CN108257892B - 真空腔室和真空腔室的门的上锁方法 - Google Patents

真空腔室和真空腔室的门的上锁方法 Download PDF

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Publication number
CN108257892B
CN108257892B CN201711458470.2A CN201711458470A CN108257892B CN 108257892 B CN108257892 B CN 108257892B CN 201711458470 A CN201711458470 A CN 201711458470A CN 108257892 B CN108257892 B CN 108257892B
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China
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opening
door
container
doors
vacuum chamber
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Chinese (zh)
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CN108257892A (zh
Inventor
富田尚宏
伊藤毅
浅川正人
末木英人
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201711458470.2A 2016-12-28 2017-12-28 真空腔室和真空腔室的门的上锁方法 Active CN108257892B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016254685 2016-12-28
JP2016-254685 2016-12-28
JP2017238256A JP7023097B2 (ja) 2016-12-28 2017-12-13 真空チャンバおよび真空チャンバの扉の施錠方法
JP2017-238256 2017-12-13

Publications (2)

Publication Number Publication Date
CN108257892A CN108257892A (zh) 2018-07-06
CN108257892B true CN108257892B (zh) 2022-01-25

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CN201711458470.2A Active CN108257892B (zh) 2016-12-28 2017-12-28 真空腔室和真空腔室的门的上锁方法

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JP (1) JP7023097B2 (ja)
KR (1) KR102100018B1 (ja)
CN (1) CN108257892B (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1925111A (zh) * 2005-09-02 2007-03-07 东京毅力科创株式会社 真空腔室和真空处理装置
US20090186569A1 (en) * 2008-01-18 2009-07-23 Seiko Epson Corporation Semiconductor device manufacturing apparatus and manufacturing method
US20150311042A1 (en) * 2014-04-29 2015-10-29 Psk Inc. Substrate treating apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3044507B2 (ja) * 1992-05-11 2000-05-22 株式会社名機製作所 大型真空プレスの安全装置
JP4049281B2 (ja) * 1997-10-28 2008-02-20 株式会社日立国際電気 基板処理装置
JP2001326162A (ja) 2000-05-17 2001-11-22 Canon Inc 半導体製造装置および半導体デバイス製造方法
JP2006093258A (ja) 2004-09-22 2006-04-06 Hitachi Kokusai Electric Inc 基板処理装置
JP4518285B2 (ja) 2008-01-18 2010-08-04 セイコーエプソン株式会社 半導体デバイスの製造装置
KR101598176B1 (ko) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 진공챔버
JP6196890B2 (ja) 2013-11-21 2017-09-13 東京エレクトロン株式会社 蓋部材開閉機構及び基板検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1925111A (zh) * 2005-09-02 2007-03-07 东京毅力科创株式会社 真空腔室和真空处理装置
US20090186569A1 (en) * 2008-01-18 2009-07-23 Seiko Epson Corporation Semiconductor device manufacturing apparatus and manufacturing method
US20150311042A1 (en) * 2014-04-29 2015-10-29 Psk Inc. Substrate treating apparatus

Also Published As

Publication number Publication date
JP7023097B2 (ja) 2022-02-21
CN108257892A (zh) 2018-07-06
JP2018110219A (ja) 2018-07-12
KR20180077056A (ko) 2018-07-06
KR102100018B1 (ko) 2020-04-10

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