複數氣流路徑，且該些氣流路徑至少通過該第一熱源以及該第二熱源。In a preferred embodiment, the micro-optical imaging device further includes at least one air inlet, and a plurality of airflow paths are formed between the at least one air inlet and the first fan and between the at least one air inlet and the second fan. And the air flow paths pass at least the first heat source and the second heat source.
於一較佳實施例中，該第一熱管係穿過該第一散熱鰭片組，且該第一熱管位於該第一散熱鰭片組之一中心線或其鄰近處，及/或該第二熱管係穿過該第二散熱鰭片組，且該第二熱管位於該第 二散熱鰭片組之一中心線或其鄰近處。In a preferred embodiment, the first heat pipe passes through the first heat sink fin group, and the first heat pipe is located at a center line of the first heat sink fin group or adjacent thereto, and/or the first heat pipe a second heat pipe is passed through the second heat sink fin set, and the second heat pipe is located at the first One of the two heat sink fin sets or its vicinity.
於一較佳實施例中，該第一熱源或該第二熱源中之至少一者係為一發光單元或一電感。In a preferred embodiment, at least one of the first heat source or the second heat source is an illumination unit or an inductor.
於一較佳實施例中，微型光學影像裝置係為一微型投影裝置，且該光學引擎更具有一顯示元件以及一光學鏡頭；其中，該顯示元件用以呈現一影像畫面，該發光單元用以提供光源予該顯示元件，而該光學鏡頭位於一投射面與該顯示元件之間，用以投射該影像畫面至該投射面，使該影像畫面被顯示於該投射面上。In a preferred embodiment, the micro-optical image device is a micro-projection device, and the optical engine further has a display component and an optical lens; wherein the display component is used to present an image frame, and the light-emitting unit is used for A light source is provided to the display element, and the optical lens is located between a projection surface and the display element for projecting the image frame to the projection surface, so that the image frame is displayed on the projection surface.
於一較佳實施例中，微型光學影像裝置係為一數位光學處理(DLP)投影裝置，抑或是一反射式液晶(LCOS)投影裝置，抑或是一穿透式液晶(LCD)投影裝置；其中，當該微型光學影像裝置為該數位光學處理(DLP)投影裝置時，該微型光學影像裝置係為一單片式數位光學處理(DLP)投影裝置，抑或是一三片式數位光學處理(DLP)投影裝置，且該顯示元件係為一數位微型反射鏡(DMD)元件。In a preferred embodiment, the micro optical image device is a digital optical processing (DLP) projection device, or a reflective liquid crystal (LCOS) projection device, or a transmissive liquid crystal (LCD) projection device; When the micro optical imaging device is the digital optical processing (DLP) projection device, the micro optical imaging device is a monolithic digital optical processing (DLP) projection device, or a three-chip digital optical processing (DLP) a projection device, and the display element is a digital micro mirror (DMD) element.
於一較佳實施例中，該發光單元係至少包括一發光二極體單元。In a preferred embodiment, the light emitting unit includes at least one light emitting diode unit.
於一較佳實施例中，該發光單元係至少包括一用以輸出紅色光束的發光二極體單元、一用以輸出綠色光束的發光二極體單元以及一用以輸出藍色光束的發光二極體單元。In a preferred embodiment, the light emitting unit includes at least one light emitting diode unit for outputting a red light beam, a light emitting diode unit for outputting a green light beam, and a light emitting unit for outputting a blue light beam. Polar body unit.
於一較佳實施例中，本創作亦提供一種微型光學影像裝置，包括： 一殼體；一顯示元件，用以呈現一影像畫面；複數發光單元，用以提供光源予該顯示元件；一光學引擎電路板，其上設置有至少一電感；一光學鏡頭，位於一投射面與該顯示元件之間，用以投射該影像畫面至該投射面，使該影像畫面被顯示於該投射面上；以及複數個熱管，每一該熱管之一第一端設置於該複數發光單元中之至少一者之鄰近處或設置於該至少一電感之鄰近處，且每一該熱管之一第二端設置有一散熱鰭片組；複數風扇，用以將集中於該複數散熱鰭片組及其附近之熱能向外排出；其中，該複數熱管中之至少二熱管係相互上下錯開且交叉排列。In a preferred embodiment, the present invention also provides a miniature optical imaging device comprising: a display device for presenting an image frame; a plurality of light emitting units for providing a light source to the display element; an optical engine circuit board having at least one inductor disposed thereon; and an optical lens disposed on a projection surface And the display element is configured to project the image frame to the projection surface to display the image frame on the projection surface; and a plurality of heat pipes, wherein the first end of each of the heat pipes is disposed on the plurality of light-emitting units The heat sink fin set is disposed at a second end of each of the heat pipes, and the plurality of heat sink fins are disposed in the vicinity of the at least one of the inductors And the heat energy in the vicinity thereof is discharged outward; wherein at least two heat pipes of the plurality of heat pipes are staggered and arranged alternately.
於一較佳實施例中，該複數熱管中之至少二熱管係呈正交排列。In a preferred embodiment, at least two of the plurality of heat pipes are arranged in an orthogonal manner.
於一較佳實施例中，該複數風扇中之至少二風扇設置於該殼體之不同表面內側。In a preferred embodiment, at least two of the plurality of fans are disposed inside different surfaces of the housing.
