CN108103540A - Tin alloy electric plating liquid - Google Patents
Tin alloy electric plating liquid Download PDFInfo
- Publication number
- CN108103540A CN108103540A CN201810067046.3A CN201810067046A CN108103540A CN 108103540 A CN108103540 A CN 108103540A CN 201810067046 A CN201810067046 A CN 201810067046A CN 108103540 A CN108103540 A CN 108103540A
- Authority
- CN
- China
- Prior art keywords
- acid
- parts
- organic
- tin
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 50
- 239000007788 liquid Substances 0.000 title claims abstract description 40
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 39
- 125000000446 sulfanediyl group Chemical group *S* 0.000 claims abstract description 77
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229920001661 Chitosan Polymers 0.000 claims abstract description 68
- 239000002253 acid Substances 0.000 claims abstract description 64
- 239000005864 Sulphur Substances 0.000 claims abstract description 63
- 239000008139 complexing agent Substances 0.000 claims abstract description 54
- 239000006025 fining agent Substances 0.000 claims abstract description 50
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000003381 stabilizer Substances 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 150000003839 salts Chemical class 0.000 claims abstract description 36
- 239000008367 deionised water Substances 0.000 claims abstract description 34
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 34
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract description 32
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 32
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- BPMFZUMJYQTVII-UHFFFAOYSA-N guanidinoacetic acid Chemical compound NC(=N)NCC(O)=O BPMFZUMJYQTVII-UHFFFAOYSA-N 0.000 claims abstract description 6
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000001621 bismuth Chemical class 0.000 claims abstract description 4
- 150000001879 copper Chemical class 0.000 claims abstract description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 81
- -1 N- methyl guanidine radicals Chemical class 0.000 claims description 38
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 claims description 35
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 32
- 239000003795 chemical substances by application Substances 0.000 claims description 31
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims description 30
- KVBGVZZKJNLNJU-UHFFFAOYSA-N naphthalene-2-sulfonic acid Chemical compound C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 KVBGVZZKJNLNJU-UHFFFAOYSA-N 0.000 claims description 30
- 229910052709 silver Inorganic materials 0.000 claims description 28
- 239000000956 alloy Substances 0.000 claims description 27
- DLLMHEDYJQACRM-UHFFFAOYSA-N 2-(carboxymethyldisulfanyl)acetic acid Chemical compound OC(=O)CSSCC(O)=O DLLMHEDYJQACRM-UHFFFAOYSA-N 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 26
- 239000004332 silver Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 25
- HVBSAKJJOYLTQU-UHFFFAOYSA-N 4-aminobenzenesulfonic acid Chemical compound NC1=CC=C(S(O)(=O)=O)C=C1 HVBSAKJJOYLTQU-UHFFFAOYSA-N 0.000 claims description 23
- 229950000244 sulfanilic acid Drugs 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052706 scandium Inorganic materials 0.000 claims description 19
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 19
- HSXUNHYXJWDLDK-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid Chemical class CC(O)CS(O)(=O)=O HSXUNHYXJWDLDK-UHFFFAOYSA-N 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 18
- 229910052720 vanadium Inorganic materials 0.000 claims description 18
- 229910052748 manganese Inorganic materials 0.000 claims description 17
- 239000011572 manganese Substances 0.000 claims description 17
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 16
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- UHGULLIUJBCTEF-UHFFFAOYSA-N 2-aminobenzothiazole Chemical class C1=CC=C2SC(N)=NC2=C1 UHGULLIUJBCTEF-UHFFFAOYSA-N 0.000 claims description 15
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 10
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 8
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 7
- 150000007513 acids Chemical class 0.000 claims description 7
- 235000006408 oxalic acid Nutrition 0.000 claims description 7
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 6
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 6
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 6
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 6
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 claims description 6
- STNJBCKSHOAVAJ-UHFFFAOYSA-N Methacrolein Chemical compound CC(=C)C=O STNJBCKSHOAVAJ-UHFFFAOYSA-N 0.000 claims description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 6
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 claims description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 claims description 6
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 claims description 6
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 claims description 6
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 6
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 5
- 239000004202 carbamide Substances 0.000 claims description 5
- TWFSYIOOAAYYAL-UHFFFAOYSA-N 2,4,6-trichlorobenzaldehyde Chemical class ClC1=CC(Cl)=C(C=O)C(Cl)=C1 TWFSYIOOAAYYAL-UHFFFAOYSA-N 0.000 claims description 4
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical class C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- LJDVQYVDNYHZAV-UHFFFAOYSA-N ethanesulfonic acid;silver Chemical compound [Ag].CCS(O)(=O)=O LJDVQYVDNYHZAV-UHFFFAOYSA-N 0.000 claims description 4
- 150000002460 imidazoles Chemical class 0.000 claims description 4
- 150000002475 indoles Chemical class 0.000 claims description 4
- JJVNINGBHGBWJH-UHFFFAOYSA-N ortho-vanillin Chemical compound COC1=CC=CC(C=O)=C1O JJVNINGBHGBWJH-UHFFFAOYSA-N 0.000 claims description 4
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 claims description 3
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims description 3
- XHANCLXYCNTZMM-UHFFFAOYSA-N 2,5-dimethyl-1,3-benzothiazole Chemical class CC1=CC=C2SC(C)=NC2=C1 XHANCLXYCNTZMM-UHFFFAOYSA-N 0.000 claims description 3
- JWYUFVNJZUSCSM-UHFFFAOYSA-N 2-aminobenzimidazole Chemical class C1=CC=C2NC(N)=NC2=C1 JWYUFVNJZUSCSM-UHFFFAOYSA-N 0.000 claims description 3
- SRWILAKSARHZPR-UHFFFAOYSA-N 3-chlorobenzaldehyde Chemical compound ClC1=CC=CC(C=O)=C1 SRWILAKSARHZPR-UHFFFAOYSA-N 0.000 claims description 3
- WQPMYSHJKXVTME-UHFFFAOYSA-N 3-hydroxypropane-1-sulfonic acid Chemical class OCCCS(O)(=O)=O WQPMYSHJKXVTME-UHFFFAOYSA-N 0.000 claims description 3
- PKQIDSVLSKFZQC-UHFFFAOYSA-N 3-oxobutanal Chemical compound CC(=O)CC=O PKQIDSVLSKFZQC-UHFFFAOYSA-N 0.000 claims description 3
- MUDSDYNRBDKLGK-UHFFFAOYSA-N 4-methylquinoline Chemical class C1=CC=C2C(C)=CC=NC2=C1 MUDSDYNRBDKLGK-UHFFFAOYSA-N 0.000 claims description 3
- BXRFQSNOROATLV-UHFFFAOYSA-N 4-nitrobenzaldehyde Chemical compound [O-][N+](=O)C1=CC=C(C=O)C=C1 BXRFQSNOROATLV-UHFFFAOYSA-N 0.000 claims description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 3
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 claims description 3
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- AMIMRNSIRUDHCM-UHFFFAOYSA-N Isopropylaldehyde Chemical compound CC(C)C=O AMIMRNSIRUDHCM-UHFFFAOYSA-N 0.000 claims description 3
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 claims description 3
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 claims description 3
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 claims description 3
- 150000001299 aldehydes Chemical class 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 235000019270 ammonium chloride Nutrition 0.000 claims description 3
- 229930016911 cinnamic acid Natural products 0.000 claims description 3
