TW201900804A - Stress dispersion film, optical member, and electronic component - Google Patents

Stress dispersion film, optical member, and electronic component Download PDF

Info

Publication number
TW201900804A
TW201900804A TW107133843A TW107133843A TW201900804A TW 201900804 A TW201900804 A TW 201900804A TW 107133843 A TW107133843 A TW 107133843A TW 107133843 A TW107133843 A TW 107133843A TW 201900804 A TW201900804 A TW 201900804A
Authority
TW
Taiwan
Prior art keywords
weight
meth
adhesive layer
stress
adhesive composition
Prior art date
Application number
TW107133843A
Other languages
Chinese (zh)
Other versions
TWI679265B (en
Inventor
佐佐木翔悟
徐創矢
設樂浩司
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201900804A publication Critical patent/TW201900804A/en
Application granted granted Critical
Publication of TWI679265B publication Critical patent/TWI679265B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a stress distributing film having excellent stress distributing ability. Also provided are an optical member and an electronic member equipped with same stress distributing film. This stress distributing film comprises a layered body from a plastic film and an adhesive layer. The stress distributing film is such that, when a load is applied from the plastic film side of the layered body in an orthogonal direction to the layered body, the indentation energy is 260 [mu]J or greater.

Description

應力分散膜、光學構件、及電子構件Stress dispersion film, optical member, and electronic member

本發明係關於一種應力分散膜、具備該應力分散膜之光學構件或電子構件。The present invention relates to a stress dispersing film, and an optical member or an electronic member including the stress dispersing film.

為了賦予使用有LCD(liquid crystal display，液晶顯示裝置)之觸控面板、相機之透鏡部、電子機器等光學構件或電子構件以剛性或耐衝擊性，存在露出面側貼合有黏著性膜之情況(例如，專利文獻1)。此種黏著性膜通常具有基材層及黏著劑層。 於組裝時、加工時、輸送時、使用時等各種情形下，有時會因壓入力給如上述般之光學構件或電子構件帶來負荷，出現光學構件或電子構件因所受之負荷而損壞之問題。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2014-234460號公報In order to impart rigidity or impact resistance to a touch panel using an LCD (liquid crystal display, liquid crystal display device), a lens portion of a camera, an electronic device or an electronic component, there is an adhesive film bonded on the exposed surface side. Case (for example, Patent Document 1). Such an adhesive film usually has a substrate layer and an adhesive layer. In various situations such as assembly, processing, transportation, and use, there may be a load on the optical component or electronic component due to the pressing force, and the optical component or electronic component may be damaged due to the load. Problem. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2014-234460

[發明所欲解決之問題] 本發明之課題在於提供一種具有優異之應力分散性之應力分散膜。又，在於提供一種具備該種應力分散膜之光學構件或電子構件。 [解決問題之技術手段] 本發明之應力分散膜係 一種包含塑膠膜與黏著劑層之積層體之應力分散膜，且 自該積層體之塑膠膜側向與該積層體垂直之方向上施加負載時之壓入能量為260 μJ以上。 於一實施形態中，上述塑膠膜之厚度為4 μm～500 μm。 於一實施形態中，上述黏著劑層之厚度為1 μm～300 μm。 於一實施形態中，上述黏著劑層由黏著劑組合物形成，該黏著劑組合物包含聚合物(A)，其具有：來自具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯的單體單元(I)，及來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)。 於一實施形態中，於將上述黏著劑組合物中之NCO基之莫耳含有比率記為[NCO]，將該黏著劑組合物中之環氧基之莫耳含有比率記為[EPOXY]，將該黏著劑組合物中之OH基之莫耳含有比率記為[OH]，將該黏著劑組合物中之COOH基之莫耳含有比率記為[COOH]時，([NCO]＋[EPOXY])/([OH]＋[COOH])＜0.05。 於一實施形態中，上述黏著劑組合物包含2官能基以上之有機聚異氰酸酯系交聯劑及/或環氧系交聯劑。 於一實施形態中，上述黏著劑組合物包含聚合物(B)，其具有來自含通式(1)所表示之脂環式結構之(甲基)丙烯酸酯之單體單元，且重量平均分子量為1000以上且未達30000。 CH2 =C(R1 )COOR2 ・・・(1) (通式(1)中，R1 為氫原子或甲基，R2 為具有脂環式結構之烴基) 於一實施形態中，上述黏著劑層之-40℃～150℃之全溫度範圍中之損耗正切tanδ為0.10以上。 本發明之光學構件具備上述應力分散膜。 本發明之電子構件具備上述應力分散膜。 [發明之效果] 根據本發明，可提供一種具有優異之應力分散性之應力分散膜。又，可提供一種具備該種應力分散膜之光學構件或電子構件。[Problems to be Solved by the Invention] An object of the present invention is to provide a stress dispersing film having excellent stress dispersibility. Another object is to provide an optical member or an electronic member provided with such a stress dispersing film. [Technical means to solve the problem] The stress dispersing film of the present invention is a stress dispersing film including a laminated body of a plastic film and an adhesive layer, and a load is applied from the side of the laminated plastic film to a direction perpendicular to the laminated body The press-in energy at this time is above 260 μJ. In one embodiment, the thickness of the plastic film is 4 μm to 500 μm. In one embodiment, the thickness of the adhesive layer is 1 μm to 300 μm. In one embodiment, the above-mentioned adhesive layer is formed of an adhesive composition containing a polymer (A), which has a (A) derived from an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety. Monomer unit (I) of an alkyl acrylate and a monomer unit (II) derived from a (meth) acrylate having an OH group and / or a COOH group in the molecule. In one embodiment, the molar content ratio of NCO groups in the adhesive composition is described as [NCO], and the molar content ratio of epoxy groups in the adhesive composition is described as [EPOXY]. When the molar content ratio of the OH group in the adhesive composition is [OH], and when the molar content ratio of the COOH group in the adhesive composition is [COOH], ([NCO] + [EPOXY ]) / ([OH] + [COOH]) <0.05. In one embodiment, the adhesive composition includes an organic polyisocyanate-based crosslinking agent and / or an epoxy-based crosslinking agent having two or more functional groups. In one embodiment, the adhesive composition includes a polymer (B) having a monomer unit derived from a (meth) acrylic acid ester having an alicyclic structure represented by the general formula (1), and has a weight average molecular weight. It is 1,000 or more and less than 30,000. CH 2 = C (R 1 ) COOR 2 (1) (In the general formula (1), R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrocarbon group having an alicyclic structure) In one embodiment, The loss tangent tan δ in the temperature range of -40 ° C to 150 ° C of the adhesive layer is 0.10 or more. An optical member of the present invention includes the above-mentioned stress dispersing film. An electronic component of the present invention includes the above-mentioned stress-dispersing film. [Effects of the Invention] According to the present invention, it is possible to provide a stress dispersing film having excellent stress dispersibility. In addition, an optical member or an electronic member provided with such a stress-dispersing film can be provided.

於本說明書中存在所謂「(甲基)丙烯酸」之表達之情形時，意味著「acrylic及/或methacryl」，於存在所謂「(甲基)丙烯酸酯」之表達之情形時，意味著「acrylate及/或methacrylate」。又，於本說明書中存在所謂「重量」之表達之情形時，亦可替換為作為表示重量之SI系單元而慣用之「質量」。 於本說明書中存在所謂「來自(a)之單體單元(A)」之表達之情形時，單體單元(A)係單體(a)所具有之不飽和雙鍵藉由聚合斷鍵而形成之結構單元。再者，所謂不飽和雙鍵藉由聚合斷鍵而形成之結構單元，係「RpRqC=CRrRs」之結構(Rp、Rq、Rr、Rs係以單鍵之形式與碳原子進行鍵結之任意之適合之基)之不飽和雙鍵「C=C」藉由聚合，斷鍵而形成之「-RpRqC-CRrRs-」之結構單元。 於本說明書中，聚合物中之單體單元之含有比率例如可藉由該聚合物之各種結構分析(例如NMR(nuclear magnetic resonance，核磁共振)等)而得知。又，即便不進行如上述般之各種結構分析，亦可以基於製造聚合物時所使用之各種單體之使用量所計算出的來自該各種單體之單體單元之含有比率，作為聚合物中之單體單元之含有比率。即，可將製造聚合物時所使用之總單體成分中之某單體(m)之含有比率作為來自該聚合物中之單體(m)之單體單元之含有比率。 ≪≪A.應力分散膜≫≫ 本發明之應力分散膜包含塑膠膜與黏著劑層之積層體。塑膠膜既可為1層，亦可為2層以上。黏著劑層既可為1層，亦可為2層以上。 圖1係本發明之一實施形態之應力分散膜之概略剖視圖。於圖1中，本發明之應力分散膜100包含塑膠膜10與黏著劑層20之積層體。圖1中雖未顯示，但黏著劑層20之表面亦可設有任意之適合之強接著層。 圖2係本發明之另一實施形態之應力分散膜之概略剖視圖。於圖2中，本發明之應力分散膜100包含黏著劑層20及塑膠膜10及黏著劑層20，依序具有黏著劑層20及塑膠膜10及黏著劑層20。即，於圖2中，本發明之應力分散膜100包含黏著劑層20、及塑膠膜10與黏著劑層20之積層體。圖2中雖未顯示，但單側或兩側之黏著劑層20之表面亦可設有任意之適合之強接著層。 於黏著劑層作為最外層而露出之形態之情形時，亦可於該露出面側設置任意之適合之隔片(剝離片材)。 本發明之應力分散膜自塑膠膜與黏著劑層之積層體之塑膠膜側向與該積層體垂直之方向上施加負載時之壓入能量為260 μJ以上。上述壓入能量之測定方法如後所述。上述壓入能量較佳為260 μJ～10000 μJ，更佳為270 μJ～9000 μJ，進而較佳為280 μJ～8000 μJ，尤佳為290 μJ～7000 μJ。由於上述壓入能量在上述範圍內，故而可提供一種具有優異之應力分散性之應力分散膜。 塑膠膜之厚度較佳為4 μm～500 μm，更佳為10 μm～400 μm，進而較佳為15 μm～350 μm，尤佳為20 μm～300 μm。由於塑膠膜之厚度在上述範圍內，故而可提供一種具有更優異之應力分散性之應力分散膜。 黏著劑層之厚度較佳為1 μm～300 μm，更佳為2 μm～250 μm，進而較佳為4 μm～200 μm，尤佳為5 μm～150 μm。由於黏著劑層之厚度在上述範圍內，故而可提供一種具有更優異之應力分散性之應力分散膜。 作為塑膠膜，可於不損害本發明之效果之範圍，採用任意之適合之塑膠膜。關於此種塑膠膜，例如其ASTM D695下之壓縮強度較佳為100 Kg/cm2 ～3000 Kg/cm2 ，更佳為200 Kg/cm2 ～2900 Kg/cm2 ，進而較佳為300 Kg/cm2 ～2800 Kg/cm2 ，尤佳為400 Kg/cm2 ～2700 Kg/cm2 。作為此種塑膠膜，具體而言，例如可列舉：聚酯系樹脂、聚烯烴系樹脂、聚醯胺系樹脂、聚醯亞胺系樹脂等。作為聚酯系樹脂，例如可列舉：聚對苯二甲酸乙二酯、聚對苯二甲酸丁二醇酯、聚萘二甲酸乙二酯等。作為聚烯烴系樹脂，例如可列舉：烯烴單體之均聚物、烯烴單體之共聚物等。作為聚烯烴系樹脂，具體而言，例如可列舉：均聚丙烯；將乙烯成分作為共聚合成分之封端系、無規系、接枝系等之丙烯系共聚物；反應器TPO(ThermoPlastic Olefin，熱塑鏈烯)；低密度、高密度、線性低密度、超低密度等乙烯系聚合物；乙烯・丙烯共聚物、乙烯・乙酸乙烯酯共聚物、乙烯・丙烯酸甲酯共聚物、乙烯・丙烯酸乙酯共聚物、乙烯・丙烯酸丁酯共聚物、乙烯・甲基丙烯酸共聚物、乙烯・甲基丙烯酸甲酯共聚物等乙烯系共聚物等。 塑膠膜可視需要含有任意之適合之添加劑。作為塑膠膜中可含有之添加劑，例如可列舉：抗氧化劑、紫外線吸收劑、光穩定劑、抗靜電劑、填充劑、顏料等。塑膠膜中可含有之添加劑之種類、數量可根據目的適當地設定。 作為黏著劑層，可於不損害本發明之效果之範圍，採用任意之適合之黏著劑層。作為此種黏著劑層，例如可列舉：由丙烯酸系黏著劑所形成之黏著劑層、由橡膠系黏著劑所形成之黏著劑層、由矽酮系黏著劑所形成之黏著劑層、由胺基甲酸酯系黏著劑所形成之黏著劑層等。 黏著劑層較佳為由黏著劑組合物形成。 黏著劑層例如係將黏著劑組合物塗佈於任意之適合之基材上，視需要進行乾燥，於基材上形成黏著劑層。之後，若將基材剝離，則獲得黏著劑層。又，例如藉由將黏著劑組合物塗佈於任意之適合之塑膠膜上，視需要進行乾燥，於塑膠膜上形成黏著劑層，照原樣殘留塑膠膜，而獲得包含黏著劑層與塑膠膜之應力分散膜。又，例如藉由將黏著劑組合物塗佈於任意之適合之基材上，視需要進行乾燥，於基材上形成黏著劑層，將剝離基材所獲得之黏著劑層載置於塑膠膜，而獲得包含黏著劑層與塑膠膜之應力分散膜。又，例如藉由將黏著劑組合物塗佈於任意之適合之基材上，視需要進行乾燥，於基材上形成黏著劑層，將基材上所形成之黏著劑層轉印至塑膠膜，而獲得包含黏著劑層及塑膠膜之應力分散膜。 作為黏著劑組合物之塗佈之方法，例如可列舉：輥塗、凹版塗佈、反向塗佈、輥刷、噴塗、氣刀塗佈法、利用模嘴塗佈機等所進行之擠壓塗佈等。 此種黏著劑組合物較佳為包含聚合物(A)，其具有：來自具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯的單體單元(I)、及來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)。 黏著劑組合物中之上述聚合物(A)之含有比率較佳為80重量%～100重量%，更佳為85重量%～100重量%，進而較佳為90重量%～100重量%，尤佳為92.5重量%～100重量%，最佳為95重量%～100重量%。由於黏著劑組合物中之上述聚合物(A)之含有比率在上述範圍內，故而可提供一種具有更優異之應力分散性之應力分散膜。 聚合物(A)具有來自具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯的單體單元(I)。聚合物(A)中之來自具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯的單體單元(I)既可僅為1種，亦可為2種以上。 聚合物(A)中之來自具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯的單體單元(I)之含有比率較佳為90重量%～99.5重量%，更佳為91重量%～99重量%，進而較佳為92重量%～98.5重量%，尤佳為93重量%～98.2重量%，最佳為94重量%～98重量%。聚合物(A)中之來自具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯的單體單元(I)之含有比率在上述範圍內，因此可提供一種具有更優異之應力分散性之應力分散膜。 作為具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯，例如可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十三烷基酯、(甲基)丙烯酸正十四烷基酯等。 聚合物(A)具有來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)。聚合物(A)中之來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)既可僅為1種，亦可為2種以上。藉由聚合物(A)具有來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)，可提供一種具有更優異之應力分散性之應力分散膜。 聚合物(A)中之來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)之含有比率較佳為0.5重量%～10重量%，更佳為1重量%～9重量%，進而較佳為1.5重量%～8重量%，尤佳為1.8重量%～7重量%，最佳為2重量%～6重量%。藉由聚合物(A)中之來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)之含有比率在上述範圍內，可提供一種具有更優異之應力分散性之應力分散膜。 作為分子內具有OH基之(甲基)丙烯酸酯，例如可列舉：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(4-羥甲基環己基)丙烯酸甲酯、N-羥甲基(甲基)丙烯醯胺、乙烯醇、烯丙醇、2-羥乙基乙烯醚、4-羥丁基乙烯醚、二乙二醇單乙烯醚等。 作為分子內具有COOH基之(甲基)丙烯酸酯，例如可列舉：(甲基)丙烯酸、(甲基)丙烯酸羥乙酯、(甲基)丙烯酸羥戊酯、伊康酸、馬來酸、富馬酸、丁烯酸、異丁烯酸等。 聚合物(A)亦可具有來自其他之單體之單體單元(III)。聚合物(A)中之來自其他之單體之單體單元(III)既可僅為1種，亦可為2種以上。 作為其他之單體，例如可列舉：含氰基單體、乙烯酯單體、芳香族乙烯單體、含醯胺基單體、含亞胺基單體、含胺基單體、含環氧基單體、乙烯醚單體、N-丙烯醯啉、含磺基單體、含磷酸基單體、含酸酐基單體等。 黏著劑組合物在將該黏著劑組合物中之NCO基之莫耳含有比率記為[NCO]，將該黏著劑組合物中之環氧基之莫耳含有比率記為[EPOXY]，將該黏著劑組合物中之OH基之莫耳含有比率記為[OH]，將該黏著劑組合物中之COOH基之莫耳含有比率記為[COOH]時，([NCO]＋[EPOXY])/([OH]＋[COOH])＜0.05。由於([NCO]＋[EPOXY])/([OH]＋[COOH])在上述範圍，故而可提供一種具有更優異之應力分散性之應力分散膜。再者，於黏著劑組合物中不存在NCO基之情形時，[NCO]＝0，黏著劑組合物中不存在環氧基之情形時，[EPOXY]＝0。即，([NCO]＋[EPOXY])/([OH]＋[COOH])之下限値為0。 黏著劑組合物較佳為包含2官能基以上之有機聚異氰酸酯系交聯劑及/或環氧系交聯劑。本發明之黏著劑組合物可包含之2官能基以上之有機聚異氰酸酯系交聯劑及/或環氧系交聯劑既可僅為1種，亦可為2種以上。 黏著劑組合物中之上述2官能基以上之有機聚異氰酸酯系交聯劑及環氧系交聯劑之合計之含有比率相對於聚合物(A)100重量份，較佳為0.001重量份～0.4重量份，更佳為0.0025重量份～0.3重量份，進而較佳為0.005重量份～0.2重量份，尤佳為0.0075重量份～0.15重量份，最佳為0.01重量份～0.1重量份。由於本發明之黏著劑組合物中之上述2官能基以上之有機聚異氰酸酯系交聯劑及環氧系交聯劑之合計之含有比率相對於聚合物(A)100重量份在上述範圍內，故而可提供一種具有更優異之應力分散性之應力分散膜。 作為2官能基以上之有機聚異氰酸酯系交聯劑，例如可列舉：伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類；亞環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類；2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類；三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(例如，日本聚胺酯工業公司製造，商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(例如，日本聚胺酯工業公司製造，商品名「Coronate HL」)、六亞甲基二異氰酸酯之異氰尿酸酯體(例如，日本聚胺酯工業公司製造，商品名「Coronate HX」)等異氰酸酯加成物等。 作為環氧系交聯劑，例如可列舉：雙酚A、表氯醇型之環氧系樹脂、乙烯縮水甘油醚、聚乙二醇二縮水甘油醚、甘油二縮水甘油醚、甘油三縮水甘油醚、1,6-己二醇縮水甘油醚、三羥甲基丙烷三縮水甘油醚、二縮水甘油苯胺、二胺縮水甘油胺、N,N,N',N'-四縮水甘油基間苯二甲胺(例如，三菱瓦斯化學公司製造，商品名「TETRAD-X」)、1,3-雙(N,N-二縮水甘油胺甲基)環己烷(例如，三菱瓦斯化學公司製造，商品名「TETRAD-C」)等。 黏著劑組合物亦可包含聚合物(B)，其具有來自含通式(1)所表示之脂環式結構之(甲基)丙烯酸酯的單體單元，重量平均分子量為1000以上且未達30000。 CH2 =C(R1 )COOR2 ・・・(1) (通式(1)中，R1 為氫原子或甲基，R2 為具有脂環式結構之烴基)。 聚合物(B)既可僅為1種，亦可為2種以上。 聚合物(B)之重量平均分子量較佳為1000～30000，更佳為1250～25000，進而較佳為1500～20000，尤佳為1750～15000，最佳為2000～10000。由於聚合物(B)之重量平均分子量在上述範圍內，故而即便增加交聯劑之量，亦可提供一種具有更優異之應力分散性之應力分散膜。 黏著劑組合物中之聚合物(B)之含有比率相對於聚合物(A)100重量份，較佳為0.5重量份～50重量份，更佳為1重量份～45重量份，進而較佳為2重量份～40重量份，尤佳為3重量份～35重量份，最佳為4重量份～30重量份。由於黏著劑組合物中之聚合物(B)之含有比率相對於聚合物(A)100重量份在上述範圍內，故而即便增加交聯劑之量，亦可提供一種具有更優異之應力分散性之應力分散膜。 聚合物(B)中之來自含通式(1)所表示之脂環式結構之(甲基)丙烯酸酯的單體單元之含有比率較佳為40重量%～99.5重量%，更佳為42.5重量%～99重量%，進而較佳為45重量%～98.5重量%，尤佳為47.5重量%～98重量%，最佳為50重量%～97.5重量%。由於聚合物(B)中之來自含通式(1)所表示之脂環式結構之(甲基)丙烯酸酯的單體單元之含有比率在上述範圍內，故而即便增加交聯劑之量，亦可提供一種具有更優異之應力分散性之應力分散膜。 作為上述含通式(1)所表示之脂環式結構之(甲基)丙烯酸酯，例如可列舉：(甲基)丙烯酸環己酯、(甲基)丙烯酸雙環戊酯、甲基丙烯酸雙環戊基氧乙酯、丙烯酸雙環戊基氧乙酯、甲基丙烯酸三環戊酯、丙烯酸三環戊酯、甲基丙烯酸1-金剛烷酯、丙烯酸1-金剛烷酯、甲基丙烯酸2-甲基-2-金剛烷酯、丙烯酸2-甲基-2-金剛烷酯、甲基丙烯酸2-乙基-2-金剛烷酯、丙烯酸2-乙基-2-金剛烷酯等。 聚合物(B)亦可具有來自其他之單體之單體單元(IV)。聚合物(B)中之來自其他之單體之單體單元(IV)既可僅為1種，亦可為2種以上。 作為聚合物(B)中可包含之其他之單體，例如可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十三烷基酯、(甲基)丙烯酸正十四烷基酯、丙烯酸、甲基丙烯酸、丙烯酸羧乙酯、丙烯酸羧戊酯、伊康酸、馬來酸、富馬酸、丁烯酸、異丁烯酸等。 聚合物(A)、聚合物(B)可於不損害本發明之效果之範圍利用任意之適合之方法而製造。作為此種製造方法，例如可列舉：溶液聚合、乳化聚合、塊狀聚合、懸浮聚合、光聚合(活性能量線聚合)等。該等之製造方法之中，自成本或生產性之觀點而言，較佳為溶液聚合。所獲得之聚合物(A)可為無規共聚物、封端共聚物、交互共聚物、接枝共聚物等任一者。所獲得之聚合物(B)可為無規共聚物、封端共聚物、交互共聚物、接枝共聚物等。 作為溶液聚合之方法，例如可列舉將單體成分或聚合起始劑等溶解於溶劑中，加熱使之聚合，而獲得聚合物溶液之方法等。 作為溶液聚合中之加熱聚合時之加熱溫度，例如可列舉50℃～90℃。作為溶液聚合中之加熱時間，例如可列舉1小時～24小時。 作為溶液聚合中所使用之溶劑，可於不損害本發明之效果之範圍內，使用任意之適合之溶劑。作為此種溶劑，例如可列舉：甲苯、苯、二甲苯等芳香族烴類；乙酸乙酯、乙酸正丁酯等酯類；正己烷、正庚烷等脂肪族烴類；環己烷、甲基環己烷等脂環式烴類；甲基乙基酮、甲基異丁基酮等酮類等有機溶劑等。溶劑既可僅為1種，亦可為2種以上。 於聚合物(A)、聚合物(B)之製造中，可使用聚合起始劑。此種聚合起始劑既可僅為1種，亦可為2種以上。作為此種聚合起始劑，例如可列舉：2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽、2,2'-偶氮雙[2-(5-甲基-2-咪唑啉-2-基)丙烷]二鹽酸鹽、2,2'-偶氮雙(2-甲基脒)二硫酸鹽、2,2'-偶氮雙(N,N'-二甲基異丁基脒)、2,2'-偶氮雙[N-(2-羧乙基)-2-甲基脒]水合物(和光純藥公司製造，VA-057)等偶氮系起始劑；過硫酸鉀、過硫酸銨等過硫酸鹽；過氧化二碳酸二(2-乙基己基)酯、過氧化二碳酸二(4-第三丁基環己基)酯、過氧化二碳酸二-第二丁酯、過氧化新癸酸第三丁酯、過氧化特戊酸第三己酯、過氧化特戊酸第三丁酯、過氧化二月桂醯、過氧化二-正辛醯、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯、過氧化二(4-甲基苯甲醯)、過氧化二苯甲醯、過氧異丁酸第三丁酯、1,1-二(第三己基過氧)環己烷、第三丁基過氧化氫、過氧化氫等過氧化物系起始劑；過硫酸鹽與亞硫酸氫鈉之組合、過氧化物與抗壞血酸鈉之組合等、將過氧化物與還原劑組合之氧化還原系起始劑等。 聚合起始劑之使用量可於不損害本發明之效果之範圍內，採用任意之適合之使用量。作為此種使用量，例如相對於單體成分100重量份，較佳為0.01重量份～5重量份。 於聚合物(A)、聚合物(B)之製造中，可使用鏈轉移劑。此種鏈轉移劑既可僅為1種，亦可為2種以上。作為此種鏈轉移劑，例如可列舉：月桂硫醇、縮水甘油基硫醇、巰基乙酸、2-巰基乙醇、硫代乙醇酸、硫代乙醇酸甲酯、硫代乙醇酸2-乙基己酯、2,3-二巰基-1-丙醇等。 鏈轉移劑之使用量可於不損害本發明之效果之範圍內採用任意之適合之使用量。作為此種使用量，例如相對於單體成分100重量份，較佳為0.01重量份～5重量份。 於聚合物(A)、聚合物(B)之製造中，可使用一般可用於聚合反應之其他之任意之適合之添加劑。 本發明之黏著劑組合物亦可包含交聯觸媒。作為交聯觸媒，可於不損害本發明之效果之範圍內採用任意之適合之交聯觸媒。作為此種交聯觸媒，例如可列舉：鈦酸四-正丁酯、鈦酸四異丙酯、乙醯丙酮鐵、氧化丁基錫、二辛基二月桂酸錫等金屬系交聯觸媒(尤其是錫系交聯觸媒)等。交聯觸媒既可僅為1種，亦可為2種以上。 交聯觸媒之使用量可於不損害本發明之效果之範圍內採用任意之適合之使用量。作為此種使用量，例如相對於單體成分100重量份，較佳為0.001重量份～0.05重量份。 黏著劑組合物亦可於不損害本發明之效果之範圍內含有任意之適合之其他之添加劑。作為此種其他之添加劑，例如可列舉：矽烷偶合劑、交聯延遲劑、乳化劑、著色劑、顏料等粉體、染料、界面活性劑、塑化劑、黏著性賦予劑、表面潤滑劑、調平劑、軟化劑、抗氧化劑、防老化劑、光穩定劑、紫外線吸收劑、聚合抑制劑、無機填充劑、有機填充劑、金屬粉、粒子狀、箔狀物等。此種其他之添加劑既可僅為1種，亦可為2種以上。 黏著劑層之-40℃～150℃之全溫度範圍中之損耗正切tanδ較佳為0.10以上。藉由使黏著劑層之-40℃～150℃之全溫度範圍中之上述損耗正切tanδ為0.10以上，可提供一種具有更優異之應力分散性之應力分散膜。再者，上述損耗正切tanδ之測定方法如後所述。 黏著劑層之-40℃～150℃之全溫度範圍中之上述損耗正切tanδ之上限較佳為2.40以下，更佳為2.20以下，進而較佳為2.00以下，尤佳為1.80以下。藉由使上述損耗正切tanδ之上限在上述範圍內，可提供一種具有更優異之應力分散性之應力分散膜。 黏著劑層之-40℃～150℃之全溫度範圍中之上述損耗正切tanδ之下限較佳為0.12以上，更佳為0.14以上，進而較佳為0.16以上，尤佳為0.18以上。藉由使上述損耗正切tanδ之下限在上述範圍內，可提供一種具有更優異之應力分散性之應力分散膜。 ≪≪C.光學構件、電子構件≫≫ 本發明之應力分散膜具有優異之應力分散性。因此，可適宜地用作以保護光學構件或電子構件不受來自外部之衝擊等為目的之保護材料。即，本發明之光學構件具備本發明之應力分散膜。又，本發明之電子構件具備本發明之應力分散膜。 [實施例] 以下，藉由實施例對本發明具體地進行說明，但本發明並非限定於該等實施例者。再者，實施例等中之試驗及評價方法如下所述。再者，於記載為「份」之情形時，只要未特別記載事項，即意指「重量份」，於記載為「%」之情形，只要未特別記載事項，即意指「重量%」。 ＜重量平均分子量之測定＞ 聚合物之重量平均分子量(Mw)係使用東曹股份有限公司製造的GPC裝置(HLC-8220GPC)進行測定。再者，重量平均分子量(Mw)係藉由聚苯乙烯換算值而求取。 測定條件如下所示。 試樣濃度：0.2重量%(THF溶液) 試樣注入量：10 μl溶離液 THF流速：0.6 ml/min 測定溫度：40℃ 試樣管柱：TSKguardcolumn SuperHZ-H(1根)＋TSKgel SuperHZM-H(2根) 參考管柱：TSKgel SuperH-RC(1根) 檢測器：示差折射計(RI) ＜黏著片材(A)之製作＞ (實施例1、3、5、7、9、11、13、15、17、19、21、23、25、26，比較例1、3、5、7) 將所獲得之黏著劑組合物以乾燥後之厚度成為10 μm之方式利用槽輥塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度50 μm，東麗公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下，固化並乾燥。如此，於基材上製作黏著劑層。繼而，於黏著劑層之表面貼合於另一面實施有矽酮處理之厚度25 μm之包含聚酯樹脂之基材之矽酮處理面，獲得黏著片材(A)。 (實施例2、4、6、8、10、12、14、16、18、20、22、24，比較例2、4、6、8) 將所獲得之黏著劑組合物以乾燥後之厚度成為22 μm之方式利用槽輥塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，東麗公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下，固化並乾燥。如此，於基材上製作黏著劑層。其次，於黏著劑層之表面貼合於另一面實施有矽酮處理之厚度25 μm之包含聚酯樹脂之基材之矽酮處理面，獲得黏著片材(A)。 ＜壓入能量之測定＞ 使用Daipla Wintes公司製造之「SAICASDN-20型」，於測定溫度：25℃、壓入速度：5 μm/sec下，按照下述順序，計算壓入能量。 (順序1) 將所獲得之黏著片材(A)之黏著劑層側貼付於平坦壓頭(負載檢測側)，將貼付於上述之平坦壓頭的黏著片材(A)之基材側壓入至球形壓頭，算出檢測到20 N之負載時之壓入深度(μm)。 (順序2) 將所獲得之黏著片材(A)之黏著劑層側貼付於載玻片，自貼付於上述載玻片之黏著片材(A)之基材側(負載檢測側)利用球形壓頭而壓入，壓入至順序1中所求得之壓入深度。 於將球形壓頭所受之垂直負載設為y＝f(x)(x：壓入深度)時，利用下述式算出對黏著片材(A)之黏著劑層側施加20 N為止之壓入能量W(μJ)(r為對黏著片材(A)之黏著劑層側施加20 N之負載時之壓入深度)。 [數1]＜黏著片材(B)之製作＞ 將所獲得之黏著劑組合物以乾燥後之厚度成為50 μm之方式利用槽輥塗佈於藉由矽酮對單面進行剝離處理後之厚度38 μm之聚酯膜(商品名：MRF，三菱化學聚酯股份有限公司製造)之剝離處理面，於乾燥溫度130℃、乾燥時間3分鐘之條件下，固化並乾燥。如此，於基材上製作黏著劑層。繼而，於黏著劑層之表面，使該膜之剝離處理面成為黏著劑層側，被覆藉由矽酮對單面進行剝離處理後之厚度38 μm之聚酯膜(商品名：MRF，三菱化學聚酯股份有限公司製造)。如此，製作黏著片材(B)。 ＜玻璃轉移溫度(Tg)、儲存模數、損失彈性模數、tanδ(損耗正切)之測定＞ 使用動態黏彈性測定裝置(Rheometric公司製造，ARES)，藉由下述之方法求取。 自所獲得之黏著片材(B)僅取出黏著劑層，積層並設為約2 mm之厚度，將其衝壓至7.9 mm，製作圓柱狀之顆粒，並作為測定用試樣。將上述測定試樣固定於7.9 mm平行板之治具，藉由上述動態黏彈性測定裝置，測定儲存模數G'、損失彈性模數G"之溫度依存性，設tanδ＝G"/G'，計算出tnaδ。再者，將所獲得之tanδ曲線成為極大之溫度作為玻璃轉移溫度(Tg)(℃)。 測定條件如下所示。 測定：剪切模式、 溫度範圍：-70℃～150℃ 升溫速度：5℃/min 頻率：1 Hz 〔製造例1〕：(甲基)丙烯酸系聚合物(1) 向具備攪拌葉片、溫度計、氮氣導入管、冷凝器之四口燒瓶中加入丙烯酸2-乙基己基酯(日本觸媒公司製造)：100重量份、丙烯酸2-羥乙酯(東亞合成公司製造)：4重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈(和光純藥工業公司製造)：0.2重量份、乙酸乙酯：156重量份，一面緩慢攪拌一面導入氮氣，將燒瓶內之液溫保持於65℃附近，進行6小時聚合反應，製備重量平均分子量55萬之(甲基)丙烯酸系聚合物(1)之溶液(40重量%)。 〔製造例2〕：(甲基)丙烯酸系聚合物(2) 向具備攪拌葉片、溫度計、氮氣導入管、冷凝器之四口燒瓶中加入丙烯酸2-乙基己基酯(日本觸媒公司製造)：100重量份、丙烯酸4-羥丁酯(大阪有機化學工業公司製造)：10重量份、丙烯酸(東亞合成公司製造)：0.02重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈(和光純藥工業公司製造)：0.2重量份、乙酸乙酯：156重量份，一面緩慢攪拌一面導入氮氣，將燒瓶內之液溫保持於65℃附近，進行6小時聚合反應，製備重量平均分子量54萬之(甲基)丙烯酸系聚合物(2)之溶液(40重量%)。 〔製造例3〕：(甲基)丙烯酸系聚合物(3) 向具備攪拌葉片、溫度計、氮氣導入管、冷凝器之四口燒瓶中加入丙烯酸丁酯(日本觸媒公司製造)：99重量份、丙烯酸4-羥丁酯(大阪有機化學工業公司製造)：1重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈(和光純藥工業公司製造)：1重量份、乙酸乙酯：156重量份，一面緩慢攪拌一面導入氮氣，將燒瓶內之液溫保持於60℃附近，進行7小時聚合反應，製備重量平均分子量160萬之(甲基)丙烯酸系聚合物(3)之溶液(39重量%)。 〔製造例4〕：(甲基)丙烯酸系聚合物(4) 向具備攪拌葉片、溫度計、氮氣導入管、冷凝器之四口燒瓶中加入丙烯酸丁酯(日本觸媒公司製造)：92重量份、N-丙烯醯啉(興人公司製造)：5重量份、丙烯酸(東亞合成公司製造)：2.9重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈(和光純藥工業公司製造)：0.1重量份、乙酸乙酯：200重量份，一面緩慢攪拌一面導入氮氣，將燒瓶內之液溫保持於55℃附近，進行8小時聚合反應，製備重量平均分子量180萬之(甲基)丙烯酸系聚合物(4)之溶液(33重量%)。 〔製造例5〕：(甲基)丙烯酸系聚合物(5) 向具備攪拌葉片、溫度計、氮氣導入管、冷凝器之四口燒瓶中加入丙烯酸丁酯(日本觸媒公司製造)：95重量份、丙烯酸(東亞合成公司製造)：5重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈(和光純藥工業公司製造)：0.2重量份、乙酸乙酯：156重量份，一面緩慢攪拌一面導入氮氣，將燒瓶內之液溫保持於63℃附近，進行10小時聚合反應，製備重量平均分子量70萬之(甲基)丙烯酸系聚合物(5)之溶液(40重量%)。 〔製造例6〕：含脂環式結構之(甲基)丙烯酸系聚合物(6) 將作為單體成分之甲基丙烯酸環己酯[均聚物(聚甲基丙烯酸環己酯)之玻璃轉移溫度：66℃]：95重量份、丙烯酸：5重量份、作為鏈轉移劑之2-巰基乙醇：3重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈：0.2重量份、及作為聚合溶媒之甲苯：103.2重量份投入可分離式燒瓶中，一面導入氮氣一面攪拌1小時。如此，於去除聚合系統內之氧氣後，升溫至70℃，使之反應3小時，進而，於75℃下使之反應2小時，獲得重量平均分子量4000之(甲基)丙烯酸系聚合物(6)之溶液(50重量%)。 〔製造例6〕：含脂環式結構之(甲基)丙烯酸系聚合物(7) 向具備攪拌葉片、溫度計、氮氣導入管、冷凝器、滴液漏斗之四口燒瓶中投入甲苯：100重量份、甲基丙烯酸二環戊酯(DCPMA)(商品名：FA-513M，日立化成工業公司製造)：60重量份、甲基丙烯酸甲酯(MMA)：40重量份、及作為鏈轉移劑之硫代乙醇酸甲酯：3.5重量份。繼而，於70℃氮氣氣體氛圍下攪拌1小時後，投入作為聚合起始劑之2,2'-偶氮雙異丁腈：0.2重量份，於70℃使之反應2小時，繼而於80℃使之反應4小時後，於90℃使之反應1小時，獲得重量平均分子量4000之(甲基)丙烯酸系聚合物(7)之溶液(51重量%)。 〔實施例1、2〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(1)。將結果表示於表1中。 〔實施例3、4〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.01重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(2)。結果表示於表1中。 〔實施例5、6〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.1重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(3)。結果表示於表1中。 〔實施例7、8〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.05重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒、以固形物成分換算加入(甲基)丙烯酸系聚合物(6)之溶液5重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(4)。結果表示於表1中。 〔實施例9、10〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.1重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒、以固形物成分換算加入(甲基)丙烯酸系聚合物(6)之溶液5重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(5)。結果表示於表1中。 〔實施例11、12〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.3重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒、以固形物成分換算加入(甲基)丙烯酸系聚合物(6)之溶液5重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(6)。結果表示於表1中。 〔實施例13、14〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.1重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒、以固形物成分換算加入(甲基)丙烯酸系聚合物(7)之溶液5重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(7)。結果表示於表1中。 〔實施例15、16〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.3重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒、以固形物成分換算加入(甲基)丙烯酸系聚合物(7)之溶液5重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(8)。結果表示於表1中。 〔實施例17、18〕 於(甲基)丙烯酸系聚合物(2)之溶液中，以相對於(甲基)丙烯酸系聚合物(2)之溶液之固形物成分100重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(9)。結果表示於表2中。 〔實施例19、20〕 於(甲基)丙烯酸系聚合物(2)之溶液中，以相對於(甲基)丙烯酸系聚合物(2)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.1重量份作為交聯劑、以固形物成分換算加入TETRAD-C(三菱瓦斯化學公司製造)0.05重量份、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(10)。結果表示於表2中。 〔實施例21、22〕 於(甲基)丙烯酸系聚合物(3)之溶液中，以相對於(甲基)丙烯酸系聚合物(3)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.02重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(11)。結果表示於表2中。 〔實施例23、24〕 於(甲基)丙烯酸系聚合物(5)之溶液中，以相對於(甲基)丙烯酸系聚合物(5)之溶液之固形物成分100重量份，以固形物成分換算加入TETRAD-C(三菱瓦斯化學公司製造)0.075重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(12)。結果表示於表2中。 〔實施例25〕 以相對於HYBRAR 5125(可樂麗製造)100重量份，總體之固形物成分成為25重量%之方式，藉由甲苯進行稀釋，獲得包含橡膠系樹脂之黏著劑組合物(13)。結果表示於表2中。 〔實施例26〕 以相對於HYBRAR 5127(可樂麗製造)100重量份，總體之固形物成分成為25重量%之方式，藉由甲苯進行稀釋，獲得包含橡膠系樹脂之黏著劑組合物(14)。結果表示於表2中。 〔比較例1、2〕 於(甲基)丙烯酸系聚合物(1)之溶液中，以相對於(甲基)丙烯酸系聚合物(1)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.5重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(C1)。結果表示於表2中。 〔比較例3、4〕 於(甲基)丙烯酸系聚合物(2)之溶液中，以相對於(甲基)丙烯酸系聚合物(2)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.45重量份作為交聯劑、以固形物成分換算加入TETRAD-C(三菱瓦斯化學公司製造)0.3重量份，以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(C2)。結果表示於表2中。 〔比較例5、6〕 於(甲基)丙烯酸系聚合物(4)之溶液中，以相對於(甲基)丙烯酸系聚合物(4)之溶液之固形物成分100重量份，以固形物成分換算加入Coronate L(日本聚胺酯工業公司製造)0.3重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(C3)。結果表示於表2中。 〔比較例7、8〕 於(甲基)丙烯酸系聚合物(5)之溶液中，以相對於(甲基)丙烯酸系聚合物(5)之溶液之固形物成分100重量份，以固形物成分換算加入TETRAD-C(三菱瓦斯化學公司製造)0.075重量份作為交聯劑、以固形物成分換算加入乙醯丙酮鐵(日本化學產業公司製造)0.005重量份作為交聯觸媒、以固形物成分換算加入(甲基)丙烯酸系聚合物(6)之溶液20重量份，總體之固形物成分成為25重量%之方式，藉由乙酸乙酯進行稀釋，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(C4)。結果表示於表2中。 [表1] [表2] 〔實施例27〕 對於自實施例1、2中所獲得之黏著劑組合物(1)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例28〕 對於自實施例3、4中所獲得之黏著劑組合物(2)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例29〕 對於自實施例7、8中所獲得之黏著劑組合物(4)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例30〕 對於自實施例13、14中所獲得之黏著劑組合物(7)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例31〕 對於自實施例17、18中所獲得之黏著劑組合物(9)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例32〕 對於自實施例19、20中所獲得之黏著劑組合物(10)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例33〕 對於自實施例21、22中所獲得之黏著劑組合物(11)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例34〕 對於自實施例23、24中所獲得之黏著劑組合物(12)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例35〕 對於自實施例25中所獲得之黏著劑組合物(13)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例36〕 對於自實施例26中所獲得之黏著劑組合物(14)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，獲得貼合有黏著片材之光學構件。 〔實施例37〕 對於自實施例1、2中所獲得之黏著劑組合物(1)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例38〕 對於自實施例3、4中所獲得之黏著劑組合物(2)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例39〕 對於自實施例7、8中所獲得之黏著劑組合物(4)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例40〕 對於自實施例13、14中所獲得之黏著劑組合物(7)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例41〕 對於自實施例17、18中所獲得之黏著劑組合物(9)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例42〕 對於自實施例19、20中所獲得之黏著劑組合物(10)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例43〕 對於自實施例21、22中所獲得之黏著劑組合物(11)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例44〕 對於自實施例23、24中所獲得之黏著劑組合物(12)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例45〕 對於自實施例25中所獲得之黏著劑組合物(13)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 〔實施例46〕 對於自實施例26中所獲得之黏著劑組合物(14)所獲得之黏著片材(A)及黏著片材(B)之各個，自一面剝離聚酯膜，貼合至作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，獲得貼合有黏著片材之電子構件。 [產業上之可利用性] 本發明之應力分散膜例如可適宜地用作以保護光學構件或電子構件不受來自外部之衝擊等為目的之保護材料。When the expression of "(meth) acrylic acid" is used in this specification, it means "acrylic and / or methacryl", and when the expression of so-called "(meth) acrylic acid" is used, it means "acrylate And / or methacrylate. " In addition, in the case where the expression "weight" is used in the present specification, it may be replaced with "mass" which is conventionally used as an SI system unit for indicating weight. In the case where the expression "a monomer unit (A) derived from (a)" exists in this specification, the monomer unit (A) is an unsaturated double bond possessed by the monomer (a), and is broken by polymerization. Formed structural unit. In addition, the so-called structural unit formed by the unsaturated double bond by breaking the bond is a structure of "RpRqC = CRrRs" (Rp, Rq, Rr, and Rs are arbitrary bonds to carbon atoms with a single bond) Suitable base) The structural unit of the "-RpRqC-CRrRs-" unsaturated double bond "C = C" formed by polymerization and breaking the bond. In this specification, the content ratio of the monomer units in a polymer can be known, for example, by various structural analyses of the polymer (for example, NMR (nuclear magnetic resonance, nuclear magnetic resonance), etc.). In addition, even if various structural analyses as described above are not performed, the content ratio of the monomer units derived from the various monomers based on the amounts of various monomers used in the production of the polymer can be used as the polymer in the polymer. Content ratio of monomer units. That is, the content ratio of a certain monomer (m) in the total monomer component used when manufacturing a polymer can be made into the content ratio of the monomer unit derived from the monomer (m) in the polymer. ≪≪A. Stress Dispersion Film≫≫ The stress dispersion film of the present invention includes a laminated body of a plastic film and an adhesive layer. The plastic film can be one layer or two or more layers. The adhesive layer may be one layer or two or more layers. FIG. 1 is a schematic cross-sectional view of a stress dispersion film according to an embodiment of the present invention. In FIG. 1, the stress dispersion film 100 of the present invention includes a laminated body of a plastic film 10 and an adhesive layer 20. Although not shown in FIG. 1, the surface of the adhesive layer 20 may be provided with any suitable strong adhesive layer. FIG. 2 is a schematic cross-sectional view of a stress dispersion film according to another embodiment of the present invention. In FIG. 2, the stress dispersing film 100 of the present invention includes an adhesive layer 20 and a plastic film 10 and an adhesive layer 20, and has an adhesive layer 20 and a plastic film 10 and an adhesive layer 20 in this order. That is, in FIG. 2, the stress dispersion film 100 of the present invention includes an adhesive layer 20 and a laminated body of the plastic film 10 and the adhesive layer 20. Although not shown in FIG. 2, the surface of the adhesive layer 20 on one or both sides may be provided with any suitable strong adhesive layer. In the case where the adhesive layer is exposed as the outermost layer, any appropriate separator (release sheet) may be provided on the exposed surface side. The stress dispersing film of the present invention has a pressing energy of 260 μJ or more when a load is applied from the plastic film of the laminated body of the plastic film and the adhesive layer in a direction perpendicular to the laminated body. The method for measuring the above-mentioned indentation energy is described later. The above-mentioned pressing energy is preferably 260 μJ to 10000 μJ, more preferably 270 μJ to 9000 μJ, even more preferably 280 μJ to 8000 μJ, and even more preferably 290 μJ to 7000 μJ. Since the above-mentioned pressing energy is within the above range, it is possible to provide a stress dispersing film having excellent stress dispersibility. The thickness of the plastic film is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, still more preferably 15 μm to 350 μm, and even more preferably 20 μm to 300 μm. Since the thickness of the plastic film is within the above range, a stress-dispersing film having more excellent stress-dispersibility can be provided. The thickness of the adhesive layer is preferably 1 μm to 300 μm, more preferably 2 μm to 250 μm, still more preferably 4 μm to 200 μm, and even more preferably 5 μm to 150 μm. Since the thickness of the adhesive layer is within the above range, it is possible to provide a stress dispersing film having more excellent stress dispersibility. As the plastic film, any suitable plastic film can be used within a range that does not impair the effect of the present invention. Regarding this plastic film, for example, the compression strength under ASTM D695 is preferably 100 Kg / cm 2 ～ 3000 Kg / cm 2 , More preferably 200 Kg / cm 2 ～ 2900 Kg / cm 2 , And more preferably 300 Kg / cm 2 ～ 2800 Kg / cm 2 , Especially preferably 400 Kg / cm 2 ～ 2700 Kg / cm 2 . Specific examples of such a plastic film include polyester resins, polyolefin resins, polyamide resins, and polyimide resins. Examples of the polyester resin include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples of the polyolefin-based resin include a homopolymer of an olefin monomer and a copolymer of an olefin monomer. Specific examples of the polyolefin-based resin include homopolypropylene; propylene-based copolymers such as end-capped, random, and graft-based copolymers having an ethylene component as a copolymerization component; reactor TPO (ThermoPlastic Olefin) , Thermoplastic alkenes); low-density, high-density, linear low-density, ultra-low-density ethylene-based polymers; ethylene · propylene copolymers, ethylene · vinyl acetate copolymers, ethylene · methyl acrylate copolymers, ethylene · Ethylene acrylate copolymers, ethylene / butyl acrylate copolymers, ethylene / methacrylic acid copolymers, ethylene / methyl methacrylate copolymers, and other ethylene-based copolymers. The plastic film may contain any suitable additives as required. Examples of the additives that may be contained in the plastic film include antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, fillers, pigments, and the like. The type and amount of additives that can be contained in the plastic film can be appropriately set according to the purpose. As the adhesive layer, any suitable adhesive layer can be used as long as the effect of the present invention is not impaired. Examples of such an adhesive layer include an adhesive layer formed of an acrylic adhesive, an adhesive layer formed of a rubber adhesive, an adhesive layer formed of a silicone adhesive, and an amine. An adhesive layer or the like formed from a urethane-based adhesive. The adhesive layer is preferably formed of an adhesive composition. The adhesive layer is, for example, an adhesive composition coated on any suitable substrate, and dried if necessary, to form an adhesive layer on the substrate. After that, if the substrate is peeled off, an adhesive layer is obtained. In addition, for example, by applying the adhesive composition to any suitable plastic film, drying as needed, forming an adhesive layer on the plastic film, and leaving the plastic film as it is, to obtain an adhesive layer and a plastic film. Stress dispersing film. In addition, for example, by coating the adhesive composition on any suitable substrate, drying it as necessary, forming an adhesive layer on the substrate, and placing the adhesive layer obtained by peeling the substrate on a plastic film. To obtain a stress dispersing film including an adhesive layer and a plastic film. In addition, for example, by coating the adhesive composition on any suitable substrate, drying it as necessary, forming an adhesive layer on the substrate, and transferring the adhesive layer formed on the substrate to a plastic film. To obtain a stress dispersing film including an adhesive layer and a plastic film. Examples of the method for applying the adhesive composition include roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating, and extrusion using a die coater. Coating, etc. Such an adhesive composition preferably contains a polymer (A) having a monomer unit (I) derived from an alkyl (meth) acrylate having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety. And a monomer unit (II) derived from a (meth) acrylate having an OH group and / or a COOH group in the molecule. The content ratio of the polymer (A) in the adhesive composition is preferably 80% to 100% by weight, more preferably 85% to 100% by weight, and still more preferably 90% to 100% by weight, especially It is preferably 92.5% to 100% by weight, and most preferably 95% to 100% by weight. Since the content ratio of the polymer (A) in the adhesive composition is within the above range, it is possible to provide a stress dispersing film having more excellent stress dispersibility. The polymer (A) has a monomer unit (I) derived from an alkyl (meth) acrylate having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety. The monomer unit (I) derived from the (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as the alkyl ester portion in the polymer (A) may be only one kind or two kinds the above. The content ratio of the monomer unit (I) derived from the (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as the alkyl ester portion in the polymer (A) is preferably 90% by weight to 99.5% by weight %, More preferably 91% to 99% by weight, still more preferably 92% to 98.5% by weight, particularly preferably 93% to 98.2% by weight, and most preferably 94% to 98% by weight. In the polymer (A), the content ratio of the monomer unit (I) derived from the (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester portion is within the above range, and thus can provide a A stress dispersing film with more excellent stress dispersibility. Examples of the (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety include methyl (meth) acrylate, ethyl (meth) acrylate, and (meth) acrylic acid. N-butyl ester, second butyl (meth) acrylate, third butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethyl (meth) acrylate Hexyl ester, n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, (formyl) Group) isodecyl acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) acrylate, and the like. The polymer (A) has a monomer unit (II) derived from a (meth) acrylate having an OH group and / or a COOH group in the molecule. In the polymer (A), the monomer unit (II) derived from a (meth) acrylate having an OH group and / or a COOH group in the molecule may be only one kind, or two or more kinds. When the polymer (A) has a monomer unit (II) derived from a (meth) acrylate having an OH group and / or a COOH group in the molecule, a stress-dispersing film having more excellent stress-dispersibility can be provided. The content ratio of the monomer unit (II) derived from the (meth) acrylate having an OH group and / or a COOH group in the polymer (A) is preferably 0.5% to 10% by weight, and more preferably 1 The weight% -9 weight% is more preferably 1.5 weight% -8 weight%, particularly preferably 1.8 weight% -7 weight%, and most preferably 2 weight% -6 weight%. When the content ratio of the monomer unit (II) in the polymer (A) derived from the (meth) acrylic ester having an OH group and / or a COOH group in the molecule is within the above range, a more excellent stress can be provided. Dispersive stress dispersing film. Examples of the (meth) acrylate having an OH group in the molecule include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate , 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethyl) Methylcyclohexyl) methyl acrylate, N-hydroxymethyl (meth) acrylamide, vinyl alcohol, allyl alcohol, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monoethylene Ether, etc. Examples of the (meth) acrylate having a COOH group in the molecule include (meth) acrylic acid, hydroxyethyl (meth) acrylate, hydroxypentyl (meth) acrylate, itaconic acid, maleic acid, Fumaric acid, butenoic acid, methacrylic acid, etc. The polymer (A) may have monomer units (III) derived from other monomers. The monomer unit (III) derived from other monomers in the polymer (A) may be only one kind, or two or more kinds. Examples of other monomers include a cyano-containing monomer, a vinyl ester monomer, an aromatic vinyl monomer, a fluorene-containing amino monomer, an imine-containing monomer, an amine-containing monomer, and an epoxy-containing monomer. Monomer, vinyl ether monomer, N-acrylic acid Phenols, sulfo-containing monomers, phosphate-containing monomers, anhydride-containing monomers, and the like. The molar content ratio of the NCO group in the adhesive composition is described as [NCO], and the molar content ratio of the epoxy group in the adhesive composition is described as [EPOXY]. When the molar content ratio of the OH group in the adhesive composition is [OH], and when the molar content ratio of the COOH group in the adhesive composition is [COOH], ([NCO] + [EPOXY]) /([OH]+[COOH])<0.05. Since ([NCO] + [EPOXY]) / ([OH] + [COOH]) is in the above range, a stress-dispersing film having more excellent stress-dispersibility can be provided. When NCO groups are not present in the adhesive composition, [NCO] = 0, and when epoxy groups are not present in the adhesive composition, [EPOXY] = 0. That is, the lower limit of ([NCO] + [EPOXY]) / ([OH] + [COOH]) is 0. The adhesive composition is preferably an organic polyisocyanate-based crosslinking agent and / or an epoxy-based crosslinking agent containing a bifunctional group or more. The adhesive composition of the present invention may contain only one or more organic polyisocyanate-based crosslinking agents and / or epoxy-based crosslinking agents having two or more functional groups. The total content ratio of the organic polyisocyanate-based crosslinking agent and the epoxy-based crosslinking agent of the above-mentioned bifunctional group in the adhesive composition is preferably 0.001 to 0.4 parts by weight relative to 100 parts by weight of the polymer (A). The weight part is more preferably 0.0025 weight part to 0.3 weight part, still more preferably 0.005 weight part to 0.2 weight part, particularly preferably 0.0075 weight part to 0.15 weight part, and most preferably 0.01 weight part to 0.1 weight part. Since the total content ratio of the organic polyisocyanate-based crosslinking agent and epoxy-based crosslinking agent of the above-mentioned bifunctional group in the adhesive composition of the present invention is within the above range with respect to 100 parts by weight of the polymer (A), Therefore, it is possible to provide a stress dispersing film having more excellent stress dispersibility. Examples of the organic polyisocyanate-based crosslinking agent having two or more functional groups include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; cyclopentylene diisocyanate and cyclohexyl diisocyanate. Alicyclic isocyanates, such as isophorone diisocyanate; aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylol Propane / toluene diisocyanate terpolymer adduct (for example, manufactured by Japan Polyurethane Industry Corporation, trade name "Coronate L"), trimethylolpropane / hexamethylene diisocyanate terpolymer adduct (for example, Japan Manufactured by Polyurethane Industries, Inc., under the trade name "Coronate HL"), isocyanurate bodies of hexamethylene diisocyanate (for example, manufactured by Polyurethane Industries, Japan, under the trade name "Coronate HX") and the like. Examples of the epoxy-based crosslinking agent include bisphenol A, an epichlorohydrin-type epoxy resin, ethylene glycidyl ether, polyethylene glycol diglycidyl ether, glycerol diglycidyl ether, and glycerol triglycidyl. Ether, 1,6-hexanediol glycidyl ether, trimethylolpropane triglycidyl ether, diglycidylaniline, diamine glycidylamine, N, N, N ', N'-tetraglycidyl metaphenylene Dimethylamine (for example, manufactured by Mitsubishi Gas Chemical Company under the trade name "TETRAD-X"), 1,3-bis (N, N-diglycidylamine methyl) cyclohexane (for example, manufactured by Mitsubishi Gas Chemical Company, Trade name "TETRAD-C"). The adhesive composition may further include a polymer (B) having a monomer unit derived from a (meth) acrylic acid ester having an alicyclic structure represented by the general formula (1), and having a weight average molecular weight of 1,000 or more and less than 30,000. CH 2 = C (R 1 COOR 2 ・ ・ ・ (1) (In the general formula (1), R 1 Is a hydrogen atom or a methyl group, R 2 (A hydrocarbon group having an alicyclic structure). The polymer (B) may be only one kind, or two or more kinds. The weight average molecular weight of the polymer (B) is preferably 1,000 to 30,000, more preferably 1250 to 25,000, still more preferably 1500 to 20,000, even more preferably 1750 to 15,000, and most preferably 2,000 to 10,000. Since the weight average molecular weight of the polymer (B) is within the above range, even if the amount of the crosslinking agent is increased, it is possible to provide a stress dispersing film having more excellent stress dispersibility. The content ratio of the polymer (B) in the adhesive composition is preferably 0.5 to 50 parts by weight, more preferably 1 to 45 parts by weight, and more preferably 100 parts by weight of the polymer (A). It is 2 to 40 parts by weight, particularly preferably 3 to 35 parts by weight, and most preferably 4 to 30 parts by weight. Since the content ratio of the polymer (B) in the adhesive composition is within the above range with respect to 100 parts by weight of the polymer (A), even if the amount of the crosslinking agent is increased, it can provide a more excellent stress dispersibility. Stress dispersing film. The content ratio of the monomer unit derived from the (meth) acrylic acid ester containing an alicyclic structure represented by the general formula (1) in the polymer (B) is preferably 40% to 99.5% by weight, and more preferably 42.5%. The weight% to 99% by weight, more preferably 45% to 98.5% by weight, particularly preferably 47.5% to 98% by weight, and most preferably 50% to 97.5% by weight. Since the content ratio of the monomer unit derived from the (meth) acrylic acid ester containing the alicyclic structure represented by the general formula (1) in the polymer (B) is within the above range, even if the amount of the crosslinking agent is increased, It is also possible to provide a stress dispersing film having more excellent stress dispersibility. Examples of the (meth) acrylate containing an alicyclic structure represented by the general formula (1) include cyclohexyl (meth) acrylate, dicyclopentyl (meth) acrylate, and dicyclopentyl methacrylate. Ethoxyethyl, dicyclopentyloxyethyl acrylate, tricyclopentyl methacrylate, tricyclopentyl acrylate, 1-adamantyl methacrylate, 1-adamantyl acrylate, 2-methyl methacrylate 2-adamantyl ester, 2-methyl-2-adamantyl acrylate, 2-ethyl-2-adamantyl methacrylate, 2-ethyl-2-adamantyl acrylate, and the like. The polymer (B) may have monomer units (IV) derived from other monomers. The monomer units (IV) derived from other monomers in the polymer (B) may be only one kind, or two or more kinds. Examples of other monomers that can be contained in the polymer (B) include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, and (meth) acrylic acid. Dibutyl ester, tertiary butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate Ester, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, (meth) ) N-dodecyl acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) acrylate, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, Iraq Conic acid, maleic acid, fumaric acid, butenoic acid, methacrylic acid, etc. The polymer (A) and the polymer (B) can be produced by any appropriate method as long as the effect of the present invention is not impaired. Examples of such a manufacturing method include solution polymerization, emulsion polymerization, block polymerization, suspension polymerization, and photopolymerization (active energy ray polymerization). Among these production methods, solution polymerization is preferred from the viewpoint of cost or productivity. The obtained polymer (A) may be any of a random copolymer, a blocked copolymer, an interpolymer, and a graft copolymer. The obtained polymer (B) may be a random copolymer, a blocked copolymer, an interpolymer, a graft copolymer, or the like. Examples of the method of solution polymerization include a method of dissolving a monomer component or a polymerization initiator in a solvent, and heating and polymerizing to obtain a polymer solution. Examples of the heating temperature during the heat polymerization in the solution polymerization include 50 ° C to 90 ° C. Examples of the heating time in the solution polymerization include 1 to 24 hours. As the solvent used in the solution polymerization, any appropriate solvent can be used within a range that does not impair the effect of the present invention. Examples of such solvents include: aromatic hydrocarbons such as toluene, benzene, and xylene; esters such as ethyl acetate and n-butyl acetate; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methylformate Cyclohexane and other alicyclic hydrocarbons; organic solvents such as ketones such as methyl ethyl ketone and methyl isobutyl ketone. The solvent may be only one type, or two or more types. In the production of the polymer (A) and the polymer (B), a polymerization initiator can be used. Such a polymerization initiator may be only one kind, or two or more kinds. Examples of such a polymerization initiator include 2,2'-azobisisobutyronitrile, 2,2'-azobis (2-fluorenylpropane) dihydrochloride, and 2,2'-couple Azabis [2- (5-methyl-2-imidazolin-2-yl) propane] dihydrochloride, 2,2'-Azobis (2-methylphosphonium) disulfate, 2,2 ' -Azobis (N, N'-dimethylisobutylphosphonium), 2,2'-azobis [N- (2-carboxyethyl) -2-methylphosphonium] hydrate (Wako Pure Chemical Industries, Ltd. Manufactured by the company, VA-057) and other azo-based initiators; persulfates such as potassium persulfate and ammonium persulfate; bis (2-ethylhexyl) peroxydicarbonate, and di (4-perfluorodicarbonate) Tributylcyclohexyl) ester, di-second butyl peroxydicarbonate, tertiary butyl peroxydecanoate, tertiary hexyl pervalerate, tertiary butyl pervalerate, peroxy Dilauryl oxide, di-n-octyl peroxide, 2-ethylhexanoic acid 1,1,3,3-tetramethylbutyl ester, di (4-methylbenzyl) peroxide, Peroxide-based starting materials such as dibenzosulfonium oxide, tert-butyl peroxyisobutyrate, 1,1-bis (tertiary hexylperoxy) cyclohexane, tertiary butyl hydrogen peroxide, and hydrogen peroxide Agent; combination of persulfate and sodium bisulfite, over A combination of an oxide and sodium ascorbate, and a redox-based initiator in which a peroxide and a reducing agent are combined. The amount of the polymerization initiator to be used may be any suitable amount within a range that does not impair the effects of the present invention. Such use amount is, for example, preferably 0.01 to 5 parts by weight based on 100 parts by weight of the monomer component. In the production of the polymer (A) and the polymer (B), a chain transfer agent can be used. Such a chain transfer agent may be only one kind, or two or more kinds. Examples of such a chain transfer agent include lauryl mercaptan, glycidyl mercaptan, thioglycolic acid, 2-mercaptoethanol, thioglycolic acid, methyl thioglycolate, and 2-ethylhexyl thioglycolate. Esters, 2,3-dimercapto-1-propanol, and the like. The amount of the chain transfer agent to be used may be any appropriate amount as long as the effect of the present invention is not impaired. Such use amount is, for example, preferably 0.01 to 5 parts by weight based on 100 parts by weight of the monomer component. In the production of the polymer (A) and the polymer (B), any other suitable additives that are generally used for polymerization can be used. The adhesive composition of the present invention may also include a crosslinking catalyst. As the cross-linking catalyst, any appropriate cross-linking catalyst can be used within a range that does not impair the effects of the present invention. Examples of such a cross-linking catalyst include metal-based cross-linking catalysts such as tetra-n-butyl titanate, tetraisopropyl titanate, iron acetoacetone, butyltin oxide, and dioctyltin dilaurate ( Especially tin-based crosslinking catalysts). The crosslinking catalyst may be only one type, or two or more types. The amount of the cross-linking catalyst to be used may be any appropriate amount as long as the effect of the present invention is not impaired. Such an amount is preferably, for example, 0.001 to 0.05 parts by weight based on 100 parts by weight of the monomer component. The adhesive composition may contain any other appropriate additives as long as the effect of the present invention is not impaired. Examples of such other additives include powders such as silane coupling agents, crosslinking delaying agents, emulsifiers, colorants, and pigments, dyes, surfactants, plasticizers, tackifiers, surface lubricants, Leveling agents, softeners, antioxidants, anti-aging agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, inorganic fillers, organic fillers, metal powders, particles, foils, etc. Such other additives may be only one kind, or two or more kinds. The loss tangent tanδ in the temperature range of -40 ° C to 150 ° C of the adhesive layer is preferably 0.10 or more. By setting the above-mentioned loss tangent tanδ in the entire temperature range of -40 ° C to 150 ° C of the adhesive layer to be 0.10 or more, it is possible to provide a stress dispersion film having more excellent stress dispersibility. The method for measuring the loss tangent tan δ will be described later. The upper limit of the loss tangent tanδ in the entire temperature range of -40 ° C to 150 ° C of the adhesive layer is preferably 2.40 or less, more preferably 2.20 or less, even more preferably 2.00 or less, and even more preferably 1.80 or less. By setting the upper limit of the loss tangent tan δ to be within the above range, it is possible to provide a stress dispersing film having more excellent stress dispersibility. The lower limit of the loss tangent tanδ in the entire temperature range of -40 ° C to 150 ° C of the adhesive layer is preferably 0.12 or more, more preferably 0.14 or more, still more preferably 0.16 or more, and even more preferably 0.18 or more. By making the lower limit of the loss tangent tan δ within the above range, it is possible to provide a stress dispersing film having more excellent stress dispersibility. ≪≪C. Optical member and electronic member≫≫ The stress dispersing film of the present invention has excellent stress dispersibility. Therefore, it can be used suitably as a protective material for the purpose of protecting an optical member or an electronic member from external impact, etc. That is, the optical member of the present invention includes the stress-dispersing film of the present invention. The electronic component of the present invention includes the stress-dispersing film of the present invention. [Examples] Hereinafter, the present invention will be specifically described using examples, but the present invention is not limited to those examples. In addition, the test and evaluation method in an Example etc. are as follows. In addition, when it is described as "part", it means "weight part" as long as it is not specifically described, and when it is described as "%", it means "weight%" as long as it is not specifically described. <Measurement of weight average molecular weight> The weight average molecular weight (Mw) of the polymer was measured using a GPC device (HLC-8220GPC) manufactured by Tosoh Corporation. In addition, a weight average molecular weight (Mw) is calculated | required from the polystyrene conversion value. The measurement conditions are shown below. Sample concentration: 0.2% by weight (THF solution) Sample injection volume: 10 μl eluent THF flow rate: 0.6 ml / min Measurement temperature: 40 ° C Sample column: TSKguardcolumn SuperHZ-H (1) + TSKgel SuperHZM-H ( (2) Reference column: TSKgel SuperH-RC (1) Detector: Differential refractometer (RI) <Production of adhesive sheet (A)> (Examples 1, 3, 5, 7, 9, 11, 13 , 15, 17, 19, 21, 23, 25, 26, Comparative Examples 1, 3, 5, 7) The obtained adhesive composition was coated with a grooved roller so that the thickness after drying became 10 μm. The base material of the polyester resin "Lumirror S10" (thickness: 50 μm, manufactured by Toray Corporation) was cured and dried at a drying temperature of 130 ° C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, the surface of the adhesive layer was bonded to the silicone-treated surface of a substrate containing a polyester resin and having a thickness of 25 μm, which was silicone-treated, to obtain an adhesive sheet (A). (Examples 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, Comparative Examples 2, 4, 6, 8) The obtained adhesive composition was dried to a thickness of The method is 22 μm, which is coated on a polyester resin-containing substrate “Lumirror S10” (thickness: 38 μm, manufactured by Toray Co., Ltd.) using a grooved roller, and cured and dried at a drying temperature of 130 ° C and a drying time of 30 seconds. . In this way, an adhesive layer is formed on the substrate. Next, the surface of the adhesive layer was bonded to the silicone-treated surface of a substrate containing a polyester resin having a thickness of 25 μm, which was silicone-treated, to obtain an adhesive sheet (A). <Measurement of the indentation energy> Using the "SAICASDN-20" manufactured by Daipla Wintes, the indentation energy was calculated in the following order at a measurement temperature: 25 ° C and an indentation speed: 5 μm / sec. (Procedure 1) The adhesive layer side of the obtained adhesive sheet (A) is attached to a flat indenter (load detection side), and the substrate side of the adhesive sheet (A) attached to the aforementioned flat indenter is pressed. Press into a spherical indenter and calculate the indentation depth (μm) when a load of 20 N is detected. (Procedure 2) The adhesive layer side of the obtained adhesive sheet (A) was attached to a glass slide, and the base material side (load detection side) of the adhesive sheet (A) attached to the above glass slide was used in a spherical shape. Press in and press to the depth of indentation obtained in Procedure 1. When the vertical load received by the spherical indenter is set to y = f (x) (x: press-in depth), the pressure until 20 N is applied to the adhesive layer side of the adhesive sheet (A) is calculated using the following formula. Insertion energy W (μJ) (r is the press-in depth when a load of 20 N is applied to the adhesive layer side of the adhesive sheet (A)). [Number 1] <Preparation of Adhesive Sheet (B)> The obtained adhesive composition was coated with a groove roller to a thickness of 38 μm after the peeling treatment was performed on one side with silicone so that the thickness after drying became 50 μm. The peeled surface of the polyester film (trade name: MRF, manufactured by Mitsubishi Chemical Polyester Co., Ltd.) was cured and dried at a drying temperature of 130 ° C and a drying time of 3 minutes. In this way, an adhesive layer is formed on the substrate. Then, on the surface of the adhesive layer, the release-treated surface of the film became the adhesive layer side, and a polyester film (trade name: MRF, Mitsubishi Chemical Corporation) having a thickness of 38 μm after being peeled off from one side by silicone was coated. Polyester Co., Ltd.). In this way, an adhesive sheet (B) was produced. <Measurement of glass transition temperature (Tg), storage modulus, loss elastic modulus, tan δ (loss tangent)> It was determined by the following method using a dynamic viscoelasticity measuring device (manufactured by Rheometric, ARES). Take out only the adhesive layer from the obtained adhesive sheet (B), laminate and set it to a thickness of about 2 mm, and punch it to 7.9 mm, cylindrical particles were prepared and used as measurement samples. Fix the above measurement sample to For a 7.9 mm parallel plate fixture, the temperature dependence of the storage modulus G 'and the loss elastic modulus G "was measured by the above-mentioned dynamic viscoelasticity measuring device, and tnaδ was calculated by setting tanδ = G" / G'. In addition, the temperature at which the obtained tanδ curve became maximum was defined as the glass transition temperature (Tg) (° C). The measurement conditions are shown below. Measurement: Shear mode, Temperature range: -70 ° C to 150 ° C, Heating rate: 5 ° C / min, Frequency: 1 Hz [Production Example 1]: (meth) acrylic polymer (1) A stirring blade, a thermometer, Into a four-necked flask of a nitrogen introduction tube and a condenser, 2-ethylhexyl acrylate (manufactured by Nippon Catalytic Corporation) was added: 100 parts by weight, 2-hydroxyethyl acrylate (manufactured by Toa Synthesis Co., Ltd.): 4 parts by weight, as polymerization 2,2'-Azobisisobutyronitrile as a starter (manufactured by Wako Pure Chemical Industries, Ltd.): 0.2 parts by weight, ethyl acetate: 156 parts by weight, nitrogen was introduced while slowly stirring, and the temperature of the liquid in the flask was maintained A polymerization reaction was performed at about 65 ° C. for 6 hours to prepare a solution (40% by weight) of a (meth) acrylic polymer (1) having a weight average molecular weight of 550,000. [Manufacturing Example 2]: (meth) acrylic polymer (2) To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser, 2-ethylhexyl acrylate (manufactured by Nippon Catalysts) was added. : 100 parts by weight, 4-hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.): 10 parts by weight, acrylic acid (manufactured by Toa Synthesis Co., Ltd.): 0.02 parts by weight, 2,2'-azobis as a polymerization initiator Isobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 0.2 parts by weight, ethyl acetate: 156 parts by weight, nitrogen was introduced while slowly stirring, and the temperature of the liquid in the flask was maintained at about 65 ° C., and a polymerization reaction was performed for 6 hours to prepare A solution (40% by weight) of a (meth) acrylic polymer (2) having a weight average molecular weight of 540,000. [Manufacturing Example 3]: (meth) acrylic polymer (3) To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser, butyl acrylate (manufactured by Nippon Catalytic Corporation) was added: 99 parts by weight 4-hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.): 1 part by weight, 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator: 1 part by weight, Ethyl acetate: 156 parts by weight. Nitrogen was introduced while slowly stirring. The temperature of the liquid in the flask was maintained at about 60 ° C, and a polymerization reaction was performed for 7 hours to prepare a (meth) acrylic polymer (3,6,5,8,5,5,8,5,5,3,5,3,5,5,3,5,3,5,5,3,5,5,5,5,5,3,5,3,3,5,5,5,5, and a (meth) acrylic polymer having a weight average molecular weight of 1,600,000 (3 ) Solution (39% by weight). [Manufacturing Example 4]: (meth) acrylic polymer (4) To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser, butyl acrylate (manufactured by Nippon Catalytic Corporation) was added: 92 parts by weight N-propylene Porphyrin (manufactured by Hingren Co., Ltd.): 5 parts by weight, acrylic acid (manufactured by Toa Kasei Corporation): 2.9 parts by weight, 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator: 0.1 parts by weight, ethyl acetate: 200 parts by weight, nitrogen was introduced while slowly stirring, and the temperature of the liquid in the flask was maintained near 55 ° C, and a polymerization reaction was performed for 8 hours to prepare a (meth) acrylic acid having a weight average molecular weight of 1.8 million. Solution (33% by weight) of polymer (4). [Manufacturing Example 5]: (meth) acrylic polymer (5) To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser, butyl acrylate (manufactured by Nippon Catalysts) was added: 95 parts by weight Acrylic acid (manufactured by Toa Synthesis): 5 parts by weight, 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator: 0.2 parts by weight, ethyl acetate: 156 parts by weight Nitrogen was introduced while slowly stirring, and the temperature of the liquid in the flask was maintained near 63 ° C., and a polymerization reaction was performed for 10 hours to prepare a solution (40% by weight) of a (meth) acrylic polymer (5) having a weight average molecular weight of 700,000. ). [Production Example 6]: (Meth) acrylic polymer containing alicyclic structure (6) Cyclohexyl methacrylate [homopolymer (cyclohexyl methacrylate)] as a monomer component Transfer temperature: 66 ° C]: 95 parts by weight, acrylic acid: 5 parts by weight, 2-mercaptoethanol as a chain transfer agent: 3 parts by weight, 2,2'-azobisisobutyronitrile as a polymerization initiator: 0.2 Parts by weight and toluene as a polymerization solvent: 103.2 parts by weight was put into a separable flask, and stirred for 1 hour while introducing nitrogen gas. In this way, after removing the oxygen in the polymerization system, the temperature was raised to 70 ° C. and allowed to react for 3 hours, and further, the reaction was allowed to react at 75 ° C. for 2 hours to obtain a (meth) acrylic polymer (6) having a weight average molecular weight of 4,000. ) Solution (50% by weight). [Production Example 6]: (Meth) acrylic polymer containing alicyclic structure (7) To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, a condenser, and a dropping funnel: 100 weight Parts, dicyclopentyl methacrylate (DCPMA) (trade name: FA-513M, manufactured by Hitachi Chemical Co., Ltd.): 60 parts by weight, methyl methacrylate (MMA): 40 parts by weight, and a chain transfer agent Methyl thioglycolate: 3.5 parts by weight. Then, after stirring for 1 hour in a nitrogen gas atmosphere at 70 ° C, 2,2'-azobisisobutyronitrile, which is a polymerization initiator, was added in an amount of 0.2 parts by weight, and reacted at 70 ° C for 2 hours, and then at 80 ° C. After reacting for 4 hours, it was reacted at 90 ° C for 1 hour to obtain a solution (51% by weight) of a (meth) acrylic polymer (7) having a weight average molecular weight of 4,000. [Examples 1 and 2] In the solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (1), the overall solid form The content of the composition was 25% by weight, diluted with ethyl acetate, and stirred with a disperser to obtain an adhesive composition (1) containing an acrylic resin. The results are shown in Table 1. [Examples 3 and 4] In a solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the (meth) acrylic polymer (1) solution was used as a solid For the conversion of ingredients, add 0.01 parts by weight of Coronate L (manufactured by Japan Polyurethane Industry Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetoacetone (manufactured by Japan Chemical Industry Co., Ltd.) as a cross-linking catalyst based on solid content conversion. The component was 25% by weight, diluted with ethyl acetate, and stirred with a disperser to obtain an adhesive composition (2) containing an acrylic resin. The results are shown in Table 1. [Examples 5 and 6] In the solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (1) was used as the solid In terms of composition, add 0.1 part by weight of Coronate L (manufactured by Japan Polyurethanes Industry Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetoacetone (manufactured by Japan Chemical Industry Co., Ltd.) as cross-linking catalysts based on solid content conversion. The component was 25% by weight, diluted with ethyl acetate, and stirred with a disperser to obtain an adhesive composition (3) containing an acrylic resin. The results are shown in Table 1. [Examples 7 and 8] In a solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (1) was used as a solid Component conversion: Add 0.05 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industry Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetonide (manufactured by Nippon Chemical Industry Co., Ltd.) as a cross-linking catalyst based on solid content conversion. 5 parts by weight of the solution of the (meth) acrylic polymer (6) was added, and the total solid content was 25% by weight. The solution was diluted with ethyl acetate and stirred with a disperser to obtain an acrylic resin. Adhesive composition (4). The results are shown in Table 1. [Examples 9 and 10] In a solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the (meth) acrylic polymer (1) solution was used as a solid For the conversion of ingredients, add 0.1 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industry Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetoacetone (manufactured by Japan Chemical Industry Co., Ltd.) as a cross-linking catalyst based on solid content conversion. 5 parts by weight of the solution of the (meth) acrylic polymer (6) was added, and the total solid content was 25% by weight. The solution was diluted with ethyl acetate and stirred with a disperser to obtain an acrylic resin. Adhesive composition (5). The results are shown in Table 1. [Examples 11 and 12] In the solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (1) was used as the solid For component conversion, add 0.3 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industrial Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetone iron oxide (manufactured by Japan Chemical Industry Co., Ltd.) as a cross-linking catalyst based on solid content conversion. 5 parts by weight of the solution of the (meth) acrylic polymer (6) was added, and the total solid content was 25% by weight. The solution was diluted with ethyl acetate and stirred with a disperser to obtain an acrylic resin. Adhesive composition (6). The results are shown in Table 1. [Examples 13 and 14] In a solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (1) was used as a solid For the conversion of ingredients, add 0.1 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industry Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetoacetone (manufactured by Japan Chemical Industry Co., Ltd.) as a cross-linking catalyst based on solid content conversion. 5 parts by weight of the solution of the (meth) acrylic polymer (7) was added, and the total solid content was 25% by weight. The solution was diluted with ethyl acetate and stirred with a disperser to obtain an acrylic resin. Adhesive composition (7). The results are shown in Table 1. [Examples 15 and 16] In a solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the (meth) acrylic polymer (1) solution was used as a solid For component conversion, add 0.3 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industrial Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetone iron oxide (manufactured by Japan Chemical Industry Co., Ltd.) as a cross-linking catalyst based on solid content conversion. 5 parts by weight of the solution of the (meth) acrylic polymer (7) was added, and the total solid content was 25% by weight. The solution was diluted with ethyl acetate and stirred with a disperser to obtain an acrylic resin. Adhesive composition (8). The results are shown in Table 1. [Examples 17 and 18] In the solution of the (meth) acrylic polymer (2), 100 parts by weight relative to the solid content of the solution of the (meth) acrylic polymer (2), the overall solid form The content of the composition was 25% by weight, and the mixture was diluted with ethyl acetate and stirred with a disperser to obtain an adhesive composition (9) containing an acrylic resin. The results are shown in Table 2. [Examples 19 and 20] In the solution of the (meth) acrylic polymer (2), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (2) was used as the solid Ingredient conversion: Add 0.1 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industrial Co., Ltd.) as a cross-linking agent, add 0.05 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) in terms of solid content, and add iron acetamidine in terms of solid content. (Manufactured by Nippon Chemical Industry Co., Ltd.) 0.005 parts by weight is used as a cross-linking catalyst, and the total solid content is 25% by weight. It is diluted with ethyl acetate and stirred with a disperser to obtain an adhesive containing acrylic resin. Composition (10). The results are shown in Table 2. [Examples 21 and 22] In the solution of the (meth) acrylic polymer (3), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (3) was used as the solid Add 0.02 parts by weight of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a cross-linking agent and 0.005 parts by weight of iron acetoacetone (manufactured by Japan Chemical Industry Co., Ltd.) as a cross-linking catalyst in terms of solid content. The component was 25% by weight, diluted with ethyl acetate, and stirred with a disperser to obtain an adhesive composition (11) containing an acrylic resin. The results are shown in Table 2. [Examples 23 and 24] In the solution of the (meth) acrylic polymer (5), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (5) was used as the solid Component conversion Add 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetoacetone (manufactured by Nippon Chemical Industry Co., Ltd.) as a cross-linking catalyst based on solid content conversion. The content of the material component was 25% by weight, diluted with ethyl acetate, and stirred with a disperser to obtain an adhesive composition (12) containing an acrylic resin. The results are shown in Table 2. [Example 25] An adhesive composition (13) containing a rubber-based resin was obtained by diluting with toluene so that the total solid content was 25% by weight based on 100 parts by weight of HYBRAR 5125 (made by Kuraray). . The results are shown in Table 2. [Example 26] An adhesive composition (14) containing a rubber-based resin was obtained by diluting with toluene so that the total solid content was 25% by weight based on 100 parts by weight of HYBRAR 5127 (made by Kuraray). . The results are shown in Table 2. [Comparative Examples 1, 2] In a solution of the (meth) acrylic polymer (1), 100 parts by weight of the solid content of the (meth) acrylic polymer (1) solution was used as a solid Add 0.5 part by weight of Coronate L (manufactured by Japan Polyurethanes Industry Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetoacetone (manufactured by Japan Chemical Industry Co., Ltd.) as a cross-linking catalyst in terms of solid content. The component was 25% by weight, diluted with ethyl acetate, and stirred with a disperser to obtain an adhesive composition (C1) containing an acrylic resin. The results are shown in Table 2. [Comparative Examples 3 and 4] In the solution of the (meth) acrylic polymer (2), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (2) was used as the solid For component conversion, add 0.45 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industrial Co., Ltd.) as a cross-linking agent, add 0.3 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) in terms of solid content, and add iron acetamidine in terms of solid content. (Manufactured by Nippon Chemical Industry Co., Ltd.) 0.005 parts by weight is used as a cross-linking catalyst, and the total solid content is 25% by weight. It is diluted with ethyl acetate and stirred with a disperser to obtain an adhesive containing acrylic resin Composition (C2). The results are shown in Table 2. [Comparative Examples 5 and 6] In the solution of the (meth) acrylic polymer (4), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (4) was used as the solid Ingredient conversion: Add 0.3 parts by weight of Coronate L (manufactured by Japan Polyurethanes Industry Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetonide (manufactured by Japan Chemical Industry Co., Ltd.) as cross-linking catalysts based on solid content conversion. The overall solids The component was 25% by weight, diluted with ethyl acetate, and stirred with a disperser to obtain an adhesive composition (C3) containing an acrylic resin. The results are shown in Table 2. [Comparative Examples 7, 8] In a solution of the (meth) acrylic polymer (5), 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (5) was used as a solid For component conversion, add 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent, and add 0.005 parts by weight of iron acetoacetone (manufactured by Nippon Chemical Industry Co., Ltd.) as a cross-linking catalyst, based on solid content 20 parts by weight of the solution of the (meth) acrylic polymer (6) was added in terms of components, and the total solid content was 25% by weight. The solution was diluted with ethyl acetate and stirred with a disperser to obtain an acrylic-containing polymer. Resin adhesive composition (C4). The results are shown in Table 2. [Table 1] [Table 2] [Example 27] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (1) obtained in Examples 1 and 2, the polyester film was peeled off from one side and pasted. An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 28] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (2) obtained in Examples 3 and 4, the polyester film was peeled off from one side and pasted. An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 29] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (4) obtained in Examples 7 and 8, the polyester film was peeled off from one side and pasted. An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 30] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (7) obtained in Examples 13 and 14, the polyester film was peeled off from one side and pasted. An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 31] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (9) obtained in Examples 17, 18, the polyester film was peeled off from one side, and An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 32] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (10) obtained in Examples 19 and 20, the polyester film was peeled off from one side and pasted. An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 33] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (11) obtained in Examples 21 and 22, the polyester film was peeled off from one side and pasted. An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 34] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (12) obtained in Examples 23 and 24, the polyester film was peeled off from one side and pasted. An optical member was bonded to a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC"), and an optical member to which an adhesive sheet was bonded was obtained. [Example 35] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (13) obtained in Example 25, the polyester film was peeled off from one side and bonded to As a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC") as an optical member, an optical member to which an adhesive sheet was bonded was obtained. [Example 36] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (14) obtained in Example 26, the polyester film was peeled off from one side and bonded to As a polarizing plate (manufactured by Nitto Denko Corporation, trade name "TEG1465DUHC") as an optical member, an optical member to which an adhesive sheet was bonded was obtained. [Example 37] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (1) obtained in Examples 1 and 2, the polyester film was peeled off from one side and pasted. A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 38] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (2) obtained in Examples 3 and 4, the polyester film was peeled off from one side and pasted. A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 39] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (4) obtained in Examples 7 and 8, the polyester film was peeled off from one side and pasted. A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 40] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (7) obtained in Examples 13 and 14, the polyester film was peeled off from one side and pasted. A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 41] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (9) obtained in Examples 17, 18, the polyester film was peeled off from one side, and pasted A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 42] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (10) obtained in Examples 19 and 20, the polyester film was peeled off from one side and pasted. A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 43] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (11) obtained in Examples 21 and 22, the polyester film was peeled off from one side and pasted. A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 44] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (12) obtained in Examples 23 and 24, the polyester film was peeled off from one side and pasted. A conductive film (produced by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP") was used as an electronic component to obtain an electronic component to which an adhesive sheet was bonded. [Example 45] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (13) obtained in Example 25, the polyester film was peeled off from one side and bonded to As a conductive film of an electronic component (manufactured by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP"), an electronic component having an adhesive sheet bonded thereto was obtained. [Example 46] For each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (14) obtained in Example 26, the polyester film was peeled off from one side and bonded to As a conductive film of an electronic component (manufactured by Nitto Denko Corporation, trade name "ELECRYSTA V270L-TFMP"), an electronic component having an adhesive sheet bonded thereto was obtained. [Industrial Applicability] The stress-dispersing film of the present invention can be suitably used, for example, as a protective material for the purpose of protecting an optical member or an electronic member from an external impact or the like.

10‧‧‧塑膠膜10‧‧‧plastic film

20‧‧‧黏著劑層20‧‧‧ Adhesive layer

100‧‧‧應力分散膜100‧‧‧ Stress Dispersion Film

圖1係本發明之一實施形態之應力分散膜之概略剖視圖。 圖2係本發明之另一實施形態之應力分散膜之概略剖視圖。FIG. 1 is a schematic cross-sectional view of a stress dispersion film according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a stress dispersion film according to another embodiment of the present invention.

Claims (8)

一種應力分散膜，其係 包含塑膠膜與黏著劑層之積層體者，且 該塑膠膜之厚度為15 μm～300 μm， 該黏著劑層之厚度為1 μm～300 μm， 該黏著劑層由黏著劑組合物形成，該黏著劑組合物包含聚合物(A)或橡膠系樹脂，該聚合物(A)具有：來自具有碳數1～20之烷基作為烷基酯部分之(甲基)丙烯酸烷基酯的單體單元(I)，及來自分子內具有OH基及/或COOH基之(甲基)丙烯酸酯的單體單元(II)， 自該積層體之塑膠膜側朝與該積層體垂直之方向上施加負載時之壓入能量為280 μJ以上7000 μJ以下， 其中，上述壓入能量之測定以如下方式進行： 使用Daipla Wintes公司製造之「SAICASDN-20型」，於測定溫度：25℃、壓入速度：5 μm/sec之條件下，按照下述順序，計算壓入能量： (順序1) 將上述積層體之黏著劑層側貼付於平坦壓頭(負載檢測側)，將貼付於該平坦壓頭的該積層體之塑膠膜側壓入至球形壓頭，算出檢測到20 N之負載時之壓入深度(μm)， (順序2) 將上述積層體之黏著劑層側貼付於載玻片，利用球形壓頭自貼付於該載玻片之該積層體之塑膠膜側(負載檢測側)壓入，壓入至順序1中所求得之壓入深度， 於將球形壓頭所受之垂直負載設為y＝f(x)(x：壓入深度)時，利用下述式算出對上述積層體之黏著劑層側施加20 N為止之壓入能量W(μJ)(r為對上述積層體之黏著劑層側施加20 N之負載時之壓入深度)， [數1]。A stress dispersing film is a laminated body comprising a plastic film and an adhesive layer, and the thickness of the plastic film is 15 μm to 300 μm, and the thickness of the adhesive layer is 1 μm to 300 μm. The adhesive layer consists of An adhesive composition is formed. The adhesive composition contains a polymer (A) or a rubber-based resin, and the polymer (A) has (meth) derived from an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety. The monomer unit (I) of the alkyl acrylate and the monomer unit (II) derived from a (meth) acrylate having an OH group and / or a COOH group in the molecule are directed from the plastic film side of the laminate to the The press-in energy when a load is applied in a vertical direction of the laminated body is 280 μJ or more and 7000 μJ or less, wherein the measurement of the above-mentioned press-in energy is performed as follows: “SAICASDN-20” manufactured by Daipla Wintes is used to measure the temperature : 25 ° C, indentation speed: 5 μm / sec, calculate indentation energy in the following order: (Procedure 1) Stick the adhesive layer side of the laminated body to a flat indenter (load detection side), Press the plastic film side of the laminated body attached to the flat indenter Spherical indenter to calculate the indentation depth (μm) when a load of 20 N is detected. (Procedure 2) The adhesive layer side of the laminated body is attached to a glass slide, and the glass indenter is used to self-adhere to the glass slide. Press the plastic film side (load detection side) of the laminated body to the depth of indentation obtained in Sequence 1. Set the vertical load on the spherical indenter to y = f (x) (x : Indentation depth), the following formula is used to calculate the indentation energy W (μJ) until 20 N is applied to the adhesive layer side of the laminated body (r is a load of 20 N to the adhesive layer side of the laminated body) Pressing depth of time), [Number 1] . 如請求項1之應力分散膜，其中上述塑膠膜之厚度為20 μm～300 μm。For example, the stress dispersing film of claim 1, wherein the thickness of the plastic film is 20 μm to 300 μm. 如請求項1或2之應力分散膜，其中上述黏著劑層之厚度為1 μm～150 μm。The stress-dispersing film according to claim 1 or 2, wherein the thickness of the above-mentioned adhesive layer is 1 μm to 150 μm. 如請求項1至3中任一項之應力分散膜，其中於將上述黏著劑組合物中之NCO基之莫耳含有比率記為[NCO]，將該黏著劑組合物中之環氧基之莫耳含有比率記為[EPOXY]，將該黏著劑組合物中之OH基之莫耳含有比率記為[OH]，將該黏著劑組合物中之COOH基之莫耳含有比率記為[COOH]時，([NCO]＋[EPOXY])/([OH]＋[COOH])＜0.05。The stress-dispersing film according to any one of claims 1 to 3, wherein the molar content ratio of the NCO group in the adhesive composition is described as [NCO], and the epoxy group in the adhesive composition is The Mohr content ratio is denoted as [EPOXY], the Mohr content ratio of OH groups in the adhesive composition is denoted as [OH], and the Mohr content ratio of COOH groups in the adhesive composition is denoted as [COOH ], ([NCO] + [EPOXY]) / ([OH] + [COOH]) <0.05. 如請求項1至4中任一項之應力分散膜，其中上述黏著劑組合物包含2官能基以上之有機聚異氰酸酯系交聯劑及/或環氧系交聯劑。The stress-dispersing film according to any one of claims 1 to 4, wherein the adhesive composition contains an organic polyisocyanate-based crosslinking agent and / or an epoxy-based crosslinking agent having two or more functional groups. 如請求項1至5中任一項之應力分散膜，其中上述黏著劑層之-40℃～150℃之全溫度範圍中之損耗正切tanδ為0.10以上。The stress-dispersing film according to any one of claims 1 to 5, wherein the loss tangent tan δ in the entire temperature range of -40 ° C to 150 ° C of the above-mentioned adhesive layer is 0.10 or more. 一種光學構件，其具備如請求項1至6中任一項之應力分散膜。An optical member including the stress dispersing film according to any one of claims 1 to 6. 一種電子構件，其具備如請求項1至6中任一項之應力分散膜。An electronic component including the stress-dispersing film according to any one of claims 1 to 6.
TW107133843A 2016-01-27 2016-09-08 Stress dispersion film, optical member, and electronic member TWI679265B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016013092 2016-01-27
JP??2016-013092 2016-01-27
JP??2016-159419 2016-08-16
JP2016159419A JP6151416B1 (en) 2016-01-27 2016-08-16 Stress dispersion film, optical member, and electronic member

Publications (2)

Publication Number Publication Date
TW201900804A true TW201900804A (en) 2019-01-01
TWI679265B TWI679265B (en) 2019-12-11

Family

ID=59082005

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105129053A TWI638878B (en) 2016-01-27 2016-09-08 Stress dispersion film, optical member, and electronic member
TW107133843A TWI679265B (en) 2016-01-27 2016-09-08 Stress dispersion film, optical member, and electronic member

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105129053A TWI638878B (en) 2016-01-27 2016-09-08 Stress dispersion film, optical member, and electronic member

Country Status (6)

Country Link
JP (2) JP6151416B1 (en)
KR (3) KR101888341B1 (en)
CN (2) CN108138004B (en)
SG (2) SG11201800572XA (en)
TW (2) TWI638878B (en)
WO (1) WO2017130444A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102399857B1 (en) 2017-09-28 2022-05-20 닛토덴코 가부시키가이샤 Reinforcing film
JP6467548B1 (en) 2017-09-28 2019-02-13 日東電工株式会社 Reinforcement film
JP6581694B1 (en) 2018-06-27 2019-09-25 日東電工株式会社 Reinforcement film
JP6581704B1 (en) 2018-08-27 2019-09-25 日東電工株式会社 Reinforcement film
JP2020033400A (en) 2018-08-27 2020-03-05 日東電工株式会社 Laminate
JP7111558B2 (en) 2018-08-27 2022-08-02 日東電工株式会社 laminate
JP6995033B2 (en) * 2018-09-27 2022-01-14 日東電工株式会社 Reinforcing film
CN111325071A (en) * 2018-12-17 2020-06-23 上海箩箕技术有限公司 Optical adhesive and optical sensor module
CN113382858B (en) 2019-02-01 2024-02-27 日东电工株式会社 Intermediate laminate, method for producing intermediate laminate, and method for producing product laminate
JP7348727B2 (en) 2019-02-12 2023-09-21 日東電工株式会社 reinforcing film
KR20200098401A (en) 2019-02-12 2020-08-20 닛토덴코 가부시키가이샤 Reinforcing film, method for making device and reinforcing method
TWI779211B (en) 2019-02-12 2022-10-01 日商日東電工股份有限公司 Reinforcing film, manufacturing method and reinforcing method of device
JP7257165B2 (en) 2019-02-12 2023-04-13 日東電工株式会社 Device with reinforcing film, manufacturing method thereof, and reinforcing method
JP2020132659A (en) 2019-02-12 2020-08-31 日東電工株式会社 Reinforcement film, manufacturing method thereof, manufacturing method of device and reinforcement method
JP6803426B2 (en) 2019-05-14 2020-12-23 日東電工株式会社 Laminated body and its manufacturing method
JP6916836B2 (en) 2019-05-14 2021-08-11 日東電工株式会社 Method of manufacturing a laminate
JP2020196820A (en) 2019-06-03 2020-12-10 日東電工株式会社 Pressure sensitive adhesive sheet, pressure sensitive adhesive kit and laminate
USD922701S1 (en) 2019-12-23 2021-06-15 Samsung Electronics Co., Ltd. Shoe care machine
KR102566606B1 (en) 2021-11-19 2023-08-16 울산과학기술원 Method of polymer material analysis on surface and interfacial cutting analysis system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001294834A (en) * 2000-04-13 2001-10-23 Lintec Corp Pressure-sensitive adhesive composition and pressure- sensitive adhesive optical member using the same
US6720375B2 (en) * 2000-04-13 2004-04-13 Lintec Corporation Adhesive composition and adhesive optical component using the composition
US7208206B2 (en) * 2003-03-10 2007-04-24 Nitto Denko Corporation Glass crack prevention laminate and liquid crystal display device
JP2006036843A (en) * 2004-07-23 2006-02-09 Diatex Co Ltd Heat-resistant and moisture-resistant adhesive and adhesive sheet
JP4869748B2 (en) * 2006-03-14 2012-02-08 日東電工株式会社 Glass protective adhesive sheet and automotive glass protective film
JP5288733B2 (en) * 2007-05-31 2013-09-11 出光ユニテック株式会社 Surface protection film
JP5212688B2 (en) * 2007-10-26 2013-06-19 サイデン化学株式会社 Optical pressure-sensitive adhesive composition and optical functional film
JP5115218B2 (en) * 2008-01-30 2013-01-09 株式会社デンソー Starter
JP2012067315A (en) * 2011-11-02 2012-04-05 Nitto Denko Corp Pressure sensitive adhesive composition, double-sided pressure sensitive adhesive tape, and method for bonding
JP5785489B2 (en) * 2011-12-27 2015-09-30 旭化成イーマテリアルズ株式会社 Pellicle
JP5844201B2 (en) * 2012-03-30 2016-01-13 リンテック株式会社 Adhesive composition, adhesive and adhesive sheet
WO2014168178A1 (en) * 2013-04-11 2014-10-16 綜研化学株式会社 Laminate
JP6043240B2 (en) * 2013-05-13 2016-12-14 積水化学工業株式会社 Adhesive sheet for electronic equipment
JP6229926B2 (en) 2013-06-03 2017-11-15 大日本印刷株式会社 Adhesive composition and adhesive sheet using the same
JP6037990B2 (en) 2013-09-30 2016-12-07 大王製紙株式会社 Toilet roll packaging film and toilet roll packaging
JP6364224B2 (en) * 2014-05-02 2018-07-25 積水化学工業株式会社 Double-sided adhesive tape for fixing optical films

Also Published As

Publication number Publication date
TW201803955A (en) 2018-02-01
KR20180091962A (en) 2018-08-16
KR101888341B1 (en) 2018-08-13
WO2017130444A1 (en) 2017-08-03
JP6193525B1 (en) 2017-09-06
CN108138004B (en) 2021-11-23
KR20180038077A (en) 2018-04-13
TWI638878B (en) 2018-10-21
CN109181561A (en) 2019-01-11
JP2017160451A (en) 2017-09-14
CN109181561B (en) 2019-09-27
KR101888811B1 (en) 2018-08-14
JP6151416B1 (en) 2017-06-21
CN108138004A (en) 2018-06-08
SG10201802306WA (en) 2018-04-27
KR102035955B1 (en) 2019-10-23
TWI679265B (en) 2019-12-11
SG11201800572XA (en) 2018-02-27
KR20180022978A (en) 2018-03-06
JP2017132977A (en) 2017-08-03

Similar Documents

Publication Publication Date Title
TWI679265B (en) Stress dispersion film, optical member, and electronic member
TWI806823B (en) Adhesive composition, adhesive member, optical member, and electronic member
JP2014145023A (en) Multilayer pressure-sensitive adhesive sheet
TWI789344B (en) Adhesive composition, adhesive member, optical member, and electronic member
WO2022030307A1 (en) Reinforcing film, optical member, and electronic member
WO2022030305A1 (en) Film for reinforcement, optical member and electronic member
WO2022030304A1 (en) Reinforcement film, optical component, and electronic component
WO2022030306A1 (en) Film for reinforcement, optical member and electronic member
US20240132757A1 (en) Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, method for producing pressure-sensitive adhesive composition, and method for detecting presence of water or water vapor
TW202330829A (en) Reinforcement film
TW202108722A (en) Adhesive sheet and use of same