CN108108052A - Laser joint patterning and its etching wiring method - Google Patents
Laser joint patterning and its etching wiring method Download PDFInfo
- Publication number
- CN108108052A CN108108052A CN201711429710.6A CN201711429710A CN108108052A CN 108108052 A CN108108052 A CN 108108052A CN 201711429710 A CN201711429710 A CN 201711429710A CN 108108052 A CN108108052 A CN 108108052A
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- Prior art keywords
- line
- right angle
- etching
- laser
- bending structure
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The laser joint patterning and its etching wiring method, the first etching line in a kind of touch screen technology field are connected with the second adjacent etching line in stitching portion by the first right angle bending structure；First etching line is overlapped with the extended line of second etching line.The present invention is connected to oblique line section stitching portion using rectangular lateral etch line and vertical etching line, can ensure the splicing precision of oblique line section, avoids the occurrence of splicing deviation and causes short circuit.
Description
Technical field
The present invention relates to a kind of technologies in touch-screen field, are specifically a kind of laser joint patterning and its etching
Wiring method.
Background technology
It is respectively film and lower film laser pattern structure chart on ITO in touch-screen as shown in Figure 1A and 1B.ITO schemes in touch-screen
Case uses laser processing procedure, but the distance of laser once is limited, it is necessary to splice, thus can not realize that Fig. 1 C such as are preferably etched
Line cabling.There is the direct splicing of oblique line and oblique line splicing deviation in laser machine, this splicing deviation can cause part
Short circuit phenomenon.ITO pattern is most using diamond structure at present, inevitably needs to carry out diagonal stitch, as shown in Figure 2.
The content of the invention
The present invention is directed to deficiencies of the prior art, it is proposed that a kind of laser joint patterning and its etching cloth
Line method is connected to oblique line section stitching portion using rectangular lateral etch line and vertical etching line, can ensure oblique line section
Splice precision, avoid the occurrence of splicing deviation and cause short circuit.
The present invention is achieved by the following technical solutions：
The present invention relates to a kind of laser joint patterning, the first etching line is led to the second adjacent etching line in stitching portion
Cross right angle bending structure connection；
First etching line is overlapped with the extended line of second etching line.
The right angle bending structure includes several right angle corners being made of lateral etch line and vertical etching line, described
In right angle bending structure lateral etch line and vertical etching line be sequentially connected, continuous cabling.
Preferably, the right angle bending structure include a right angle corner, the vertical etching line at form right angle turning with
First etching line is connected, and the lateral etch line at form right angle turning is connected with the first etching line.
Preferably, the right angle bending structure is arranged in a planar graph, and the planar graph is diagonal including two groups；
Preferably, an axis of the ITO pattern unit divides one group of the planar graph diagonal, and plan view equally
Another group of shape is diagonally on the axisymmetrical；The quantity of the planar graph is no less than 2.
It is further preferred that 2 or 4 right angle bending structures are arranged in the planar graph.
Lateral etch line is equal with the length b of vertical etching line in the right angle bending structure, b not less than 0.2 millimeter and
No more than 0.5a millimeters, a is cornerwise length longer in planar graph.
The present invention relates to the etching wiring method of above-mentioned laser joint patterning, the two splicing etching line at connecting position
And right angle bending structure is etched to be formed by laser of unlatching.
The laser joint patterning includes several ITO pattern units for arranging connection in order, and one time laser is opened
Progress of etching in, laser cabling is more accurate along obtuse angle or right angle into walking line, while avoids away acute angle there are burst points
Defect.
Technique effect
Compared with prior art, the present invention is connected to the spelling of oblique line section using rectangular lateral etch line and vertical etching line
Place is met, can ensure the splicing precision of oblique line section, splicing deviation is avoided the occurrence of and causes short circuit；And laser can continuous cabling,
Improve the efficiency of etching wiring.
Description of the drawings
Figure 1A is film laser pattern structure chart on ITO in touch-screen in the prior art；
Figure 1B is ITO lower film laser pattern structure charts in touch-screen in the prior art；
Fig. 1 C are ITO pattern unit etching line ideal trace-diagram；
Fig. 2 is the actual trace-diagram of ITO pattern unit etching line；
Fig. 3 is part-structure schematic diagram in embodiment 1, etching when dotted line expression is not provided with right angle bending structure in figure
Line；
Fig. 4 is another laser pattern structure in embodiment 1；
In figure：First etching line 1, the second etching line 2, vertical etching line 3, lateral etch line 4.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention will be described in detail.
Embodiment 1
The present embodiment includes several ITO pattern units for arranging connection in order, several sections in the ITO pattern unit
Etching line connects to forming several diamond structures successively, and two splicing etching lines are oblique line at connecting position.
Preferably, symmetric figure centered on the diamond structure.
The present embodiment is optimized to being in the etching line at connecting position, is avoided the occurrence of splicing deviation and is caused short circuit,
Specific measure is：
1) it is raising etching efficiency, will be defaulted at etching line connecting position on the continuous diamond structure of a row, it is described
Each diamond structure is symmetrical arranged compared with the horizontal axis (as shown in Figure 1 C) of ITO pattern unit；
2) set on each diamond structure at default etching line connecting position as shown in Figure 2 lateral etch line 4 with it is vertical
The right angle bending structure that etching line 3 is formed, vertical etching line 3 are connected with the first etching line 1, and lateral etch line 4 and second etches
Line 2 is connected, and the extended line of the first etching line 1 and the second etching line 2 overlaps；
3) stability of product quality is considered, the figure that etching line is formed in ITO pattern unit is symmetric figure, in
2) non-stitching position is respectively provided with right angle bending structure, and structure (as shown by dotted lines in figure 3) on other each side on diamond structure
New centrosymmetric image is built, as shown in Figure 3；
Carry out laser-induced thermal etching accordingly, can continuous cabling, complete ITO pattern unit etching.
Preferably, the length of the lateral etch line 4 and vertical etching line 3 is b, and the scope of b is 0.2~0.5a millis
Rice, a are the diagonal distance of diamond structure.
Right angle bending structure is not limited in Fig. 3 sink into the diamond structure in the present embodiment, can also externally protrude out in described
Diamond structure；In addition without considering this problem of laser-induced thermal etching efficiency, etching line connecting position is also not necessarily limited in above-described embodiment
Position；The planar graph newly built is without Striking symmetry.
As a deformation of the present embodiment, etching line connecting position can also be set in two diamond structures being centrosymmetric
Point of intersection；At the etching line connecting position, lateral etch line 4 also can be set to tie as shown in Figure 4 with vertical etching line 3
Structure.
It is emphasized that：It the above is only presently preferred embodiments of the present invention, not the present invention made in any form
Limitation, any simple modification, equivalent change and modification that every technical spirit according to the invention makees above example,
In the range of still falling within technical solution of the present invention.
Claims (9)
1. a kind of laser joint patterning, it is characterized in that, the first etching line passes through with the second adjacent etching line in stitching portion
Right angle bending structure connection；
First etching line is overlapped with the extended line of second etching line.
2. laser joint patterning according to claim 1, it is characterized in that, the right angle bending structure includes several
The right angle corner being made of lateral etch line and vertical etching line, lateral etch line and vertical etching in the right angle bending structure
Line is sequentially connected, continuous cabling.
3. laser joint patterning according to claim 2, it is characterized in that, the right angle bending structure includes one
Right angle corner, the vertical etching line at form right angle turning are connected with the first etching line, the lateral etch line at form right angle turning with
First etching line is connected.
4. laser joint patterning according to claim 3, it is characterized in that, it is flat that the right angle bending structure is arranged at one
In the figure of face, the planar graph is diagonal including two groups；
Preferably, an axis of the ITO pattern unit divides one group of the planar graph diagonal, and the planar graph equally
Another group diagonally on the axisymmetrical.
5. laser joint patterning according to claim 4, it is characterized in that, lateral etch in the right angle bending structure
Line is equal with the length b of vertical etching line, and for b not less than 0.2 millimeter and no more than 0.5a millimeters, a is longer in planar graph
Cornerwise length.
6. laser joint patterning according to claim 4, it is characterized in that, 2 are arranged in the planar graph
Or 4 right angle bending structures.
7. laser joint patterning according to claim 4, it is characterized in that, the quantity of the planar graph is no less than 2
It is a.
8. a kind of method that wiring is etched to laser joint patterning described in any of the above-described claim, feature
It is that two splicing etching lines and right angle bending structure are etched to be formed by laser of unlatching at the connecting position.
9. the method for wiring is etched to laser joint patterning according to claim 8, it is characterized in that, the laser
Composed pattern structure includes several ITO pattern units for arranging connection in order, in the progress of etching that laser is opened, laser
Cabling is carried out along obtuse angle or right angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711429710.6A CN108108052B (en) | 2017-12-26 | 2017-12-26 | Laser splicing pattern structure and etching wiring method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711429710.6A CN108108052B (en) | 2017-12-26 | 2017-12-26 | Laser splicing pattern structure and etching wiring method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108108052A true CN108108052A (en) | 2018-06-01 |
| CN108108052B CN108108052B (en) | 2021-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711429710.6A Active CN108108052B (en) | 2017-12-26 | 2017-12-26 | Laser splicing pattern structure and etching wiring method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108108052B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110515485A (en) * | 2019-07-31 | 2019-11-29 | 芜湖伦丰电子触摸屏产业技术研究院有限公司 | A method of large scale touch screen function piece is prepared using small halftone |
| CN113146055A (en) * | 2021-02-24 | 2021-07-23 | 芜湖伦丰电子科技有限公司 | Laser engraving method of capacitive touch screen |
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| CN106708315A (en) * | 2016-12-01 | 2017-05-24 | 业成科技（成都）有限公司 | Touch panel and touch display device using touch panel |
| CN107255442A (en) * | 2017-06-06 | 2017-10-17 | 中国葛洲坝集团勘测设计有限公司 | Large scale hydraulic generator stator based on laser tracking technology installs measuring method |
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| WO2012145306A2 (en) * | 2011-04-18 | 2012-10-26 | Inguran Llc | Polymeric members and methods for marking polymeric members |
| CN103737182A (en) * | 2013-12-06 | 2014-04-23 | 南京第壹有机光电有限公司 | Method for laser etching of TCO pattern |
| CN105855711A (en) * | 2015-01-09 | 2016-08-17 | 位元奈米科技股份有限公司 | Laser etching method of transparent conductive plate and transparent conductive plate manufactured by same |
| CN104741794A (en) * | 2015-03-21 | 2015-07-01 | 温州大学 | Laser etching preparation method for surface array microstructure on basis of curved surface workpiece appearance |
| CN205074678U (en) * | 2015-09-09 | 2016-03-09 | 位元奈米科技股份有限公司 | Laser etching apparatus |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110515485A (en) * | 2019-07-31 | 2019-11-29 | 芜湖伦丰电子触摸屏产业技术研究院有限公司 | A method of large scale touch screen function piece is prepared using small halftone |
| CN110515485B (en) * | 2019-07-31 | 2022-05-10 | 芜湖伦丰电子触摸屏产业技术研究院有限公司 | Method for preparing large-size touch screen functional sheet by using small screen printing plate |
| CN113146055A (en) * | 2021-02-24 | 2021-07-23 | 芜湖伦丰电子科技有限公司 | Laser engraving method of capacitive touch screen |
| CN113146055B (en) * | 2021-02-24 | 2023-12-08 | 芜湖伦丰电子科技有限公司 | Laser engraving method of capacitive touch screen |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108108052B (en) | 2021-12-31 |
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