CN108319925B - Fingerprint module and have its mobile terminal - Google Patents
Fingerprint module and have its mobile terminal Download PDFInfo
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- CN108319925B CN108319925B CN201810130123.5A CN201810130123A CN108319925B CN 108319925 B CN108319925 B CN 108319925B CN 201810130123 A CN201810130123 A CN 201810130123A CN 108319925 B CN108319925 B CN 108319925B
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- circuit board
- fingerprint module
- decoration
- flexible circuit
- packaging layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a fingerprint module and a mobile terminal with the same, wherein the fingerprint module comprises: the packaging layer is used for packaging the fingerprint identification component, and a first matching part is arranged on the rear wall surface of the packaging layer; and the decoration has an embedded groove, the packaging layer is embedded in the embedded groove, a second matching part is arranged in the embedded groove, and the first matching part and the second matching part are mutually embedded. According to the fingerprint module, the first matching part is arranged on the rear wall surface of the packaging layer, the second matching part which is mutually embedded with the first matching part is arranged in the embedding groove of the decorating part, and when the packaging layer is embedded in the embedding groove and the first matching part and the second matching part are mutually embedded, the thickness of the packaging layer and the decorating part along the front-back direction after being matched can be reduced, so that the thickness of the fingerprint module can be reduced, the ultra-thin design of the whole mobile terminal can be adapted, and the use requirements of users can be met.
Description
The application is divided into cases with application date of '2016, 08 and 16 th month, application number of' 201610678006.3 ', application name of' fingerprint module and mobile terminal with the same
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a fingerprint module and a mobile terminal with the same.
Background
In the related art, mobile terminals such as mobile phones are gradually becoming ultra-thin, but the thickness of the mobile terminals such as mobile phones is difficult to reduce under the condition that the thickness of each part in a fingerprint module of the mobile terminal cannot be reduced.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the invention provides a fingerprint module which has the advantage of small thickness.
The invention further provides a mobile terminal which comprises the fingerprint module.
According to the fingerprint module of the embodiment of the invention, include: the packaging layer is used for packaging the fingerprint identification component, and a first matching part is arranged on the rear wall surface of the packaging layer; and the decoration has an embedded groove, the packaging layer is embedded in the embedded groove, a second matching part is arranged in the embedded groove, and the first matching part and the second matching part are mutually embedded.
According to the fingerprint module, the first matching part is arranged on the rear wall surface of the packaging layer, the second matching part which is mutually embedded with the first matching part is arranged in the embedding groove of the decorating part, and when the packaging layer is embedded in the embedding groove and the first matching part and the second matching part are mutually embedded, the thickness of the packaging layer and the decorating part in the front-back direction after being matched can be reduced, so that the thickness of the fingerprint module can be reduced, the ultra-thin design of the whole mobile terminal can be adapted, and the use requirements of users can be met.
According to some embodiments of the invention, the first mating portion is a protruding portion formed on a rear wall surface of the encapsulation layer, and the second mating portion is a recessed portion formed in the insertion groove, at least a part of the protruding portion being located in the recessed portion.
In some embodiments of the invention, the protrusion is one.
In some embodiments of the present invention, one end of the circuit board assembly of the fingerprint module extends into the concave portion through the decoration, and an end of the circuit board assembly is attached to the free end face of the convex portion.
In some embodiments of the present invention, a ground terminal is disposed on the circuit board assembly, and the decoration is a conductive decoration electrically connected to the ground terminal through the circuit board assembly.
In some embodiments of the present invention, a conductive member is interposed between the circuit board assembly and the inner bottom wall of the recess.
In some embodiments of the present invention, a mounting groove is formed on a bottom wall of the recessed portion, and the conductive member is embedded in the mounting groove.
In some embodiments of the present invention, the conductive member is a conductive foam.
