CN108284532A - A kind of silicon wafer clamping tooling and silicon wafer shear - Google Patents
A kind of silicon wafer clamping tooling and silicon wafer shear Download PDFInfo
- Publication number
- CN108284532A CN108284532A CN201810131984.5A CN201810131984A CN108284532A CN 108284532 A CN108284532 A CN 108284532A CN 201810131984 A CN201810131984 A CN 201810131984A CN 108284532 A CN108284532 A CN 108284532A
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- China
- Prior art keywords
- silicon wafer
- wafer clamping
- swing arm
- idler wheel
- clamping device
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 143
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 143
- 239000010703 silicon Substances 0.000 title claims abstract description 143
- 230000007246 mechanism Effects 0.000 claims description 38
- 238000005520 cutting process Methods 0.000 claims description 24
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 6
- 230000002459 sustained effect Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 47
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 21
- 229920005591 polysilicon Polymers 0.000 abstract description 21
- 238000009434 installation Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 61
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The present invention relates to a kind of silicon wafer clamping tooling and silicon wafer shears, wherein the silicon wafer clamping tooling includes workbench and silicon wafer clamping device；The workbench includes job platform, positioning plate and backing plate, job platform has operation table top, the positioning plate is vertically installed in a side of operation table top, at least two deep gouges are offered on operation table top, the backing plate is set in the deep gouge, the upper surface of backing plate is located at same level height, it is additionally provided with overflow launder on operation table top, the overflow launder is arranged around backing plate, overflow launder is interconnected, spout hole is offered on overflow launder, resigning straight slot is offered on the job platform, and the silicon wafer clamping device is set on the work top.Silicon wafer clamping tooling of the present invention is simple in structure, and versatility is good, can carry out stable holding to silicon single crystal rod and polysilicon block, utilization rate of equipment and installations and height are made efficient.
Description
Technical field
The present invention relates to hard and brittle material cutting technology field more particularly to a kind of silicon wafer clamping toolings and silicon wafer shear.
Background technology
Use for silicon wafer in photovoltaic industry is very extensive.In order to meet the mass parameter of silicon crystal bar with it is lower together with work
Shape, the size of sequence and to silicon rod carry out preparatory processing, it is indispensable in photovoltaic solar cell piece process early period
Step.From cutting technique, either long line diamond wire or ring wire saw cutting machine, for seed crystal, cylindric monocrystalline
Silicon rod, cube polysilicon block block that technological parameter requirement is all similar, therefore the cutting operating mechanism (cutting machine) of equipment
It does not need to be specifically designed, but the clamping of cylindric silicon single crystal rod, cube polysilicon block, clamping tooling have not
Same job requirement.
Using existing processing technology and equipment in silicon crystal bar truncated process, because silicon single crystal rod and polysilicon block
The requirement blocked to clamping device is different, existing equipment be mostly by dedicated silicon wafer clamping device or it is special plus
Work machinery, executes monocrystalline respectively or polycrystalline blocks work, the versatility of clamping tooling is poor, and working efficiency is low, use cost
It is high；In addition, existing clamping tooling treat block crystal carry out clamping block when, can not accurately ensure that silicon crystal bar is blocking
While work top will not be damaged, and spray coolant liquid not easily collecting cause equipment corrosion even damage, or
Person's collection structure is complicated, and collecting effect is bad.
Invention content
For this reason, it may be necessary to a kind of silicon wafer clamping tooling and silicon wafer shear are provided, it is logical to solve existing silicon wafer clamping device
With property is low, use cost is high, coolant liquid not easily collecting the problem of.
