CN220672867U - Grounding connection structure and electronic equipment - Google Patents
Grounding connection structure and electronic equipment Download PDFInfo
- Publication number
- CN220672867U CN220672867U CN202322322071.0U CN202322322071U CN220672867U CN 220672867 U CN220672867 U CN 220672867U CN 202322322071 U CN202322322071 U CN 202322322071U CN 220672867 U CN220672867 U CN 220672867U
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- Prior art keywords
- conductive
- connector
- conductive cloth
- foam
- conductive foam
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- 239000004744 fabric Substances 0.000 claims abstract description 73
- 239000006260 foam Substances 0.000 claims abstract description 64
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 26
- 229910052742 iron Inorganic materials 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a grounding connection structure, which comprises a first connector and a second connector which are mutually overlapped; the first connector comprises first conductive foam and first conductive cloth wrapped outside the first conductive foam, and the second connector comprises second conductive foam and second conductive cloth wrapped outside the second conductive foam; the first connecting body and the second connecting body are separated from each other to form a connecting gap, the side surfaces of the first connecting body and the second connecting body, which are positioned in the connecting gap, are respectively provided with a back adhesive layer, the connecting gap is used for connecting a shell of the electronic equipment, so that the first conductive cloth and the second conductive cloth are directly contacted with two materials of the electronic equipment, which are required to be grounded, conductive adhesive in the prior art is omitted, the grounding impedance is smaller, the grounding is more stable, the heights of the first conductive foam and the second conductive foam are small, the pressed diffusion volume of the first conductive foam and the second conductive foam is small, the space utilization rate of the main board is improved, and meanwhile, the assembly cost of the grounding connecting structure is reduced. The utility model also discloses an electronic device with the grounding connection structure.
Description
Technical Field
The utility model relates to the technical field of radio frequency grounding of electronic equipment, in particular to a grounding connection structure with stable grounding effect and low assembly cost and electronic equipment.
Background
Referring to fig. 1, a conventional grounding connector 1 for realizing rf grounding of electronic equipment is obtained by wrapping foam 11 with conductive cloth 12 to form a rectangular parallelepiped, and then attaching conductive adhesive 13 to the side of the rectangular parallelepiped. After the screen is assembled in EMS (Electronics Manufacturing Services) factory, when the whole machine assembly factory is assembled, the grounding connector 1 is assembled on the shell 4, and the grounding connector 1 is adhered between two materials to be grounded by using the conductive adhesive 13, as shown in fig. 1, the grounding connector 1 is adhered on the screen iron frame 3 by using the conductive adhesive 13, so that the grounding of the main board 2 and the screen iron frame 3 is realized.
However, the conventional ground connector 1 has disadvantages in that:
1. the conductive adhesive 13 is conducted by adding metal into the common back adhesive, and has unstable impedance and poor grounding consistency;
2. the distance from the main board 2 to the screen iron frame 3 is large, so that the natural height of foam 11 is large, and the volume of foam which is compressed and diffused to the periphery is large, thereby affecting the utilization rate of main board ornaments;
3. the grounding connector 1 of the scheme can be assembled only in EMS factories, and the assembly cost is high.
Therefore, it is necessary to provide a grounding connection structure and an electronic device capable of improving the grounding effect and the motherboard ornament utilization ratio and reducing the assembly cost, so as to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a grounding connection structure which can improve the grounding effect and the utilization rate of a mainboard ornament and reduce the assembly cost.
Another objective of the present utility model is to provide an electronic device capable of improving grounding effect and motherboard ornament utilization rate and reducing assembly cost.
In order to achieve the above purpose, the technical scheme of the utility model is as follows: providing a grounding connection structure, which comprises a first connector and a second connector; the first connector comprises first conductive foam and first conductive cloth wrapped outside the first conductive foam; the second connector comprises second conductive foam and second conductive cloth wrapped outside the second conductive foam; the first connector and the second connector are mutually overlapped and are spaced to form a connecting gap, and the side surfaces of the first connector and the second connector, which are positioned in the connecting gap, are respectively provided with a back adhesive layer.
Preferably, the heights of the first conductive foam and the second conductive foam are the same or different.
Preferably, one end of the first conductive cloth and one end of the second conductive cloth are connected to close one end of the connection gap.
Preferably, the first conductive cloth and the second conductive cloth are integrated conductive cloth, two ends of the integrated conductive cloth are respectively wrapped with the first conductive foam and the second conductive foam to obtain the first connector and the second connector, and the first connector and the second connector which are mutually overlapped are formed by folding the integrated conductive cloth.
