CN108138004A - Stress dispersion membrane, optical component and electronic component - Google Patents

Stress dispersion membrane, optical component and electronic component Download PDF

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Publication number
CN108138004A
CN108138004A CN201680058899.XA CN201680058899A CN108138004A CN 108138004 A CN108138004 A CN 108138004A CN 201680058899 A CN201680058899 A CN 201680058899A CN 108138004 A CN108138004 A CN 108138004A
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Prior art keywords
weight
methyl
adhesive composition
stress dispersion
dispersion membrane
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Granted
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CN201680058899.XA
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CN108138004B (en
Inventor
佐佐木翔悟
徐创矢
设乐浩司
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to CN201810824492.4A priority Critical patent/CN109181561B/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2475/00—Presence of polyurethane
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    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
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    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a kind of stress dispersion membrane with excellent stress dispersibility.Additionally, it is provided a kind of optical component, electronic component for having such stress dispersion membrane.The stress dispersion membrane of the present invention includes the laminated body of plastic foil and adhesive phase, wherein, press-in energy when applying load from the plastic foil of the laminated body laterally direction vertical with the laminated body is more than 260 μ J.

Description

Stress dispersion membrane, optical component and electronic component
Technical field
The present invention relates to a kind of stress dispersion membrane, the optical component for having the stress dispersion membrane, electronic components.
Background technology
In order to using the touch panel of LCD (liquid crystal display), lens section, the electronic machine of camera The optical components such as device, electronic component assign rigidity, impact resistance, there is a situation where expose surface side be fitted with adhesiveness film (for example, Patent document 1).Such adhesiveness film usually has substrate layer and adhesive phase.
When in assembling, processing, conveying when, when of use etc. is under various situations, sometimes because pressing-in force is to as described above Optical component, electronic component bring load, optical component occur, the problem of electronic component damages due to suffered load.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2014-234460 bulletins
Invention content
Problem to be solved by the invention
Problem of the present invention is that provide a kind of stress dispersion membrane with excellent stress dispersibility.In addition, it is to carry For a kind of optical component, electronic component for having such stress dispersion membrane.
Solution to the problem
The stress dispersion membrane of the present invention includes the laminated body of plastic foil and adhesive phase, wherein,
Press-in energy when applying load from the plastic foil of the laminated body laterally direction vertical with the laminated body is 260 More than μ J.
In one embodiment, the thickness of above-mentioned plastic foil is 4 μm~500 μm.
In one embodiment, the thickness of above-mentioned adhesive phase is 1 μm~300 μm.
In one embodiment, above-mentioned adhesive phase is formed by adhesive composition, which includes polymerization Object (A), above-mentioned polymer (A) is with from (methyl) propylene of the alkyl with carbon atom number 1~20 as alkylester moieties The monomeric unit (I) of acid alkyl ester and have from intramolecular OH bases and/or COOH bases (methyl) acrylate monomer list First (II).
In one embodiment, a mole content ratio for the NCO bases in above-mentioned adhesive composition is set as [NCO], it will A mole content ratio for epoxy group in the adhesive composition is set as [EPOXY], by the OH bases in the adhesive composition Mole content ratio is set as [OH], when a mole content ratio for the COOH bases in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+[COOH]) ＜ 0.05.
In one embodiment, above-mentioned adhesive composition includes organic polyisocyanates class crosslinking agents more than 2 functions And/or epoxies crosslinking agent.
In one embodiment, above-mentioned adhesive composition includes polymer (B), and above-mentioned polymer (B) has from logical The monomeric unit and weight average molecular weight of (methyl) acrylate of the structure containing ester ring type shown in formula (1) are more than 1000 and small In 30000,
CH2=C (R1)COOR2···(1)
In general formula (1), R1For hydrogen atom or methyl, R2For the alkyl with ester ring type structure.
In one embodiment, loss angle tangent of the above-mentioned adhesive phase in -40 DEG C~150 DEG C of entire temperature range Value tan δ are more than 0.10.
The optical component of the present invention has above-mentioned stress dispersion membrane.
The electronic component of the present invention has above-mentioned stress dispersion membrane.
The effect of invention
According to the present invention, it is possible to provide a kind of stress dispersion membrane with excellent stress dispersibility.In addition, it is possible to provide a kind of Have optical component, the electronic component of such stress dispersion membrane.
Description of the drawings
Fig. 1 is the schematic cross-sectional view of the stress dispersion membrane of one embodiment of the present invention.
Fig. 2 is the schematic cross-sectional view of the stress dispersion membrane of another embodiment of the present invention.
Symbol description
10 plastic foils
20 adhesive phases
100 stress dispersion membranes
Specific embodiment
In the case of in the present specification there are the expression of so-called " (methyl) acrylic acid ", it is meant that " acrylic acid and/or first Base acrylic acid ", in the case of the expression there are so-called " (methyl) acrylate ", it is meant that " acrylate and/or metering system Acid esters ".In addition, in the case of in the present specification there are the expression of so-called " weight ", can also replace with as expression weight SI systems unit and usual " quality ".
In the case of in the present specification there are the expression of so-called " monomeric unit (A) for coming from (a) ", monomeric unit (A) It is the structural unit that unsaturated double-bond possessed by monomer (a) is formed by polymerizeing scission of link.It should be noted that so-called insatiable hunger The structural unit formed with double bond by polymerizeing scission of link refers to that (Rp, Rq, Rr, Rs are with list for the structure of " RpRqC=CRrRs " Any appropriate group that the form of key is bonded with carbon atom) unsaturated double-bond " C=C " formed by polymerizeing scission of link "-RpRqC-CRrRs- " structural unit.
In the present specification, the content ratio of the monomeric unit in polymer can for example pass through the various structures of the polymer It analyzes (such as NMR etc.) and learns.In addition, even if without various structural analyses as described above, manufacture can also will be based on The content ratio for the monomeric unit from the various monomers that the usage amount of used various monomers calculates is made during polymer Content ratio for the monomeric unit in polymer.It that is, can be by certain list in used total monomer ingredient when manufacturing polymer Content ratio of the content ratio of body (m) as the monomeric unit from monomer (m) in the polymer.
《《A. stress dispersion membrane》》
The stress dispersion membrane of the present invention includes the laminated body of plastic foil and adhesive phase.Plastic foil both can be 1 layer, also may be used Think 2 layers or more.Adhesive phase both can be 1 layer, or 2 layers or more.
Fig. 1 is the schematic cross-sectional view of the stress dispersion membrane of one embodiment of the present invention.In Fig. 1, stress of the invention Dispersion membrane 100 is made of plastic foil 10 and the laminated body of adhesive phase 20.Though it is not shown in Fig. 1, the surface of adhesive phase 20 Any appropriate strong adhesive linkage can also be equipped with.
