CN108319925A - Fingerprint module and mobile terminal with it - Google Patents
Fingerprint module and mobile terminal with it Download PDFInfo
- Publication number
- CN108319925A CN108319925A CN201810130123.5A CN201810130123A CN108319925A CN 108319925 A CN108319925 A CN 108319925A CN 201810130123 A CN201810130123 A CN 201810130123A CN 108319925 A CN108319925 A CN 108319925A
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- Prior art keywords
- fingerprint module
- decoration
- auxiliary section
- encapsulated layer
- flexible pcb
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a kind of fingerprint module and with its mobile terminal, wherein fingerprint module includes：Encapsulated layer for encapsulating fingerprint recognition component has the first auxiliary section on the rear surface of encapsulated layer；And there is embedded groove, encapsulated layer to be embedded in embedded groove for decoration, decoration, the second auxiliary section is equipped in embedded groove, the first auxiliary section and the second auxiliary section are fitted into each other.Fingerprint module according to the present invention, by the way that the first auxiliary section is arranged on the rear surface of encapsulated layer, setting and the first auxiliary section chimeric the second auxiliary section each other in the embedded groove of decoration, when encapsulated layer is embedded in embedded groove, and first auxiliary section and the second auxiliary section when being fitted into each other, thickness along the longitudinal direction after encapsulated layer and ornamental piece can be reduced, so as to reduce the thickness of fingerprint module, and then it is adapted to the ultra-thin design of mobile terminal complete machine, meet the use demand of user.
Description
The application be the applying date be " on 08 16th, 2016 ", application No. is " 201610678006.3 ", application it is entitled
The division of " fingerprint module and the mobile terminal with it "
Technical field
The present invention relates to technical field of electronic equipment, more particularly, to a kind of fingerprint module and with its mobile terminal.
Background technology
In the related technology, the mobile terminals such as mobile phone gradually develop to ultrathin, still, each in the fingerprint module of mobile terminal
For the thickness of component in the case where that can not be thinned, the thickness of the mobile terminals such as mobile phone is difficult to reduce.
Invention content
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, the present invention carries
Go out a kind of fingerprint module, the fingerprint module has the advantages that thickness is small.
The present invention also proposes that a kind of mobile terminal, the mobile terminal include above-mentioned fingerprint module.
Fingerprint module according to the ... of the embodiment of the present invention, including：Encapsulated layer for encapsulating fingerprint recognition component, the encapsulation
There is the first auxiliary section on the rear surface of layer；And there is embedded groove, the encapsulated layer to be embedded described for decoration, the decoration
In embedded groove, the second auxiliary section is equipped in the embedded groove, first auxiliary section and second auxiliary section are fitted into each other.
Fingerprint module according to the ... of the embodiment of the present invention is being filled by the way that the first auxiliary section is arranged on the rear surface of encapsulated layer
Setting and the first auxiliary section chimeric the second auxiliary section each other in the embedded groove of gadget, when encapsulated layer is embedded in embedded groove, and
When first auxiliary section and the second auxiliary section are fitted into each other, thickness along the longitudinal direction after encapsulated layer and ornamental piece can be reduced
Degree, so as to reduce the thickness of fingerprint module, and then is adapted to the ultra-thin design of mobile terminal complete machine, meets making for user
Use demand.
According to some embodiments of the present invention, first auxiliary section be formed in it is convex on the rear surface of the encapsulated layer
The portion of rising, second auxiliary section is the recessed portion being formed in the embedded groove, and at least partly described boss is in described recessed
In concave portion.
In some embodiments of the invention, the lug boss is one.
In some embodiments of the invention, one end of the circuit board assemblies of the fingerprint module is stretched across the decoration
Enter to the recessed portion, the end of the circuit board assemblies is sticked in the free end end face of the lug boss.
In some embodiments of the invention, the circuit board assemblies are equipped with ground terminal, and the decoration is conduction
Decoration, the decoration are electrically connected by the circuit board assemblies with the ground terminal.