In some embodiments of the invention, the circuit board assembly comprises: one end of the flexible circuit board extends into the concave part, the end part of the flexible circuit board is attached to the free end face of the convex part, and the grounding terminal is arranged on the flexible circuit board; and the reinforcing plate is attached to the flexible circuit board and electrically connected with the flexible circuit board, the reinforcing plate is positioned on one side of the flexible circuit board, which is far away from the packaging layer, and the conductive piece is electrically connected with the reinforcing plate.
The mobile terminal comprises the fingerprint module.
According to the mobile terminal provided by the embodiment of the invention, the thickness of the mobile terminal can be reduced by arranging the fingerprint module, and the ultrathin requirement of the mobile terminal is met.
Drawings
FIG. 1 is a schematic diagram of a fingerprint module according to an embodiment of the present invention;
FIG. 2 is an exploded view of a fingerprint module according to an embodiment of the present invention;
FIG. 3 is an exploded view of a fingerprint module according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a fingerprint module according to an embodiment of the invention.
Reference numerals:
the fingerprint module 100 is provided with a fingerprint module 100,
the thickness of the encapsulation layer 1, the bump 11,
the decoration piece 2, the embedded groove 21, the depressed part 22, the via hole 23, the mounting groove 24, the sealing groove 25,
the circuit board assembly 3, the flexible circuit board 31, the reinforcing plate 32,
conductive piece 4, cover plate 5, fingerprint clamp plate 6, sealing member 7.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "lateral," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The fingerprint module 100 according to an embodiment of the present invention is described below with reference to fig. 1-4.
As shown in fig. 1 to 4, a fingerprint module 100 according to an embodiment of the present invention includes an encapsulation layer 1 and a decoration 2.
Specifically, the packaging layer 1 is used for packaging the fingerprint identification component, the rear wall surface (the rear side shown in fig. 4) of the packaging layer 1 is provided with a first matching portion (a protruding portion 11 as described below), the decoration 2 is provided with an embedded groove 21, the packaging layer 1 is embedded in the embedded groove 21, a second matching portion (a recessed portion 22 as described below) is arranged in the embedded groove 21, and the first matching portion and the second matching portion are mutually embedded. From this, when encapsulation layer 1 inlays and establishes in embedded groove 21, and first cooperation portion and second cooperation portion when inlaying each other, can reduce the thickness of encapsulation layer 1 and decoration 2 cooperation back along fore-and-aft direction (the fore-and-aft direction as shown in fig. 4) to can reduce fingerprint module 100's thickness, and then can adapt to the ultra-thin design of mobile terminal complete machine, satisfy user's user demand.
According to the fingerprint module 100 provided by the embodiment of the invention, the first matching part is arranged on the rear wall surface of the packaging layer 1, the second matching part which is mutually embedded with the first matching part is arranged in the embedding groove 21 of the decorating part 2, and when the packaging layer 1 is embedded in the embedding groove 21 and the first matching part and the second matching part are mutually embedded, the thickness of the packaging layer 1 and the decorating part 2 along the front-back direction after being matched can be reduced, so that the thickness of the fingerprint module 100 can be reduced, the ultra-thin design of the whole mobile terminal can be adapted, and the use requirements of users can be met.
In some embodiments of the present invention, as shown in fig. 2 to 4, the first mating portion is a protruding portion 11 formed on the rear wall surface (rear surface as shown in fig. 4) of the encapsulation layer 1, and the second mating portion is a recessed portion 22 formed in the insertion groove 21, at least a part of the protruding portion 11 being located in the recessed portion 22. From this, when assembling encapsulation layer 1 and decoration 2, with the at least part embedding of bellying 11 to depressed part 22 in, can reduce decoration 2 and encapsulation layer 1 assembly back along the thickness of fore-and-aft direction to can reduce fingerprint module 100's thickness, and then can adapt to the ultra-thin design of mobile terminal complete machine, satisfy user's user demand.