於一較佳實施例中，該複數風扇係包括一第一風扇以及一第二風扇，且該複數散熱鰭片組係包括一第一散熱鰭片組以及一第二散熱鰭片組；其中，該第一風扇設置於該殼體之該底面內側以及該第一散熱鰭片組之間，且該第二風扇設置於該殼體之一側面 內側以及該第二散熱鰭片組之間；抑或是該第一風扇設置於該殼體之該側面內側以及該第一散熱鰭片組之間，且該第二風扇係設置於該殼體之該側面內側以及該第二散熱鰭片組之間。In a preferred embodiment, the plurality of fan sets include a first fan and a second fan, and the plurality of heat sink fin sets include a first heat sink fin set and a second heat sink fin set; The first fan is disposed inside the bottom surface of the housing and between the first heat dissipation fin sets, and the second fan is disposed on one side of the housing Between the inner side and the second heat-dissipating fin set; or the first fan is disposed between the side of the side of the housing and the first heat-dissipating fin set, and the second fan is disposed on the housing Between the inner side of the side and the second set of fins.
於一較佳實施例中，微型光學影像裝置更包括至少一進風口，且該至少一進風口與該複數風扇之間形成有複數氣流路徑，且該些氣流路徑至少通過該複數發光單元以及該至少一電感。In a preferred embodiment, the micro-optical imaging device further includes at least one air inlet, and a plurality of airflow paths are formed between the at least one air inlet and the plurality of fans, and the airflow paths pass through at least the plurality of light-emitting units and the At least one inductor.
於一較佳實施例中，該複數熱管中之至少一熱管係穿過相對應之該散熱鰭片組，且該至少一熱管位於該散熱鰭片組之一中心線或其鄰近處。In a preferred embodiment, at least one heat pipe of the plurality of heat pipes passes through the corresponding heat dissipation fin set, and the at least one heat pipe is located at a center line of the heat dissipation fin set or adjacent thereto.
於一較佳實施例中，微型光學影像裝置係為一數位光學處理(DLP)投影裝置，抑或是一反射式液晶(LCOS)投影裝置，抑或是一穿透式液晶(LCD)投影裝置；其中，當該微型光學影像裝置為該數位光學處理(DLP)投影裝置時，該微型光學影像裝置係為一單片式數位光學處理(DLP)投影裝置，抑或是一三片式數位光學處理(DLP)投影裝置，且該顯示元件係為一數位微型反射鏡(DMD)元件。In a preferred embodiment, the micro optical image device is a digital optical processing (DLP) projection device, or a reflective liquid crystal (LCOS) projection device, or a transmissive liquid crystal (LCD) projection device; When the micro optical imaging device is the digital optical processing (DLP) projection device, the micro optical imaging device is a monolithic digital optical processing (DLP) projection device, or a three-chip digital optical processing (DLP) a projection device, and the display element is a digital micro mirror (DMD) element.
於一較佳實施例中，該發光單元係至少包括一發光二極體單元。In a preferred embodiment, the light emitting unit includes at least one light emitting diode unit.
於一較佳實施例中，該發光單元係至少包括一用以輸出紅色光束的發光二極體單元、一用以輸出綠色光束的發光二極體單元以及一用以輸出藍色光束的發光二極體單元。In a preferred embodiment, the light emitting unit includes at least one light emitting diode unit for outputting a red light beam, a light emitting diode unit for outputting a green light beam, and a light emitting unit for outputting a blue light beam. Polar body unit.
首先說明的是，本創作微型光學影像裝置係泛指各種具有發光單元且於運作時會產生高熱流密度的微型影像裝置，如照明裝置、監控裝置等，以下將以微型投影裝置作為舉例說明本案之創作精神，但不以侷限本案之本創作的應用範疇。其中，微型投影裝置係可為一單片式數位光學處理(DLP)投影裝置、一三片式數位光學處理(DLP)投影裝置、一反射式液晶(LCOS)投影裝置，抑或是一穿透式液晶(LCD)投影裝置，惟上述各種投影裝置的投影技術應係為熟知本技藝人士所應知悉，故在此即不再予以贅述。First of all, the micro-optical imaging device of the present invention generally refers to various micro-image devices having a light-emitting unit and generating a high heat flux density during operation, such as a lighting device, a monitoring device, etc., and the micro-projection device will be used as an example to illustrate the case. The spirit of creation, but not limited to the application of the original creation of the case. The micro-projection device can be a single-chip digital optical processing (DLP) projection device, a three-chip digital optical processing (DLP) projection device, a reflective liquid crystal (LCOS) projection device, or a transmissive type. Liquid crystal (LCD) projection devices, but the projection techniques of the various projection devices described above should be known to those skilled in the art, and thus will not be further described herein.
請參閱圖2~圖6，圖2為本創作微型光學影像裝置於第一較佳實施例之結構構示意圖(為了更清楚示意微型光學影像裝置的內部結構，故圖2中並未顯示殼體的上蓋，而殼體的上蓋另於圖5中顯示)，圖3為圖2所示微型光學影像裝置之部分結構示意圖，圖4為圖2所示微型光學影像裝置之部分結構底視圖，圖5為圖2所示微型光學影像裝置之部分結構並包括上蓋在內的立體分解圖，圖6為圖2所示微型光學影像裝置之氣流路徑示意圖。Please refer to FIG. 2 to FIG. 6. FIG. 2 is a schematic structural view of the micro-optical image device according to the first preferred embodiment (in order to more clearly illustrate the internal structure of the micro-optical image device, the housing is not shown in FIG. 2 FIG. 3 is a partial structural view of the micro optical image device shown in FIG. 2, and FIG. 4 is a partial bottom view of the micro optical image device shown in FIG. 5 is a partial exploded view of the micro-optical image device shown in FIG. 2 and includes an upper cover, and FIG. 6 is a schematic view of the air flow path of the micro-optical image device shown in FIG.
