CN108286066A - A kind of diamond cutting secant processing method and device - Google Patents
A kind of diamond cutting secant processing method and device Download PDFInfo
- Publication number
- CN108286066A CN108286066A CN201810123335.0A CN201810123335A CN108286066A CN 108286066 A CN108286066 A CN 108286066A CN 201810123335 A CN201810123335 A CN 201810123335A CN 108286066 A CN108286066 A CN 108286066A
- Authority
- CN
- China
- Prior art keywords
- grit carborundum
- diamond cutting
- cutting secant
- grit
- carborundum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
Abstract
The embodiment of the invention discloses a kind of diamond cutting secant processing method and devices, including carry out cleaning and drying and processing to grit carborundum；Ion deposition processing is carried out to the grit carborundum after drying, the metal cation for being attached to grit carborundum surface is made to form film layer；Grit carborundum after ion deposition is consolidated on steel wire, to form diamond cutting secant.Grit carborundum in the embodiment of the present invention through ion deposition after handling, grit carborundum surface forms one layer of metal cation film layer, then the grit carborundum with metal cation film layer is fixedly arranged on steel wire again, metal cation film layer can increase adhesive force of the grit carborundum on steel wire, to make the diamond cutting secant being made not easily cause falling off for grit carborundum in use, to improve the quality of diamond cutting secant, the height of protrusion of diamond cutting secant and broken tearing force are ensured, and more environmentally-friendly.
Description
Technical field
The present embodiments relate to diamond cutting secant manufacture technology fields, add more particularly to a kind of diamond cutting secant
Work method and device.
Background technology
Currently, industrial many hard materials are all cut using diamond cutting secant, for example photovoltaic art is more
Crystal silicon is sliced, monocrystalline silicon, crystal bar.In the prior art, when making diamond cutting secant, by way of plating by cleaned and
Grit carborundum after drying is directly fixedly arranged on steel wire, forms diamond cutting secant, the diamond being made by this mode
The adhesive force of grit carborundum on cutting line is relatively low.During using the diamond cut wire cutting object, it is fixedly arranged at steel
Being easy to fall off for grit carborundum on line, influences the height of protrusion of diamond cutting secant and broken tearing force, reduces Buddha's warrior attendant cutting line
Quality, and the grit carborundum that falls off is easy pollution environment.
In consideration of it, how to provide it is a kind of solve above-mentioned technical problem diamond cutting secant processing method and device become this
The current problem to be solved of field technology personnel.
Invention content
The purpose of the embodiment of the present invention is to provide a kind of diamond cutting secant processing method and device, improves golden diamond dust
The quality of adhesive force and diamond cutting secant of the gravel on steel wire, has ensured the height of protrusion of diamond cutting secant and broken tearing force,
It is more environmentally-friendly.
In order to solve the above technical problems, an embodiment of the present invention provides a kind of diamond cutting secant processing methods, including：
Cleaning and drying and processing are carried out to grit carborundum；
Ion deposition processing is carried out to the grit carborundum after drying, make to be attached to the metal sun on the grit carborundum surface from
Son forms film layer；
Grit carborundum after ion deposition is consolidated on steel wire, to form diamond cutting secant.
Optionally, the grit carborundum after described pair of drying carries out ion deposition processing, makes to be attached to the grit carborundum table
The process that the metal cation in face forms film layer is：
By handling nickel alloy, nickel cation is obtained；
Ion deposition is carried out to the grit carborundum after drying using the nickel cation, the grit carborundum surface is made to be formed
Nickel film layer.
Optionally, described to handle nickel alloy, the process for obtaining nickel cation is：
Electrolysis processing is carried out to nickel alloy, obtains nickel cation.
Optionally, described to handle nickel alloy, the process for obtaining nickel cation is：
High-temperature process is carried out to nickel alloy, obtains nickel cation.
Optionally, the nickel alloy surfaces are equipped with additive layer.
Optionally, the additive layer is chlorination nickel layer.
Optionally, the grit carborundum by after ion deposition is consolidated in the process that diamond cutting secant is formed on steel wire
For：
The grit carborundum after ion deposition is consolidated in formation diamond cutting secant on steel wire by way of plating.