Fig. 2 is the schematic cross-sectional view of the stress dispersion membrane of another embodiment of the present invention.In fig. 2, it is of the invention should Power dispersion membrane 100 is made of adhesive phase 20, plastic foil 10 and adhesive phase 20, has adhesive phase 20, modeling by following sequences Expect film 10 and adhesive phase 20.That is, in fig. 2, stress dispersion membrane 100 of the invention is by adhesive phase 20, plastic foil 10 and glues The laminated body of mixture layer 20 is formed.Though not shown in Fig. 2, can also be equipped on the surface of unilateral or both sides adhesive phase 20 Any appropriate strong adhesive linkage.
In the case of the mode exposed in adhesive phase as outermost layer, can also arbitrary conjunction be set in the exposing surface side Suitable separator (stripping film).
The stress dispersion membrane of the present invention laterally hangs down from plastic foil and the plastic foil of the laminated body of adhesive phase with the laminated body Press-in energy when applying load on straight direction is more than 260 μ J.The assay method of above-mentioned press-in energy is as described later.It is above-mentioned Press-in energy is preferably the μ J of 260 μ J~10000, the μ J of more preferably 270 μ J~9000 μ J, further preferably 280 μ J~8000, The μ J of particularly preferably 290 μ J~7000.Due to above-mentioned press-in energy within the above range, it can provide a kind of with excellent The stress dispersion membrane of stress dispersibility.
The thickness of plastic foil is preferably 4 μm~500 μm, more preferably 10 μm~400 μm, further preferably 15 μm~ 350 μm, particularly preferably 20 μm~300 μm.Due to plastic foil thickness within the above range, can provide a kind of has more The stress dispersion membrane of excellent stress dispersibility.
The thickness of adhesive phase is preferably 1 μm~300 μm, more preferably 2 μm~250 μm, further preferably 4 μm~ 200 μm, particularly preferably 5 μm~150 μm.Due to adhesive phase thickness within the above range, can provide one kind has The stress dispersion membrane of superior stress dispersibility.
As plastic foil, any appropriate plastic foil can be used within the scope of the effect of the invention.In this way Compressive strength of the plastic foil for example under ASTM D695 be preferably 100Kg/cm2~3000Kg/cm2, more preferably 200Kg/ cm2~2900Kg/cm2, further preferably 300Kg/cm2~2800Kg/cm2, particularly preferably 400Kg/cm2~2700Kg/ cm2.As such plastic foil, specifically, can for example enumerate：Polyester resin, polyolefin resin, polyamide-based tree Fat, polyimide based resin etc..As polyester resin, such as can enumerate：Polyethylene terephthalate, poly- terephthaldehyde Sour butanediol ester, polyethylene naphthalate etc..As polyolefin resin, such as can enumerate：The homopolymer of olefinic monomer, Copolymer of olefinic monomer etc..As polyolefin resin, specifically, can for example enumerate：Homo-polypropylene；By ethylene into being allocated as Propylene copolymers for the block class of combined polymerization ingredient, Random Copolymer, grafting class etc.；Reactor TPO；Low-density, high density, line The polyvinyls such as property low-density, extremely-low density；Ethylene-propylene copolymer, vinyl-vinyl acetate copolymer, ethylene-the third E pioic acid methyl ester copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-methyl methacrylate are common Ethene copolymers such as polymers, ethylene methyl methacrylate copolymer etc..
Plastic foil can contain any appropriate additive as needed.As the additive contained in plastic foil, such as It can enumerate：Antioxidant, ultra-violet absorber, light stabilizer, antistatic agent, filler, pigment etc..Contain in plastic foil Type, the quantity of additive can suitably be set according to purpose.
As adhesive phase, any appropriate adhesive phase can be used within the scope of the effect of the invention. As such adhesive phase, such as can enumerate：The adhesive phase that is formed by acrylic adhesives, by rubber adhesive shape Into adhesive phase, the adhesive phase formed by silicone adhesive category, the adhesive that is formed by carbamates adhesive Layer etc..
Adhesive phase is preferably formed by adhesive composition.
Be coated on any appropriate base material for adhesive phase, such as by adhesive composition, as needed into Row drying, forms adhesive phase on base material.Then, when base material is removed, then adhesive phase is obtained.In addition, for example pass through by Adhesive composition is coated on any appropriate plastic foil, is dried as needed, forms adhesive phase on the plastic film, Residual plastic film in this state, so as to obtain the stress dispersion membrane comprising adhesive phase and plastic foil.In addition, for example pass through by Adhesive composition is coated on any appropriate base material, is dried as needed, and adhesive phase is formed on base material, will be shelled The adhesive phase obtained from base material is placed in plastic foil, so as to obtain the stress dispersion membrane comprising adhesive phase and plastic foil.Separately Outside, it such as by the way that adhesive composition is coated on any appropriate base material, is dried, is formed on base material as needed The adhesive phase formed on base material is transferred to plastic foil by adhesive phase, so as to obtain comprising adhesive phase and plastic foil should Power dispersion membrane.
As the coating method of adhesive composition, such as can enumerate：Roller coating, reversely intaglio plate coating, coating, roller brush, spray Painting, utilizes the extrusion coated etc. of the progress such as die coating machine at air knife coating method.
Such adhesive composition preferably comprises polymer (A), and above-mentioned polymer (A) is with from carbon atom number 1~20 alkyl has OH as the monomeric unit (I) of (methyl) alkyl acrylate of alkylester moieties and from intramolecular The monomeric unit (II) of (methyl) acrylate of base and/or COOH bases.
The content ratio of above-mentioned polymer (A) in adhesive composition is preferably the weight of 80 weight %~100 %, more excellent It is selected as the weight % of 85 weight %~100, further preferably 90 weight %~100 weight %, particularly preferably 92.5 weight % The weight % of~100 weight %, most preferably 95 weight %~100.Due to containing for above-mentioned polymer (A) in adhesive composition It is proportional within the above range, therefore a kind of stress dispersion membrane with superior stress dispersibility can be provided.
Polymer (A) is with from (methyl) acrylic acid of the alkyl with carbon atom number 1~20 as alkylester moieties The monomeric unit (I) of Arrcostab.In polymer (A) from the alkyl with carbon atom number 1~20 as alkylester moieties The monomeric unit (I) of (methyl) alkyl acrylate both can be only a kind, or two or more.
In polymer (A) from (methyl) acrylic acid of the alkyl with carbon atom number 1~20 as alkylester moieties The content ratio of the monomeric unit (I) of Arrcostab is preferably the weight % of 90 weight %~99.5, more preferably 91 weight %~99 The weight % of weight %, further preferably 92 weight %~98.5 weight %, particularly preferably 93 weight %~98.2, most preferably For the weight % of 94 weight %~98.In polymer (A) from the alkyl with carbon atom number 1~20 as alkylester moieties The content ratio of the monomeric unit (I) of (methyl) alkyl acrylate within the above range, therefore can provide a kind of with more excellent The stress dispersion membrane of different stress dispersibility.