Preferably, the connection gap is used for installing a casing of the electronic device, and is attached to the casing through the back adhesive layer, and the side surface, away from the connection gap, of the first connector and the second connector is directly contacted with a material to be grounded.
Correspondingly, the utility model also provides electronic equipment, which comprises a main board, a screen iron frame, a shell and the grounding connection structure; the grounding connection structure is arranged between the main board and the screen iron frame, the first conductive cloth is in direct contact with the main board and the screen iron frame, and the shell stretches into the connection gap and is attached to the first conductive cloth and the second conductive cloth through the back adhesive layer.
Preferably, a connecting end is convexly arranged on the shell, the thickness of the connecting end is smaller than the height of the connecting gap, and the connecting end stretches into the connecting gap and is attached to the first conductive cloth and the second conductive cloth through the back adhesive layer.
Compared with the prior art, the grounding connection structure has the advantages that firstly, the first conductive foam and the second conductive foam with smaller heights are designed, and then the first conductive cloth and the second conductive cloth are respectively wrapped outside the first conductive foam and the second conductive foam to form the first connector and the second connector, so that the diffusion volume of the first conductive foam and the second conductive foam pressed open during assembly is small, and the space utilization rate of a main board ornament is improved; secondly, the shell of the electronic equipment is installed through the connection gaps of the first connector and the second connector, and the first connector, the second connector and the shell are adhered through the back adhesive layer, so that the first conductive cloth of the first connector and the second conductive cloth of the second connector are directly contacted with two materials of the electronic equipment, which are required to be grounded, and the conductive adhesive in the prior art is omitted, so that the grounding impedance is smaller and the grounding is more stable; furthermore, the grounding connection structure can be directly assembled in a mould factory, and compared with the mode of being assembled only in an EMS factory, the utility model can improve the componentization material yield and reduce the assembly cost; finally, the grounding connection structure reduces the dimensional tolerance through small engineering height design, and realizes high-precision management and control.
Correspondingly, the electronic equipment with the grounding connection structure has the same technical effect.
Drawings
Fig. 1 is a schematic structural view of a prior art ground connector.
Fig. 2 is a schematic structural view of a grounding connection structure of the present utility model.
Fig. 3 is a schematic structural view of the grounding connection structure assembled in an electronic device.
Detailed Description
Embodiments of the present utility model will now be described with reference to the drawings, wherein like reference numerals represent like elements throughout. It should be noted that, the description of the azimuth or the positional relationship indicated by the present utility model, such as up, down, left, right, front, back, etc., is based on the azimuth or the positional relationship shown in the drawings, and is only for convenience in describing the technical solution of the present application and/or simplifying the description, and does not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. First, second, etc. are described solely for distinguishing between technical features and should not be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of technical features indicated.
As shown in fig. 2-3, the grounding connection structure 100 provided by the utility model is mainly suitable for the electronic equipment 1 to realize the grounding of materials, can reduce the contact resistance, ensures that the grounding is stable, and requires a small space. Of course, the use of the ground connection structure 100 is not limited to the electronic device 1, and similar components requiring grounding in other devices may be used.
With continued reference to fig. 2-3, the grounding connection structure 100 provided by the present utility model includes a first connection body 110 and a second connection body 120. The first connector 110 includes a first conductive foam 111 and a first conductive fabric 112 wrapped outside the first conductive foam 111; the second connector 120 includes a second conductive foam 121 and a second conductive cloth 122 wrapped outside the second conductive foam 121. Moreover, the first connector 110 and the second connector 120 are stacked with each other and are spaced apart from each other to form a connection gap 130, the side surfaces of the first connector 110 and the second connector 120 located in the connection gap 130 are respectively provided with a back adhesive layer 140, the connection gap 130 is used for mounting a housing 400 (see fig. 3) of the electronic device, and the housing 400 is attached to the first connector 110 and the second connector 120 through the back adhesive layers 140, so as to implement the mounting of the grounding connection structure 100.
As further shown in fig. 2 to 3, in the present utility model, the heights of the first conductive foam 111 and the second conductive foam 121 may be the same or different, which is not particularly limited herein. In one embodiment of the present utility model, the heights of the first conductive foam 111 and the second conductive foam 121 are the same, and the thicknesses of the first conductive cloth 112 and the second conductive cloth 122 are the same, so that the thicknesses of the resulting first connection body 110 and second connection body 120 are the same. Of course, the structure is not limited to this, the heights of the first conductive foam 111 and the second conductive foam 121 may be set according to the use requirement, and the thicknesses of the first conductive cloth 112 and the second conductive cloth 122 may be selected respectively.
With continued reference to fig. 2, in this embodiment, one end of the first conductive foam 111 forms an arc structure, and the shape of the other end is not particularly limited. When the first conductive cloth 112 is included outside the first conductive foam 111, the first conductive cloth 112 is completely wrapped around the arc end 111a of the first conductive foam 111, so that one end of the first connector 110 integrally forms the arc end 110a, while the other end of the first conductive foam 111 far away from the arc end 111a is a structure of incomplete wrapping, where the first conductive cloth 112 may be completely wrapped or may be incompletely wrapped, as shown in fig. 2.
Correspondingly, one end of the second conductive foam 121 forms an arc structure, and the shape of the other end is not particularly limited. When the second conductive cloth 122 is included outside the second conductive foam 121, the second conductive cloth 122 is completely wrapped around the arc end 121a of the second conductive foam 121, so that one end of the second connector 120 integrally forms the arc end 120a, while the other end of the second conductive foam 121 far away from the arc end 121a is the structure of incomplete wrapping, and the second conductive cloth 122 may be completely wrapped or may be incompletely wrapped, as shown in fig. 2.
With continued reference to fig. 2-3, when the first connector 110 and the second connector 120 are stacked on each other, the arcuate ends 110a of the first connector 110 and the arcuate ends 1210a of the second connector 120 are vertically opposite to each other. Then, the first conductive cloth 112 and the second conductive cloth 122 are connected at the ends far from the arc ends 110a and 120a through the connecting portion 150, so that the connecting portion 150 closes one end of the connecting gap 130, an opening is formed at a position of the connecting gap 130 corresponding to the arc ends 110a and 120a, and the housing 400 is inserted into the connecting gap 130 through the opening. It will be appreciated that it is also possible to connect the first conductive cloth 112 and the second conductive cloth 122 of the arc-shaped ends 110a and 120a of the first connector 110 and the second connector 120, and to form an opening at an end far from the arc-shaped ends 110a and 120a, which does not affect the functions of the first connector 110 and the second connector 120.
Referring to fig. 2, in one embodiment of the present utility model, the first conductive cloth 112 and the second conductive cloth 122 are integrated conductive cloths, that is, the first conductive cloth 112 and the second conductive cloth 122 are actually one piece of conductive cloth. The two ends of the integrated conductive cloth are respectively wrapped with the first conductive foam 111 and the second conductive foam 121 to obtain a first connector 110 and a second connector 120, and then the first connector 110 and the second connector 120 are stacked by folding the integrated conductive cloth.
With continued reference to fig. 2-3, after the grounding connection structure 100 is mounted on the electronic device 1, the housing 400 of the electronic device 1 is inserted into the connection gap 130 between the first connection body 110 and the second connection body 120, and is attached to the housing 400 by the adhesive back layer 140, and the sides of the first connection body 110 and the second connection body 120 away from the connection gap 130 directly contact the material to be grounded, that is, the material to be grounded directly contacts the first conductive cloth 112 and the second conductive cloth 122 without conductive adhesive, so that the grounding impedance is smaller and the grounding is more stable. In addition, in the case that the space between two materials to be grounded of the electronic device is fixed, the grounding connection structure 100 of the present utility model is provided with two first conductive foam 111 and second conductive foam 121 with smaller heights, and compared with the structure in the prior art (see fig. 1) provided with conductive foam with a height corresponding to the space between the two materials, the diffusion volume of the first conductive foam 111 and the second conductive foam 121 after being pressed apart is small, so that the space utilization rate of the motherboard ornament can be improved.
With continued reference to fig. 2-3, the present utility model further provides an electronic device 1, which includes a motherboard 200, a screen bezel 300, a housing 400, and the ground connection structure 100 as described above. The main board 200 and the screen iron frame 300 are disposed opposite to each other and connected to two sides of the housing 400, and the structure and the connection manner of the main board 200, the screen iron frame 300 and the housing 400 are conventional in the art, and will not be described in detail.
In the present utility model, the grounding connection structure 100 is disposed between the motherboard 200 and the screen iron frame 300, and the casing 400 extends into the connection gap 130 and is attached to the first conductive cloth 112 and the second conductive cloth 122 through the backing adhesive layer 140; and the first conductive cloth 112 directly contacts the main board 200, the second conductive cloth 122 directly contacts the screen iron frame 300, and the conductive cloth directly contacts the main board 200 and the screen iron frame 300 without conductive glue, so that the grounding impedance is smaller and the grounding is more stable.