For example, in the example shown in fig. 3 and 4, the rear wall surface of the packaging layer 1 has a first engagement portion formed as a protrusion 11, the garnish 2 has a fitting groove 21, the packaging layer 1 is disposed in the fitting groove 21, the bottom wall of the fitting groove 21 is provided with a second engagement portion formed as a recess 22, the protrusion 11 is located in the recess 22, the side wall surface of the protrusion 11 and the rear wall surface of the packaging layer 1 form a first step surface, the bottom wall of the fitting groove 21 and the side wall of the recess 22 form a second step surface, and the first step surface and the second step surface are engaged with each other, so that displacement of the packaging layer 1 in the backward direction can be limited, thereby ensuring reliability of operation of the fingerprint module 100. And when the thickness of the protruding part 11 in the front-back direction is a, the overall thickness of the fingerprint module 100 can be reduced by a.
Specifically, as shown in fig. 3, the boss 11 is one. Therefore, the structure and the processing technology of the packaging layer 1 can be simplified, the production period is saved, and the production cost is reduced. For example, in the example shown in fig. 3, the rear wall surface of the encapsulation layer 1 is provided with the protruding portion 11, and the protruding portion 11 is one and is located at the central portion of the encapsulation layer 1, when the encapsulation layer 1 is processed, the encapsulation layer 1 with the uniform thickness may be processed first, and then a circle of steps may be processed on the rear wall surface of the encapsulation layer 1 along the circumferential direction thereof.
In some embodiments of the present invention, as shown in fig. 4, one end of the circuit board assembly 3 of the fingerprint module 100 extends into the concave portion 22 through the decoration 2, and the end of the circuit board assembly 3 is attached to the free end surface of the convex portion 11 (e.g., the back end surface of the convex portion 11 shown in fig. 4). For example, in the example shown in fig. 2-4, a through hole 23 is provided on the bottom wall of the recessed portion 22, one end of the circuit board assembly 3 passes through the through hole 23 on the decoration 2 and extends into the recessed portion 22, and the circuit board assembly 3 extending into the recessed portion 22 is attached to the free end surface of the protruding portion 11. When circuit board assembly 3 pastes and establishes on the free end face of bellying 11, bellying 11 can play certain guard action to circuit board assembly 3 on the one hand, can prevent that the impurity in the air from causing the electrical property to descend to the corruption of circuit, and on the other hand can also guarantee the zonulae occludens of fingerprint identification subassembly and circuit board assembly 3 in the encapsulated layer 1, guarantees the reliability of fingerprint module 100 work.
Optionally, a ground terminal is disposed on the circuit board assembly 3, the decoration 2 is a conductive decoration 2, and the decoration 2 is electrically connected to the ground terminal through the circuit board assembly 3. Therefore, the decorating part 2 can realize the purpose of grounding through the grounding terminal on the circuit board assembly 3, and the bad influence of the static electricity of the decorating part 2 on the fingerprint module 100 is prevented. In addition, static electricity may be generated in the process of the decoration 2 touching or rubbing an external object, and the static electricity in the decoration 2 may adversely affect the fingerprint module 100.
Further, as shown in fig. 2 to 4, a conductive member 4 is interposed between the circuit board assembly 3 and the inner bottom wall of the recess 22. Therefore, the circuit board assembly 3 and the decoration 2 can be indirectly electrically connected through the conductive piece 4, and the structural arrangement between the circuit board assembly 3 and the decoration 2 can be more reasonable.
Further, as shown in fig. 2 and 4, a mounting groove 24 is formed on the bottom wall of the recess 22, and the conductive member 4 is embedded in the mounting groove 24. The mounting groove 24 serves to limit the conductive member 4 and prevent the conductive member 4 from moving on the bottom wall of the recess 22, so that the reliability of the connection between the conductive member 4 and the inner bottom wall of the recess 22 and the connection between the conductive member 4 and the circuit board assembly 3 can be ensured.