As (methyl) alkyl acrylate of the alkyl with carbon atom number 1~20 as alkylester moieties, such as can It enumerates：(methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) n-butyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) isobutyl acrylate, (methyl) Hexyl 2-propenoate, (methyl) acrylic acid 2- ethyl hexyls Ester, (methyl) n-octyl, (methyl) Isooctyl acrylate monomer, the positive nonyl ester of (methyl) acrylic acid, the different nonyl of (methyl) acrylic acid Ester, the positive last of the ten Heavenly stems ester of (methyl) acrylic acid, (methyl) isodecyl acrylate, (methyl) acrylic acid n-dodecane base ester, (methyl) propylene Sour n-tridecane base ester, (methyl) n-myristyl base ester etc..
Polymer (A) is with the monomeric unit from (methyl) acrylate of intramolecular with OH bases and/or COOH bases (II).The monomeric unit (II) of (methyl) acrylate from intramolecular with OH bases and/or COOH bases in polymer (A) Both it can be only a kind, or two or more.Due to polymer (A) with from intramolecular with OH bases and/or COOH bases A kind of monomeric unit (II) of (methyl) acrylate, it is possible to provide stress dispersion membrane with superior stress dispersibility.
The monomeric unit of (methyl) acrylate from intramolecular with OH bases and/or COOH bases in polymer (A) (II) content ratio is preferably the weight % of 0.5 weight %~10, the weight % of more preferably 1 weight %~9, further preferably The weight % of 1.5 weight %~8 weight %, particularly preferably 1.8 weight %~7 weight %, most preferably 2 weight %~6.Due to Monomeric unit (II's) of (methyl) acrylate from intramolecular with OH bases and/or COOH bases in polymer (A) contains It is proportional within the above range, it is possible to provide a kind of stress dispersion membrane with superior stress dispersibility.
As intramolecular there is (methyl) acrylate of OH bases, such as can enumerate：(methyl) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid 2- hydroxy propyl esters, (methyl) acrylic acid 4- hydroxybutyls, the own ester of (methyl) acrylic acid 6- hydroxyls, (methyl) third Olefin(e) acid 8- hydroxyls monooctyl ester, (methyl) acrylic acid 10- hydroxyls last of the ten Heavenly stems ester, (methyl) acrylic acid 12- hydroxylaurics ester, (4- methylol rings Hexyl) methyl acrylate, N- methylols (methyl) acrylamide, vinyl alcohol, allyl alcohol, 2- hydroxyethyl vinyls ethers, 4- hydroxyl butyl Vinethene, diethylene glycol monovinyl ether etc..
As intramolecular there is (methyl) acrylate of COOH bases, such as can enumerate：(methyl) acrylic acid, (methyl) third Olefin(e) acid hydroxy methacrylate, (methyl) dihydroxypropyl pentyl ester, itaconic acid, maleic acid, fumaric acid, butenoic acid, methacrylate etc..
Polymer (A) can also have the monomeric unit (III) from other monomers.Coming from polymer (A) is other The monomeric unit (III) of monomer both can be only a kind, or two or more.
As other monomers, such as can enumerate：Cyano-containing monomer, vinyl acetate monomer, aromatic vinyl monomer, amide-containing Monomer, monomer containing imide, emulsion stability, containing epoxy based monomers, vinyl ether monomers, N- acryloyl morpholines, list containing sulfo group Body, phosphorous acid-based monomers, monomer containing anhydride group etc..
In adhesive composition, a mole content ratio for the NCO bases in the adhesive composition is set as [NCO], by this A mole content ratio for epoxy group in adhesive composition is set as [EPOXY], by rubbing for the OH bases in the adhesive composition You are set as [OH] at content ratio, when a mole content ratio for the COOH bases in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+[COOH]) ＜ 0.05.Since ([NCO]+[EPOXY])/([OH]+[COOH]) is in above-mentioned model It encloses, therefore a kind of stress dispersion membrane with superior stress dispersibility can be provided.It should be noted that it is combined in adhesive There is no in the case of NCO bases in object, [NCO]=0, there is no in the case of epoxy group in adhesive composition, [EPOXY]= 0.That is, the lower limiting value of ([NCO]+[EPOXY])/([OH]+[COOH]) is 0.
Adhesive composition preferably comprises organic polyisocyanates class crosslinking agents and/or epoxies crosslinking more than 2 functions Agent.The organic polyisocyanates class crosslinking agents and/or epoxies more than 2 functions that may include in the adhesive composition of the present invention Crosslinking agent both can be only a kind, or two or more.
More than above-mentioned 2 function organic polyisocyanates class crosslinking agent and epoxies crosslinking agent in adhesive composition Total content ratio is preferably the parts by weight of 0.001 parts by weight~0.4 relative to 100 parts by weight of polymer (A), and more preferably 0.0025 The parts by weight of parts by weight~0.3, the parts by weight of further preferably 0.005 parts by weight~0.2, particularly preferably 0.0075 parts by weight~ The parts by weight of 0.15 parts by weight, most preferably 0.01 parts by weight~0.1.Due to above-mentioned 2 official in the adhesive composition of the present invention Total content ratio of more than energy organic polyisocyanates class crosslinking agent and epoxies crosslinking agent is relative to 100 weight of polymer (A) It measures part within the above range, therefore a kind of stress dispersion membrane with superior stress dispersibility can be provided.
As organic polyisocyanates class crosslinking agents more than 2 functions, such as can enumerate：Tetramethylene diisocyanate, six The lower aliphatics Polyisocyanate esters such as methylene diisocyanate；Cyclopentylene diisocyanate, cyclohexylidene diisocyanate The alicyclic isocyanates class such as ester, isophorone diisocyanate；2,4 toluene diisocyanate, 4,4'- diphenyl methanes two The aromatic isocyanates class such as isocyanates, xylylene diisocyanate；Trimethylolpropane-toluene di-isocyanate(TDI) trimerization Object addition product (for example, Japanese polyurethane industrial group manufactures, trade name " Coronate L ") ,-six methylene of trimethylolpropane Group diisocyanate trimer addition product (for example, Japanese polyurethane industrial group manufactures, trade name " Coronate HL "), six The isocyanuric acid ester (for example, Japanese polyurethane industrial group manufactures, trade name " Coronate HX ") of methylene diisocyanate Wait isocyanate addition products etc..
As epoxies crosslinking agent, such as can enumerate：Bisphenol-A, the epoxylite of epichlorohydrin type, ethylene glycidol Ether, polyethyleneglycol diglycidylether, glycerin diglycidyl ether, T 55,1,6-HD glycidol Ether, trihydroxymethylpropanyltri diglycidyl ether, 2-glycidyl aniline, diamines glycidyl amine, N, N, N', N'- tetra- shrink sweet Oil base m-xylene diamine (for example, gas chemical company of Mitsubishi manufactures, trade name " TETRAD-X "), 1,3- are bis-, and (N, N- bis- shrinks Glyceramine methyl) hexamethylene (for example, gas chemical company of Mitsubishi manufactures, trade name " TETRAD-C ") etc..
