CN109739066A - Micro projector - Google Patents
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- CN109739066A CN109739066A CN201910103489.8A CN201910103489A CN109739066A CN 109739066 A CN109739066 A CN 109739066A CN 201910103489 A CN201910103489 A CN 201910103489A CN 109739066 A CN109739066 A CN 109739066A
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- Prior art keywords
- ray machine
- host system
- host
- micro projector
- conducting strip
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- 230000003287 optical effect Effects 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims description 57
- 229910052751 metal Inorganic materials 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 19
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 239000007770 graphite material Substances 0.000 claims description 4
- 239000002086 nanomaterial Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 206010037660 Pyrexia Diseases 0.000 claims description 3
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- 238000005303 weighing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The embodiment of the present invention provides a kind of micro projector, including ray machine head system and host system;Ray machine head system includes ray machine casing, ray machine driving plate and the ray machine optical path mould group being electrically connected with ray machine driving plate, and ray machine driving plate and ray machine optical path mould group are located in ray machine casing;Host system includes host shell and host system plate, and host system plate is located in host shell, in being provided with operation button on host shell;Ray machine casing is rotationally articulated on host shell by a shaft, and ray machine casing and host shell are located at the both ends of shaft in the axial direction of shaft, and ray machine driving plate is electrically connected by connecting line and host system plate.The micro projector, which can avoid the heat that ray machine head system distributes, influences host system work, while comfort and portability that product uses can be improved.
Description
Technical field
The present embodiments relate to projection art more particularly to a kind of micro projectors.
Background technique
With the development of shadow casting technique, the direction that projection device is more intended to small size, high power and low noise is developed.
The ray machine head system and host system of existing micro projector are usually located in the same shell, due to micro projector internal junction
Structure is compact, can not form effective natural convection air air duct, heat caused by the biggish ray machine head system of calorific value is often
Easy accumulation dissipates inside housings does not go out, these heats will cause inside projector that each part temperatures are excessively high instead, influences to send out
The lower host system of heat works normally.
Meanwhile it being provided with operation button on the shell of existing micro projector, and it is the main region of human-computer interaction, it is above-mentioned micro-
In operation, heat caused by ray machine head system causes the temperature of entire projector shell higher to type projector, to influence
The comfort that projector operation uses.
In addition, existing micro projector generally requires the support of the attachmentes such as bracket, shadow in different projection application scenarios
Ring the portable performance of projector.
Summary of the invention
In view of this, the technical problem to be solved by the embodiment of the invention is that provide a kind of micro projector, to gram
Taking heat caused by ray machine head system in the prior art influences the problem of host system works normally, and reaching effectively to radiate,
And the technical effect of operating comfort and portability can be improved.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of micro projector, including ray machine head system and master
Machine system;The ray machine head system includes ray machine casing, ray machine driving plate and the light being electrically connected with the ray machine driving plate
Machine optical path mould group, the ray machine driving plate and ray machine optical path mould group are located in the ray machine casing;The host system includes
Host shell and host system plate, the host system plate are located in the host shell, are provided on Yu Suoshu host shell
Operation button;The ray machine casing is rotationally articulated on the host shell by a shaft, the ray machine casing
Be located at the both ends of the shaft in the axial direction of the shaft with host shell, the ray machine driving plate by connecting line with
The host system plate is electrically connected.
Further, the ray machine casing is made of metal material comprising tubular housing body and respectively position
In the side wall radiator of the housing body opposite sides.
Further, metal conducting strip is equipped in the housing body, heat caused by the ray machine head system passes through
Institute's metal conducting strip, which is conducted to the two sidewalls radiator and housing body, to radiate.
Further, the metal conducting strip surface is coated with graphite material.
Further, the metal conducting strip includes the first metal conducting strip and the second metal conducting strip;First gold medal
Belong to thermally conductive sheet and be attached at the ray machine driving plate, and is set to opposite the two of the ray machine driving plate with the ray machine optical path mould splits
Side;Second metal conducting strip is attached on the heater element of the ray machine optical path mould group, and is divided with the ray machine driving plate
Set on the opposite sides of the ray machine optical path mould group.
Further, first metal conducting strip bends out end, and the end is attached at far from the host system
Side wall radiator;Second metal conducting strip also bends out end, and the end is attached at close to the host system
Side wall radiator.
Further, between the housing body and the side wall radiator of the separate host system by heat-barrier material or
Heat Conduction Material connection;It is connected between the housing body and the side wall radiator of the close host system by Heat Conduction Material.
Further, first metal conducting strip bends out end, and the end is attached at the two sidewalls radiator;
Second metal conducting strip is attached at the housing body in planar.
Further, it is all connected by heat-barrier material between the housing body and the two sidewalls radiator.
Further, the ray machine head system further includes interior frame bracket, and the interior frame bracket is located at the ray machine casing
Interior, the ray machine optical path mould group and ray machine driving plate are fixedly mounted on the interior frame bracket;The shaft is hollow axle,
One end is fixed on the interior frame bracket, and the connecting line is arranged in the shaft.
Further, the host system further includes metal thermal balance cover, and the metal thermal balance cover is covered on the master
The inner surface of casing body, and between the element being located on the host shell and host system plate, and pass through heat-conducting medium and institute
The heater element stated on host system plate is connected.
Further, the metal thermal balance cover surface is coated with carbon nanomaterial.
Further, correspond to that several heat dissipations are offered at the position of the metal thermal balance cover is logical on the host shell
Hole.
Further, the host shell is made of plastic material.
Further, the host system plate has charge-discharge circuit, and the host system further includes can be by electric and external
The battery core of portion's equipment electric discharge, the battery core are located in the host shell, and electric with the charge-discharge circuit of the host system plate
Property connection.
Compared with prior art, ray machine head system and host system split settings in the embodiment of the present invention, make ray machine head
System is mutually isolated with host system, and can avoid the heat that ray machine head system distributes influences host system work.Meanwhile host system
Operation button is set on system, and in operation, human body hardly connects with the higher ray machine head system of heat above-mentioned micro projector
Touching causes human body uncomfortable to can avoid overheat, and above-mentioned split-type design can effectively distribute heat spreader distribution, and human body is frequent
The partial heat of touch is dispersed, and is focused on non-contact area and is concentrated heat dissipation, so that the comfort that product uses can be improved.This
Outside, ray machine head system is rotationally pivotally connected on the host computer system, and host system can be used as the brace foundation of ray machine head system, this
Split type setting can better solve the various application scenarios flexibly projected, not need the support of the attachmentes such as bracket, so as to
Improve the portability of product.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in inventive embodiments can also obtain according to these attached drawings for those of ordinary skill in the art
Obtain other attached drawings.
Fig. 1 is the stereoscopic schematic diagram of a preferred embodiment of the present invention.
Fig. 2 is the stereoscopic schematic diagram of embodiment illustrated in fig. 1 one of which use state.
Fig. 3 is the decomposition diagram of ray machine head system in embodiment illustrated in fig. 1.
Fig. 4 is the partial schematic sectional view of ray machine head system in embodiment illustrated in fig. 1.
Fig. 5 is the decomposition diagram of host system in embodiment illustrated in fig. 1.
Fig. 6 is the partial schematic sectional view of host system in embodiment illustrated in fig. 1.
Specific embodiment
In order to make those skilled in the art more fully understand the technical solution in the embodiment of the present invention, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described reality
Applying example only is a part of the embodiment of the embodiment of the present invention, instead of all the embodiments.Based on the implementation in the embodiment of the present invention
The range of protection of the embodiment of the present invention all should belong in example, those of ordinary skill in the art's every other embodiment obtained.
Fig. 1 to Fig. 6 is please referred to, is a preferred embodiment of the invention, which includes ray machine head system 1 and master
Machine system 2.Ray machine head system 1 includes ray machine casing 11, ray machine driving plate 12 and the light being electrically connected with ray machine driving plate 12
Machine optical path mould group 13, ray machine driving plate 12 and ray machine optical path mould group 13 are located in ray machine casing 11.Host system 2 includes host
Shell 21 and host system plate 22, host system plate 22 are located in host shell 21, in be provided on host shell 21 operation by
Key 211.Ray machine casing 11 is rotationally articulated on host shell 21 by a shaft 3, ray machine casing 11 and main case
Body 21 is located at the both ends of shaft 3 in the axial direction of shaft 3, and ray machine driving plate 12 passes through connecting line (not shown) and master
Machine system board 21 is electrically connected.
The ray machine head system 1 and 2 split settings of host system of above-mentioned micro projector, make ray machine head system 1 and host system
It unites 2 mutually isolated, can avoid the heat that ray machine head system 1 distributes and influence host system 2 working.Meanwhile being arranged in host system 2
Operation button 211, in operation, human body is hardly contacted with the higher ray machine head system 1 of heat above-mentioned micro projector, from
And it is uncomfortable to can avoid thermally-induced human body;Above-mentioned split-type design can effectively distribute heat spreader distribution, and human body is often touched
Partial heat dispersed, focus on non-contact area concentrate heat dissipation, so that the comfort that product uses can be improved.In addition,
Ray machine head system 1 is rotationally articulated in host system 2, and host system 2 can be used as the brace foundation of ray machine head system 1, this
Kind split-type design can better solve the various application scenarios flexibly projected, not need the support of the attachmentes such as bracket, thus
The portability of product can be improved.
Specifically, please referring collectively to Fig. 3 and Fig. 4, laser ray machine, heat entirety phase is can be used in above-mentioned ray machine head system 1
To DLP(Digital Light Processing, digital light processing) ray machine is smaller, it does not need to pacify as common DLP ray machine
Indispensable fan is filled, so as to save space, while avoiding noise caused by fan.Ray machine head system 1 further includes inside casing branch
Frame 14, interior frame bracket 14 are located in ray machine casing 11, and ray machine optical path mould group 13 and ray machine driving plate 12 are fixedly mounted on inside casing
On bracket 14.
Ray machine casing 11 is made of metal material comprising tubular housing body 111 and is located at shell master
The side wall radiator 112 of 111 opposite sides of body, housing body 111 and two sidewalls radiator 112 enclose jointly sets out an inside sky
Between, for accommodating ray machine driving plate 12 and ray machine optical path mould group 13.Ray machine optical path mould group 13 and about 12 ray machine driving plate are stacked
Ground is mounted in shell 111, can reduce the space occupied.The two sidewalls radiator 112 of ray machine casing 11 uses aluminium alloy type
Material is made, and is coated with nano material in Surface of profile, to enhance heat dissipation performance.Every one side wall radiator 112 includes substrate 1121
And several radiating fins 1122, substrate 1121 are closed in the end of housing body 111, radiating fin 1122 is by the outer of substrate 1121
Side extends outwardly.Metal conducting strip is equipped in the housing body 111 of ray machine head system 1, by metal conducting strip by light
Heat caused by head system 1 is conducted to two sidewalls radiator 112 and housing body 111 and is radiated.
Metal conducting strip can be made of copper foil, and surface is coated with graphite material.Graphite material has very in the x, y direction
High thermal conduction characteristic, and copper has very high thermal conduction characteristic in Z-direction, in conjunction with the advantages of the two, metal conducting strip can more be accelerated
Fast ground conducts heat generated in ray machine head system 1 to side wall radiator 112 and housing body 111, and then radiates.
Specifically, the metal conducting strip includes the first metal conducting strip 15 and the second metal conducting strip 16.First metal
Thermally conductive sheet 15 is attached at ray machine driving plate 12, and the opposite sides of ray machine driving plate 12 is divided into ray machine optical path mould group 13.The
One metal conducting strip 15 bends out end, and the end is attached at a side wall radiator 112 far from host system 2.In this way,
Heat caused by ray machine driving plate 12 can be conducted by the first metal conducting strip 15 to one of side wall radiator 112,
It is radiated by side wall radiator 112.Second metal conducting strip 16 is mounted on interior frame bracket 14, and is attached at ray machine optical path
On the heater element (not indicating in figure) of mould group 13, the opposite sides of ray machine optical path mould group 13 is divided into ray machine driving plate 12.
Second metal conducting strip 16 bends out end, and the end is attached at the side wall radiator 112 close to host system 2, by light
Heat caused by machine optical path mould group 13 is conducted to another side wall radiator 112 of ray machine shell 11.In the present embodiment,
It is all connected by Heat Conduction Material between housing body 111 and two sidewalls radiator 112, in this way, two sidewalls radiator 112 can pass through
Heat Conduction Material conducts heat in housing body 111, further carries out auxiliary heat dissipation by housing body 111.This heat dissipation
Mode can make the surface temperature of housing body 111 not too high and cause to scald one's hand, and side wall radiator 112 is usually that hand does not reach
Position, can give full play to its heat sinking function, guarantee that internal ray machine optical path mould group 13 and ray machine driving plate 12 can work normally.
Certainly, also it can will pass through heat-barrier material between housing body 111 and the side wall radiator 112 of separate host system 2
Connection, and pass through Heat Conduction Material between housing body 111 and the side wall radiator 112 of close host system 2 and connect.In this way, main
Heat caused by machine driving plate 12 is conducted by the first metal conducting strip 15 to the side wall radiator 112 far from host system 2
After upper, string heat will not occur with housing body 111, and heat caused by ray machine optical path mould group 13 passes through the second metal conducting strip
16 conduction can further be conducted by Heat Conduction Material to housing body to after on the side wall radiator 112 of host system 2
On 111, the surface temperature of housing body 111 is made to be unlikely to excessively high, is in thermal equilibrium state with surrounding enviroment.
In another embodiment of the present invention, the end of the first metal conducting strip 15 can also be attached at two side walls simultaneously
Radiator 112 conducts heat caused by ray machine driving plate 12 to the two side walls radiator 112 of ray machine shell 11;
And the second metal conducting strip 16 does not bend out end, the second metal conducting strip 16 is attached at housing body 111, light in planar
Heat caused by machine optical path mould group 13 can be transmitted to housing body 111 by the second metal conducting strip 16 and radiate.Due to
Heat caused by ray machine driving plate 12 is relatively large, and heat caused by ray machine optical path mould group 13 is relatively small, shell master
It is all connected by heat-barrier material between body 111 and two sidewalls radiator 112, in this way, string heat can be prevented, that is, prevents side wall radiator
Higher heat is conducted to housing body 111 on 112, influences the normal operation of ray machine optical path mould group 13.
Please referring collectively to Fig. 5 and Fig. 6, the host shell 21 of above-mentioned host system 2 includes upper cover 212 and lower cover 213, operation
Key 211 is mounted in upper cover 212, and host system 2 further includes keypad 23, and keypad 23 is located at key 211 and host system
Between plate 22, and it is electrically connected with host system plate 22.Host shell 21 is equipped with the multiple connector ports of electricity and (does not mark in figure
Show), the connector port include at least USB(Universal Serial Bus, universal serial bus) interface and audio it is defeated
Incoming interface.
Host system 2 further includes metal thermal balance cover 24, the shape and 21 upper cover 212 of host shell of metal thermal balance cover 24
Inner surface configuration it is consistent, metal thermal balance cover 24 is covered on the inner surface of 21 upper cover 212 of host shell, and is located at host shell
Between element (not indicating in figure) in 21 upper covers 212 and host system plate 22, metal thermal balance cover 24 is led by heat-conducting glue etc.
Thermal medium is connect with the heater element (such as chip) on host system plate 22.Metal thermal balance cover is by heating conductions such as aluminium, copper
Good metal material is made, main to play heat dissipation and shielding action, can conduct even heat caused by host system 2
To the upper cover 212 of host shell 21, uniform heat, and space heat elimination is carried out, to prevent the local temperature of host shell 21
It is excessively high.
Host shell 21 is preferably made of plastic material, to reduce temperature to the susceptibility of human body, certainly, main body shell 21
It can also be made of metal material.If being offered at the position for corresponding to metal thermal balance cover 24 in the upper cover 212 of host shell 21
Equally distributed thermal vias 2121 is done, in order to radiate.24 surface of metal thermal balance cover can coat carbon nanomaterial, to reinforce
Heat loss through radiation, heat loss through radiation mainly pass through the thermal vias 2121 on host shell 21 and shed.
Please referring collectively to Fig. 1 and Fig. 2, above-mentioned shaft 3 is hollow axle, and one end is fixed on interior in ray machine head system 1
On frame bracket 14, ray machine head system can be rotated together with shaft 3.Connecting line is arranged in shaft 3, will not in terms of product appearance
Connecting line is seen at gap between ray machine casing 11 and host shell 21, will not more be generated connecting line caused by rotation and be inserted
Bad problem is connect, so as to take into account the practicability and aesthetics of product.Certainly, shaft 3 can also be solid spindle, and connecting line can
Ray machine head system 2 and host system 1 are connected in 3 external parallel of shaft.
Shaft 3 is first fixed on the interior frame bracket 14 of ray machine head system 1, in assembling by light by above-mentioned micro projector
Machine optical path mould group 13, ray machine driving plate 12 assemble integral with interior frame bracket 14, are then inserted in housing body 111, encapsulating housing
The side wall radiator 112 at 111 both ends of main body completes the assembling of ray machine head system 1.Then, then by the other end of shaft 3 integrally fill
Enter in the host shell 11 of host system 1, host shell 11 positions by perpendicular end surface and use fastened by screw, guarantees positioning accurate
It is quasi-.
Connecting line between above-mentioned ray machine head system 2 and host system 1 may include audio-video connecting line, power supply line, control
Line etc., one end are welded to FPC(Flexible Printed Circuit, flexible circuit board) soft arranging wire, to connect ray machine
Driving plate 12, and the other end connects socket, to connect host system 1.
In addition, above-mentioned host system plate 22 also has charge-discharge circuit, host system 2 further includes that can set by electricity and to outside
The battery core 25 of standby electric discharge, battery core 25 are located in host shell 21, and are located at host system plate 22 far from metal thermal balance cover 24
Side is electrically connected with the charge-discharge circuit of host system plate 22.In the present embodiment, the charge-discharge circuit is fast charging and discharging
Circuit supports QC3.0 agreement and PD2.0 agreement, supports quickly by electricity and to external equipment repid discharge, can be in 5V, 9V, 12V
Fast charge function is completed on gear.The charge-discharge circuit can be under the fast charge mode of micro projector, i.e., optical projection system closes shape
Under state, repid discharge is carried out by fast charge agreement under 5V, 9V, 12V gear to external single equipment, or receive fast charge adaptation
The quick charge of device;It can also discharge while opening optical projection system external equipment electric discharge or the side Bian Shou electricity, this mode
Under can be at concurrently or separately charge and discharge under 5V state.Internal battery core 25 is powered, and is in micro- throwing start-up mode, and external hard drive
In the case where, it is powered using 5V by current needs.In the above state, extraneous power supply adaptor is equally needed using 5V by electric current
Ask power supply.
Ray machine head system and host system are arranged in the same inner space relative to traditional micro projector, fever
Measure heat caused by biggish ray machine head system influence calorific value can lower host system normal work, the embodiment of the present invention
Micro projector by ray machine head system 1 and 2 split settings of host system, make ray machine head system 1 and host system 2 mutually every
From can avoid the heat that ray machine head system 1 distributes influences the work of host system 2.Meanwhile operation button is set in host system 2
211, in operation, human body is hardly contacted with the higher ray machine head system 1 of heat above-mentioned micro projector, to can avoid
Cross the comfort that thermally-induced human body is uncomfortable, and raising product uses.In addition, ray machine head system 1 is rotationally articulated in host system 2
On, host system 2 can be used as the brace foundation of ray machine head system 1, so as to better solve the various applications flexibly projected
Scene does not need the support of the attachmentes such as bracket, improves the portability of product.
Above-described embodiment is only the preferable embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other it is any without departing from the spirit and principles of the present invention made by changes, modifications, substitutions, combinations, simplifications,
It is regarded as equivalent substitute mode, is included within the scope of the present invention.
Claims (15)
1. a kind of micro projector, including ray machine head system and host system;The ray machine head system include ray machine driving plate and
The ray machine optical path mould group being electrically connected with the ray machine driving plate;The host system includes host system plate;The ray machine drives
Movable plate is electrically connected by connecting line and the host system plate;It is characterized in that, the ray machine head system further includes ray machine head
Shell, the ray machine driving plate and ray machine optical path mould group are located in the ray machine casing;The host system further includes host
Shell, the host system plate are located in the host shell, are provided with operation button on Yu Suoshu host shell;The ray machine
Casing is rotationally articulated on the host shell by a shaft, and the ray machine casing and host shell are at described turn
The both ends of the shaft are located in the axial direction of axis.
2. micro projector as described in claim 1, which is characterized in that the ray machine casing is made of metal material,
Including tubular housing body and it is located at the side wall radiator of the housing body opposite sides.
3. micro projector as claimed in claim 2, which is characterized in that be equipped with metal conducting strip, institute in the housing body
State heat caused by ray machine head system by institute's metal conducting strip conduct to the two sidewalls radiator and housing body into
Row heat dissipation.
4. micro projector as claimed in claim 3, which is characterized in that the metal conducting strip surface is coated with graphite material
Material.
5. micro projector as claimed in claim 3, which is characterized in that the metal conducting strip includes the first metal conducting strip
And second metal conducting strip;First metal conducting strip is attached at the ray machine driving plate, and with the ray machine optical path mould group
It is divided into the opposite sides of the ray machine driving plate;Second metal conducting strip is attached at the fever of the ray machine optical path mould group
On element, and it is divided into the ray machine driving plate opposite sides of the ray machine optical path mould group.
6. micro projector as claimed in claim 5, which is characterized in that first metal conducting strip bends out end, institute
It states end and is attached at the side wall radiator far from the host system;Second metal conducting strip also bends out end, described
End is attached at the side wall radiator close to the host system.
7. micro projector as claimed in claim 6, which is characterized in that the housing body and the separate host system
It is connected between side wall radiator by heat-barrier material or Heat Conduction Material;The side wall of the housing body and the close host system
It is connected between radiator by Heat Conduction Material.
8. micro projector as claimed in claim 5, which is characterized in that first metal conducting strip bends out end, institute
It states end and is attached at the two sidewalls radiator;Second metal conducting strip is attached at the housing body in planar.
9. micro projector as claimed in claim 8, which is characterized in that the housing body and the two sidewalls radiator it
Between all pass through heat-barrier material connect.
10. micro projector as described in claim 1, which is characterized in that the ray machine head system further includes interior frame bracket, institute
It states interior frame bracket to be located in the ray machine casing, the ray machine optical path mould group and ray machine driving plate are fixedly mounted on the inside casing
On bracket;The shaft is hollow axle, and one end is fixed on the interior frame bracket, and the connecting line is arranged in the shaft
In.
11. micro projector as described in claim 1, which is characterized in that the host system further includes metal thermal balance cover,
The metal thermal balance cover is covered on the inner surface of the host shell, and is located on the host shell and host system plate
Between element, and it is connected by heat-conducting medium with the heater element on the host system plate.
12. micro projector as claimed in claim 11, it is characterised in that, the metal thermal balance cover surface is coated with carbon
Nano material.
13. micro projector as claimed in claim 11, which is characterized in that it is equal to correspond to the metal fever on the host shell
Several thermal vias are offered at the position of weighing apparatus cover.
14. micro projector as claimed in claim 11, which is characterized in that the host shell is made of plastic material.
15. the micro projector as described in any one of claim 1 to 14, which is characterized in that the host system plate tool
There is charge-discharge circuit, the host system further includes that can be located at described by electricity and the battery core discharged external equipment, the battery core
In host shell, and it is electrically connected with the charge-discharge circuit of the host system plate.
Priority Applications (1)
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CN201910103489.8A CN109739066A (en) | 2019-02-01 | 2019-02-01 | Micro projector |
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CN201910103489.8A CN109739066A (en) | 2019-02-01 | 2019-02-01 | Micro projector |
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Family
ID=66367103
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113253552A (en) * | 2021-04-29 | 2021-08-13 | 深圳市火乐科技发展有限公司 | Heat radiation structure and projector |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009080146A (en) * | 2007-09-25 | 2009-04-16 | Brother Ind Ltd | Projector |
KR20090046454A (en) * | 2007-11-06 | 2009-05-11 | 삼성전자주식회사 | Portable projector and mobile telecommunication terminal having the same |
CN103838066A (en) * | 2012-11-23 | 2014-06-04 | 鸿富锦精密工业(深圳)有限公司 | Projector |
CN104834167A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
CN209400845U (en) * | 2019-02-01 | 2019-09-17 | 深圳一维山科技有限公司 | Micro projector |
-
2019
- 2019-02-01 CN CN201910103489.8A patent/CN109739066A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009080146A (en) * | 2007-09-25 | 2009-04-16 | Brother Ind Ltd | Projector |
KR20090046454A (en) * | 2007-11-06 | 2009-05-11 | 삼성전자주식회사 | Portable projector and mobile telecommunication terminal having the same |
CN103838066A (en) * | 2012-11-23 | 2014-06-04 | 鸿富锦精密工业(深圳)有限公司 | Projector |
CN104834167A (en) * | 2015-05-12 | 2015-08-12 | 苏州佳世达光电有限公司 | Projection device |
CN209400845U (en) * | 2019-02-01 | 2019-09-17 | 深圳一维山科技有限公司 | Micro projector |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113253552A (en) * | 2021-04-29 | 2021-08-13 | 深圳市火乐科技发展有限公司 | Heat radiation structure and projector |
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