To achieve the above object, inventor provide a kind of silicon wafer clamping tooling, the clamping tooling include workbench and
Silicon wafer clamping device；
The workbench includes job platform, positioning plate and backing plate, and the job platform has operation table top, the positioning
Plate is vertically installed in a side of operation table top, and at least two deep gouges, the backing plate setting are offered on the operation table top
In in the deep gouge, the upper surface of the backing plate is located at same level height, and overflow launder is additionally provided on operation table top, described to overflow
Chute is arranged around backing plate, and overflow launder is interconnected, and spout hole is offered on the overflow launder, is offered on the job platform
Resigning straight slot, the resigning straight slot, which is located at saw blade cutting machine, block on work operating path；
The silicon wafer clamping device is set on the work top, and the silicon wafer clamping device is to be blocked for fixation
Silicon crystal bar.
As a kind of preferred structure of the present invention, the silicon wafer clamping device includes limited block and clamp system；
The limited block is fixed on operation table top, and the width of limited block and work top contact surface is not less than positioning
Spacing between plate and backing plate, the one side of limited block and positioning plate against；
The clamp system includes swing arm unit and angled-lift splits retaining mechanism；
The swing arm unit includes U-shaped swing arm seat, swing arm and pivotal axis, is opened up on the boss of the U-shaped swing arm seat both sides
Have coaxial aperture, the pivotal axis is pivotable to be fixed in the coaxial aperture, the swing arm with pivot axis connection so that swing arm with
Pivotal axis links；
The angled-lift splits retaining mechanism includes angled-lift splits and take-up housing, and the take-up housing is fixedly connected with swing arm, described oblique
It is provided with the trapezoidal skewed slot of evagination on sliding block one side, is provided on the take-up housing one side and matches with the trapezoidal skewed slot of evagination
The both ends of the trapezoidal skewed slot of the indent of conjunction, the trapezoidal skewed slot of the indent are additionally provided with anticreep convex block.
As a kind of preferred structure of the present invention, the silicon wafer clamping device further includes testing agency, the testing agency
Including gag lever post and limit switch, the gag lever post is set to one end of the pivotal axis, and pivot axis drives gag lever post hair
Raw rotation, the limit switch are located on the path of gag lever post rotation.
As a kind of preferred structure of the present invention, anti-wear sleeve, the anti-wear sleeve position are provided in the coaxial aperture
Between pivotal axis and the axis hole wall of U-shaped swing arm seat.
As a kind of preferred structure of the present invention, the silicon wafer clamping device further includes cam clamping mechanism, the cam
Clamp system includes that cam handle, latch segment, fastening seat, locking slide-bar and spring, the spring are located at fastening seat and latch segment
Between, one end of the locking sliding slot sequentially passes through fastening seat, spring and latch segment and connects, the cam handle and locking slide-bar
The other end connection.
As a kind of preferred structure of the present invention, the silicon wafer clamping device includes idler wheel machine frame and idler wheel mechanism；Institute
It includes tooling platform and the clamping plate for being fixed on tooling platform both sides to state idler wheel machine frame, and the upper surface of the clamping plate is inclined-plane,
The axis hole vertical with inclined-plane is offered on the inclined-plane, the idler wheel mechanism includes idler wheel, bearing and roller wheel shaft, the idler wheel
One end of shaft is fixed in the axis hole, and the other end of roller wheel shaft is rotatablely connected by bearing and the idler wheel, the rolling
It is multigroup to take turns mechanism, is evenly distributed on the clamping plate inclined-plane of tooling platform both sides, and all idler wheels is outer in the idler wheel mechanism
Disc is in sustained height and constitutes a v-angle face.
As a kind of preferred structure of the present invention, the silicon wafer clamping device further includes limit voussoir, and limit voussoir is located at
Between silicon wafer and rolling wheel support frame to be blocked, for wedging silicon wafer to be blocked.
As a kind of preferred structure of the present invention, the extended line of the center line of the axis hole on the clamping plate of both sides is formed by angle
It is 50-70 °.
As a kind of preferred structure of the present invention, the idler wheel machine frame is two-part structure, two sections of idler wheel machine frames it
Between there are prepsetting gap, the prepsetting gap, which is located at saw blade cutting machine, block on work operating path, and prepsetting gap is located at
The surface of resigning straight slot.
Inventor also discloses a kind of silicon wafer shear, and the silicon wafer shear is provided with silicon wafer clamping tooling, the silicon
Brilliant shear is above-mentioned silicon wafer clamping tooling.
It is different from the prior art, above-mentioned technical proposal has the following advantages that：Silicon wafer clamping tooling of the present invention is in operation table top
Inlay several backing plates so that polysilicon block can be directly placed on backing plate be clamped and block, and reduce and be laid with crystal pad
Work step, improve work efficiency, while silicon single crystal rod clamping tooling also can be directly mounted on backing plate, monocrystalline silicon and polysilicon
Clamping device, which realizes, shares workbench, effectively realizes a tractor serves several purposes so that a kind of equipment can be realized two kinds and cut
It cuts, improves utilization rate of equipment and installations, in addition, overflow launder is arranged around backing plate on operation table top, structure setting is simple, you can to cutting
It cuts coolant liquid efficiently to be collected, blocking for silicon crystal bar is better.
Description of the drawings
Fig. 1 is the overlooking structure diagram of the workbench of the present embodiment silicon wafer clamping tooling；
Fig. 2 is the schematic cross-sectional view of the side view of the workbench of the present embodiment silicon wafer clamping tooling
Fig. 3 is the overlooking structure diagram that polysilicon block is clamped in the present embodiment silicon wafer clamping tooling；
Fig. 4 is the side structure schematic view that polysilicon block is clamped in the present embodiment silicon wafer clamping tooling；
Fig. 5 is the side structure schematic view that silicon single crystal rod is clamped in the present embodiment silicon wafer clamping tooling；
Fig. 6 is the overlooking structure diagram that silicon single crystal rod is clamped in the present embodiment silicon wafer clamping tooling.
Reference sign：
1, workbench；
11, job platform；111, operation table top；
12, positioning plate；
13, backing plate；
14, overflow launder；
15, spout hole；
16, resigning straight slot；
2, silicon wafer clamping device；
21, limited block；
221, U-shaped swing arm seat；222, swing arm；223, pivotal axis；224, anti-wear sleeve；
231, angled-lift splits；232, take-up housing；
241, gag lever post；242, limit switch；
251, cam handle；252, latch segment；253, seat is fastened；254, slide-bar is locked；255, spring；
26, idler wheel machine frame；261, tooling platform；262, clamping plate；
27, idler wheel mechanism；
28, voussoir is limited；
29, prepsetting gap；
3, silicon single crystal rod；
4, polysilicon block；
5, direction is blocked.
Specific implementation mode
For the technology contents of technical solution, construction feature, the objects and the effects are described in detail, below in conjunction with specific reality
It applies example and attached drawing is coordinated to be explained in detail.
It please refers to Fig.1 to Fig. 6, the present invention provides a kind of silicon wafer clamping tooling, the clamping tooling includes 1 He of workbench
Silicon wafer clamping device；
As depicted in figs. 1 and 2, the workbench 1 in the present embodiment on the one hand as monocrystalline silicon clamping device or
The installation of polysilicon clamping device, support platform, it is on the other hand also flat as the collection of saw blade cutting machine spraying cooling liquid, discharge
Platform.Its concrete structure is：The workbench 1 includes job platform 11, positioning plate 12 and backing plate 13, and the job platform 11 has
Operation table top 111, the positioning plate 12 are vertically installed in a side of operation table top 111, and backing plate is installed on operation table top 111
13, backing plate 13 directly accommodates mechanism with silicon wafer or silicon crystal bar contacts, and it is heavy that at least two are offered on the operation table top 111
Slot, the backing plate 13 are set in the deep gouge, and the upper surface of the backing plate 13 is located at same level height, to prevent being pressed from both sides by silicon wafer
Holding the silicon crystal bar of mechanism clamping prevents injustice, and when carrying out blocking work, there is a situation where shakes to cause truncation surface is uneven to occur, excellent
Choosing, the upper surface of backing plate 13 is located at same level height and is slightly above operation table top 111, prevents job platform from being made to silicon wafer material
At quality impact because silicon wafer and ferrous material are in direct contact, ferrous material very likely carry contains magnetic conductivity
Substance leads to the complication of silicon chip magnetic field edge effect, to influence the quality of battery.Preferably, the backing plate can be modeling
Backing strap plate or aluminium alloy backing plate preferably use nylon66 fiber, can also prevent silicon wafer material surface from being scratched.Described determines
Position plate 12 is used to, against the silicon wafer clamping device, be positioned for the installation of silicon wafer clamping device, prevent its deviated line sawing
Cutting mill operating path.Overflow launder 14 is additionally provided on operation table top 111, the overflow launder 14 is arranged around backing plate 13, overflow launder
14 are interconnected, and spout hole 15 are offered on the overflow launder 14, it is cold to saw blade cutting machine that the overflow launder 14 acts on collection
But the cooling water cleaned, prevents cooling water from arbitrarily splashing out, and causes clamping tooling corrosion or circuit is caused to damage, and the overflow
Slot 14 is simple in structure, makes easy to use.Resigning straight slot 16 is offered on the job platform 11, the resigning straight slot 16 is located at
Saw blade cutting machine block on work operating path, and the resigning straight slot 16 is cut as saw blade cutting machine in progress silicon crystal bar
The working path passed through when cutting, can control line saw cutting machine to the cut-off efficiency of silicon crystal bar, and workbench 1 will not be caused
Damage.Preferably, the locating piece is two pieces, is located at the both sides of resigning straight slot 16.
The silicon wafer clamping device is set on 1 face of the workbench, and the silicon wafer clamping device waits blocking for fixation
Silicon crystal bar.Silicon wafer clamping device can carry out silicon crystal bar the clamping of stabilization, prevent silicon crystal bar from being trembled in truncated process
It is dynamic, the appearance of wavy surface is caused, the quality of silicon crystal bar is influenced.
Silicon wafer clamping tooling of the present invention is in several backing plates of operation table top inlaid so that polysilicon block can be directly placed at
Clamping is carried out on backing plate to block, and is reduced the work step for being laid with crystal pad, is improved work efficiency, while silicon single crystal rod clamping tooling
Also it can be directly mounted on backing plate, monocrystalline silicon and polysilicon clamping device are realized and shared to workbench, are effectively realized
A tractor serves several purposes so that two kinds of cuttings can be realized in a kind of equipment, improve utilization rate of equipment and installations, in addition, overflow launder is set around backing plate
It sets on operation table top, structure setting is simple, you can cutting coolant liquid is efficiently collected, silicon crystal bar blocks effect more
It is good.
Fig. 3 and Fig. 4 are please referred to, as a preferred embodiment of the present invention, the silicon wafer clamping device is as more silicon wafers
The clamping device of stick, the silicon wafer clamping device include limited block 21 and clamp system；
An abutment plate of the limited block 21 as more silicon crystal bars, a side for treating the more silicon crystal bars blocked
Face carries out, against limit, being then clamped locking being matched for clamping tightly mechanism, the limited block 21 is fixed on operation table top 111
On, not less than the spacing between positioning plate 12 and backing plate 13, purpose exists the width of 1 face contact surface of limited block 21 and workbench
In making 4 side of polysilicon block be fully located on backing plate 13 converted products is in direct contact to prevent polysilicon block 4 and job platform
Quality is affected, the one side of limited block 21 and positioning plate 12 against.Preferably, the limited block 21 is plastics material
Matter.
The clamp system includes 222 component of swing arm and angled-lift splits retaining mechanism；222 component of swing arm is as tiltedly sliding
Block locking mechanism drives stock, drives the movement of angled-lift splits retaining mechanism to realize the clamping to more silicon crystal bars.222 groups of the swing arm
Part includes U-shaped swing arm seat 221, swing arm 222 and pivotal axis 223, is offered on the boss of 221 both sides of U-shaped swing arm seat coaxial
Hole, the pivotal axis 223 is pivotable to be fixed in the coaxial aperture, and the swing arm 222 is connect with pivotal axis 223 so that pendulum
Arm 222 links with pivotal axis 223；In the particular embodiment, the U-shaped swing arm seat 221 is detachably connected by screw, Tenon etc.
The mode of connecing is fixed on 1 face of workbench, and the swing arm 222 is connect with pivotal axis 223, swing arm 222 rotation drive pivotal axis 223 around
Pivotal axis 223 and the junction of U-shaped swing arm seat 221 are rotated.
The angled-lift splits retaining mechanism includes angled-lift splits 231 and take-up housing 232, and the take-up housing 232 is fixed with swing arm 222
Connection is provided with the trapezoidal skewed slot of evagination on 231 one side of the angled-lift splits, be provided on 232 one side of the take-up housing with
The trapezoidal skewed slot of the matched indent of trapezoidal skewed slot of evagination, it is convex that the both ends of the trapezoidal skewed slot of the indent are additionally provided with anticreep
Block.The rotation of the swing arm 222 drives the take-up housing 232 to rotate so that the trapezoidal skewed slot of 232 indent of take-up housing is slided with oblique
The trapezoidal skewed slot of evagination on block 231 coordinates so that and angled-lift splits retaining mechanism is clamped or loosens to polysilicon block 4,
In specific embodiment, when 232 indent of take-up housing trapezoidal skewed slot on the outside of be skewed slot flash, 231 evagination of angled-lift splits it is trapezoidal
When the inside of skewed slot is the flash of skewed slot, swing arm 222 is rotated clockwise at this time, take-up housing 232 is driven to rotate clockwise, and is realized more
The clamping of crystal silicon block 4 rotates counterclockwise the release that polysilicon block 4 is realized in swing arm 222；When the trapezoidal skewed slot of 232 indent of take-up housing
Outside is that the low side of skewed slot rotates clockwise pendulum at this time when the inside of the trapezoidal skewed slot of 231 evagination of angled-lift splits is the low side of skewed slot
Arm 222 drives take-up housing 232 to rotate clockwise, and realizes the release of polysilicon block 4, rotates counterclockwise swing arm 222 and realizes polysilicon
The clamping of block 4, clamping mode are simple, firm.
In a preferred embodiment, the silicon wafer clamping device further includes testing agency, and the testing agency includes limit
Bar 241 and limit switch 242, the gag lever post 241 are set to one end of the pivotal axis 223, and the rotation of pivotal axis 223 drives limit
Position bar 241 rotates, and the limit switch 242 is located on the path of the rotation of gag lever post 241.Limit switch 242 is used as scroll saw
The safe start stop switch of cutting machine, when gag lever post 241 is against limit switch 242, limit switch 242 starts, at this time saw blade cutting
Machine can not carry out blocking work.Preferably, the limit switch 242 coordinates with angled-lift splits retaining mechanism so that in polysilicon block 4
When in clamped condition, saw blade cutting machine can carry out blocking work, and when angled-lift splits retaining mechanism is in relaxation state,
Be connected to the gag lever post 241 of 223 one end of pivotal axis just against limit switch 242 when limit switch 242 be in open state,
Operation lack of standardization is prevented completely, work safety, more silicon crystal bar processing qualities are good.
As a preferred embodiment of the present invention, anti-wear sleeve 224, the wear-resisting shaft are provided in the coaxial aperture
Set 224 is between pivotal axis 223 and the axis hole wall of U-shaped swing arm seat 221.The use of the anti-wear sleeve 224 is to prevent pivot
Shaft 223 or U-shaped swing arm seat 221 are worn, and the service life of the two is reduced.In preferably embodiment, the pendulum
It is additionally provided with wear-resistant gasket between arm 222 and U-shaped swing arm seat 221.
Referring to Fig. 3, as in a preferred embodiment of the present invention, the silicon wafer clamping device further includes that cam clamps
Mechanism, the cam clamping mechanism include cam handle 251, latch segment 252, fastening seat 253, locking slide-bar 254 and spring
255, the spring 255 is located between fastening seat 253 and latch segment 252, and one end of the locking sliding slot sequentially passes through fastening seat
253, spring 255 is connect with latch segment 252, and the cam handle 251 is connect with the other end of locking slide-bar 254.In this implementation
In example, spring 255 is set between fastening seat 253 and latch segment 252, because spring 255 will keep its extended configuration, is carried
The elastic force of confession unanimously oppress latch segment 252 to polycrystal silicon rod against so that polycrystal silicon rod is constantly in clamping and turns state；When
When needing to unclamp more silicon crystal bars, cam handle 251 is pulled so that 252 compressed spring 255 of latch segment, spring 255 keep compression shape
State.In a preferred embodiment, described one end for fastening seat 253 connection and baffle so that cam clamping mechanism is slided with oblique
Block locking mechanism realizes integration locking, realizes the dual locking of more silicon crystal bars, and very simple in operation, operating personnel no longer need to
Nonmetallic weight is moved to be clamped.The position swing arm 222 of adjustment so that after retaining mechanism is decontroled, workbench only needs on 1 face
Processing or the polysilicon block that has processed, without other sundries, when operation, does not have to worry to collide with, securely and reliably.
Fig. 5 and Fig. 6 are please referred to, as another preferred embodiment of the present invention, the silicon wafer clamping device is for pressing from both sides
Silicon single crystal rod 3 is held, the silicon wafer clamping device includes idler wheel machine frame 26 and idler wheel mechanism 27；The idler wheel machine frame 26 includes
The upper surface of tooling platform 261 and the clamping plate 262 for being fixed on 261 both sides of tooling platform, the clamping plate 262 is inclined-plane, described
The axis hole vertical with inclined-plane is offered on inclined-plane, the idler wheel mechanism 27 includes idler wheel, bearing and roller wheel shaft, and the idler wheel turns
One end of axis is fixed in the axis hole, and the other end of roller wheel shaft is rotatablely connected by bearing and the idler wheel, the idler wheel
Mechanism 27 is multigroup, is evenly distributed on 262 inclined-plane of clamping plate of 261 both sides of tooling platform, is owned in the idler wheel mechanism 27
The periphery of idler wheel is in sustained height and constitutes a v-angle face.The idler wheel machine frame 26 as idler wheel mechanism 27 with
And the supporting mechanism of silicon single crystal rod 3, the periphery of all idler wheels is in the V-type of sustained height composition in the idler wheel mechanism 27
Direct contact surface of the angle face as silicon single crystal rod 3, silicon single crystal rod 3 are placed on the v-angle face, and single silicon crystal bar is at its own
V-type inclined-plane is absorbed under the action of gravity, engaging limit by V-type inclined-plane fixes, and silicon single crystal rod 3 there are several point of contacts of idler wheel periphery
Support positioning, very simple to knife adjustment, clamp operation is also very convenient.Specifically, being offered on idler wheel for installing bearing
With the bearing hole of roller wheel shaft, the bearing hole is blind hole structure so that screen bearing of the idler wheel as umbrella avoids cold cut
Water directly to the infringement of bearing, needs not move through special designing, and while will not increase use cost, degree of protection but obtains
Significant increase.