Adhesive composition can also include polymer (B), and above-mentioned polymer (B), which has, carrys out containing shown in self-drifting (1) The monomeric unit of (methyl) acrylate of ester ring type structure, weight average molecular weight for 1000 less than 30000,
CH2=C (R1)COOR2···(1)
In general formula (1), R1For hydrogen atom or methyl, R2For the alkyl with ester ring type structure.
Polymer (B) both can be only a kind, or two or more.
The weight average molecular weight of polymer (B) is preferably 1000~30000, and more preferably 1250~25000, further preferably It is 1500~20000, particularly preferably 1750~15000, most preferably 2000~10000.Due to dividing equally for polymer (B) again Son amount within the above range, therefore even if increasing the amount of crosslinking agent, can also provide a kind of with superior stress dispersibility Stress dispersion membrane.
The content ratio of polymer (B) in adhesive composition is preferably 0.5 relative to 100 parts by weight of polymer (A) The parts by weight of parts by weight~50, the parts by weight of more preferably 1 parts by weight~45, the parts by weight of further preferably 2 parts by weight~40, especially The parts by weight of preferably 3 parts by weight~35, the parts by weight of most preferably 4 parts by weight~30.Due to the polymer in adhesive composition (B) content ratio relative to 100 parts by weight of polymer (A) within the above range, therefore even if increase crosslinking agent amount, also may be used To provide a kind of stress dispersion membrane with superior stress dispersibility.
The monomeric unit of (methyl) acrylate for carrying out the structure containing ester ring type shown in self-drifting (1) in polymer (B) Content ratio be preferably the weight % of 40 weight %~99.5, the weight % of more preferably 42.5 weight %~99, further preferably For the weight % of 45 weight %~98.5, the weight % of particularly preferably 47.5 weight %~98, most preferably 50 weight %~97.5 Weight %.Due to the monomer list of (methyl) acrylate for carrying out the structure containing ester ring type shown in self-drifting (1) in polymer (B) Within the above range, therefore even if increasing the amount of crosslinking agent, can also provide one kind has superior answer to the content ratio of member The stress dispersion membrane of power dispersibility.
As (methyl) acrylate of the structure containing ester ring type shown in above-mentioned general formula (1), such as can enumerate：(methyl) third Olefin(e) acid cyclohexyl, the bicyclic pentyl ester of (methyl) acrylic acid, methacrylic acid Bicvclopentyl oxygroup ethyl ester, acrylic acid Bicvclopentyl oxygroup Ethyl ester, methacrylic acid tricyclic pentyl ester, acrylic acid tricyclic pentyl ester, methacrylic acid 1- adamantane esters, acrylic acid 1- adamantane Base ester, methacrylic acid 2- methyl -2- adamantane esters, acrylic acid 2- methyl -2- adamantane esters, methacrylic acid 2- second Base -2- adamantane esters, acrylic acid 2- ethyl -2- adamantane esters etc..
Polymer (B) can also have the monomeric unit (IV) from other monomers.Other lists are come from polymer (B) The monomeric unit (IV) of body both can be only a kind, or two or more.
As the other monomers that may include in polymer (B), such as can enumerate：(methyl) methyl acrylate, (methyl) third Olefin(e) acid ethyl ester, (methyl) n-butyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) propylene Sour isobutyl ester, (methyl) Hexyl 2-propenoate, (methyl) 2-EHA, (methyl) n-octyl, (methyl) third The different monooctyl ester of olefin(e) acid, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, the positive last of the ten Heavenly stems ester of (methyl) acrylic acid, (methyl) third Olefin(e) acid isodecyl ester, (methyl) acrylic acid n-dodecane base ester, (methyl) acrylic acid n-tridecane base ester, (methyl) acrylic acid positive ten Tetraalkyl ester, acrylic acid, methacrylic acid, carboxy ethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, fourth Olefin(e) acid, methacrylate etc..
Polymer (A), polymer (B) can not damage the present invention effect range by any appropriate method and Manufacture.As such manufacturing method, such as can enumerate：Polymerisation in solution, emulsion polymerization, bulk polymerization, suspension polymerisation, photopolymerization (active energy ray polymerization) etc..In these manufacturing methods, from the viewpoint of cost, productivity, preferably polymerisation in solution.It obtains Polymer (A) can be any one of random copolymer, block copolymer, alternate copolymer, graft copolymer etc..It obtains Polymer (B) can be random copolymer, block copolymer, alternate copolymer, graft copolymer etc..
As the method for polymerisation in solution, such as it can enumerate and monomer component, polymerization initiator etc. are dissolved in solvent, heat Make its polymerization, so as to obtain method of polymer solution etc..
Heating temperature when polymerizeing as the heating in polymerisation in solution, such as 50 DEG C~90 DEG C can be enumerated.Gather as solution Heating time in conjunction, such as can enumerate 1 hour~24 hours.
It, can within the scope of the effect of the invention, using arbitrary as the solvent used in polymerisation in solution Suitable solvent.As such solvent, such as can enumerate：Toluene, benzene, dimethylbenzene etc. are aromatic hydrocarbon；Ethyl acetate, acetic acid The esters such as N-butyl；The aliphatic hydrocarbons such as n-hexane, normal heptane；The ester ring types hydro carbons such as hexamethylene, hexahydrotoluene；Methyl ethyl ketone, Organic solvents such as the ketones such as methyl iso-butyl ketone (MIBK) etc..Solvent both can be only a kind, or two or more.
Polymer (A), polymer (B) manufacture in, can be used polymerization initiator.Such polymerization initiator both can be only It is a kind, or two or more.As such polymerization initiator, such as can enumerate：2,2'- azodiisobutyronitriles, 2,2'- Azo two (2- amidine propanes) dihydrochloride, 2,2'- azos two [2- (5- methyl -2- imidazoline -2- bases) propane] dihydrochloride, 2,2'- azos two (2- methyl amidine) dithionate, 2,2'- azos two (N, N'- dimethyl isobutyl amidine), two [N- of 2,2'- azos (2- carboxyethyls) -2- methyl amidine] azo-initiators such as hydrate (and Guang Chun medicines company manufacture, VA-057)；Potassium peroxydisulfate, mistake The persulfates such as ammonium sulfate；Dicetyl peroxydicarbonate two (2- ethylhexyls) ester, dicetyl peroxydicarbonate two (4- tert-butylcyclohexyls) Ester, peroxide-butyl carbonate, new peroxide tert-butyl caprate, talkyl peropivalate, peroxidating pivalic acid uncle Butyl ester, dilauroyl peroxide, two positive decoyl of peroxidating, peroxidating 2 ethyl hexanoic acid 1,1,3,3- tetramethyls butyl ester, peroxidating Two (4- toluyls), dibenzoyl peroxide, tert-butyl peroxyisobutyrate, 1,1- bis- (tertiary hexyl peroxide) hexamethylene, uncle The peroxide type initiators such as butylhydroperoxide, hydrogen peroxide；The combination of persulfate and sodium hydrogensulfite, peroxide with Combination of sodium ascorbate etc., the redox type initiators for combining peroxide with reducing agent etc..
For the usage amount of polymerization initiator, arbitrary conjunction can be used within the scope of the effect of the invention Suitable usage amount.As such usage amount, such as relative to 100 parts by weight of monomer component, the weight of preferably 0.01 parts by weight~5 Measure part.
Polymer (A), polymer (B) manufacture in, can be used chain-transferring agent.Such chain-transferring agent both can be only 1 Kind, or two or more.As such chain-transferring agent, such as can enumerate：Lauryl mercaptan, glycidyl mercaptan, mercapto Guanidine-acetic acid, 2 mercapto ethanol, thioglycolic acid, Methyl mercaptoacetate, thioglycolic acid 2- ethylhexyls, 2,3- dimercaptos- 1- propyl alcohol etc..
It, can be within the scope of the effect of the invention using any appropriate for the usage amount of chain-transferring agent Usage amount.As such usage amount, such as relative to 100 parts by weight of monomer component, the weight of preferably 0.01 parts by weight~5 Part.
Polymer (A), polymer (B) manufacture in, can be used be typically used for the other any appropriate of polymerisation Additive.
The adhesive composition of the present invention can also include crosslinking catalyst.As crosslinking catalyst, can not damage Any appropriate crosslinking catalyst is used in the range of the effect of the present invention.As such crosslinking catalyst, such as can enumerate： The metals classes such as tetra-n-butyl titanate, tetraisopropyl titanate, ferric acetyl acetonade, butyl tin oxide, dioctyl tin cinnamic acid tin are crosslinked Catalyst (particularly tin class crosslinking catalyst) etc..Crosslinking catalyst both can be only a kind, or two or more.
For the usage amount of crosslinking catalyst, arbitrary conjunction can be used within the scope of the effect of the invention Suitable usage amount.As such usage amount, such as relative to 100 parts by weight of monomer component, preferably 0.001 parts by weight~ 0.05 parts by weight.
Adhesive composition can also contain any appropriate other additions within the scope of the effect of the invention Agent.As such other additives, such as can enumerate：Silane coupling agent, delayed crosslinker, emulsifier, colorant, pigment etc. Powder, surfactant, plasticizer, adhesiveness imparting agent, surface lubricant, levelling agent, softening agent, antioxidant, is prevented dyestuff Aging agent, light stabilizer, ultra-violet absorber, polymerization inhibitor, inorganic filler, organic filler, metal powder, particle shape, foil-like Object etc..Such other additives both can be only a kind, or two or more.
Loss tangent tan δ of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range be preferably 0.10 with On.By make above-mentioned loss tangent tan δ of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range for 0.10 with On, it is possible to provide a kind of stress dispersion membrane with superior stress dispersibility.It should be noted that above-mentioned loss tangent The assay method of tan δ is as described later.
The upper limit of above-mentioned loss tangent tan δ of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range is excellent 2.40 are selected as hereinafter, more preferably 2.20 hereinafter, further preferably 2.00 hereinafter, particularly preferably less than 1.80.By making The upper limit of above-mentioned loss tangent tan δ is within the above range, it is possible to provide a kind of stress with superior stress dispersibility Dispersion membrane.
The lower limit of above-mentioned loss tangent tan δ of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range is excellent It is selected as more than 0.12, more preferably more than 0.14, further preferably more than 0.16, particularly preferably more than 0.18.By making The lower limit of above-mentioned loss tangent tan δ is within the above range, it is possible to provide a kind of stress with superior stress dispersibility Dispersion membrane.
《《C. optical component, electronic component》》
The stress dispersion membrane of the present invention has excellent stress dispersibility.Therefore, can suitably be used as protecting optics structure Part, electronic component be not by the protection materials for the purpose of external impact etc..That is, the optical component of the present invention has the present invention Stress dispersion membrane.In addition, the electronic component of the present invention has the stress dispersion membrane of the present invention.
Embodiment
Hereinafter, the present invention is concretely demonstrated by embodiment, but the present invention is not limited to these embodiments.It needs It is noted that experiment in embodiment etc. and evaluation method is as follows described.It should be noted that in the situation for being recorded as " part " Under, it is recorded as long as no special, that is, refers to " parts by weight ", in the case where being recorded as " % ", recorded, that is, refer to as long as no special " weight % ".
The measure ＞ of ＜ weight average molecular weight
The weight average molecular weight (Mw) of polymer is carried out using the GPC devices (HLC-8220GPC) that TOSOH Co., Ltd manufactures It measures.It should be noted that weight average molecular weight (Mw) is obtained by polystyrene scaled value.
Determination condition is as follows.
Sample solution concentration：0.2 weight % (THF solution)
Sample injection rate：10 μ l eluents
THF flow velocitys：0.6ml/min
Measuring temperature：40℃
Sample slug：TSKguardcolumn SuperHZ-H (1)+TSKgel SuperHZM-H (2)
Reference column：TSKgel SuperH-RC (1)
Detector：Differential refractometer (RI)
The making ＞ of ＜ bonding sheets (A)
(embodiment 1,3,5,7,9,11,13,15,17,19,21,23,25,26, comparative example 1,3,5,7)
Obtained adhesive composition is coated on using fountain roll by gathering in a manner that dried thickness becomes 10 μm The base material " Lumirror S10 " (50 μm of thickness, Toray manufacture) that ester resin is formed, in 130 DEG C of drying temperature, drying Between under conditions of 30 seconds, cure simultaneously dry.In this way, adhesive phase is made on base material.Next, it is pasted on the surface of adhesive phase The organosilicon process face of the base material being made of polyester resin of 25 μm of the thickness of organosilicon processing is implemented together in another side, is obtained Bonding sheet (A).
(embodiment 2,4,6,8,10,12,14,16,18,20,22,24, comparative example 2,4,6,8)
Obtained adhesive composition is coated on using fountain roll by gathering in a manner that dried thickness becomes 22 μm The base material " Lumirror S10 " (38 μm of thickness, Toray manufacture) that ester resin is formed, in 130 DEG C of drying temperature, drying Between under conditions of 30 seconds, cure simultaneously dry.In this way, adhesive phase is made on base material.Next, it is pasted on the surface of adhesive phase The organosilicon process face of the base material being made of polyester resin of 25 μm of the thickness of organosilicon processing is implemented together in another side, is obtained Bonding sheet (A).
＜ is pressed into the measure ＞ of energy
" the SAICASDN-20 types " manufactured using Daipla Wintes companies, in measuring temperature：25 DEG C, press-in speed：5 μm/sec under, according to following sequences, calculate press-in energy.
