CN113146055A - Laser engraving method of capacitive touch screen - Google Patents
Laser engraving method of capacitive touch screen Download PDFInfo
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- CN113146055A CN113146055A CN202110205600.1A CN202110205600A CN113146055A CN 113146055 A CN113146055 A CN 113146055A CN 202110205600 A CN202110205600 A CN 202110205600A CN 113146055 A CN113146055 A CN 113146055A
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- 238000010147 laser engraving Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000004880 explosion Methods 0.000 abstract description 10
- 230000007547 defect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- General Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
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- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser engraving method of a capacitive touch screen, which comprises the following steps: splicing positions are selected at the connection positions of adjacent hexagons, and the laser wiring pattern is divided into a plurality of pattern blocks; under the condition of not changing a conductive channel of the capacitive touch screen, modifying the mode of connection of set inflection points of the splicing positions between every two adjacent pattern blocks into a mode of connection through linear extension to obtain improved pattern blocks; and sequentially carrying out laser engraving on each improved pattern block by a vibrating mirror block laser method. According to the invention, the splicing positions are arranged at the hexagonal connection positions, and the inflection points of the splicing positions are modified into straight lines, so that the technical defect that a plurality of laser points are overlapped due to the fact that the inflection points are arranged as the splicing positions is overcome, the number of laser lines to be spliced is reduced, and the problems that the conventional splicing positions are easy to generate explosion points and open and short circuits are solved.
Description
Technical Field
The invention relates to the technical field of laser engraving, in particular to a laser engraving method of a capacitive touch screen.
Background
In the process of manufacturing the capacitive screen, a process of engraving a circuit by laser is adopted, and unnecessary places are burnt by light, so that a required conductive channel is left; the capacitive screen that produces now also is bigger and bigger, and laser etching will be through the regional laser of a, and the laser equipment of capacitive screen divides the piece laser through the galvanometer, and will have a handing-over concatenation position between piece and the piece, and the problem of explosion point and open the short circuit easily appears in the concatenation position among the prior art usually.
Disclosure of Invention
The invention aims to provide a laser engraving method of a capacitive touch screen, which aims to solve the problem that the conventional splicing position is easy to have explosion points and open/short circuits.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides a laser engraving method of a capacitive touch screen, which comprises the following steps:
splicing positions are selected at the connection positions of adjacent hexagons, and the laser wiring pattern is divided into a plurality of pattern blocks; the laser routing patterns are formed by connecting adjacent hexagonal laser routing patterns in a mode of setting inflection point connection when the capacitive touch screen is subjected to laser engraving; each pattern block comprises n multiplied by m hexagons, the m hexagons are sequentially connected to form a hexagon row, the n hexagon rows form the pattern block, and the connection position of the m-th hexagon of each hexagon row of the previous pattern block and the 1 st hexagon of each hexagon row of the next pattern block in the two adjacent pattern blocks is the splicing position of the two adjacent pattern blocks;
under the condition of not changing a conductive channel of the capacitive touch screen, modifying the mode of connection of set inflection points of the splicing positions between every two adjacent pattern blocks into a mode of connection through linear extension to obtain improved pattern blocks;
and sequentially carrying out laser engraving on each improved pattern block by a vibrating mirror block laser method.
Optionally, the size of the pattern block is equal to the size of the galvanometer.
Optionally, the size of the galvanometer is 180mm × 180 mm.
The invention also provides another laser engraving method of the capacitive touch screen, which comprises the following steps:
under the condition that a conductive channel of the capacitive touch screen is not changed, the laser routing pattern which is adopted by the capacitive touch screen during laser engraving and is connected with the adjacent hexagons in a mode of setting inflection point connection is modified into the laser routing pattern which is connected with the adjacent hexagons in a mode of straight line extension connection and is used as an improved laser routing pattern;
splicing positions are selected at the connection positions of adjacent hexagons, and the improved laser routing pattern is divided into a plurality of pattern blocks; each pattern block comprises n multiplied by m hexagons, the m hexagons are sequentially connected to form a hexagon row, the n hexagon rows form the pattern block, and the connection position of the m-th hexagon of each hexagon row of the former pattern block and the 1 st hexagon of each hexagon row of the latter pattern block is the splicing position of two adjacent pattern blocks;
and sequentially carrying out laser engraving on the plurality of pattern blocks by a galvanometer blocking laser method.
Optionally, the size of the pattern block is equal to the size of the galvanometer.
Optionally, the size of the galvanometer is 180mm × 180 mm.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention discloses a laser engraving method of a capacitive touch screen, which comprises the following steps: splicing positions are selected at the connection positions of adjacent hexagons, and the laser wiring pattern is divided into a plurality of pattern blocks; the laser routing patterns are formed by connecting adjacent hexagonal laser routing patterns in a mode of setting inflection point connection when the capacitive touch screen is subjected to laser engraving; each pattern block comprises n multiplied by m hexagons, the m hexagons are sequentially connected to form a hexagon row, the n hexagon rows form the pattern block, and the connection position of the m-th hexagon of each hexagon row of the previous pattern block and the 1 st hexagon of each hexagon row of the next pattern block in the two adjacent pattern blocks is the splicing position of the two adjacent pattern blocks; under the condition of not changing a conductive channel of the capacitive touch screen, modifying the mode of connection of set inflection points of the splicing positions between every two adjacent pattern blocks into a mode of connection through linear extension to obtain improved pattern blocks; and sequentially carrying out laser engraving on each improved pattern block by a vibrating mirror block laser method. According to the invention, the splicing positions are arranged at the hexagonal connection positions, and the inflection points of the splicing positions are modified into straight lines, so that the technical defect that a plurality of laser points are overlapped due to the fact that the inflection points are arranged as the splicing positions is overcome, the number of laser lines to be spliced is reduced, and the problems that the conventional splicing positions are easy to generate explosion points and open and short circuits are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
Fig. 1 is a flowchart of a laser engraving method for a capacitive touch screen according to embodiment 1 of the present invention;
fig. 2 is a schematic view of a laser trace pattern of a conventional laser engraving method provided in embodiment 1 of the present invention;
fig. 3 is a schematic diagram of an explosion point phenomenon caused by a splice location arranged at an inflection point position according to embodiment 1 of the present invention;
fig. 4 is a schematic diagram illustrating a setting position of a splice in the laser engraving method according to embodiment 1 of the present invention;
fig. 5 is a schematic diagram of a splice location when a routing manner of the splice location is not modified according to embodiment 1 of the present invention;
FIG. 6 is a schematic diagram illustrating an improved way of routing a splice bit according to embodiment 1 of the present invention;
FIG. 7 is a schematic diagram of laser engraving by using an improved routing manner of splice bits according to embodiment 1 of the present invention;
fig. 8 is a schematic diagram of the deviation test result provided in embodiment 2 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a laser engraving method of a capacitive touch screen, which aims to solve the problem that the conventional splicing position is easy to have explosion points and open/short circuits.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example 1
The invention provides a laser engraving method of a capacitive touch screen, which comprises the following steps:
101, selecting splicing positions at the connection positions of adjacent hexagons, and dividing a laser wiring pattern into a plurality of pattern blocks; the laser routing patterns are formed by connecting adjacent hexagonal laser routing patterns in a mode of setting inflection point connection when the capacitive touch screen is subjected to laser engraving; each pattern block comprises n multiplied by m hexagons, the m hexagons are sequentially connected to form a hexagon row, the n hexagon rows form the pattern block, and the connection position of the m-th hexagon of each hexagon row of the previous pattern block and the 1 st hexagon of each hexagon row of the next pattern block in the two adjacent pattern blocks is the splicing position of the two adjacent pattern blocks.
Specifically, in the process of manufacturing the capacitive screen, a process is adopted as a laser etching line, and a normal mirror vibrating range is as follows: 180MM, i.e. when the product size is smaller than this size, it is possible to dispense with the use of a block laser; now, if a 86-inch capacitive screen is manufactured, the length and width are about 1950 MM 1120 MM: fig. 2 shows a prior art laser trace; in order to facilitate laser splicing, the splicing positions are considered to be arranged at the left and right positions in the middle of a straight line and cannot be arranged near the turning of the line.
The laser splicing position is the last section of laser, the start section of the next section of laser and the connecting position of the 2 places; therefore, the bending position can be avoided as much as possible, and the problem that a plurality of laser points are overlapped is avoided; fig. 3(a) shows the laser effect of the actual laser product splice site with a burst (i.e., data non-uniformity), and fig. 3(b) shows the actual burst data.
The splicing has the anomaly on this kind of laser, and anterior segment single-film test can't be controlled to the card (mutual capacitance product, data need X, can detect the capacitance value to the point after the Y axle makes up, and the open short circuit problem of passageway can be tested to anterior segment singleton), only back end sensor test can show. The bad quantity of the front section is more when the control is carried out on the rear section, the discovery time is delayed, and the great bad loss is caused. The occurrence rate of splicing abnormality is improved, and a large amount of defects can be avoided.
The present invention adjusts the splice location to the position shown by the dotted line in fig. 4, i.e., to the position where the laser line is narrow, as few lines as possible need to be spliced.
102, under the condition that a conductive channel of the capacitive touch screen is not changed, changing a mode of connection of set inflection points of a splicing position between every two adjacent pattern blocks into a mode of connection through linear extension to obtain improved pattern blocks.
The position shown by the dotted line in fig. 4 is exactly the place where the laser line turns, and as shown in fig. 5, the position is shown as one of the lines, the laser is a schematic of identifying 3 points in the head and the tail of each section of line, the routing of the laser can be planned according to the 3 points, if the laser is spliced in the place where the laser turns, the laser equipment needs to act on each point, the head and the tail points of the line section of the splicing position are also the points of the laser, the splicing precision of the self turning is not good, and all the current laser splicing positions are the points where the turning needs to be avoided.
The invention adopts the following method to adjust the laser routing method:
the position shown by the dotted line in fig. 4 is adjusted to the connection mode shown in fig. 6, so that the laser does not turn at the position of the splicing position, but the oblique line directly extends forwards, and thus, the line does not turn at the position. As shown in detail in fig. 7, fig. 7 shows 2 laser lines, and 3 points in the head and tail of the laser line can be found, which are far away from each other, and the splice is located at a position where the line turns away.
And 103, sequentially carrying out laser engraving on each improved pattern block by a vibrating mirror block laser method.
Example 2
The invention also provides another laser engraving method of the capacitive touch screen, which comprises the following steps:
under the condition that a conductive channel of the capacitive touch screen is not changed, the laser routing pattern which is adopted by the capacitive touch screen during laser engraving and is connected with the adjacent hexagons in a mode of setting inflection point connection is modified into the laser routing pattern which is connected with the adjacent hexagons in a mode of straight line extension connection and is used as an improved laser routing pattern;
splicing positions are selected at the connection positions of adjacent hexagons, and the improved laser routing pattern is divided into a plurality of pattern blocks; each pattern block comprises n multiplied by m hexagons, the m hexagons are sequentially connected to form a hexagon row, the n hexagon rows form the pattern block, and the connection position of the m-th hexagon of each hexagon row of the former pattern block and the 1 st hexagon of each hexagon row of the latter pattern block is the splicing position of two adjacent pattern blocks;
and sequentially carrying out laser engraving on the plurality of pattern blocks by a galvanometer blocking laser method.
Wherein the size of the pattern block is equal to the size of the galvanometer. The size of the galvanometer is 180mm multiplied by 180 mm.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention shifts the laser splicing to the position with less laser lines, adjusts the turning position of the original laser lines to be a straight oblique line, and carries out deviation test. Deviation tests prove that the maximum deviation fault tolerance of the drawing of the invention can reach 0.3mm, and the data can not have explosion points.
The deviation test refers to artificial adjustment of splicing and dislocation to simulate mass production, sometimes the influence on the rear section cannot be seen by the splicing and dislocation, and mainly depends on abnormal dislocation of splicing at ordinary times and how much dislocation is possible to occur; in fig. 8, fig. 8(a) to 8(c) show the simulated misalignment of 0.2MM, fig. 8(a) shows the Y-axis shift of 0.2MM, fig. 8(b) shows the X-axis shift of 0.2MM, and fig. 8(c) shows the X and Y shifts of 0.2 MM; FIGS. 8(d) -8 (f) show simulated misalignment of 0.3MM, Y-axis offset of 0.3MM for FIG. 8(d), X-axis offset of 0.3MM for FIG. 8(e), and X and Y both offset of 0.3MM for FIG. 8 (f); the capacitance data of each dislocation is tested, and the 0.3MM deviation is found to have no explosion point.
The deviation test shows that the data explosion point of the splicing position can be effectively improved, the probability of abnormal splicing is reduced when the splicing position is adjusted to a place with few laser lines, meanwhile, the laser routing at the place is adjusted, the defect of explosion point or open short circuit cannot be formed when splicing dislocation is lower than 0.3MM, and the yield of production and the flatness and stability of product data are improved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (6)
1. A laser engraving method of a capacitive touch screen is characterized by comprising the following steps:
splicing positions are selected at the connection positions of adjacent hexagons, and the laser wiring pattern is divided into a plurality of pattern blocks; the laser routing patterns are formed by connecting adjacent hexagonal laser routing patterns in a mode of setting inflection point connection when the capacitive touch screen is subjected to laser engraving; each pattern block comprises n multiplied by m hexagons, the m hexagons are sequentially connected to form a hexagon row, the n hexagon rows form the pattern block, and the connection position of the m-th hexagon of each hexagon row of the previous pattern block and the 1 st hexagon of each hexagon row of the next pattern block in the two adjacent pattern blocks is the splicing position of the two adjacent pattern blocks;
under the condition of not changing a conductive channel of the capacitive touch screen, modifying the mode of connection of set inflection points of the splicing positions between every two adjacent pattern blocks into a mode of connection through linear extension to obtain improved pattern blocks;
and sequentially carrying out laser engraving on each improved pattern block by a vibrating mirror block laser method.
2. The method of claim 1, wherein the size of the pattern block is equal to the size of the galvanometer.
3. A method for laser engraving of a capacitive touch screen according to claim 2, wherein the size of the galvanometer is 180mm x 180 mm.
4. A laser engraving method of a capacitive touch screen is characterized by comprising the following steps:
under the condition that a conductive channel of the capacitive touch screen is not changed, the laser routing pattern which is adopted by the capacitive touch screen during laser engraving and is connected with the adjacent hexagons in a mode of setting inflection point connection is modified into the laser routing pattern which is connected with the adjacent hexagons in a mode of straight line extension connection and is used as an improved laser routing pattern;
selecting splicing positions at the connection positions of adjacent hexagons, and dividing the improved laser routing pattern into a plurality of pattern blocks; each pattern block comprises n multiplied by m hexagons, the m hexagons are sequentially connected to form a hexagon row, the n hexagon rows form the pattern block, and the connection position of the m-th hexagon of each hexagon row of the former pattern block and the 1 st hexagon of each hexagon row of the latter pattern block is the splicing position of two adjacent pattern blocks;
and sequentially carrying out laser engraving on the plurality of pattern blocks by a galvanometer blocking laser method.
5. The method of claim 4, wherein the size of the pattern block is equal to the size of the galvanometer.
6. A method for laser engraving of a capacitive touch screen according to claim 5, wherein the size of the galvanometer is 180mm x 180 mm.
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| CN202110205600.1A CN113146055B (en) | 2021-02-24 | 2021-02-24 | Laser engraving method of capacitive touch screen |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102179631A (en) * | 2011-05-18 | 2011-09-14 | 苏州德龙激光有限公司 | Device and method for processing large-breadth light guide plate |
| CN108108052A (en) * | 2017-12-26 | 2018-06-01 | 张家港康得新光电材料有限公司 | Laser joint patterning and its etching wiring method |
| WO2019014036A1 (en) * | 2017-07-11 | 2019-01-17 | Corning Incorporated | Tiled displays and methods of manufacturing the same |
| CN109396657A (en) * | 2018-11-16 | 2019-03-01 | 北京易加三维科技有限公司 | More Laser correctives and joining method for increasing material manufacturing equipment |
| CN110653489A (en) * | 2019-09-18 | 2020-01-07 | 西安铂力特增材技术股份有限公司 | Multi-galvanometer rapid calibration method |
| CN111590209A (en) * | 2020-05-07 | 2020-08-28 | 中国科学院力学研究所 | Sectional continuous laser engraving method |
| CN111625153A (en) * | 2020-05-09 | 2020-09-04 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
| JPWO2020202976A1 (en) * | 2019-04-05 | 2020-10-08 |
-
2021
- 2021-02-24 CN CN202110205600.1A patent/CN113146055B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102179631A (en) * | 2011-05-18 | 2011-09-14 | 苏州德龙激光有限公司 | Device and method for processing large-breadth light guide plate |
| WO2019014036A1 (en) * | 2017-07-11 | 2019-01-17 | Corning Incorporated | Tiled displays and methods of manufacturing the same |
| CN108108052A (en) * | 2017-12-26 | 2018-06-01 | 张家港康得新光电材料有限公司 | Laser joint patterning and its etching wiring method |
| CN109396657A (en) * | 2018-11-16 | 2019-03-01 | 北京易加三维科技有限公司 | More Laser correctives and joining method for increasing material manufacturing equipment |
| JPWO2020202976A1 (en) * | 2019-04-05 | 2020-10-08 | ||
| CN110653489A (en) * | 2019-09-18 | 2020-01-07 | 西安铂力特增材技术股份有限公司 | Multi-galvanometer rapid calibration method |
| CN111590209A (en) * | 2020-05-07 | 2020-08-28 | 中国科学院力学研究所 | Sectional continuous laser engraving method |
| CN111625153A (en) * | 2020-05-09 | 2020-09-04 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
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