- 235000013985 cinnamic acid Nutrition 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 3
- 235000019864 coconut oil Nutrition 0.000 claims description 3
- 239000003240 coconut oil Substances 0.000 claims description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 claims description 3
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 claims description 3
- ZOOODBUHSVUZEM-UHFFFAOYSA-N ethoxymethanedithioic acid Chemical compound CCOC(S)=S ZOOODBUHSVUZEM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000174 gluconic acid Substances 0.000 claims description 3
- 235000012208 gluconic acid Nutrition 0.000 claims description 3
- 229940015043 glyoxal Drugs 0.000 claims description 3
- BRWIZMBXBAOCCF-UHFFFAOYSA-N hydrazinecarbothioamide Chemical compound NNC(N)=S BRWIZMBXBAOCCF-UHFFFAOYSA-N 0.000 claims description 3
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 claims description 3
- 239000004310 lactic acid Substances 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 3
- GTBQRHOYAUGRPV-UHFFFAOYSA-N methanesulfonic acid;silver Chemical compound [Ag].CS(O)(=O)=O GTBQRHOYAUGRPV-UHFFFAOYSA-N 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 claims description 3
- 229940054441 o-phthalaldehyde Drugs 0.000 claims description 3
- ZWLUXSQADUDCSB-UHFFFAOYSA-N phthalaldehyde Chemical compound O=CC1=CC=CC=C1C=O ZWLUXSQADUDCSB-UHFFFAOYSA-N 0.000 claims description 3
- 150000003349 semicarbazides Chemical class 0.000 claims description 3
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 3
- 229940071536 silver acetate Drugs 0.000 claims description 3
- ZFRKQXVRDFCRJG-UHFFFAOYSA-N skatole Chemical class C1=CC=C2C(C)=CNC2=C1 ZFRKQXVRDFCRJG-UHFFFAOYSA-N 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 3
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 3
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 claims description 3
- BUUPQKDIAURBJP-UHFFFAOYSA-N sulfinic acid Chemical compound OS=O BUUPQKDIAURBJP-UHFFFAOYSA-N 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 claims description 3
- 239000012991 xanthate Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims 4
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims 2
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 claims 1
- SCVJRXQHFJXZFZ-KVQBGUIXSA-N 2-amino-9-[(2r,4s,5r)-4-hydroxy-5-(hydroxymethyl)oxolan-2-yl]-3h-purine-6-thione Chemical compound C1=2NC(N)=NC(=S)C=2N=CN1[C@H]1C[C@H](O)[C@@H](CO)O1 SCVJRXQHFJXZFZ-KVQBGUIXSA-N 0.000 claims 1
- CHXRHAMFIVEARH-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid;tin Chemical compound [Sn].CC(O)CS(O)(=O)=O CHXRHAMFIVEARH-UHFFFAOYSA-N 0.000 claims 1
- GRIATXVEXOFBGO-UHFFFAOYSA-N 4-methyl-1,3-benzothiazol-2-amine Chemical class CC1=CC=CC2=C1N=C(N)S2 GRIATXVEXOFBGO-UHFFFAOYSA-N 0.000 claims 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- DPJBJAPWEDZODW-UHFFFAOYSA-N ethanesulfonic acid;tin Chemical compound [Sn].CCS(O)(=O)=O DPJBJAPWEDZODW-UHFFFAOYSA-N 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 229910052939 potassium sulfate Inorganic materials 0.000 claims 1
- 235000011151 potassium sulphates Nutrition 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- DVNFLGLGNLXITH-UHFFFAOYSA-N 2-guanidinopropionic acid Chemical class OC(=O)C(C)N=C(N)N DVNFLGLGNLXITH-UHFFFAOYSA-N 0.000 abstract 1
- KYLIZBIRMBGUOP-UHFFFAOYSA-N Anetholtrithion Chemical group C1=CC(OC)=CC=C1C1=CC(=S)SS1 KYLIZBIRMBGUOP-UHFFFAOYSA-N 0.000 abstract 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 48
- 229910052718 tin Inorganic materials 0.000 description 44
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 33
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 28
- CVSVTCORWBXHQV-UHFFFAOYSA-N creatine Chemical class NC(=[NH2+])N(C)CC([O-])=O CVSVTCORWBXHQV-UHFFFAOYSA-N 0.000 description 26
- 229940051841 polyoxyethylene ether Drugs 0.000 description 16
- 229920000056 polyoxyethylene ether Polymers 0.000 description 16
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 230000003213 activating effect Effects 0.000 description 14
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 13
- 238000002360 preparation method Methods 0.000 description 13
- 239000002994 raw material Substances 0.000 description 13
- 235000011054 acetic acid Nutrition 0.000 description 12
- 230000006641 stabilisation Effects 0.000 description 12
- 238000011105 stabilization Methods 0.000 description 12
- 239000004094 surface-active agent Substances 0.000 description 12
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 12
- 229910000881 Cu alloy Inorganic materials 0.000 description 10
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 238000003466 welding Methods 0.000 description 10
- HUMNYLRZRPPJDN-KWCOIAHCSA-N benzaldehyde Chemical group O=[11CH]C1=CC=CC=C1 HUMNYLRZRPPJDN-KWCOIAHCSA-N 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical class C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Natural products CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002191 fatty alcohols Chemical class 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 description 2
- ZXZFRENPWSCGTB-UHFFFAOYSA-N 4-methyl-1-benzothiophen-2-amine Chemical class CC1=CC=CC2=C1C=C(N)S2 ZXZFRENPWSCGTB-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 241000219000 Populus Species 0.000 description 2
- PCSMJKASWLYICJ-UHFFFAOYSA-N Succinic aldehyde Chemical compound O=CCCC=O PCSMJKASWLYICJ-UHFFFAOYSA-N 0.000 description 2
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 150000003851 azoles Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 2
- 230000005347 demagnetization Effects 0.000 description 2
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 210000004700 fetal blood Anatomy 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 2
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 2
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 1
- BXICQQUCPXTUKY-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid;silver Chemical compound [Ag].CC(O)CS(O)(=O)=O BXICQQUCPXTUKY-UHFFFAOYSA-N 0.000 description 1
- DYBIGIADVHIODH-UHFFFAOYSA-N 2-nonylphenol;oxirane Chemical compound C1CO1.CCCCCCCCCC1=CC=CC=C1O DYBIGIADVHIODH-UHFFFAOYSA-N 0.000 description 1
- YHZQOKUDQQISEW-UHFFFAOYSA-N 4-Cumylphenol Natural products C1=CC(C(C)C)=CC=C1C1=CC=C(O)C=C1 YHZQOKUDQQISEW-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229920002807 Thiomer Polymers 0.000 description 1
- JTBSSXWFYSSVJP-UHFFFAOYSA-N [S].C1=CSC=N1 Chemical compound [S].C1=CSC=N1 JTBSSXWFYSSVJP-UHFFFAOYSA-N 0.000 description 1
- KPZUWETZTXCDED-UHFFFAOYSA-N [V].[Cu] Chemical compound [V].[Cu] KPZUWETZTXCDED-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- ZRALSGWEFCBTJO-UHFFFAOYSA-N anhydrous guanidine Natural products NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000004400 mucous membrane Anatomy 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 210000001519 tissue Anatomy 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229940126680 traditional chinese medicines Drugs 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Abstract
The present invention provides tin alloy electric plating liquid, and the tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic metal salt, complexing agent, reducing agent, stabilizer, fining agent, brightener, deionized water；Wherein, calculate by weight, 1000 parts of deionized water, organic 100 600 parts of mixed acid, 40 100 parts of organic tin salt, 18 parts of organic metal salt, 50 160 parts of complexing agent, 30 70 parts of reducing agent, 20 100 parts of stabilizer, 5 20 parts of fining agent, 3 15 parts of brightener；The organic metal salt includes one kind in organic silver salts, organic copper salt, organic bismuth salt；The complexing agent includes one or more in thiocarbamide, 1,3 dimethyl sulfoureas, 2,4 two sulphur biurets, 2,4,6 trithio contracting triurets, 2,2 two thiopyridines, 2,2 two thioanilines, tetramethylguanidine, glycocyamine, N methylglycocyamines, thio chitosan.