微型光學影像裝置1係包括殼體11(含上蓋115)、至少一部分位於殼體11內的光學引擎12以及至少一部分位於殼體11內的散熱模組13，且光學引擎12具有顯示元件121、複數發光單元122、光學鏡頭123以及光學引擎電路板124；其中，顯示元件121係用以呈現影像畫面，而複數發光單元122用以提供光源，且其所提 供之光源經由一光處理程序(如合光動作及/或混光動作)後會照射在顯示元件121上；又，光學鏡頭123位於一投射面8與顯示元件121之間，用以將顯示元件121上之影像畫面投射至投射面8，使影像畫面被放大顯示於投射面8上；此外，光學引擎電路板124係用以提供驅動電路使微型光學影像裝置1能夠於被導通電力後開始運作，且光學引擎電路板124上具有複數電子元件，如電感1241。The micro-optical imaging device 1 includes a housing 11 (including an upper cover 115), an optical engine 12 at least partially located in the housing 11, and a heat dissipation module 13 at least partially located in the housing 11, and the optical engine 12 has a display element 121, a plurality of light-emitting units 122, an optical lens 123, and an optical engine circuit board 124; wherein the display element 121 is used to present an image frame, and the plurality of light-emitting units 122 are used to provide a light source, and the The light source is irradiated onto the display element 121 via a light processing program (such as a light combining operation and/or a light mixing operation); further, the optical lens 123 is located between a projection surface 8 and the display element 121 for display The image frame on the component 121 is projected onto the projection surface 8 so that the image image is enlarged and displayed on the projection surface 8; further, the optical engine circuit board 124 is used to provide a driving circuit to enable the micro optical imaging device 1 to be turned on after being turned on. It operates and the optical engine board 124 has a plurality of electronic components, such as an inductor 1241.
於本較佳實施例中，微型光學影像裝置1係為一單片式數位光學處理(DLP)投影裝置，且其顯示元件121係為一數位微型反射鏡(DMD)元件，而該複數發光單元122包括一用以輸出紅色光束的發光二極體單元1221、一用以輸出綠色光束的發光二極體單元1222以及一用以輸出藍色光束的發光二極體單元1223。又，任一發光二極體單元係可為一發光二極體晶片與一發光二極體電路板的組合，抑或是一發光二極體與一發光二極體電路板的組合。In the preferred embodiment, the micro-optical imaging device 1 is a monolithic digital optical processing (DLP) projection device, and the display element 121 is a digital micro-mirror (DMD) component, and the complex illumination unit 122 includes a light emitting diode unit 1221 for outputting a red light beam, a light emitting diode unit 1222 for outputting a green light beam, and a light emitting diode unit 1223 for outputting a blue light beam. Moreover, any of the light emitting diode units can be a combination of a light emitting diode chip and a light emitting diode circuit board, or a combination of a light emitting diode and a light emitting diode circuit board.
又，本創作微型光學影像裝置之散熱模組13至少包括一第一散熱手段131以及一第二散熱手段132，第一散熱手段131係用以將光學引擎12所產生的部份熱能由殼體11的第一表面111處的出風口1111向外排出，而第二散熱手段132係用以將光學引擎12所產生的另一部份熱能由殼體11的第二表面112處的出風口1121向外排出。The heat dissipation module 13 of the micro-optical imaging device includes at least a first heat dissipation means 131 and a second heat dissipation means 132. The first heat dissipation means 131 is used to heat part of the heat generated by the optical engine 12 from the housing. The air outlet 1111 at the first surface 111 of the 11 is outwardly discharged, and the second heat dissipating means 132 is used to dissipate another portion of the thermal energy generated by the optical engine 12 from the air outlet 1121 at the second surface 112 of the housing 11. Discharge outward.
於本較佳實施例中，殼體11的第一表面111以及第二表面112 係分別為殼體11的側面(例如，為一左側側面)以及底面，且第一散熱手段131包括第一導熱件1311、第一熱管1312、第一散熱鰭片組1313以及第一風扇1314；其中，第一導熱件1311被安排設置於微型光學影像裝置1的第一熱源(以本實施例為例，其係為輸出綠色光束的發光二極體單1222以及輸出藍色光束的發光二極體單元1223，並請參閱後續之詳細說明)以及第一熱管1312之間，且分別與第一熱源以及第一熱管1312之第一端接觸，而第一熱管1312之第二端接觸於第一散熱鰭片組1313；此外，第一風扇1314係以站立的方式設置於殼體11的第一表面111內側，且皆相對於第一散熱鰭片組1313設置，即第一風扇131係位於殼體11的第一表面111以及第一散熱鰭片組1313之間。In the preferred embodiment, the first surface 111 and the second surface 112 of the housing 11 The first heat dissipating means 131 includes a first heat conducting member 1311, a first heat pipe 1312, a first heat sink fin set 1313, and a first fan 1314; The first heat-conducting member 1311 is arranged in the first heat source of the micro-optical image device 1 (in the embodiment, it is a light-emitting diode unit 1222 that outputs a green light beam and a light-emitting diode that outputs a blue light beam. The body unit 1223, and please refer to the subsequent detailed description) and the first heat pipe 1312, and respectively contact the first heat source and the first end of the first heat pipe 1312, and the second end of the first heat pipe 1312 is in contact with the first The first fan 1314 is disposed in a standing manner on the inner side of the first surface 111 of the housing 11 and is disposed relative to the first heat dissipation fin group 1313, that is, the first fan 131 is located in the shell. The first surface 111 of the body 11 and the first heat dissipation fin group 1313.
另一較佳作法(圖未示出)，任何熟悉本技藝之人士，於參閱本案後，顯亦可提出包括將第一散熱鰭片組1313改設置於第一風扇1314與第一表面111之間在內的任何其他均等的設計或變化。Another preferred method (not shown), any person skilled in the art, after referring to the present invention, may also propose to include the first heat sink fin set 1313 on the first fan 1314 and the first surface 111. Any other equal design or variation between the two.