The embodiment of the present invention provides a kind of diamond cut wire processing device accordingly, including：
Cleaning device, for being started the cleaning processing to grit carborundum；
Drying unit, for carrying out drying and processing to the grit carborundum after cleaning；
Ion deposition apparatus makes to be attached to the Buddha's warrior attendant for carrying out ion deposition processing to the grit carborundum after drying
The metal cation of grit surface forms film layer；
Consolidation device, for the grit carborundum after ion deposition to be consolidated in formation diamond cutting secant on steel wire.
A kind of diamond cutting secant processing method and device are provided in the embodiment of the present invention, including：To grit carborundum into
Row cleaning and drying and processing；Ion deposition processing is carried out to the grit carborundum after drying, makes the gold for being attached to grit carborundum surface
Belong to cation and forms film layer；Grit carborundum after ion deposition is consolidated on steel wire, to form diamond cutting secant.
For grit carborundum in the embodiment of the present invention after being handled through ion deposition, grit carborundum surface forms one layer of metal sun
Then grit carborundum with metal cation film layer is fixedly arranged on steel wire by ion film layer again, metal cation film layer can increase
Add adhesive force of the grit carborundum on steel wire, to make the diamond cutting secant being made not easily cause gold in use
Emery gravel falls off, and to improve the quality of diamond cutting secant, has ensured the height of protrusion of diamond cutting secant and has broken and torn
Power, and it is more environmentally-friendly.
Description of the drawings
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to institute in the prior art and embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow diagram of diamond cutting secant processing method provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of diamond cut wire processing device provided in an embodiment of the present invention.
Specific implementation mode
An embodiment of the present invention provides a kind of diamond cutting secant processing method and devices, improve golden grit carborundum in steel
The quality of adhesive force and diamond cutting secant on line has ensured the height of protrusion of diamond cutting secant and broken tearing force, more ring
It protects.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Fig. 1 is please referred to, Fig. 1 is a kind of flow signal of diamond cutting secant processing method provided in an embodiment of the present invention
Figure.
This method includes：
S11：Cleaning and drying and processing are carried out to grit carborundum；
It should be noted that grit carborundum surface may have impurity and oil stain, diamond dust can be removed by cleaning
The impurity and oil stain on gravel surface make the cleannes higher of grit carborundum.Pure water usually may be used to clean 0.5 hour, and
By the grit carborundum drying after cleaning, drying box high temperature specifically may be used and dry 0.5 hour.
S12：Ion deposition processing is carried out to the grit carborundum after drying, make to be attached to the metal sun on grit carborundum surface from
Son forms film layer；
Specifically, can be by making it generate metal cation, and profit after handling metallic compound in the application
Ion deposition processing is carried out to the grit carborundum after drying with generated metal cation, metal cation is made to be attached to Buddha's warrior attendant
Grit surface, to form one layer of metal cation film layer on grit carborundum surface.The formation of metal cation film layer can make
Grit carborundum is bonded to the increase of the easness on steel wire, namely increases the active force between grit carborundum and steel wire, makes diamond dust
Adhesion enhancement of the gravel on steel wire.
In practical applications, the grit carborundum after drying can be placed in vacuum mixing device, which centers
There is ions bombardment device, ions bombardment device after handling metallic compound for generating metal cation, and vacuum
In rotary course internal grit carborundum can be come into full contact with mixing arrangement with metal cation, so as to metal sun from
It is sub preferably, evenly be attached to grit carborundum surface, to keep the film layer to be formed more uniform.Wherein, the present invention is implemented
It can be that iron cation can also that iron compound or nickel compound namely metal cation, which may be used, in metallic compound in example
For nickel cation, it is of course also possible to for other metallic compounds, the application is not specifically limited this, can realize the present invention
The purpose of embodiment.
It should also be noted that, being not likely to produce other attachments to ensure grit carborundum in Ion deposition processes, make
Grit carborundum is not contaminated, and is improved safety and environmental protection coefficient, is used vacuum mixing device in the embodiment of the present invention, make in coating process
Middle grit carborundum is in vacuum state.
S13：Grit carborundum after ion deposition is consolidated on steel wire, to form diamond cutting secant.
It should be noted that there is the grit carborundum of metal cation film layer to be consolidated in steel surface in the embodiment of the present invention
On line, due to the effect of chemical bond, metal cation film layer can increase adhesive force of the grit carborundum on steel wire, to make gold
Emery gravel is easier to be fixedly arranged on steel wire, improves efficiency of grit carborundum during consolidating steel wire, and due to adhesive force
It improves, it is more secured to make grit carborundum be consolidated on steel wire, namely the middle method provided adds through the embodiment of the present invention
Diamond cutting secant made of work does not easily cause falling off for grit carborundum in use, improves the matter of diamond cutting secant
It measures, the diamond cutting secant height of protrusion and broken tearing force in the embodiment of the present invention are larger.In addition, due to the gold being fixedly arranged on steel wire
Emery gravel is not easily to fall off, keeps the diamond cutting secant in the embodiment of the present invention more environmentally-friendly.
Further, ion deposition processing is carried out to the grit carborundum after drying in above-mentioned S12, makes to be attached to grit carborundum
The metal cation on surface forms the process of film layer, is specifically as follows：
By handling nickel alloy, nickel cation is obtained；
Ion deposition is carried out to the grit carborundum after drying using nickel cation, grit carborundum surface is made to form nickel film layer.
It should be noted that the adhesive force in order to further ensure grit carborundum on steel wire, the embodiment of the present invention is right
When grit carborundum after drying carries out ion deposition processing, ion is carried out to the grit carborundum after drying preferably by nickel alloy
Precipitation process, specifically, nickel alloy can be made to generate nickel cation by way of electrolysis, or by way of high-temperature heating
So that nickel alloy is generated nickel cation, and nickel cation is deposited on to the surface formation nickel film layer of grit carborundum.Due to nickel cation
Further with steel wire, nickel alloy surfaces are equipped with additive layer.
Specifically, fast in order to improve the generation quantity of nickel cation and improve attachment of the nickel cation on grit carborundum surface
Degree, the embodiment of the present invention can coat one layer of additive in nickel alloy surfaces, to promote nickel alloy to generate the effect of nickel cation
Rate, and then so that nickel cation is attached to grit carborundum surface.
Specifically, the additive layer in the embodiment of the present invention is chlorination nickel layer.
It should be noted that the additive in the embodiment of the present invention is not limited only to that for nickel chloride, amino sulphur can also be used
Sour nickel as additive, with promote nickel cation generation and nickel cation grit carborundum surface deposit efficiency.
Further, the grit carborundum after ion deposition being consolidated on steel wire in above-mentioned S13 forms diamond cutting
The process of secant, is specifically as follows：
The grit carborundum after ion deposition is consolidated in formation diamond cutting secant on steel wire by way of plating.
It should be noted that in order to improve the efficiency that grit carborundum consolidates steel wire, the embodiment of the present invention is preferably using electricity
Surface there is the grit carborundum of metal cation film layer to be consolidated in formation diamond cutting secant on steel wire by the mode of plating.
It is, of course, also possible to grit carborundum is fixedly arranged on steel wire using other modes, this hair of which kind of mode is specifically used
Bright embodiment does not do this particular determination, can realize the purpose of the embodiment of the present invention.
Provide a kind of diamond cutting secant processing method in the embodiment of the present invention, including to grit carborundum carry out cleaning and
Drying and processing；Ion deposition processing is carried out to the grit carborundum after drying, makes the metal cation for being attached to grit carborundum surface
Form film layer；Grit carborundum after ion deposition is consolidated on steel wire, to form diamond cutting secant.The present invention is implemented
For grit carborundum in example after being handled through ion deposition, grit carborundum surface forms one layer of metal cation film layer, then again will
Grit carborundum with metal cation film layer is fixedly arranged on steel wire, and metal cation film layer can increase grit carborundum on steel wire
Adhesive force, to make the diamond cutting secant being made not easily cause falling off for grit carborundum in use, to
The quality for improving diamond cutting secant has ensured the height of protrusion of diamond cutting secant and broken tearing force, and more environmentally-friendly.
Accordingly the embodiment of the invention also discloses a kind of diamond cut wire processing device, specifically please refer to shown in Fig. 2
A kind of diamond cut wire processing device structural schematic diagram.On the basis of the above embodiments：
The device includes：
Cleaning device 1, for being started the cleaning processing to grit carborundum；
Drying unit 2, for carrying out drying and processing to the grit carborundum after cleaning；
Ion deposition apparatus 3 makes to be attached to grit carborundum for carrying out ion deposition processing to the grit carborundum after drying
The metal cation on surface forms film layer；
Consolidation device 4, for the grit carborundum after ion deposition to be consolidated in formation diamond cutting secant on steel wire.
