CN108284532B - Silicon crystal clamping tool and silicon crystal cutting machine - Google Patents
Silicon crystal clamping tool and silicon crystal cutting machine Download PDFInfo
- Publication number
- CN108284532B CN108284532B CN201810131984.5A CN201810131984A CN108284532B CN 108284532 B CN108284532 B CN 108284532B CN 201810131984 A CN201810131984 A CN 201810131984A CN 108284532 B CN108284532 B CN 108284532B
- Authority
- CN
- China
- Prior art keywords
- clamping
- workbench
- silicon wafer
- silicon crystal
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 108
- 239000010703 silicon Substances 0.000 title claims abstract description 108
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 107
- 239000013078 crystal Substances 0.000 title claims abstract description 80
- 238000005520 cutting process Methods 0.000 title claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 90
- 238000001514 detection method Methods 0.000 claims description 6
- 238000005299 abrasion Methods 0.000 claims description 4
- 208000019300 CLIPPERS Diseases 0.000 claims 2
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 claims 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 28
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract description 23
- 229920005591 polysilicon Polymers 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention relates to a silicon crystal clamping tool and a silicon crystal cutting machine, wherein the silicon crystal clamping tool comprises a workbench and a silicon crystal clamping mechanism; the workbench comprises a workbench, a positioning plate and a base plate, wherein the workbench is provided with a workbench surface, the positioning plate is vertically arranged on one side edge of the workbench surface, at least two sinking grooves are formed in the workbench surface, the base plate is arranged in the sinking grooves, the upper surface of the base plate is located at the same horizontal height, an overflow groove is further formed in the workbench surface, the overflow grooves are arranged around the base plate in a surrounding mode, the overflow grooves are mutually communicated, overflow holes are formed in the overflow grooves, a yielding through groove is formed in the workbench, and the silicon crystal clamping mechanism is arranged on the workbench surface. The silicon crystal clamping tool disclosed by the invention is simple in structure, good in universality, capable of stably clamping a monocrystalline silicon rod and a polycrystalline silicon block, high in equipment utilization rate and high in working efficiency.
Description
Technical Field
The invention relates to the technical field of cutting of hard and brittle materials, in particular to a silicon crystal clamping tool and a silicon crystal cutting machine.
Background
The use of silicon crystals in the photovoltaic industry is very widespread. The preliminary processing of the silicon rod is carried out in order to meet the quality parameters of the silicon crystal rod and the appearance and the size of the next working procedure, and is an indispensable step in the earlier working procedure of the photovoltaic solar cell. In terms of cutting process, the requirements on cutting process parameters of seed crystals, cylindrical single crystal silicon rods and cubic polycrystalline silicon blocks are almost similar, so that a cutting operation mechanism (cutting machine) of the equipment does not need to be specially designed, but clamping tools of the cylindrical single crystal silicon rods and the cubic polycrystalline silicon blocks have different working requirements.
In the process of cutting the silicon crystal rod by using the existing processing technology and equipment, because the requirements of cutting the monocrystalline silicon rod and the polycrystalline silicon block on the clamping mechanism are different, the existing equipment mainly uses a special silicon crystal clamping mechanism or a special processing machine to respectively execute monocrystalline or polycrystalline cutting work, the universality of the clamping tool is poor, the working efficiency is low and the use cost is high; in addition, when current centre gripping frock is treating to cut the crystal centre gripping and cut, can't guarantee accurately that the silicon crystal bar can not lead to the fact the damage to table surface when cutting, and spun coolant liquid is difficult for collecting moreover and causes equipment corrosion to damage even, perhaps collects the structure complicacy, and the collection effect is not good.
Disclosure of Invention
Therefore, a silicon crystal clamping tool and a silicon crystal cutting machine are needed to solve the problems that an existing silicon crystal clamping mechanism is low in universality, high in use cost and difficult to collect cooling liquid.
In order to achieve the above object, the present inventors provide a silicon wafer clamping tool, which includes a workbench and a silicon wafer clamping mechanism;
the workbench comprises a workbench surface, a positioning plate and a base plate, wherein the workbench surface is provided with a workbench surface, the positioning plate is vertically arranged on one side edge of the workbench surface, at least two sinking grooves are formed in the workbench surface, the base plate is arranged in the sinking grooves, the upper surface of the base plate is positioned at the same horizontal height, the workbench surface is also provided with overflow grooves, the overflow grooves are arranged around the base plate and are mutually communicated, overflow holes are formed in the overflow grooves, a yielding through groove is formed in the workbench surface, and the yielding through groove is positioned on a cutting working path of the wire saw cutting machine;
the silicon crystal clamping mechanism is arranged on the workbench surface and is used for fixing the silicon crystal bar to be cut off.