又，第一導熱件1311係由高導熱係數的材質(如金屬)所製成，抑或是為一散熱片，用以供第一熱源的熱能被傳導至第一導熱件1311，而與第一導熱件1311接觸的第一熱管1312係為一中空且兩端封閉的金屬管，且其第一端以及第二端分別為一蒸發部以及一冷凝部。Moreover, the first heat conducting member 1311 is made of a material having a high thermal conductivity (such as metal), or is a heat sink for conducting heat energy of the first heat source to the first heat conducting member 1311, and the first The first heat pipe 1312 contacting the heat conducting member 1311 is a hollow metal tube closed at both ends, and the first end and the second end are respectively an evaporation portion and a condensation portion.
一般而言，蒸發部係用以被安排設置於溫度較高的環境，且該環境中的熱能係經由蒸發部傳導至第一熱管1312內，而第一熱 管1312內的工作液體於吸收該熱能後蒸發成氣體，並接著由蒸發部擴散至冷凝部，由於冷凝部的溫度相對較低，使得氣體凝固回液體，同時熱能由冷凝部向外散出，而液體則透過毛細作用回流到蒸發部，如此完成一熱傳循環動作。是以，第一熱管1312具有將熱能由蒸發部傳導至冷凝部的功能，其詳細的工作原理係為熟知本技藝人士所應知悉，故在此即不再予以贅述。In general, the evaporation portion is arranged to be disposed in a higher temperature environment, and the thermal energy in the environment is conducted to the first heat pipe 1312 via the evaporation portion, and the first heat The working liquid in the tube 1312 evaporates into a gas after absorbing the thermal energy, and then diffuses from the evaporation portion to the condensation portion. Since the temperature of the condensation portion is relatively low, the gas is solidified back to the liquid, and the heat energy is dissipated outward from the condensation portion. The liquid is returned to the evaporation portion by capillary action, thus completing a heat transfer cycle. Therefore, the first heat pipe 1312 has a function of transmitting thermal energy from the evaporation portion to the condensation portion, and the detailed working principle is known to those skilled in the art, and therefore will not be described herein.
由以上說明可知，第一熱源所產生的熱能會於依序經由第一導熱件1311、第一熱管1312後傳導至第一散熱鰭片組1313處及其附近，此時，集中於第一散熱鰭片組1313處及其附近的熱能則透過第一風扇1314的作用而從殼體115之第一表面111處的出風口1111向外排出。It can be seen from the above description that the thermal energy generated by the first heat source is sequentially transmitted to the first heat dissipation fin group 1313 and its vicinity via the first heat conduction member 1311 and the first heat treatment tube 1312. At this time, the first heat dissipation is concentrated. The heat energy at and near the fin group 1313 is discharged outward from the air outlet 1111 at the first surface 111 of the housing 115 by the action of the first fan 1314.
較佳者，第一熱管1312係穿過第一散熱鰭片組1313，且位於第一散熱鰭片組1313之一中心線L1或其鄰近處，如此更能夠加速第一散熱手段131的散熱效率。Preferably, the first heat pipe 1312 passes through the first heat dissipation fin group 1313 and is located at a center line L1 of the first heat dissipation fin group 1313 or in the vicinity thereof, so that the heat dissipation efficiency of the first heat dissipation means 131 can be accelerated. .
再者，於本較佳實施例中，第二散熱手段132係包括第二導熱件1321、第二熱管1322、第二散熱鰭片組1323、第二風扇1324以及第三風扇1325；其中，第二導熱件1321被安排設置於微型光學影像裝置1的第二熱源(以本實施例為例，其係為輸出紅色光束的發光二極體單元1221，並請參閱後續之詳細說明)以及第二熱管1322之間，且分別與第二熱源以及第二熱管1322之第一端接觸，而第二熱管1322之第二端接觸於第二散熱鰭片組1323；此外，第 二風扇1324以及第三風扇1325皆係以平躺的方式設置於殼體11的第二表面112內側，並位於第二散熱鰭片組1323的下方，即第二風扇1324以及第三風扇1325是位於殼體11的第二表面112內側以及第二散熱鰭片組1323之間。Furthermore, in the preferred embodiment, the second heat dissipating means 132 includes a second heat conducting member 1321, a second heat pipe 1322, a second heat radiating fin group 1323, a second fan 1324, and a third fan 1325; The second heat conducting member 1321 is arranged to be disposed on the second heat source of the micro optical imaging device 1 (for example, this embodiment is a light emitting diode unit 1221 that outputs a red light beam, and please refer to the subsequent detailed description) and the second The heat pipes 1322 are in contact with the first heat source and the first heat pipe 1322, respectively, and the second heat pipe 1322 is in contact with the second heat sink fins 1323; The second fan 1324 and the third fan 1325 are disposed on the inner side of the second surface 112 of the housing 11 in a lying manner and are located below the second heat dissipation fin group 1323, that is, the second fan 1324 and the third fan 1325 are Located between the inner surface of the second surface 112 of the housing 11 and the second heat dissipation fin group 1323.
又，第二導熱件1321係由高導熱係數的材質(如金屬)所製成，抑或是為一散熱片，用以供第二熱源的熱能被傳導至第二導熱件1321，而與第二導熱件1321接觸的第二管131亦係為一中空且兩端封閉的金屬管，且其第一端以及第二端分別為一蒸發部以及一冷凝部；其中，第二熱管1322的工作原理相同於第一熱管1312的工作原理，故在此即不再予以贅述。Moreover, the second heat conducting member 1321 is made of a material having a high thermal conductivity (such as metal), or is a heat sink for conducting heat energy of the second heat source to the second heat conducting member 1321, and the second The second tube 131 contacting the heat conducting member 1321 is also a hollow metal tube closed at both ends, and the first end and the second end are respectively an evaporation portion and a condensation portion; wherein the working principle of the second heat pipe 1322 It is the same as the working principle of the first heat pipe 1312, so it will not be described here.
是以，第二熱源所產生的熱能會於依序經由第二導熱件1321、第二熱管1322後傳導至第二散熱鰭片組1323處及其附近，此時，集中於第二散熱鰭片組1323處及其附近的熱能則透過第二風扇1324以及第三風扇1325的作用而從殼體之第二表面112處的出風口1121向外排出。Therefore, the thermal energy generated by the second heat source is sequentially transmitted to and near the second heat dissipation fin group 1323 via the second heat conduction member 1321 and the second heat pipe 1322. At this time, the second heat dissipation fin is concentrated. The heat energy at and near the group 1323 is discharged outward from the air outlet 1121 at the second surface 112 of the casing through the action of the second fan 1324 and the third fan 1325.
較佳者，第二熱管1322係穿過第二散熱鰭片組1323，且位於第二散熱鰭片組1323之一中心線L2或其鄰近處，如此更能夠加速第二散熱手段132的散熱效率。Preferably, the second heat pipe 1322 passes through the second heat dissipation fin group 1323 and is located at a center line L2 of the second heat dissipation fin group 1323 or adjacent thereto, so that the heat dissipation efficiency of the second heat dissipation means 132 can be accelerated. .
特別說明的是，本實施例中之第一熱源係為輸出綠色光束的發光二極體單1222以及輸出藍色光束的發光二極體單元1223，而第二熱源係為輸出紅色光束的發光二極體單元1221；詳言之，當 微型光學影像裝置1開始工作時，發光單元122會同步或分別地輸出光源，並且於輸出光源的同時產生熱能，特別是輸出紅色光束的發光二極體單元1221以及輸出綠色光束的發光二極體單元1222因其所需耗費功率相對較高，故所產生的熱能也就更多，是以，排解發光單元122所產生的熱能為散熱模組的首要功用。Specifically, the first heat source in the embodiment is a light-emitting diode unit 1222 that outputs a green light beam and a light-emitting diode unit 1223 that outputs a blue light beam, and the second heat source is a light-emitting diode that outputs a red light beam. Polar body unit 1221; in detail, when When the micro-optical imaging device 1 starts to work, the light-emitting unit 122 outputs the light source synchronously or separately, and generates thermal energy while outputting the light source, in particular, the light-emitting diode unit 1221 that outputs the red light beam and the light-emitting diode that outputs the green light beam. Since the power consumption of the unit 1222 is relatively high, the generated thermal energy is more, so that the thermal energy generated by the light-emitting unit 122 is the primary function of the heat dissipation module.
由於現今電子設備均有朝向輕、薄、短小之設計原則發展，故殼體11內的空間相當有限，而為了使第一熱管1312還能夠設置於第一散熱鰭片組1313之一中心線L1或其鄰近處以及使第二熱管1322還能夠設置於第二散熱鰭片組1323之一中心線L2或其鄰近處，本案特定設計將第一熱管1312以及第二熱管1322以相互上下錯開(例如，於垂直方向相互上下錯開)，且以交叉排列的方式設置，如此即能夠有效節省第一散熱手段以及第二散熱手段所需佔據之空間，以達到極佳的散熱效果，故此為本案之重要創作特徵。Since the current electronic devices have a design principle that is light, thin, and short, the space in the housing 11 is rather limited, and the first heat pipe 1312 can be disposed on the center line L1 of the first heat dissipation fin group 1313. Or adjacent thereto and the second heat pipe 1322 can also be disposed at or adjacent to a center line L2 of the second heat radiation fin group 1323. The specific design of the present case is to vertically align the first heat pipe 1312 and the second heat pipe 1322 (for example, , which are vertically offset from each other in the vertical direction, and are arranged in a cross-arranged manner, so that the space occupied by the first heat-dissipating means and the second heat-dissipating means can be effectively saved, so as to achieve an excellent heat-dissipating effect, and thus it is important for the present case. Creative features.
此外，微型光學影像裝置1的熱源可能並不僅限於發光單元122，如光學引擎電路板124上的複數電感1241以及顯示元件121亦可能因運作過程而出現相當的熱量而成為熱源，是以，根據以上實施例所得到之啟示，熟悉本技術之人士可依據實際應用需求而進行任何均等的變化設計，如將電感1241、顯示元件121或其它熱源的熱能透過熱管而移轉而傳導至複數個適當的熱集中處，再由微型光學影像裝置1的不同表面向外排出。In addition, the heat source of the micro-optical imaging device 1 may not be limited to the light-emitting unit 122. For example, the plurality of inductors 1241 and the display element 121 on the optical engine circuit board 124 may become a heat source due to the occurrence of considerable heat during operation. In the above embodiments, those skilled in the art can perform any equal change design according to actual application requirements, such as transferring the thermal energy of the inductor 1241, the display element 121 or other heat source through the heat pipe to be transmitted to a plurality of appropriate The heat concentration is then discharged outward from the different surfaces of the micro-optical imaging device 1.
再者，為了使微型光學影像裝置1具有更佳的散熱效率，於本實施例中，微型光學影像裝置1的殼體11具有複數個穿孔用以作為微型光學影像裝置1的進風口113，故在第一風扇1314、第二風扇1324以及第三風扇1325的作動下，該些進風口113與殼體11之第一表面111處的出風口1111之間以及該些進風口113與殼體之第二表面112處的出風口1121之間會形成複數個氣流路徑；其中，藉由適當的安排該些進風口113與該些出風口1111、1121的位置，則可使該些氣流路徑經過每一熱源之鄰近處及/或其熱能可被轉移至的熱集中處，進而使帶有熱能的空氣往殼體11外排出；其相關的熱流分析結果，則如圖6虛線標示處所示。In addition, in order to make the micro-optical imaging device 1 have better heat dissipation efficiency, in the embodiment, the housing 11 of the micro-optical imaging device 1 has a plurality of perforations for the air inlet 113 of the micro-optical imaging device 1. The air inlet 113 and the air outlet 1111 at the first surface 111 of the housing 11 and the air inlet 113 and the housing are operated by the first fan 1314, the second fan 1324, and the third fan 1325. A plurality of air flow paths are formed between the air outlets 1121 at the second surface 112. wherein the air flow paths 113 and the air outlets 1111 and 1121 are properly arranged, the air flow paths can be passed through each The heat source is adjacent to the heat source and/or its heat energy can be transferred to the heat concentration, and then the heat-bearing air is discharged to the outside of the casing 11; the relevant heat flow analysis result is shown in the dotted line of FIG.
請參閱圖7~圖10，圖7為本創作微型光學影像裝置於第二較佳實施例之結構構示意圖(為了更清楚示意微型光學影像裝置的內部結構，故殼體上蓋未顯示)，圖8為圖7所示微型光學影像裝置於另一視角之結構構示意圖，圖9為圖7所示微型光學影像裝置之氣流路徑示意圖。Please refer to FIG. 7 to FIG. 10 . FIG. 7 is a schematic structural view of the micro-optical image device according to the second preferred embodiment (in order to more clearly illustrate the internal structure of the micro-optical image device, the upper cover of the housing is not shown). 8 is a schematic structural view of the micro-optical image device shown in FIG. 7 in another viewing angle, and FIG. 9 is a schematic diagram of the airflow path of the micro-optical image device shown in FIG.
其中，本實施例之微型光學影像裝置2大致類似於本案第一較佳實施例中所述者，在此即不再予以贅述。而本較佳實施例與前述第一較佳實施例的不同之處在於，第二散熱手段232僅存在單一風扇2324，且風扇2324是以站立的方式設置於殼體11的側面211內側以及第二散熱鰭片組2323之間。此外，因應上述風扇2324的設置方式，第二熱管2322之轉彎處的夾角角度亦有所改 變，以獲得較佳的空間配置以及散熱效率。The micro-optical imaging device 2 of the present embodiment is substantially similar to that described in the first preferred embodiment of the present invention, and will not be further described herein. The difference between the preferred embodiment and the first preferred embodiment is that the second heat dissipation means 232 has only a single fan 2324, and the fan 2324 is disposed on the side of the side surface 211 of the housing 11 in a standing manner and Between the two heat sink fin groups 2323. In addition, due to the manner in which the fan 2324 is disposed, the angle of the corner of the second heat pipe 2322 is also changed. Change to get better space configuration and heat dissipation efficiency.
同樣地，發光二極體單元2221所產生的熱能會於依序經由第二導熱件2321、第二熱管2322後傳導至第二散熱鰭片組2323處及其附近，此時，集中於第二散熱鰭片組2323處及其附近的熱能則透過風扇2324的作用而從殼體之側面211處的出風口2112向外排出。於本較佳實施例中，集中於第一散熱鰭片組2313與其附近之熱能以及集中於第二散熱鰭片組2323與其附近之熱能皆由殼體21之相同表面向外排出。 又，於本較佳實施例中，進風口213與殼體21之第一表面211處的出風口2111、2112之間會形成複數個氣流路徑；其中，藉由如本案所示，適當的安排該些進風口213與該些出風口2111、2121的位置，即可使該些氣流路徑經過每一熱源之鄰近處及/或其熱能可被轉移至的熱集中處，進而使帶有熱能的空氣往殼體21外排出；其相關的熱流分析結果，則如圖10虛線標示處所示。Similarly, the thermal energy generated by the LED unit 2221 is sequentially transmitted to and near the second heat dissipation fin group 2323 via the second heat conduction member 2321 and the second heat pipe 2322, and is concentrated in the second. The heat energy at and near the heat dissipation fin group 2323 is discharged outward from the air outlet 2112 at the side 211 of the casing by the action of the fan 2324. In the preferred embodiment, the thermal energy concentrated on the first heat dissipation fin group 2313 and its vicinity and the thermal energy concentrated on the second heat dissipation fin group 2323 and its vicinity are discharged outward from the same surface of the housing 21. Moreover, in the preferred embodiment, a plurality of airflow paths are formed between the air inlet 213 and the air outlets 2111, 2112 at the first surface 211 of the housing 21; wherein, as shown in the present case, an appropriate arrangement The air inlets 213 and the air outlets 2111, 2121 are positioned such that the airflow paths pass through the vicinity of each heat source and/or the heat concentration to which the heat energy can be transferred, thereby enabling thermal energy. The air is discharged outside the casing 21; its associated heat flow analysis results are shown in the dotted line of Figure 10.
特別說明的是，於本實施例中之第一熱管1312以及第二熱管1322同樣是以相互上下錯開(例如，於垂直方向相互上下錯開)，且以交叉排列的方式設置，因此亦能夠有效節省第一散熱手段以及第二散熱手段所需佔據之空間，從而達到極佳的散熱效果。In particular, the first heat pipe 1312 and the second heat pipe 1322 in the present embodiment are also vertically shifted from each other (for example, vertically offset from each other in the vertical direction), and are arranged in a cross-arranged manner, thereby also saving money. The first heat dissipating means and the space required by the second heat dissipating means achieve an excellent heat dissipating effect.
根據以上各實施例可知，本案透過至少兩個散熱手段使得使得各熱源的熱能能夠有效率的向外排出，並且透過熱管及其轉彎處之夾角的角度，而能將熱源的熱能移轉傳導至適當的熱集中 處，並且由於至少二熱管間以上下錯開且交叉排列的方式設置，使得微型光學影像裝置內之各元件的空間配置與設計將更為彈性，進而使微型光學影像裝置更為輕、薄、短小。According to the above embodiments, the present invention enables the heat energy of each heat source to be efficiently discharged outward through the at least two heat dissipating means, and transmits the heat energy of the heat source to the heat source through the angle of the angle between the heat pipe and the turning portion thereof. Proper heat concentration And because at least two heat pipes are disposed above and below and arranged in a crosswise manner, the spatial arrangement and design of the components in the micro-optical imaging device are more flexible, thereby making the micro-optical imaging device lighter, thinner and shorter. .
以上所述僅為本創作之較佳實施例，並非用以限定本創作之申請專利範圍，因此凡其它未脫離本創作所揭示之精神下所完成之等效改變或修飾，均應包含於本案之申請專利範圍內。The above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent changes or modifications made without departing from the spirit of the present invention should be included in the present case. Within the scope of the patent application.
1‧‧‧微型光學影像裝置1‧‧‧Micro Optical Imager
2‧‧‧微型光學影像裝置2‧‧‧Micro optical imaging device
3‧‧‧微型光學影像裝置3‧‧‧Micro optical imaging device
8‧‧‧投射面8‧‧‧projection surface
9‧‧‧投影裝置9‧‧‧Projector
11‧‧‧殼體11‧‧‧Shell
12‧‧‧光學引擎12‧‧‧Optical engine
13‧‧‧散熱模組13‧‧‧ Thermal Module
21‧‧‧殼體21‧‧‧ housing
24‧‧‧阻絕手段24‧‧‧Resistance means
31‧‧‧殼體31‧‧‧Shell
91‧‧‧殼體91‧‧‧Shell
92‧‧‧光學鏡頭92‧‧‧ optical lens
111‧‧‧第一表面111‧‧‧ first surface
112‧‧‧第二表面112‧‧‧ second surface
113‧‧‧進風口113‧‧‧air inlet
115‧‧‧上蓋115‧‧‧上盖
121‧‧‧顯示元件121‧‧‧Display components
122‧‧‧發光單元122‧‧‧Lighting unit
123‧‧‧光學鏡頭123‧‧‧ optical lens
124‧‧‧光學引擎電路板124‧‧‧Optical engine board
131‧‧‧第一散熱手段131‧‧‧First means of heat dissipation
132‧‧‧第二散熱手段132‧‧‧Second heat dissipation means
211‧‧‧底面211‧‧‧ bottom
212‧‧‧側面212‧‧‧ side
214‧‧‧進風口214‧‧‧Air inlet
311‧‧‧底面311‧‧‧ bottom
312‧‧‧側面312‧‧‧ side
1111‧‧‧出風口1111‧‧‧air outlet
1121‧‧‧出風口1121‧‧ vents
1221‧‧‧紅色發光二極體單元1221‧‧‧Red LED Unit
1222‧‧‧綠色發光二極體單元1222‧‧‧Green LED unit
1223‧‧‧藍色發光二極體單元1223‧‧‧Blue LED Unit
1241‧‧‧電感1241‧‧‧Inductance
1311‧‧‧第一導熱件1311‧‧‧First heat conducting parts
1312‧‧‧第一熱管1312‧‧‧First heat pipe
1313‧‧‧第一散熱鰭片組1313‧‧‧First heat sink fin set
1314‧‧‧第一風扇1314‧‧‧First fan
1321‧‧‧第二導熱件1321‧‧‧Second heat-conducting parts
1322‧‧‧第二熱管1322‧‧‧second heat pipe
1323‧‧‧第二散熱鰭片組1323‧‧‧Second heat sink fin set
1324‧‧‧第二風扇1324‧‧‧second fan
1325‧‧‧第三風扇1325‧‧‧third fan
2111‧‧‧出風口2111‧‧‧air outlet
2112‧‧‧出風口2112‧‧‧air outlet
2121‧‧‧出風口2121‧‧‧air outlet
2222‧‧‧綠色發光二極體單2222‧‧‧Green LEDs
2223‧‧‧藍色發光二極體單元2223‧‧‧Blue LED Unit
2323‧‧‧第二散熱鰭片組2323‧‧‧Second heat sink fin set
2313‧‧‧第一散熱鰭片組2313‧‧‧First heat sink fin set
2324‧‧‧第二風扇2324‧‧‧second fan
2325‧‧‧第三風扇2325‧‧‧third fan
3111‧‧‧出風口3111‧‧‧air outlet
3121‧‧‧出風口3121‧‧‧air outlet
L1‧‧‧中心線L1‧‧‧ center line
L2‧‧‧中心線L2‧‧‧ center line
圖1：係為習知投影裝置的結構示意圖。Figure 1 is a schematic view showing the structure of a conventional projection device.
圖2：係為本創作微型光學影像裝置於第一較佳實施例之結構構示意圖。FIG. 2 is a structural schematic view of the first preferred embodiment of the present miniature optical imaging device.
圖3：係為圖2所示微型光學影像裝置之部分結構示意圖。Figure 3 is a partial structural view of the micro-optical image device shown in Figure 2.
圖4：係為圖2所示微型光學影像裝置之部分結構底視圖。Figure 4 is a bottom plan view showing a portion of the structure of the micro-optical image device shown in Figure 2.
圖5：係為圖2所示微型光學影像裝置之部分結構並包括上蓋在內的立體分解圖。Figure 5 is an exploded perspective view showing a portion of the structure of the micro-optical image device shown in Figure 2 and including the upper cover.
圖6：係為圖2所示微型光學影像裝置之氣流路徑示意圖。Figure 6 is a schematic view showing the air flow path of the micro-optical image device shown in Figure 2.
圖7：係為本創作微型光學影像裝置於第二較佳實施例之結構構示意圖。Fig. 7 is a structural schematic view showing the creation of a miniature optical image device in a second preferred embodiment.
圖8：係為圖7所示微型光學影像裝置於另一視角之結構構示意圖。Fig. 8 is a structural schematic view showing the micro-optical image device shown in Fig. 7 in another view.
圖9：係為圖7所示微型光學影像裝置之氣流路徑示意圖。Fig. 9 is a schematic view showing the air flow path of the micro-optical image device shown in Fig. 7.
1‧‧‧微型光學影像裝置1‧‧‧Micro Optical Imager
11‧‧‧殼體11‧‧‧Shell
12‧‧‧光學引擎12‧‧‧Optical engine
13‧‧‧散熱模組13‧‧‧ Thermal Module
111‧‧‧第一表面111‧‧‧ first surface
112‧‧‧第二表面112‧‧‧ second surface
113‧‧‧進風口113‧‧‧air inlet
115‧‧‧上蓋115‧‧‧上盖
121‧‧‧顯示元件121‧‧‧Display components
122‧‧‧發光單元122‧‧‧Lighting unit
123‧‧‧光學鏡頭123‧‧‧ optical lens
124‧‧‧光學引擎電路板124‧‧‧Optical engine board
131‧‧‧第一散熱手段131‧‧‧First means of heat dissipation
132‧‧‧第二散熱手段132‧‧‧Second heat dissipation means
1111‧‧‧出風口1111‧‧‧air outlet
1121‧‧‧出風口1121‧‧ vents
1221‧‧‧紅色發光二極體單元1221‧‧‧Red LED Unit
1222‧‧‧綠色發光二極體單元1222‧‧‧Green LED unit
1223‧‧‧藍色發光二極體單元1223‧‧‧Blue LED Unit
1241‧‧‧電感1241‧‧‧Inductance
1311‧‧‧第一導熱件1311‧‧‧First heat conducting parts
1312‧‧‧第一熱管1312‧‧‧First heat pipe
1313‧‧‧第一散熱鰭片組1313‧‧‧First heat sink fin set
1314‧‧‧第一風扇1314‧‧‧First fan
1321‧‧‧第二導熱件1321‧‧‧Second heat-conducting parts
1322‧‧‧第二熱管1322‧‧‧second heat pipe
1323‧‧‧第二散熱鰭片組1323‧‧‧Second heat sink fin set
1324‧‧‧第二風扇1324‧‧‧second fan
1325‧‧‧第三風扇1325‧‧‧third fan
L1‧‧‧中心線L1‧‧‧ center line
L2‧‧‧中心線L2‧‧‧ center line
Claims (22)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101212476U TWM447998U (en) | 2012-06-28 | 2012-06-28 | Mini optical image device |
| CN 201220370520 CN202837785U (en) | 2012-06-28 | 2012-07-27 | Micro Optical Imaging Device |
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| Application Number | Priority Date | Filing Date | Title |
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| TW101212476U TWM447998U (en) | 2012-06-28 | 2012-06-28 | Mini optical image device |
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| TWM447998U true TWM447998U (en) | 2013-03-01 |
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| TW101212476U TWM447998U (en) | 2012-06-28 | 2012-06-28 | Mini optical image device |
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| CN (1) | CN202837785U (en) |
| TW (1) | TWM447998U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI627493B (en) * | 2014-10-31 | 2018-06-21 | 高準精密工業股份有限公司 | Combined optical lens and optical imaging device using the same |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6160373B2 (en) * | 2013-09-03 | 2017-07-12 | ソニー株式会社 | Light source device and video display device |
| CN104834167A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
| CN108303837B (en) * | 2017-01-12 | 2020-12-18 | 中强光电股份有限公司 | Projection device, heat dissipation module and heat dissipation fin set |
| CN107272309A (en) * | 2017-08-21 | 2017-10-20 | 青岛海信电器股份有限公司 | Laser projection device |
| CN108811475B (en) * | 2018-09-07 | 2024-04-16 | 埃视森智能科技(上海)有限公司 | Heat dissipation air ducting of grating type 3D vision positioning system |
| US11079665B2 (en) | 2019-03-20 | 2021-08-03 | Hisense Laser Display Co., Ltd. | Laser projection apparatus |
| CN112114476B (en) * | 2019-06-20 | 2022-08-30 | 青岛海信激光显示股份有限公司 | Laser projection device |
| US11237468B2 (en) | 2019-06-20 | 2022-02-01 | Hisense Laser Display Co., Ltd. | Laser projection apparatus |
| WO2020253167A1 (en) * | 2019-06-20 | 2020-12-24 | 青岛海信激光显示股份有限公司 | Laser projection device |
| CN110687739A (en) * | 2019-10-31 | 2020-01-14 | 青岛海信激光显示股份有限公司 | Laser projection device |
| CN110780517A (en) * | 2019-10-31 | 2020-02-11 | 青岛海信激光显示股份有限公司 | Laser projection device |
-
2012
- 2012-06-28 TW TW101212476U patent/TWM447998U/en not_active IP Right Cessation
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI627493B (en) * | 2014-10-31 | 2018-06-21 | 高準精密工業股份有限公司 | Combined optical lens and optical imaging device using the same |
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