In some embodiments of the invention, it is folded with and leads between the circuit board assemblies and the inner bottom wall of the recessed portion
Electric part.
In some embodiments of the invention, the bottom wall of the recessed portion is equipped with mounting groove, and the conduct piece is embedded
In the mounting groove.
In some embodiments of the invention, the conduct piece is conducting foam.
In some embodiments of the invention, the circuit board assemblies include：Flexible PCB, the flexible PCB
One end stretches in the recessed portion, and the end of the flexible PCB is bonded with the free end end face of the lug boss, institute
Ground terminal is stated to be located on the flexible PCB；And stiffening plate, the stiffening plate be fitted on the flexible PCB and with
The flexible PCB electrical connection, and the stiffening plate is located at the side far from the encapsulated layer of the flexible PCB, institute
Conduct piece is stated to be electrically connected with the stiffening plate.
Mobile terminal according to the ... of the embodiment of the present invention, including above-mentioned fingerprint module.
Mobile terminal according to the ... of the embodiment of the present invention can reduce the thickness of mobile terminal by the way that above-mentioned fingerprint module is arranged
Degree, meets the ultra-thin requirement of mobile terminal.
Description of the drawings
Fig. 1 is the structural schematic diagram of fingerprint module according to the ... of the embodiment of the present invention；
Fig. 2 is the explosive view of fingerprint module according to the ... of the embodiment of the present invention；
Fig. 3 is the explosive view of fingerprint module according to the ... of the embodiment of the present invention；
Fig. 4 is the sectional view of fingerprint module according to the ... of the embodiment of the present invention.
Reference numeral：
Fingerprint module 100,
Encapsulated layer 1, lug boss 11,
Decoration 2, embedded groove 21, recessed portion 22, via 23, mounting groove 24, seal groove 25,
Circuit board assemblies 3, flexible PCB 31, stiffening plate 32,
Conduct piece 4, cover board 5, fingerprint platen 6, sealing element 7.
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings.Below with reference to
The embodiment of attached drawing description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " transverse direction ", " thickness ", "upper", "lower",
The orientation or position of the instructions such as "front", "rear", "left", "right", "top", "bottom", "inner", "outside", " axial direction ", " radial direction ", " circumferential direction "
It is to be based on the orientation or positional relationship shown in the drawings to set relationship, is merely for convenience of description of the present invention and simplification of the description, rather than
Indicate or imply that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore cannot
It is interpreted as limitation of the present invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；Can be that machinery connects
It connects, can also be to be electrically connected or can communicate each other；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the interaction relationship of the connection or two elements inside two elements, unless otherwise restricted clearly.For this field
For those of ordinary skill, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
Fingerprint module 100 according to the ... of the embodiment of the present invention is described below with reference to Fig. 1-Fig. 4.
As Figure 1-Figure 4, fingerprint module 100 according to the ... of the embodiment of the present invention, including encapsulated layer 1 and decoration 2.
Specifically, encapsulated layer 1 is for encapsulating fingerprint recognition component, the rear surface (rear side as shown in Figure 4) of encapsulated layer 1
Upper to have the first auxiliary section (lug boss 11 as described below), there is decoration 2 embedded groove 21, encapsulated layer 1 to be embedded in embedded groove
In 21, it is equipped with the second auxiliary section (recessed portion 22 as described below) in embedded groove 21, the first auxiliary section and the second auxiliary section are each other
It is chimeric.As a result, when encapsulated layer 1 is embedded in embedded groove 21, and the first auxiliary section and the second auxiliary section are fitted into each other, it can subtract
The thickness of (front-rear direction as shown in Figure 4) along the longitudinal direction, refers to so as to reduce after small package layer 1 and decoration 2 coordinate
The thickness of line module 100, and then it is adapted to the ultra-thin design of mobile terminal complete machine, meet the use demand of user.