As a preferable structure of the invention, the silicon crystal clamping mechanism comprises a limit stop and a clamping mechanism;
the limit stop is fixed on the working table surface, the width of the contact surface of the limit stop and the working table surface is not smaller than the interval between the positioning plate and the base plate, and one side surface of the limit stop is abutted against the positioning plate;
the clamping mechanism comprises a swing arm assembly and an inclined slide block locking mechanism;
the swing arm assembly comprises a U-shaped swing arm seat, swing arms and a pivot shaft, coaxial holes are formed in bosses on two sides of the U-shaped swing arm seat, the pivot shaft is pivotally fixed in the coaxial holes, and the swing arms are connected with the pivot shaft so that the swing arms are linked with the pivot shaft;
the oblique slider locking mechanism comprises an oblique slider and a slider seat, the slider seat is fixedly connected with the swing arm, an outwards convex trapezoid chute is arranged on one side surface of the oblique slider, an inwards concave trapezoid chute matched with the outwards convex trapezoid chute is arranged on one side surface of the slider seat, and anti-falling bumps are further arranged at two ends of the inwards concave trapezoid chute.
As a preferable structure of the invention, the silicon crystal clamping mechanism further comprises a detection mechanism, the detection mechanism comprises a limit rod and a limit switch, the limit rod is arranged at one end of the pivot shaft, the pivot shaft rotates to drive the limit rod to rotate, and the limit switch is positioned on a path of rotation of the limit rod.
As a preferable structure of the invention, the coaxial hole is internally provided with the wear-resistant shaft sleeve, and the wear-resistant shaft sleeve is positioned between the pivot shaft and the shaft hole wall of the U-shaped swing arm seat.
As a preferable structure of the silicon crystal clamping mechanism, the silicon crystal clamping mechanism further comprises a cam clamping mechanism, the cam clamping mechanism comprises a cam handle, a locking block, a fastening seat, a locking sliding shaft and a spring, the spring is positioned between the fastening seat and the locking block, one end of the locking sliding shaft sequentially penetrates through the fastening seat and the spring to be connected with the locking block, and the cam handle is connected with the other end of the locking sliding shaft.
As a preferable structure of the invention, the silicon crystal clamping mechanism comprises a roller tool frame and a roller mechanism; the roller tool frame comprises a tool platform and clamping plates fixed on two sides of the tool platform, wherein the upper end faces of the clamping plates are inclined planes, shaft holes perpendicular to the inclined planes are formed in the inclined planes, the roller mechanism comprises rollers, bearings and roller rotating shafts, one ends of the roller rotating shafts are fixed in the shaft holes, the other ends of the roller rotating shafts are connected with the rollers in a rotating mode through the bearings, the roller mechanisms are multiple groups and are uniformly distributed on the inclined planes of the clamping plates on two sides of the tool platform, and the outer circular faces of all rollers in the roller mechanism are located at the same height to form a V-shaped corner clamping face.
As an optimized structure of the invention, the silicon crystal clamping mechanism further comprises a limiting wedge block, wherein the limiting wedge block is positioned between the silicon crystal to be cut and the roller support frame and is used for wedging the silicon crystal to be cut.
As a preferable structure of the invention, the included angle formed by the extension lines of the central lines of the shaft holes on the two side clamping plates is 50-70 degrees.
As an optimized structure of the invention, the roller tool frame is of a two-section structure, a preset gap is reserved between the two sections of roller tool frames, the preset gap is positioned on a cutting working running path of the wire saw cutting machine, and the preset gap is positioned right above the yielding through groove.
The inventor also discloses a silicon crystal cutting machine, which is provided with a silicon crystal clamping tool, and the silicon crystal cutting machine is the silicon crystal clamping tool.
Compared with the prior art, the technical scheme has the following advantages: according to the invention, the silicon crystal clamping tool is embedded with the plurality of base plates on the working table surface, so that the polycrystalline silicon blocks can be directly placed on the base plates for clamping and cutting, the steps for laying the crystal pads are reduced, the working efficiency is improved, meanwhile, the monocrystalline silicon rod clamping tool can also be directly installed on the base plates, the sharing of the workbench is realized by the monocrystalline silicon and polycrystalline silicon clamping mechanisms, the multiple functions of one machine are effectively realized, two types of cutting can be realized by one device, the device utilization rate is improved, and in addition, the overflow groove is arranged on the working table surface in a surrounding manner, the structure is simple, the cutting cooling liquid can be efficiently collected, and the cutting effect of the silicon crystal rod is better.