In embodiment as shown in FIG. 6, the silicon wafer clamping device further includes limit voussoir 28, and limit voussoir, which is located at, to be waited cutting
Break between silicon wafer and rolling wheel support frame, for wedging silicon wafer to be blocked.In the specific use process, silicon single crystal rod is first placed in rolling
Take turns machine frame v-angle face in, then will limit voussoir wedging idler wheel machine frame and silicon single crystal rod between, limit voussoir against
In on the clamping plate of idler wheel machine frame, in single silicon crystal bar in the effect of its own gravity and under limiting the dual fixation of voussoir 28,
Silicon single crystal rod 3 is clamped more secured.Preferably, the limit voussoir 28 and idler wheel are plastic material.
As a preferred embodiment of the present invention, the extended line of the center line of the axis hole on both sides clamping plate 262 is formed
Angle be 50-70 °, it is the face folder between 50-70 i.e. V-type inclined-plane that the extended line of the center line of both sides axis hole, which is formed by angle,
Angle is also 50-70 °, is arranged to the V-type inclined-plane of this angle, under the action of 3 its own gravity of silicon single crystal rod, to silicon single crystal rod 3
Clamping more stablize.
As a preferred embodiment of the present invention, the idler wheel machine frame 26 is two-part structure, two sections of idler wheel toolings
There are prepsetting gap 29 between frame 26, the prepsetting gap 29, which is located at saw blade cutting machine, block on work operating path, in advance
If gap 29 is located at the surface of resigning straight slot 16.Two sections of idler wheel machine frames 26 are respectively long 26 He of position idler wheel machine frame
Short position idler wheel machine frame 26, short position tooling length is in 200-400mm, and for long position tooling length in 500-2000mm, structure is very simple,
Versatility part is more, can be deformed at any time according to client or seriation manufactures, and light-weight, replacement tooling is laborsaving and pacifies
Entirely.
The invention also discloses a kind of silicon wafer shear, the silicon wafer shear is provided with silicon wafer clamping tooling, the silicon
Brilliant shear is silicon wafer clamping tooling of the present invention, and silicon single crystal rod or polysilicon block, institute can be clamped in the silicon wafer clamping tooling
State that silicon wafer clamping tooling versatility is good, stable to the clamping of silicon crystal bar, securely, advantage simple in structure.
It should be noted that although the various embodiments described above have been described herein, it is not intended to limit
The scope of patent protection of the present invention.Therefore, based on the present invention innovative idea, to embodiment described herein carry out change and repair
Change, or using equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it directly or indirectly will be with
Upper technical solution is used in other related technical areas, is included within the scope of patent protection of the present invention.
Claims (10)
1. a kind of silicon wafer clamping tooling, which is characterized in that the clamping tooling includes workbench and silicon wafer clamping device；
The workbench includes job platform, positioning plate and backing plate, and there is the job platform operation table top, the positioning plate to hang down
It is directly set in a side of operation table top, at least two deep gouges is offered on the operation table top, the backing plate is set to institute
It states in deep gouge, the upper surface of the backing plate is located at same level height, and overflow launder, the overflow launder are additionally provided on operation table top
It is arranged around backing plate, overflow launder is interconnected, and spout hole is offered on the overflow launder, resigning is offered on the job platform
Straight slot, the resigning straight slot, which is located at saw blade cutting machine, block on work operating path；
The silicon wafer clamping device is set on the work top, and the silicon wafer clamping device is for fixed silicon wafer to be blocked
Stick.
2. silicon wafer clamping tooling according to claim 1, which is characterized in that the silicon wafer clamping device includes limited block
And clamp system；
The limited block is fixed on operation table top, the width of limited block and work top contact surface not less than positioning plate with
Spacing between backing plate, the one side of limited block and positioning plate against；
The clamp system includes swing arm unit and angled-lift splits retaining mechanism；
The swing arm unit includes U-shaped swing arm seat, swing arm and pivotal axis, is offered on the boss of the U-shaped swing arm seat both sides same
Axis hole, the pivotal axis is pivotable to be fixed in the coaxial aperture, the swing arm and pivot axis connection so that swing arm and pivot
Axis links；
The angled-lift splits retaining mechanism includes angled-lift splits and take-up housing, and the take-up housing is fixedly connected with swing arm, the angled-lift splits
It is provided with the trapezoidal skewed slot of evagination on one side, is provided on the take-up housing one side matched with the trapezoidal skewed slot of evagination
The both ends of the trapezoidal skewed slot of indent, the trapezoidal skewed slot of the indent are additionally provided with anticreep convex block.
3. silicon wafer clamping tooling according to claim 2, which is characterized in that the silicon wafer clamping device further includes detection machine
Structure, the testing agency include gag lever post and limit switch, and the gag lever post is set to one end of the pivotal axis, pivots shaft rotation
Dynamic that gag lever post is driven to rotate, the limit switch is located on the path of gag lever post rotation.
4. silicon wafer clamping tooling according to claim 2, which is characterized in that be provided with wear-resisting shaft in the coaxial aperture
Set, the anti-wear sleeve are located between pivotal axis and the axis hole wall of U-shaped swing arm seat.
5. silicon wafer clamping tooling according to claim 2, which is characterized in that the silicon wafer clamping device further includes cam folder
Tight mechanism, the cam clamping mechanism include that cam handle, latch segment, fastening seat, locking slide-bar and spring, the spring are located at
It fastens between seat and latch segment, one end of the locking sliding slot sequentially passes through fastening seat, spring and latch segment and connects, the cam
Handle is connect with the other end of locking slide-bar.
6. silicon wafer clamping tooling according to claim 1, which is characterized in that the silicon wafer clamping device includes idler wheel tooling
Frame and idler wheel mechanism；The idler wheel machine frame includes tooling platform and the clamping plate for being fixed on tooling platform both sides, the clamping plate
Upper surface be inclined-plane, offer the axis hole vertical with inclined-plane on the inclined-plane, the idler wheel mechanism includes idler wheel, bearing and rolling
Shaft is taken turns, one end of the roller wheel shaft is fixed in the axis hole, and the other end of roller wheel shaft passes through bearing and the idler wheel
Rotation connection, the idler wheel mechanism is multigroup, and is evenly distributed on the clamping plate inclined-plane of tooling platform both sides, the roller machine
The periphery of all idler wheels is in sustained height and constitutes a v-angle face in structure.
7. silicon wafer clamping tooling according to claim 6, which is characterized in that the silicon wafer clamping device further includes limit wedge
Block, limit voussoir is between silicon wafer to be blocked and rolling wheel support frame, for wedging silicon wafer to be blocked.
8. silicon wafer clamping tooling according to claim 6, which is characterized in that the center line of the axis hole on the clamping plate of both sides prolongs
It is 50-70 ° that long line, which is formed by angle,.
9. silicon wafer clamping tooling according to claim 6, which is characterized in that the idler wheel machine frame is two-part structure,
There are prepsetting gap between two sections of idler wheel machine frames, the prepsetting gap, which is located at saw blade cutting machine, to carry out blocking work operating path
On, prepsetting gap is located at the surface of resigning straight slot.
10. a kind of silicon wafer shear, the silicon wafer shear is provided with silicon wafer clamping tooling, which is characterized in that the silicon wafer is cut
Off line includes silicon wafer clamping tooling described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810131984.5A CN108284532B (en) | 2018-02-09 | 2018-02-09 | Silicon crystal clamping tool and silicon crystal cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810131984.5A CN108284532B (en) | 2018-02-09 | 2018-02-09 | Silicon crystal clamping tool and silicon crystal cutting machine |
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| CN108284532A true CN108284532A (en) | 2018-07-17 |
| CN108284532B CN108284532B (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810131984.5A Active CN108284532B (en) | 2018-02-09 | 2018-02-09 | Silicon crystal clamping tool and silicon crystal cutting machine |
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|---|---|
| CN108284532B (en) | 2023-11-24 |
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