CN108193182A - A kind of three-dimensional Sputting film-plating apparatus - Google Patents
A kind of three-dimensional Sputting film-plating apparatus Download PDFInfo
- Publication number
- CN108193182A CN108193182A CN201810159056.XA CN201810159056A CN108193182A CN 108193182 A CN108193182 A CN 108193182A CN 201810159056 A CN201810159056 A CN 201810159056A CN 108193182 A CN108193182 A CN 108193182A
- Authority
- CN
- China
- Prior art keywords
- agitated kettle
- vacuum cavity
- dimensional
- plating apparatus
- sputtering target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Abstract
The invention discloses a kind of three-dimensional Sputting film-plating apparatus, including vacuum cavity, magnetron sputtering target assembly and agitated kettle, magnetron sputtering target assembly is arranged on the top of vacuum cavity, agitated kettle is arranged on the bottom of vacuum cavity, agitated kettle opening is opposite with magnetron sputtering target assembly, and agitating paddle is provided in agitated kettle.The outer surface entirety uniform coated of the materials such as the present invention achievable ball, cylinder, tetrahedron, hexahedron.
Description
Technical field
The present invention relates to a kind of three-dimensional Sputting film-plating apparatus, belong to magnetron sputtering field.
Background technology
Sputter coating is a kind of common coating technique, existing most commonly magnetron sputtering plating, traditional magnetic control
Sputting film-plating apparatus can only realize the uniform coated of two dimensional surface, for materials such as some balls, cylinder, tetrahedron, hexahedrons
The outer surface entirety uniform coated of material can not also be realized.
Invention content
In order to solve the above technical problem, the present invention provides a kind of three-dimensional Sputting film-plating apparatus.
In order to achieve the above object, the technical solution adopted in the present invention is：
A kind of three-dimensional Sputting film-plating apparatus, including vacuum cavity, magnetron sputtering target assembly and agitated kettle, magnetron sputtering target assembly
The top of vacuum cavity is arranged on, agitated kettle is arranged on the bottom of vacuum cavity, agitated kettle opening and magnetron sputtering target assembly phase
It is right, agitating paddle is provided in agitated kettle.
Magnetron sputtering target assembly includes at least a magnetic controlled sputtering target, if a magnetic controlled sputtering target, then the magnetron sputtering
The central axis of target with vacuum cavity top central axis on same straight line, if multiple magnetic controlled sputtering targets, then these magnetic
Control sputtering target is distributed in using vacuum cavity top center as on the circle in the center of circle, and the center of all magnetic controlled sputtering targets is uniformly distributed
On the same circumference.
Agitating paddle is arranged on the central axis of agitated kettle, and bottom centre's axis of agitating paddle bottom end and agitated kettle connects, stirring
Paddle bottom end is connect by transmission shaft with the driving device outside vacuum cavity.
Agitated kettle is arc agitated kettle.
Agitating paddle includes agitating shaft and the blade being arranged on agitating shaft side wall.
Agitated kettle is fixed by stent and vacuum cavity bottom, and the bottom of agitated kettle is provided with several stabilizer blades, and stent is fixed
In vacuum cavity bottom, it is provided on stent and is embedded in groove with the matched groove of stabilizer blade, stabilizer blade.
All stabilizer blades are uniformly distributed on the same circumference.
The advantageous effect that the present invention is reached：The outer surface of the materials such as the present invention achievable ball, tetrahedron, hexahedron is whole
Body uniform coated.
Description of the drawings
Fig. 1 is the result schematic diagram of the present invention.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.Following embodiment is only used for clearly illustrating the present invention
Technical solution, and be not intended to limit the protection scope of the present invention and limit the scope of the invention.
As shown in Figure 1, a kind of three-dimensional Sputting film-plating apparatus, including vacuum cavity 1, magnetron sputtering target assembly 2 and stirring
Pot 3.