Drawings
FIG. 1 is a schematic top view of a table of a silicon wafer clamping tool according to the present embodiment;
FIG. 2 is a schematic cross-sectional view of a stage of a silicon wafer clamping tool according to the present embodiment
Fig. 3 is a schematic top view of a polysilicon block clamped by the silicon wafer clamping tool according to this embodiment;
fig. 4 is a schematic side view of a polysilicon block clamped by the silicon wafer clamping tool according to this embodiment;
FIG. 5 is a schematic side view of a silicon wafer clamping tool for clamping a silicon single crystal rod according to the present embodiment;
fig. 6 is a schematic top view of a silicon wafer clamping tool for clamping a silicon single crystal rod according to the present embodiment.
Reference numerals illustrate:
1. a work table;
11. an operation platform; 111. a work table;
12. a positioning plate;
13. a backing plate;
14. an overflow trough;
15. an overflow aperture;
16. a yielding through groove;
2. a silicon crystal clamping mechanism;
21. a limit stop;
221. u-shaped swing arm seats; 222. swing arms; 223. a pivot shaft; 224. wear-resistant shaft sleeve;
231. an inclined slide block; 232. a slider seat;
241. a limit rod; 242. a limit switch;
251. a cam handle; 252. a locking block; 253. a fastening seat; 254. locking the sliding shaft; 255. a spring;
26. a roller tool frame; 261. a tooling platform; 262. a clamping plate;
27. a roller mechanism;
28. a limit wedge block;
29. presetting a gap;
3. a single crystal silicon rod;
4. a block of polysilicon;
5. a cutting direction.
Detailed Description
In order to describe the technical content, constructional features, achieved objects and effects of the technical solution in detail, the following description is made in connection with the specific embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 to 6, the present invention provides a silicon wafer clamping tool, which comprises a workbench 1 and a silicon wafer clamping mechanism;
as shown in fig. 1 and 2, the workbench 1 is used as a mounting and supporting platform of a monocrystalline silicon clamping mechanism or a polycrystalline silicon clamping mechanism in the embodiment, and is also used as a collecting and discharging platform of spraying cooling liquid of a wire saw cutting machine. The concrete structure is as follows: the workbench 1 comprises a workbench 11, a positioning plate 12 and a base plate 13, the workbench 11 is provided with a workbench surface 111, the positioning plate 12 is vertically arranged on one side of the workbench surface 111, the base plate 13 is installed on the workbench surface 111 and is directly contacted with a silicon crystal holding mechanism or a silicon crystal rod, at least two sinking grooves are formed in the workbench surface 111, the base plate 13 is arranged in the sinking grooves, the upper surfaces of the base plate 13 are located at the same horizontal height, so that the situation that the silicon crystal rod clamped by a silicon crystal clamping mechanism is prevented from being uneven, shaking occurs to cause uneven cut surfaces when cutting work is performed, preferably, the upper surfaces of the base plate 13 are located at the same horizontal height and slightly higher than the workbench surface 111, the influence of the workbench on the quality caused by silicon crystal materials is prevented, because the silicon crystal and the iron materials are directly contacted, the iron materials are very likely to have magnetic conductivity substances, the magnetic field edge effect of the silicon wafer is complicated, and the quality of a battery is influenced. Preferably, the backing plate can be a plastic backing plate or an aluminum alloy backing plate, preferably nylon 66 is adopted, and the surface of the silicon crystal material can be prevented from being scratched. The positioning plate 12 is used for abutting against the silicon crystal clamping mechanism to position the silicon crystal clamping mechanism, and prevent the silicon crystal clamping mechanism from deviating from the running path of the wire saw cutting machine. The work table 111 is further provided with an overflow groove 14, the overflow groove 14 is arranged around the base plate 13, the overflow grooves 14 are mutually communicated, the overflow groove 14 is provided with overflow holes 15, the overflow groove 14 is used for collecting cooling water for cooling and cleaning the wire saw cutting machine, the cooling water is prevented from splashing randomly, the clamping tool is corroded or a circuit is damaged, and the overflow groove 14 is simple in structure and convenient to manufacture and use. Offer logical groove 16 of stepping down on the work platform 11, the logical groove 16 of stepping down is located the wire saw cutting machine and cuts on the working travel path, the logical groove 16 of stepping down as the wire saw cutting machine when carrying out the silicon crystal bar cutting the operation path that passes through, can control the cutting efficiency of wire saw cutting machine to the silicon crystal bar, can not cause the damage of workstation 1 moreover. Preferably, the two positioning blocks are respectively positioned at two sides of the yielding through groove 16.
The silicon crystal clamping mechanism is arranged on the surface of the workbench 1 and is used for fixing the silicon crystal bars to be cut off. The silicon crystal clamping mechanism can stably clamp the silicon crystal bar, so that the silicon crystal bar is prevented from shaking in the cutting process, the occurrence of wave surfaces is caused, and the quality of the silicon crystal bar is affected.
According to the invention, the silicon crystal clamping tool is embedded with the plurality of base plates on the working table surface, so that the polycrystalline silicon blocks can be directly placed on the base plates for clamping and cutting, the steps for laying the crystal pads are reduced, the working efficiency is improved, meanwhile, the monocrystalline silicon rod clamping tool can also be directly installed on the base plates, the sharing of the workbench is realized by the monocrystalline silicon and polycrystalline silicon clamping mechanisms, the multiple functions of one machine are effectively realized, two types of cutting can be realized by one device, the device utilization rate is improved, and in addition, the overflow groove is arranged on the working table surface in a surrounding manner, the structure is simple, the cutting cooling liquid can be efficiently collected, and the cutting effect of the silicon crystal rod is better.
Referring to fig. 3 and 4, as a preferred embodiment of the present invention, the silicon wafer clamping mechanism is used as a clamping mechanism for a multi-silicon ingot, and the silicon wafer clamping mechanism includes a limit stop 21 and a clamping mechanism;
the limit stop 21 is used as an abutting plate of the polysilicon crystal bar and is used for abutting and limiting one side face of the polysilicon crystal bar to be cut off, then the limit stop 21 is clamped and locked by a matched clamping mechanism, the limit stop 21 is fixed on the working table surface 111, the width of the surface contact face of the limit stop 21 and the working table 1 is not smaller than the distance between the positioning plate 12 and the base plate 13, and the limit stop is used for enabling the side face of the polysilicon block 4 to be completely positioned on the base plate 13 so as to prevent the quality of the polysilicon block 4 directly contacted with the working table to be affected, and one side face of the limit stop 21 abuts against the positioning plate 12. Preferably, the limit stop 21 is made of plastic.
The clamping mechanism comprises a swing arm 222 assembly and an inclined slide block locking mechanism; the swing arm 222 assembly is used as a driving strand of the inclined slide block locking mechanism, and drives the inclined slide block locking mechanism to move so as to clamp the polysilicon crystal bar. The swing arm 222 assembly comprises a U-shaped swing arm seat 221, a swing arm 222 and a pivot shaft 223, coaxial holes are formed in bosses on two sides of the U-shaped swing arm seat 221, the pivot shaft 223 is pivotally fixed in the coaxial holes, and the swing arm 222 is connected with the pivot shaft 223, so that the swing arm 222 is linked with the pivot shaft 223; in a specific embodiment, the U-shaped swing arm seat 221 is fixed on the surface of the table 1 by a detachable connection manner such as a screw, a mortise and tenon, etc., the swing arm 222 is connected with the pivot shaft 223, and the swing arm 222 rotates to drive the pivot shaft 223 to rotate around the connection position between the pivot shaft 223 and the U-shaped swing arm seat 221.
The oblique slider locking mechanism comprises an oblique slider 231 and a slider seat 232, the slider seat 232 is fixedly connected with the swing arm 222, an outwards convex trapezoid chute is arranged on one side surface of the oblique slider 231, an inwards concave trapezoid chute matched with the outwards convex trapezoid chute is arranged on one side surface of the slider seat 232, and anti-falling lugs are further arranged at two ends of the inwards concave trapezoid chute. The swing arm 222 rotates to drive the sliding block seat 232 to rotate, so that the concave trapezoid chute of the sliding block seat 232 is matched with the convex trapezoid chute on the inclined sliding block 231, and the inclined sliding block locking mechanism clamps or loosens the polysilicon block 4; when the outer side of the concave trapezoid chute of the sliding block seat 232 is the lower side of the chute, and the inner side of the convex trapezoid chute of the inclined sliding block 231 is the lower side of the chute, the swing arm 222 is rotated clockwise at the moment to drive the sliding block seat 232 to rotate clockwise, so that the loosening of the polycrystalline silicon block 4 is realized, and the swing arm 222 is rotated anticlockwise to clamp the polycrystalline silicon block 4, so that the clamping mode is simple and stable.
In a preferred embodiment, the silicon wafer clamping mechanism further comprises a detection mechanism, the detection mechanism comprises a limiting rod 241 and a limiting switch 242, the limiting rod 241 is arranged at one end of the pivot shaft 223, the pivot shaft 223 rotates to drive the limiting rod 241 to rotate, and the limiting switch 242 is located on a rotating path of the limiting rod 241. The limit switch 242 is used as a safe start-stop switch of the wire saw cutting machine, when the limit rod 241 abuts against the limit switch 242, the limit switch 242 is started, and at the moment, the wire saw cutting machine cannot cut off. Preferably, the limit switch 242 is matched with the inclined slide block locking mechanism, so that when the polycrystalline silicon block 4 is in a clamping state, the wire saw cutting machine can cut off the work, and when the inclined slide block locking mechanism is in a releasing state, the limit switch 242 is in an opening state when the limit rod 241 connected to one end of the pivot shaft 223 just abuts against the limit switch 242, so that irregular operation is completely eradicated, the work is safe, and the processing quality of the polycrystalline silicon rod is good.
As a preferred embodiment of the present invention, the coaxial hole is provided with an abrasion-resistant shaft sleeve 224, and the abrasion-resistant shaft sleeve 224 is located between the pivot shaft 223 and the shaft hole wall of the U-shaped swing arm seat 221. The wear-resistant shaft sleeve 224 is used for preventing the pivot shaft 223 or the U-shaped swing arm seat 221 from being worn, and reducing the service life of the pivot shaft and the U-shaped swing arm seat. In a preferred embodiment, a wear-resistant pad is further disposed between the swing arm 222 and the U-shaped swing arm base 221.
Referring to fig. 3, as a preferred embodiment of the present invention, the silicon wafer clamping mechanism further includes a cam clamping mechanism, the cam clamping mechanism includes a cam handle 251, a locking block 252, a fastening seat 253, a locking sliding shaft 254, and a spring 255, the spring 255 is located between the fastening seat 253 and the locking block 252, one end of the locking sliding shaft 254 sequentially passes through the fastening seat 253 and the spring 255 to be connected with the locking block 252, and the cam handle 251 is connected with the other end of the locking sliding shaft 254. In this embodiment, the spring 255 is disposed between the fastening seat 253 and the locking block 252, and because the spring 255 is to maintain its extended state, the elastic force provided by the spring uniformly presses the locking block 252 against the polycrystalline silicon rod, so that the polycrystalline silicon rod is always in a clamped rotation state; when the polysilicon ingot needs to be loosened, the cam handle 251 is pulled, so that the locking block 252 compresses the spring 255, and the spring 255 is kept in a compressed state. In a preferred embodiment, the fastening seat 253 is connected to one end of the baffle plate, so that the cam clamping mechanism and the inclined slide block locking mechanism are integrally locked, double locking of the polysilicon crystal bar is realized, the operation is very simple, and an operator does not need to move a nonmetal weight for clamping. After the locking mechanism is released, the adjustable position swing arm 222 only has the polycrystalline silicon blocks to be processed or processed on the surface of the workbench 1, and no other sundries exist, so that collision is not needed during operation, and the workbench is safe and reliable.
Referring to fig. 5 and 6, as another preferred embodiment of the present invention, the silicon wafer clamping mechanism is used for clamping the single crystal silicon rod 3, and comprises a roller tool frame 26 and a roller mechanism 27; the roller tool frame 26 comprises a tool platform 261 and clamping plates 262 fixed on two sides of the tool platform 261, the upper end faces of the clamping plates 262 are inclined planes, shaft holes perpendicular to the inclined planes are formed in the inclined planes, the roller mechanism 27 comprises rollers, bearings and roller rotating shafts, one ends of the roller rotating shafts are fixed in the shaft holes, the other ends of the roller rotating shafts are connected with the rollers in a rotating mode through the bearings, the roller mechanisms 27 are multiple groups and are evenly distributed on the inclined planes of the clamping plates 262 on two sides of the tool platform 261, and the outer circular faces of all the rollers in the roller mechanism 27 are located at the same height to form a V-shaped clamping angle face. The roller tool frame 26 is used as a roller mechanism 27 and a supporting mechanism of the monocrystalline silicon rod 3, the V-shaped included angle surface formed by the fact that the outer circular surfaces of all rollers in the roller mechanism 27 are all at the same height is used as a direct contact surface of the monocrystalline silicon rod 3, the monocrystalline silicon rod 3 is arranged on the V-shaped included angle surface, the monocrystalline silicon rod falls into the V-shaped inclined surface under the action of self gravity and is fixed by the clamping limit of the V-shaped inclined surface, the monocrystalline silicon rod 3 is supported and positioned by a plurality of tangential points of the outer circular surfaces of the rollers, tool setting adjustment is very simple, and clamping operation is very convenient. Specifically, set up the bearing hole that is used for installing bearing and gyro wheel pivot on the gyro wheel, the bearing hole is blind hole structure for the gyro wheel is just like the shielding bearing of umbrella, has avoided cold cut water direct to the infringement of bearing, need not through special design, when can not increase use cost, and the protection grade has nevertheless obtained very big promotion.
In the embodiment shown in fig. 6, the silicon wafer clamping mechanism further includes a limiting wedge 28, which is located between the silicon wafer to be cut and the roller support frame, and is used for wedging the silicon wafer to be cut. In the specific use process, the monocrystalline silicon rod is firstly placed in the V-shaped corner clamping surface of the roller tool frame, then the limiting wedge block is wedged between the roller tool frame and the monocrystalline silicon rod, the limiting wedge block is propped against the clamping plate of the roller tool frame, and the monocrystalline silicon rod 3 is clamped more firmly under the action of the gravity of the monocrystalline silicon rod and the dual fixation of the limiting wedge block 28. Preferably, the limit wedge 28 and the roller are both made of plastic.
As a preferred embodiment of the invention, the included angle formed by the extension lines of the central lines of the shaft holes on the two side clamping plates 262 is 50-70 degrees, the included angle formed by the extension lines of the central lines of the two side shaft holes is 50-70 degrees, namely, the included angle between the V-shaped inclined planes is also 50-70 degrees, and the V-shaped inclined planes arranged to form the included angle are more stable for clamping the single crystal silicon rod 3 under the action of the gravity of the single crystal silicon rod 3.
As a preferred embodiment of the present invention, the roller tool frame 26 has a two-stage structure, a preset gap 29 is reserved between the two-stage roller tool frame 26, the preset gap 29 is located on the cutting working path of the wire saw cutting machine, and the preset gap 29 is located right above the yielding groove 16. The two sections of roller tool frames 26 are respectively a long-position roller tool frame 26 and a short-position roller tool frame 26, the short-position tool length is 200-400mm, the long-position tool length is 500-2000mm, the structure is very simple, the number of universal parts is large, deformation or serialization manufacturing can be carried out at any time according to the needs of customers, the weight is light, and the tool replacement is labor-saving and safe.
The invention also discloses a silicon crystal cutting machine, which is provided with the silicon crystal clamping tool, wherein the silicon crystal cutting machine is the silicon crystal clamping tool, the silicon crystal clamping tool can clamp a monocrystalline silicon rod or a polycrystalline silicon block, and the silicon crystal clamping tool has the advantages of good universality, stable and firm clamping of the silicon crystal rod and simple structure.
It should be noted that, although the foregoing embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concepts of the present invention, alterations and modifications to the embodiments described herein, or equivalent structures or equivalent flow transformations made by the present description and drawings, apply the above technical solution, directly or indirectly, to other relevant technical fields, all of which are included in the scope of the invention.
Claims (8)
1. The silicon crystal clamping tool is characterized by comprising a workbench and a silicon crystal clamping mechanism;
the workbench comprises a workbench surface, a positioning plate and a base plate, wherein the workbench surface is provided with a workbench surface, the positioning plate is vertically arranged on one side edge of the workbench surface, at least two sinking grooves are formed in the workbench surface, the base plate is arranged in the sinking grooves, the upper surface of the base plate is positioned at the same horizontal height, the workbench surface is also provided with overflow grooves, the overflow grooves are arranged around the base plate and are mutually communicated, overflow holes are formed in the overflow grooves, a yielding through groove is formed in the workbench surface, and the yielding through groove is positioned on a cutting working path of the wire saw cutting machine;
the silicon crystal clamping mechanism is arranged on the workbench surface and is used for fixing a silicon crystal bar to be cut off;
the silicon crystal clamping mechanism comprises a limit stop and a clamping mechanism;
the limit stop is fixed on the working table surface, the width of the contact surface of the limit stop and the working table surface is not smaller than the interval between the positioning plate and the base plate, and one side surface of the limit stop is abutted against the positioning plate;
the clamping mechanism comprises a swing arm assembly and an inclined slide block locking mechanism;
the swing arm assembly comprises a U-shaped swing arm seat, swing arms and a pivot shaft, coaxial holes are formed in bosses on two sides of the U-shaped swing arm seat, the pivot shaft is pivotally fixed in the coaxial holes, and the swing arms are connected with the pivot shaft so that the swing arms are linked with the pivot shaft;
the oblique sliding block locking mechanism comprises an oblique sliding block and a sliding block seat, the sliding block seat is fixedly connected with the swing arm, an outwards convex trapezoid chute is arranged on one side surface of the oblique sliding block, an inwards concave trapezoid chute matched with the outwards convex trapezoid chute is arranged on one side surface of the sliding block seat, and anti-falling lugs are further arranged at two ends of the inwards concave trapezoid chute;
the silicon crystal clamping mechanism further comprises a cam clamping mechanism, the cam clamping mechanism comprises a cam handle, a locking block, a fastening seat, a locking sliding shaft and a spring, the spring is located between the fastening seat and the locking block, one end of the locking sliding shaft sequentially penetrates through the fastening seat and the spring to be connected with the locking block, and the cam handle is connected with the other end of the locking sliding shaft.
2. The silicon wafer clamping tool according to claim 1, wherein the silicon wafer clamping mechanism further comprises a detection mechanism, the detection mechanism comprises a limit rod and a limit switch, the limit rod is arranged at one end of the pivot shaft, the pivot shaft rotates to drive the limit rod to rotate, and the limit switch is located on a path of rotation of the limit rod.
3. The silicon wafer clamping tool according to claim 1, wherein an abrasion-resistant shaft sleeve is arranged in the coaxial hole, and the abrasion-resistant shaft sleeve is positioned between the pivot shaft and the shaft hole wall of the U-shaped swing arm seat.
4. The silicon wafer clamping tool of claim 1, wherein the silicon wafer clamping mechanism comprises a roller tool frame and a roller mechanism; the roller tool frame comprises a tool platform and clamping plates fixed on two sides of the tool platform, wherein the upper end face of the clamping plates is an inclined face, a shaft hole perpendicular to the inclined face is formed in the inclined face, the roller mechanism comprises rollers, bearings and a roller rotating shaft, one end of the roller rotating shaft is fixed in the shaft hole, the other end of the roller rotating shaft is connected with the rollers in a rotating mode through the bearings, the roller mechanisms are multiple groups and are uniformly distributed on the inclined faces of the clamping plates on two sides of the tool platform, and the outer circular faces of all rollers in the roller mechanism are located at the same height to form a V-shaped corner clamping face.
5. The silicon wafer clamping tool according to claim 4, wherein the silicon wafer clamping mechanism further comprises a limiting wedge block, and the limiting wedge block is located between the silicon wafer to be cut and the roller support frame and used for wedging the silicon wafer to be cut.
6. The silicon wafer clamping tool according to claim 4, wherein an included angle formed by extension lines of central lines of shaft holes on the two side clamping plates is 50-70 degrees.
7. The silicon wafer clamping tool according to claim 4, wherein the roller tool frame is of a two-section structure, a preset gap is reserved between the two sections of roller tool frames, the preset gap is located on a cutting working running path of the wire saw cutting machine, and the preset gap is located right above the yielding through groove.
8. A silicon wafer clipper provided with a silicon wafer clamping fixture, characterized in that the silicon wafer clipper comprises the silicon wafer clamping fixture as set forth in any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810131984.5A CN108284532B (en) | 2018-02-09 | 2018-02-09 | Silicon crystal clamping tool and silicon crystal cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810131984.5A CN108284532B (en) | 2018-02-09 | 2018-02-09 | Silicon crystal clamping tool and silicon crystal cutting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108284532A CN108284532A (en) | 2018-07-17 |
| CN108284532B true CN108284532B (en) | 2023-11-24 |
Family
ID=62833041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810131984.5A Active CN108284532B (en) | 2018-02-09 | 2018-02-09 | Silicon crystal clamping tool and silicon crystal cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108284532B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4017093A1 (en) * | 1990-05-28 | 1991-12-19 | Kuno Neuhierl | Panel-sizing circular saw - is operated with roller table and lift table |
| CN101875188A (en) * | 2009-12-06 | 2010-11-03 | 天津银河阀门有限公司 | Installation fixture of press-seat butterfly valve seat |
| CN102601873A (en) * | 2012-03-28 | 2012-07-25 | 长春光华微电子设备工程中心有限公司 | Insulating padding plate for precision machine and manufacture method for insulating padding plate |
| CN203726373U (en) * | 2014-01-26 | 2014-07-23 | 梁官寿 | Wedge-caulking parallel mechanical clamp |
| CN205112114U (en) * | 2015-10-09 | 2016-03-30 | 谢琼真 | Novel engagement type unilateral stone pillar shifts up fluting device |
| CN206297021U (en) * | 2016-11-18 | 2017-07-04 | 台州市原本光电科技有限公司 | Crystal cuts or polish jade with an emery wheel block cutting machine and its crystal stone roller block securing jig |
| CN206349350U (en) * | 2017-01-04 | 2017-07-21 | 浙江晶盛机电股份有限公司 | A kind of automatic support meanss blocked for silicon single crystal rod |
| CN206832744U (en) * | 2017-05-16 | 2018-01-02 | 北京六一生物科技有限公司 | Horizontal glue-making machine |
| CN107553742A (en) * | 2017-11-06 | 2018-01-09 | 李广连 | A kind of rope saw device of concrete processing |
| CN208035030U (en) * | 2018-02-09 | 2018-11-02 | 福州天瑞线锯科技有限公司 | A kind of silicon wafer clamping tooling and silicon wafer shear |
-
2018
- 2018-02-09 CN CN201810131984.5A patent/CN108284532B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4017093A1 (en) * | 1990-05-28 | 1991-12-19 | Kuno Neuhierl | Panel-sizing circular saw - is operated with roller table and lift table |
| CN101875188A (en) * | 2009-12-06 | 2010-11-03 | 天津银河阀门有限公司 | Installation fixture of press-seat butterfly valve seat |
| CN102601873A (en) * | 2012-03-28 | 2012-07-25 | 长春光华微电子设备工程中心有限公司 | Insulating padding plate for precision machine and manufacture method for insulating padding plate |
| CN203726373U (en) * | 2014-01-26 | 2014-07-23 | 梁官寿 | Wedge-caulking parallel mechanical clamp |
| CN205112114U (en) * | 2015-10-09 | 2016-03-30 | 谢琼真 | Novel engagement type unilateral stone pillar shifts up fluting device |
| CN206297021U (en) * | 2016-11-18 | 2017-07-04 | 台州市原本光电科技有限公司 | Crystal cuts or polish jade with an emery wheel block cutting machine and its crystal stone roller block securing jig |
| CN206349350U (en) * | 2017-01-04 | 2017-07-21 | 浙江晶盛机电股份有限公司 | A kind of automatic support meanss blocked for silicon single crystal rod |
| CN206832744U (en) * | 2017-05-16 | 2018-01-02 | 北京六一生物科技有限公司 | Horizontal glue-making machine |
| CN107553742A (en) * | 2017-11-06 | 2018-01-09 | 李广连 | A kind of rope saw device of concrete processing |
| CN208035030U (en) * | 2018-02-09 | 2018-11-02 | 福州天瑞线锯科技有限公司 | A kind of silicon wafer clamping tooling and silicon wafer shear |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108284532A (en) | 2018-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112372137A (en) | Slag removal device of laser cutting machine workbench | |
| CN108284532B (en) | Silicon crystal clamping tool and silicon crystal cutting machine | |
| CN208035030U (en) | A kind of silicon wafer clamping tooling and silicon wafer shear | |
| CN201913719U (en) | Fixture used on band-sawing machine tool | |
| CN209919582U (en) | Iron and steel rust removing device for waste recovery | |
| CN214237354U (en) | Breakage-proof chip splashing device of pipe cutting machine for pipeline plugging construction | |
| CN210550278U (en) | Cutting clamping seat for abrasive wheel cutting machine | |
| CN208035040U (en) | A kind of silicon wafer clamping device and silicon wafer shear | |
| CN211841527U (en) | Clamping device convenient for workpiece fixing for grinding equipment | |
| JP3173589B2 (en) | Semiconductor ingot cutting system and cutting method | |
| CN214815275U (en) | Pipe cutting machine capable of achieving smooth cutting | |
| CN213438857U (en) | Plough quick-witted outward appearance piece processing with grinding machine anchor clamps of convenient centre gripping thin slice product a little | |
| CN218657111U (en) | Frame construction sawing machine anchor clamps | |
| CN218109553U (en) | Special clamp for processing inclined iron by belt sawing machine | |
| CN219059551U (en) | Positioning and cutting device for clothing processing | |
| CN217569981U (en) | Workpiece clamping mechanism for laser cleaning machine | |
| CN218612933U (en) | Clamp for metal processing | |
| CN214109195U (en) | Slag removal device of laser cutting machine workbench | |
| CN210997564U (en) | Quick clamping mechanism | |
| CN218190421U (en) | Surface treatment device for processing light steel structure | |
| CN213410613U (en) | Connecting device for saw blade and saw blade supporting shaft | |
| CN214925459U (en) | Blank body glaze wiping device | |
| CN213674502U (en) | Clamping structure for preventing reverse rotation of saw blade | |
| CN214350913U (en) | Machining rocker arm type clamp device | |
| CN220029616U (en) | Grinding device is used in carborundum processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |