CN108257892B - 真空腔室和真空腔室的门的上锁方法 - Google Patents
真空腔室和真空腔室的门的上锁方法 Download PDFInfo
- Publication number
- CN108257892B CN108257892B CN201711458470.2A CN201711458470A CN108257892B CN 108257892 B CN108257892 B CN 108257892B CN 201711458470 A CN201711458470 A CN 201711458470A CN 108257892 B CN108257892 B CN 108257892B
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- Prior art keywords
- opening
- door
- container
- doors
- vacuum chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016254685 | 2016-12-28 | ||
JP2016-254685 | 2016-12-28 | ||
JP2017238256A JP7023097B2 (ja) | 2016-12-28 | 2017-12-13 | 真空チャンバおよび真空チャンバの扉の施錠方法 |
JP2017-238256 | 2017-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108257892A CN108257892A (zh) | 2018-07-06 |
CN108257892B true CN108257892B (zh) | 2022-01-25 |
Family
ID=62845191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711458470.2A Active CN108257892B (zh) | 2016-12-28 | 2017-12-28 | 真空腔室和真空腔室的门的上锁方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7023097B2 (ja) |
KR (1) | KR102100018B1 (ja) |
CN (1) | CN108257892B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1925111A (zh) * | 2005-09-02 | 2007-03-07 | 东京毅力科创株式会社 | 真空腔室和真空处理装置 |
US20090186569A1 (en) * | 2008-01-18 | 2009-07-23 | Seiko Epson Corporation | Semiconductor device manufacturing apparatus and manufacturing method |
US20150311042A1 (en) * | 2014-04-29 | 2015-10-29 | Psk Inc. | Substrate treating apparatus |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3044507B2 (ja) * | 1992-05-11 | 2000-05-22 | 株式会社名機製作所 | 大型真空プレスの安全装置 |
JP4049281B2 (ja) * | 1997-10-28 | 2008-02-20 | 株式会社日立国際電気 | 基板処理装置 |
JP2001326162A (ja) | 2000-05-17 | 2001-11-22 | Canon Inc | 半導体製造装置および半導体デバイス製造方法 |
JP2006093258A (ja) | 2004-09-22 | 2006-04-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP4518285B2 (ja) | 2008-01-18 | 2010-08-04 | セイコーエプソン株式会社 | 半導体デバイスの製造装置 |
KR101598176B1 (ko) * | 2010-03-30 | 2016-02-26 | 주식회사 원익아이피에스 | 진공챔버 |
JP6196890B2 (ja) | 2013-11-21 | 2017-09-13 | 東京エレクトロン株式会社 | 蓋部材開閉機構及び基板検査装置 |
-
2017
- 2017-12-13 JP JP2017238256A patent/JP7023097B2/ja active Active
- 2017-12-26 KR KR1020170179357A patent/KR102100018B1/ko active IP Right Grant
- 2017-12-28 CN CN201711458470.2A patent/CN108257892B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1925111A (zh) * | 2005-09-02 | 2007-03-07 | 东京毅力科创株式会社 | 真空腔室和真空处理装置 |
US20090186569A1 (en) * | 2008-01-18 | 2009-07-23 | Seiko Epson Corporation | Semiconductor device manufacturing apparatus and manufacturing method |
US20150311042A1 (en) * | 2014-04-29 | 2015-10-29 | Psk Inc. | Substrate treating apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP7023097B2 (ja) | 2022-02-21 |
CN108257892A (zh) | 2018-07-06 |
JP2018110219A (ja) | 2018-07-12 |
KR20180077056A (ko) | 2018-07-06 |
KR102100018B1 (ko) | 2020-04-10 |
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