Fingerprint module 100 according to the ... of the embodiment of the present invention, by the way that the first auxiliary section is arranged on the rear surface of encapsulated layer 1,
Setting and the first auxiliary section chimeric the second auxiliary section each other in the embedded groove 21 of decoration 2, when encapsulated layer 1 is embedded in insertion
In slot 21, and when the first auxiliary section and the second auxiliary section are fitted into each other, it can reduce after encapsulated layer 1 and decoration 2 coordinate along preceding
The thickness of rear direction so as to reduce the thickness of fingerprint module 100, and then is adapted to that mobile terminal complete machine is ultra-thin to be set
Meter, meets the use demand of user.
In some embodiments of the invention, as shown in figs 2-4, the first auxiliary section is the rear wall for being formed in encapsulated layer 1
Lug boss 11 on face (rear as shown in Figure 4), the second auxiliary section are the recessed portion 22 being formed in embedded groove 21, at least portion
Lug boss 11 is divided to be located in recessed portion 22.As a result, when assembling encapsulated layer 1 and decoration 2, by at least partly embedding of lug boss 11
Enter to recessed portion 22, thickness along the longitudinal direction after decoration 2 is assembled with encapsulated layer 1 can be reduced, referred to so as to reduce
The thickness of line module 100, and then it is adapted to the ultra-thin design of mobile terminal complete machine, meet the use demand of user.
For example, in Fig. 3 and example shown in Fig. 4, the rear surface of encapsulated layer 1 has the first auxiliary section, the first auxiliary section
Be formed as lug boss 11, there is decoration 2 embedded groove 21, encapsulated layer 1 to be located in embedded groove 21, and the bottom wall of embedded groove 21 is equipped with the
Two auxiliary sections, the second auxiliary section are formed as recessed portion 22, and lug boss 11 is located in recessed portion 22, the side wall surface and envelope of lug boss 11
The rear surface formation First terrace of dress layer 1, the bottom wall of embedded groove 21 and the side wall formation second step face of recessed portion 22, first
Step surface and the engaging of second step face, it is possible thereby to displacement of the encapsulated layer 1 in backward directions be limited, to ensure fingerprint module
The reliability of 100 work.It, can be by the integral thickness of fingerprint module 100 and when the thickness of lug boss 11 along the longitudinal direction is a
Reduce a.
Specifically, as shown in figure 3, lug boss 11 is one.Thus, it is possible to simplify the structure and processing technology of encapsulated layer 1,
The production cycle is saved, production cost is reduced.For example, in the example depicted in fig. 3, the rear surface of encapsulated layer 1 is equipped with lug boss
11, lug boss 11 is one and can first process consistency of thickness when processing encapsulated layer 1 positioned at the centre of encapsulated layer 1
Encapsulated layer 1, then in the rear surface of encapsulated layer 1 along one circle step of its circumferential direction processing.
In some embodiments of the invention, as shown in figure 4, one end of the circuit board assemblies 3 of fingerprint module 100 passes through dress
Gadget 2 stretches in recessed portion 22, and the ends of circuit board assemblies 3 free end end face in lug boss 11 that is sticked is (as shown in Figure 4
The rear end face of lug boss 11) on.For example, in Fig. 2-examples shown in Fig. 4, the bottom wall of recessed portion 22 is equipped with perforative via
23, one end of circuit board assemblies 3 passes through the via 23 on decoration 2 to stretch in recessed portion 22, stretches in recessed portion 22
Circuit board assemblies 3 are sticked on the free end face of lug boss 11.When circuit board assemblies 3 are sticked on the free end face of lug boss 11
When, one side lug boss 11 can play a certain protective role circuit board assemblies 3, and the impurity in air can be prevented to electricity
The corrosion on road and cause electric property to decline, on the other hand can also ensure fingerprint recognition component and circuit board in encapsulated layer 1
The close connection of component 3 ensures the reliability of 100 work of fingerprint module.
Optionally, circuit board assemblies 3 are equipped with ground terminal, and decoration 2 is conductive decoration 2, and decoration 2 passes through circuit
Board group part 3 is electrically connected with ground terminal.Decoration 2 can be grounded by the ground terminal on circuit board assemblies 3 as a result,
Purpose prevents harmful effect of 2 electrostatic of decoration to fingerprint module 100.It should be noted that decoration 2 with exterior object
Electrostatic is will produce during touching or friction etc., the electrostatic in decoration 2 can generate harmful effect to fingerprint module 100.
Further, as shown in figs 2-4, it is folded with conduct piece between circuit board assemblies 3 and the inner bottom wall of recessed portion 22
4.Circuit board assemblies 3 and decoration 2 can realize electrical connection indirectly by conduct piece 4 as a result, can make circuit board assemblies 3 with
Structure arrangement between decoration 2 is more reasonable.
Further, as shown in Figure 2 and Figure 4, the bottom wall of recessed portion 22 is equipped with mounting groove 24, and conduct piece 4 is embedded
In mounting groove 24.Mounting groove 24 can play the role of limit to conduct piece 4, prevent conduct piece 4 on the bottom wall of recessed portion 22
It is mobile, it thereby may be ensured that and connect between the inner bottom wall and conduct piece 4 and circuit board assemblies 3 of conduct piece 4 and recessed portion 22
Reliability.
Specifically, conduct piece 4 can be conducting foam.Conducting foam is that conductive fabric is wrapped up on flame-retardant sponge, by one
After the processing of series, good surface conductivity is made it have, can be easy to be fixed on adhesive tape to need on shielding device.It adopts
Of low cost with conducting foam, processing technology is simple, while can ensure the reliability of ground connection.When circuit board assemblies 3 and decoration
After part 2 assembles, the conducting foam between circuit board assemblies 3 and decoration 2 has certain decrement, it is ensured that leads
Reliability connection between electric foam and decoration 2 and between conducting foam and circuit board assemblies 3, to ensure decoration 2
Good ground connection prevents 2 electrostatic of decoration from generating harmful effect to fingerprint module 100.
In some embodiments of the invention, as shown in figs 2-4, circuit board assemblies 3 include flexible PCB 31 and mend
Strong plate 32.One end of flexible PCB 31 stretches in recessed portion 22, and oneself of the end of flexible PCB 31 and lug boss 11
By holding end face (rear end face of lug boss 11 as shown in Figure 4) fitting.On the one hand, lug boss 11 can play flexible PCB 31
It to certain protective effect, prevents the impurity in air from causing electric property to decline the corrosion of circuit, on the other hand may be used also
To ensure the close connection of the fingerprint recognition component in encapsulated layer 1 and flexible PCB 31, what guarantee fingerprint module 100 worked can
By property.Ground terminal is located on flexible PCB 31, stiffening plate 32 be fitted on flexible PCB 31 and with flexible PCB 31
Electrical connection, and stiffening plate 32 is located at the side (rear side as shown in Figure 4) of the separate encapsulated layer 1 of flexible PCB 31, conduct piece 4
It is electrically connected with stiffening plate 32 (i.e. stiffening plate 32 is electrically conductive component).The structure that stiffening plate 32 can enhance flexible PCB 31 is strong
Degree prevents flexible PCB 31 from bending etc. occurs, to ensure the reliability of the work of flexible PCB 31, meanwhile, stiffening plate 32
It can be electrically connected with flexible PCB 31, conduct piece 4 is electrically connected with stiffening plate 32 to realize decoration 2 and flexible PCB 31
Electrical connection.So as to realize being electrically connected by flexible PCB 31 and ground terminal of decoration 2, and then avoid decoration 2
Harmful effect of the electrostatic to fingerprint module 100.
In some embodiments of the invention, as shown in figure 4, being cased with sealing element 7 on the periphery wall of decoration 2.Work as fingerprint
When module 100 is installed on the mobile terminals such as mobile phone, can to avoid on hand sweat or other liquid intrusion mobile terminal inside
And the parts inside mobile terminal are damaged, to ensure the reliability of mobile terminal work.
Further, as shown in figure 4, the periphery wall of decoration 2 is equipped with seal groove 25, sealing element 7 is embedded in seal groove
In 25.So as to prevent sealing element 7 from jumping along the axial direction (front-rear direction as shown in Figure 4) of decoration 2, ensure sealing
Reliability.
In some embodiments of the invention, as shown in figs 2-4, fingerprint module 100 further includes cover board 5, and cover board 5 is located at
Front side (front side as shown in Figure 4) in embedded groove 21 and positioned at encapsulated layer 1.One side cover board 5 can be to fingerprint recognition component
Play the role of further protection with circuit board assemblies 3, another aspect cover board 5 can also increase the aesthetics of fingerprint module 100.
Optionally, cover board 5 can be the glossiness of glass cover-plate 5 or ceramic cover plate 5, glass cover-plate 5 or ceramic cover plate 5
Height can improve the aesthetics of fingerprint module 100.
It is described below to be below with reference to the fingerprint module 100 of Fig. 1-Fig. 4 descriptions accord to a specific embodiment of that present invention
Illustratively, it is intended to for explaining the present invention, and be not considered as limiting the invention.
As Figure 1-Figure 4, fingerprint module 100 according to the ... of the embodiment of the present invention, including encapsulated layer 1, decoration 2, circuit
Board group part 3, cover board 5.
Specifically, as shown in Figure 3 and Figure 4, encapsulated layer 1 is set for encapsulating fingerprint recognition component on the rear surface of encapsulated layer 1
It is the lug boss 11 being formed on 1 rear surface of encapsulated layer to have the first auxiliary section, the first auxiliary section, and lug boss 11 is one and is located at
The intermediate position of encapsulated layer 1 can process a circle step, encapsulated layer when processing lug boss 11 along the circumferential direction of encapsulated layer 1
1 and the side wall surface of rear surface and lug boss 11 formed First terrace.As shown in Figure 2 and Figure 4, decoration 2 has embedded groove 21,
Encapsulated layer 1 is located in embedded groove 21, the second auxiliary section is equipped in embedded groove 21, the second auxiliary section is to be formed in embedded groove 21
Recessed portion 22, lug boss 11 are located in recessed portion 22.The bottom wall of embedded groove 21 and the side wall of recessed portion 22 form second step face,
First terrace engages with second step face.After the completion of decoration 2 and encapsulated layer 1 assemble, decoration 2 and encapsulation can be reduced
Layer 1 is in thickness in the front-back direction, and to reduce the thickness of fingerprint module 100, and then it is ultra-thin to be adapted to mobile terminal complete machine
It is required that.
It should be noted that when the thickness of lug boss 11 along the longitudinal direction is a, in the longitudinal direction, decoration 2 and envelope
Thickness after dress layer 1 assembles can reduce a.For example, when the thickness of lug boss 11 along the longitudinal direction is 0.2mm, in front-rear direction
On, the thickness after decoration 2 is assembled with encapsulated layer 1 can reduce 0.2mm.
As shown in figs 2-4, circuit board assemblies 3 include flexible PCB 31 and stiffening plate 32, the recessed portion 22 of decoration 2
Bottom wall be equipped with via 23, one end of flexible PCB 31 stretches to across via 23 in recessed portion 22, stretches into recessed portion 22
The end of interior flexible PCB 31 is bonded with the free end end face (i.e. the rear surface of lug boss 11) of lug boss 11.On the one hand,
Encapsulated layer 1 can play the role of protection to flexible PCB 31, can prevent the impurity in air from being made to the corrosion of circuit
Decline at electric property, on the other hand, it can also be ensured that fingerprint recognition component in encapsulated layer 1 is close with flexible PCB 31
Connection ensures the reliability of 100 work of fingerprint module.Stiffening plate 32 can be reinforcement steel plate, and stiffening plate 32 is fitted in flexible electrical
It the side of the separate encapsulated layer 1 of road plate 31 and is electrically connected with flexible PCB 31, i.e., stiffening plate 32 is fitted in flexible PCB 31
Rear wall on.Stiffening plate 32 can reinforce the structural strength of flexible PCB 31, prevent flexible PCB 31 from bending and damaging.
In addition, as shown in figs 2-4, decoration 2 is ferromagnetism steel plate, the other end of flexible PCB 31 (does not extend into recessed
One end in concave portion 22) it is equipped with ground terminal, conduct piece 4, decoration 2 are equipped between stiffening plate 32 and the inner bottom wall of recessed portion 22
It is electrically connected with ground terminal realization by conduct piece 4, stiffening plate 32 and flexible PCB 31, to realize what decoration 2 was grounded
Purpose prevents 2 electrostatic of decoration from exerting an adverse impact to fingerprint module 100.Wherein, conduct piece 4 is conducting foam, conduction bubble
The shape of the cross section of cotton is rectangle, and it is rectangular mounting groove 24, conduction bubble that the bottom wall of recessed portion 22, which is equipped with cross section,
Cotton is embedded in mounting groove 24, thus, it is possible to prevent conducting foam from moving, to ensure decoration 2 and flexible PCB 31 it
Between the reliability that is electrically connected.
As shown in figure 4, cover board 5 is glass cover-plate 5, cover board 5 is located at the front side in embedded groove 21 and positioned at encapsulated layer 1, lid
Plate 5 can block the front openings of embedded groove 21.Cover board 5 not only can play the role of further protection to circuit board assemblies 3,
The aesthetics of fingerprint module 100 can also be increased.
As shown in figure 4, being arranged with sealing element 7 on the periphery wall of decoration 2, sealing element 7 is embedded on 2 periphery wall of decoration
Seal groove 25 in, when fingerprint module 100 is installed on the mobile terminals such as mobile phone, can to avoid on hand sweat or other liquid
The parts inside mobile terminal are damaged inside body intrusion mobile terminal, to ensure the reliability of mobile terminal work.
As shown in figs 2-4, fingerprint module 100 further includes fingerprint platen 6, and fingerprint platen 6 is located at the rear side of decoration 2.
It, can be by cover board 5, encapsulated layer 1, flexible PCB 31 and stiffening plate 32 during processing fingerprint module 100
It processes together, then conducting foam is pasted to 24 the inside of mounting groove of decoration 2, by the cover board 5 processed together, encapsulation
Layer 1, flexible PCB 31 and stiffening plate 32 are punctuated the glue and decoration 2 that processes is assembled together and pressurize by periphery one.
Meanwhile being assembled by dispensing, the conducting foam between stiffening plate 32 and decoration 2 passes through certain decrement, dispensing pressurize
After a certain period of time, ensure good earth between the two after glue curing.
Fingerprint module 100 according to the ... of the embodiment of the present invention encloses step to be formed by the rear surface processing one in encapsulated layer 1
Lug boss 11 is fixed using lug boss 11 and 22 dispensing of recessed portion of decoration 2, can reduce encapsulated layer 1 and decoration 2 assembles
Thickness in the front-back direction afterwards, to reduce the thickness of fingerprint module 100.
Mobile terminal according to the ... of the embodiment of the present invention, including above-mentioned fingerprint module 100.
Mobile terminal according to the ... of the embodiment of the present invention can reduce mobile terminal by the way that above-mentioned fingerprint module 100 is arranged
Thickness meets the ultra-thin requirement of mobile terminal.
In some embodiments of the invention, mobile terminal can be mobile phone, tablet computer or laptop etc., work as hand
After machine, tablet computer or laptop etc. are using above-mentioned fingerprint module 100, its thickness can be reduced, meet its and ultra-thin want
It asks.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (10)
1. a kind of fingerprint module, which is characterized in that including：
Encapsulated layer for encapsulating fingerprint recognition component has the first auxiliary section on the rear surface of the encapsulated layer；With
There is embedded groove, the encapsulated layer to be embedded in the embedded groove, are equipped in the embedded groove for decoration, the decoration
Second auxiliary section, first auxiliary section and second auxiliary section are fitted into each other, are arranged on the periphery wall of the decoration
Sealing element.
2. fingerprint module according to claim 1, which is characterized in that first auxiliary section is to be formed in the encapsulated layer
Rear surface on lug boss,
Second auxiliary section is the recessed portion being formed in the embedded groove, and at least partly described boss is in the recess
In portion.
3. fingerprint module according to claim 2, which is characterized in that the lug boss is one.
4. fingerprint module according to claim 3, which is characterized in that wear one end of the circuit board assemblies of the fingerprint module
The decoration is crossed to stretch in the recessed portion,
The end of the circuit board assemblies is sticked in the free end end face of the lug boss.
5. fingerprint module according to claim 4, which is characterized in that the circuit board assemblies are equipped with ground terminal, institute
It is conductive decoration to state decoration, and the decoration is electrically connected by the circuit board assemblies with the ground terminal.
6. fingerprint module according to claim 5, which is characterized in that the interior bottom of the circuit board assemblies and the recessed portion
Conduct piece is folded between wall.
7. fingerprint module according to claim 6, which is characterized in that the bottom wall of the recessed portion is equipped with mounting groove, institute
Conduct piece is stated to be embedded in the mounting groove.
8. fingerprint module according to claim 6, which is characterized in that the conduct piece is conducting foam.
9. fingerprint module according to claim 6, which is characterized in that the circuit board assemblies include：
One end of flexible PCB, the flexible PCB stretches in the recessed portion, and the end of the flexible PCB
It is bonded with the free end end face of the lug boss, the ground terminal is located on the flexible PCB；With
Stiffening plate, the stiffening plate is fitted on the flexible PCB and is electrically connected with the flexible PCB, and the benefit
Strong plate is located at the side far from the encapsulated layer of the flexible PCB, and the conduct piece is electrically connected with the stiffening plate.
10. a kind of mobile terminal, which is characterized in that include the fingerprint module according to any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810130123.5A CN108319925B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and have its mobile terminal |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610678006.3A CN106203404B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and there is its mobile terminal |
| CN201810130123.5A CN108319925B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and have its mobile terminal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610678006.3A Division CN106203404B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and there is its mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108319925A true CN108319925A (en) | 2018-07-24 |
| CN108319925B CN108319925B (en) | 2022-03-22 |
Family
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| CN201610678006.3A Active CN106203404B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module and there is its mobile terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018032871A1 (en) | 2016-08-16 | 2018-02-22 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal having same |
| WO2018032870A1 (en) | 2016-08-16 | 2018-02-22 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal having same |
| CN106803079B (en) * | 2017-01-20 | 2020-08-21 | Oppo广东移动通信有限公司 | Fingerprint module and mobile terminal |
| CN106897712B (en) * | 2017-03-13 | 2020-01-14 | Oppo广东移动通信有限公司 | Fingerprint module, display screen and mobile terminal |
| CN107133582B (en) * | 2017-04-27 | 2020-01-14 | 维沃移动通信有限公司 | Installation structure and installation method of fingerprint module and electronic equipment |
| CN109063585B (en) * | 2018-07-11 | 2024-06-07 | 南昌黑鲨科技有限公司 | Fingerprint module and electronic equipment |
| CN113971820A (en) * | 2021-09-17 | 2022-01-25 | 惠州Tcl移动通信有限公司 | Fingerprint module and mobile terminal |
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| CN206178867U (en) * | 2016-08-16 | 2017-05-17 | 广东欧珀移动通信有限公司 | Fingerprint module and have its mobile terminal |
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| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106203404A (en) | 2016-12-07 |
| CN106203404B (en) | 2018-03-16 |
| CN108319925B (en) | 2022-03-22 |
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