Specifically, the conductive member 4 may be conductive foam. The conductive foam is formed by wrapping conductive cloth on flame-retardant sponge, has good surface conductivity after a series of treatments, and can be easily fixed on a device to be shielded by an adhesive tape. The conductive foam has low cost and simple processing technology, and can ensure the reliability of grounding. After circuit board components 3 and decoration 2 assembled, the cotton certain compression volume that has of electrically conductive bubble that lies in between circuit board components 3 and the decoration 2, can guarantee that the reliability between electrically conductive bubble is cotton and the decoration 2 and between electrically conductive bubble and the circuit board components 3 is connected to guarantee the good ground connection of decoration 2, prevent that decoration 2 static from producing harmful effects to fingerprint module 100.
In some embodiments of the present invention, as shown in fig. 2-4, the circuit board assembly 3 includes a flexible circuit board 31 and a stiffener 32. One end of the flexible circuit board 31 extends into the concave portion 22, and an end portion of the flexible circuit board 31 is attached to a free end surface of the convex portion 11 (e.g., a rear end surface of the convex portion 11 shown in fig. 4). On the one hand, the convex part 11 can play certain guard action to flexible circuit board 31, prevents that the impurity in the air from causing the electrical performance to descend to the corruption of circuit, and on the other hand can also guarantee the zonulae occludens of fingerprint identification subassembly and flexible circuit board 31 in the encapsulated layer 1, guarantees the reliability of fingerprint module 100 work. The ground terminal is disposed on the flexible circuit board 31, the reinforcing plate 32 is attached to the flexible circuit board 31 and electrically connected to the flexible circuit board 31, the reinforcing plate 32 is located on a side (rear side as shown in fig. 4) of the flexible circuit board 31 away from the package layer 1, and the conductive member 4 is electrically connected to the reinforcing plate 32 (i.e., the reinforcing plate 32 is a conductive member). The stiffening plate 32 can strengthen the structural strength of the flexible circuit board 31, prevent the flexible circuit board 31 from bending and the like, thereby ensuring the reliability of the work of the flexible circuit board 31, meanwhile, the stiffening plate 32 can be electrically connected with the flexible circuit board 31, and the conductive piece 4 is electrically connected with the stiffening plate 32 to realize the electric connection of the decoration 2 and the flexible circuit board 31. Thereby can realize that decoration 2 passes through the electric connection of flexible circuit board 31 with ground terminal, and then avoid decoration 2 static to the harmful effects of fingerprint module 100.
In some embodiments of the invention, as shown in figure 4, the peripheral wall of the decorative element 2 is provided with a sealing element 7. When the fingerprint module 100 is installed on a mobile terminal such as a mobile phone, sweat or other liquid on the hand can be prevented from invading the inside of the mobile terminal to damage parts inside the mobile terminal, so that the working reliability of the mobile terminal is ensured.
Further, as shown in fig. 4, a sealing groove 25 is provided on the outer peripheral wall of the garnish 2, and the sealing member 7 is fitted in the sealing groove 25. It is thereby possible to prevent the seal member 7 from rattling in the axial direction of the garnish 2 (the front-rear direction shown in fig. 4), ensuring the reliability of the sealing.
In some embodiments of the present invention, as shown in fig. 2-4, the fingerprint module 100 further includes a cover plate 5, and the cover plate 5 is disposed in the embedded groove 21 and located at the front side (the front side shown in fig. 4) of the packaging layer 1. On the one hand, the cover plate 5 can further protect the fingerprint identification assembly and the circuit board assembly 3, and on the other hand, the cover plate 5 can also increase the attractiveness of the fingerprint module 100.
Optionally, the cover plate 5 may be a glass cover plate 5 or a ceramic cover plate 5, and the glossiness of the glass cover plate 5 or the ceramic cover plate 5 is high, so that the aesthetic property of the fingerprint module 100 may be improved.
The following description of the fingerprint module 100 according to one embodiment of the present invention is provided with reference to fig. 1-4, and the following description is only exemplary and is intended to illustrate the present invention, but not to be construed as limiting the present invention.
As shown in fig. 1 to 4, the fingerprint module 100 according to an embodiment of the present invention includes a package layer 1, a decoration 2, a circuit board assembly 3, and a cover plate 5.
Specifically, as shown in fig. 3 and 4, the packaging layer 1 is used for packaging a fingerprint identification component, a first matching portion is arranged on the rear wall surface of the packaging layer 1, the first matching portion is a protruding portion 11 formed on the rear wall surface of the packaging layer 1, the protruding portion 11 is one and located in the middle of the packaging layer 1, when the protruding portion 11 is processed, a circle of steps can be processed along the circumferential direction of the packaging layer 1, and the packaging layer 1 and the side wall surfaces of the rear wall surface and the protruding portion 11 form a first step surface. As shown in fig. 2 and 4, the decoration 2 has an insertion groove 21, the encapsulation layer 1 is provided in the insertion groove 21, a second engagement portion is provided in the insertion groove 21, the second engagement portion is a recessed portion 22 formed in the insertion groove 21, and the protrusion portion 11 is located in the recessed portion 22. The bottom wall of the fitting groove 21 and the side wall of the recessed portion 22 form a second step surface, and the first step surface and the second step surface are engaged. After the decoration 2 and the packaging layer 1 are assembled, the thickness of the decoration 2 and the packaging layer 1 in the front-back direction can be reduced, so that the thickness of the fingerprint module 100 is reduced, and the requirement of the whole machine ultra-thin of the mobile terminal can be met.
Note that, when the thickness of the boss 11 in the front-rear direction is a, the thickness of the garnish 2 assembled with the potting layer 1 in the front-rear direction can be reduced by a. For example, when the thickness of the boss 11 in the front-rear direction is 0.2mm, the thickness of the garnish 2 after being assembled with the encapsulation layer 1 can be reduced by 0.2mm in the front-rear direction.
As shown in fig. 2 to 4, the circuit board assembly 3 includes a flexible circuit board 31 and a reinforcing plate 32, a through hole 23 is provided on the bottom wall of the recessed portion 22 of the decoration 2, one end of the flexible circuit board 31 passes through the through hole 23 and extends into the recessed portion 22, and the end of the flexible circuit board 31 extending into the recessed portion 22 is attached to the free end surface of the protruding portion 11 (i.e., the rear wall surface of the protruding portion 11). On the one hand, encapsulation layer 1 can play the effect of protection to flexible circuit board 31, can prevent that impurity in the air from causing the electrical performance to descend to the corruption of circuit, and on the other hand can also guarantee the zonulae occludens of fingerprint identification subassembly and flexible circuit board 31 in the encapsulation layer 1, guarantees the reliability of fingerprint module 100 work. The reinforcing plate 32 may be a reinforcing steel plate, and the reinforcing plate 32 is attached to one side of the flexible circuit board 31 away from the encapsulation layer 1 and electrically connected to the flexible circuit board 31, that is, the reinforcing plate 32 is attached to the rear side wall of the flexible circuit board 31. The reinforcing plate 32 can reinforce the structural strength of the flexible circuit board 31 and prevent the flexible circuit board 31 from being bent and damaged.
In addition, as shown in fig. 2-4, the decoration 2 is a conductive metal part, the other end (the end not extending into the recess 22) of the flexible circuit board 31 is provided with a grounding terminal, a conductive member 4 is arranged between the reinforcing plate 32 and the inner bottom wall of the recess 22, and the decoration 2 is electrically connected to the grounding terminal through the conductive member 4, the reinforcing plate 32 and the flexible circuit board 31, so that the purpose of grounding the decoration 2 is achieved, and the bad influence of static electricity of the decoration 2 on the fingerprint module 100 is prevented. Wherein, it is cotton that electrically conductive 4 is electrically conductive bubble, and the shape of the cotton cross section of electrically conductive bubble is the rectangle, is equipped with the cross section on the diapire of depressed part 22 and is rectangular mounting groove 24, and electrically conductive bubble is cotton to be inlayed and to be established in mounting groove 24, from this, can prevent that electrically conductive bubble is cotton to remove to guarantee the reliability of electricity connection between decoration 2 and the flexible circuit board 31.