(sequence 1)
The adhesive phase side of obtained bonding sheet (A) is pasted on flat pressure head (load detecting side), with spherical indenter from The substrate side press-in of the bonding sheet (A) of above-mentioned flat pressure head is pasted on, calculates compression distance (μ when detecting the load of 20N m)。
(sequence 2)
The adhesive phase side of obtained bonding sheet (A) is pasted on glass slide, with spherical indenter from being pasted on above-mentioned load glass Substrate side (load detecting side) press-in of the bonding sheet (A) of piece, is pressed into the compression distance being obtained into sequence 1.
Normal load suffered by spherical indenter is set as y=f (x) (x：Compression distance) when, it is calculated using following formula to viscous (r is the adhesive phase side application to bonding sheet (A) to press-in energy W (μ J) until closing the adhesive phase side application 20N of piece (A) The compression distance during load of 20N).
[mathematical expression 1]
The making ＞ of ＜ bonding sheets (B)
Obtained adhesive composition in a manner that dried thickness becomes 50 μm using fountain roll is coated on and is passed through Organosilicon is to the polyester film (trade name of 38 μm of thickness after single side progress lift-off processing：MRF, polyester Co., Ltd. of Mitsubishi Chemical Manufacture) lift-off processing face, under conditions of 130 DEG C of drying temperature, 3 minutes drying times, cure simultaneously dry.In this way, in base Adhesive phase is made on material.Next, on the surface of adhesive phase, so that the lift-off processing face of the film becomes adhesive phase side Mode, cladding is by organosilicon to the polyester film (trade name of 38 μm of thickness after single side progress lift-off processing：MRF, Mitsubishi Chemical Polyester Co., Ltd. manufactures).In this way, make bonding sheet (B).
The survey of ＜ glass transition temperatures (Tg), store elastic modulus, loss elastic modulus, tan δ (loss tangent) Determine ＞
Using measurement of dynamic viscoelasticity device (Rheometric companies manufacture, ARES), it is obtained by following methods.
Adhesive phase, lamination and the thickness that about 2mm is made only are taken out from obtained bonding sheet (B), by its punching press extremely 7.9mm makes columned particle, and as measurement sample.Said determination sample is fixed on controlling for 7.9mm parallel-plates Tool by above-mentioned measurement of dynamic viscoelasticity device, measures the temperature dependency of store elastic modulus G', loss elastic modulus G ", Tan δ=G "/G' is set as, calculates tna δ.It should be noted that obtained tan δ curves are become into great temperature as glass Glass transition temperature (Tg) (DEG C).
Determination condition is as follows.
It measures：Shear mode,
Temperature range：- 70 DEG C~150 DEG C
Heating rate：5℃/min
Frequency：1Hz
(Production Example 1)：(methyl) acrylic polymer (1)
Acrylic acid 2- ethyl hexyls are added in into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser Base ester (Japanese catalyst Co. manufacture)：100 parts by weight, acrylic acid 2- hydroxy methacrylates (manufacture of East Asia Synesis Company)：4 weight Part, the 2,2'- azodiisobutyronitriles (and the manufacture of Wako Pure Chemical Industries company) as polymerization initiator：0.2 parts by weight, acetic acid second Ester：156 parts by weight import nitrogen while being slowly stirred, and the liquid temperature in flask is held in 65 DEG C or so, is carried out 6 hours Polymerisation prepares the solution (40 weight %) of (methyl) acrylic polymer (1) of weight average molecular weight 550,000.
(Production Example 2)：(methyl) acrylic polymer (2)
Acrylic acid 2- ethyl hexyls are added in into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser Base ester (Japanese catalyst Co. manufacture)：100 parts by weight, acrylic acid 4- hydroxybutyl (Osaka Organic Chemical Industry corporations It makes)：10 parts by weight, acrylic acid (manufacture of East Asia Synesis Company)：0.02 parts by weight, the 2,2'- azos two as polymerization initiator Isobutyronitrile (and the manufacture of Wako Pure Chemical Industries company)：0.2 parts by weight, ethyl acetate：156 parts by weight are led while being slowly stirred Enter nitrogen, the liquid temperature in flask is held in 65 DEG C or so, carries out 6 hours polymerisations, prepares (the first of weight average molecular weight 540,000 Base) acrylic polymer (2) solution (40 weight %).
(Production Example 3)：(methyl) acrylic polymer (3)
Butyl acrylate (day is added in into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser This catalyst Co. manufactures)：99 parts by weight, acrylic acid 4- hydroxybutyls (manufacture of Osaka Organic Chemical Industry company)：1 weight Part, the 2,2'- azodiisobutyronitriles (and the manufacture of Wako Pure Chemical Industries company) as polymerization initiator：1 parts by weight, ethyl acetate： 156 parts by weight import nitrogen while being slowly stirred, and the liquid temperature in flask is held in 60 DEG C or so, polymerize within 7 hours Reaction prepares the solution (39 weight %) of (methyl) acrylic polymer (3) of weight average molecular weight 1,600,000.
(Production Example 4)：(methyl) acrylic polymer (4)
Butyl acrylate (day is added in into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser This catalyst Co. manufactures)：92 parts by weight, N- acryloyl morpholines (manufacture of Xing Ren companies)：(East Asia synthesizes for 5 parts by weight, acrylic acid Company manufactures)：2.9 parts by weight, the 2,2'- azodiisobutyronitriles (and the manufacture of Wako Pure Chemical Industries company) as polymerization initiator： 0.1 parts by weight, ethyl acetate：200 parts by weight import nitrogen while being slowly stirred, and the liquid temperature in flask is held in 55 DEG C or so, 8 hours polymerisations are carried out, prepare the solution of (methyl) acrylic polymer (4) of weight average molecular weight 1,800,000 (33 weight %).
(Production Example 5)：(methyl) acrylic polymer (5)
Butyl acrylate (day is added in into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser This catalyst Co. manufactures)：95 parts by weight, acrylic acid (manufacture of East Asia Synesis Company)：5 parts by weight, as polymerization initiator 2,2'- azodiisobutyronitriles (and the manufacture of Wako Pure Chemical Industries company)：0.2 parts by weight, ethyl acetate：156 parts by weight, on one side slowly Stirring imports nitrogen on one side, and the liquid temperature in flask is held in 63 DEG C or so, 10 hours polymerisations is carried out, prepares Weight-average molecular Measure the solution (40 weight %) of 700,000 (methyl) acrylic polymer (5).
(Production Example 6)：(methyl) acrylic polymer (6) of the structure containing ester ring type
Using as the cyclohexyl methacrylate of monomer component, [vitrifying of homopolymer (polycyclohexyl methacrylate) turns Temperature：66℃]：95 parts by weight, acrylic acid：5 parts by weight, the 2 mercapto ethanol as chain-transferring agent：3 parts by weight, as poly- Close the 2,2'- azodiisobutyronitriles of initiator：0.2 parts by weight and the toluene as polymer solvent：103.2 parts by weight input can In separate type flask, stirred while nitrogen is imported 1 hour.In this way, after the oxygen in paradigmatic system is removed, it is warming up to 70 DEG C, it is made to react 3 hours, it is further made to react at 75 DEG C 2 hours, obtains (methyl) acrylic acid of weight average molecular weight 4000 The solution (50 weight %) of Type of Collective object (6).
(Production Example 6)：(methyl) acrylic polymer (7) of the structure containing ester ring type
Toluene is put into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser, dropping funel： 100 parts by weight, methacrylic acid two ring pentyl ester (DCPMA) (trade name：FA-513M, the manufacture of chemical conversion industry company of Hitachi)：60 weights Measure part, methyl methacrylate (MMA)：40 parts by weight and the Methyl mercaptoacetate as chain-transferring agent：3.5 parts by weight.It connects Get off, after being stirred 1 hour under 70 DEG C of nitrogen atmospheres, put into 2, the 2'- azodiisobutyronitriles as polymerization initiator：0.2 weight Part is measured, it is made to react at 70 DEG C 2 hours, after its reaction next being made at 80 DEG C 4 hours, makes its reaction 1 small at 90 DEG C When, the solution (51 weight %) of (methyl) acrylic polymer (7) of acquisition weight average molecular weight 4000.
(embodiment 1,2)
In the solution of (methyl) acrylic polymer (1), with relative to the molten of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent of liquid, overall solid constituent become the mode of 25 weight %, are diluted by ethyl acetate, It is stirred using disperser, obtains the adhesive composition (1) for including acrylic resin.It the results are shown in Table 1.
(embodiment 3,4)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, converted with solid constituent and add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.01 Parts by weight convert as crosslinking agent, with solid constituent adds in ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 weight Part in a manner that overall solid constituent becomes 25 weight %, is diluted by ethyl acetate, utilized as crosslinking catalyst Disperser is stirred, and obtains the adhesive composition (2) for including acrylic resin.As a result it is shown in table 1.
(embodiment 5,6)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 parts by weight is added in as crosslinking agent, with solid constituent conversion As crosslinking catalyst, in a manner that overall solid constituent becomes 25 weight %, be diluted by ethyl acetate, using point Scattered device is stirred, and obtains the adhesive composition (3) for including acrylic resin.As a result it is shown in table 1.
(embodiment 7,8)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, converted with solid constituent and add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.05 Parts by weight convert as crosslinking agent, with solid constituent adds in ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 weight Part is as crosslinking catalyst, being converted with solid constituent adds in 5 parts by weight of solution of (methyl) acrylic polymer (6), with total The solid constituent of body becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, is wrapped Adhesive composition (4) containing acrylic resin.As a result it is shown in table 1.
(embodiment 9,10)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 parts by weight is added in as crosslinking agent, with solid constituent conversion As crosslinking catalyst, being converted with solid constituent adds in 5 parts by weight of solution of (methyl) acrylic polymer (6), with totality Solid constituent become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, comprising The adhesive composition (5) of acrylic resin.As a result it is shown in table 1.
(embodiment 11,12)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.3 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 parts by weight is added in as crosslinking agent, with solid constituent conversion As crosslinking catalyst, being converted with solid constituent adds in 5 parts by weight of solution of (methyl) acrylic polymer (6), with totality Solid constituent become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, comprising The adhesive composition (6) of acrylic resin.As a result it is shown in table 1.
(embodiment 13,14)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 parts by weight is added in as crosslinking agent, with solid constituent conversion As crosslinking catalyst, being converted with solid constituent adds in 5 parts by weight of solution of (methyl) acrylic polymer (7), with totality Solid constituent become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, comprising The adhesive composition (7) of acrylic resin.As a result it is shown in table 1.
(embodiment 15,16)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.3 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 parts by weight is added in as crosslinking agent, with solid constituent conversion As crosslinking catalyst, being converted with solid constituent adds in 5 parts by weight of solution of (methyl) acrylic polymer (7), with totality Solid constituent become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, comprising The adhesive composition (8) of acrylic resin.As a result it is shown in table 1.
(embodiment 17,18)
In the solution of (methyl) acrylic polymer (2), with relative to the molten of (methyl) acrylic polymer (2) 100 parts by weight of solid constituent of liquid, overall solid constituent become the mode of 25 weight %, are diluted by ethyl acetate, It is stirred using disperser, obtains the adhesive composition (9) for including acrylic resin.As a result it is shown in table 2.
(embodiment 19,20)
In the solution of (methyl) acrylic polymer (2), relative to the solution of (methyl) acrylic polymer (2) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight Measure part as crosslinking agent, with solid constituent conversion addition TETRAD-C (manufacture of gas chemical company of Mitsubishi) 0.05 parts by weight, with Solid constituent conversion adds in ferric acetyl acetonade (Japan chemistry industry companies manufacture) 0.005 parts by weight as crosslinking catalyst, with Overall solid constituent becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, obtains Adhesive composition (10) comprising acrylic resin.As a result it is shown in table 2.
(embodiment 21,22)
In the solution of (methyl) acrylic polymer (3), relative to the solution of (methyl) acrylic polymer (3) 100 parts by weight of solid constituent, converted with solid constituent and add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.02 Parts by weight convert as crosslinking agent, with solid constituent adds in ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 weight Part in a manner that overall solid constituent becomes 25 weight %, is diluted by ethyl acetate, utilized as crosslinking catalyst Disperser is stirred, and obtains the adhesive composition (11) for including acrylic resin.As a result it is shown in table 2.
(embodiment 23,24)
In the solution of (methyl) acrylic polymer (5), relative to the solution of (methyl) acrylic polymer (5) 100 parts by weight of solid constituent, with solid constituent convert add in TETRAD-C (manufacture of gas chemical company of Mitsubishi) 0.075 weight Part adds in ferric acetyl acetonade (the chemical industry companies' manufacture of Japan) 0.005 parts by weight work as crosslinking agent, with solid constituent conversion For crosslinking catalyst, in a manner that overall solid constituent becomes 25 weight %, it is diluted by ethyl acetate, utilizes dispersion Device is stirred, and obtains the adhesive composition (12) for including acrylic resin.As a result it is shown in table 2.
(embodiment 25)
With relative to HYBRAR 5125 (KURARAY manufactures) 100 parts by weight, overall solid constituent becomes 25 weight % Mode, be diluted by toluene, obtain and include the adhesive composition (13) of rubber resin.As a result it is shown in table 2.
(embodiment 26)
With relative to HYBRAR 5127 (KURARAY manufactures) 100 parts by weight, overall solid constituent becomes 25 weight % Mode, be diluted by toluene, obtain and include the adhesive composition (14) of rubber resin.As a result it is shown in table 2.
(Comparative Examples 1 and 2)
In the solution of (methyl) acrylic polymer (1), relative to the solution of (methyl) acrylic polymer (1) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.5 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 parts by weight is added in as crosslinking agent, with solid constituent conversion As crosslinking catalyst, in a manner that overall solid constituent becomes 25 weight %, be diluted by ethyl acetate, using point Scattered device is stirred, and obtains the adhesive composition (C1) for including acrylic resin.As a result it is shown in table 2.