It should be noted that may include vacuum mixing device and ion in ion deposition apparatus in the embodiment of the present invention
Device is bombarded, and ions bombardment device is set to inside vacuum mixing device, in Ion deposition processes, after drying
Grit carborundum is positioned in vacuum mixing device, and for generating metal cation, vacuum mixing device is revolving ions bombardment device
Turn during grit carborundum can be made to come into full contact with metal cation, so as to make metal cation preferably, attachment evenly
On grit carborundum surface, metal cation film layer has been formed.
It should also be noted that, the diamond cut wire processing device provided in the embodiment of the present invention has and above-mentioned reality
The identical advantageous effect of diamond cutting secant processing method provided in example is applied, and for diamond cutting secant processing method
Specific introduce please refers to above method embodiment, and details are not described herein by the application.
It should also be noted that, in the present specification, such as the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only that
A little elements, but also include other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (8)
1. a kind of diamond cutting secant processing method, which is characterized in that including：
Cleaning and drying and processing are carried out to grit carborundum；
Ion deposition processing is carried out to the grit carborundum after drying, makes the metal cation shape for being attached to the grit carborundum surface
Film forming layer；
Grit carborundum after ion deposition is consolidated on steel wire, to form diamond cutting secant.
2. diamond cutting secant processing method according to claim 1, which is characterized in that the diamond dust after described pair of drying
Gravel carries out ion deposition processing, and the metal cation for making to be attached to the grit carborundum surface forms the process of film layer and is：
By handling nickel alloy, nickel cation is obtained；
Ion deposition is carried out to the grit carborundum after drying using the nickel cation, the grit carborundum surface is made to form nickel film
Layer.
3. diamond cutting secant processing method according to claim 2, which is characterized in that it is described to nickel alloy at
Reason, the process for obtaining nickel cation are：
Electrolysis processing is carried out to nickel alloy, obtains nickel cation.
4. diamond cutting secant processing method according to claim 2, which is characterized in that it is described to nickel alloy at
Reason, the process for obtaining nickel cation are：
High-temperature process is carried out to nickel alloy, obtains nickel cation.
5. the diamond cutting secant processing method according to claim 2-4 any one, which is characterized in that the nickel alloy
Surface is equipped with additive layer.
6. diamond cutting secant processing method according to claim 5, which is characterized in that the additive layer is nickel chloride
Layer.
7. diamond cutting secant processing method according to claim 5, which is characterized in that it is described will be after ion deposition
Grit carborundum be consolidated on steel wire formed diamond cutting secant process be：
The grit carborundum after ion deposition is consolidated in formation diamond cutting secant on steel wire by way of plating.
8. a kind of diamond cut wire processing device, which is characterized in that including：
Cleaning device, for being started the cleaning processing to grit carborundum；
Drying unit, for carrying out drying and processing to the grit carborundum after cleaning；
Ion deposition apparatus makes to be attached to the grit carborundum for carrying out ion deposition processing to the grit carborundum after drying
The metal cation on surface forms film layer；
Consolidation device, for the grit carborundum after ion deposition to be consolidated in formation diamond cutting secant on steel wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810123335.0A CN108286066A (en) | 2018-02-07 | 2018-02-07 | A kind of diamond cutting secant processing method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810123335.0A CN108286066A (en) | 2018-02-07 | 2018-02-07 | A kind of diamond cutting secant processing method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108286066A true CN108286066A (en) | 2018-07-17 |
Family
ID=62832587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810123335.0A Pending CN108286066A (en) | 2018-02-07 | 2018-02-07 | A kind of diamond cutting secant processing method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108286066A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076705A (en) * | 2019-02-18 | 2019-08-02 | 盛利维尔（中国）新材料技术股份有限公司 | Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528166A (en) * | 2012-02-24 | 2012-07-04 | 陈盈同 | Grinding type fretsaw |