Magnetron sputtering target assembly 2 is arranged on the top of vacuum cavity 1, and magnetron sputtering target assembly 2 includes at least a magnetic control
Sputtering target, if a magnetic controlled sputtering target, then the central axis of the magnetic controlled sputtering target with 1 top central axis of vacuum cavity same
On straight line, if multiple magnetic controlled sputtering targets, then these magnetic controlled sputtering targets are distributed in using 1 top center of vacuum cavity as the center of circle
Circle on, and the center of all magnetic controlled sputtering targets is uniformly distributed on the same circumference.Three magnetic controls is set to splash under normal circumstances
It shoots at the target.
Agitated kettle 3 is arc agitated kettle 3, and agitated kettle 3 fixed by stent and 1 bottom of vacuum cavity, the opening of agitated kettle 3 and
Magnetron sputtering target assembly 2 is opposite, and the bottom of agitated kettle 3 is provided with several stabilizer blades 7, and all stabilizer blades 7 are evenly distributed on same circumference
On, stent 8 is fixed on 1 bottom of vacuum cavity, is provided on stent 8 and is embedded in groove with 7 matched groove of stabilizer blade, stabilizer blade 7, is
Guarantee agitated kettle 3 is stablized, and stabilizer blade 7 is no less than three, and stabilizer blade 7 is polygon cylinder.Agitating paddle, edge are provided in agitated kettle 3
The central axis setting of agitated kettle 3, agitating paddle include agitating shaft 4 and the blade 5 being arranged on 4 side wall of agitating shaft, agitating paddle bottom
Bottom centre's axis with agitated kettle 3 is held to connect, agitating paddle bottom end is connect by transmission shaft 6 with the driving device outside vacuum cavity 1,
Driving device uses motor.
The course of work of above device is：Above device is installed, plating membrane sample is put into agitated kettle 3, vacuum cavity 1
Base vacuum is evacuated to, and is filled with argon gas and prepares plated film, while magnetic controlled sputtering target is opened, starting motor turns agitating paddle
It is dynamic, the plated membrane sample in agitated kettle 3 is stirred, it can by the sputter rate for controlling motor rotation speed and magnetic controlled sputtering target
To realize the uniform coated of each outer surface of plated sample.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvement and deformation can also be made, these are improved and deformation
Also it should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of three-dimensional Sputting film-plating apparatus, it is characterised in that：Including vacuum cavity, magnetron sputtering target assembly and agitated kettle,
Magnetron sputtering target assembly is arranged on the top of vacuum cavity, and agitated kettle is arranged on the bottom of vacuum cavity, agitated kettle opening and magnetic
It is opposite to control sputter target assemblies, agitating paddle is provided in agitated kettle.
2. a kind of three-dimensional Sputting film-plating apparatus according to claim 1, it is characterised in that：Magnetron sputtering target assembly at least wraps
Include a magnetic controlled sputtering target, if a magnetic controlled sputtering target, then the central axis of the magnetic controlled sputtering target at the top of vacuum cavity in
Mandrel line is on same straight line, and if multiple magnetic controlled sputtering targets, then these magnetic controlled sputtering targets are distributed in at the top of vacuum cavity
Center is on the circle in the center of circle, and the center of all magnetic controlled sputtering targets is uniformly distributed on the same circumference.
3. a kind of three-dimensional Sputting film-plating apparatus according to claim 1, it is characterised in that：Agitating paddle is arranged on agitated kettle
On central axis, bottom centre's axis of agitating paddle bottom end and agitated kettle connects, and agitating paddle bottom end passes through outside transmission shaft and vacuum cavity
The driving device connection in portion.
4. a kind of three-dimensional Sputting film-plating apparatus according to claim 1 or 3, it is characterised in that：Agitated kettle is stirred for arc
Pot.
5. a kind of three-dimensional Sputting film-plating apparatus according to claim 1 or 3, it is characterised in that：Agitating paddle includes agitating shaft
With the blade being arranged on agitating shaft side wall.
6. a kind of three-dimensional Sputting film-plating apparatus according to claim 1, it is characterised in that：Agitated kettle passes through stent and vacuum
Cavity bottom is fixed, and the bottom of agitated kettle is provided with several stabilizer blades, and stent is fixed on vacuum cavity bottom, be provided on stent with
The matched groove of stabilizer blade, stabilizer blade is in groove.
7. a kind of three-dimensional Sputting film-plating apparatus according to claim 6, it is characterised in that：All stabilizer blades are evenly distributed on together
On one circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810159056.XA CN108193182A (en) | 2018-02-26 | 2018-02-26 | A kind of three-dimensional Sputting film-plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810159056.XA CN108193182A (en) | 2018-02-26 | 2018-02-26 | A kind of three-dimensional Sputting film-plating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108193182A true CN108193182A (en) | 2018-06-22 |
Family
ID=62593703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810159056.XA Pending CN108193182A (en) | 2018-02-26 | 2018-02-26 | A kind of three-dimensional Sputting film-plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108193182A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114774875A (en) * | 2022-04-22 | 2022-07-22 | 武汉联影医疗科技有限公司 | Film coating device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1670241A (en) * | 2005-03-03 | 2005-09-21 | 西华大学 | Method and device for producing membrane on magnetic refrigeration material surface |
| JP2007204784A (en) * | 2006-01-31 | 2007-08-16 | Bridgestone Corp | Particle coating method and particle coating apparatus |
| CN101296857A (en) * | 2005-10-26 | 2008-10-29 | 株式会社P&I | Method and device for reparing powder on which nano metal, alloy, and ceramic particles are uniformly vacuum-deposited |
| CN103103481A (en) * | 2011-11-09 | 2013-05-15 | 东莞市长凌电子材料有限公司 | Multi-arc magnetic control ion plating equipment |
| KR101828311B1 (en) * | 2016-08-10 | 2018-02-12 | 주식회사 테토스 | Sputtering method for a electrical conductive particle, and electrical conductive particle formed by the same |
| CN207958488U (en) * | 2018-02-26 | 2018-10-12 | 苏州求是真空电子有限公司 | A kind of three-dimensional Sputting film-plating apparatus |
-
2018
- 2018-02-26 CN CN201810159056.XA patent/CN108193182A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1670241A (en) * | 2005-03-03 | 2005-09-21 | 西华大学 | Method and device for producing membrane on magnetic refrigeration material surface |
| CN101296857A (en) * | 2005-10-26 | 2008-10-29 | 株式会社P&I | Method and device for reparing powder on which nano metal, alloy, and ceramic particles are uniformly vacuum-deposited |
| JP2007204784A (en) * | 2006-01-31 | 2007-08-16 | Bridgestone Corp | Particle coating method and particle coating apparatus |
| CN103103481A (en) * | 2011-11-09 | 2013-05-15 | 东莞市长凌电子材料有限公司 | Multi-arc magnetic control ion plating equipment |
| KR101828311B1 (en) * | 2016-08-10 | 2018-02-12 | 주식회사 테토스 | Sputtering method for a electrical conductive particle, and electrical conductive particle formed by the same |
| CN207958488U (en) * | 2018-02-26 | 2018-10-12 | 苏州求是真空电子有限公司 | A kind of three-dimensional Sputting film-plating apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114774875A (en) * | 2022-04-22 | 2022-07-22 | 武汉联影医疗科技有限公司 | Film coating device |
| CN114774875B (en) * | 2022-04-22 | 2024-01-19 | 武汉联影医疗科技有限公司 | Coating device |
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Effective date of registration: 20220222 Address after: 310024 room 414, building 3, Hejing business center, Gudang street, Xihu District, Hangzhou, Zhejiang Applicant after: Hangzhou bifanke Electronic Technology Co.,Ltd. Address before: 215300 Building 1, 232 Yuanfeng Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: SUZHOU ADVANCED VACUUM ELECTRONIC EQUIPMENT CO.,LTD. |
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