As shown in fig. 4, the cover plate 5 is a glass cover plate 5, the cover plate 5 is disposed in the embedded groove 21 and located at the front side of the encapsulation layer 1, and the cover plate 5 can close the front side opening of the embedded groove 21. The cover plate 5 not only can further protect the circuit board assembly 3, but also can increase the aesthetic property of the fingerprint module 100.
As shown in fig. 4, the sealing member 7 is sleeved on the outer peripheral wall of the decoration 2, and the sealing member 7 is embedded in the sealing groove 25 on the outer peripheral wall of the decoration 2, so that when the fingerprint module 100 is mounted on a mobile terminal such as a mobile phone, sweat or other liquid on the hand can be prevented from invading the mobile terminal to damage parts inside the mobile terminal, and the working reliability of the mobile terminal is ensured.
As shown in fig. 2-4, the fingerprint module 100 further includes a fingerprint pressing plate 6, and the fingerprint pressing plate 6 is disposed at the rear side of the decoration 2.
In the process of processing the fingerprint module 100, the cover plate 5, the packaging layer 1, the flexible circuit board 31 and the reinforcing plate 32 can be processed together, then the conductive foam is pasted in the mounting groove 24 of the decoration 2, and the processed cover plate 5, the packaging layer 1, the flexible circuit board 31 and the reinforcing plate 32 are assembled together with the processed decoration 2 through peripheral circle of dispensing and pressure maintaining. Meanwhile, through dispensing assembly, the conductive foam between the reinforcing plate 32 and the decorating part 2 passes through a certain compression amount, and after dispensing and pressure maintaining for a certain time, good grounding between the reinforcing plate and the decorating part is ensured after glue is cured.
According to the fingerprint module 100 of the embodiment of the invention, the protruding part 11 is formed by processing a circle of steps on the rear wall surface of the packaging layer 1, and the protruding part 11 and the concave part 22 of the decoration 2 are used for dispensing and fixing, so that the thickness of the packaging layer 1 and the decoration 2 in the front-back direction after assembly can be reduced, and the thickness of the fingerprint module 100 is reduced.
The mobile terminal according to the embodiment of the present invention includes the fingerprint module 100.
According to the mobile terminal provided by the embodiment of the invention, the thickness of the mobile terminal can be reduced by arranging the fingerprint module 100, and the ultra-thin requirement of the mobile terminal is met.
In some embodiments of the present invention, the mobile terminal may be a mobile phone, a tablet computer, a notebook computer, or the like, and when the fingerprint module 100 is used in the mobile phone, the tablet computer, the notebook computer, or the like, the thickness of the mobile terminal may be reduced to meet the requirement of ultra-thinness.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (7)
1. The utility model provides a fingerprint module which characterized in that includes:
the packaging layer is used for packaging the fingerprint identification component, a first matching part is arranged on the rear wall surface of the packaging layer, and the first matching part is a protruding part formed on the rear wall surface of the packaging layer; and
the decoration, the decoration has the embedded groove, the encapsulation layer inlays to be established in the embedded groove, be equipped with second cooperation portion in the embedded groove, first cooperation portion with second cooperation portion gomphosis each other, second cooperation portion is for forming depressed part in the embedded groove, at least part the bellying is located in the depressed part, the cover is equipped with the sealing member on the periphery wall of decoration, the one end of the circuit board subassembly of fingerprint module is passed the decoration stretch into extremely in the depressed part, circuit board subassembly's tip is pasted and is established on the free end terminal surface of bellying, be equipped with ground terminal on the circuit board subassembly, the decoration is electrically conductive decoration, the decoration passes through circuit board subassembly with ground terminal electricity is connected.