| TW201321556A (en) * | 2011-09-14 | 2013-06-01 | Facility Co Ltd | Wire coated with solid microparticles, and method for producing wire coated with solid microparticles |
| CN103266341A (en) * | 2013-05-17 | 2013-08-28 | 浙江工业大学 | Preparation method for producing diamond cutting line through steel wire magnetization |
| CN105937027A (en) * | 2016-05-27 | 2016-09-14 | 山田研磨材料有限公司 | Diamond surface metallizing production method for ultrafine diamond wire saw |
| CN106282928A (en) * | 2016-08-10 | 2017-01-04 | 福建新福兴玻璃有限公司 | A kind of coating film on glass production line |
| CN106414807A (en) * | 2015-05-29 | 2017-02-15 | Facility有限公司 | Nickel plating liquid, method for manufacturing wire coated with solid microparticles, and wire coated with solid microparticles |
-
2018
- 2018-02-07 CN CN201810123335.0A patent/CN108286066A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201321556A (en) * | 2011-09-14 | 2013-06-01 | Facility Co Ltd | Wire coated with solid microparticles, and method for producing wire coated with solid microparticles |
| CN102528166A (en) * | 2012-02-24 | 2012-07-04 | 陈盈同 | Grinding type fretsaw |
| CN103266341A (en) * | 2013-05-17 | 2013-08-28 | 浙江工业大学 | Preparation method for producing diamond cutting line through steel wire magnetization |
| CN106414807A (en) * | 2015-05-29 | 2017-02-15 | Facility有限公司 | Nickel plating liquid, method for manufacturing wire coated with solid microparticles, and wire coated with solid microparticles |
| CN105937027A (en) * | 2016-05-27 | 2016-09-14 | 山田研磨材料有限公司 | Diamond surface metallizing production method for ultrafine diamond wire saw |
| CN106282928A (en) * | 2016-08-10 | 2017-01-04 | 福建新福兴玻璃有限公司 | A kind of coating film on glass production line |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076705A (en) * | 2019-02-18 | 2019-08-02 | 盛利维尔（中国）新材料技术股份有限公司 | Buddha's warrior attendant Wiring technology is electroplated in sand on a kind of naked powder |
| CN110076705B (en) * | 2019-02-18 | 2021-07-16 | 盛利维尔（中国）新材料技术股份有限公司 | Bare powder sanding diamond wire electroplating process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI360529B (en) | Methods of finishing quartz glass surfaces and com | |
| CN103144209B (en) | A kind of diamond fretsaw and production technology thereof | |
| CN101209505B (en) | Method for preparing metal binding agent diamond scroll saw | |
| CN108878246A (en) | Multilayer plasma body for chamber part corrodes protection | |
| CN103757707B (en) | A kind of complete processing of sapphire material mobile phone screen cover plate | |
| TW200905745A (en) | Methodology for cleaning of surface metal contamination from electrode assemblies | |
| CN201428002Y (en) | Device of electroplating-diamond fretsaw | |
| CN102522326B (en) | Production method of semiconductor discrete device back side metal suitable for screen printing | |
| CN104149039A (en) | Method for coating surface of ultrafine abrasive with monox | |
| CN103031012B (en) | A kind of compositions and the method for preparing diamond fretsaw thereof | |
| CN108286066A (en) | A kind of diamond cutting secant processing method and device | |
| JP5832468B2 (en) | Manufacturing method of glass substrate, manufacturing method of glass substrate for display, and cleaning method of end surface of glass substrate for display | |
| CN104392899A (en) | Sand-blasting-free diffusion nickel plating technology of rectification monocrystalline silicon wafer | |
| CN108381379A (en) | The polishing method that aluminum-nitride single crystal piece electrobrightening and chemically mechanical polishing are combined | |
| CN103415373A (en) | Electrodeposition liquid for fixed-abrasive saw wire | |
| CN104722864B (en) | The polishing processing method of planar shaped metal surface based on double peak pulse current electrochemical copolymerization machinery | |
| CN109016196A (en) | A kind of electroplating diamond wire saw | |
| CN102965668A (en) | Polishing solution for processing stainless steel plate material 8K mirror surface | |
| CN106289924A (en) | The display packing of metallographic structure of target | |
| CN103352200B (en) | Surface deposition has the preparation method of the diamond particles of WC/W compound coating | |
| CN105729251B (en) | A kind of ferroelectric material method of surface finish based on additional asymmetric electric field | |
| TWI293991B (en) | Sputtering target and method of manufacturing same | |
| CN109295427B (en) | Method and device for cleaning sputtering target | |
| CN105506718B (en) | A kind of abrasive particle patterned configuration electroplating diamond wire saw production technology and abrasive particle patterning magnetizing assembly | |
| CN104032357A (en) | Preparation method of cathode electrophoresis resin diamond wire saw |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180717 |
|
| RJ01 | Rejection of invention patent application after publication |