More specifically, the housing 400 is provided with a connecting end 410 protruding upward, and the thickness of the connecting end 410 is smaller than the height of the connecting gap 130, so that a layer of adhesive backing layer 140 can be disposed on the first conductive cloth 112 and the second conductive cloth 122 in the connecting gap 130 to attach to the connecting end 410.
In summary, in the grounding connection structure 100 of the present utility model, first, the first conductive foam 111 and the second conductive foam 121 with smaller heights are designed, and then the first conductive cloth 112 and the second conductive cloth 122 are respectively wrapped outside the first conductive foam 111 and the second conductive foam 121 to form the first connector 110 and the second connector 120, so that the diffusion volume of the first conductive foam 111 and the second conductive foam 121 pressed open during assembly is small, thereby improving the space utilization of the motherboard ornament; secondly, the shell 400 of the electronic device 1 is mounted through the connection gaps 130 of the first connector 110 and the second connector 120, and the first connector 110, the second connector 120 and the shell 400 are bonded through the back adhesive layer 140, so that the first conductive cloth 112 of the first connector 110 and the second conductive cloth 122 of the second connector 120 directly contact two materials of the electronic device 1, which need to be grounded, and the conductive adhesive in the prior art is omitted, so that the grounding impedance is smaller and the grounding is more stable; furthermore, the grounding connection structure 100 can be directly assembled in a mold factory, and compared with the mode of only being assembled in an EMS factory, the utility model can improve the componentization material yield and reduce the assembly cost; finally, the grounding connection structure 100 of the present utility model reduces the dimensional tolerance through a small engineering design, and realizes high-precision management and control.
Correspondingly, the electronic device 1 with the grounding connection structure 100 has the same technical effects.
The structure of the other parts of the electronic device 1 according to the present utility model is a conventional arrangement well known to those skilled in the art, and will not be described in detail here.
The foregoing description of the preferred embodiments of the present utility model is not intended to limit the scope of the claims, which follow, as defined in the claims.
Claims (7)
1. A ground connection structure, characterized by comprising:
the first connector comprises first conductive foam and first conductive cloth wrapped outside the first conductive foam;
the second connector comprises second conductive foam and second conductive cloth wrapped outside the second conductive foam;
the first connector and the second connector are mutually overlapped and are spaced to form a connecting gap, and the side surfaces of the first connector and the second connector, which are positioned in the connecting gap, are respectively provided with a back adhesive layer.
2. The ground connection structure of claim 1, wherein the first conductive foam and the second conductive foam are the same or different in height.
3. The ground connection structure of claim 1, wherein one end of the first conductive cloth and one end of the second conductive cloth are connected to close one end of the connection gap.
4. The ground connection structure according to any one of claims 1 to 3, wherein the first conductive cloth and the second conductive cloth are integrated conductive cloth, and both ends of the integrated conductive cloth are respectively wrapped with the first conductive foam and the second conductive foam to obtain the first connector and the second connector, and the first connector and the second connector are stacked with each other by folding the integrated conductive cloth.
5. A grounding connection structure according to any one of claims 1 to 3, wherein the connection gap is used for mounting a housing of an electronic device, and is attached to the housing through the back adhesive layer, and sides of the first connector and the second connector, which are far away from the connection gap, are in direct contact with a material to be grounded.
6. The utility model provides an electronic equipment, includes mainboard, screen chase and casing, its characterized in that still includes:
the ground connection structure of any one of claims 1-5; the grounding connection structure is arranged between the main board and the screen iron frame, the first conductive cloth is in direct contact with the main board and the screen iron frame, and the shell stretches into the connection gap and is attached to the first conductive cloth and the second conductive cloth through the back adhesive layer.
7. The electronic device of claim 6, wherein a connection end is provided protruding from the housing, the connection end has a thickness smaller than a height of the connection gap, and the connection end extends into the connection gap and is attached to the first conductive cloth and the second conductive cloth through the backing layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322322071.0U CN220672867U (en) | 2023-08-28 | 2023-08-28 | Grounding connection structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322322071.0U CN220672867U (en) | 2023-08-28 | 2023-08-28 | Grounding connection structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220672867U true CN220672867U (en) | 2024-03-26 |
Family
ID=90330861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322322071.0U Active CN220672867U (en) | 2023-08-28 | 2023-08-28 | Grounding connection structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220672867U (en) |
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2023
- 2023-08-28 CN CN202322322071.0U patent/CN220672867U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |