CN108323041A - A kind of edges of boards design method of multiple pressing HDI plates - Google Patents

Abstract

The present invention relates to art of printed circuit boards, specially a kind of edges of boards design method of multiple pressing HDI plates, the design method that the present invention passes through optimization edges of boards, fusion bit pattern is made in edges of boards, so that edges of boards fuse etched copper consistency of thickness in copper layer thickness and unit at position, removal fusion bit pattern is etched by outer layer again, compared with the production process of mechanical processing HDI plates, reduce the process of mechanical milling, without being further added by technological process and processing cost, solves the copper sheet blistering Tibetan medicine water problems at fusion position.The optimum design method that the present invention passes through edges of boards by the copper sheet at the fusion position by easy blistering, edges of boards fusion position blistering Tibetan medicine water problems caused by solving such processing HDI plates using mechanical system, processing and fabricating process cost is saved, product output rate is improved, improves exterior quality.Simultaneously as this method does not need milling except fusion position, it can also improve the edges of boards removed because position milling will be fused, be not easy to the operational issue picked and placeed.

Description

A kind of edges of boards design method of multiple pressing HDI plates

Technical field

The present invention relates to art of printed circuit boards more particularly to a kind of edges of boards design methods of multiple pressing HDI plates.

Background technology

HDI is the abbreviation of high density interconnection (High Density Interconnector), and HDI plates blind are buried using micro- A kind of circuit board that circuit distribution density is relatively high of hole technology.HDI plates are the compact products for aiming at low capacity user design. It using modularization can Parallel Design, a module capacity 1000VA (height 1U), natural cooling, maximum can 6 modules in parallel. There is HDI plates gamut to adapt to load capacity and stronger short-time overload capacity.Small portable from mobile phone to intellectual weapon In product, " small " is eternal constant pursuit, and Electronic Design also is making great efforts to reduce its ruler while overall performance is continuously improved It is very little.High Density Integration (HDI) technology can be such that end product design more minimizes, while meet Electronic Performance and efficiency more High standard.Be widely used in mobile phone at present, number (takes the photograph) camera, MP3, MP4, laptop, automotive electronics and other number Code product etc., wherein being most widely used with mobile phone.

Currently, when making HDI circuit boards, copper sheet foaming phenomena can be generated in edges of boards fusion position, then in outer graphics With in silk-screen welding resistance manufacturing process, be easy the fusion position Tibetan medicine water in blistering, liquid medicine can penetrate into unit in the production process leads Pollution plate face is caused, influences production board appearance even by client's rejection and customer complaint.The mode milling of generally use machinery milling at present Fall the place of copper sheet blistering, but this way has the following defects:

1, it needs that position mill off will be fused by way of mechanical milling in a manner of doing over again after second pressing, increases process And process time, after the completion, machinery mills the place removed and makes edges of boards generate to lack block, sharp at processing, easily scratches plate face, not side Continue loading or unloading operation after an action of the bowels.

2, when daughter board manufactures inner figure, the fusion bit pattern of outer layer has been made, after abrasive belt grinding leveling, This fusion position can generate copper sheet foaming phenomena because of electro-coppering binding force problem after heavy copper plate electric, and product are brought to the making of rear process Matter hidden danger.

Invention content

The present invention uses engraving method replacement and mechanical milling to prevent due to HDI plates in view of the above-mentioned problems, offer is a kind of Edges of boards fuse the edges of boards design method of the multiple pressing HDI plates of Tibetan medicine water caused by the blistering of position.

To achieve the above object, the present invention uses following technical scheme：

A kind of edges of boards design method of multiple pressing HDI plates, includes the following steps:

S1, when making internal layer daughter board, the edges of boards of inner- electron plate produce fusion position；

S2, inner- electron plate make internal layer plate hole pattern when, fusion position covered with dry film；

S3, inner- electron plate make inner figure when, fusion position produce fusion position tool figure；

S4, it makes plating hole pattern in outer layer and when outer graphics, is covered with dry film in the fusion position of outer layer；

S5, when outer layer is etched, etching removal fusion position at copper sheet.

Further, in step s3, fusion position tool figure is not produced in the fusion position for being placed in outer layer.

Compared with prior art, the beneficial effects of the invention are as follows：The present invention by optimize edges of boards design method, in edges of boards Make fusion bit pattern so that edges of boards fuse etched copper consistency of thickness in copper layer thickness and unit at position, then pass through outer layer Etching removal fusion bit pattern reduces the process of mechanical milling, without increasing again compared with the production process of mechanical processing HDI plates Add technological process and processing cost, solves the copper sheet blistering Tibetan medicine water problems at fusion position.The present invention by easy by blistering Fusion position at copper sheet by the optimum design methods of edges of boards, solve plate caused by such processing HDI plates using mechanical system Side fuses position blistering Tibetan medicine water problems, saves processing and fabricating process cost, improves product output rate, improves exterior quality.Meanwhile Since this method does not need milling except fusion position, it can also improve the edges of boards removed because position milling will be fused, be not easy to the operational issue picked and placeed.

Specific implementation mode

In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention It is described further and illustrates.

Embodiment

The present invention provides a kind of edges of boards design method of multiple pressing HDI plates, the especially resinous consent flow of outer layer HDI plates specifically include the improvement to following steps in original circuit board making flow:

S1, internal layer daughter board is made, when making internal layer daughter board, fusion position is produced in the edges of boards of inner- electron plate；

S2, inner- electron plate make internal layer plate hole pattern when, fusion position covered with dry film；

S3, inner- electron plate make inner figure when, fusion position produce fusion position tool figure；Wherein, it is being placed in Do not produce fusion position tool figure in the fusion position of outer layer；

S4, it makes plating hole pattern in outer layer and when outer graphics, is covered with dry film in the fusion position of outer layer；

S5, when outer layer is etched, etching removal fusion position at copper sheet.

S6, the follow-up production process of circuit board is completed until product is completed.

The present invention makes fusion bit pattern so that edges of boards fuse at position by the design method of optimization edges of boards in edges of boards Copper layer thickness and etched copper consistency of thickness in unit, then removal fusion bit pattern is etched by outer layer, with mechanical processing HDI plates Production process compare, reduce the process of mechanical milling, without being further added by technological process and processing cost, solve at fusion position Copper sheet blister Tibetan medicine water problems.The optimization design side that the present invention passes through edges of boards by the copper sheet at the fusion position by easy blistering Method, edges of boards fusion position blistering Tibetan medicine water problems, saves processing and fabricating stream caused by solving such processing HDI plates using mechanical system Cheng Chengben improves product output rate, improves exterior quality.Simultaneously as this method do not need milling except fusion position, can also improve because The edges of boards that fusion position milling is removed, are not easy to the operational issue picked and placeed.

It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand, But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this Bright protection.

Claims (2)

1. a kind of edges of boards design method of multiple pressing HDI plates, which is characterized in that include the following steps:

S1, when making internal layer daughter board, the edges of boards of inner- electron plate produce fusion position；

S2, inner- electron plate make internal layer plate hole pattern when, fusion position covered with dry film；

S3, inner- electron plate make inner figure when, fusion position produce fusion position tool figure；

S4, it makes plating hole pattern in outer layer and when outer graphics, is covered with dry film in the fusion position of outer layer；

S5, when outer layer is etched, etching removal fusion position at copper sheet.

2. the edges of boards design method of multiple pressing HDI plates according to claim 1, it is characterised in that：In step s3, exist Do not produce fusion position tool figure in the fusion position for being placed in outer layer.