(comparative example 3,4)
In the solution of (methyl) acrylic polymer (2), relative to the solution of (methyl) acrylic polymer (2) 100 parts by weight of solid constituent, converted with solid constituent and add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.45 Parts by weight are as crosslinking agent, being converted with solid constituent adds in TETRAD-C (manufacture of gas chemical company of Mitsubishi) 0.3 parts by weight, with Solid constituent conversion adds in ferric acetyl acetonade (Japan chemistry industry companies manufacture) 0.005 parts by weight as crosslinking catalyst, with Overall solid constituent becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, obtains Adhesive composition (C2) comprising acrylic resin.As a result it is shown in table 2.
(comparative example 5,6)
In the solution of (methyl) acrylic polymer (4), relative to the solution of (methyl) acrylic polymer (4) 100 parts by weight of solid constituent, with solid constituent convert add in Coronate L (manufacture of Japanese polyurethane industrial group) 0.3 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies of Japan) 0.005 parts by weight is added in as crosslinking agent, with solid constituent conversion As crosslinking catalyst, in a manner that overall solid constituent becomes 25 weight %, be diluted by ethyl acetate, using point Scattered device is stirred, and obtains the adhesive composition (C3) for including acrylic resin.As a result it is shown in table 2.
(comparative example 7,8)
In the solution of (methyl) acrylic polymer (5), relative to the solution of (methyl) acrylic polymer (5) 100 parts by weight of solid constituent, with solid constituent convert add in TETRAD-C (manufacture of gas chemical company of Mitsubishi) 0.075 weight Part adds in ferric acetyl acetonade (the chemical industry companies' manufacture of Japan) 0.005 parts by weight work as crosslinking agent, with solid constituent conversion For crosslinking catalyst, being converted with solid constituent adds in 20 parts by weight of solution of (methyl) acrylic polymer (6), with totality Solid constituent becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, obtains comprising third The adhesive composition (C4) of olefin(e) acid resinoid.As a result it is shown in table 2.
(embodiment 27)
For bonding sheet (A) obtained from the adhesive composition (1) that is obtained from embodiment 1,2 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 28)
For bonding sheet (A) obtained from the adhesive composition (2) that is obtained from embodiment 3,4 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 29)
For bonding sheet (A) obtained from the adhesive composition (4) that is obtained from embodiment 7,8 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 30)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (7) that is obtained from embodiment 13,14 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 31)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (9) that is obtained from embodiment 17,18 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 32)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (10) that is obtained from embodiment 19,20 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 33)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (11) that is obtained from embodiment 21,22 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 34)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (12) that is obtained from embodiment 23,24 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 35)
For bonding sheet (A) obtained from the adhesive composition (13) that is obtained from embodiment 25 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 36)
For bonding sheet (A) obtained from the adhesive composition (14) that is obtained from embodiment 26 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 37)
For bonding sheet (A) obtained from the adhesive composition (1) that is obtained from embodiment 1,2 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 38)
For bonding sheet (A) obtained from the adhesive composition (2) that is obtained from embodiment 3,4 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 39)
For bonding sheet (A) obtained from the adhesive composition (4) that is obtained from embodiment 7,8 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 40)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (7) that is obtained from embodiment 13,14 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 41)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (9) that is obtained from embodiment 17,18 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 42)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (10) that is obtained from embodiment 19,20 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 43)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (11) that is obtained from embodiment 21,22 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 44)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (12) that is obtained from embodiment 23,24 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 45)
For bonding sheet (A) obtained from the adhesive composition (13) that is obtained from embodiment 25 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 46)
For bonding sheet (A) obtained from the adhesive composition (14) that is obtained from embodiment 26 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
Industrial applicibility
The stress dispersion membrane of the present invention for example can suitably be used as protecting optical component, electronic component not by from outside Impact etc. for the purpose of protection materials.

Claims (10)

1. a kind of stress dispersion membrane, it includes the laminated body of plastic foil and adhesive phase, wherein,
Press-in energy when applying load from the plastic foil of the laminated body laterally direction vertical with the laminated body for 260 μ J with On.
2. stress dispersion membrane as described in claim 1, wherein,
The thickness of the plastic foil is 4 μm~500 μm.
3. stress dispersion membrane as claimed in claim 1 or 2, wherein,
The thickness of described adhesive layer is 1 μm~300 μm.
4. stress dispersion membrane as claimed any one in claims 1 to 3, wherein,
Described adhesive layer is formed by adhesive composition, which includes polymer (A), the polymer (A) With from monomeric unit of the alkyl with carbon atom number 1~20 as (methyl) alkyl acrylate of alkylester moieties (I) and from intramolecular there is the monomeric unit (II) of (methyl) acrylate of OH bases and/or COOH bases.
5. stress dispersion membrane as claimed in claim 4, wherein,
A mole content ratio for NCO bases in described adhesive composition is set as [NCO], by the ring in the adhesive composition A mole content ratio for oxygroup is set as [EPOXY], and a mole content ratio for the OH bases in the adhesive composition is set as [OH], When a mole content ratio for COOH bases in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+ [COOH]) ＜ 0.05.
6. stress dispersion membrane as described in claim 4 or 5, wherein,
Described adhesive composition includes organic polyisocyanates class crosslinking agents and/or epoxies crosslinking agent more than 2 functions.
7. the stress dispersion membrane as described in any one of claim 4 to 6, wherein,
Described adhesive composition includes polymer (B), and the polymer (B), which has, to contain ester ring type shown in self-drifting (1) The monomeric unit and weight average molecular weight of (methyl) acrylate of structure for 1000 less than 30000,
CH2=C (R1)COOR2…(1)
In general formula (1), R1For hydrogen atom or methyl, R2For the alkyl with ester ring type structure.
8. the stress dispersion membrane as described in any one of claim 1 to 7, wherein,
Loss tangent tan δ of the described adhesive layer in -40 DEG C~150 DEG C of entire temperature range is more than 0.10.
9. a kind of optical component has stress dispersion membrane described in any item of the claim 1 to 8.
10. a kind of electronic component has stress dispersion membrane described in any item of the claim 1 to 8.
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KR20180022978A (en) 2018-03-06
KR101888341B1 (en) 2018-08-13
KR20180038077A (en) 2018-04-13
WO2017130444A1 (en) 2017-08-03
CN109181561A (en) 2019-01-11
JP2017160451A (en) 2017-09-14
TWI638878B (en) 2018-10-21
JP6193525B1 (en) 2017-09-06
JP6151416B1 (en) 2017-06-21
KR20180091962A (en) 2018-08-16
CN109181561B (en) 2019-09-27
TW201900804A (en) 2019-01-01
CN108138004B (en) 2021-11-23
TW201803955A (en) 2018-02-01
TWI679265B (en) 2019-12-11
JP2017132977A (en) 2017-08-03
SG10201802306WA (en) 2018-04-27
SG11201800572XA (en) 2018-02-27
KR101888811B1 (en) 2018-08-14

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