2. The fingerprint module of claim 1, wherein the protrusion is one.
3. The fingerprint module of claim 1, wherein a conductive member is sandwiched between the circuit board assembly and the inner bottom wall of the recess.
4. The fingerprint module of claim 3, wherein a mounting groove is formed on a bottom wall of the recess, and the conductive member is embedded in the mounting groove.
5. The fingerprint module of claim 3, wherein the conductive member is a conductive foam.
6. The fingerprint module of claim 3, wherein the circuit board assembly comprises:
one end of the flexible circuit board extends into the concave part, the end part of the flexible circuit board is attached to the free end face of the convex part, and the grounding terminal is arranged on the flexible circuit board; and
the reinforcing plate is attached to the flexible circuit board and electrically connected with the flexible circuit board, the reinforcing plate is located on one side of the flexible circuit board, away from the packaging layer, and the conductive piece is electrically connected with the reinforcing plate.
7. A mobile terminal, characterized in that it comprises a fingerprint module according to any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810130123.5A CN108319925B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and have its mobile terminal |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810130123.5A CN108319925B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and have its mobile terminal |
| CN201610678006.3A CN106203404B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and there is its mobile terminal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610678006.3A Division CN106203404B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and there is its mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108319925A CN108319925A (en) | 2018-07-24 |
| CN108319925B true CN108319925B (en) | 2022-03-22 |
Family
ID=57522717
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810130123.5A Active CN108319925B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and have its mobile terminal |
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| WO2018032870A1 (en) | 2016-08-16 | 2018-02-22 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal having same |
| EP3457316B1 (en) | 2016-08-16 | 2023-08-02 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module and mobile terminal having same |
| CN106803079B (en) * | 2017-01-20 | 2020-08-21 | Oppo广东移动通信有限公司 | Fingerprint module and mobile terminal |
| CN106897712B (en) * | 2017-03-13 | 2020-01-14 | Oppo广东移动通信有限公司 | Fingerprint module, display screen and mobile terminal |
| CN107133582B (en) * | 2017-04-27 | 2020-01-14 | 维沃移动通信有限公司 | Installation structure and installation method of fingerprint module and electronic equipment |
| CN109063585B (en) * | 2018-07-11 | 2024-06-07 | 南昌黑鲨科技有限公司 | Fingerprint module and electronic equipment |
| CN110210388B (en) * | 2019-05-31 | 2021-03-09 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
| CN113971820A (en) * | 2021-09-17 | 2022-01-25 | 惠州Tcl移动通信有限公司 | Fingerprint module and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2016076617A (en) * | 2014-10-07 | 2016-05-12 | 新光電気工業株式会社 | Semiconductor device for fingerprint recognition, manufacturing method of semiconductor device for fingerprint recognition, and semiconductor device |
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| CN104751130A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN204650546U (en) * | 2015-06-03 | 2015-09-16 | 江西合力泰科技有限公司 | A kind of fingerprint recognition module |
| CN105242803B (en) * | 2015-09-07 | 2018-09-14 | 深圳市财富之舟科技有限公司 | The installation method and a kind of mobile terminal of a kind of touch chip |
| CN105373778B (en) * | 2015-11-02 | 2019-05-24 | 魅族科技（中国）有限公司 | A kind of fingerprint mould group and terminal |
| CN105825165B (en) * | 2015-11-20 | 2019-02-15 | 维沃移动通信有限公司 | A kind of fingerprint recognition mould group, terminal device and assembly method |
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN206178867U (en) * | 2016-08-16 | 2017-05-17 | 广东欧珀移动通信有限公司 | Fingerprint module and have its mobile terminal |
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| JP2016076617A (en) * | 2014-10-07 | 2016-05-12 | 新光電気工業株式会社 | Semiconductor device for fingerprint recognition, manufacturing method of semiconductor device for fingerprint recognition, and semiconductor device |
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| CN106203404A (en) | 2016-12-07 |
| CN108319925A (en) | 2018-07-24 |
| CN106203404B (en) | 2018-03-16 |
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