CN108340653A - 电子产品的框架的制造方法及其制品 - Google Patents

电子产品的框架的制造方法及其制品 Download PDF

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CN108340653A
CN108340653A CN201710057998.2A CN201710057998A CN108340653A CN 108340653 A CN108340653 A CN 108340653A CN 201710057998 A CN201710057998 A CN 201710057998A CN 108340653 A CN108340653 A CN 108340653A
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frame
metal layer
opening
prepreg bed
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陈昱龙
洪万顺
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Advanced International Multitech Co Ltd
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Advanced International Multitech Co Ltd
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    • B32—LAYERED PRODUCTS
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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Abstract

一种电子产品的框架的制造方法，包含一个粗化步骤、一个叠置步骤，及一个成型步骤。在该粗化步骤中，准备多个各自围绕出一个第一开口的金属层，并分别对所述金属层的表面进行粗化处理。在该叠置步骤中，将所述金属层与多个预浸材料层交互堆叠，每一个预浸材料层围绕出一个第二开口，所述第一开口及所述第二开口相互连通。在该成型步骤中，将所述金属层及所述预浸材料层热压成型为一个框架。该框架由于同时具有预浸材料及金属，因此兼具了易于成型及结构强度佳的优点，由于所述金属层的表面经过粗化处理，因此可增加热压时与预浸材料层所溢流出的树脂黏合时的接触面积，提升结合强度。

Description

电子产品的框架的制造方法及其制品
技术领域
本发明涉及一种框架的制造方法及其制品，特别是涉及一种电子产品的框架制造方法及其制品。
背景技术
在科技的不断进步下，各式各样的电子产品逐渐微型化，功能精致度也不断突破，像是智能手表便是其中一例，不仅具备传统的时间显示功能，还能测量睡眠质量、定位、监控使用者身体机能状态、提示来电，及讯息等等。由于微型及功能精致化的结果，故此类电子产品的框架需要具备较高的强度，且为了增添设计感或内部组件置放需求，该框架的材料还要易于成型。而全金属的框架虽然有较高的强度，但是成型加工不易，且智能手表这类的产品常需要跟着用户运动以监测运动数据，而全金属框架的重量较重，会加重使用者运动时的负担并影响穿戴体验。而复合材料(例如碳纤维)制成的框架虽然较轻且相对的易于成型，但强度较低且缺乏金属质感而外型欠佳，加上一般电子产品内的组件需要接地线，若使用复合材料框架的话，则需由框架内部另外拉接地线，电子回路配置较为麻烦。
发明内容
本发明的目的在于提供一种具有复合材料及金属的电子产品的外框的制造方法。
本发明电子产品的框架的制造方法，其特征在于：该制造方法包含一个粗化步骤、一个叠置步骤，及一个成型步骤，在该粗化步骤中，准备多个金属层，每一个金属层围绕出一个第一开口，并分别对所述金属层的表面进行粗化处理，在该叠置步骤中，将所述金属层与多个预浸材料层交互堆叠，每一个预浸材料层围绕出一个第二开口，所述第一开口及所述第二开口相互连通，在该成型步骤中，将所述金属层及所述预浸材料层热压成型为一个框架。
较佳地，前述电子产品的框架的制造方法，其中在该粗化步骤中，是对每一个金属层的相反两面进行粗化。
较佳地，前述电子产品的框架的制造方法，其中在该叠置步骤中，每一个预浸材料层是选自碳纤维、聚对苯二甲酸二乙酯、聚乙烯、聚丙烯、克维拉纤维、芳纶纤维、玻璃纤维或玄武岩纤维所制成。
本发明的另一个目的在于提供一种由该制造方法所制得的制品。
本发明电子产品的框架，其特征在于：该框架包含多个金属层及多个分别与所述金属层交错设置的预浸材料层，每一个金属层围绕出一个第一开口，且具有至少一个粗糙面，每一个预浸材料层的至少其中一面是黏固相邻金属层的粗糙面，且该预浸材料层围绕出一个连通两相邻金属层的第一开口的第二开口。
较佳地，前述电子产品的框架，其中每一个金属层具有两个彼此相反的粗糙面，每一个预浸材料层的相反两面是分别黏固相邻两个金属层的相对应粗糙面。
较佳地，前述电子产品的框架，其中每一个预浸材料层是选自碳纤维、聚对苯二甲酸二乙酯、聚乙烯、聚丙烯、克维拉纤维、芳纶纤维、玻璃纤维或玄武岩纤维所制成。
本发明的有益的效果在于：该框架由于同时具有预浸材料及金属，因此兼具了易于成型及结构强度佳的优点，同时该框架内的电子组件的接地线可直接连接所述金属层，因此不需另外布线，简化电子线路配置。此外，在热压成型时，由所述预浸材料层流出的树脂会流淌于所述金属层的表面，由于所述金属层的表面经过粗化处理，因此可增加与树脂黏合的接触面积，进而提升结合强度。
附图说明
图1是一个流程图，说明本发明电子产品的框架的制造方法的一实施例；
图2是一个立体图，说明本实施例的一个粗化步骤；
图3是一个立体分解图，说明本实施例的一个叠置步骤；
图4是一个立体图，说明本实施例的一个成型步骤；及
图5是一个剖视图，说明该实施例所制得的一个框架。
具体实施方式
下面结合附图及实施例对本发明进行详细说明。
参阅图图1与图2，本发明电子产品的框架1的制造方法的一个实施例，包含一个粗化步骤21、一个叠置步骤22，及一个成型步骤23。在该粗化步骤21中，先准备多个金属层3，每一个金属层3围绕出一个第一开口31。接着通过砂纸或其他方式对所述金属层3的相反两面进行粗化，从而使每一个金属层3具有两个彼此相反的粗糙面32。
参阅图1及图3，在该叠置步骤22中，准备多个预浸材料层4，每一个预浸材料层4围绕出一个第二开口41。接着将所述金属层3及所述预浸材料层4交互堆叠，并使所述第一开口31与所述第二开口41相连通并相互对应。在本实施例中，每一个预浸材料层4是选自碳纤维、聚对苯二甲酸二乙酯、聚乙烯、聚丙烯、克维拉纤维、芳纶纤维、玻璃纤维或玄武岩纤维所制成。
参阅图1、图4及图5，在该成型步骤23中，将所述金属层3及所述预浸材料层4置入模具中(图未示)，并进行热压成型，在前述过程中，所述预浸材料层4内所含的树脂会流出并流淌至所述金属层3的所述粗糙面32上，使得所述金属层3可通过树脂与所述预浸材料层4黏合。在热压成型后开启模具，便可得到一个电子产品的框架1，该框架1包含多个金属层3及多个预浸材料层4，且围绕出一个用于容置电子组件的容置空间11。
所述金属层3可提供较佳的结构强度，而所述预浸材料层4较易成型而降低加工难度，且设置于该容置空间11内的电子组件的接地线可直接连接所述金属层3，免去另外配置线路的困扰。此外，所述粗糙面32与树脂的接触面积较大，因此可增加与所述预浸材料层4黏合时的结合力。
综上所述，所述金属层3不但具有金属光泽而较为美观，且提供较佳的结构强度。所述预浸材料层4较易成型而使外型设计更为灵活，故确实能达成本发明的目的。

Claims (6)

1.一种电子产品的框架的制造方法，其特征在于：该制造方法包含一个粗化步骤、一个叠置步骤，及一个成型步骤，在该粗化步骤中，准备多个金属层，每一个金属层围绕出一个第一开口，并分别对所述金属层的表面进行粗化处理，在该叠置步骤中，将所述金属层与多个预浸材料层交互堆叠，每一个预浸材料层围绕出一个第二开口，所述第一开口及所述第二开口相互连通，在该成型步骤中，将所述金属层及所述预浸材料层热压成型为一个框架。
2.根据权利要求1所述电子产品的框架的制造方法，其特征在于：在该粗化步骤中，是对每一个金属层的相反两面进行粗化。
3.根据权利要求1所述电子产品的框架的制造方法，其特征在于：在该叠置步骤中，每一个预浸材料层是选自碳纤维、聚对苯二甲酸二乙酯、聚乙烯、聚丙烯、克维拉纤维、芳纶纤维、玻璃纤维或玄武岩纤维所制成。
4.一种电子产品的框架，其特征在于：该框架包含多个金属层及多个分别与所述金属层交错设置的预浸材料层，每一个金属层围绕出一个第一开口，且具有至少一个粗糙面，每一个预浸材料层的至少其中一面是黏固相邻金属层的粗糙面，且该预浸材料层围绕出一个连通两相邻金属层的第一开口的第二开口。
5.根据权利要求4所述电子产品的框架，其特征在于：每一个金属层具有两个彼此相反的粗糙面，每一个预浸材料层的相反两面是分别黏固相邻两个金属层的相对应粗糙面。
6.根据权利要求4所述电子产品的框架，其特征在于：每一个预浸材料层是选自碳纤维、聚对苯二甲酸二乙酯、聚乙烯、聚丙烯、克维拉纤维、芳纶纤维、玻璃纤维或玄武岩纤维所制成。
CN201710057998.2A 2017-01-23 2017-01-23 电子产品的框架的制造方法及其制品 Pending CN108340653A (zh)

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