Description
Technical field
The present invention relates to electroplating technology, in particular it relates to tin alloy electric plating liquid.
Background technology
In recent years, such as in automotive field electrification rapidly promoting, the circuit number of electrical equipment increases therewith, therefore, institute
The miniaturization of the connector used, spininess become notable.If by connector spininess, though the insertion force of each pin compared with
Small, connector integrally stills need larger power when being inserted into connector, and there is a possibility that productivity declines.Therefore, attempt by subtracting
The coefficient of friction of small Tinplated copper alloy material reduces the insertion force of each pin.
Tinplated copper alloy terminal material by the base material being made of copper alloy implement copper facing and it is tin plating after flow back
Processing forms Cu-Sn alloy-layers in the lower floor of the Sn class superficial layers on surface layer, is widely used as terminal material.
The stanniferous amount of tin signal bronze is larger, easily polishes, and polishing back reflection rate is high, and hardness is between nickel, chromium；In air
Oxidation resistance is strong, and with the increase of Theil indices in coating, the anti-corrosion capability of coating is consequently increased.
For the high tin plating product of terminal class of the smaller precision of volume, tin palpus is susceptible to after tin plating completion
Phenomenon, most of tin in subsequent use must easily generate two adjacent human hair combing wastes life short circuits etc. and ask highly up to 100 μm or more
Topic.
Therefore, in view of the above-mentioned problems, the present invention provides tin alloy electric plating liquid, welding temperature existing for tin plating alloy is solved
Higher, crystallization is thick and Yi Changxi must problem, effectively cut down it is tin plating after tin on product must, make coating surface flatness good, nothing
Slight crack, chemical property are stablized, and improve safety and stability of the product in subsequent use.
The content of the invention
To solve the above-mentioned problems, the present invention provides tin alloy electric plating liquid, and the tin alloy electric plating liquid includes organic mixing
Acid, organic tin salt, organic metal salt, complexing agent, reducing agent, stabilizer, fining agent, brightener, deionized water；Wherein, by weight
It measures part to calculate, 1000 parts of deionized water, organic mixed acid 100-600 parts, 40-100 parts of organic tin salt, 1-8 parts of organic metal salt,
50-160 parts of complexing agent, 30-70 parts of reducing agent, 20-100 parts of stabilizer, 5-20 parts of fining agent, 3-15 parts of brightener；It is described to have
Machine metal salt includes one kind in organic silver salts, organic copper salt, organic bismuth salt；The complexing agent includes thiocarbamide, 1,3- dimethyl
Thiocarbamide, 2,4-, bis- sulphur biurets, 2,4,6- trithio contracting triurets, 2,2-, bis- thiopyridines, 2,2-, bis- thioanilines, tetramethylguanidine, guanidine radicals
It is one or more in acetic acid, N- methylglycocyamines, thio chitosan.
In one embodiment, organic mixed acid is methanesulfonic acid, ethanesulfonic acid, 2- ethylenehydrinsulfonic acids, 2- hydroxyls third
Sulfonic acid, 3- hydroxy-propanesulfonic acids, citric acid, tartaric acid, lactic acid, gluconic acid, paracresol sulfonic acid, p-aminobenzene sulfonic acid, sulfo group water
Poplar acid, two or more in oxalic acid.
In one embodiment, the organic tin salt includes tin methane sulfonate, 2- ethylenehydrinsulfonic acids tin, 2- hydroxy-propanesulfonic acids
One or more in tin.
In one embodiment, the organic silver salts include methanesulfonic acid silver, 2- ethylenehydrinsulfonic acids silver, 2- hydroxy-propanesulfonic acids
It is one or more in silver, paracresol sulfonic acid silver, silver acetate, ethanesulfonic acid silver, sulfinic acid silver.
In one embodiment, the stabilizer includes sodium thiosulfate, potassium thiosulfate, thiocarbamide, xanthate, 2,
4- dithiobiurets, semicarbazides, thiosemicarbazide, Isosorbide-5-Nitrae-phenylene double (thiocarbamide), thiodiglycolic acid, β-thiodiglycol,
Dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) tetraacethyl, [(1- methyl-props subunit) two is thio] oxalic acid, two sulphur
For one or more in Glycolic acid.
In one embodiment, the stabilizer is dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) four
Acetic acid, dithioglycollic acid；The dibenzothiazyl disulfide sulphur and (two thio subunit four of the ethane) tetraacethyl, described two
The weight ratio of thio Glycolic acid is 1：(0.1-0.3)：(0.5-2).
In one embodiment, the fining agent includes sodium chloride, copper chloride, potassium chloride, ammonium chloride, bismuth nitrate, second
Glycol, butenoic acid, acrylamide, crotonamide, crotonaldehyde, acetyl ethanonlamine, 1,8- naphthalimides, N- cyclohexylbenzoyls
Amine, dinethylformamide, urea, P-aminobenzene-sulfonamide, acetamide, formamide, coconut oil diethanol amide, 2- sulfydryl benzene
And thiazole, dibenzothiazyl disulfide, 2-mercaptobenzimidazole, 2,5- dimethyl-benzothiazoles, 2- amino -4- methyl benzo thiophenes
One or more in azoles, 2- aminobenzothiazoles, 2- aminobenzimidazoles, 3- methyl indols, 4- methylquinolines.
In one embodiment, the brightener include α-pyridine carboxylic acid, benzaldehyde, 2,4,6- tri chlorobenzaldehydes, β-
Naphthalene sulfonic acids, m chlorobenzaldehyde, paranitrobenzaldehyde, salicylide, o-phthalaldehyde, formaldehyde, acetyl acetaldehyde, acetaldehyde, butyraldehyde, isobutyl
Aldehyde, propionic aldehyde, valeraldehyde, methacrylaldehyde, crotonaldehyde, glyoxal, isopentyl aldehyde, hexanal, butanedial, 2,4- sorbic aldehydes, cinnamic acid, second
One in acyl acetone, imidazoles, 2- vinylpyridines, indoles, quinoline, ethanolamine, o-vanillin, polyvinyl alcohol, polyethyleneimine
Kind is a variety of.
In one embodiment, the tin alloy electric plating liquid is applied to circuit board connector material alloy terminals.
In one embodiment, count by weight percentage, the circuit board connector material alloy terminals are by iron：
8.5%th, manganese：15%th, silicon：0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The above-mentioned of the application and other features, aspect and advantage is more readily understood with reference to following detailed description.
Specific embodiment
Participate in the election of the detailed description of the invention below that method is preferably implemented and including embodiment this hair can be more easily understood
Bright content.Unless otherwise defined, all technologies used herein and scientific terminology have common with fields of the present invention
The normally understood identical meaning of technical staff.When there is a conflict, the definition in this specification shall prevail.
As used herein term " by ... prepare " it is synonymous with "comprising".Term "comprising" used herein, " comprising ",
" having ", " containing " or its any other deformation, it is intended that cover including for non-exclusionism.For example, the combination comprising listed elements
Object, step, method, product or device are not necessarily limited to those elements, but can include not expressly listed other elements or
Such composition, step, method, product or the intrinsic element of device.
Conjunction " Consists of " excludes any element do not pointed out, step or component.If be used in claim, this
Phrase will make claim be closed, it is made not include the material in addition to the material of those descriptions, but relative normal
Except rule impurity.When being rather than immediately following in the clause that phrase " Consists of " appears in claim main body after theme,
It is only limited to the element described in the clause；Other elements are not excluded outside the claim as a whole.
Equivalent, concentration or other values or parameter are excellent with scope, preferred scope or a series of upper limit preferred values and lower limit
During the Range Representation that choosing value limits, this, which is appreciated that, specifically discloses by any range limit or preferred value and any scope
All scopes that any pairing of lower limit or preferred value is formed, regardless of whether the scope separately discloses.For example, when open
During scope " 1 to 5 ", described scope should be interpreted as including scope " 1 to 4 ", " 1 to 3 ", " 1 to 2 ", " 1 to 2 and 4 to
5 ", " 1 to 3 and 5 " etc..When numberical range is described herein, unless otherwise stated, otherwise scope intention includes its end
Value and all integers and fraction in the range.
Singulative includes plural number and object is discussed, unless the context clearly dictates otherwise." optional " or it is " arbitrary
It is a kind of " refer to that the item described thereafter or event may or may not occur, and the description include situation that event occurs and
The situation that event does not occur.
Approximate term in specification and claims is used for modifying quantity, represents specific the present invention is not limited to this
Quantity further includes the modified part of the acceptable change without cause related basic function close to the quantity.Phase
It answers, modifies a numerical value with " about ", " about " etc., mean that the invention is not restricted to the exact numericals.It is approximate in some examples
Term likely corresponds to the precision of the instrument of measured value.In present specification and claims, scope limits can be with
It combines and/or exchanges, these scopes include all subranges contained therebetween if not stated otherwise.
In addition, indefinite article " one kind " before element of the present invention or component and "one" quantitative requirement to element or component
(i.e. occurrence number) unrestriction.Therefore "one" or " one kind " should be read as including one or at least one, and odd number
The element or component of form also include plural form, unless the apparent purport of the quantity refers to singulative.
" polymer " means through the polymerizable compound prepared by the monomer that polymerize identical or different type.Generic term
" polymer " includes term " homopolymer ", " copolymer ", " terpolymer " and " copolymer ".
" copolymer " means the polymer prepared by polymerizeing at least two different monomers.Generic term " copolymer " includes
(it is general with term " terpolymer " for term " copolymer " (its generally to refer to the polymer prepared by two kinds of different monomers)
To refer to the polymer prepared by three kinds of different monomers).It is also comprising the polymer manufactured by polymerizeing more kinds of monomers.
" blend " means that two or more polymer mixes the polymer to be formed by physics or chemical method jointly.
The present invention provides tin alloy electric plating liquid, and the tin alloy electric plating liquid includes organic mixed acid, organic tin salt, You Jijin
Belong to salt, complexing agent, reducing agent, stabilizer, fining agent, brightener, deionized water；Wherein, calculate by weight, deionized water
1000 parts, organic mixed acid 100-600 parts, 40-100 parts of organic tin salt, 1-8 parts of organic metal salt, 50-160 parts of complexing agent, also
Former agent 30-70 parts, 20-100 parts of stabilizer, 5-20 parts of fining agent, 3-15 parts of brightener；The organic metal salt includes organic silver
One kind in salt, organic copper salt, organic bismuth salt；The complexing agent includes thiocarbamide, 1,3- dimethyl sulfoureas, 2,4-, bis- sulphur contracting two
Urea, 2,4,6- trithio contracting triurets, 2,2-, bis- thiopyridines, 2,2-, bis- thioanilines, tetramethylguanidine, glycocyamine, N- methyl guanidine radicals second
It is one or more in acid, thio chitosan.
Preferably, calculate by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, 80 parts of organic tin salt is organic
2 parts of metal salt, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener.
In one embodiment, the organic metal salt is organic silver salts.
In one embodiment, the complexing agent is 2,4-, bis- sulphur biurets, N- methylglycocyamines, sulfydryl shell gather
Sugar.
In one embodiment, the sulphur biurets of 2,4- bis- described in the complexing agent and the N- methylglycocyamines,
The weight ratio of the thio chitosan is 1：(0.1-0.5)：(0.3-1.2)；Preferably, 2,4-, the bis- sulphur biurets with it is described
N- methylglycocyamines, the weight ratio of the thio chitosan are 1：0.24：0.72.
In one embodiment, the raw material for preparing of the thio chitosan includes 2- sulfydryl -4- methyl-5-thiazole acetic acid
(CAS：31090-12-7), chitosan.
The preparation method of the thio chitosan comprises the following steps：
Chitosan, 1- hydroxy benzo triazoles, distilled water are added in into reactor, after stirring evenly, adds in 2- sulfydryls -4-
Methyl-5-thiazole acetic acid, 1- (3- dimethyl aminopropyls) -3- ethyl-carbodiimide hydrochlorides, will with the sodium hydroxide of 1mol/L
The pH of reaction solution to 5 reacts at room temperature 4h, adds in absolute ethyl alcohol, and filtering, 60 DEG C are dried under reduced pressure 10h, grinding, 5 DEG C of Cord bloods；
The weight ratio of the chitosan and the 1- hydroxy benzo triazoles, the distilled water is 1：0.7：30；The chitosan and institute
The weight ratio for stating 2- sulfydryl -4- methyl-5-thiazole acetic acid is 1：3.6；2- sulfydryls -4- methyl-5-thiazoles the acetic acid with it is described
The molar ratio of 1- (3- dimethyl aminopropyls) -3- ethyl-carbodiimide hydrochlorides is 1：1.05；The chitosan with it is described anhydrous
The weight ratio of ethyl alcohol is 1：10.
Chitosan has stronger complexing, adsorption capacity, and good mechanical property, stable chemical performance, fixed efficiency are high, and shell gathers
Further enhancing for adhesiveness after sulfydryl is connected on glycan molecule, very effective can be adsorbed onto electrode surface, sulfydryl shell gathers
The characteristics of sugar has good stability and lasts a long time.The oxidizable formation disulfide bond of sulfydryl so as to form network structure, has significant
Adsorption effect.
The introducing of mercapto groups assigns chitosan new biological nature：When the content increase of sulfydryl, mucous membrane and sulfhydrylation
The time contacted between chitosan is extended, and when pH value raises, the activity of sulfydryl is enhanced, Chitosan-Thiolated Polymers intramolecular
The more disulfide bond of portion's forming quantity.
By in chitosan and 2- sulfydryl -4- methyl-5-thiazole acetic acidreactions, obtaining thio chitosan in the present invention, have
There is network structure, it is ensured that while bath stability, can be formed ensures the hardness needed for coating and flexible flexible nickel coating；
In addition, being capable of providing higher coating forms speed, and even if the access times of plating solution increase, coating has excellent corrosion resistant
Corrosion and wearability.
In one embodiment, organic mixed acid is methanesulfonic acid, ethanesulfonic acid, 2- ethylenehydrinsulfonic acids, 2- hydroxyls third
Sulfonic acid, 3- hydroxy-propanesulfonic acids, citric acid, tartaric acid, lactic acid, gluconic acid, paracresol sulfonic acid, p-aminobenzene sulfonic acid, sulfo group water
Poplar acid, two or more in oxalic acid；Preferably, organic mixed acid is citric acid, p-aminobenzene sulfonic acid.
In one embodiment, the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2.
In one embodiment, the organic tin salt includes tin methane sulfonate, 2- ethylenehydrinsulfonic acids tin, 2- hydroxy-propanesulfonic acids
One or more in tin；Preferably, the organic tin salt is tin methane sulfonate.
In one embodiment, the organic silver salts include methanesulfonic acid silver, 2- ethylenehydrinsulfonic acids silver, 2- hydroxy-propanesulfonic acids
It is one or more in silver, paracresol sulfonic acid silver, silver acetate, ethanesulfonic acid silver, sulfinic acid silver；Preferably, the organic silver salts are 2-
Hydroxy-propanesulfonic acid silver.
In one embodiment, the stabilizer includes sodium thiosulfate, potassium thiosulfate, thiocarbamide, xanthate, 2,
4- dithiobiurets, semicarbazides, thiosemicarbazide, Isosorbide-5-Nitrae-phenylene double (thiocarbamide), thiodiglycolic acid, β-thiodiglycol,
Dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) tetraacethyl (CAS:10003-69-7), [(1- methyl-props subunit) two
It is thio] oxalic acid (CAS:4265-61-6), dithioglycollic acid (CAS：It is one or more in 505-73-7).
In one embodiment, the stabilizer is dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) four
Acetic acid, dithioglycollic acid；The dibenzothiazyl disulfide sulphur and (two thio subunit four of the ethane) tetraacethyl, described two
The weight ratio of thio Glycolic acid is 1：(0.1-0.3)：(0.5-2)；Preferably, the dibenzothiazyl disulfide sulphur with it is described
(two thio subunit four of ethane) tetraacethyl, the weight ratio of the dithioglycollic acid are 1：0.15：1.2.
In one embodiment, the fining agent includes sodium chloride, copper chloride, potassium chloride, ammonium chloride, bismuth nitrate, second
Glycol, butenoic acid, acrylamide, crotonamide, crotonaldehyde, acetyl ethanonlamine, 1,8- naphthalimides, N- cyclohexylbenzoyls
Amine, dinethylformamide, urea, P-aminobenzene-sulfonamide, acetamide, formamide, coconut oil diethanol amide, 2- sulfydryl benzene
And thiazole, dibenzothiazyl disulfide, 2-mercaptobenzimidazole, 2,5- dimethyl-benzothiazoles, 2- amino -4- methyl benzo thiophenes
One or more in azoles, 2- aminobenzothiazoles, 2- aminobenzimidazoles, 3- methyl indols, 4- methylquinolines；Preferably,
The fining agent is 2- aminobenzothiazoles.
Fining agent can crystal grain thinning, make crystal grain refinement size up to 5~50nm, the final coating for obtaining fine grain, and same
The bright degree of Shi Tigao coating.
In one embodiment, the brightener include α-pyridine carboxylic acid, benzaldehyde, 2,4,6- tri chlorobenzaldehydes, β-
Naphthalene sulfonic acids, m chlorobenzaldehyde, paranitrobenzaldehyde, salicylide, o-phthalaldehyde, formaldehyde, acetyl acetaldehyde, acetaldehyde, butyraldehyde, isobutyl
Aldehyde, propionic aldehyde, valeraldehyde, methacrylaldehyde, crotonaldehyde, glyoxal, isopentyl aldehyde, hexanal, butanedial, 2,4- sorbic aldehydes, cinnamic acid, second
One in acyl acetone, imidazoles, 2- vinylpyridines, indoles, quinoline, ethanolamine, o-vanillin, polyvinyl alcohol, polyethyleneimine
Kind is a variety of；Preferably, the brightener include α-pyridine carboxylic acid, benzaldehyde, 2,4,6- tri chlorobenzaldehydes, beta-naphthalenesulfonic-acid,
Chlorobenzaldehyde, imidazoles, 2- vinylpyridines, indoles, quinoline, ethanolamine, o-vanillin, polyvinyl alcohol, in one or more；
Most preferably, the brightener is benzaldehyde, beta-naphthalenesulfonic-acid.
In one embodiment, the weight ratio of benzaldehyde described in the brightener and the beta-naphthalenesulfonic-acid is 1：0.3.
In one embodiment, the tin alloy electric plating liquid further includes 3-10 parts of surfactants；It lives on the surface
Property agent include polyethylene glycol (molecular weight 400-2000), polypropylene glycol (molecular weight 400-5000), nonylphenol polyoxyethylene ether (5-
15EO), octyl phenol polyoxyethylene ether (5-12EO), fatty alcohol polyoxyethylene ether (3-20EO), 4- cumyl phenol base ethylene oxides ether,
Sorbitan fatty acid ester polyoxyethylene ether, fatty alcohol polyoxypropylene ether (3-20PO), nonyl phenol poly-oxypropylene ether (5-
15PO), octyl phenol polyethenoxy ether (5-12PO), PULLRONIC F68 (EO-PO, EO: PO=1-5: 3) copolymer, double
One or more in phenol A；Preferably, the surfactant is polyethylene glycol (molecular weight 400-1500), polyoxyethylene nonyl phenyl
Vinethene (8-12EO), fatty alcohol polyoxyethylene ether, nonyl phenol poly-oxypropylene ether (5-12EO), PULLRONIC F68
(EO-PO, EO, PO number are than EO: PO=2-4: 3) copolymer, one kind in 4- cumyl phenols polyoxyethylene ether (7-11EO) or
It is a variety of；It is highly preferred that the surfactant is nonylphenol polyoxyethylene ether (10EO).
In one embodiment, the tin alloy electric plating liquid is applied to circuit board connector material alloy terminals.
In one embodiment, count by weight percentage, the circuit board connector material alloy terminals are by iron：
8.5%th, manganese：15%th, silicon：0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The production method of the circuit board connector material alloy terminals, by weight percentage by iron：8.5%th, manganese：
15%th, silicon：0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% and surplus copper carry out melting-first pulling shaping-heat
Processing-rough-middle draw is heat-treated (demagnetization), and-thin drawing-is cut into through punching machine at required specification or melting-first pulling shaping-heat
- tin plating-rough-middle draw is heat-treated (demagnetization), and-thin drawing is-thin to draw-to cut into required specification through punching machine to reason.It is heat-treated in first time
In drawing process afterwards, the mold endoporus that when bracing wire uses is square, flat or circular, and different bracing wire mould internal via shapes is determined
It is that square alloy wire or flat type alloy wire or circular alloy wire, the punching machine through corresponding model are cut out to have determined last final alloy line
Become square post, flat terminal or circular terminal after cutting.When being heat-treated for second, temperature is controlled at 1050-1100 DEG C, and
The inflated with nitrogen in stove, the material alloy terminals electroplated processing again after punching machine cuts shaping, becomes all kinds of circuit board electronics
Finished product terminal used on connector, is put in storage through examining.
The scandium (Sc) that atomic number is 21 belongs to 3d type magnesium-yttrium-transition metals, and Ti, V, Cr, Mn identical period, with La, Ce, Pr,
Nd etc. is of the same clan, therefore it has the beneficial effect of this two metalloid of rare earth element, transition element concurrently in copper alloy.Microamounts of Scandium adds
Enter into copper alloy, can significantly crystal grain thinning, inhibition recrystallize, it is significantly improved while copper alloy good electric conductivity is kept
Intensity etch resistant properties and welding performance.
Sc has strong metamorphism, can refine friction welding seam fusion zone crystal grain, significantly reduce weld crack tendentiousness.
Sc can effectively inhibit the recrystallization of heat affected area simultaneously, and the as cast condition area of weld seam is transitted directly to by the subgrain tissue of matrix, make this
The weld seam transition region or heat affected area that should have recrystallized structure do not have recrystallized structure, and as-cast grain contains with Sc in weld seam
The increase of amount and refine.
Vanadium is that transition group metalloid has BCC structures at normal temperatures and pressures, and lattice structure is undergone phase transition under different pressure,
Trace vanadium is added in copper alloy, can significantly crystal grain thinning, inhibit recrystallization, while copper alloy good electric conductivity is kept into
One step significantly improves its intensity etch resistant properties and welding performance.
The preparation process of the electroplate liquid is as follows：
Deionized water is added in electroplating bath, adds in the desired amount of organic mixed acid mixed solution, organic tin salt, organic silver
After salt, it is mixed evenly after standing 1h, sequentially adds complexing agent, reducing agent, stabilizer, fining agent in the desired amount, mixing is stirred
After standing 0.5h after mixing uniformly, the desired amount of brightener is added, is stirred evenly, for use；To obtain more preferably electroplating effect, institute
State electroplate liquid is 4.5-6.5 using pH environment.
Tin must be a kind of elongated tin monocrystalline from tin layers or the growth of tin alloy layers surface.Tin must generally be of a straight line type, bend
Type, knot shape and loop configuration, it has very high current load ability, has to electronic component and seriously endangers.
The generation of tin palpus will be there are two conditio sune qua non：First, there is lasting compression to maintain to drive in tin layers
Power；Second is that the compression persistently generated in tin layers will maintain dynamic equilibrium by the growth of tin palpus.
The electrode potential of copper is reduced using complexing agent and the complex of tin divalent ion formation in the present invention, passes through displacement
Reaction copper is cemented out by tin, is deposited tin by self catalyzed reduction after copper surface is covered entirely by tin, then on its surface, is made tin plating
Layer constantly thickens；Add in organic mixed acid, organic silver salts, dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) simultaneously
Tetraacethyl, dithioglycollic acid effectively tin coating to be overcome to generate tin palpus.Adding in stabilizer can not only prevent tin plating electrolyte from generating
Precipitation, while there is the characteristic for preventing tin coating surface oxidation.In addition Ag and Sn carries out common plating, further reaches alloying and slows down
The purpose of tin one of the main divisions of the male role in traditional opera length.
By using containing scandium, vanadium copper alloy in the present invention, copper alloy phase counterdiffusion is made to reach metallurgical after dynamic recrystallization
With reference to significantly improving the intensity of terminal, substantially improve its welding performance and corrosion resistance；Additionally by complexing agent and tin two
The complex that valency ion is formed reduces the electrode potential of copper, adds in organic mixed acid, organic silver salts, dibenzothiazyl disulfide
Sulphur, (two thio subunit four of ethane) tetraacethyl, dithioglycollic acid effectively to overcome tin coating to generate tin palpus, and Ag and Sn is total to
Plating, further reaching alloying, to slow down tin one of the main divisions of the male role in traditional opera long.
The present invention is specifically described below by embodiment.It is necessarily pointed out that following embodiment is only used
In the invention will be further described, it is impossible to be interpreted as limiting the scope of the invention, professional and technical personnel in the field
Some the nonessential modifications and adaptations made according to the content of the invention described above, still fall within protection scope of the present invention.
In addition, if without other explanations, it is raw materials used to be all commercially available, it is purchased from traditional Chinese medicines chemical reagent.
Embodiment 1
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazoles acetic acid, chitosan；Organic mixed acid is citric acid, to amino
The weight ratio of benzene sulfonic acid, the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；The organic tin salt is tin methane sulfonate；Institute
Organic silver salts are stated as 2- hydroxy-propanesulfonic acids silver；The stabilizer is dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane)
Tetraacethyl, dithioglycollic acid, it is the dibenzothiazyl disulfide sulphur and (two thio subunit four of the ethane) tetraacethyl, described
The weight ratio of dithioglycollic acid is 1：0.15：1.2；The fining agent is 2- aminobenzothiazoles；The brightener is benzene first
The weight ratio of aldehyde, beta-naphthalenesulfonic-acid, the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；The surfactant gathers for nonyl phenol
Ethylene oxide ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan comprises the following steps：
Chitosan, 1- hydroxy benzo triazoles, distilled water are added in into reactor, after stirring evenly, adds in 2- sulfydryls -4-
Methyl-5-thiazole acetic acid, 1- (3- dimethyl aminopropyls) -3- ethyl-carbodiimide hydrochlorides, will with the sodium hydroxide of 1mol/L
The pH of reaction solution to 5 reacts at room temperature 4h, adds in absolute ethyl alcohol, and filtering, 60 DEG C are dried under reduced pressure 10h, grinding, 5 DEG C of Cord bloods；
The weight ratio of the chitosan and the 1- hydroxy benzo triazoles, the distilled water is 1：0.7：30；The chitosan and institute
The weight ratio for stating 2- sulfydryl -4- methyl-5-thiazole acetic acid is 1：3.6；2- sulfydryls -4- methyl-5-thiazoles the acetic acid with it is described
The molar ratio of 1- (3- dimethyl aminopropyls) -3- ethyl-carbodiimide hydrochlorides is 1：1.05；The chitosan with it is described anhydrous
The weight ratio of ethyl alcohol is 1：10.
Embodiment 2
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.5：0.3, the thio chitosan
Prepare raw material include 2- sulfydryl -4- methyl-5-thiazoles acetic acid, chitosan；Organic mixed acid is citric acid, p-aminophenyl
The weight ratio of sulfonic acid, the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；The organic tin salt is tin methane sulfonate；It is described
Organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer is dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) four
Acetic acid, dithioglycollic acid, the dibenzothiazyl disulfide sulphur and (two thio subunit four of the ethane) tetraacethyl, described two
The weight ratio of thio Glycolic acid is 1：0.15：1.2；The fining agent is 2- aminobenzothiazoles；The brightener for benzaldehyde,
The weight ratio of beta-naphthalenesulfonic-acid, the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；The surfactant is polyoxyethylene nonyl phenyl second
Alkene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Embodiment 3
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.1：1.2, the thio chitosan
Prepare raw material include 2- sulfydryl -4- methyl-5-thiazoles acetic acid, chitosan；Organic mixed acid is citric acid, p-aminophenyl
The weight ratio of sulfonic acid, the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；The organic tin salt is tin methane sulfonate；It is described
Organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer is dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) four
Acetic acid, dithioglycollic acid, the dibenzothiazyl disulfide sulphur and (two thio subunit four of the ethane) tetraacethyl, described two
The weight ratio of thio Glycolic acid is 1：0.15：1.2；The fining agent is 2- aminobenzothiazoles；The brightener for benzaldehyde,
The weight ratio of beta-naphthalenesulfonic-acid, the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；The surfactant is polyoxyethylene nonyl phenyl second
Alkene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Embodiment 4
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazole acetic acid (CAS：31090-12-7), chitosan；Organic mixing
Acid is citric acid, p-aminobenzene sulfonic acid, and the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；It is described organic
Pink salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer for dibenzothiazyl disulfide sulphur,
(two thio subunit four of ethane) tetraacethyl, dithioglycollic acid, the dibenzothiazyl disulfide sulphur with described (ethane two is thio
Subunit four) tetraacethyl, the dithioglycollic acid weight ratio be 1：0.1：2；The fining agent is 2- aminobenzothiazoles；Institute
Brightener is stated as benzaldehyde, beta-naphthalenesulfonic-acid, the weight ratio of the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；It lives on the surface
Property agent be nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Embodiment 5
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazole acetic acid (CAS：31090-12-7), chitosan；Organic mixing
Acid is citric acid, p-aminobenzene sulfonic acid, and the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；It is described organic
Pink salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer for dibenzothiazyl disulfide sulphur,
(two thio subunit four of ethane) tetraacethyl, dithioglycollic acid, the dibenzothiazyl disulfide sulphur with described (ethane two is thio
Subunit four) tetraacethyl, the dithioglycollic acid weight ratio be 1：0.3：0.5；The fining agent is 2- aminobenzothiazoles；
The brightener is benzaldehyde, beta-naphthalenesulfonic-acid, and the weight ratio of the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；The surface
Activating agent is nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Comparative example 1
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent is 2,4-, bis- sulphur biurets, N- methylglycocyamines, 2,4-, the bis- sulphur biurets and institute
The weight ratio for stating N- methylglycocyamines is 1：0.24, the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；
The organic tin salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer for diphenyl disulfide simultaneously
Thiazole sulphur, (two thio subunit four of ethane) tetraacethyl, dithioglycollic acid, the dibenzothiazyl disulfide sulphur and the (second
Two thio subunit four of alkane) tetraacethyl, the dithioglycollic acid weight ratio be 1：0.15：1.2；The fining agent is 2- amino
Benzothiazole；The brightener is benzaldehyde, beta-naphthalenesulfonic-acid, and the weight ratio of the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；
The surfactant is nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
Comparative example 2
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent is thio chitosan, and the raw material for preparing of the thio chitosan includes 2- sulfydryl -4- first
Base -5- thiazolyl acetic acids (CAS：31090-12-7), chitosan；Organic mixed acid is citric acid, p-aminobenzene sulfonic acid, described
The weight ratio of citric acid and the p-aminobenzene sulfonic acid is 1：1.2；The organic tin salt is tin methane sulfonate；The organic silver salts are
2- hydroxy-propanesulfonic acids silver；The stabilizer is dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) tetraacethyl, two thio
Glycolic acid, the dibenzothiazyl disulfide sulphur and (two thio subunit four of the ethane) tetraacethyl, the dithioglycollic acid
Weight ratio be 1：0.15：1.2；The fining agent is 2- aminobenzothiazoles；The brightener is benzaldehyde, beta-naphthalenesulfonic-acid,
The weight ratio of the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；The surfactant is nonylphenol polyoxyethylene ether
(10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Comparative example 3
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazole acetic acid (CAS：31090-12-7), chitosan；Organic mixing
Acid is citric acid；The organic tin salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer is two
Dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) tetraacethyl, dithioglycollic acid, the dibenzothiazyl disulfide sulphur
Weight ratio with (two thio subunit four of the ethane) tetraacethyl, the dithioglycollic acid is 1：0.15：1.2；The refinement
Agent is 2- aminobenzothiazoles；The brightener is benzaldehyde, beta-naphthalenesulfonic-acid, the weight of the benzaldehyde and the beta-naphthalenesulfonic-acid
Than for 1：0.3；The surfactant is nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Comparative example 4
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazole acetic acid (CAS：31090-12-7), chitosan；Organic mixing
Acid is citric acid, p-aminobenzene sulfonic acid, and the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；It is described organic
Pink salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer is dibenzothiazyl disulfide sulphur；Institute
Fining agent is stated as 2- aminobenzothiazoles；The brightener is benzaldehyde, beta-naphthalenesulfonic-acid, the benzaldehyde and the beta-naphthalenesulfonic-acid
Weight ratio be 1：0.3；The surfactant is nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Comparative example 5
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazole acetic acid (CAS：31090-12-7), chitosan；Organic mixing
Acid is citric acid, p-aminobenzene sulfonic acid, and the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；It is described organic
Pink salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer is (two thio subunit four of ethane) four
Acetic acid；The fining agent is 2- aminobenzothiazoles；The brightener for benzaldehyde, beta-naphthalenesulfonic-acid, the benzaldehyde with it is described
The weight ratio of beta-naphthalenesulfonic-acid is 1：0.3；The surfactant is nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Comparative example 6
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazole acetic acid (CAS：31090-12-7), chitosan；Organic mixing
Acid is citric acid, p-aminobenzene sulfonic acid, and the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；It is described organic
Pink salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer is dibenzothiazyl disulfide sulphur, two
The weight ratio of thio Glycolic acid, the dibenzothiazyl disulfide sulphur and the dithioglycollic acid is 1：1.2；The fining agent
For 2- aminobenzothiazoles；The brightener is benzaldehyde, beta-naphthalenesulfonic-acid, the weight ratio of the benzaldehyde and the beta-naphthalenesulfonic-acid
For 1：0.3；The surfactant is nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023% with the copper of surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Comparative example 7
The tin alloy electric plating liquid includes organic mixed acid, organic tin salt, organic silver salts, complexing agent, reducing agent, stabilization
Agent, fining agent, brightener, deionized water；It calculates by weight, 1000 parts of deionized water, organic 350 parts of mixed acid, organotin
80 parts of salt, 2 parts of organic silver salts, 100 parts of complexing agent, 45 parts of reducing agent, 60 parts of stabilizer, 10 parts of fining agent, 8 parts of brightener, table
6 parts of face activating agent；
Wherein, the complexing agent for 2,4-, bis- sulphur biurets, N- methylglycocyamines, thio chitosan, 2, the 4- bis-
The weight ratio of sulphur biuret and the N- methylglycocyamines, the thio chitosan is 1：0.24：0.72, the sulfydryl shell gathers
The raw material for preparing of sugar includes 2- sulfydryl -4- methyl-5-thiazole acetic acid (CAS：31090-12-7), chitosan；Organic mixing
Acid is citric acid, p-aminobenzene sulfonic acid, and the weight ratio of the citric acid and the p-aminobenzene sulfonic acid is 1：1.2；It is described organic
Pink salt is tin methane sulfonate；The organic silver salts are 2- hydroxy-propanesulfonic acids silver；The stabilizer for dibenzothiazyl disulfide sulphur,
(two thio subunit four of ethane) tetraacethyl, dithioglycollic acid, the dibenzothiazyl disulfide sulphur with described (ethane two is thio
Subunit four) tetraacethyl, the dithioglycollic acid weight ratio be 1：0.15：1.2；The fining agent is 2- amino benzo thiophenes
Azoles；The brightener is benzaldehyde, beta-naphthalenesulfonic-acid, and the weight ratio of the benzaldehyde and the beta-naphthalenesulfonic-acid is 1：0.3；The table
Face activating agent is nonylphenol polyoxyethylene ether (10EO)；
Count by weight percentage, the circuit board connector material alloy terminals are by iron：8.5%th, manganese：15%th, silicon：
0.07%th, nickel：0.2%th, the copper of scandium 0.0035% and surplus into.
The preparation method of the thio chitosan is the same as embodiment 1.
Performance test：
1st, the tin palpus growth experiment under Thermal cycling conditions employs the accelerated test method of JEDEC201, parameter
For：- 55 DEG C (+0/-10 DEG C) -+85 DEG C (+10/-0 DEG C), atmospheric environment in 3 cycling/h experimentations, often undergo 500
The just growth of observation tin palpus after secondary cycling；1500 Xun Huans have been carried out altogether, have observed the growth conditions of tin palpus three times.
2nd, welding performance is tested
Two samples are welded, bonding area 5*5mm, with HY-1080 type universal tensile machines to the sample that is welded
Product are stretched, and pulling-off force is more than 1000N, good welding performance；Pulling-off force is more than 800N and is less than 1000N, and welding performance is general；It draws
Opening force is less than 800N, and welding performance is poor.
3rd, corrosion resistance is tested
To preparing sample area is taken to do acid salt spray test for 10mm*10mm sizes, experiment for 24 hours, observes the number of rust spot afterwards
Mesh.
1 the performance test results of table
It is seen from the above data that tin alloy electric plating liquid provided by the invention, solves the existing welding of tin plating alloy
Temperature is higher, crystallization is thick and Yi Changxi palpus problems, effectively cuts down the tin palpus on tin plating rear product, makes coating surface flatness
Good, flawless, chemical property is stablized, and improves safety and stability of the product in subsequent use.
Foregoing example is merely illustrative, for explaining some features of the method for the invention.Appended right will
It asks and is intended to the scope as wide as possible that requirement is contemplated that, and embodiments as presented herein is only according to all possible implementation
The explanation of the embodiment of the selection of the combination of example.Therefore, the purpose of applicant is that appended claim is not illustrated this hair
The exemplary selectional restriction of bright feature.Some numberical ranges used also include sub- model in the claims
It encloses, the variation in these scopes should be also construed in the conceived case by appended claim covering.
Claims (10)
1. tin alloy electric plating liquid, which is characterized in that the tin alloy electric plating liquid includes organic mixed acid, organic tin salt, You Jijin
Belong to salt, complexing agent, reducing agent, stabilizer, fining agent, brightener, deionized water；Wherein, calculate by weight, deionized water
1000 parts, organic mixed acid 100-600 parts, 40-100 parts of organic tin salt, 1-8 parts of organic metal salt, 50-160 parts of complexing agent, also
Former agent 30-70 parts, 20-100 parts of stabilizer, 5-20 parts of fining agent, 3-15 parts of brightener；The organic metal salt includes organic silver
One kind in salt, organic copper salt, organic bismuth salt；The complexing agent includes thiocarbamide, 1,3- dimethyl sulfoureas, 2,4-, bis- sulphur contracting two
Urea, 2,4,6- trithio contracting triurets, 2,2-, bis- thiopyridines, 2,2-, bis- thioanilines, tetramethylguanidine, glycocyamine, N- methyl guanidine radicals second
It is one or more in acid, thio chitosan.
2. tin alloy electric plating liquid according to claim 1, which is characterized in that organic mixed acid for methanesulfonic acid, ethanesulfonic acid,
2- ethylenehydrinsulfonic acids, 2- hydroxy-propanesulfonic acids, 3- hydroxy-propanesulfonic acids, citric acid, tartaric acid, lactic acid, gluconic acid, paracresol sulphur
Two or more in acid, p-aminobenzene sulfonic acid, sulfosalicylic acid, oxalic acid.
3. tin alloy electric plating liquid according to claim 1, which is characterized in that the organic tin salt includes tin methane sulfonate, 2- hydroxyls
One or more in base ethanesulfonic acid tin, 2- hydroxy-propanesulfonic acid tin.
4. tin alloy electric plating liquid according to claim 1, which is characterized in that the organic silver salts include methanesulfonic acid silver, 2- hydroxyls
It is one or more in base ethanesulfonic acid silver, 2- hydroxy-propanesulfonic acids silver, paracresol sulfonic acid silver, silver acetate, ethanesulfonic acid silver, sulfinic acid silver.
5. tin alloy electric plating liquid according to claim 1, which is characterized in that the stabilizer includes sodium thiosulfate, thio
Potassium sulfate, thiocarbamide, xanthate, 2,4- dithiobiurets, semicarbazides, thiosemicarbazide, Isosorbide-5-Nitrae-phenylene double (thiocarbamides), Asia
Sulfenyl oxalic acid, β-thiodiglycol, dibenzothiazyl disulfide sulphur, (two thio subunit four of ethane) tetraacethyl, [(1- methyl-props
Subunit) two thio] oxalic acid, one or more in dithioglycollic acid.
6. tin alloy electric plating liquid according to claim 5, which is characterized in that the stabilizer is dibenzothiazyl disulfide
Sulphur, (two thio subunit four of ethane) tetraacethyl, dithioglycollic acid；The dibenzothiazyl disulfide sulphur and the (ethane two
Thio subunit four) tetraacethyl, the dithioglycollic acid weight ratio be 1：(0.1-0.3)：(0.5-2).
7. tin alloy electric plating liquid according to claim 1, which is characterized in that the fining agent includes sodium chloride, copper chloride, chlorine
Change potassium, ammonium chloride, bismuth nitrate, ethylene glycol, butenoic acid, acrylamide, crotonamide, crotonaldehyde, acetyl ethanonlamine, 1,8- naphthoyls
Imines, N- cyclohexylbenzoyls amine, dinethylformamide, urea, P-aminobenzene-sulfonamide, acetamide, formamide, coconut oil
Diglycollic amide, 2-mercaptobenzothiazole, dibenzothiazyl disulfide, 2-mercaptobenzimidazole, 2,5- dimethyl-benzothiazoles,
In 2- amino -4- methylbenzothiazoles, 2- aminobenzothiazoles, 2- aminobenzimidazoles, 3- methyl indols, 4- methylquinolines
It is one or more.
8. tin alloy electric plating liquid according to claim 1, which is characterized in that the brightener includes α-pyridine carboxylic acid, benzene first
Aldehyde, 2,4,6- tri chlorobenzaldehydes, beta-naphthalenesulfonic-acid, m chlorobenzaldehyde, paranitrobenzaldehyde, salicylide, o-phthalaldehyde, formaldehyde,
Acetyl acetaldehyde, acetaldehyde, butyraldehyde, isobutylaldehyde, propionic aldehyde, valeraldehyde, methacrylaldehyde, crotonaldehyde, glyoxal, isopentyl aldehyde, hexanal, fourth two
Aldehyde, 2,4- sorbic aldehydes, cinnamic acid, acetylacetone,2,4-pentanedione, imidazoles, 2- vinylpyridines, indoles, quinoline, ethanolamine, o-vanillin,
One or more in polyvinyl alcohol, polyethyleneimine.
9. tin alloy electric plating liquid according to claim 1, which is characterized in that the tin alloy electric plating liquid connects applied to circuit board
Connect device material alloy terminals.
10. tin alloy electric plating liquid according to claim 9, which is characterized in that count by weight percentage, the circuit board connects
Device material alloy terminals are connect by iron：8.5%th, manganese：15%th, silicon：0.07%th, nickel：0.2%th, scandium 0.0035%, vanadium：0.0023%
With the copper of surplus into.
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| CN109183096A (en) * | 2018-11-08 | 2019-01-11 | 杭州云会五金电镀有限公司 | A kind of electroplating surface liquid and electroplating technology for alloy |
| CN109594107A (en) * | 2018-11-13 | 2019-04-09 | 南通赛可特电子有限公司 | A kind of electrotinning additive and preparation method thereof |
| CN109972180A (en) * | 2019-04-12 | 2019-07-05 | 博敏电子股份有限公司 | The new application of 2,2 '-dithiodipyridine and the electro-plating method that filling perforation additive is electroplated and uses the additive for using it |
| CN110079840A (en) * | 2019-04-26 | 2019-08-02 | 山东金宝电子股份有限公司 | A kind of surface treatment additive package improving copper foil high-temp antioxidizing performance |
| CN112359380A (en) * | 2020-10-23 | 2021-02-12 | 珠海鑫通化工有限公司 | Electroplating solution for chemical tinning of passive component |
| CN113604846A (en) * | 2021-03-29 | 2021-11-05 | 宁波德洲精密电子有限公司 | Surface treatment process for integrated circuit lead frame |
| CN116695204A (en) * | 2023-08-08 | 2023-09-05 | 宁波德洲精密电子有限公司 | IC frame tinning processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109183096A (en) * | 2018-11-08 | 2019-01-11 | 杭州云会五金电镀有限公司 | A kind of electroplating surface liquid and electroplating technology for alloy |
| CN109594107A (en) * | 2018-11-13 | 2019-04-09 | 南通赛可特电子有限公司 | A kind of electrotinning additive and preparation method thereof |
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| CN112359380A (en) * | 2020-10-23 | 2021-02-12 | 珠海鑫通化工有限公司 | Electroplating solution for chemical tinning of passive component |
| CN113604846A (en) * | 2021-03-29 | 2021-11-05 | 宁波德洲精密电子有限公司 | Surface treatment process for integrated circuit lead frame |
| CN116695204A (en) * | 2023-08-08 | 2023-09-05 | 宁波德洲精密电子有限公司 | IC frame tinning processing method |
| CN116695204B (en) * | 2023-08-08 | 2023-11-03 | 宁波德洲精密电子有限公司 | IC frame tinning processing method |
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